JP3823118B2 - 基板組立装置 - Google Patents
基板組立装置 Download PDFInfo
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- JP3823118B2 JP3823118B2 JP2005185892A JP2005185892A JP3823118B2 JP 3823118 B2 JP3823118 B2 JP 3823118B2 JP 2005185892 A JP2005185892 A JP 2005185892A JP 2005185892 A JP2005185892 A JP 2005185892A JP 3823118 B2 JP3823118 B2 JP 3823118B2
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Description
Claims (2)
- 減圧雰囲気にするためのチャンバと、前記チャンバ内に一方の基板を保持し上下に移動可能に構成した加圧板と、前記加圧板に保持された基板に対向して間隔を空けて他方の基板を保持する基板保持テーブルと、前記基板保持テーブルを駆動して、前記一方の基板と他方の基板の位置合せを行い、前記加圧板を上下に駆動して基板間の間隔を狭め、前記基板のどちらか一方に設けた接着剤により減圧雰囲気中で貼り合せを行う基板組立装置において、
前記加圧板に吸引吸着するため、複数の吸引吸着孔を3つ以上の群に分割し、各群毎に負圧を供給する配管を備え、各群毎に吸着力を可変できるように負圧源をそれぞれ設けるか、配管途中に調圧弁を備え、保持する基板の撓み量に応じてそれぞれの群に供給する負圧力を調整する構成とした基板組立装置。 - 請求項1に記載の基板組立装置において、
前記チャンバ内を減圧した時に、前記基板を保持するための静電吸着機構または粘着保持機構を備えていることを特徴とする基板組立装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005185892A JP3823118B2 (ja) | 2002-07-19 | 2005-06-27 | 基板組立装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002210443 | 2002-07-19 | ||
JP2005185892A JP3823118B2 (ja) | 2002-07-19 | 2005-06-27 | 基板組立装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002366017A Division JP3823083B2 (ja) | 2002-07-19 | 2002-12-18 | 基板組立装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006120029A Division JP4023510B2 (ja) | 2002-07-19 | 2006-04-25 | 基板組立装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005326873A JP2005326873A (ja) | 2005-11-24 |
JP3823118B2 true JP3823118B2 (ja) | 2006-09-20 |
Family
ID=35473209
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2005185892A Expired - Fee Related JP3823118B2 (ja) | 2002-07-19 | 2005-06-27 | 基板組立装置 |
Country Status (1)
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JP (1) | JP3823118B2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100898793B1 (ko) | 2005-12-29 | 2009-05-20 | 엘지디스플레이 주식회사 | 액정표시소자용 기판 합착 장치 |
WO2021054507A1 (ko) | 2019-09-19 | 2021-03-25 | 엘지전자 주식회사 | 반도체 발광소자의 자가조립 장치 |
KR102323256B1 (ko) | 2019-09-19 | 2021-11-08 | 엘지전자 주식회사 | 반도체 발광소자의 자가조립 장치 |
WO2021054548A1 (en) | 2019-09-19 | 2021-03-25 | Lg Electronics Inc. | Substrate chuck for self-assembling semiconductor light-emitting diodes |
WO2021054508A1 (ko) | 2019-09-19 | 2021-03-25 | 엘지전자 주식회사 | 반도체 발광소자의 자가조립 장치 |
EP4071789A4 (en) | 2019-09-19 | 2024-02-14 | LG Electronics Inc. | SUBSTRATE CHUCK FOR SELF-ASSEMBLY OF LIGHT-EMITTING SEMICONDUCTOR DIODES |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3393955B2 (ja) * | 1995-04-18 | 2003-04-07 | 株式会社ダイヘン | 薄板状ワーク搬送用ハンド |
JP4153582B2 (ja) * | 1998-03-16 | 2008-09-24 | 東芝松下ディスプレイテクノロジー株式会社 | 基板保持装置 |
JP3410983B2 (ja) * | 1999-03-30 | 2003-05-26 | 株式会社 日立インダストリイズ | 基板の組立方法およびその装置 |
JP2001105368A (ja) * | 1999-10-01 | 2001-04-17 | Mitsubishi Electric Corp | 吸着装置及び吸着方法 |
JP3574865B2 (ja) * | 1999-11-08 | 2004-10-06 | 株式会社 日立インダストリイズ | 基板の組立方法とその装置 |
JP2001179672A (ja) * | 1999-12-21 | 2001-07-03 | Mitsubishi Electric Corp | ロボットハンド |
-
2005
- 2005-06-27 JP JP2005185892A patent/JP3823118B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JP2005326873A (ja) | 2005-11-24 |
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