JP3629774B2 - Wood grain embossed decorative board - Google Patents

Wood grain embossed decorative board Download PDF

Info

Publication number
JP3629774B2
JP3629774B2 JP26301395A JP26301395A JP3629774B2 JP 3629774 B2 JP3629774 B2 JP 3629774B2 JP 26301395 A JP26301395 A JP 26301395A JP 26301395 A JP26301395 A JP 26301395A JP 3629774 B2 JP3629774 B2 JP 3629774B2
Authority
JP
Japan
Prior art keywords
layer
conduit
embossed
embossing
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP26301395A
Other languages
Japanese (ja)
Other versions
JPH09104096A (en
Inventor
仁 鈴木
昌恭 吉村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
Original Assignee
Toppan Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Inc filed Critical Toppan Inc
Priority to JP26301395A priority Critical patent/JP3629774B2/en
Publication of JPH09104096A publication Critical patent/JPH09104096A/en
Application granted granted Critical
Publication of JP3629774B2 publication Critical patent/JP3629774B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Laminated Bodies (AREA)

Description

【0001】
【産業上の利用分野】
本発明は、天然木化粧材の代替品として見直されつつある木目導管溝形状を模した化粧板に関し、詳しくは、一般住宅用内装材や家具表面として広く利用可能な木目エンボス化粧板に関するものである。
【0002】
【従来の技術】
近年、枯渇により入手が困難になりつつある天然木材の代替品として見直されている木材表面の導管溝形状を模したり、忠実に再現したエンボス化粧板が知られている。
とりわけ、不飽和ポリエステル樹脂を用いたポリエステル化粧板の分野では、これまでにもそのエンボス賦与方法の違いによって多くの製品や試みがなされてきたが、大別すると、(a)天然木原稿より、離型のよい硬化性樹脂を用いて、その表面の導管溝等の凹凸形状を忠実に型取りしたエンボス型(フィルム状)を用いたものや、(b)これらを用いて得られた電気鋳造法等によるエンボスロールを使用したものや、(c)熱可塑性フィルム等を天然木原稿や、これより反転注型して得られた母型上にて熱圧プレスや高周波プレス等により成形したエンボス型(フィルム状)を使用したものや、(d)天然木導管部のポジ又はネガ原稿を基に製版して得られた任意の版を用いて、グラビヤ印刷やシルクスクリーン印刷による盛り上げ印刷手法のエンボス型(フィルム状)を使用したもの等が広く知られている。上記4種の賦与方法のうち、とりわけ、(a),(b),(c)に関しては、その手法的特徴により天然木の導管溝形状のリアルな再現をすることが可能である。
【0003】
【発明が解決しようとする課題】
しかしながら、このリアルな導管溝形状の再現をするために化粧板のエンボス形成樹脂層の厚みが大きくなりがちで、現在広く用いられているいかなる合成樹脂を使用しようとしても、化粧板として切削加工時に、樹脂層の割れや欠け等、2次加工性の低下や使用樹脂量の増加によるコストアップ等の弊害も否めない事実であった。
そこで本発明は、これらの課題に鑑みなされたもので、その目的とするところは、より安定的で、安価で、かつ、リアルな天然木の導管溝のエンボスを有する木目エンボス化粧板を提供することにある。
【0004】
【課題を解決するための手段】
上記目的を達成するために本発明の請求項1によれば、基板上に、少なくとも1層以上からなりその総厚が50〜700μmの合成樹脂層を設け、その表面に、天然木材表面の導管開口形状を反転形成したエンボス型又はこれに類似した導管溝形状を有するエンボス型にて、導管溝を形成したことを特徴とする。
【0005】
また、本発明の請求項2によれば、前記エンボス化粧板の基板と、導管溝を有する透明乃至は半透明の合成樹脂層との間に、接着剤を介して無地又は印刷柄層を有する化粧シート乃至は接着剤層を介して転写による印刷柄層を設けたことを特徴とする。
【0006】
また、本発明の請求項3によれば、合成樹脂層表面に設けられた導管溝に、ワイピング着色層を施し、該合成樹脂層表面の平面部乃至は平面部と導管溝に、合成樹脂によるトップコート層を設けたことを特徴とする。
【0007】
また、本発明の請求項4によれば、ワイピング着色層及びトップコート層のうち、いずれかの1層を化粧板表面に施したことを特徴とする。
【0008】
また、本発明の請求項5によれば、前記化粧板表面に設けられた導管溝が、天然木材表面の導管溝深度の表面側より10〜80%程度に再現されていることを特徴とする。
【0009】
以下、本発明を詳細に説明する。
図1は、本発明の木目エンボス化粧板の構成を示す断面図である。
本発明に係る木目エンボス化粧板の構成は、上述の如く基材上に設けられた透明乃至は半透明の合成樹脂層表面に、天然木材表面の導管開口形状を反転形成したエンボス型又はこれに類似した導管溝形状を有したエンボス型にて、導管溝を形成したことを特徴とするものであり、同図中、(1)は基材層、(2)は接着剤層、(5)はシート(3)上に印刷柄層(4)を設けた化粧シート、(6)は合成樹脂層、(7)は導管溝、(8)はワイピング着色層、(9)はトップコート層である。
また、図2(a)及び図2(b)は、これら化粧板に導管溝エンボスを賦与する工程を示すもので、図2(a)は、天然木材表面の導管部開口形状を反転形成したエンボス型、又はこれに類似した導管溝形状を有したエンボス型(12)にて合成樹脂層表面を圧延・エンボス加工した状態を示しており、本エンボス型は導管部開口形状を再現したエンボス形状樹脂層(10)と基体フィルム層(11)とからなる。さらに、図2(b)は上述のエンボス型などの天然木材表面の導管部開口形状を反転形成したエンボス型、又はこれに類似した導管溝形状を有したエンボス型より得られる母型を基に作製されたエンボスロール(13)にて合成樹脂層(6)表面にエンボスせしめる工程を示したものである。
【0010】
本発明に用いる基材(1)としては、従来化粧板に広く用いられてきた合板、MDF、ハードボード、パーティクルボード等の木質系基材、金属板、樹脂板、無機板等の材質が使用可能である。さらに、基材の大きさは任意の寸法、厚みのものが選択可能である。
【0011】
この基材(1)上に接着剤(2)を介して化粧シート(5)を設けるか、或いは転写手法にて印刷柄層(5)を設ける。化粧シート及び転写による印刷柄層のいずれの積層の場合においても接着剤層(2)として用いられる接着剤は、その接着性を考慮すれば任意の選択が可能である。一例として、合板基材と坪量80g/mの化粧シートの組合わせの場合、酢酸ビニルエマルジョン系や尿素−酢酸ビニルエマルジョン系等の接着剤が一般的であり適している。
【0012】
接着剤の塗工方法としては、ロールコーター、リバースコーター、ナイフコーター、フローコーター、スプレー等の塗工方法やこれらを複数組み合わせた方法が任意に選択可能である。
【0013】
次に、接着剤層(2)を介して印刷柄層(4)を形成する。この際、シート(3)上に予め木目柄印刷や単色印刷等の印刷柄層(4)を設けた化粧シート(5)を積層、又は任意の基体フィルム上に印刷柄が形成された転写シートにて、印刷柄層のみを積層せしめる方法が選択可能である。また、化粧シート(5)に用いられるシート(3)としては、塩化ビニル、アクリル、オレフィン、ABS等の任意の厚みの合成樹脂フィルム単独や複数組み合わせたもの、坪量15〜200g/m程度の紙、チタン紙、混抄紙、含浸紙、合成紙等が選択可能である。なお、印刷柄層(4)を省略したシート単独での使用も可能である。さらに、化粧シート(5)上に印刷柄層(4)の保護、シートとエンボス形成する合成樹脂層(6)との密着性の改善等の目的でプライマーコート層を設けることも、適宜可能である。
【0014】
そして化粧シート(5)上にエンボス型にて木目導管溝を形成せしめる合成樹脂層(6)を設ける。この樹脂層に用いられる樹脂としては、ポリエステル樹脂系、エポキシ樹脂系、ウレタン樹脂系、メラミン樹脂系、ダップ樹脂系等の透明乃至は半透明の硬化性樹脂であれば選択肢は多く、任意の選択が可能である。
【0015】
これら樹脂の塗布方法としては、使用する樹脂を複数層積層せしめることも可能であるが、総厚としては、樹脂層表面に賦与・形成される天然木材表面の導管溝(7)の形状を考慮して50〜700μm程度であれば十分である。
【0016】
さらに、図2(a)に示すように、樹脂層(6)の表面に天然木材表面の導管部開口形状を反転形成したエンボス型、又はこれに類似した導管溝形状を有するエンボス型(12)を樹脂層の硬化過程に積層・圧延せしめた後、樹脂層(6)の硬化を待ってエンボス型(12)を除去・脱型することで導管溝(7)を形成する。
【0017】
また、図2(b)に示すように、樹脂層(6)の表面に天然木材表面の導管部開口形状を反転形成したエンボス型、又はこれに類似した導管溝形状を有するエンボス型より得られる母型を基に作製されたエンボスロール(13)にて樹脂層の硬化過程乃至は硬化後に、エンボスせしめることで導管溝(7)を形成することも可能である。ここで使用されるエンボス型(12)は、基体フィルム層(11)としてビニロンフィルム、ポリエステルフィルム、オレフィン系フィルム、フッ素系フィルム、ポリ塩化ビニルフィルム等の合成樹脂フィルムの単体や複合化されたものが使用可能である。
【0018】
これら基体フィルム(11)及びエンボス型形状樹脂層(10)を用いて天然木材表面の導管部開口形状を注型・反転せしめる。この際に、本発明の特徴として、図3に示すように、エンボス形状樹脂層(10)の導管深度を天然木材の導管深度の100%を再現する必要はなく、天然木材表面の導管深度の表面側より10〜80%程度に再現されれば、意匠的に十分な外観を得ることが可能で、これにより合成樹脂層(6)の膜厚が50〜700μm程度でも天然木材表面の導管溝形状と非常に近似した意匠効果と、樹脂層の大幅な節約が可能となる。
例えば、図3(a)は、天然木材表面を反転・注型してその導管溝をほぼ100%再現したエンボス型、図3(b)は、天然木材表面を反転・注型して得られたエンボス型の導管深度を天然木材の其に対してほぼ50%に調節したもの、図3(c)は、天然木材表面を反転・注型して得られたエンボス型の導管深度を天然木材の其に対してほぼ10%に調節したものである。この3種エンボス型を用いて圧延・硬化せしめたエンボス化粧板において、その意匠効果(天然木材との類似性)は、図3(a),(b),(c)いずれの場合も、大きな差異は認められない。しかしながら、この際に必要となる樹脂層(6)の厚みは、
図3(a)>(b)>(c)
となり、図3(b),(c)の場合、その意匠性を確保したまま樹脂層(6)の大幅な節約が可能となる。
【0019】
この導管深度の再現に関しては、前記図2(a),(b)の樹脂層(6)の表面に、天然木材表面の導管部開口形状を反転形成したエンボス型(12)、又はこれに類似した導管溝形状を有するエンボス型より得られる母型を基に作製されたエンボスロール(13)にて、樹脂層(6)の硬化過程乃至は硬化後に、エンボスせしめる場合のエンボスロール深度設計にも有効である。
【0020】
これら樹脂層(6)表面に導管溝(7)を設ける工程を経て、次に導管溝(7)中にワイピング着色層(8)を設け、さらに導管溝(7)中のワイピング着色層(8)上と導管溝(7)周辺部の平面部表面にトップコート層(9)を設けることがよいが、これに限定されるものではない。
【0021】
【作用】
本発明に係る木目エンボス化粧板は、天然木材表面の導管部開口形状を反転形成したエンボス型、又はこれに類似した導管溝形状を有するエンボス型を用いて木目エンボスを形成する際、得られたエンボス型を天然木材表面の導管溝深度の表面より10〜80%程度に調整しておくことで、木目導管のリアルな表現を損なうことなく、エンボス形成する透明乃至は半透明の樹脂層の総厚を50〜700μmに削減することが可能となる。
【0022】
【実施例】
以下、実施例を詳細に説明する。
まず、木目エンボス化粧板の基材として、大きさ920mm×1830mm、厚さ2.5mmの合板を用いて、この基材の片面に酢酸ビニルエマルジョン接着剤をナチュラルコーターにて、80g/mwetの塗布量で塗布し接着剤層を形成した。
さらに、坪量60g/mの原紙にグラビヤ印刷にて木目柄を予め印刷しておいた化粧シートを上記接着剤層の上に重ね合わせて、100℃×60secの条件でホットプレスにて接着・硬化せしめ、上記基材に化粧シートを貼り合わせたものである。
次に、この化粧シートを貼り合わせた上側に、不飽和ポリエステル樹脂(エポラック、(株)日本触媒社製)に触媒としてパーメック(日本油脂(株)社製)を1.5部添加・攪拌したものを直ちに適宜な塗布量で塗布し、この上に別に用意しておいたエンボス型を重ね合わせ、ゴムロールで圧延した。
この際、用いるエンボス型としては、その基体フィルムに厚み25μmのビニロンフィルム、エンボス形成樹脂層にポリビニルアルコール樹脂を用いて、エンボス原稿には北米産ホワイトオーク板目材を用いて、その表面形状を反転・注型して、(a)その導管溝をほぼ100%再現したもの、(b)導管深度をエンボス原稿のそれに対してほぼ50%に調節した、2種類を準備した。
このようにして不飽和ポリエステル樹脂の硬化・乾燥、エンボス型を脱型し、さらに得られたエンボス化粧板の表面導管溝に、ワイピング着色層と、表面の導管溝周辺部の平面部にはウレタン樹脂にてトップコート層を設けて木目エンボス化粧板を得た。
【0023】
以下、表1に、得られた化粧板のエンボス賦与されたポリエステル樹脂層の厚み、賦与された導管溝深度、外観品質(天然木材導管との類似性)を示す。
【0024】
【表1】

Figure 0003629774
【0025】
表1に示すように、エンボス型の導管深度調整を行わない場合は、必要樹脂量の削減が困難である。また、表中のサンプルNo1,2,4においては、その得られた外観品質(天然木材導管との類似性)に関して大きな差異は、認められない。
【0026】
【発明の効果】
本発明に係る木目エンボス化粧板は、天然木材表面の導管部開口形状を反転形成したエンボス型、又はこれに類似した導管溝形状を有したエンボス型を用いて木目エンボスを形成する際、得られたエンボス型を天然木材表面の導管溝深度の表面側より10〜80%程度に調整しておくことで、木目導管のリアルな表現を損なうことなくエンボス形成する透明乃至は半透明の樹脂層の層厚を薄膜化することが可能となり、木目エンボス化粧板のエンボス賦与される樹脂層厚を50〜700μmに削減することが可能となった。
【図面の簡単な説明】
【図1】本発明の木目エンボス化粧板の一例を示す断面図である。
【図2】本発明の木目エンボス化粧板におけるエンボス加工を示すもので、(a)は天然木材表面の導管部開口形状を反転形成したエンボス型にて、合成樹脂層表面を圧延・エンボス加工した状態を示す説明図であり、(b)は上述のエンボス型より得られる母型を基に作製されたエンボスロールにて、合成樹脂層表面にエンボスせしめる工程を示す説明図である。
【図3】本発明の木目エンボス化粧板に用いられるエンボス型を示すもので、(a)は100%再現したエンボス型を断面で表した説明図であり、(b)は50%再現したエンボス型を断面で表した説明図であり、(c)は10%再現したエンボス型を断面で表した説明図である。
【符号の説明】
1…基材
2…接着剤層
3…シート
4…印刷柄層
5…化粧シート
6…合成樹脂層
7…導管溝
8…ワイピング着色層
9…トップコート層
10…エンボス形状樹脂層
11…基体フィルム層
12…エンボス型
13…エンボスロール[0001]
[Industrial application fields]
The present invention relates to a decorative board imitating the shape of a wood grain conduit groove that is being reviewed as an alternative to a natural wood decorative material, and more particularly to a wood grain embossed decorative board that can be widely used as an interior material for general housing or a furniture surface. is there.
[0002]
[Prior art]
In recent years, embossed decorative boards have been known that simulate or faithfully reproduce the shape of a conduit groove on the surface of wood, which has been reviewed as an alternative to natural wood, which is becoming difficult to obtain due to depletion.
Especially, in the field of polyester decorative boards using unsaturated polyester resins, many products and trials have been made so far due to the difference in embossing method, but roughly speaking, (a) from a natural wood manuscript, Using an embossing mold (film shape) in which unevenness shapes such as conduit grooves on the surface are faithfully formed using a curable resin having a good mold release, and (b) electroforming obtained using these Embossed rolls using the embossing roll by the law, etc. (c) Embossing molded by hot-pressing or high-frequency pressing on a natural wood manuscript or a mother mold obtained by reversing casting from this Using a mold (film-like) or (d) gravure printing or silkscreen printing, using any plate obtained by making a plate based on a positive or negative manuscript of a natural wood conduit Such as those used law embossed (film-like) it is widely known. Among the above four types of application methods, in particular, (a), (b), and (c) can realistically reproduce the shape of the conduit groove of natural wood due to its technical characteristics.
[0003]
[Problems to be solved by the invention]
However, in order to reproduce this realistic conduit groove shape, the embossing resin layer thickness of the decorative board tends to be large, and any synthetic resin that is widely used today can be used as a decorative board during cutting processing. In addition, there were undeniable problems such as cracking and chipping of the resin layer, such as a decrease in secondary processability and an increase in cost due to an increase in the amount of resin used.
Therefore, the present invention has been made in view of these problems, and an object of the present invention is to provide a wood grain embossed decorative board having embossments of a natural wood conduit groove that is more stable, inexpensive, and realistic. There is.
[0004]
[Means for Solving the Problems]
In order to achieve the above object, according to claim 1 of the present invention, a synthetic resin layer consisting of at least one layer and having a total thickness of 50 to 700 μm is provided on a substrate, and a conduit on the surface of natural wood is provided on the surface. The conduit groove is formed by an embossing die having an inverted opening shape or an embossing die having a similar conduit groove shape.
[0005]
Moreover, according to Claim 2 of this invention, it has a plain or printed pattern layer via an adhesive agent between the board | substrate of the said embossing decorative board, and the transparent thru | or translucent synthetic resin layer which has a conduit groove. A printed pattern layer by transfer is provided through a decorative sheet or an adhesive layer.
[0006]
According to claim 3 of the present invention, a wiping colored layer is applied to the conduit groove provided on the surface of the synthetic resin layer, and the flat portion or the flat portion of the surface of the synthetic resin layer and the conduit groove are made of synthetic resin. A top coat layer is provided.
[0007]
According to claim 4 of the present invention, any one of the wiping colored layer and the top coat layer is applied to the surface of the decorative board.
[0008]
Moreover, according to Claim 5 of this invention, the conduit groove provided in the said decorative board surface is reproduced about 10-80% from the surface side of the conduit groove depth of the natural wood surface, It is characterized by the above-mentioned. .
[0009]
Hereinafter, the present invention will be described in detail.
FIG. 1 is a cross-sectional view showing a configuration of a wood grain embossed decorative board of the present invention.
The structure of the wood grain embossed decorative board according to the present invention is the embossed type in which the conduit opening shape of the surface of natural wood is inverted on the surface of the transparent or translucent synthetic resin layer provided on the base as described above. The embossed mold having a similar conduit groove shape is characterized in that a conduit groove is formed. In the figure, (1) is a base material layer, (2) is an adhesive layer, (5) Is a decorative sheet provided with a printed pattern layer (4) on the sheet (3), (6) is a synthetic resin layer, (7) is a conduit groove, (8) is a wiping colored layer, (9) is a topcoat layer is there.
Moreover, FIG. 2 (a) and FIG.2 (b) show the process of giving a conduit groove embossing to these decorative boards, and Fig.2 (a) reversed and formed the conduit | pipe part opening shape of the natural wood surface. The embossed mold or the embossed mold (12) with a similar conduit groove shape shows the state where the surface of the synthetic resin layer has been rolled and embossed. It consists of a resin layer (10) and a base film layer (11). Further, FIG. 2 (b) is based on an embossed mold obtained by reversing the shape of the opening of the conduit section on the surface of natural wood, such as the embossed mold described above, or a matrix obtained from an embossed mold having a similar conduit groove shape. The process of embossing on the surface of a synthetic resin layer (6) with the produced embossing roll (13) is shown.
[0010]
As the base material (1) used in the present invention, materials such as plywood, MDF, hard board, particle board, and other woody base materials, metal plates, resin plates, inorganic plates, etc., which have been widely used for conventional decorative boards are used. Is possible. Furthermore, the size of the base material can be selected from arbitrary dimensions and thicknesses.
[0011]
A decorative sheet (5) is provided on the substrate (1) via an adhesive (2), or a printed pattern layer (5) is provided by a transfer method. The adhesive used as the adhesive layer (2) can be selected arbitrarily in consideration of its adhesiveness in any case of lamination of the decorative sheet and the printed pattern layer by transfer. As an example, in the case of a combination of a plywood substrate and a decorative sheet having a basis weight of 80 g / m 2 , an adhesive such as a vinyl acetate emulsion system or a urea-vinyl acetate emulsion system is common and suitable.
[0012]
As an adhesive coating method, a coating method such as a roll coater, a reverse coater, a knife coater, a flow coater, or a spray, or a method in which a plurality of these are combined can be arbitrarily selected.
[0013]
Next, a printed pattern layer (4) is formed through the adhesive layer (2). In this case, a transfer sheet in which a decorative sheet (5) provided with a printed pattern layer (4) such as wood grain pattern printing or monochromatic printing is laminated on the sheet (3) or a printed pattern is formed on an arbitrary base film. The method of laminating only the printed pattern layer can be selected. Moreover, as a sheet | seat (3) used for a decorative sheet (5), the synthetic resin film of arbitrary thickness, such as vinyl chloride, an acryl, an olefin, and ABS, or what combined several, basis weight 15-200g / m < 2 > grade Paper, titanium paper, mixed paper, impregnated paper, synthetic paper, and the like can be selected. In addition, it is also possible to use the sheet alone without the printed pattern layer (4). Furthermore, a primer coat layer can be appropriately provided on the decorative sheet (5) for the purpose of protecting the printed pattern layer (4) and improving the adhesion between the sheet and the synthetic resin layer (6) to be embossed. is there.
[0014]
Then, a synthetic resin layer (6) is formed on the decorative sheet (5) to form a wood grain conduit groove in an embossed form. There are many choices for the resin used in this resin layer as long as it is a transparent or translucent curable resin such as polyester resin, epoxy resin, urethane resin, melamine resin, and dapp resin. Is possible.
[0015]
As a method of applying these resins, it is possible to laminate a plurality of layers of the resin to be used, but the total thickness considers the shape of the conduit groove (7) on the surface of the natural wood provided and formed on the surface of the resin layer. If it is about 50-700 micrometers, it is enough.
[0016]
Furthermore, as shown in FIG. 2 (a), an embossed mold (12) having a conduit groove shape similar to the embossed mold in which the conduit section opening shape of the natural wood surface is reversed on the surface of the resin layer (6). Is laminated and rolled in the curing process of the resin layer, and after waiting for the resin layer (6) to cure, the embossing mold (12) is removed and removed to form the conduit groove (7).
[0017]
Moreover, as shown in FIG.2 (b), it obtains from the emboss type which reversely formed the conduit | pipe part opening shape of the natural wood surface on the surface of the resin layer (6), or the emboss type | mold which has a similar conduit groove shape. It is also possible to form the conduit groove (7) by embossing the resin layer with the embossing roll (13) produced based on the matrix, after or after the resin layer is cured. The embossed mold (12) used here is a single or complex synthetic resin film such as a vinylon film, a polyester film, an olefin film, a fluorine film, or a polyvinyl chloride film as a base film layer (11). Can be used.
[0018]
Using these base film (11) and embossed shaped resin layer (10), the shape of the opening of the conduit on the natural wood surface is cast and inverted. At this time, as shown in FIG. 3, it is not necessary to reproduce the conduit depth of the embossed resin layer (10) as 100% of the conduit depth of the natural wood. If reproduced from about 10 to 80% from the surface side, it is possible to obtain a design-appropriate appearance, whereby the conduit groove on the surface of natural wood even if the synthetic resin layer (6) has a thickness of about 50 to 700 μm. A design effect very close to the shape and a significant saving of the resin layer are possible.
For example, Fig. 3 (a) is an embossed type in which the surface of natural wood is inverted and cast to reproduce its conduit groove almost 100%, and Fig. 3 (b) is obtained by inverting and casting the surface of natural wood. Fig. 3 (c) shows the embossed conduit depth adjusted to approximately 50% of that of natural wood. Fig. 3 (c) shows the embossed conduit depth obtained by inverting and casting the natural wood surface. It is adjusted to about 10% of that. In the embossed decorative board rolled and hardened using these three types of embossing molds, the design effect (similarity to natural wood) is large in any of FIGS. 3 (a), (b) and (c). There is no difference. However, the thickness of the resin layer (6) required at this time is
FIG. 3 (a)>(b)> (c)
Thus, in the case of FIGS. 3B and 3C, the resin layer (6) can be greatly saved while ensuring its design.
[0019]
Regarding the reproduction of the conduit depth, the embossed type (12) in which the shape of the opening of the conduit portion of the natural wood surface is inverted on the surface of the resin layer (6) in FIGS. 2 (a) and 2 (b), or the like. For the embossing roll depth design when embossing is performed after the curing process of the resin layer (6) or after curing in the embossing roll (13) produced based on the mother mold obtained from the embossing mold having the conduit groove shape. It is valid.
[0020]
After the step of providing the conduit groove (7) on the surface of the resin layer (6), the wiping colored layer (8) is then provided in the conduit groove (7), and further the wiping colored layer (8 in the conduit groove (7)). ) A top coat layer (9) is preferably provided on the surface of the flat portion on the top and the periphery of the conduit groove (7), but is not limited thereto.
[0021]
[Action]
The wood grain embossed decorative board according to the present invention was obtained when the wood grain embossing was formed using an embossing mold in which the conduit portion opening shape of the natural wood surface was inverted or an embossing mold having a similar conduit groove shape. By adjusting the embossing mold to about 10 to 80% from the surface of the natural wood surface, the embossed transparent or semi-transparent resin layer can be formed without impairing the realistic expression of the wood grain conduit. The thickness can be reduced to 50 to 700 μm.
[0022]
【Example】
Examples will be described in detail below.
First, as a base material for the wood grain embossed decorative board, a plywood having a size of 920 mm × 1830 mm and a thickness of 2.5 mm was used, and a vinyl acetate emulsion adhesive was applied to one side of the base material with a natural coater at 80 g / m 2 wet. An adhesive layer was formed by coating with a coating amount of.
Furthermore, a decorative sheet on which a grain pattern is pre-printed by gravure printing on a base paper having a basis weight of 60 g / m 2 is superimposed on the adhesive layer and bonded by hot pressing under conditions of 100 ° C. × 60 sec. -It is cured and a decorative sheet is bonded to the substrate.
Next, 1.5 parts of Parmec (manufactured by Nippon Oil & Fats Co., Ltd.) as a catalyst was added to and stirred with an unsaturated polyester resin (Epolac, manufactured by Nippon Shokubai Co., Ltd.) on the upper side where the decorative sheet was bonded. The product was immediately applied at an appropriate coating amount, and an embossing mold prepared separately was overlaid thereon and rolled with a rubber roll.
At this time, the embossing mold to be used is a vinylon film having a thickness of 25 μm for the base film, a polyvinyl alcohol resin for the embossing resin layer, and a white oak board material for North America, and the surface shape of the embossed original. Two types were prepared by reversing and casting, (a) the conduit groove was reproduced approximately 100%, and (b) the conduit depth was adjusted to approximately 50% of that of the embossed document.
In this way, the unsaturated polyester resin is cured and dried, the embossing mold is removed, and the embossed decorative board thus obtained has a wiping colored layer on the surface conduit groove, and a urethane on the flat portion around the surface of the conduit groove. A wood grain embossed decorative board was obtained by providing a top coat layer with resin.
[0023]
Table 1 below shows the thickness of the embossed polyester resin layer, the applied conduit groove depth, and the appearance quality (similarity to natural wood conduit) of the resulting decorative board.
[0024]
[Table 1]
Figure 0003629774
[0025]
As shown in Table 1, when the embossed conduit depth is not adjusted, it is difficult to reduce the required resin amount. Moreover, in sample No1,2,4 in a table | surface, the big difference is not recognized regarding the obtained external appearance quality (similarity with a natural wood conduit | pipe).
[0026]
【The invention's effect】
The wood grain embossed decorative board according to the present invention is obtained when a wood grain embossing is formed using an embossing mold in which the shape of the opening of the conduit portion on the surface of natural wood is reversed or an embossing mold having a similar conduit groove shape. By adjusting the embossing mold to about 10 to 80% from the surface side of the depth of the conduit groove on the natural wood surface, a transparent or translucent resin layer that can be embossed without impairing the realistic expression of the wood grain conduit. The layer thickness can be reduced, and the resin layer thickness to which embossing of the wood grain embossed decorative board is applied can be reduced to 50 to 700 μm.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an example of a wood grain embossed decorative board of the present invention.
FIG. 2 shows embossing in a wood grain embossed decorative board according to the present invention. FIG. 2A is an embossed mold in which the shape of the opening of a conduit portion on the surface of natural wood is reversed and the surface of a synthetic resin layer is rolled and embossed. It is explanatory drawing which shows a state, (b) is explanatory drawing which shows the process of embossing on the surface of a synthetic resin layer with the embossing roll produced based on the mother die obtained from the above-mentioned embossing type | mold.
FIG. 3 shows an embossing mold used for the wood grain embossed decorative board of the present invention, in which (a) is an explanatory view showing an embossing mold reproduced in 100%, and (b) is an embossing reproduced in 50%. It is explanatory drawing which represented the type | mold by the cross section, (c) is explanatory drawing which represented the embossing type | mold reproduced 10% in the cross section.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Base material 2 ... Adhesive layer 3 ... Sheet 4 ... Print pattern layer 5 ... Cosmetic sheet 6 ... Synthetic resin layer 7 ... Conduit groove 8 ... Wiping coloring layer 9 ... Topcoat layer 10 ... Embossed resin layer 11 ... Base film Layer 12 ... Embossing mold 13 ... Embossing roll

Claims (2)

基板上に、少なくとも1層以上からなりその総厚が50〜700μmの合成樹脂層を設け、その表面に、天然木材表面の導管開口形状を反転形成したエンボス型にて導管溝を形成してなり、前記エンボス型が、天然木材表面の導管溝深度の表面側より10〜80%再現されていることを特徴とする木目エンボス化粧板。A synthetic resin layer consisting of at least one layer and having a total thickness of 50 to 700 μm is provided on the substrate, and a conduit groove is formed on the surface by an embossed type in which the shape of the conduit opening on the surface of natural wood is reversed. The wood grain embossing decorative board , wherein the embossing mold is reproduced 10 to 80% from the surface side of the depth of the conduit groove on the surface of natural wood. 接着剤層を介して無地又は印刷柄層を有する化粧シート層を積層せしめた基材上、又は接着剤層を介して印刷層を転写せしめた基材上に、すくなくとも1層以上からなりその総厚が50〜700μmの透明乃至は半透明な合成樹脂層を設け、その表面に、天然木材表面の導管開口形状を反転形成したエンボス型にて導管溝を形成してなり、前記エンボス型が、天然木材表面の導管溝深度の表面側より10〜80%再現されていることを特徴とする木目エンボス化粧板。It consists of at least one layer on a base material on which a decorative sheet layer having a plain or printed pattern layer is laminated via an adhesive layer, or on a base material on which a printed layer is transferred via an adhesive layer. A transparent or translucent synthetic resin layer having a thickness of 50 to 700 μm is provided, and on the surface thereof, a conduit groove is formed by an embossing mold in which a conduit opening shape of the surface of natural wood is reversed. Wood grain embossed decorative board characterized by being reproduced 10-80% from the surface side of the depth of the conduit groove on the surface of natural wood.
JP26301395A 1995-10-11 1995-10-11 Wood grain embossed decorative board Expired - Fee Related JP3629774B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26301395A JP3629774B2 (en) 1995-10-11 1995-10-11 Wood grain embossed decorative board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26301395A JP3629774B2 (en) 1995-10-11 1995-10-11 Wood grain embossed decorative board

Publications (2)

Publication Number Publication Date
JPH09104096A JPH09104096A (en) 1997-04-22
JP3629774B2 true JP3629774B2 (en) 2005-03-16

Family

ID=17383682

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26301395A Expired - Fee Related JP3629774B2 (en) 1995-10-11 1995-10-11 Wood grain embossed decorative board

Country Status (1)

Country Link
JP (1) JP3629774B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010069621A (en) * 2001-04-23 2001-07-25 최인관 A method for making recomposed veneer from low price veneer and the recomposed veneer thereby
DE102007026170A1 (en) 2007-06-04 2008-12-11 Akzenta Paneele + Profile Gmbh Laminated decorative plate and method for its production

Also Published As

Publication number Publication date
JPH09104096A (en) 1997-04-22

Similar Documents

Publication Publication Date Title
JPH01297176A (en) Production of transfer sheet and thermosetting resin decorative laminate
JP3629774B2 (en) Wood grain embossed decorative board
JPS63194949A (en) Decorative sheet
JPS602989B2 (en) Release sheet and its manufacturing method
JP3672636B2 (en) Manufacturing method of decorative board
JP3465103B2 (en) Cosmetic material having unevenness synchronized with pattern and its manufacturing method
JP3289621B2 (en) Door or door using frame layout decorative board
JPS6346580Y2 (en)
JPS59391B2 (en) Decorative board manufacturing method
JP3582115B2 (en) Embossed decorative sheet used for wrapping, etc.
JPH04282248A (en) Polyester decorative sheet
JPH09104097A (en) Embossed decorative board and door using this board
JP2576513Y2 (en) Molding sheet and painting molding
JP2626762B2 (en) Method for producing colored painted curable resin decorative board
JPS6321614B2 (en)
JPH054908B2 (en)
JPH059199Y2 (en)
JP2810011B2 (en) Manufacturing method of laminated synthetic resin decorative material
JPH09314756A (en) Thermosetting resin decorative material
JPS5936588B2 (en) Decorative sheet manufacturing method
JPS5940776B2 (en) Decorative glass manufacturing method
JPH11170438A (en) Manufacture of embossed decorative sheet having wiping appearance, and transfer material
JPH0714634B2 (en) Veneer manufacturing method
JPH09174793A (en) Synthetic resin decorative material and manufacture thereof
JPH0661902B2 (en) Decorative board and manufacturing method thereof

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20040702

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20040803

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040910

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20041005

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20041108

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20041124

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20041207

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20071224

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20081224

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20091224

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20091224

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101224

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111224

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121224

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121224

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131224

Year of fee payment: 9

LAPS Cancellation because of no payment of annual fees