JP3906233B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP3906233B2 JP3906233B2 JP2005296433A JP2005296433A JP3906233B2 JP 3906233 B2 JP3906233 B2 JP 3906233B2 JP 2005296433 A JP2005296433 A JP 2005296433A JP 2005296433 A JP2005296433 A JP 2005296433A JP 3906233 B2 JP3906233 B2 JP 3906233B2
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Description
3 能動素子領域
5 LSIチップ
6 リードフレーム
7 内部リード先端部
8 ボンディングワイヤ
9 モールドレジン
10 耐熱有機絶縁膜
11 無機パッシベーション膜
12 接着剤
Claims (11)
- 半導体素子と、
前記半導体素子の能動素子領域を分断し該能動素子領域とオーバーラップしないように形成されたパッド領域に列状に配置された複数個のボンディングパッドと、
前記ボンディングパッドの少なくとも一部を露出するように前記半導体素子上に形成された無機材料の第一の絶縁層と、
前記ボンディングパッドが複数個配置されたパッド領域が少なくとも露出するように前記第一の絶縁層上に形成され、前記第一の絶縁層よりも厚い有機材料の第二の絶縁層と、
前記第二の絶縁層の上部に接続されたリードと、
前記ボンディングパッドと前記リードとを電気的に接続するボンディングワイヤと、
前記半導体素子を封止する樹脂と、
を有し、
前記半導体素子の能動素子領域は、4分割されてレイアウトされており、
前記半導体素子の複数のボンディングパッドは、分割された複数の能動素子領域の間にのみ配置されていることを特徴とする半導体装置。 - 請求項1記載の半導体装置であって、
前記第一の絶縁層と前記第二の絶縁層とは、前記リードの前記ボンディングワイヤと接続された部分と前記半導体素子との間にあることを特徴とする半導体装置。 - 請求項1又は2記載の半導体装置であって、
前記リードの前記ボンディングワイヤと接続された部分は、前記半導体素子の能動素子領域上にあること特徴とする半導体装置。 - 請求項1乃至3のいずれか1項に記載の半導体装置であって、
前記半導体素子は互いに対向する第一の辺と第二の辺と、前記第一の辺と前記第二の辺に隣接しかつ互いに対向する第三の辺と第四の辺とを有し、
前記複数のボンディングパッドは、前記第一の辺と前記第二の辺とに挟まれた領域にあることを特徴とする半導体装置。 - 請求項4記載の半導体装置であって、
前記複数個のボンディングパッドは、前記第一の辺と前記第二の辺とからの距離が等しい前記半導体素子上の領域にあることを特徴とする半導体装置。 - 請求項4又は5記載の半導体装置であって、
前記リードの前記ワイヤボンディングと接続された部分は、前記第一の辺と前記ボンディングパッドとの間、又は、前記第二の辺と前記ボンディングパッドとの間にあることを特徴とする半導体装置。 - 請求項1乃至6のいずれか1項に記載の半導体装置であって、
前記半導体素子は矩形であることを特徴とする半導体装置。 - 請求項7記載の半導体装置であって、
前記複数個のボンディングパッドは、前記半導体素子の長辺方向に配列されていることを特徴とする半導体装置。 - 請求項1乃至8のいずれか1項に記載の半導体装置であって、
前記複数個のボンディングパッドは、一列に配列されていることを特徴とする半導体装置。 - 請求項1乃至9のいずれか1項に記載の半導体装置であって、
前記第二の絶縁層はポリイミドであることを特徴とする半導体装置。 - 請求項1乃至10のいずれか1項に記載の半導体装置であって、
前記第二の絶縁層と前記リードとは、接着層を介して接続されていることを特徴とする半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2005296433A JP3906233B2 (ja) | 2005-10-11 | 2005-10-11 | 半導体装置 |
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JP2005296433A JP3906233B2 (ja) | 2005-10-11 | 2005-10-11 | 半導体装置 |
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JP2002305279A Division JP2003124424A (ja) | 2002-10-21 | 2002-10-21 | 半導体装置の製造方法 |
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JP2006049929A JP2006049929A (ja) | 2006-02-16 |
JP3906233B2 true JP3906233B2 (ja) | 2007-04-18 |
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JP2005296433A Expired - Lifetime JP3906233B2 (ja) | 2005-10-11 | 2005-10-11 | 半導体装置 |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008071935A (ja) * | 2006-09-14 | 2008-03-27 | Toshiba Corp | 半導体装置 |
US9261530B2 (en) | 2009-11-24 | 2016-02-16 | Panasonic Intellectual Property Management Co., Ltd. | Acceleration sensor |
JP2011112389A (ja) * | 2009-11-24 | 2011-06-09 | Panasonic Electric Works Co Ltd | 加速度センサ |
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2005
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