JP3916689B2 - Powder coating composition - Google Patents
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- JP3916689B2 JP3916689B2 JP12058696A JP12058696A JP3916689B2 JP 3916689 B2 JP3916689 B2 JP 3916689B2 JP 12058696 A JP12058696 A JP 12058696A JP 12058696 A JP12058696 A JP 12058696A JP 3916689 B2 JP3916689 B2 JP 3916689B2
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Description
【0001】
【本発明の属する技術分野】
本発明は硬化性に優れ、低温焼き付け、高温短時間焼き付けが可能であり、貯蔵安定性に優れた粉体塗料組成物に関するものである。
【0002】
【従来の技術】
エポキシ樹脂は機械特性、耐薬品性、電気特性に優れ、粉体塗料にも広く使用されている。しかし、従来エポキシ樹脂を用いた粉体塗料では180℃程度の比較的高温で長時間焼き付ける必要があり、耐熱性の低い被塗物には適用できなかったり、近年の省エネルギーの気運に対しても不利であった。
このような不利の点を解決する手段としてイミダゾール等の硬化促進剤を多量に配合して、焼き付け温度の低温化、ならびに高温での短時間焼き付けが行われている。しかし、このような組成物は製造過程の溶融混練時にゲル化を起こしたり、たとえ粉体塗料が得られても貯蔵安定性が悪く、低温での貯蔵を余儀なくされるばかりか塗膜の耐食性の低下をまねく等の問題があり実用上困難であった。
【0003】
【発明が解決しようとする課題】
本発明はエポキシ系粉体塗料の上記欠点を解決し、低温焼き付け並びに高温短時間焼き付けを可能とし、貯蔵安定性を併せ持ち、さらに塗膜物性に優れた粉体塗料組成物を提供するものである。
【0004】
【課題を解決する為の手段】
本発明の要旨は、エポキシ樹脂[A]と、該エポキシ樹脂の硬化剤[B]とからなる粉体塗料組成物であって、前記エポキシ樹脂[A]は、ビスフェノールA型エポキシ樹脂(a)(2官能性エポキシ樹脂(a)という)に1分子中に少なくとも2.5〜8個のフェノール性水酸基を有するフェノール及び/又はクレゾールのノボラック樹脂(b)(単にノボラック樹脂という)とビスフェノールA(c)(2官能フェノール類という)を一段階で反応させて得られたエポキシ当量が400〜1500g/eqで軟化点が60〜140℃の範囲であることを特徴とする、140℃で硬化可能な粉体塗料組成物である。
【0005】
即ち、本発明の粉体塗料組成物を構成するエポキシ樹脂[A]は、2官能性エポキシ樹脂(a)にノボラック樹脂(b)と2官能フェノール類(c)を反応させて得られるエポキシ当量が400〜1500g/eqで軟化点が60〜140℃の範囲である常温で固体のエポキシ樹脂であり、得られた粉体塗料組成物は低温焼き付け並びに高温短時間焼き付けを可能とし、貯蔵安定性を併せ持ち、さらに塗膜物性に優れた硬化塗膜を提供する。
【0006】
本発明の粉体塗料組成物の主成分であるエポキシ樹脂[A]はエポキシ当量が400〜1500g/eqで、軟化点が60〜140℃の範囲である常温で固体のエポキシ樹脂であり、エポキシ当量が400g/eq未満では貯蔵中の耐ブロッキング性が悪くなり、1500g/eqを超えると粉体塗料の加熱硬化時に流動性が悪くなり平滑な塗膜が得られなくなる。また、軟化点も同様に60℃未満では貯蔵中にブロッキングし易くなり、140℃を超えると塗膜の平滑性が悪くなり好ましくない。
【0007】
本発明の粉体塗料組成物の主成分であるエポキシ樹脂[A]を製造するに当たり、前記二官能性エポキシ樹脂、ノボラック樹脂及び2価のフェノール類の3成分の配合比率は、二官能性エポキシ樹脂(a)のエポキシ基1当量相当分に対して、ノボラック樹脂(b)のフェノール性水酸基が0.01〜0.6当量相当分、好ましくは0.05〜0.3当量相当分となる比率で、また、2価のフェノール類(c)とノボラック樹脂(b)とのフェノール性水酸基の総量が0.2〜0.8当量相当分、好ましくは0.3〜0.8当量相当分となる比率で用いるのが適当である。
【0008】
本発明の粉体塗料組成物におけるエポキシ樹脂[A]を構成する2官能性エポキシ樹脂(a)は1分子中に実質的に2個のエポキシ基を持つエポキシ樹脂であり、ビスフェノールA型エポキシ樹脂が好ましく、更に好ましくはエポキシ当量が170g/eq〜300g/eqの範囲にあるビスフェノールA型エポキシ樹脂である。ノボラック樹脂(b)はフェノール類とアルデヒド類から公知慣用の方法により得られ、1分子中に少なくとも平均2.1〜10個、好ましくは2.5〜8個のフェノール性水酸基を有するノボラック樹脂である。ここにおいてフェノール類としてはフェノール又はクレゾールであり、それぞれ単独または混合して用いることができるが、中でもフェノールが好ましい。他方、アルデヒド類としてはパラホルムアルデヒド、ホルムアルデヒド、アセトアルデヒド、プロピルアルデヒド、ブチルアルデヒド、P−ヒドロキシベンズアルデヒド等がある。2官能フェノール類(c)はビスフェノールAである。
【0009】
しかして、これら二官能性エポキシ樹脂、ノボラック樹脂及び2価のフェノール類の3成分の配合比率は、先に述べたように、二官能性エポキシ樹脂(a)のエポキシ基1当量相当分に対して、ノボラック樹脂(b)のフェノール性水酸基が0.01〜0.6当量相当分となる比率であることが好ましく、ノボラック樹脂(b)のフェノール性水酸基として0.01当量相当分より少ないと本発明の低温硬化性が発揮できず、逆に0.6当量相当分より多いとエポキシ樹脂[A]の製造時にゲル化を起こしやすい上、これを用いた粉体塗料は貯蔵安定性が悪く塗膜の平滑性が劣る等の欠点が生じる。
【0010】
また、二官能性エポキシ樹脂(a)のエポキシ基1当量相当分に対して、2価のフェノール類(c)とノボラック樹脂(b)とのフェノール性水酸基の総量が0.2〜0.8当量相当分となる比率で用いるのが好ましく、また、2価のフェノール類(c)とノボラック樹脂(b)とのフェノール性水酸基の総量が0.2当量相当分より少ないとエポキシ樹脂[A]が固形にならなかったり、本発明の低温硬化性が発揮できず好ましくない。逆に0.8当量相当分より多いとエポキシ樹脂[A]の製造時にゲル化を起こしやすかったり、ゲル化しないまでも軟化点が甚だしく高く、これを用いた粉体塗料は塗膜の平滑性が劣る等実用上困難なものとなる。
【0011】
本発明のエポキシ樹脂[A]の製造方法としては上記した適当な割合で3成分を加熱混合することによって得られる。その際、公知慣用の反応触媒、例えば4級アンモニウム塩、イミダゾール類、フォスホニウム塩類等を適量添加し、100〜200℃に加熱して2〜6時間混合することによってエポキシ当量が400〜1500g/eqで軟化点が60〜140℃の範囲の本発明で使用するエポキシ樹脂[A]を得ることができる。
次に本発明に用いられるエポキシ樹脂用硬化剤[B]としてはエポキシ粉体塗料に用いられる公知の硬化剤を使用することができ、酸無水物類、アミン類、ポリアミド樹脂、ジシアンジアミド、フェノールノボラック樹脂、オルソクレゾールノボラック樹脂、カルボキシル末端ポリエステル樹脂、ジヒドラジド類、イミダゾール類、三フッ化ホウ素のアミン錯体等が挙げられる。その配合量はエポキシ樹脂[A]のエポキシ当量に応じて化学量論的に適宜その量が決まる。
【0012】
本発明の粉体塗料組成物にはエポキシ樹脂[A]及びエポキシ樹脂の硬化剤[B]以外に、本発明の特性を損なわない範囲で従来公知の芳香族エポキシ樹脂、脂環族エポキシ樹脂等、他のエポキシ樹脂を配合することができ、またその使用目的に応じて顔料、充填剤、流動調整剤、触媒等の添加剤を配合することができる。さらにエクストルーダー等で溶融混練し、冷却後微粉砕することによって粉体塗料を得ることができる。
【0013】
【発明の実施の形態】
次に、参考例、実施例及び比較例により本発明を更に詳細に説明するが、本発明はこれら実施例によって限定されるものではない。なお実施例中、「部」は全て重量部を表す。
参考例1 ノボラック樹脂(b−1)の製造例
オルソクレゾール425g、86%パラホルムアルデヒド70gを仕込み、さらに40%シュウ酸25gを仕込み約95℃で4時間反応させ、次いで縮合水を減圧下で回収して軟化点75℃、フェノール性水酸基当量120g/eq、および平均4.0個のフェノール性水酸基を有するオルソクレゾールノボラック樹脂(b−1)を得た。
【0014】
参考例2 ノボラック樹脂(b−2)の製造例
フェノール450g、86%パラホルムアルデヒド70gを仕込み、さらに40%シュウ酸30gを仕込み約95℃で4時間反応させ、次いで縮合水を減圧下で回収して軟化点65℃、フェノール性水酸基当量106g/eq、及び平均3.5個のフェノール性水酸基を有するフェノールノボラック樹脂(b−2)を得た。
【0015】
参考例3 エポキシ樹脂[A−1]の製造例
「YD−128」(東都化成(株)製ビスフェノールA型エポキシ樹脂;エポキシ当量=187g/eq)を187g、参考例1で得たオルソクレゾールノボラック樹脂(b−1)を10g、さらにビスフェノールAを68g仕込み昇温し、次いで反応触媒としてn−ブチルトリフェニルホスホニウムブロマイドを0.1g添加して170℃で4時間反応して、エポキシ当量850g/eq、軟化点103℃のエポキシ樹脂[A−1]を得た。
【0016】
参考例4 エポキシ樹脂[A−2]の製造例
「YD−128」(東都化成(株)製ビスフェノールA型エポキシ樹脂;エポキシ当量=187g/eq)を187g、参考例2で得たフェノールノボラック樹脂(b−2)を10g、さらにビスフェノールAを58g仕込み昇温し、次いで反応触媒としてn−ブチルトリフェニルホスホニウムブロマイドを0.1g添加して170℃で4時間反応して、エポキシ当量650g/eq、軟化点88℃のエポキシ樹脂[A−2]を得た。
【0017】
参考例5 エポキシ樹脂[A−3]の製造例
「YD−128」(東都化成(株)製ビスフェノールA型エポキシ樹脂;エポキシ当量=187g/eq)を187g、参考例2で得たフェノールノボラック樹脂(b−2)を15g、さらにビスフェノールAを64g仕込み昇温し、次いで反応触媒としてn−ブチルトリフェニルホスホニウムブロマイドを0.1g添加して170℃で4時間反応して、エポキシ当量950g/eq、軟化点105℃のエポキシ樹脂[A−3]を得た。
【0018】
実施例1〜4及び比較例1〜4
表1に示す配合組成の混合物をヘンシェルミキサーでドライブレンドし、次いで二軸エクストルーダーを使用し樹脂温度120℃〜140℃で溶融混練し、冷却後、微粉砕して粉体塗料を得た。得られた粉体塗料を静電粉体塗装機を用いてリン酸亜鉛処理した軟鋼板に、膜厚が40〜60ミクロンになるよう塗布し、表1に示す焼き付け条件で試験片を作成した。こうして得られた塗膜について諸性能を調べた。その結果は表1に示すとおりであった。
なお表1中のYD−902は東都化成(株)製ビスフェノールA型エポキシ樹脂(エポキシ当量:650g/eq、軟化点:86℃)、同じくYD−904は東都化成(株)製ビスフェノールA型エポキシ樹脂(エポキシ当量:950g/eq、軟化点:102℃)である。また流れ調整剤としてはアクロナール4F(BASFジャパン株式会社製)を使用した。
【0019】
表1における試験方法及び評価は次のとおりである。
光沢…光沢計での60゜鏡面反射率(%)
耐衝撃性…デュポン衝撃試験機により撃芯1/2インチ、荷重1Kg、高さ50cmで試験後の塗膜の状態。
○異常なし。 ×亀裂等の異常有り。
耐食性…塩水噴霧試験500時間後のクロスカット部よりの剥離幅。
貯蔵安定性…粉体塗料を35℃の恒温槽で1ヶ月保管した後、同様に塗装して耐衝撃性を評価した。
【0020】
【表1】
【0021】
【発明の効果】
本発明の粉体塗料用樹脂組成物は貯蔵安定性が良好で、低温或いは高温短時間での焼き付けが可能となり、機械特性に優れた塗膜が得られる。[0001]
[Technical field to which the present invention pertains]
The present invention relates to a powder coating composition which is excellent in curability, can be baked at a low temperature and baked at a high temperature for a short time, and has excellent storage stability.
[0002]
[Prior art]
Epoxy resins have excellent mechanical properties, chemical resistance, and electrical properties, and are widely used in powder coatings. However, powder coatings using conventional epoxy resins need to be baked at a relatively high temperature of about 180 ° C. for a long time, and cannot be applied to objects with low heat resistance. It was disadvantageous.
As means for solving such disadvantages, a large amount of a curing accelerator such as imidazole is blended to reduce the baking temperature and to perform baking at a high temperature for a short time. However, such a composition causes gelation during melt kneading in the manufacturing process, and even if a powder coating is obtained, the storage stability is poor, and not only is it required to be stored at low temperatures, but also the corrosion resistance of the coating film. There were problems such as lowering, which was practically difficult.
[0003]
[Problems to be solved by the invention]
The present invention provides a powder coating composition that solves the above-described drawbacks of epoxy-based powder coatings, enables low-temperature baking and high-temperature baking for a short time, has storage stability, and has excellent coating film properties. .
[0004]
[Means for solving the problems]
The gist of the present invention is a powder coating composition comprising an epoxy resin [A] and a curing agent [B] of the epoxy resin, wherein the epoxy resin [A] is a bisphenol A type epoxy resin (a). ( Referred to as bifunctional epoxy resin (a)) phenol and / or cresol novolak resin (b) (simply referred to as novolak resin) and bisphenol A ( which has at least 2.5 to 8 phenolic hydroxyl groups in one molecule ) c) The epoxy equivalent obtained by reacting (referred to as bifunctional phenols) in one step is 400-1500 g / eq, and the softening point is in the range of 60-140 ° C., which can be cured at 140 ° C. such a powder coating composition.
[0005]
That is, the epoxy resin [A] constituting the powder coating composition of the present invention is an epoxy equivalent obtained by reacting a novolak resin (b) and a bifunctional phenol (c) with a bifunctional epoxy resin (a). Is an epoxy resin that is solid at room temperature and has a softening point in the range of 60 to 140 ° C. in the range of 400 to 1500 g / eq, and the obtained powder coating composition enables low-temperature baking and high-temperature short-time baking, and storage stability In addition, the present invention provides a cured coating film having excellent coating film properties.
[0006]
The epoxy resin [A], which is the main component of the powder coating composition of the present invention, is an epoxy resin that is solid at room temperature and has an epoxy equivalent of 400 to 1500 g / eq and a softening point in the range of 60 to 140 ° C. When the equivalent is less than 400 g / eq, the blocking resistance during storage deteriorates, and when it exceeds 1500 g / eq, the fluidity deteriorates when the powder coating is heat-cured and a smooth coating film cannot be obtained. Similarly, if the softening point is less than 60 ° C., blocking tends to occur during storage.
[0007]
In producing the epoxy resin [A] which is the main component of the powder coating composition of the present invention, the blending ratio of the three components of the bifunctional epoxy resin, novolac resin and divalent phenols is as follows. The phenolic hydroxyl group of the novolak resin (b) is equivalent to 0.01 to 0.6 equivalent, preferably 0.05 to 0.3 equivalent, relative to 1 equivalent of the epoxy group of the resin (a). The total amount of phenolic hydroxyl groups of the divalent phenols (c) and the novolak resin (b) is 0.2 to 0.8 equivalents, preferably 0.3 to 0.8 equivalents. It is appropriate to use the ratio as follows.
[0008]
The bifunctional epoxy resin (a) constituting the epoxy resin [A] in the powder coating composition of the present invention is an epoxy resin having substantially two epoxy groups in one molecule, and is a bisphenol A type epoxy resin. The bisphenol A type epoxy resin having an epoxy equivalent in the range of 170 g / eq to 300 g / eq is more preferable. The novolak resin (b) is a novolak resin obtained from a phenol and an aldehyde by a known and commonly used method and having an average of 2.1 to 10, preferably 2.5 to 8, phenolic hydroxyl groups in one molecule. is there. A phenol or cresol as the phenol in the herein can be used alone or in combination, among others phenol is preferred. On the other hand, aldehydes include paraformaldehyde, formaldehyde, acetaldehyde, propyl aldehyde, butyraldehyde, P-hydroxybenzaldehyde and the like. Divalent phenol (c) is Ru bisphenol A der.
[0009]
Thus, as described above, the blending ratio of these bifunctional epoxy resin, novolak resin and dihydric phenols is 3 parts equivalent to the equivalent of 1 equivalent of the epoxy group of the bifunctional epoxy resin (a). The ratio of the phenolic hydroxyl group of the novolak resin (b) is preferably 0.01 to 0.6 equivalents, and the phenolic hydroxyl group of the novolak resin (b) is less than the equivalent of 0.01 equivalents. The low-temperature curability of the present invention cannot be exhibited, and conversely, if it exceeds 0.6 equivalents, gelation is likely to occur during the production of the epoxy resin [A], and the powder coating using this has poor storage stability. Defects such as poor smoothness of the coating film occur.
[0010]
Further, the total amount of phenolic hydroxyl groups of the divalent phenols (c) and the novolak resin (b) is 0.2 to 0.8 with respect to 1 equivalent of the epoxy group of the bifunctional epoxy resin (a). It is preferable to use it at a ratio corresponding to the equivalent amount. When the total amount of phenolic hydroxyl groups of the divalent phenols (c) and the novolak resin (b) is less than 0.2 equivalent amount, the epoxy resin [A] Does not become solid, and the low temperature curability of the present invention cannot be exhibited. On the other hand, if the amount is more than 0.8 equivalent, gelation is likely to occur during the production of the epoxy resin [A], or the softening point is extremely high even if it does not gel. It becomes difficult practically such as inferior.
[0011]
The method for producing the epoxy resin [A] of the present invention can be obtained by heating and mixing the three components at the appropriate ratio described above. At that time, an appropriate amount of a known and usual reaction catalyst, for example, quaternary ammonium salt, imidazole, phosphonium salt and the like is added, heated to 100 to 200 ° C. and mixed for 2 to 6 hours to obtain an epoxy equivalent of 400 to 1500 g / eq. Thus, the epoxy resin [A] used in the present invention having a softening point in the range of 60 to 140 ° C. can be obtained.
Next, as the curing agent [B] for epoxy resin used in the present invention, known curing agents used for epoxy powder coatings can be used, and acid anhydrides, amines, polyamide resins, dicyandiamide, phenol novolac. Examples thereof include resins, orthocresol novolak resins, carboxyl-terminated polyester resins, dihydrazides, imidazoles, and amine complexes of boron trifluoride. The amount is appropriately determined stoichiometrically according to the epoxy equivalent of the epoxy resin [A].
[0012]
In addition to the epoxy resin [A] and the epoxy resin curing agent [B], the powder coating composition of the present invention includes conventionally known aromatic epoxy resins, alicyclic epoxy resins and the like as long as the characteristics of the present invention are not impaired. Other epoxy resins can be blended, and additives such as pigments, fillers, flow regulators, and catalysts can be blended depending on the purpose of use. Furthermore, a powder coating can be obtained by melt-kneading with an extruder or the like, and finely pulverizing after cooling.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Next, although a reference example, an Example, and a comparative example demonstrate this invention still in detail, this invention is not limited by these Examples. In the examples, all “parts” represent parts by weight.
Reference Example 1 Production Example of Novolac Resin (b-1) 425 g of orthocresol and 70 g of 86% paraformaldehyde were added, and 25 g of 40% oxalic acid was further added and reacted at about 95 ° C. for 4 hours, and then condensed water was recovered under reduced pressure. Thus, an ortho-cresol novolak resin (b-1) having a softening point of 75 ° C., a phenolic hydroxyl group equivalent of 120 g / eq, and an average of 4.0 phenolic hydroxyl groups was obtained.
[0014]
Reference Example 2 Production Example of Novolak Resin (b-2) 450 g of phenol and 70 g of 86% paraformaldehyde were added, and 30 g of 40% oxalic acid was added and reacted at about 95 ° C. for 4 hours, and then condensed water was recovered under reduced pressure. Thus, a phenol novolak resin (b-2) having a softening point of 65 ° C., an phenolic hydroxyl group equivalent of 106 g / eq, and an average of 3.5 phenolic hydroxyl groups was obtained.
[0015]
Reference Example 3 Production Example “YD-128” of Epoxy Resin [A-1] (187 Tons of Tosoh Kasei Co., Ltd. Bisphenol A Epoxy Resin; Epoxy Equivalent = 187 g / eq), Orthocresol Novolac Obtained in Reference Example 1 10 g of resin (b-1) and 68 g of bisphenol A were added and the temperature was raised. Then, 0.1 g of n-butyltriphenylphosphonium bromide was added as a reaction catalyst and reacted at 170 ° C. for 4 hours to obtain an epoxy equivalent of 850 g / eq, an epoxy resin [A-1] having a softening point of 103 ° C. was obtained.
[0016]
Reference Example 4 Production Example “YD-128” of Epoxy Resin [A-2] (187 Tons of Bisphenol A Type Epoxy Resin; Epoxy Equivalent = 187 g / eq) manufactured by Tohto Kasei Co., Ltd. The phenol novolac resin obtained in Reference Example 2 10 g of (b-2) and 58 g of bisphenol A were added and the temperature was raised. Then, 0.1 g of n-butyltriphenylphosphonium bromide was added as a reaction catalyst and reacted at 170 ° C. for 4 hours to obtain an epoxy equivalent of 650 g / eq. An epoxy resin [A-2] having a softening point of 88 ° C. was obtained.
[0017]
Reference Example 5 Production Example “YD-128” of Epoxy Resin [A-3] (187 g of Bisphenol A Type Epoxy Resin manufactured by Tohto Kasei Co., Ltd .; Epoxy Equivalent = 187 g / eq), Phenol Novolak Resin Obtained in Reference Example 2 15 g of (b-2) and 64 g of bisphenol A were added and the temperature was raised. Then, 0.1 g of n-butyltriphenylphosphonium bromide was added as a reaction catalyst and reacted at 170 ° C. for 4 hours to obtain an epoxy equivalent of 950 g / eq. An epoxy resin [A-3] having a softening point of 105 ° C. was obtained.
[0018]
Examples 1-4 and Comparative Examples 1-4
A mixture having the composition shown in Table 1 was dry blended with a Henschel mixer, then melt-kneaded at a resin temperature of 120 to 140 ° C. using a biaxial extruder, cooled, and finely pulverized to obtain a powder coating material. The obtained powder coating was applied to a mild steel plate treated with zinc phosphate using an electrostatic powder coating machine so that the film thickness was 40 to 60 microns, and test pieces were prepared under the baking conditions shown in Table 1. . Various performances of the coating film thus obtained were examined. The results are shown in Table 1.
YD-902 in Table 1 is a bisphenol A type epoxy resin (epoxy equivalent: 650 g / eq, softening point: 86 ° C.) manufactured by Toto Kasei Co., Ltd. YD-904 is a bisphenol A type epoxy manufactured by Toto Kasei Co., Ltd. Resin (epoxy equivalent: 950 g / eq, softening point: 102 ° C.). Moreover, Acronal 4F (made by BASF Japan Ltd.) was used as a flow regulator.
[0019]
The test methods and evaluation in Table 1 are as follows.
Gloss ... 60 ° specular reflectance (%) on gloss meter
Impact resistance: The state of the coating film after testing with a DuPont impact tester of 1/2 inch impact core, 1 kg load, and 50 cm height.
○ No abnormalities. × There are abnormalities such as cracks.
Corrosion resistance: Peeling width from the cross cut portion after 500 hours of salt spray test.
Storage stability: The powder coating was stored in a constant temperature bath at 35 ° C. for 1 month, and then coated in the same manner to evaluate impact resistance.
[0020]
[Table 1]
[0021]
【The invention's effect】
The resin composition for powder coatings of the present invention has good storage stability, enables baking at a low temperature or a high temperature in a short time, and provides a coating film excellent in mechanical properties.
Claims (3)
Priority Applications (1)
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JP12058696A JP3916689B2 (en) | 1996-05-15 | 1996-05-15 | Powder coating composition |
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JP12058696A JP3916689B2 (en) | 1996-05-15 | 1996-05-15 | Powder coating composition |
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JP3916689B2 true JP3916689B2 (en) | 2007-05-16 |
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