JP3824742B2 - Electronic circuit package structure - Google Patents

Electronic circuit package structure Download PDF

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Publication number
JP3824742B2
JP3824742B2 JP19335397A JP19335397A JP3824742B2 JP 3824742 B2 JP3824742 B2 JP 3824742B2 JP 19335397 A JP19335397 A JP 19335397A JP 19335397 A JP19335397 A JP 19335397A JP 3824742 B2 JP3824742 B2 JP 3824742B2
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Prior art keywords
circuit
package structure
upper plate
electronic circuit
resin
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JPH1126651A (en
Inventor
恵 堀内
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Citizen Electronics Co Ltd
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Citizen Electronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Description

【０００１】
【発明の属する技術分野】
本発明は、回路基板上にＩＣチップを始めとする小型の電子回路部品を搭載し、樹脂で封止して回路部品を埋設した電子回路モジュールのパッケージ構造に関する。
【０００２】
【従来の技術】
回路基板に能動や受動の回路部品を搭載して一定の機能を持つユニットとした回路モジュールは、多様な種類のものが現れるとともに小型化が進み、電子機器に表面実装するのに適したものが普及しつつある。このような小型回路のパッケージ構造として、図３（Ａ）のものは発明者らが従来から製造しているもので、寸法の一例を上げれば縦横１０ｍｍ以下、高さ５ｍｍ以下程度である。そのＢ−Ｂ断面を図３（Ｂ）に示すが、回路基板１０１にＩＣチップ１０２やチップ抵抗、チップ・コンデンサ等の回路部品１０３を実装し、基板周辺の一部または全部にモールド枠１０４を接合し、その内側にエポキシ等の樹脂１０５を注入して回路部品を埋設し、金属のシールド・ケース１０６を取り付けたものである。シールド・ケース１０６に開けた窓１０７は、回路中の光電素子のための光の通路である。
【０００３】
図３（Ｃ）も上記と同系統のパッケージ構造で、そのＤ−Ｄ断面を図（Ｄ）に示すが、回路基板１０１の両側に樹脂を盛ってない箇所１０８があり、これは製造時にこの部分にマスキング材を土手状に仮接合しておき、マスキング材の間に樹脂を注入して固化した後、マスキング材を除去したものである。このパッケージにも金属のシールド・ケース１０６を取り付けてある。
【０００４】
図３（Ｅ）のパッケージは一般に見られるもので、そのＦ−Ｆ断面を図３（Ｆ）に示すが、回路にリード１０９を接続し、トランスファ・モールドにより回路を樹脂１１０中に封入したものである。
【０００５】
【発明が解決しようとする課題】
上記のような従来のモジュールのパッケージ構造は、次のような問題を持っている。すなわち、図３（Ａ）、（Ｂ）のものは、封止用の樹脂１０５を一定の量と形状にするためにモールド枠１０４を用いているが、このモールド枠１０４は完成モジュールの構成部品の一部をなし、そしてモールド枠１０４の高さは回路部品の高さに対し若干余裕を持たせておくため、パッケージの小型、薄型化の支障となり、製造コストの低減も難しい。図３（Ｃ）、（Ｄ）のものは、完成モジュールにはモールド枠を含まないものの、樹脂の量と形状を一定にするために製造工程でこれに類似したマスキング材を用い、樹脂の注入後に除去するのであるから、やはり前記と同様の問題を持っている。図３（Ｅ）、（Ｆ）のものは構成材料にリード・フレームが加わってコスト要因となり、完成形状も前記のもののようなチップ状でなくリードが張り出しているため、小型、薄型化に不向きである。
本発明はこれらの問題を解決して、小型、薄型化に適するとともに廉価に製造でき、信頼性も十分な電子回路のパッケージ構造を提供するものである。
【０００６】
【課題を解決するための手段】
本発明の電子回路のパッケージは、回路部品を実装した回路基板に上板を乗せ、回路基板と上板の間に封止用の樹脂を充填した構造である。言い替えれば、回路基板と上板が樹脂部分をサンドイッチ状に挟持し、樹脂中に回路部品を埋設している。上板の下面は抵抗やコンデンサ等の回路部品の中で高さの最も高いものに当接させる。従って樹脂層の厚さが回路部品の厚さと同等になって、パッケージの厚さが最小限に収まる。またパッケージの各側面が樹脂面となり、回路基板にモールド枠やマスキング枠を配置するための場所を設ける必要がない。上板には絶縁材を用いるなり、あるいは回路部品の表面が十分に絶縁されていて短絡の恐れがないならば、金属板を用いるなりする。さらに絶縁材の上板に金属層を重ねてもよく、このように金属層を設けることにより遮蔽機能が得られ、従来のようなシールド・ケースを用いなくとも信頼性が維持される。
【０００７】
【発明の実施の形態】
以下、図面に基づいて本発明の実施形態を説明する。
図１は、本発明による電子回路のパッケージ構造の第１の実施形態を示し、図１（Ａ）は外観図、図１（Ｂ）は図１（Ａ）のＢ−Ｂ断面図である。図１（Ｂ）にて、回路基板１にＩＣチップ２およびチップ状の抵抗、コンデンサその他の回路部品が実装してあり、その中で一番高さの高いものを回路部品３としてある。上部に上板４を、高さが一番高くて回路基板から一番出っ張っている回路部品３に下面５を当接させて配置してある。そして回路基板１と上板４の間を樹脂６で充填することにより、全体を接合するとともに樹脂中に回路部品を埋設して機械的に保護し、外気からも保護している。
【０００８】
回路基板１の下面には、図示してないが、装置への接続用の端子電極が設けてある。回路基板１の側面の円弧状に窪んだ部分７は、窪みの内面に導電材を被覆した導電部で、回路基板１の素材に設けてあったスルーホールの一部であり、この導電部７によって回路基板１の上面の導電パターンと下面の端子電極を接続している。
【０００９】
上板４は、絶縁材であれば短絡を生じることなく下面５を回路部品３に当接させることができる。製品の薄型化のため、強度の許す範囲で極力薄手の材料（例えば０．１ｍｍ前後）を用いる。モジュールの機能によってはフォト・トランジスタ、フォト・ダイオード、ＬＥＤ等の受光、発光の光電素子を含むから、その場合は上板４は光を通すことが必要で、光の強度に応じて透明または半透明の樹脂材料等を用いる。しかし他方に遮光を要する回路部品があるなら、その箇所は上板４にマスク印刷などを施しておく。
【００１０】
回路部品３の表面が十分に絶縁されたものである場合には、上板４を金属板にすることができる。金属板の上板からはシールド作用が得られる。シールド作用の安定のために金属の上板４を回路基板１の接地パターンに接続するには、例えば接地パターン上に接地用のばね片や導電エラストマ等を置き、上板４の下面に当接させるなどの構造を取ることができる。金属板の上板４はシールド作用以外にも、遮光性や放熱性に優れるという利点がある。
【００１１】
金属板の上板４の下面５に塗装などによって絶縁膜を形成しておけば、回路部品３に当接させても短絡の恐れがない。金属板の上板４を接地するには、下面５の絶縁被覆を一部省き、ここに前記の接地用ばね片等が当接するようにする。
【００１２】
図２は本発明の他の実施形態で、図２（Ａ）は外観図、図２（Ｂ）は図２（Ａ）のＢ−Ｂ断面図である。基本構造は図１と同様であるが、絶縁材の上板４の上に金属層８を重ねてシールド機能を持たせたものである。一般に、上板４および金属層８として、印刷回路基板材料のような絶縁材と金属箔を一体に積層したものを用いるのが便利である。金属層８の接地は、例えば上板４の下面５に小面積のランド部を設け、スルーホールで上面の金属層８に接続し、前述のように回路基板１の接地パターンに設けた接地用のばね片等がこのランド部に当接するようにして行うことができる。この場合スルーホールは、樹脂６がパッケージ表面に流れ出ない程度に小径のものや、予め封止してあるもの、あるいは穴が導電材でふさがっているものなどが望ましい。金属層８を設けることにより、前述のように、シールド機能のほか遮光性と放熱性が向上する。
【００１３】
図２（Ａ）、（Ｂ）にて金属層８に設けた窓９は、回路が光電素子を含む場合の光の通路で、フォト・エッチングして形成する。その場合、光が通るよう上板４には透明または半透明の材料を用いる。従来のように別体のシールド・ケースを用いたパッケージでは、回路の種別などの表示のためにシールド・ケースに記号を刻印することがあったが、本発明のごとくシールド・ケースを用いずに金属層８を設ける場合には、刻印などの工程によらなくとも、記号を窓９などと同時にパターニングすることができ、製造コストを下げる上で有利である。
【００１４】
上述のような本発明のパッケージは、基本的にはＩＣチップ２、回路部品３等を実装した回路基板１の部品搭載面に樹脂６を塗布し、上板４を押しつけて下面５を回路部品３に当接させ、周囲からはみ出した樹脂を削り取って固化することにより得られる構造である。しかし実際の製造に当たってはもっと便利な方法を用いる。例えば、大面積の集合基板に個々の回路モジュールとなる多くの領域を設け、それぞれの領域に回路部品を実装し、その上にこれも大面積の集合上板をかぶせて、その下面を集合基板上に多数搭載された回路部品群３の上面に当接させて保持し、集合基板の周囲に樹脂の注入部を除いてモールド枠を設けておくなり、集合基板の周囲を注入部を残して塞ぐ治具を用いるなりして樹脂を注入、固化し、これをダイシングして回路モジュールを多数個取りで得るのである。しかし、ここでは製造方法について詳述することは省く。
【００１５】
【発明の効果】
以上述べたごとく、本発明による回路モジュールは従来のようなモールド枠やリード・フレーム、あるいはシールド・ケースといった部品を用いないから、部品数が減ってコストが下がる。回路基板にはモールド枠の搭載場所が不要で面積を小さくでき、またモジュールの厚さは回路基板の厚さと回路部品の高さと上板の厚さの和にほぼ等しくて余分の厚さを必要とせず、最大限の小型、薄型化が可能になる。回路部品は樹脂中に封入されて機械的に保護され、外部の雰囲気からも保護されてモジュールの信頼性が保たれる。そして上板に金属板あるいは金属箔との積層板を用いるならば、シールド・ケースを用いなくとも遮蔽作用が得られるとともに、遮光性や放熱性が向上する。また、金属層のパターニングにより、種別などの記号の表示を従来より簡単に行えるという利点もある。
【図面の簡単な説明】
【図１】本発明による電子回路のパッケージの実施形態であって、図（Ａ）は外観図、図（Ｂ）は図（Ａ）のＢ−Ｂ断面図である。
【図２】本発明による電子回路のパッケージの別の実施形態であって、図（Ａ）は外観図、図（Ｂ）は図（Ａ）のＢ−Ｂ断面図である。
【図３】従来の電子回路のパッケージであって、図（Ａ）、図（Ｃ）および図（Ｅ）はそれぞれ外観図であり、図（Ｂ）、図（Ｄ）および図（Ｆ）はそれぞれ図（Ａ）、図（Ｃ）および図（Ｅ）のＢ−Ｂ断面図、Ｄ−Ｄ断面図およびＦ−Ｆ断面図である。
【符号の説明】
１、１０１ 回路基板
２、１０２ ＩＣチップ
３、１０３ 回路部品
４ 上板
６、１０５、１１０ 樹脂
７ 導電部
８ 金属層
９、１０７ 窓
１０４ モールド枠
１０６ シールド・ケース
１０９ リード[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a package structure of an electronic circuit module in which a small electronic circuit component such as an IC chip is mounted on a circuit board, and the circuit component is embedded by sealing with a resin.
[0002]
[Prior art]
Circuit modules that have active and passive circuit components mounted on a circuit board and have a certain function are suitable for surface mounting on electronic equipment as various types appear and miniaturization progresses. It is becoming popular. As a package structure of such a small circuit, the one shown in FIG. 3A has been conventionally manufactured by the inventors. If an example of the dimensions is given, it is about 10 mm in length and width and about 5 mm in height. FIG. 3B shows a cross section taken along the line B-B. A circuit component 103 such as an IC chip 102, a chip resistor, and a chip capacitor is mounted on the circuit board 101, and a mold frame 104 is formed on a part or all of the periphery of the board. In this case, a resin component 105 such as epoxy is injected inside to embed circuit components, and a metal shield case 106 is attached. A window 107 opened in the shield case 106 is a light path for the photoelectric elements in the circuit.
[0003]
FIG. 3 (C) also shows a package structure of the same system as above, and its DD cross section is shown in FIG. 3 (D), but there are places 108 where resin is not deposited on both sides of the circuit board 101. A masking material is temporarily joined to the portion in a bank shape, a resin is injected between the masking materials and solidified, and then the masking material is removed. A metal shield case 106 is also attached to this package.
[0004]
The package shown in FIG. 3 (E) is generally seen, and its FF cross section is shown in FIG. 3 (F). The lead 109 is connected to the circuit, and the circuit is encapsulated in the resin 110 by transfer molding. It is.
[0005]
[Problems to be solved by the invention]
The conventional module package structure as described above has the following problems. That is, in FIGS. 3A and 3B, the mold frame 104 is used to make the sealing resin 105 into a certain amount and shape, and this mold frame 104 is a component of the completed module. Since the height of the mold frame 104 is slightly larger than the height of the circuit components, the package becomes small and thin, and it is difficult to reduce the manufacturing cost. 3C and 3D, the finished module does not include a mold frame, but a similar masking material is used in the manufacturing process in order to keep the amount and shape of the resin constant, and the resin is injected. Since it is removed later, it still has the same problem as described above. 3 (E) and 3 (F) are cost factors due to the addition of a lead frame to the constituent materials, and the completed shape is not a chip like the one described above, and the leads protrude, making it unsuitable for miniaturization and thinning. It is.
The present invention solves these problems and provides an electronic circuit package structure that is suitable for reduction in size and thickness, can be manufactured at low cost, and has sufficient reliability.
[0006]
[Means for Solving the Problems]
The electronic circuit package of the present invention has a structure in which an upper plate is placed on a circuit board on which circuit components are mounted, and a sealing resin is filled between the circuit board and the upper plate. In other words, the circuit board and the upper plate sandwich the resin portion in a sandwich shape, and the circuit components are embedded in the resin. The lower surface of the upper plate is brought into contact with the highest circuit component such as a resistor or a capacitor. Therefore, the thickness of the resin layer becomes equal to the thickness of the circuit component, and the thickness of the package is minimized. Further, each side surface of the package becomes a resin surface, and there is no need to provide a place for arranging a mold frame or a masking frame on the circuit board. An insulating material is used for the upper plate, or a metal plate is used if the surface of the circuit component is sufficiently insulated and there is no fear of a short circuit. Further, a metal layer may be stacked on the upper plate of the insulating material. By providing such a metal layer, a shielding function can be obtained, and reliability can be maintained without using a conventional shield case.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
1A and 1B show a first embodiment of a package structure of an electronic circuit according to the present invention. FIG. 1A is an external view, and FIG. 1B is a cross-sectional view taken along line BB in FIG. In FIG. 1B, an IC chip 2 and chip-like resistors, capacitors and other circuit components are mounted on a circuit board 1, and the highest one among them is a circuit component 3. The upper plate 4 is disposed on the upper portion, and the lower surface 5 is disposed in contact with the circuit component 3 having the highest height and protruding most from the circuit board. By filling the space between the circuit board 1 and the upper plate 4 with the resin 6, the whole is joined and the circuit component is embedded in the resin to mechanically protect it and also protects it from the outside air.
[0008]
Although not shown, a terminal electrode for connection to the device is provided on the lower surface of the circuit board 1. A portion 7 of the side surface of the circuit board 1 that is recessed in an arc shape is a conductive portion in which the inner surface of the recess is covered with a conductive material, and is a part of the through hole provided in the material of the circuit board 1. Thus, the conductive pattern on the upper surface of the circuit board 1 and the terminal electrode on the lower surface are connected.
[0009]
If the upper plate 4 is an insulating material, the lower surface 5 can be brought into contact with the circuit component 3 without causing a short circuit. In order to reduce the thickness of the product, a material that is as thin as possible (for example, around 0.1 mm) is used as long as the strength allows. Depending on the function of the module, it may include light-receiving and light-emitting photoelectric elements such as phototransistors, photo-diodes, and LEDs. In this case, the upper plate 4 needs to transmit light and is transparent or semi-transparent depending on the light intensity. A transparent resin material or the like is used. However, if there is a circuit component that needs light shielding on the other side, mask printing or the like is applied to the upper plate 4 at that location.
[0010]
When the surface of the circuit component 3 is sufficiently insulated, the upper plate 4 can be a metal plate. A shielding action is obtained from the upper plate of the metal plate. In order to connect the metal upper plate 4 to the ground pattern of the circuit board 1 in order to stabilize the shielding action, for example, a grounding spring piece or a conductive elastomer is placed on the ground pattern and abuts against the lower surface of the upper plate 4. You can take a structure such as letting. The upper plate 4 of the metal plate has an advantage that it has excellent light shielding properties and heat dissipation properties in addition to the shielding action.
[0011]
If an insulating film is formed on the lower surface 5 of the upper plate 4 of the metal plate by painting or the like, there is no fear of a short circuit even if it is brought into contact with the circuit component 3. In order to ground the upper plate 4 of the metal plate, a part of the insulating coating on the lower surface 5 is omitted, and the grounding spring piece or the like is brought into contact therewith.
[0012]
FIG. 2 is another embodiment of the present invention, FIG. 2 (A) is an external view, and FIG. 2 (B) is a cross-sectional view taken along line BB of FIG. 2 (A). The basic structure is the same as in FIG. 1, but a metal layer 8 is stacked on the upper plate 4 of the insulating material to provide a shielding function. In general, it is convenient to use an upper plate 4 and a metal layer 8 in which an insulating material such as a printed circuit board material and a metal foil are integrally laminated. For the grounding of the metal layer 8, for example, a land portion having a small area is provided on the lower surface 5 of the upper plate 4 and connected to the upper metal layer 8 through a through hole. The spring piece or the like can be brought into contact with the land portion. In this case, it is desirable that the through hole has a small diameter so that the resin 6 does not flow out to the package surface, is sealed in advance, or has a hole blocked with a conductive material. Providing the metal layer 8 improves the light shielding and heat dissipation as well as the shielding function as described above.
[0013]
The window 9 provided in the metal layer 8 in FIGS. 2A and 2B is a light path when the circuit includes a photoelectric element, and is formed by photo-etching. In that case, a transparent or translucent material is used for the upper plate 4 so that light can pass through. In the case of a package using a separate shield case as in the past, a symbol may be engraved on the shield case for display of the type of circuit, but without using the shield case as in the present invention. When the metal layer 8 is provided, the symbol can be patterned simultaneously with the window 9 and the like without using a process such as engraving, which is advantageous in reducing the manufacturing cost.
[0014]
In the package of the present invention as described above, basically, the resin 6 is applied to the component mounting surface of the circuit board 1 on which the IC chip 2, the circuit component 3 and the like are mounted, and the upper plate 4 is pressed to fix the lower surface 5 to the circuit component. 3 is a structure obtained by scraping and solidifying the resin protruding from the periphery. However, a more convenient method is used in actual production. For example, a large area collective board is provided with many areas to be individual circuit modules, circuit components are mounted in each area, and a large area collective upper plate is also placed thereon, and the lower surface thereof is the collective board. It is held in contact with the upper surface of the circuit component group 3 mounted thereon, and a mold frame is provided around the collective substrate except for the resin injection portion, leaving the injection portion around the collective substrate. By using a closing jig, resin is injected and solidified, and this is diced to obtain a large number of circuit modules. However, detailed description of the manufacturing method is omitted here.
[0015]
【The invention's effect】
As described above, the circuit module according to the present invention does not use parts such as a conventional mold frame, lead frame, or shield case, so the number of parts is reduced and the cost is reduced. The circuit board does not require a mounting area for the mold frame and the area can be reduced. The thickness of the module is approximately equal to the sum of the thickness of the circuit board, the height of the circuit components, and the thickness of the top plate, and requires an extra thickness. However, the maximum size and thickness can be reduced. The circuit components are sealed in a resin and mechanically protected, and are protected from the external atmosphere to maintain the reliability of the module. If a laminated plate of a metal plate or a metal foil is used for the upper plate, a shielding action can be obtained without using a shield case, and light shielding and heat dissipation can be improved. In addition, the patterning of the metal layer has an advantage that symbols such as the type can be displayed more easily than in the past.
[Brief description of the drawings]
1A and 1B show an embodiment of an electronic circuit package according to the present invention, in which FIG. 1A is an external view, and FIG. 1B is a cross-sectional view along line BB in FIG.
FIG. 2 is another embodiment of the electronic circuit package according to the present invention, in which FIG. (A) is an external view and FIG. (B) is a cross-sectional view along line BB of FIG.
FIG. 3 shows a conventional electronic circuit package, in which FIG. (A), FIG. (C), and FIG. (E) are external views, and FIG. (B), FIG. (D), and FIG. They are a BB sectional view, DD sectional view, and FF sectional view of Drawing (A), Drawing (C), and Drawing (E), respectively.
[Explanation of symbols]
1, 101 Circuit board 2, 102 IC chip 3, 103 Circuit component 4 Upper plate 6, 105, 110 Resin 7 Conductive part 8 Metal layer 9, 107 Window 104 Mold frame 106 Shield case 109 Lead

Claims (5)

回路部品を実装した回路基板の上に上板を重ねて配置し、
前記上板は下面を前記回路部品のうち最も高さの高いものに当接させ、
前記回路基板と前記上板の間に充填した樹脂中に前記回路部品を封入した電子回路のパッケージ構造。Place the upper board on the circuit board on which the circuit components are mounted,
The upper plate is abutted against a lower surface having the highest height of the circuit component,
The package structure of the electronic circuit which enclosed the said circuit component in resin with which it filled between the said circuit board and the said upper board. 請求項１に記載の電子回路のパッケージ構造において、
前記上板は、下面に絶縁被覆を施した金属板である電子回路のパッケージ構造。 The electronic circuit package structure according to claim 1,
The upper plate is a package structure of an electronic circuit, which is a metal plate having an insulating coating on the lower surface. 請求項１に記載の電子回路のパッケージ構造において、
前記上板は、絶縁材であり、前記上板の上面に金属層を重ねた電子回路のパッケージ構造。The electronic circuit package structure according to claim 1,
The upper plate is an insulating material , and is an electronic circuit package structure in which a metal layer is stacked on the upper surface of the upper plate . 請求項３に記載の電子回路のパッケージ構造において、
前記金属層は、金属箔である電子回路のパッケージ構造。In the package structure of the electronic circuit according to claim 3,
The metal layer is a package structure of an electronic circuit which is a metal foil. 請求項３に記載の電子回路のパッケージ構造において、
前記回路部品は光電素子を含み、前記上板は透光性の材料であり、前記光電素子上の前記金属層の一部に窓を設けた電子回路のパッケージ構造。In the package structure of the electronic circuit according to claim 3,
The circuit component includes a photoelectric element, the upper plate is made of a translucent material , and an electronic circuit package structure in which a window is provided in a part of the metal layer on the photoelectric element .
JP19335397A 1997-07-04 1997-07-04 Electronic circuit package structure Expired - Fee Related JP3824742B2 (en)

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JP19335397A JP3824742B2 (en) 1997-07-04 1997-07-04 Electronic circuit package structure

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Application Number Priority Date Filing Date Title
JP19335397A JP3824742B2 (en) 1997-07-04 1997-07-04 Electronic circuit package structure

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JP3824742B2 true JP3824742B2 (en) 2006-09-20

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US10825694B2 (en) 2017-02-02 2020-11-03 Hitachi Chemical Company, Ltd. Method for manufacturing electronic component, resin composition for temporary protection, and resin film for temporary protection
KR20230020963A (en) 2020-06-09 2023-02-13 쇼와덴코머티리얼즈가부시끼가이샤 Method for manufacturing electronic parts, resin composition for temporary protection, and resin film for temporary protection

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