JP3945814B2 - 無電解金めっき液 - Google Patents
無電解金めっき液 Download PDFInfo
- Publication number
- JP3945814B2 JP3945814B2 JP2006544784A JP2006544784A JP3945814B2 JP 3945814 B2 JP3945814 B2 JP 3945814B2 JP 2006544784 A JP2006544784 A JP 2006544784A JP 2006544784 A JP2006544784 A JP 2006544784A JP 3945814 B2 JP3945814 B2 JP 3945814B2
- Authority
- JP
- Japan
- Prior art keywords
- plating solution
- gold plating
- electroless gold
- compound
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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- 238000007747 plating Methods 0.000 title claims description 73
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims description 47
- 239000010931 gold Substances 0.000 title claims description 46
- 229910052737 gold Inorganic materials 0.000 title claims description 46
- -1 bisulfite compound Chemical class 0.000 claims description 39
- 150000002344 gold compounds Chemical class 0.000 claims description 8
- 239000000243 solution Substances 0.000 description 36
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 18
- 229910000679 solder Inorganic materials 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 13
- 238000000576 coating method Methods 0.000 description 13
- 230000007797 corrosion Effects 0.000 description 10
- 238000005260 corrosion Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 10
- 229910052759 nickel Inorganic materials 0.000 description 9
- 229910052783 alkali metal Inorganic materials 0.000 description 6
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 150000003863 ammonium salts Chemical class 0.000 description 5
- 229920006395 saturated elastomer Polymers 0.000 description 5
- 238000006467 substitution reaction Methods 0.000 description 5
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 3
- SRCZENKQCOSNAI-UHFFFAOYSA-H gold(3+);trisulfite Chemical compound [Au+3].[Au+3].[O-]S([O-])=O.[O-]S([O-])=O.[O-]S([O-])=O SRCZENKQCOSNAI-UHFFFAOYSA-H 0.000 description 3
- 231100000053 low toxicity Toxicity 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005554 pickling Methods 0.000 description 3
- 239000004471 Glycine Substances 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-L Phosphate ion(2-) Chemical compound OP([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-L 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000008139 complexing agent Substances 0.000 description 2
- ADPOBOOHCUVXGO-UHFFFAOYSA-H dioxido-oxo-sulfanylidene-$l^{6}-sulfane;gold(3+) Chemical compound [Au+3].[Au+3].[O-]S([O-])(=O)=S.[O-]S([O-])(=O)=S.[O-]S([O-])(=O)=S ADPOBOOHCUVXGO-UHFFFAOYSA-H 0.000 description 2
- XKUKSGPZAADMRA-UHFFFAOYSA-N glycyl-glycyl-glycine Chemical compound NCC(=O)NCC(=O)NCC(O)=O XKUKSGPZAADMRA-UHFFFAOYSA-N 0.000 description 2
- YMAWOPBAYDPSLA-UHFFFAOYSA-N glycylglycine Chemical compound [NH3+]CC(=O)NCC([O-])=O YMAWOPBAYDPSLA-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- AOSFMYBATFLTAQ-UHFFFAOYSA-N 1-amino-3-(benzimidazol-1-yl)propan-2-ol Chemical compound C1=CC=C2N(CC(O)CN)C=NC2=C1 AOSFMYBATFLTAQ-UHFFFAOYSA-N 0.000 description 1
- URDCARMUOSMFFI-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]ethyl-(2-hydroxyethyl)amino]acetic acid Chemical compound OCCN(CC(O)=O)CCN(CC(O)=O)CC(O)=O URDCARMUOSMFFI-UHFFFAOYSA-N 0.000 description 1
- DMQQXDPCRUGSQB-UHFFFAOYSA-N 2-[3-[bis(carboxymethyl)amino]propyl-(carboxymethyl)amino]acetic acid Chemical compound OC(=O)CN(CC(O)=O)CCCN(CC(O)=O)CC(O)=O DMQQXDPCRUGSQB-UHFFFAOYSA-N 0.000 description 1
- IWTIBPIVCKUAHK-UHFFFAOYSA-N 3-[bis(2-carboxyethyl)amino]propanoic acid Chemical compound OC(=O)CCN(CCC(O)=O)CCC(O)=O IWTIBPIVCKUAHK-UHFFFAOYSA-N 0.000 description 1
- 208000023514 Barrett esophagus Diseases 0.000 description 1
- 241000132023 Bellis perennis Species 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 235000005633 Chrysanthemum balsamita Nutrition 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- 108010008488 Glycylglycine Proteins 0.000 description 1
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 description 1
- JYXGIOKAKDAARW-UHFFFAOYSA-N N-(2-hydroxyethyl)iminodiacetic acid Chemical compound OCCN(CC(O)=O)CC(O)=O JYXGIOKAKDAARW-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- ACQKDRSYTYUZQD-UHFFFAOYSA-K SC(=O)[O-].[Au+3].SC(=O)[O-].SC(=O)[O-] Chemical compound SC(=O)[O-].[Au+3].SC(=O)[O-].SC(=O)[O-] ACQKDRSYTYUZQD-UHFFFAOYSA-K 0.000 description 1
- DWAQJAXMDSEUJJ-UHFFFAOYSA-M Sodium bisulfite Chemical compound [Na+].OS([O-])=O DWAQJAXMDSEUJJ-UHFFFAOYSA-M 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- LFVGISIMTYGQHF-UHFFFAOYSA-N ammonium dihydrogen phosphate Chemical compound [NH4+].OP(O)([O-])=O LFVGISIMTYGQHF-UHFFFAOYSA-N 0.000 description 1
- 229910000387 ammonium dihydrogen phosphate Inorganic materials 0.000 description 1
- XYXNTHIYBIDHGM-UHFFFAOYSA-N ammonium thiosulfate Chemical compound [NH4+].[NH4+].[O-]S([O-])(=O)=S XYXNTHIYBIDHGM-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 description 1
- 229910000388 diammonium phosphate Inorganic materials 0.000 description 1
- 235000019838 diammonium phosphate Nutrition 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 description 1
- FGRVOLIFQGXPCT-UHFFFAOYSA-L dipotassium;dioxido-oxo-sulfanylidene-$l^{6}-sulfane Chemical compound [K+].[K+].[O-]S([O-])(=O)=S FGRVOLIFQGXPCT-UHFFFAOYSA-L 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 108010067216 glycyl-glycyl-glycine Proteins 0.000 description 1
- 229940043257 glycylglycine Drugs 0.000 description 1
- FDWREHZXQUYJFJ-UHFFFAOYSA-M gold monochloride Chemical compound [Cl-].[Au+] FDWREHZXQUYJFJ-UHFFFAOYSA-M 0.000 description 1
- MXZVHYUSLJAVOE-UHFFFAOYSA-N gold(3+);tricyanide Chemical compound [Au+3].N#[C-].N#[C-].N#[C-] MXZVHYUSLJAVOE-UHFFFAOYSA-N 0.000 description 1
- PDMYFWLNGXIKEP-UHFFFAOYSA-K gold(3+);trithiocyanate Chemical compound [Au+3].[S-]C#N.[S-]C#N.[S-]C#N PDMYFWLNGXIKEP-UHFFFAOYSA-K 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 229940079826 hydrogen sulfite Drugs 0.000 description 1
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical compound OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 235000019837 monoammonium phosphate Nutrition 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 description 1
- 239000006174 pH buffer Substances 0.000 description 1
- 239000006179 pH buffering agent Substances 0.000 description 1
- 229960003330 pentetic acid Drugs 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 150000003016 phosphoric acids Chemical class 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- DJEHXEMURTVAOE-UHFFFAOYSA-M potassium bisulfite Chemical compound [K+].OS([O-])=O DJEHXEMURTVAOE-UHFFFAOYSA-M 0.000 description 1
- 229940099427 potassium bisulfite Drugs 0.000 description 1
- 235000010259 potassium hydrogen sulphite Nutrition 0.000 description 1
- 229940005657 pyrophosphoric acid Drugs 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 235000010267 sodium hydrogen sulphite Nutrition 0.000 description 1
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 description 1
- 235000019345 sodium thiosulphate Nutrition 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1642—Substrates other than metallic, e.g. inorganic or organic or non-conductive semiconductor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
Description
(1) 非シアン系水溶性金化合物、及び亜硫酸水素化合物を含有することを特徴とする置換型無電解金めっき液。
(2) さらにチオ硫酸化合物を含有することを特徴とする前記(1)記載の置換型無電解金めっき液。
(3) さらにアミノカルボン酸化合物を含有することを特徴とする前記(1)又は(2)記載の置換型無電解金めっき液。
本発明の無電解金めっき液は、非シアン系水溶性金化合物、及び亜硫酸水素化合物の水溶液である。
置換型無電解金めっき液として表1に示す各組成のめっき液を建浴した。被めっき材として、レジスト開口部0.6mmφの銅張りプリント配線板を用い以下のプロセスでめっきを行った。
酸性脱脂(45℃、5min)
→ソフトエッチング(25℃、2min)
→酸洗(25℃、1min)
→アクチベーター(日鉱メタルプレーティング製、KG−522)
(25℃、pH<1.0、5min)
→酸洗(25℃、1min)
→無電解ニッケル−リンめっき
(めっき液:日鉱メタルプレーティング製、KG−530、
被膜中リン品位約7%)
(88℃、pH4.5、30min)
→置換型無電解金めっき(表1記載のめっき液、めっき条件)
→還元型無電解金めっき
(めっき液:日鉱メタルプレーティング製、KG−560)
(70℃、pH5.0、30min)
(酸洗→アクチベーターの間以外は全て1minの水洗工程が入る)
下地ニッケルめっき被膜の腐食状態は、置換型無電解金めっき被膜を日鉱メタルプレーティング製金剥離剤オーラムストリッパー710(25℃、0.5min)で剥離した後、SEMで2000倍で観察し、腐食痕(孔食)の有無を目視観察した。
評価結果を表1に示す。
Claims (3)
- 非シアン系水溶性金化合物、及び亜硫酸水素化合物を含有することを特徴とする置換型無電解金めっき液。
- さらにチオ硫酸化合物を含有することを特徴とする請求項1記載の置換型無電解金めっき液。
- さらにアミノカルボン酸化合物を含有することを特徴とする請求項1又は2記載の置換型無電解金めっき液。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004330036 | 2004-11-15 | ||
JP2004330036 | 2004-11-15 | ||
PCT/JP2005/015229 WO2006051637A1 (ja) | 2004-11-15 | 2005-08-22 | 無電解金めっき液 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP3945814B2 true JP3945814B2 (ja) | 2007-07-18 |
JPWO2006051637A1 JPWO2006051637A1 (ja) | 2008-05-29 |
Family
ID=36336320
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006544784A Active JP3945814B2 (ja) | 2004-11-15 | 2005-08-22 | 無電解金めっき液 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7396394B2 (ja) |
EP (1) | EP1813696B1 (ja) |
JP (1) | JP3945814B2 (ja) |
KR (1) | KR100832630B1 (ja) |
CN (1) | CN1993499B (ja) |
HK (1) | HK1104934A1 (ja) |
TW (1) | TWI306906B (ja) |
WO (1) | WO2006051637A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009102681A (ja) * | 2007-10-22 | 2009-05-14 | Ishihara Chem Co Ltd | 置換金メッキ浴及び当該金メッキ方法 |
CN102605359A (zh) * | 2011-01-25 | 2012-07-25 | 台湾上村股份有限公司 | 化学钯金镀膜结构及其制作方法、铜线或钯铜线接合的钯金镀膜封装结构及其封装工艺 |
CN102286736A (zh) * | 2011-08-29 | 2011-12-21 | 深圳市化讯应用材料有限公司 | 一种置换型化学镀金液 |
KR101444687B1 (ko) * | 2014-08-06 | 2014-09-26 | (주)엠케이켐앤텍 | 무전해 금도금액 |
CN108220934A (zh) * | 2018-01-22 | 2018-06-29 | 昆山成功环保科技有限公司 | 一种无氰化学浸金溶液 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3300328A (en) * | 1963-11-12 | 1967-01-24 | Clevite Corp | Electroless plating of gold |
GB1548887A (en) * | 1975-04-10 | 1979-07-18 | Johnson Matthey Co Ltd | Preparation of gold aompounds and their use in the electroplating of gold |
CN1003524B (zh) * | 1985-10-14 | 1989-03-08 | 株式会社日立制作所 | 无电浸镀金溶液 |
JP3030113B2 (ja) | 1991-04-12 | 2000-04-10 | エヌ・イーケムキャット株式会社 | 置換無電解金めつき液 |
US5232492A (en) * | 1992-01-23 | 1993-08-03 | Applied Electroless Concepts Inc. | Electroless gold plating composition |
DE69224914T2 (de) * | 1992-11-25 | 1998-10-22 | Kanto Kagaku | Stromloses goldbeschichtungsbad |
US5318621A (en) * | 1993-08-11 | 1994-06-07 | Applied Electroless Concepts, Inc. | Plating rate improvement for electroless silver and gold plating |
JPH08291389A (ja) | 1995-04-18 | 1996-11-05 | Hitachi Chem Co Ltd | 非シアン置換金めっき液及びこの液を用いた金めっき方法 |
JP3566498B2 (ja) | 1997-05-14 | 2004-09-15 | 株式会社大和化成研究所 | 置換金めっき浴 |
US5935306A (en) * | 1998-02-10 | 1999-08-10 | Technic Inc. | Electroless gold plating bath |
JP2000357671A (ja) * | 1999-04-13 | 2000-12-26 | Sharp Corp | 金属配線の製造方法 |
KR20010107989A (ko) * | 1999-10-07 | 2001-12-07 | 다나까 세이이찌로 | 금도금액 및 그 금도금액을 이용한 도금방법 |
JP3482402B2 (ja) * | 2001-06-29 | 2003-12-22 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 置換金メッキ液 |
JP3994279B2 (ja) * | 2002-10-21 | 2007-10-17 | 奥野製薬工業株式会社 | 無電解金めっき液 |
JP2004250765A (ja) * | 2003-02-21 | 2004-09-09 | Murata Mfg Co Ltd | 金めっき液、及び電子部品の製造方法 |
KR100735259B1 (ko) * | 2003-06-05 | 2007-07-03 | 닛코킨조쿠 가부시키가이샤 | 무전해 금도금액 |
EP1767664B1 (en) * | 2004-07-09 | 2017-05-17 | JX Nippon Mining & Metals Corporation | Electroless gold plating liquid |
-
2005
- 2005-08-22 EP EP05780518.6A patent/EP1813696B1/en active Active
- 2005-08-22 CN CN2005800260775A patent/CN1993499B/zh active Active
- 2005-08-22 JP JP2006544784A patent/JP3945814B2/ja active Active
- 2005-08-22 US US11/632,815 patent/US7396394B2/en active Active
- 2005-08-22 KR KR1020077006825A patent/KR100832630B1/ko active IP Right Grant
- 2005-08-22 WO PCT/JP2005/015229 patent/WO2006051637A1/ja active Application Filing
- 2005-08-31 TW TW094129821A patent/TWI306906B/zh active
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2007
- 2007-09-14 HK HK07110030.4A patent/HK1104934A1/xx unknown
Also Published As
Publication number | Publication date |
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JPWO2006051637A1 (ja) | 2008-05-29 |
WO2006051637A1 (ja) | 2006-05-18 |
HK1104934A1 (en) | 2008-01-25 |
EP1813696A1 (en) | 2007-08-01 |
KR20070046195A (ko) | 2007-05-02 |
EP1813696B1 (en) | 2018-12-26 |
KR100832630B1 (ko) | 2008-05-27 |
EP1813696A4 (en) | 2011-08-24 |
TW200615398A (en) | 2006-05-16 |
TWI306906B (en) | 2009-03-01 |
US7396394B2 (en) | 2008-07-08 |
CN1993499A (zh) | 2007-07-04 |
US20070209548A1 (en) | 2007-09-13 |
CN1993499B (zh) | 2010-09-29 |
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