JP3644575B2 - Wire bonding equipment - Google Patents

Wire bonding equipment Download PDF

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Publication number
JP3644575B2
JP3644575B2 JP22665498A JP22665498A JP3644575B2 JP 3644575 B2 JP3644575 B2 JP 3644575B2 JP 22665498 A JP22665498 A JP 22665498A JP 22665498 A JP22665498 A JP 22665498A JP 3644575 B2 JP3644575 B2 JP 3644575B2
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bonding
wire
capillary
chip
axis
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JP2000058582A (en
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秀憲 笹原
玉成 安田
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Kaijo Corp
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Kaijo Corp
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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Description

【０００１】
【発明の属する技術分野】
本発明は、ワイヤボンディング装置に関し、特にチップの電極の第１ボンディング点と予めリードに接合されたバンプボールの第２ボンディング点とをワイヤで接続するボンディング動作を、制御用マイクロコンピュータにより制御するワイヤボンディング装置の技術分野に属する。
【０００２】
【従来の技術】
従来の、チップの電極とリードとをワイヤで接続するワイヤボンディング装置においては、キャピラリをチップの電極の第１ボンディング点からリードの第２ボンディング点までのＸ軸およびＹ軸方向の水平面内で移動させるＸ軸移動テーブルおよびＹ軸移動テーブルと、Ｚ軸方向の上下に揺動させるＺ軸駆動機構と、これらを駆動制御するサーボ駆動制御部を有している。Ｚ軸駆動機構の先端部にはワイヤが挿通されたキャピラリが有り、キャピラリが第１ボンディング点から第２ボンディング点まで移動するようになっている。
【０００３】
図８は、従来のワイヤボンディング装置の構成の一例を示すブロック図である。
図８において、ベース２０上にはＸ軸モータ２１を備えたＸ軸移動テーブル２２と、Ｙ軸モータ２３を備えたＹ軸移動テーブル２４が設置されており、Ｘ軸モータ２１とＹ軸モータ２３の回転によりテーブルが水平面内を移動する。Ｙ軸移動テーブル２４上にはＺ軸駆動機構２５が設置されており、Ｚ軸駆動機構２５は支軸２６により保持ブロック２７に回転自在に軸支されている。Ｚ軸駆動機構２５にはアーム２８が延出しており、アーム２８の先端部にはワイヤ１４が挿通されたキャピラリ３０が保持されている。また、Ｚ軸駆動機構２５にはカム機構３１が有り、カム機構３１はＺ軸モータ３２により回転しアーム２８を上下に揺動させる。キャピラリ３０の上位部にはワイヤ１４を挟持するワイヤクランプ２９が有り、ワイヤクランプ２９がワイヤ１４を挟持したまま上昇することによりワイヤ１４が第２ボンディング点から切断される。
【０００４】
べース２０上にはボンディング対象物であるチップ１０が搭載されたリードフレーム１１を搭載するボンディングステージ３３が設置されている。チップ１０には電極１２があり、ボンディングにより電極１２とリード１３がワイヤ１４により接続される。Ｙ軸移動テーブル２４上のＺ軸駆動機構２５の横には保持具３４が延出しており、この保持具３４にはＩＴＶカメラ３５が固定されている。ＩＴＶカメラ３５はボンディング部分に対して水平面内で移動可能であり、ボンディング部分を撮像し映像を読み取り電気信号に変換する。
【０００５】
画像認識部３６はＩＴＶカメラ３５により読み取られた映像信号を画像認識し、ボンディングに必要な位置決め情報を制御部３７へ出力する。制御部３７はこの位置決め情報によりキャピラリ３０の動きを制御する。制御部３７には、キャピラリ３０が第１ボンディング点から第２ボンディング点まで移動するときの、キャピラリ３０のＸ軸およびＹ軸上の水平面内の位置とＺ軸上の上下の位置のパラメータが予め設定されており、このパラメータによりキャピラリ３０が定められた軌跡に沿って移動する制御信号を出力する。
【０００６】
サーボ駆動制御部３８は制御部３７からの信号によりＸ軸モータ２１とＹ軸モータ２３とを回転させ、Ｘ軸移動テーブル２２とＹ軸移動テーブル２４を水平面内に移動させる。さらにサーボ駆動制御部３８はＺ軸モータ３２を回転させることによりカム機構３１を駆動しアーム２８を上下に揺動させる。これによりキャピラリ３０が第１ボンディング点から第２ボンディング点まで定められた軌跡で移動するようになっている。
【０００７】
次に、従来のワイヤボンディング装置のボンディング動作について図８および図９を使用して説明する。
図９は図８の従来のワイヤボンディング装置の第１ボンディング点から第２ボンディング点までキャピラリ３０が移動してワイヤを掛け渡す動作の説明図である。図８によれば、ボンディングステージ３３上のリードフレーム１１の上面にチップ１０が搭載されている。ワイヤボンディングを行うのに先立って、チップ１０の電極１２とリード１３がＩＴＶカメラ３５で撮像される。この映像は電気信号に変換され画像認識部３６にて画像認識されボンディング位置が検出され制御部３７へ送られる。制御部３７ではこの位置情報と制御部３７に予め設定されているキャピラリ３０の移動軌跡のパラメータを使用して、キャピラリ３０が定められた軌跡で移動させる制御信号が作られる。この制御信号によりサーボ駆動制御部３８はキャピラリ３０を第１ボンディング点から第２ボンディング点までループを形成して移動させる。
【０００８】
図８では、キャピラリ３０の先端でワイヤ１４の先端にボンディング用のボール１５が形成されている。
そして、キャピラリ３０が第１ボンディング点であるチップ１０の電極１２へ降下当接することによりホール１７が電極１２に圧着接合される。その後図９に示すようにキャピラリ３０がループを形成しつつリード１３の第２ボンディング点まで移動しワイヤ１４をリード１３に押しつけて接合する。これにより第１ボンディング点と第２ボンディング点とがワイヤ１４により接続される。接続が終わるとキャピラリ３０は上昇し第１ボンディング点へ移動して次のボンディング動作へ移る。キャピラリ３０が上昇中にキャピラリ３０の上位部のワイヤクランプ２９が閉じてワイヤ１４を握持して上方へ移動することによりワイヤ１４が第２ボンディング点の所で切断させる。
【０００９】
【発明が解決しようとする課題】
しかしながら、前記従来の技術には次のような問題があった。
第１の問題点は、第２ボンディング点におけるボンディングがワイヤを直接第２ボンディング点のリードに押しつけて接合させ、その後上方向に引っ張って切るテールカットと呼ばれるものであるため、第２ボンディング点における接合面積が第１ボンディング点に比べて非常に小さく接合強度が弱いということである。また、接合面積が小さいため、リードの表面清浄度や表面粗さの度合いをより良くしなければ良好なボンディングができない。この結果ボンディングの信頼性があがらないということである。
【００１０】
第２の問題点は、第２ボンディング点のリードの傾きが大きいと、キャピラリの先端形状に合わず接合ができないことである。近年、第２ボンディング点がリードフレームのリードのほかに、チップサイズパッケージ（ＣＳＰ），ＬＥＤ，トランジスタ，ダイオードなどにボンディングされるものが多くなっており取り付け状態により傾きが大きく且つ色々の傾きとなっている。リードの傾きの許容値はキャピラリの先端形状に関係しており、色々の傾きに対応するには傾きに合った先端形状を有するキャピラリを複数用意しなければならない。
【００１１】
第３の問題点は、ボンディング対象物がチップサイズパッケージ（ＣＳＰ）のような表面構造が弱いものに第２ボンディングを行う場合は、十分な接合力を得るための圧力がＣＳＰにとっては過度な圧力となり、またキャピラリが直接ＣＳＰに触れてＣＳＰが破壊することがある。このため表面構造が弱いチップには第２ボンディングを行うことができずボンディング対象物が制限されることである。
【００１２】
本発明の目的は、上記従来技術の問題点に鑑みて、ワイヤボンディング装置において、第１ボンディング点と第２ボンディング点とをワイヤで接続するボンディング動作を行う前に、予め第２ボンディング点にバンプボールを接合しておき、このバンプボールにワイヤを接続するように制御用マイクロコンピュータで制御することにより、第２ボンディング点の接合面積が大きくして良好なボンディングができるワイヤボンディング装置を提供することにある。また、第２ボンディング点のリードの傾きが大きくてもキャピラリの先端形状が制限されなく良好な接合ができるワイヤボンディング装置を提供することにある。さらに、リードを第１ボンディング点としチップの電極を第２ボンディング点とした通常と逆のボンディング動作を行うことにより、ＣＳＰなど表面構造が弱いものに対して過度な圧力が掛からなく破壊することのない安全なワイヤボンディング装置を提供することにある。
バンプボールをリードまたはチップの電極の複数箇所の第２ボンディング点に予め連続して作成接合することにより、キャピラリの移動距離が短くなりボンディング速度をあげることができるワイヤボンディング装置を提供することにある。
【００１３】
【課題を解決するための手段】
本発明は、上記の目的を達成するために次の各手段構成を有する。
第１の発明は、チップの電極とリードとを接続するワイヤが挿通されるキャピラリと、キャピラリを保持するアームと、このアームを上下のＺ軸方向に揺動させるＺ軸モータとカム機構を有するＺ軸駆動機構と、チップの電極とリードの上面を撮像し映像を電気信号に変換するＩＴＶカメラと、前記アームと前記ＩＴＶカメラをチップに対して相対的に水平面内に移動させるＸ軸モータを有するＸ軸移動テーブルおよびＹ軸モータを有するＹ軸移動テーブルと、チップが搭載されたリードフレームを搭載するボンディングステージと、前記ＩＴＶカメラからの映像信号を画像認識し位置情報を得る画像認識部と、この位置情報によりキャピラリの動きを制御する制御用マイクロコンピュータと、前記Ｘ軸モータ，Ｙ軸モータ，Ｚ軸モータを回転させるサーボ駆動制御部とを有するワイヤボンディング装置であって、前記制御用マイクロコンピュータが、次の各手段構成を有することを特徴とする。
（イ）チップの電極の第１ボンディング点と予めリードに接合されたバンプボールの第２ボンディング点とを、キャピラリを移動させてワイヤで接続するボンディング制御手段
（ロ）バンプボールをリードの第２ボンディング点に作成接合するバンプボール作成接合制御手段
【００１４】
第２の発明は、前記第１の発明の制御用マイクロコンピュータに、リードを第１ボンディング点とし、前記（ロ）記載のバンプボール作成接合制御手段により予めチップの電極に接合されたバンプボールを第２ボンディング点として、キャピラリを移動させてワイヤで接続する逆ボンディング制御手段を付加したことを特徴とするワイヤボンディング装置である。
【００１５】
第３の発明は、前記第１の発明の制御用マイクロコンピュータに、第２ボンディング点とする複数のリードまたはチップの複数の電極にバンプボールを連続して作成接合する複数バンプボール作成接合制御手段を付加したことを特徴とするワイヤボンディング装置である。
【００１６】
第４の発明は、前記第１の発明の制御用マイクロコンピュータに、次の各手段構成を付加したことを特徴とするワイヤボンディング装置である。
（イ）リードを第１ボンディング点とし、予めチップの電極に接合されたバンプボールを第２ボンディング点として、キャピラリを移動させてワイヤで接続する逆ボンディング制御手段
（ロ）バンプボールを、第２ボンディング点とする複数のリードまたはチップの複数の電極に予め連続して作成接合する複数バンプボール作成接合制御手段
【００１７】
【作用】
本発明は、各手段構成によりワイヤボンディング装置において第１ボンディング点と第２ボンディング点とをワイヤで接続するボンディング動作を行う前に、予め第２ボンディング点にバンプボールを接合しておき、このバンプボールにワイヤを接続するように制御用マイクロコンピュータが制御動作を行うようにしたので、第２ボンディング点の接合面積が大きくなり良好なボンディングができる。また、第２ボンディング点のリードに予めバンプボールを接合しておき、これにワイヤを接続するようにしたので、リードの傾きが大きくてもキャピラリの先端形状が制限されなく良好な接合ができる。
第２の発明は、リードを第１ボンディング点としチップの電極を第２ボンディング点とした通常と逆のボンディング動作を行うことにより、ＣＳＰなど表面構造が弱いものに対して過度な圧力が掛からなく破壊することのない安全なボンディングができる。
第３の発明は、バンプボールを、第２ボンディング点とする複数のリードまたはチップの複数の電極に予め連続して作成接合することにより、キャピラリの移動距離が短くなりボンディング速度をあげることができる。
第４の発明は、前記すべての発明の作用をする。
【００１８】
【発明の実施の形態】
本発明の実施の形態は、第１の発明では、チップの電極とリードとを接続するワイヤが挿通されるキャピラリと、キャピラリを保持するアームと、このアームを上下のＺ軸方向に揺動させるＺ軸モータとカム機構を有するＺ軸駆動機構と、チップの電極とリードの上面を撮像し映像を電気信号に変換するＩＴＶカメラと、前記アームと前記ＩＴＶカメラをチップに対して相対的に水平面内に移動させるＸ軸モータを有するＸ軸移動テーブルおよびＹ軸モータを有するＹ軸移動テーブルと、チップが搭載されたリードフレームを搭載するボンディングステージと、前記ＩＴＶカメラからの映像信号を画像認識し位置情報を得る画像認識部と、この位置情報によりキャピラリの動きを制御する制御用マイクロコンピュータと、前記Ｘ軸モータ，Ｙ軸モータ，Ｚ軸モータを回転させるサーボ駆動制御部とを有するワイヤボンディング装置であって、制御用マイクロコンピュータが、バンプボールをリードの第２ボンディング点に作成接合するバンプボール作成接合制御手段と、チップの電極の第１ボンディング点と予めリードに接合されたバンプボールの第２ボンディング点とをキャピラリを移動させてワイヤで接続するボンディング制御手段とを有し、第１ボンディング点と第２ボンディング点とをワイヤで接続するボンディング動作を行う前に、予め第２ボンディング点にバンプボールを接合しておき、このバンプボールにワイヤを接続するように制御動作を行うようにしたものである。これにより第２ボンディング点の接合面積が大きく接合強度が強くなり良好なボンディングができる。また、第２ボンディング点のリードに予めバンプボールを接合しておくことにより、リードの傾きが大きくても、また、種々の傾きに対しても、種々の先端形状のキャピラリを用意しなくとも良好な接合ができる。
【００１９】
第２の発明では、前記制御用マイクロコンピュータに、リードの第１ボンディング点と予めチップの電極に接合されたバンプボールの第２ボンディング点とを、キャピラリを移動させてワイヤで接続する逆ボンディング制御手段を付加することにより、リードを第１ボンディング点としチップの電極を第２ボンディング点とした通常と逆のボンディング動作を行うようにしたものである。これによりＣＳＰなど表面構造が弱いものに対して過度な圧力が掛からない安全なボンディングができる。
【００２０】
第３の発明では、前記制御用マイクロコンピュータに、バンプボールを、第２ボンディング点とする複数のリードまたはチップの複数の電極に連続して作成接合する複数バンプボール作成接合制御手段を付加することにより、キャピラリの移動距離が短くなるようにしたものである。これによりボンディング速度をあげることができる。
【００２１】
第４の発明では、前記第１，第２，第３の発明の実施の形態のすべてを備えたものである。
【００２２】
【実施例】
以下本発明のワイヤボンディング装置の実施例を図面を参照して詳細に説明する。
図１は本発明のワイヤボンディング装置の第１の発明の実施例の構成を示すブロック図である。図１において、ベース２０上にはＸ軸モータ２１を備えたＸ軸移動テーブル２２と、Ｙ軸モータ２３を備えたＹ軸移動テーブル２４が設置されており、Ｘ軸モータ２１とＹ軸モータ２３の回転によりテーブルが水平面内を移動する。Ｙ軸移動テーブル２４上にはＺ軸駆動機構２５が設置されており、Ｚ軸駆動機構２５は支軸２６により保持ブロック２７に回転自在に軸支されている。Ｚ軸駆動機構２５にはアーム２８が延出しており、アーム２８の先端部にはワイヤ１４が挿通されたキャピラリ３０が保持されている。また、Ｚ軸駆動機構２５にはカム機構３１が有り、カム機構３１はＺ軸モータ３２により回転しアーム２８を上下に揺動させる。キャピラリ３０の上位部にはワイヤ１４を挟持するワイヤクランプ２９が有り、ワイヤクランプ２９がワイヤ１４を挟持したまま上昇することによりワイヤ１４が第２ボンディング点から切断される。
【００２３】
べース２０上にはボンディング対象物であるチップ１０が搭載されたリードフレーム１１を搭載するボンディングステージ３３が設置されている。
チップ１０には電極１２があり、ボンディングにより電極１２とリード１３がワイヤ１４により接続される。Ｙ軸移動テーブル２４上のＺ軸駆動機構２５の横には保持具３４が延出しており、この保持具３４にはＩＴＶカメラ３５が固定されている。ＩＴＶカメラ３５はボンディング部分に対して水平面内で移動可能であり、ボンディング部分を撮像し映像を読み取り電気信号に変換する。画像認識部３６はＩＴＶカメラ３５により読み取られた映像信号を画像認識し、ワイヤボンディングに必要な位置決め情報を制御用マイクロコンピュータ１へ出力する。
【００２４】
制御用マイクロコンピュータ１はこの位置決め情報によりキャピラリ３０の動きを制御する。制御用マイクロコンピュータ１はバンプボール作成接合制御手段２とボンディング制御手段３とを有する。バンプボール作成接合制御手段２は第１ボンディング点と第２ボンディング点とをワイヤで接続するボンディング動作を行う前に、予め第２ボンディング点にバンプボールを接合しておくように制御する。ボンディング制御手段３はチップ１０の電極１２の第１ボンディング点とリード１３に予め接合されたバンプボールの第２ボンディング点とをキャピラリ３０を移動させてワイヤ１４で接続するように制御する。
【００２５】
次に、本発明のワイヤボンディング装置の動作について図１，図２および図３を使用して説明する。
図１によれば、ボンディングステージ３３上のリードフレーム１１の上面にチップ１０が搭載されている。ワイヤボンディングを行うのに先立って、チップ１０の電極１２とリード１３がＩＴＶカメラ３５で撮像される。この映像は電気信号に変換され画像認識部３６にて画像認識されボンディング位置が検出され制御用マイクロコンピュータ１へ送られる。制御用マイクロコンピュータ１ではこの位置情報と制御用マイクロコンピュータ１に予め設定されているキャピラリ３０の移動軌跡のパラメータを使用して、キャピラリ３０を定められた軌跡で移動させる制御信号が作られる。この制御信号によりサーボ駆動制御部３８はキャピラリ３０を第１ボンディング点から第２ボンディング点までループを形成して移動させる。
【００２６】
図２は本発明の制御用マイクロコンピュータのバンプボール作成接合制御手段２の動作説明図であり、図２の（ａ）はボール作成図、図２の（ｂ）はバンプボール接合図、図２の（ｃ）はバンプボール作成図を示す。
図２の（ａ）のボール作成図に示すように、先ずキャピラリ３０に挿入されたワイヤ１４の先端にスパークロッド３９でスパークされてボール１５が作成される。その後キャピラリ３０がリード１３の第２ボンディング点に下降してくる。次に図２の（ｂ）のバンプボール接合図に示すようにキャピラリ３０がリード１３の第２ボンディング点に下降してバンプボール１６が接合される。次に図２の（ｃ）のバンプボール作成図に示すように第２ボンディング点にバンプボール１６が接合されると、キャピラリ３０がＰ０からＰ１まで上昇し、Ｐ１からＰ２までは水平方向で第１ボンディング点の方向とは逆方向に、Ｐ２からＰ３までは下降し、Ｐ３からＰ４までは再びバンプボールから離れる向きで水平方向に移動してワイヤ１４にクラックを発生させた後、ワイヤクランプ２９がワイヤ１４を挟持して上へ引き上げることによりワイヤ１４が切断されバンプボール１６が作成される。Ｐ０から、Ｐ１，Ｐ２，Ｐ３を経由してＰ４までの移動距離のパラメータはクラックが適切に発生するような値に設定される。
【００２７】
図３は本発明の制御用マイクロコンピュータのボンディング制御手段の動作説明図であり、図３の（ａ）はボール作成図、図３の（ｂ）は第１ボール接合図、図３の（ｃ）はボンディング図を示す。図３の（ａ）のボール作成図に示すように図２で説明したバンプボール作成接合制御手段２により第２ボンディング点にバンプボール１６が予め接合されている。先ずキャピラリ３０に挿入されたワイヤ１４の先端にボール１５が作成され、キャピラリ３０がチップ１０の電極１２の第１ボンディング点に下降してくる。次に図３の（ｂ）のボール作成図に示すように、キャピラリ３０がチップ１０の電極１２の第１ボンディング点に下降し、ボール１５が圧着接合され第１ボール１７のようになる。次に、図３の（ｃ）のボンディング図に示すように、キャピラリ３０がリード１３の第２ボンディング点までループを形成して移動し、予め作成されたバンプボール１６の第２ボンディング点よりＬ０だけ行き過ぎた点に下降してバンプボール１６にワイヤ１４が接合される。これにより第１ボンディング点と第２ボンディング点がワイヤ１４により接続される。Ｌ０の距離のパラメータはボンディングが適切に行われる値に設定される。
【００２８】
次に第２の発明の実施例の制御用マイクロコンピュータの構成について図４および図５を使用して詳細に説明する。
図４は第２の発明の実施例の制御用マイクロコンピュータの構成を説明するためのブロック図である。図５は第２の発明の実施例の制御用マイクロコンピュータの逆ボンディング制御手段の動作説明図であり、図５の（ａ）はバンプボール作成図，図５の（ｂ）はボンディング図を示す。第２の発明の実施例の制御用マイクロコンピュータ４は、第１の発明の実施例の制御用マイクロコンピュータ１にリード１３の第１ボンディング点と予めチップ１０の電極１２に接合されたバンプボールの第２ボンディング点とを、キャピラリ３０を移動させてワイヤ１４で接続する逆ボンディング制御手段５を付加したものである。リード１３を第１ボンディング点としチップ１０の電極１２を第２ボンディング点とした、通常とは逆のボンディング動作を行うことができる。
【００２９】
次に第２の発明の実施例の制御用マイクロコンピュータの動作について図５を使用して詳細に説明する。
図５の（ａ）バンプボール作成図に示すように、リード１３を第１ボンディング点としチップ１０の電極１２を第２ボンディング点とした、通常とは逆のボンディング動作を行うもので、先ず第２ボンディング点に第１の発明と同様にバンプボール作成接合制御手段２によりバンプボール１８が作成される。キャピラリ３０のＰ０からＰ１，Ｐ２，Ｐ３，Ｐ４までの動作は第１の発明と同じである。次に図５の（ｂ）のボンディング図に示すように逆ボンディング制御手段５によりキャピラリ３０がリード１３の第１ボンディング点に下降し第１ボール１９が接合された後、キャピラリ３０がチップ１０の電極１２の第２ボンディング点までループを形成して移動し、予め作成されたバンプボール１８の第２ボンディング点よりＬ１だけ行き過ぎた点に下降してバンプボール１８にワイヤ１４が接合される。これにより第１ボンディング点と第２ボンディング点がワイヤ１４により接続される。Ｌ１の距離のパラメータはボンディングが適切に行われる値に設定される。
【００３０】
次に第３の発明の実施例の制御用マイクロコンピュータの構成について図６を使用して説明する。
図６は第３の発明の実施例の制御用マイクロコンピュータの構成を説明するためのブロック図である。第３の発明の実施例の制御用マイクロコンピュータ６は、第１の発明の実施例の制御用マイクロコンピュータ１にバンプボールをリード１３またはチップ１０の電極１２の複数箇所の第２ボンディング点に予め連続して作成接合する複数バンプボール作成接合制御手段７を付加したもので、キャピラリ３０の移動距離が短くなりボンディング速度をあげることができる。
【００３１】
次に第３の発明の実施例の制御用マイクロコンピュータの動作について説明する。
第３の発明の実施例の制御用マイクロコンピュータ６は、複数バンプボール作成接合制御手段７によりバンプボールをリードまたはチップの電極の複数箇所の第２ボンディング点に予め連続して作成接合しておき、その後ボンディング制御手段３により第１の発明と同様にボンディング動作を行う。
【００３２】
次に第４の発明の実施例の制御用マイクロコンピュータの構成について図７を使用して説明する。
図７は第４の発明の実施例の制御用マイクロコンピュータの構成を説明するためのブロック図である。第４の発明の実施例の制御用マイクロコンピュータ８は、第１の発明の実施例の制御用マイクロコンピュータ１にリード１３の第１ボンディング点とチップ１０の電極１２に予め接合されたバンプボールの第２ボンディング点とをキャピラリ３０を移動させてワイヤ２９で接続する逆ボンディング制御手段５と、バンプボールをリード１３またはチップ１０の電極１２の複数箇所の第２ボンディング点に予め連続して作成接合する複数バンプボール作成接合制御手段７とを付加したものである。
【００３３】
次に第４の発明の実施例の制御用マイクロコンピュータの動作について説明する。
第４の発明の実施例の制御用マイクロコンピュータ８は、第１の発明の実施例の制御用マイクロコンピュータ１に第２の発明の逆ボンディング制御手段５と、第３の発明の複数バンプボール作成接合制御手段７とを付加したものであり、動作も両者を合わせたものである。
【００３４】
【発明の効果】
以上説明したように本発明のワイヤボンディング装置は次の効果を有する。
第１の発明の第１の効果は、第１ボンディング点と第２ボンディング点とをワイヤで接続するボンディング動作を行う前に、予め第２ボンディング点にバンプボールを接合しておき、このバンプボールにワイヤを接続するように制御用マイクロコンピュータが制御動作を行うようにしたので、第２ボンディング点の接合面積が大きくなり接合強度が強くなる。またリードの表面清浄度や表面粗さの度合いによる影響が少なく良好なボンディングができる。この結果ボンディング精度をあげることができる。
【００３５】
第１の発明の第２の効果は、第２ボンディング点のリードに予めバンプボールを接合しておき、これにワイヤを接続するように制御用マイクロコンピュータが制御動作を行うようにしたので、第２ボンディング点のリードの傾きが大きくてもリードの傾きに合ったキャピラリの先端形状を選択する必要がなくなり、キャピラリの先端形状が制限されなく良好な接合ができる。この結果ボンディング精度をあげることができる。
【００３６】
第２の発明の効果は、短ワイヤのボンディングのときに、リードを第１ボンディング点としチップの電極を第２ボンディング点とした、通常とは逆のボンディング動作を行うことにより、チップの表面構造が弱いものに対してキャピラリの先端がチップに接触せずバンプボールが緩衝となって過度な圧力が掛からない安全なボンディングができる。
【００３７】
第３の発明の効果は、バンプボールをリードまたはチップの電極の複数箇所の第２ボンディング点に予め連続して作成接合することにより、キャピラリの移動距離が短くなりボンディング速度をあげることができる。
【００３８】
第４の発明の効果は、前記第１の発明の効果、第２の発明の効果および第３の発明の効果のすべてを有する。
【図面の簡単な説明】
【図１】本発明のワイヤボンディング装置の第１の発明の実施例の構成を示すブロック図である。
【図２】本発明の制御用マイクロコンピュータのバンプボール作成接合制御手段の動作説明図である。
【図３】本発明の制御用マイクロコンピュータのボンディング制御手段の動作説明図である。
【図４】第２の発明の実施例の制御用マイクロコンピュータの構成を説明するためのブロック図である。
【図５】第２の発明の実施例の制御用マイクロコンピュータの逆ボンディング制御手段の動作説明図である。
【図６】第３の発明の実施例の制御用マイクロコンピュータの構成を説明するためのブロック図である。
【図７】第４の発明の実施例の制御用マイクロコンピュータの構成を説明するためのブロック図である。
【図８】従来のワイヤボンディング装置の構成の一例を示すブロック図である。
【図９】図８の従来のワイヤボンディング装置の第１ボンディング点から第２ボンディング点までキャピラリが移動してワイヤを掛け渡す動作の説明図である。
【符号の説明】
１，４，６，８ 制御用マイクロコンピュータ
２ バンプボール作成接合制御手段
３ ボンディング制御手段
５ 逆ボンディング制御手段
７ 複数バンプボール作成接合制御手段
１０ チップ
１１ リードフレーム
１２ 電極
１３ リード
１４ ワイヤ
１５ ボール
１６ バンプボール
１７ 第１ボール
１８ バンプボール
１９ 第１ボール
２０ ベース
２１ Ｘ軸モータ
２２ Ｘ軸移動テーブル
２３ Ｙ軸モータ
２４ Ｙ軸移動テーブル
２５ Ｚ軸駆動機構
２６ 支軸
２７ 保持ブロック
２８ アーム
２９ ワイヤクランプ
３０ キャピラリ
３１ カム機構
３２ Ｚ軸モータ
３３ ボンディングステージ
３４ 保持具
３５ ＩＴＶカメラ
３６ 画像認識部
３７ 制御部
３８ サーボ駆動制御部
３９ スパークロッド[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a wire bonding apparatus, and more particularly to a wire for controlling a bonding operation for connecting a first bonding point of a chip electrode and a second bonding point of a bump ball previously bonded to a lead by a control microcomputer. It belongs to the technical field of bonding equipment.
[0002]
[Prior art]
In a conventional wire bonding apparatus that connects a chip electrode and a lead with a wire, the capillary is moved in a horizontal plane in the X-axis and Y-axis directions from the first bonding point of the chip electrode to the second bonding point of the lead. An X-axis movement table and a Y-axis movement table to be moved; a Z-axis drive mechanism that swings up and down in the Z-axis direction; and a servo drive control unit that drives and controls them. There is a capillary through which a wire is inserted at the tip of the Z-axis drive mechanism, and the capillary moves from the first bonding point to the second bonding point.
[0003]
FIG. 8 is a block diagram showing an example of the configuration of a conventional wire bonding apparatus.
In FIG. 8, an X-axis moving table 22 having an X-axis motor 21 and a Y-axis moving table 24 having a Y-axis motor 23 are installed on a base 20, and the X-axis motor 21 and the Y-axis motor 23 are installed. The table moves in the horizontal plane by the rotation of. A Z-axis drive mechanism 25 is installed on the Y-axis moving table 24, and the Z-axis drive mechanism 25 is rotatably supported on a holding block 27 by a support shaft 26. An arm 28 extends from the Z-axis drive mechanism 25, and a capillary 30 through which the wire 14 is inserted is held at the tip of the arm 28. The Z-axis drive mechanism 25 has a cam mechanism 31. The cam mechanism 31 is rotated by a Z-axis motor 32 to swing the arm 28 up and down. The upper portion of the capillary 30 has a wire clamp 29 that holds the wire 14. The wire clamp 29 is lifted while holding the wire 14, whereby the wire 14 is cut from the second bonding point.
[0004]
On the base 20, a bonding stage 33 for mounting the lead frame 11 on which the chip 10 as a bonding target is mounted is installed. The chip 10 has an electrode 12, and the electrode 12 and the lead 13 are connected by a wire 14 by bonding. A holder 34 extends beside the Z-axis drive mechanism 25 on the Y-axis moving table 24, and an ITV camera 35 is fixed to the holder 34. The ITV camera 35 is movable in a horizontal plane with respect to the bonding portion, images the bonding portion, reads an image, and converts it into an electrical signal.
[0005]
The image recognition unit 36 recognizes the image signal read by the ITV camera 35 and outputs positioning information necessary for bonding to the control unit 37. The controller 37 controls the movement of the capillary 30 based on this positioning information. In the control unit 37, parameters of the position of the capillary 30 in the horizontal plane on the X axis and the Y axis and the vertical position on the Z axis when the capillary 30 moves from the first bonding point to the second bonding point are preset. The control signal is set, and a control signal for moving the capillary 30 along the locus determined by this parameter is output.
[0006]
The servo drive control unit 38 rotates the X-axis motor 21 and the Y-axis motor 23 in response to a signal from the control unit 37, and moves the X-axis movement table 22 and the Y-axis movement table 24 in the horizontal plane. Further, the servo drive control unit 38 rotates the Z-axis motor 32 to drive the cam mechanism 31 and swing the arm 28 up and down. As a result, the capillary 30 moves along a predetermined locus from the first bonding point to the second bonding point.
[0007]
Next, the bonding operation of the conventional wire bonding apparatus will be described with reference to FIGS.
FIG. 9 is an explanatory diagram of an operation of moving the capillary 30 by moving the capillary 30 from the first bonding point to the second bonding point of the conventional wire bonding apparatus of FIG. According to FIG. 8, the chip 10 is mounted on the upper surface of the lead frame 11 on the bonding stage 33. Prior to performing wire bonding, the electrodes 12 and leads 13 of the chip 10 are imaged by the ITV camera 35. This video is converted into an electrical signal, and the image recognition unit 36 recognizes the image, detects the bonding position, and sends it to the control unit 37. The control unit 37 uses this positional information and the parameters of the movement locus of the capillary 30 preset in the control unit 37 to generate a control signal for moving the capillary 30 along a predetermined locus. In response to this control signal, the servo drive controller 38 moves the capillary 30 in a loop from the first bonding point to the second bonding point.
[0008]
In FIG. 8, a bonding ball 15 is formed at the tip of the capillary 30 at the tip of the wire 14.
Then, the capillary 30 is brought into contact with the electrode 12 of the chip 10 which is the first bonding point, and the hole 17 is bonded to the electrode 12 by pressure bonding. Thereafter, as shown in FIG. 9, the capillary 30 moves to the second bonding point of the lead 13 while forming a loop, and the wire 14 is pressed against the lead 13 to be joined. Thereby, the first bonding point and the second bonding point are connected by the wire 14. When the connection is completed, the capillary 30 rises and moves to the first bonding point and moves to the next bonding operation. While the capillary 30 is raised, the upper wire clamp 29 of the capillary 30 is closed, and the wire 14 is gripped and moved upward, whereby the wire 14 is cut at the second bonding point.
[0009]
[Problems to be solved by the invention]
However, the conventional technique has the following problems.
The first problem is that the bonding at the second bonding point is called a tail cut in which the wire is directly pressed against the lead of the second bonding point to be bonded, and then pulled upward to cut. This means that the bonding area is very small compared to the first bonding point and the bonding strength is weak. In addition, since the bonding area is small, good bonding cannot be performed unless the surface cleanliness and surface roughness of the lead are improved. As a result, bonding reliability is not improved.
[0010]
The second problem is that if the lead inclination at the second bonding point is large, the tip shape of the capillary does not match and bonding cannot be performed. In recent years, in addition to the lead frame lead, the second bonding point is often bonded to a chip size package (CSP), LED, transistor, diode, etc., and the inclination becomes large and various inclinations depending on the mounting state. ing. The allowable value of the lead inclination is related to the tip shape of the capillary, and in order to cope with various inclinations, a plurality of capillaries having tip shapes that match the inclination must be prepared.
[0011]
The third problem is that when the second bonding is performed on a bonding object having a weak surface structure such as a chip size package (CSP), the pressure for obtaining a sufficient bonding force is excessive for the CSP. In addition, the CSP may break down when the capillary directly touches the CSP. For this reason, the second bonding cannot be performed on a chip having a weak surface structure, and the bonding object is limited.
[0012]
In view of the above-mentioned problems of the prior art, an object of the present invention is to provide a bump to a second bonding point in advance in a wire bonding apparatus before performing a bonding operation for connecting the first bonding point and the second bonding point with a wire. Provided is a wire bonding apparatus in which a bonding area of a second bonding point is increased and good bonding is performed by controlling a control microcomputer so that a wire is connected to the bump ball in advance by bonding a ball. It is in. It is another object of the present invention to provide a wire bonding apparatus that can perform good bonding without limiting the tip shape of the capillary even when the inclination of the lead at the second bonding point is large. Furthermore, by performing the reverse bonding operation with the lead as the first bonding point and the chip electrode as the second bonding point, it can be destroyed without applying excessive pressure to a weak surface structure such as a CSP. There is no need to provide a safe wire bonding apparatus.
An object of the present invention is to provide a wire bonding apparatus capable of shortening a moving distance of a capillary and increasing a bonding speed by continuously forming and bonding bump balls to a plurality of second bonding points of leads or chip electrodes in advance. .
[0013]
[Means for Solving the Problems]
The present invention has the following means to achieve the above object.
1st invention has the capillary through which the wire which connects the electrode of a chip | tip and a lead is penetrated, the arm holding a capillary, the Z-axis motor and cam mechanism which rock | fluctuate this arm to an up-down Z-axis direction A Z-axis drive mechanism, an ITV camera that captures the top surface of the chip electrode and leads and converts the image into an electrical signal, and an X-axis motor that moves the arm and the ITV camera in a horizontal plane relative to the chip An X-axis movement table having a Y-axis motor, a Y-axis movement table having a Y-axis motor, a bonding stage on which a lead frame on which a chip is mounted is mounted, and an image recognition unit for recognizing a video signal from the ITV camera and obtaining position information The control microcomputer that controls the movement of the capillary according to the position information and the X-axis motor, the Y-axis motor, and the Z-axis motor are rotated. A wire bonding apparatus and a servo drive controller to the control microcomputer is characterized by having the means configuration follows.
(A) Bonding control means for connecting the first bonding point of the chip electrode and the second bonding point of the bump ball previously bonded to the lead by moving the capillary with a wire.
(B) Bump ball creation / joining control means for creating and joining a bump ball to the second bonding point of the lead
[0014]
According to a second aspect of the present invention, there is provided a control microcomputer according to the first aspect of the present invention in which a bump ball preliminarily bonded to a chip electrode by the bump ball creation / bonding control means described in the above (b) is used. As a second bonding point, a wire bonding apparatus is characterized in that reverse bonding control means for moving a capillary and connecting with a wire is added.
[0015]
According to a third aspect of the present invention, there is provided a plurality of bump ball creation / joining control means for continuously creating and joining bump balls to the plurality of leads or the plurality of electrodes of the chip as the second bonding points in the control microcomputer of the first invention. Is a wire bonding apparatus characterized in that
[0016]
According to a fourth aspect of the present invention, there is provided a wire bonding apparatus characterized by adding the following means to the control microcomputer of the first aspect of the invention.
(A) Reverse bonding control means for moving a capillary and connecting with a wire using a lead as a first bonding point and a bump ball previously bonded to an electrode of the chip as a second bonding point
(B) A plurality of bump ball creation / joining control means for continuously creating and joining a bump ball to a plurality of electrodes of a plurality of leads or chips as second bonding points.
[0017]
[Action]
According to the present invention, a bump ball is bonded to the second bonding point in advance before the bonding operation for connecting the first bonding point and the second bonding point with a wire in the wire bonding apparatus by each means configuration. Since the control microcomputer performs the control operation so as to connect the wire to the ball, the bonding area of the second bonding point is increased and good bonding can be performed. Further, since the bump ball is bonded to the lead at the second bonding point in advance and the wire is connected to the bump ball, the tip shape of the capillary is not limited even if the inclination of the lead is large, and good bonding can be performed.
According to the second aspect of the present invention, by performing a reverse bonding operation with the lead as the first bonding point and the chip electrode as the second bonding point, an excessive pressure is not applied to a weak surface structure such as a CSP. Safe bonding without breaking is possible.
According to the third aspect of the present invention, the bump ball is formed and bonded in advance to the plurality of leads or the plurality of electrodes of the chip as the second bonding points, so that the moving distance of the capillary can be shortened and the bonding speed can be increased. .
The fourth invention functions as all the above inventions.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
In an embodiment of the present invention, in the first invention, a capillary through which a wire connecting a chip electrode and a lead is inserted, an arm holding the capillary, and swinging this arm in the vertical Z-axis direction A Z-axis drive mechanism having a Z-axis motor and a cam mechanism; an ITV camera that captures an image of the top surface of the chip electrode and leads and converts the image into an electrical signal; and the arm and the ITV camera relative to the chip in a horizontal plane Recognize the video signal from the ITV camera, the X-axis movement table having the X-axis motor to be moved in and the Y-axis movement table having the Y-axis motor, the bonding stage on which the lead frame on which the chip is mounted is mounted. An image recognition unit for obtaining position information, a control microcomputer for controlling the movement of the capillary according to the position information, the X-axis motor, Y A wire bonding apparatus having a motor and a servo drive control unit for rotating a Z-axis motor, wherein a control microcomputer creates and joins a bump ball to a second bonding point of a lead, and a chip Bonding control means for connecting the first bonding point of the electrode and the second bonding point of the bump ball previously bonded to the lead with a wire by moving the capillary, the first bonding point and the second bonding point, Before performing the bonding operation of connecting the wires with the wire, the bump ball is bonded to the second bonding point in advance, and the control operation is performed so as to connect the wire to the bump ball. As a result, the bonding area at the second bonding point is large, the bonding strength is increased, and good bonding can be achieved. Also, by pre-bonding the bump ball to the lead at the second bonding point, even if the lead has a large inclination, it is not necessary to prepare various tip-shaped capillaries for various inclinations. Can be joined.
[0019]
In the second invention, reverse bonding control is performed in which the control microcomputer is connected to the first bonding point of the lead and the second bonding point of the bump ball previously bonded to the electrode of the chip with a wire by moving the capillary. By adding the means, the reverse bonding operation is performed with the lead as the first bonding point and the chip electrode as the second bonding point. As a result, it is possible to perform safe bonding without applying excessive pressure to those having a weak surface structure such as CSP.
[0020]
In a third aspect of the present invention, a plurality of bump ball creation / joining control means for continuously creating and joining bump balls to a plurality of leads or a plurality of electrodes of a chip as second bonding points is added to the control microcomputer. Thus, the moving distance of the capillary is shortened. Thereby, the bonding speed can be increased.
[0021]
In the fourth invention, all the embodiments of the first, second and third inventions are provided.
[0022]
【Example】
Hereinafter, embodiments of the wire bonding apparatus of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a block diagram showing the configuration of the embodiment of the first invention of the wire bonding apparatus of the present invention. In FIG. 1, an X-axis moving table 22 having an X-axis motor 21 and a Y-axis moving table 24 having a Y-axis motor 23 are installed on a base 20, and the X-axis motor 21 and the Y-axis motor 23 are installed. The table moves in the horizontal plane by the rotation of. A Z-axis drive mechanism 25 is installed on the Y-axis moving table 24, and the Z-axis drive mechanism 25 is rotatably supported on a holding block 27 by a support shaft 26. An arm 28 extends from the Z-axis drive mechanism 25, and a capillary 30 through which the wire 14 is inserted is held at the tip of the arm 28. The Z-axis drive mechanism 25 has a cam mechanism 31. The cam mechanism 31 is rotated by a Z-axis motor 32 to swing the arm 28 up and down. The upper portion of the capillary 30 has a wire clamp 29 that holds the wire 14. The wire clamp 29 is lifted while holding the wire 14, whereby the wire 14 is cut from the second bonding point.
[0023]
On the base 20, a bonding stage 33 for mounting the lead frame 11 on which the chip 10 as a bonding target is mounted is installed.
The chip 10 has an electrode 12, and the electrode 12 and the lead 13 are connected by a wire 14 by bonding. A holder 34 extends beside the Z-axis drive mechanism 25 on the Y-axis moving table 24, and an ITV camera 35 is fixed to the holder 34. The ITV camera 35 is movable in a horizontal plane with respect to the bonding portion, images the bonding portion, reads an image, and converts it into an electrical signal. The image recognition unit 36 recognizes the image signal read by the ITV camera 35 and outputs positioning information necessary for wire bonding to the control microcomputer 1.
[0024]
The control microcomputer 1 controls the movement of the capillary 30 based on this positioning information. The control microcomputer 1 has bump ball creation / bonding control means 2 and bonding control means 3. The bump ball creation / bonding control means 2 controls the bump ball to be bonded to the second bonding point in advance before performing the bonding operation for connecting the first bonding point and the second bonding point with a wire. The bonding control means 3 controls the first bonding point of the electrode 12 of the chip 10 and the second bonding point of the bump ball previously bonded to the lead 13 so that the capillary 30 is moved and connected by the wire 14.
[0025]
Next, the operation of the wire bonding apparatus of the present invention will be described with reference to FIGS.
According to FIG. 1, the chip 10 is mounted on the upper surface of the lead frame 11 on the bonding stage 33. Prior to performing wire bonding, the electrodes 12 and leads 13 of the chip 10 are imaged by the ITV camera 35. This video is converted into an electrical signal, and the image recognition unit 36 recognizes the image, detects the bonding position, and sends it to the control microcomputer 1. The control microcomputer 1 generates a control signal for moving the capillary 30 along a predetermined locus using the position information and the parameters of the movement locus of the capillary 30 preset in the control microcomputer 1. In response to this control signal, the servo drive controller 38 moves the capillary 30 in a loop from the first bonding point to the second bonding point.
[0026]
FIG. 2 is a diagram for explaining the operation of the bump ball creation / bonding control means 2 of the control microcomputer of the present invention. FIG. 2 (a) is a ball creation diagram, FIG. (C) shows a drawing drawing of a bump ball.
As shown in the ball creation diagram of FIG. 2A, the ball 15 is first sparked by the spark rod 39 at the tip of the wire 14 inserted into the capillary 30. Thereafter, the capillary 30 descends to the second bonding point of the lead 13. Next, as shown in the bump ball bonding diagram of FIG. 2B, the capillary 30 is lowered to the second bonding point of the lead 13 and the bump ball 16 is bonded. Next, when the bump ball 16 is bonded to the second bonding point as shown in FIG. 0 To P 1 Up to P 1 To P 2 Up to the horizontal direction and in the direction opposite to the direction of the first bonding point, P 2 To P 3 Down until P 3 To P 4 Until again In a direction away from the bump ball After moving in the horizontal direction and generating a crack in the wire 14, the wire clamp 29 clamps the wire 14 and pulls it up, whereby the wire 14 is cut and the bump ball 16 is created. P 0 To P 1 , P 2 , P 3 Via P 4 The parameter of the moving distance until is set to a value such that a crack is appropriately generated.
[0027]
FIG. 3 is a diagram for explaining the operation of the bonding control means of the control microcomputer of the present invention. FIG. 3 (a) is a ball creation diagram, FIG. 3 (b) is a first ball joint diagram, and FIG. ) Shows a bonding diagram. As shown in the ball creation diagram of FIG. 3A, the bump ball 16 is previously joined to the second bonding point by the bump ball creation / joining control means 2 described in FIG. First, the ball 15 is created at the tip of the wire 14 inserted into the capillary 30, and the capillary 30 descends to the first bonding point of the electrode 12 of the chip 10. Next, as shown in the ball creation diagram of FIG. 3B, the capillary 30 descends to the first bonding point of the electrode 12 of the chip 10 and the ball 15 is pressure-bonded to become the first ball 17. Next, as shown in the bonding diagram of FIG. 3C, the capillary 30 moves to form a loop to the second bonding point of the lead 13 and moves from the second bonding point of the bump ball 16 prepared in advance to L. 0 The wire 14 is joined to the bump ball 16 by descending to the point where it has passed too much. As a result, the first bonding point and the second bonding point are connected by the wire 14. L 0 The distance parameter is set to a value at which bonding is appropriately performed.
[0028]
Next, the configuration of the control microcomputer according to the embodiment of the second invention will be described in detail with reference to FIGS.
FIG. 4 is a block diagram for explaining the configuration of the control microcomputer of the embodiment of the second invention. FIG. 5 is a diagram for explaining the operation of the reverse bonding control means of the control microcomputer according to the embodiment of the second invention. FIG. 5 (a) shows a drawing of bump balls, and FIG. . The control microcomputer 4 according to the second embodiment of the present invention is the same as that of the control microcomputer 1 according to the first embodiment of the present invention. The reverse bonding control means 5 for connecting the second bonding point with the wire 14 by moving the capillary 30 is added. A reverse bonding operation can be performed in which the lead 13 is the first bonding point and the electrode 12 of the chip 10 is the second bonding point.
[0029]
Next, the operation of the control microcomputer of the second embodiment will be described in detail with reference to FIG.
As shown in FIG. 5 (a), a bump ball creation diagram, the lead 13 is used as the first bonding point and the electrode 12 of the chip 10 is used as the second bonding point. The bump ball 18 is created at the two bonding points by the bump ball creation / joining control means 2 as in the first invention. P of capillary 30 0 To P 1 , P 2 , P 3 , P 4 The operations up to are the same as in the first invention. Next, as shown in the bonding diagram of FIG. 5B, after the capillary 30 is lowered to the first bonding point of the lead 13 by the reverse bonding control means 5 and the first ball 19 is joined, the capillary 30 is attached to the chip 10. A loop is formed to move to the second bonding point of the electrode 12, and it is moved from the previously created second bonding point of the bump ball 18 to L 1 The wire 14 is joined to the bump ball 18 by descending to a point that has passed too much. As a result, the first bonding point and the second bonding point are connected by the wire 14. L 1 The distance parameter is set to a value at which bonding is appropriately performed.
[0030]
Next, the configuration of the control microcomputer according to the embodiment of the third invention will be described with reference to FIG.
FIG. 6 is a block diagram for explaining the configuration of the control microcomputer of the embodiment of the third invention. The control microcomputer 6 according to the third embodiment is preliminarily provided with bump balls on the second bonding points of the leads 13 or the electrodes 12 of the chip 10 in the control microcomputer 1 according to the first embodiment. By adding a plurality of bump ball creation / joining control means 7 for creating and joining continuously, the moving distance of the capillary 30 is shortened and the bonding speed can be increased.
[0031]
Next, the operation of the control microcomputer according to the embodiment of the third invention will be described.
In the control microcomputer 6 according to the third embodiment of the present invention, a bump ball is created and joined in advance to a plurality of second bonding points of a lead or chip electrode by a plurality of bump ball creation and joining control means 7 in advance. Thereafter, the bonding control means 3 performs the bonding operation in the same manner as in the first invention.
[0032]
Next, the configuration of the control microcomputer according to the fourth embodiment will be described with reference to FIG.
FIG. 7 is a block diagram for explaining the configuration of a control microcomputer according to an embodiment of the fourth invention. The control microcomputer 8 of the fourth embodiment of the present invention is the same as that of the control microcomputer 1 of the first invention of the bump ball previously bonded to the first bonding point of the lead 13 and the electrode 12 of the chip 10. The reverse bonding control means 5 for connecting the second bonding point with the wire 29 by moving the capillary 30 and the bump ball are formed and joined in advance to the second bonding points at a plurality of positions of the lead 13 or the electrode 12 of the chip 10 in advance. And a plurality of bump ball creation / joining control means 7 are added.
[0033]
Next, the operation of the control microcomputer according to the fourth embodiment will be described.
The control microcomputer 8 of the embodiment of the fourth invention is the same as the control microcomputer 1 of the embodiment of the first invention except that the reverse bonding control means 5 of the second invention and the production of a plurality of bump balls of the third invention. A joining control means 7 is added, and the operation is also a combination of both.
[0034]
【The invention's effect】
As described above, the wire bonding apparatus of the present invention has the following effects.
The first effect of the first invention is that a bump ball is bonded to the second bonding point in advance before the bonding operation for connecting the first bonding point and the second bonding point with a wire. Since the control microcomputer performs the control operation so as to connect the wires to each other, the bonding area at the second bonding point is increased and the bonding strength is increased. In addition, good bonding can be achieved with little influence of the surface cleanliness and surface roughness of the leads. As a result, the bonding accuracy can be increased.
[0035]
The second effect of the first invention is that the bump microcomputer is previously bonded to the lead of the second bonding point, and the control microcomputer performs the control operation so as to connect the wire to the lead. Even if the lead inclination at the two bonding points is large, it is not necessary to select the tip shape of the capillary that matches the lead inclination, and the tip shape of the capillary is not limited and good bonding can be achieved. As a result, the bonding accuracy can be increased.
[0036]
The effect of the second invention is that when a short wire is bonded, the surface structure of the chip is achieved by performing a reverse bonding operation using the lead as the first bonding point and the chip electrode as the second bonding point. For weak materials, the tip of the capillary does not come into contact with the chip, and the bump ball acts as a buffer so that safe bonding can be performed without applying excessive pressure.
[0037]
The effect of the third invention is that the bump ball is moved and moved at a short time by increasing the bonding speed by continuously forming and bonding the bump ball to the second bonding points at a plurality of positions of the lead or chip electrode.
[0038]
The effects of the fourth invention have all the effects of the first invention, the effects of the second invention, and the effects of the third invention.
[Brief description of the drawings]
FIG. 1 is a block diagram showing the configuration of an embodiment of a first invention of a wire bonding apparatus of the present invention.
FIG. 2 is an operation explanatory view of a bump ball creation / joining control means of the control microcomputer of the present invention.
FIG. 3 is an explanatory diagram of the operation of the bonding control means of the control microcomputer of the present invention.
FIG. 4 is a block diagram for explaining a configuration of a control microcomputer according to an embodiment of the second invention.
FIG. 5 is an explanatory diagram of the operation of the reverse bonding control means of the control microcomputer of the embodiment of the second invention.
FIG. 6 is a block diagram for explaining a configuration of a control microcomputer according to an embodiment of the third invention.
FIG. 7 is a block diagram for explaining the configuration of a control microcomputer according to an embodiment of the fourth invention.
FIG. 8 is a block diagram showing an example of the configuration of a conventional wire bonding apparatus.
9 is an explanatory diagram of an operation of moving a capillary by moving a capillary from a first bonding point to a second bonding point in the conventional wire bonding apparatus of FIG.
[Explanation of symbols]
1,4,6,8 Control microcomputer
2 Bump ball creation / joining control means
3 Bonding control means
5 Reverse bonding control means
7 Multiple bump ball creation / joining control means
10 chips
11 Lead frame
12 electrodes
13 Lead
14 wires
15 balls
16 Bump ball
17 First ball
18 Bump ball
19 First ball
20 base
21 X-axis motor
22 X-axis moving table
23 Y-axis motor
24 Y-axis moving table
25 Z-axis drive mechanism
26 Spindle
27 Holding block
28 arms
29 Wire clamp
30 Capillary
31 Cam mechanism
32 Z-axis motor
33 Bonding stage
34 Holder
35 ITV Camera
36 Image recognition unit
37 Control unit
38 Servo drive controller
39 Spark Rod

Claims (2)

チップの電極とリードとを接続するワイヤが挿通されるキャピラリと、キャピラリを保持するアームと、このアームを上下のＺ軸方向に揺動させるＺ軸モータとカム機構を有するＺ軸駆動機構と、チップの電極とリードの上面を撮像し映像を電気信号に変換するＩＴＶカメラと、前記アームと前記ＩＴＶカメラをチップに対して相対的に水平面内に移動させるＸ軸モータを有するＸ軸移動テーブルおよびＹ軸モータを有するＹ軸移動テーブルと、チップが搭載されたリードフレームを搭載するボンディングステージと、前記ＩＴＶカメラからの映像信号を画像認識し位置情報を得る画像認識部と、この位置情報によりキャピラリの動きを制御する制御用マイクロコンピュータと、前記Ｘ軸モータ，Ｙ軸モータ，Ｚ軸モータを回転させるサーボ駆動制御部とを有するワイヤボンディング装置において、前記制御用マイクロコンピュータが、次の各構成を有することを特徴とするワイヤボンディング装置。
（イ）第２ボンディング点とするチップの複数の電極にバンプボールを連続して作成接合する複数バンプボール作成接合制御手段
（ロ）リードを第１ボンディング点とし、（イ）の複数バンプボール作成接合制御手段により予めチップの電極に接合されたバンプボールを第２ボンディング点として、キャピラリを移動してワイヤで接続する逆ボンディング制御手段 A capillary through which a wire connecting a chip electrode and a lead is inserted, an arm holding the capillary, a Z-axis drive mechanism having a Z-axis motor and a cam mechanism for swinging the arm in the vertical Z-axis direction, An ITV camera that images the top surface of the chip electrode and leads and converts an image into an electrical signal; an X-axis moving table having an X-axis motor that moves the arm and the ITV camera in a horizontal plane relative to the chip; A Y-axis moving table having a Y-axis motor, a bonding stage on which a lead frame on which a chip is mounted is mounted, an image recognizing unit for recognizing a video signal from the ITV camera to obtain position information, and a capillary using the position information Microcomputer for controlling the movement of the motor and servo for rotating the X-axis motor, Y-axis motor and Z-axis motor In the wire bonding apparatus and a dynamic controller, said control microcomputer, a wire bonding apparatus characterized by having each of the following configurations.
(A) Multiple bump ball creation / joining control means for continuously creating and joining bump balls to a plurality of electrodes of the chip as the second bonding point (b) Using the lead as the first bonding point, (b) creating multiple bump balls Reverse bonding control means for moving a capillary and connecting with a wire using a bump ball previously bonded to a chip electrode by a bonding control means as a second bonding point 複数バンプボール作成接合制御手段が、バンプボールをチップの電極の第２ボンディング点に作成接合した後、キャピラリが第２ボンディング点から上昇し，次に水平方向に移動し，次に下降し，最後に再びバンプボールから離れる向きで水平方向に移動してワイヤにクラックをつくり切断する制御動作を行うことを特徴とする請求項１記載のワイヤボンディング装置。 After the bump ball creation / joining control means creates and joins the bump ball to the second bonding point of the chip electrode, the capillary rises from the second bonding point, then moves horizontally, then descends, and finally 2. The wire bonding apparatus according to claim 1, wherein a control operation is performed in which the wire is cracked and cut by moving horizontally in a direction away from the bump ball .
JP22665498A 1998-08-11 1998-08-11 Wire bonding equipment Expired - Fee Related JP3644575B2 (en)

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