JP3640268B2

JP3640268B2 - Connector and connector manufacturing method

Info

Publication number: JP3640268B2
Application number: JP28685295A
Authority: JP
Inventors: 龍前田; 光司小野
Original assignee: Whitaker LLC
Current assignee: Whitaker LLC
Priority date: 1995-10-06
Filing date: 1995-10-06
Publication date: 2005-04-20
Anticipated expiration: 2015-10-06
Also published as: JPH09115577A

Description

【０００１】
【発明の属する技術分野】
本発明は、ＢＧＡ、ＬＧＡのような、面内に多数の電極が形成された半導体パッケ−ジ用のコネクタ及びその製造方法に関する。
【０００２】
【従来の技術】
パ−ソナルコンピュ−タやワ−クステ−ションに用いられるマイクロプロセッサやＡＳＩＣ（ＡｐｐｌｉｃａｔｉｏｎＳｐｅｃｉｆｉｃＩｎｔｅｇｒａｔｅｄＣｉｒｃｕｉｔ）に、多ピンのＢＧＡやＬＧＡのパッケ−ジが使用されている。特に近年ＢＧＡパッケ−ジの使用が注目されており、半田による表面実装の他に、これらを取り外しできるコネクタが必要とされている。
従来はＰＧＡパッケ−ジが主流であり、コネクタとしてピン挿入型のＰＧＡ用コネクタが主に用いられていた。しかしながらＰＧＡパッケ−ジは比較的外形寸法が大きくなる点、多極高密度配置を要求するときピン径が小さくなりピンの成形加工やピンの変形等の問題を生じる点等の問題点があった。更にそのコネクタは大きな挿抜荷重に対して耐えうるよう、又は零挿入力型に設計される必要があり、コネクタ設計が難しい、又は経済的に不利である等の問題があった。
主に以上の理由からＰＧＡパッケ−ジからピンを除去し面内に電極パッドだけを残すＬＧＡパッケ−ジが使用される。また、近年ＱＦＰ（ＱｕａｄＦｌａｔＰａｃｋｅａｇｅ）やＴＣＰ（ＴａｐｅＣａｒｒｉｅｒＰａｃｋａｇｅ）等の多ピンパッケ−ジの代替としてＢＧＡパッケ−ジが使用される。ＢＧＡはＬＧＡのランドの位置にバンプ状半田ボ−ルを形成したものである。ＢＧＡパッケ−ジを有する素子はプリント基板上の所定の位置に配置後半田リフロ−され、これにより半田ボ−ルを溶融させ基板側のランドと半田接合されることにより、プリント基板上に実装可能である。
【０００３】
【発明が解決しようとする課題】
しかしながら従来は、ＬＧＡ、ＢＧＡパッケ−ジに好適なプリント基板に取り付け取り外し可能な比較的低コストのコネクタが無かった。上述の如き半田接合による取り付けでは取り外しが不可能になる。上記パッケ−ジを有する半導体素子が取り付け取り外し可能であることは試作段階や初期販売段階でのＣＰＵの試験的実装、或いは新型半導体素子への交換等に必要とされる。
【０００４】
従って、本発明の目的は，ＬＧＡ、ＢＧＡパッケ−ジを有する半導体素子等を取り外し可能にしてプリント基板に取り付け両者間を電気的に接続させる小型で比較的安価なコネクタ及びその製造方法を提供することである。
【０００５】
【課題を解決するための手段】
本発明のコネクタは、複数の貫通孔が形成された絶縁性シートと、前記貫通孔の内側面上に位置し前記絶縁性シートの両面を電気的に導通する導電層と、前記貫通孔内に充填された弾性樹脂と、該弾性樹脂面上に配置され前記導電層と電気的に導通する金属バンプとを有することを特徴とする。
【０００６】
本発明のコネクタは、ＬＧＡ、ＢＧＡ等のパッケ−ジを具える半導体素子をプリント基板に接続させる。本発明のコネクタは多数の導電ランドを両面に有する絶縁性シ−トと、導電ランド位置に形成されたスル−ホ−ル（貫通孔）の内面に沿って位置し上下面のランド間を導電接続する導電層と、スル−ホ−ル内に充填されたエラストマ−と、エラストマ−の上下表面に位置する金属バンプとを有する。金属バンプは半球形または球形に形成され、その径はスル−ホ−ル径よりも小径に形成される。
【０００７】
更に本発明のコネクタ製造方法は絶縁性シートの所定位置に貫通孔を形成する工程と該貫通孔の内側面に沿って導電層を形成する工程と、前記貫通孔内に弾性樹脂を充填する工程と、該弾性樹脂の上下面に前記導電層と電気的に導通する金属バンプを配置する工程を含む。
【０００８】
本発明のコネクタの製造方法の第１工程では、絶縁性シ−トの両面の所望の対向位置に導電ランドが形成され、この導電ランド位置に孔開け加工しスル−ホ−ルを形成する。第２の工程ではスル−ホ−ル内面にめっき等の方法により導電層を膜状に形成する。第３の工程ではスル−ホ−ル内に適量のエラストマ−を充填し、第４の工程ではエラストマ−上に導電性接着剤を介して金属バンプを配置する。
【０００９】
【発明の実施の形態】
以下に、添付図面を参照して本発明のコネクタ及びコネクタ製造方法の好適となる実施形態を説明する。
【００１０】
本発明のコネクタは、ポリイミド、ポリエステル、ガラスエポキシ、紙フェノ−ル、セラミックス、テフロン、シリコン樹脂等の様々なシ−ト状樹脂からなる絶縁性シート１が使用される。この絶縁性シ−ト１の両面にはＬＧＡのパッド位置及びプリント基板パッド位置と相対する背中合わせの位置に導電ランドを形成する。一例として導電ランドは絶縁性のシ−トの両面に銅の層を配置し、この銅層をエッチングして形成する。次に銅製の導電ランド位置にはランド寸法より小さい径の孔を孔開け加工しスル−ホ−ル２（貫通孔）を形成する（図１参照）。孔開け加工の方法は、ドリル加工、ケミカルエッチング、プレス打ち抜き、レ−ザ−加工等のいずれの方法でも構わない。
【００１１】
次に、スル−ホ−ル２の内面にスル−ホ−ルめっきを行い導電層３を形成する（図２参照）。導電層３は絶縁シ−ト１の両面に位置する導電ランド５間を導電接続する。スル−ホ−ルめっきの代わりに導電性樹脂をスル−ホ−ル内に注入し内面に加熱硬化させる方法もある。
【００１２】
更に図３の如く、スル−ホ−ル２内にエラストマ−等の弾性を有する樹脂６が充填され、加熱等の方法で硬化される。樹脂は好ましくはシリコ−ン樹脂を主成分とするものを使用する。樹脂は導電性であるか非導電性であるかを問わないが、好ましくは導電性のもの、例えばシリコ−ン樹脂中にＡｇ（銀）等の金属粒子又は樹脂表面を金属コ−ティングした導電性の粒子を分散させたものを使用する。
【００１３】
スル−ホ−ル２内に完全に樹脂が充填された後、絶縁性シ−ト１の表面を研磨し、両面側の導電ランド５及び／またはシリコ−ン弾性樹脂６の表面にシリコ−ン系導電性接着材７を塗布し、更にその後導電性接着剤７上に図４乃至図８の如く金属バンプ８を配置する。図４及び図６に示す実施形態によれば金属バンプ８が導電層３と直接接触し、一方図５、図７及び図８に示す実施形態では金属バンプ８と導電層３は導電性接着剤７を介して間接的に導通される。
【００１４】
半球形又は球形の金属バンプ８は所定の形状の銅やニッケルの表面に金めっきしたものを用いる。これらは径を揃えたものであることが好ましい。特に金属バンプ８を半田ボ−ルにしたり、半田或いは錫めっきした金属半球または金属球より形成することにより表面実装型のコネクタとしても使用可能である。
【００１５】
加えて本発明によれば図８に示す実施形態の如く、一側で弾性樹脂上に金属バンプ８が配置され逆側で導電ランド５上に半田バンプ９が形成される。この場合、下側の半田バンプ９が形成された側は基板等のパッドに位置合わせされ、半田付け接続される。
【００１６】
上述した如く絶縁シート１の一面に金属バンプ８を形成した本発明のコネクタは略枠状のハウジング（図示せず）内に配置されコネクタ組立体（図示せず）を形成し得る。接続時には例えばプリント基板上の所望の位置に上述のコネクタを収容した略枠状のハウジングを配置し、その頂側にＬＧＡ、ＢＧＡ等のパッケ−ジの半導体素子を配置し、この半導体素子の頂側より半導体素子を押圧する。これにより半導体素子の端子（パッド）がコネクタの一側の金属バンプ８と接触する。またこの金属バンプと背中合わせに配置された他方の金属バンプがプリント基板のパッドと接続され得る。この時金属バンプは弾性樹脂に埋まるよう移動する。
【００１７】
半導体素子やプリント基板のパッドの平面度は完全ではなく一般には１０ｍｍ角の寸法に対して約０．１ｍｍ程度の凹凸があるが、本発明のコネクタは弾性樹脂６を具えており、この凹凸を十分補償可能である。加えて接続抵抗値は金属バンプ８先端での優れた接触抵抗とスルーホールめっきにより十分小さな値となる。
【００１８】
【実施例１】
２７ｍｍ角で厚さ０．８ｍｍのガラスエポキシ基板の両面に１．５ｍｍピッチで直径１．３ｍｍ，縦１５個、横１５個合計２２５個の銅パッド（導電ランド）を基板両面の相対位置に形成した。各パッドの略中心に直径１．１ｍｍのスルーホールを形成した後スルーホールめっきし上下の銅パッドを導電接続させた。さらに上下面のパッド表面に金めっきを施した。市販の２液混合付加反応型シリコーン樹脂に２０重量％のシリカ粉を混合したぺーストを上記のスルーホールに充填し１００℃で加熱硬化させた。シリコーン樹脂系の導電接着剤を樹脂及びパッド上に塗布し、金めっきした直径０．９ｍｍの銅金属半球をスルーホールの略中央のエラストマー部分に接着させた。
【００１９】
本コネクタ部材の１電極について上下から金めっき板で挟んで特性を調べたところ、接圧１０グラムで金属半球によるバンプの変位は上下で約０．２ｍｍ，４端子法での接触抵抗は１８ｍｍ・Ωであった。
２２５個のコンタクト、即ち接触部を有するコネクタをハウジングに入れ、２７ｍｍ角のＬＧＡをこの上に乗せて実装し電気的試験をした。２２５個の接続抵抗値は全て３５ｍｍ・Ω以下となり高温試験後の抵抗変化はプラス１０％以下であった。
【００２０】
【実施例２】
２７ｍｍ角で厚さ０．８ｍｍのガラスエポキシ基板の両面に１．５ｍｍピッチで直径１．３ｍｍ．縦１５個、横１５個合計２２５個の銅パッドを基板両面の相対位置に形成した。角パッドの略中心に直径１．１ｍｍのスルーホールを孔開け加工し、スルーホールめっきし上下の電極パッドを導電接続させた。さらに上下の銅パッド表面に金メッキを施した。
付加反応型シリコーン樹脂９０重量％に平均粒径１００μｍの金めっき銅粉を１０重量％混合したものをスルーホールに充填し１００℃で加熱硬化させた。直径０．９ｍｍの銅金属球に金めっきを施し、シリコーン樹脂系の導電性接着材を金パッド全体に塗布した後スルーホール中央部のエラストマー部に接着させた。
【００２１】
本コネクター部材の１電極について、上下から金めっき板で挟み、上下からの接圧と接触抵抗の相関を求めたところ、接圧１０グラムでのバンプ変位は上下合計で０．２ｍｍ，４端子法での接触抵抗は５ｍｍ・Ωであった。
２２５個のコンタクトを有する本部材をハウジングに入れ、２７ｍｍ角のＬＧＡをこの上に載せて実装し電気的試験をした。２２５個の端子の接続抵抗は全て１５ｍｍ・Ω以下にあり、高温高湿試験後の抵抗変化はプラス１５％以下であった。
【００２２】
【実施例３】
２７ｍｍ角で厚さ１．０ｍｍのガラスエキポシ基板の両面に１．５ｍｍピッチで直径１．３ｍｍ，縦１５個、横１５個合計２２５個の銅パッドを基板両面の相対位置に形成した。基板の下面の角パッド中心に直径０．３ｍｍ、深さ０．３ｍｍのスルーホール孔開け加工し、スルーホールめっきし上下のパッドを導電接続させた。さらに上下面のパッド表面に金めっきを施した。市販の２液混合付加反応型シリコーン樹脂を上記のスルーホールに充填し１００℃で加熱硬化させた。直径０．９ｍｍの銅金属球に金めっきを施し、シリコーン樹脂形の導電性接着材を上面の金パッド全体に塗布した後ランド中央部のエラストマー部に接着させた。一方下面のパッドには直径１．２ｍｍの球状半田ボールを半田接続させた。
【００２３】
本コネクター部材の１電極について、下面はプリント基板と半田接合し上面の金属球に平板プローブを当てプローブにかかる荷重と接触抵抗の関係を求めたところ、接圧１０グラムでのバンプ変位は０．１２ｍｍ、４端子法での接触抵抗は４ｍｍ・Ωであった。
２２５個のコンタクトを有する本部材をハウジングに入れ、２７ｍｍ角のＬＧＡをこの上に乗せて実装し電気的試験をした。２２５個の端子の接続抵抗は全て２８ｍｍ・Ω以下にあり、高温高湿試験後の抵抗変化はプラス８％以下であった。
【００２４】
【発明の効果】
本発明のコネクタによればＬＧＡ、ＢＧＡ等のパッケージを有する多極の半導体素子を、プリント基板等に対して取り外し可能にして容易に接続可能となる。更に本発明のコネクタは比較的簡単な構造でその製造方法によれば製造も容易であり経済的効果も高い。
【図面の簡単な説明】
【図１】本発明のコネクタの製造方法の第１の工程を示す断面図。
【図２】本発明のコネクタの製造方法の第２の工程を示す図１類似の断面図。
【図３】本発明のコネクタの製造方法の第３の工程を示す図１類似の断面図。
【図４】本発明のコネクタの第１の好適実施形態を示す断面図。
【図５】本発明のコネクタの第２の好適実施形態を示す断面図。
【図６】本発明のコネクタの第３の好適実施形態を示す断面図。
【図７】本発明のコネクタの第４の好適実施形態を示す断面図。
【図８】本発明のコネクタの第５の好適実施形態を示す断面図。
【符号の説明】
１・・・・絶縁性シート
２・・・・貫通孔（スルーホール）
３・・・・導電層
６・・・・弾性樹脂
８・・・・金属バンプ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a connector for a semiconductor package, such as BGA and LGA, in which a large number of electrodes are formed in a plane, and a method for manufacturing the same.
[0002]
[Prior art]
Multi-pin BGA and LGA packages are used in microprocessors and ASICs (Application Specific Integrated Circuits) used in personal computers and workstations. In particular, the use of BGA packages has attracted attention in recent years, and in addition to surface mounting by solder, a connector that can be removed is required.
Conventionally, PGA packages have been mainstream, and pin insertion type PGA connectors have been mainly used as connectors. However, the PGA package has problems such as a relatively large external dimension and a problem that a pin diameter becomes small when a multi-pole high-density arrangement is required, resulting in problems such as pin forming and pin deformation. . Further, the connector needs to be designed to withstand a large insertion / extraction load, or to be designed to have a zero insertion force type, which causes problems such as difficulty in connector design or economical disadvantages.
For the above reasons, an LGA package is used which removes pins from the PGA package and leaves only electrode pads in the surface. In recent years, BGA packages have been used as an alternative to multi-pin packages such as QFP (Quad Flat Package) and TCP (Tape Carrier Package). BGA is a bump-shaped solder ball formed at the position of a land of LGA. A device with a BGA package can be mounted on a printed circuit board by solder reflow after it is placed at a predetermined position on the printed circuit board, thereby melting the solder ball and soldering it to the land on the board side. It is.
[0003]
[Problems to be solved by the invention]
However, conventionally, there has been no relatively low-cost connector that can be attached to and detached from a printed circuit board suitable for LGA and BGA packages. Demounting is impossible with the attachment by soldering as described above. The fact that the semiconductor element having the package can be attached and detached is necessary for trial mounting of the CPU at the trial production stage and the initial sales stage, or replacement with a new type semiconductor element.
[0004]
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a small and relatively inexpensive connector in which a semiconductor element or the like having an LGA or BGA package can be removed and attached to a printed circuit board and electrically connected to each other, and a method for manufacturing the same. That is.
[0005]
[Means for Solving the Problems]
Connector of the present invention includes a plurality of through holes are formed insulating sheet, and a conductive layer electrically connected to both surfaces of the insulating sheet positioned on the inner surface of the through hole, the through hole and it filled elastic resin, and having a metal bump disposed on the elastic resin surface conducting to the conducting layers and electrically.
[0006]
The connector of the present invention connects a semiconductor element having a package such as LGA or BGA to a printed board. The connector of the present invention has an insulating sheet having a large number of conductive lands on both sides, and is located along the inner surface of a through hole (through hole) formed at the position of the conductive lands. It has a conductive layer to be connected, an elastomer filled in the through hole, and metal bumps located on the upper and lower surfaces of the elastomer. The metal bump is formed in a hemispherical shape or a spherical shape, and has a diameter smaller than the through hole diameter.
[0007]
Furthermore, the connector manufacturing method of the present invention includes a step of forming a through hole at a predetermined position of the insulating sheet, a step of forming a conductive layer along the inner surface of the through hole, and a step of filling the through hole with an elastic resin. And a step of disposing metal bumps electrically connected to the conductive layer on the upper and lower surfaces of the elastic resin.
[0008]
In the first step of the connector manufacturing method according to the present invention, conductive lands are formed at desired opposing positions on both surfaces of the insulating sheet, and holes are formed at the positions of the conductive lands to form through holes. In the second step, a conductive layer is formed in a film shape on the inner surface of the through hole by a method such as plating. In the third step, an appropriate amount of elastomer is filled in the through hole, and in the fourth step, metal bumps are disposed on the elastomer via a conductive adhesive.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of a connector and a connector manufacturing method of the present invention will be described with reference to the accompanying drawings.
[0010]
The connector of the present invention uses an insulating sheet 1 made of various sheet-like resins such as polyimide, polyester, glass epoxy, paper phenol, ceramics, Teflon, and silicon resin. Conductive lands are formed on both sides of the insulating sheet 1 in back-to-back positions opposite to the LGA pad position and the printed circuit board pad position. As an example, the conductive land is formed by disposing a copper layer on both sides of an insulating sheet and etching the copper layer. Next, a hole having a diameter smaller than the land size is drilled at the copper conductive land position to form a through hole 2 (through hole) (see FIG. 1). The drilling method may be any method such as drilling, chemical etching, press punching, laser processing, or the like.
[0011]
Next, through hole plating is performed on the inner surface of the through hole 2 to form the conductive layer 3 (see FIG. 2). Conductive layer 3 conducts conductive connection between conductive lands 5 located on both sides of insulating sheet 1. There is also a method of injecting a conductive resin into the through hole instead of through hole plating and heating and curing the inner surface.
[0012]
Further, as shown in FIG. 3, an elastic resin 6 such as an elastomer is filled in the through hole 2, and is cured by a method such as heating. The resin is preferably a resin mainly composed of a silicone resin. Regardless of whether the resin is conductive or non-conductive, it is preferably conductive, for example, a conductive resin obtained by metal coating of metal particles such as Ag (silver) or a resin surface in a silicone resin. The one in which the nature particles are dispersed is used.
[0013]
After the through hole 2 is completely filled with the resin, the surface of the insulating sheet 1 is polished, and the surface of the conductive land 5 and / or the silicon elastic resin 6 on both sides is polished. A system conductive adhesive 7 is applied, and then metal bumps 8 are disposed on the conductive adhesive 7 as shown in FIGS. According to the embodiment shown in FIGS. 4 and 6, the metal bumps 8 are in direct contact with the conductive layer 3, whereas in the embodiments shown in FIGS. 5, 7, and 8, the metal bumps 8 and the conductive layer 3 are conductive adhesives. Conducted indirectly through 7.
[0014]
As the hemispherical or spherical metal bump 8, a surface of copper or nickel having a predetermined shape is gold-plated. These preferably have a uniform diameter. In particular, the metal bump 8 can be used as a surface mount type connector by forming it as a solder ball, or forming it from a solder or tin-plated metal hemisphere or metal ball.
[0015]
In addition, according to the present invention, as in the embodiment shown in FIG. 8, the metal bumps 8 are arranged on the elastic resin on one side and the solder bumps 9 are formed on the conductive lands 5 on the opposite side. In this case, the side on which the lower solder bump 9 is formed is aligned with a pad such as a substrate and soldered and connected.
[0016]
As described above, the connector of the present invention in which the metal bumps 8 are formed on one surface of the insulating sheet 1 can be arranged in a substantially frame-like housing (not shown) to form a connector assembly (not shown). At the time of connection, for example, a substantially frame-shaped housing that accommodates the above-described connector is disposed at a desired position on a printed circuit board, and a package semiconductor element such as LGA or BGA is disposed on the top side of the housing. The semiconductor element is pressed from the side. Thereby, the terminal (pad) of the semiconductor element comes into contact with the metal bump 8 on one side of the connector. The other metal bump arranged back to back with this metal bump can be connected to the pad of the printed circuit board. At this time, the metal bump moves so as to be buried in the elastic resin.
[0017]
The flatness of the pads of the semiconductor element and the printed circuit board is not perfect and generally has an unevenness of about 0.1 mm with respect to a size of 10 mm square, but the connector of the present invention includes the elastic resin 6, and this unevenness is It can be fully compensated. In addition, the connection resistance value is sufficiently small due to excellent contact resistance at the tip of the metal bump 8 and through-hole plating.
[0018]
[Example 1]
A copper pad (conductive land) of a total of 225 copper pads (conductive lands) of 1.5 mm in diameter and 15 in length and 15 in width is formed on both sides of a glass epoxy board of 27 mm square and 0.8 mm in thickness at a relative position on both sides of the board. did. A through hole having a diameter of 1.1 mm was formed at the approximate center of each pad, and then through hole plating was conducted to electrically connect the upper and lower copper pads. Further, gold plating was applied to the upper and lower pad surfaces. A paste in which 20% by weight of silica powder was mixed with a commercially available two-component mixed addition reaction type silicone resin was filled in the above-mentioned through-holes and cured by heating at 100 ° C. A silicone resin-based conductive adhesive was applied onto the resin and the pad, and a gold-plated copper metal hemisphere with a diameter of 0.9 mm was adhered to the elastomer portion at the approximate center of the through hole.
[0019]
When the characteristics of one electrode of this connector member were sandwiched from above and below by a gold-plated plate, the displacement of the bump due to the metal hemisphere was about 0.2 mm at the top and bottom at a contact pressure of 10 grams, and the contact resistance by the 4-terminal method was 18 mm. Ω.
A connector having 225 contacts, i.e., contact portions, was placed in a housing, and a 27 mm square LGA was mounted thereon and mounted for electrical testing. The connection resistance values of 225 pieces were all 35 mm · Ω or less, and the resistance change after the high temperature test was plus 10% or less.
[0020]
[Example 2]
A diameter of 1.3 mm at a pitch of 1.5 mm on both sides of a 27 mm square and 0.8 mm thick glass epoxy substrate. A total of 225 copper pads, 15 in length and 15 in width, were formed at relative positions on both sides of the substrate. A through hole having a diameter of 1.1 mm was drilled at the approximate center of the square pad, plated through the hole, and the upper and lower electrode pads were conductively connected. Furthermore, the upper and lower copper pads were plated with gold.
A mixture of 90% by weight of addition-reactive silicone resin and 10% by weight of gold-plated copper powder having an average particle size of 100 μm was filled into a through hole and cured by heating at 100 ° C. A copper metal ball having a diameter of 0.9 mm was plated with gold, and a silicone resin conductive adhesive was applied to the entire gold pad, and then adhered to the elastomer part at the center of the through hole.
[0021]
One electrode of this connector member was sandwiched from above and below by a gold-plated plate, and the correlation between the contact pressure from above and below and the contact resistance was determined. The contact resistance was 5 mm · Ω.
This member having 225 contacts was put in a housing, and a 27 mm square LGA was mounted thereon and mounted for electrical testing. The connection resistance of all 225 terminals was 15 mm · Ω or less, and the resistance change after the high-temperature and high-humidity test was plus 15% or less.
[0022]
[Example 3]
A total of 225 copper pads having a diameter of 1.3 mm, a length of 15 pieces, and a width of 15 pieces of 225 copper pads were formed on both surfaces of a 27 mm square and 1.0 mm thick glass epoxy substrate at a pitch of 1.5 mm. A through-hole with a diameter of 0.3 mm and a depth of 0.3 mm was drilled in the center of the corner pad on the lower surface of the substrate, and through-hole plating was performed to electrically connect the upper and lower pads. Further, gold plating was applied to the upper and lower pad surfaces. A commercially available two-component mixed addition reaction type silicone resin was filled into the above-mentioned through-holes and cured by heating at 100 ° C. A copper metal sphere having a diameter of 0.9 mm was plated with gold, and a silicone resin-type conductive adhesive was applied to the entire gold pad on the upper surface, and then adhered to the elastomer portion at the center of the land. On the other hand, a spherical solder ball having a diameter of 1.2 mm was soldered to the pad on the lower surface.
[0023]
For one electrode of this connector member, the lower surface was soldered to the printed circuit board, a flat probe was applied to the upper metal ball, and the relationship between the load applied to the probe and the contact resistance was determined. The contact resistance in the 12 mm, 4-terminal method was 4 mm · Ω.
This member having 225 contacts was placed in a housing, and a 27 mm square LGA was mounted thereon and mounted for electrical testing. The connection resistance of all 225 terminals was 28 mm · Ω or less, and the resistance change after the high temperature and high humidity test was 8% or less.
[0024]
【The invention's effect】
According to the connector of the present invention, a multipolar semiconductor element having a package such as LGA or BGA can be easily connected to a printed circuit board or the like by being removable. Furthermore, the connector of the present invention has a relatively simple structure, and is easy to manufacture according to the manufacturing method, and has a high economic effect.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a first step of a connector manufacturing method according to the present invention.
FIG. 2 is a cross-sectional view similar to FIG. 1, showing a second step in the method for manufacturing a connector of the present invention.
FIG. 3 is a cross-sectional view similar to FIG. 1, showing a third step in the method of manufacturing a connector of the present invention.
FIG. 4 is a sectional view showing a first preferred embodiment of the connector of the present invention.
FIG. 5 is a cross-sectional view showing a second preferred embodiment of the connector of the present invention.
FIG. 6 is a sectional view showing a third preferred embodiment of the connector of the present invention.
FIG. 7 is a sectional view showing a fourth preferred embodiment of the connector of the present invention.
FIG. 8 is a sectional view showing a fifth preferred embodiment of the connector of the present invention.
[Explanation of symbols]
1 .... Insulating sheet 2 .... Through hole (through hole)
3 .... conductive layer 6 ... elastic resin 8 ... metal bump

Claims

複数の貫通孔が形成された絶縁性シートと、
前記貫通孔の内側面上に位置し前記絶縁性シートの両面を電気的に導通する導電層と、
前記貫通孔内に充填された弾性樹脂と、
該弾性樹脂面上に配置され前記導電層と電気的に導通する金属バンプとを有することを特徴とするコネクタ。An insulating sheet having a plurality of through holes;
A conductive layer located on the inner surface of the through hole and electrically conducting both sides of the insulating sheet ;
An elastic resin filled in the through hole;
A connector comprising metal bumps disposed on the elastic resin surface and electrically connected to the conductive layer.

絶縁性シートの所定位置に貫通孔を形成する工程と、
該貫通孔の内側面に沿って導電層を形成する工程と、
前記貫通孔内に弾性樹脂を充填する工程と、
該弾性樹脂の上下面に前記導電層と電気的に導通する金属バンプを配置する工程とを含むことを特徴とするコネクタ製造方法。Forming a through hole at a predetermined position of the insulating sheet;
Forming a conductive layer along the inner surface of the through hole;
Filling the through hole with an elastic resin;
Connector manufacturing method characterized by including the step of placing a metal bump to the conductive layer and the electrically conductive to the upper and lower surfaces of the elastic resin.