JP3597214B2 - Coating device and coating method - Google Patents

Coating device and coating method Download PDF

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JP3597214B2
JP3597214B2 JP34614193A JP34614193A JP3597214B2 JP 3597214 B2 JP3597214 B2 JP 3597214B2 JP 34614193 A JP34614193 A JP 34614193A JP 34614193 A JP34614193 A JP 34614193A JP 3597214 B2 JP3597214 B2 JP 3597214B2
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substrate
coating liquid
coating
supplying
nozzle
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JPH07171479A (en
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由雄 酒井
裕文 吉野
伊雄 岡本
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Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
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Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting

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  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Description

【０００１】
【産業上の利用分野】
本発明は、半導体用シリコンウエハや液晶用ガラス角型基板などの基板表面にフォトレジストなどの所定の塗布液を塗布する塗布装置及び塗布方法に関する。
【０００２】
【従来の技術】
この種の装置としては、例えば特公昭５７−４８９８０号公報及び特開平１−１３５５６５号公報などに開示された装置（スピンコータ）がある。これらのスピンコータでは、図８に示すように、回転自在に設けられたスピンチャック２が設けられており、その上方部で基板１を水平支持可能となっている。このスピンチャック２に支持された基板１の表面中央部１ａの上方位置に単一の吐出口（図示省略）が固定されており、基板１の表面中央部１ａにフォトレジスト３を供給可能となっている。また、この装置では、吐出口からのフォトレジスト３が基板１の表面中央部１ａに供給された後、スピンチャック２に連結されたモータ（図示省略）を作動させると、フォトレジスト３が基板１の表面全体に拡散されて、一定膜厚の薄膜が形成される。
【０００３】
【発明が解決しようとする課題】
しかしながら、上記のように１箇所にフォトレジスト３を供給する従来の装置においては、基板の大きさに対して十分な量のフォトレジスト３を基板表面上に供給しておかないと、基板表面全体にフォトレジストを行き渡らせて基板表面全体にその薄膜を形成することが困難であった。したがって、従来装置では、基板表面に薄膜を形成するために、薄膜形成に必要な量よりもかなり多めのフォトレジスト３を基板表面に供給しており、その結果フォトレジスト３の使用量が多くなるという問題がある。
【０００４】
本発明は、上述のような問題に鑑みてなされたものであって、塗布液の使用量を減少させても基板表面全体に塗布液を行き渡らせて基板表面全体に薄膜を形成することが可能な塗布装置および塗布方法を提供することを目的とする。
【０００５】
【課題を解決するための手段】
請求項１の発明は、基板の表面に所定の塗布液を供給して、前記基板の表面に薄膜を形成する塗布装置であって、基板を水平状態で支持する回転可能な基板支持手段と、前記基板支持手段により支持された前記基板の表面の所定の範囲に塗布液を供給する塗布液供給手段と、前記基板支持手段を回転させることにより、前記塗布液供給手段によって塗布液が供給された前記基板を回転させて、前記基板の表面の前記所定の範囲に供給された塗布液を前記基板の表面全体に拡散させる基板回転手段とを有し、前記塗布液供給手段が、前記基板支持手段に支持される前記基板の表面に沿って第１方向に延び、前記基板の表面の前記第１方向に沿った線状の領域に塗布液を供給するノズル部と、前記ノズル部を前記第１方向と交差し、かつ前記基板の表面に沿った第２方向に直線移動させる移動手段とを有し、前記所定の範囲は、前記基板の表面より若干小さい範囲であり、前記ノズル部は、前記第１方向に沿って伸びるスリット状の吐出口を有するスリットノズルであって、前記吐出口の前記第１方向の長さは、前記所定の範囲の一辺に対応する長さである。
また、請求項２の発明は、請求項１の発明に係る塗布装置であって、前記ノズル部は、前記基板支持手段に支持された前記基板の辺のうち、前記第１方向に配置される辺の長さよりも短い長さの前記線状の領域に塗布液を供給するものである。
また、請求項３の発明は、基板の表面に所定の塗布液を供給して、前記基板の表面に薄膜を形成する塗布装置であって、基板を水平状態で支持する回転自在な基板支持手段と、前記基板支持手段に支持される前記基板の表面よりも若干小さい所定の範囲に塗布液を供給する塗布液供給手段と、前記基板支持手段を回転させることにより、前記塗布液供給手段によって塗布液が供給された前記基板を回転させて、前記基板の表面の前記所定の範囲に供給された塗布液を前記基板の表面全体に拡散させる基板回転手段とを有し、前記塗布液供給手段が、前記基板支持手段に支持される前記基板の表面に塗布液を供給するノズル部と、前記ノズル部を前記基板の表面に沿って移動させる移動手段とを有し、前記ノズル部は、前記基板支持手段に支持される前記基板の表面に沿って第１方向に伸びるスリット状の吐出口を有するスリットノズルであって、前記吐出口の前記第１方向の長さは、前記所定の範囲の一辺に対応する長さであり、基板を支持した前記基板支持手段を前記基板回転手段によって回転させた状態で、前記ノズル部から塗布液を吐出しつつ前記移動手段により前記ノズル部を前記基板の表面に沿って移動させて、前記所定の範囲に塗布液を供給し、その後さらに前記基板支持手段を回転させて前記基板の表面の塗布液を前記基板の表面全体に拡散させる。
また、請求項４の発明は、請求項１乃至３の発明に係る塗布装置であって、前記塗布液はフォトレジストである。
【０００６】
また、請求項５の発明は、角型の基板の表面に所定の塗布液を供給して、前記基板の表面に薄膜を形成する塗布方法であって、基板を回転可能な基板支持手段により水平状態で支持する工程と、スリット状の吐出口により線状の領域に塗布液を供給するノズル部を、前記基板支持手段に支持された前記基板の一辺に沿うように配置する工程と、前記ノズル部から前記基板の表面に向けて塗布液を吐出しつつ、前記ノズル部を前記基板の前記一辺と交差する他辺に沿う方向に前記基板の表面に沿って移動させて、前記基板の表面よりも若干小さい所定の範囲に塗布液を供給する工程と、前記基板支持手段にて前記基板を支持した状態で当該基板を回転させて、前記所定の範囲に供給された塗布液を前記基板の表面全体に拡散させる工程とを有し、前記吐出口の長手方向の長さは、前記所定の範囲の一辺に対応する長さである。
また、請求項６の発明は、基板の表面に所定の塗布液を供給して、前記基板の表面に薄膜を形成する塗布方法であって、基板を回転可能な基板支持手段により水平状態で支持する工程と、前記基板支持手段を回転させて前記基板を回転させつつ、ノズル部から塗布液を吐出しながら回転中の前記基板の表面上を移動させて、前記基板の表面よりも若干小さい所定の範囲に塗布液を供給する工程と、その後さらに前記基板支持手段を回転させて、前記基板の表面の塗布液を前記基板の表面全体に拡散させる工程とを有し、前記ノズル部は、前記基板支持手段により支持された前記基板の表面に沿った第１方向に伸びるスリット状の吐出口を有し、前記吐出口の前記第１方向の長さは、前記所定の範囲の一辺に対応する長さである。
【０００７】
【作用】
本発明では、ノズル部から基板の表面に向けて塗布液が吐出されながら、前記ノズル部が前記基板の表面に対して相対移動される。このため、前記基板の表面上に前記基板の表面よりも若干小さい所定の範囲に前記塗布液が供給される。そして、前記ノズル部によって塗布液が供給された基板が回転され、その塗布液が遠心力によって基板の表面全体に拡散されて、塗布液の薄膜が均一に形成される。
【０００８】
【実施例】
図１は、この発明にかかる塗布装置の一実施例を示す図である。この装置は、同図に示すように、基板１を水平状態で保持するスピンチャック（基板保持手段）２と、そのスピンチャック２によって支持された基板１の表面に向けて所定の塗布液を塗布する塗布液供給部３と、スピンチャック２と連結されてスピンチャック２を回転させるモータ（基板回転手段）４とを有している。
【０００９】
塗布液供給部３では、スピンチャック２によって支持された基板１の表面に向けて塗布液を吐出するためのノズル部５がスピンチャック２の上方位置に配置されている。このノズル部５は、図２に示すように、直方体のノズルブロック５１の底面から下方に８本の針状ノズル５２が一定ピッチ、例えば１０ｍｍで長手方向Ｘに列状に突設されている。
【００１０】
このノズルブロック５１には、３次元移動機構６が連結されている。この３次元移動機構６は、上下方向Ｚに伸縮自在なコラム６１と、その一方端がコラム６１の頂部に連結されるとともに他方端にノズルブロック５１を連結してなり水平Ｙ方向に伸縮自在なアーム６２とを備えており、図示を省略する駆動部によりコラム６１の水平Ｘ方向への移動、コラム６１の上下方向Ｚへの伸縮およびアーム６２の水平Ｙ方向への伸縮をそれぞれ可変速制御することで、ノズル部５を任意の位置に任意の速度で移動させることができるようになっている。なお、コラム６１の水平Ｘ方向への移動、コラム６１の上下方向Ｚへの伸縮およびアーム６２の水平Ｙ方向への伸縮を行うために、例えばモータを駆動部の駆動源として用いることができるが、これ以外にシリンダーなどの他の駆動源を用いることができる。
【００１１】
また、ノズル部５には、図１に示すように、供給ユニット７が接続されている。この供給ユニット７では、塗布液タンク７１内の塗布液がトラップタンク７２に一定量だけトラップされており、ポンプ７３を作動させることによりそのトラップタンク７２からポンプ７３およびフィルタ７４を介して塗布液の温度調整を行う温調部７５に与えられる。さらに、温調部７５で所定温度に調整された塗布液はエアー弁７６およびサックバック機構７７を経由してノズルブロック５１に圧送される。このため、ポンプ７３の作動により塗布液がノズル部５に圧送されると、塗布液が針状ノズル５２からスピンチャック２に支持された基板１の表面に向けて吐出される。なお、この実施例では、サックバック機構７７を設けたことで針状ノズル５２からの塗布液の滴下、いわゆる「ボタ落ち」を効果的に防止している。また、ポンプ７３の代わりに、窒素ガスや空気を塗布液タンク７１内に送り込んでタンク７１内の圧力を高めて塗布液を圧送するようにしてもよい。
【００１２】
次に、上記のように構成された塗布装置により塗布液、例えばフォトレジストを塗布してレジスト薄膜を形成する動作について説明する。基板１が図示を省略する搬送機構によりスピンチャック２上に搬送されると、ノズルブロック５１をノズル先端の乾燥を防止するためのノズル退避ポット（図示省略）から塗布開始位置（例えば図２の基板１の左上隅部に対応し、しかも基板表面から一定高さの位置）まで移動させる。
【００１３】
それに続いて、ポンプ７３を作動してフォトレジストを針状ノズル５２から吐出させながら、ノズルブロック５１を水平（＋Ｙ）方向に基板１の一方辺から他方辺まで移動させる（図２の矢印Ａ）。また、フォトレジストを吐出したままで、ノズルブロック５１を水平（＋Ｘ）方向に移動させた（同図の矢印Ｂ）後、水平（−Ｙ）方向に基板１の一方辺まで移動させる（図２の矢印Ｃ）。これによって、ノズルブロック５１が基板１の表面をスキャンし、そのスキャン経路に沿って基板１の表面にフォトレジストが供給される。
【００１４】
さらに、ノズルブロック５１が基板１の表面の全域よりも小さい所定の範囲全体をスキャンするまで、上記と同様に針状ノズル５２からフォトレジストを吐出しながらノズルブロック５１を水平Ｘおよび水平Ｙ方向に移動させて、フォトレジストを基板表面に供給する。こうして、フォトレジストの基板表面への供給が完了すると、基板表面において表面の全域より小さい所定の範囲全体にフォトレジスト８が供給される。なお、図３は、フォトレジスト８が上記所定の範囲全体に供給された基板１の断面図である。
【００１５】
上記のようにして基板表面へのフォトレジスト８の供給が完了すると、ノズル部５をノズル退避ポットに移動させた後、モータ４を作動させて基板１をスピンチャック２と一体的に回転させ、遠心力によってフォトレジスト８を拡散させて、基板表面全体に塗布液を行き渡らせて、基板１にレジスト薄膜を形成する。
【００１６】
以上のように、この実施例ではフォトレジスト（塗布液）８を基板１の上記所定の範囲全体に供給しているので、薄膜形成に必要な量よりもわずかに多めにフォトレジスト８を基板表面に供給するだけで所望の薄膜を形成することができ、その結果フォトレジストの使用量を抑えることができる。
【００１７】
なお、上記実施例では、フォトレジスト８を基板表面に供給した後、基板１を回転させるようにしているが、上記実施例と同様にノズルをスキャンさせつつ基板１を低速で回転させて基板表面上の所定の範囲に塗布液を供給し、その後に基板１を高速で回転させて塗布液を基板表面全体に拡散させてよい。
【００１８】
また、基板１を回転させると、基板表面上のフォトレジスト８は回転中心から放射状に拡散しようとするため、基板表面の中央領域（図４の点線で囲った領域）１ｂ上に比較的多くのフォトレジスト８を供給する一方、それ以外の表面領域上に比較的少量のフォトレジスト８を供給すると、基板１の表面に供給するフォトレジスト量を薄膜形成に必要な量に近づけることができ、フォトレジスト８の使用量をさらに減少させることができる。具体的には、ノズルブロック５１をスキャンさせる場合、中央領域１ｂに対応する位置で、つまり同図の１点鎖線に示す経路をスキャンする間ノズルブロック５１の移動速度を低下させて、当該領域へのフォトレジスト供給量を多くすることができる。
【００１９】
また、上記実施例では、その長辺が基板１の一辺よりも短いノズルブロック５１を用い、このノズルブロック５１を２次元（水平Ｘ，Ｙ方向）に移動させるようにしているが、基板１の一辺よりもわずかに短く上記所定の範囲の一辺をカバーする長さを有するノズルブロックを用いた場合には、当該ノズルブロックをその一辺の直交する方向に往復させるだけで基板表面全面に上記と同様にフォトレジスト８を塗布することができる。また、この場合、ノズルブロックに列状に突設された針状ノズルのうち中央部のノズルの径を他のものより大きくすることで、基板表面の中央領域１ｂに比較的多くのフォトレジスト８を供給することができる。
【００２０】
また、上記の実施例では、ノズルブロック５１を矩形状（図２，図４参照）に揺動移動させているが、図５に示すように、基板１を回転させながらノズルブロック５１を円弧状に揺動させるようにしてもよい。また、上記実施例では、ノズルブロック５１を移動させるようにしているが、ノズル部５を固定させるとともに、基板１を移動させるようにしてもよく、要はノズル部５を基板１に対して相対移動させるようにすればよい。
【００２１】
また、ノズル５２の配列は一列配置に限定されるものではなく、スキャン方向Ｄに対し直交する方向に並ぶ複数の列状、例えば図６に示すように２列で配列してもよく、この場合ノズルブロック５１の長辺方向により多くのノズル５２を配列することができる。
【００２２】
また、上記実施例では１つのノズルブロック５１に８本の針状ノズル５２を取り付けているが、ノズルの本数はこれに限定されるものでなく、１本あるいは複数本取り付けることができる。また、１つのアーム６２に連結するノズルブロックの数も限定されるものではなく、複数個のノズルブロックを取り付けてもよい。さらに、アーム６２を複数個設けるようにしてもよい。
【００２３】
さらに、上記実施例ではノズルブロック５１に針状ノズル５２を突設してなるノズル部５を用いているが、ノズル部５の代わりに図７に示すような単一のスリット状の吐出口がその下端に形成され、スリットの長さは上記所定の範囲の一辺に対応する長さであるスリットノズル５′を用いてもよい。
【００２４】
【発明の効果】
以上のように、この発明によれば、ノズル部から基板の表面に向けて塗布液を吐出しながら前記ノズル部を前記基板の表面に対して相対移動して、前記基板の表面上で前記基板の表面よりも若干小さい所定の範囲に前記塗布液を供給するようにしているので、塗布液の使用量を減少させても基板の表面全体に塗布液を行き渡らせて基板の表面全体にその薄膜を形成することができる。
【図面の簡単な説明】
【図１】この発明にかかる塗布装置の一実施例を示す図である。
【図２】図１の塗布装置の部分斜視図である。
【図３】図１の装置における基板表面へのフォトレジストの供給状態を示す断面図である。
【図４】ノズルブロックのスキャン経路を示す図である。
【図５】この発明にかかる塗布装置の変形例を示す図である。
【図６】この発明にかかる塗布装置の別の変形例を示す図である。
【図７】この発明にかかる塗布装置のさらに別の変形例を示す図である。
【図８】従来における基板表面へのフォトレジストの供給状態を示す図である。
【符号の説明】
１ 基板
２ スピンチャック（基板支持手段）
３ 塗布液供給部
４ モータ（基板回転手段）
５ ノズル部
６ ３次元移動機構[0001]
[Industrial applications]
The present invention relates to a coating apparatus and a coating method for coating a predetermined coating liquid such as a photoresist on the surface of a substrate such as a silicon wafer for a semiconductor or a glass rectangular substrate for a liquid crystal.
[0002]
[Prior art]
Examples of this type of apparatus include an apparatus (spin coater) disclosed in Japanese Patent Publication No. 57-48980 and Japanese Patent Laid-Open Publication No. 1-135565. In these spin coaters, as shown in FIG. 8, a rotatable spin chuck 2 is provided, and the substrate 1 can be horizontally supported above the spin chuck 2. A single discharge port (not shown) is fixed above the center 1a of the surface of the substrate 1 supported by the spin chuck 2, and the photoresist 3 can be supplied to the center 1a of the surface of the substrate 1. ing. Further, in this apparatus, after the photoresist 3 from the discharge port is supplied to the center 1a of the front surface of the substrate 1, when the motor (not shown) connected to the spin chuck 2 is operated, the photoresist 3 is Is diffused over the entire surface to form a thin film having a constant thickness.
[0003]
[Problems to be solved by the invention]
However, in the conventional apparatus for supplying the photoresist 3 to one location as described above, unless the photoresist 3 in a sufficient amount for the size of the substrate is supplied on the substrate surface, the entire surface of the substrate 3 is required. It is difficult to form a thin film on the entire surface of the substrate by distributing the photoresist. Therefore, in the conventional apparatus, in order to form a thin film on the substrate surface, a much larger amount of the photoresist 3 is supplied to the substrate surface than necessary for forming the thin film. As a result, the amount of the photoresist 3 used increases. There is a problem.
[0004]
The present invention has been made in view of the above-described problems, and it is possible to form a thin film on the entire substrate surface by spreading the coating liquid over the entire substrate surface even when the amount of the coating liquid used is reduced. It is an object of the present invention to provide a simple coating apparatus and a coating method.
[0005]
[Means for Solving the Problems]
The invention of claim 1, by supplying a predetermined coating liquid on the surface of the substrate, a coating apparatus for forming a thin film on the surface of the substrate, a rotatable substrate supporting means for supporting the substrate in a horizontal state, a coating liquid supply means for supplying a coating solution to a predetermined range of the supporting surface of the substrate by the substrate supporting means, by rotating the substrate supporting means, the coating liquid supplied by the coating liquid supply means by rotating the substrate, the coating liquid supplied to the predetermined range of the surface of the substrate possess a substrate rotating means for diffusing the entire surface of the substrate, the coating liquid supplying means, the substrate supporting means A nozzle portion that extends in a first direction along the surface of the substrate supported by the substrate, and supplies a coating liquid to a linear region on the surface of the substrate along the first direction; Crossing the direction and said substrate Moving means for linearly moving in a second direction along the surface, wherein the predetermined range is a range slightly smaller than the surface of the substrate, and the nozzle portion has a slit shape extending along the first direction. Wherein the length of the discharge port in the first direction is a length corresponding to one side of the predetermined range .
The invention according to claim 2 is the coating apparatus according to claim 1, wherein the nozzle portion is disposed in the first direction on a side of the substrate supported by the substrate supporting means. The coating liquid is supplied to the linear region having a length shorter than the length of the side.
According to a third aspect of the present invention, there is provided a coating apparatus for forming a thin film on a surface of a substrate by supplying a predetermined coating liquid to the surface of the substrate, wherein the substrate supporting means is rotatable. Coating liquid supply means for supplying a coating liquid to a predetermined range slightly smaller than the surface of the substrate supported by the substrate support means, and coating by the coating liquid supply means by rotating the substrate support means. Substrate rotation means for rotating the substrate to which the liquid is supplied, and diffusing the coating liquid supplied to the predetermined area on the surface of the substrate over the entire surface of the substrate, wherein the coating liquid supply means A nozzle unit for supplying a coating liquid to the surface of the substrate supported by the substrate support unit, and a moving unit for moving the nozzle unit along the surface of the substrate, wherein the nozzle unit includes the substrate Supported by support means A slit nozzle having a slit-like discharge port extending in a first direction along the surface of the substrate, wherein the length of the discharge port in the first direction is a length corresponding to one side of the predetermined range. In a state where the substrate supporting means supporting the substrate is rotated by the substrate rotating means, the nozzle part is moved along the surface of the substrate by the moving means while discharging the coating liquid from the nozzle part. Then, the coating liquid is supplied to the predetermined range, and then the substrate supporting means is further rotated to diffuse the coating liquid on the surface of the substrate over the entire surface of the substrate.
According to a fourth aspect of the present invention, there is provided the coating apparatus according to the first to third aspects of the present invention, wherein the coating liquid is a photoresist.
[0006]
The invention of claim 5, for supplying a predetermined coating liquid to the surface of the square of the substrate, a coating method for forming a thin film on the surface of the substrate, the horizontal by the rotatable substrate supporting means of the substrate a step of supporting state, placing along the nozzle portion for supplying the coating solution to the linear region by the slit-shaped discharge opening, one side of the substrate supported by the substrate supporting means, said nozzle while ejecting a coating liquid from the section toward the surface of the substrate, the nozzle unit is moved along said surface of the substrate in a direction along the other side crossing the one side of the substrate, the surface of the substrate Supplying the coating liquid to a predetermined range slightly smaller than the above, and rotating the substrate in a state where the substrate is supported by the substrate supporting means, and applying the coating liquid supplied to the predetermined range to the surface of the substrate. possess a step of diffusing throughout Longitudinal length of the discharge port is a length corresponding to one side of the predetermined range.
According to a sixth aspect of the present invention, there is provided a coating method for forming a thin film on a surface of a substrate by supplying a predetermined coating solution to the surface of the substrate, wherein the substrate is supported in a horizontal state by rotatable substrate support means. And rotating the substrate by rotating the substrate supporting means, and moving the substrate on the rotating surface of the substrate while discharging the coating liquid from the nozzle portion, so that the predetermined amount is slightly smaller than the surface of the substrate. a step of supplying a coating solution in the range of, and then by further rotating the substrate supporting means, a coating solution of the surface of the substrate possess a step of diffusing the entire surface of the substrate, the nozzle unit, the It has a slit-shaped discharge port extending in a first direction along the surface of the substrate supported by the substrate support means, and the length of the discharge port in the first direction corresponds to one side of the predetermined range. Length.
[0007]
[Action]
In the present invention, the nozzle is relatively moved with respect to the surface of the substrate while the application liquid is being discharged from the nozzle toward the surface of the substrate. Therefore, the coating liquid slightly smaller predetermined range from the surface of the substrate on the surface of the substrate is provided. The substrate is supplied coating solution by the nozzle unit is rotated, the coating liquid is spread over the entire surface of the substrate by centrifugal force, a thin film of the coating solution is uniformly formed.
[0008]
【Example】
FIG. 1 is a view showing one embodiment of a coating apparatus according to the present invention. As shown in FIG. 1, the apparatus includes a spin chuck (substrate holding means) 2 for holding a substrate 1 in a horizontal state, and applying a predetermined coating solution to a surface of the substrate 1 supported by the spin chuck 2. And a motor (substrate rotating means) 4 connected to the spin chuck 2 and rotating the spin chuck 2.
[0009]
In the application liquid supply unit 3, a nozzle unit 5 for discharging the application liquid toward the surface of the substrate 1 supported by the spin chuck 2 is disposed above the spin chuck 2. As shown in FIG. 2, the nozzle portion 5 has eight needle-like nozzles 52 projecting downward from the bottom surface of a rectangular parallelepiped nozzle block 51 in a row at a constant pitch, for example, 10 mm in the longitudinal direction X.
[0010]
The three-dimensional moving mechanism 6 is connected to the nozzle block 51. The three-dimensional moving mechanism 6 has a column 61 which can be extended and contracted in the vertical direction Z, and one end connected to the top of the column 61 and a nozzle block 51 connected to the other end. An arm 62 is provided, and the moving speed of the column 61 in the horizontal X direction, the expansion and contraction of the column 61 in the vertical direction Z, and the expansion and contraction of the arm 62 in the horizontal Y direction are each controlled at a variable speed by a drive unit not shown. Thus, the nozzle unit 5 can be moved to an arbitrary position at an arbitrary speed. In order to move the column 61 in the horizontal X direction, expand and contract the column 61 in the vertical direction Z, and expand and contract the arm 62 in the horizontal Y direction, for example, a motor can be used as a drive source of the drive unit. In addition, other driving sources such as a cylinder can be used.
[0011]
Further, a supply unit 7 is connected to the nozzle unit 5 as shown in FIG. In the supply unit 7, a predetermined amount of the coating liquid in the coating liquid tank 71 is trapped in the trap tank 72, and by operating the pump 73, the coating liquid is supplied from the trap tank 72 through the pump 73 and the filter 74. It is provided to a temperature control unit 75 that performs temperature adjustment. Further, the application liquid adjusted to a predetermined temperature by the temperature control unit 75 is sent to the nozzle block 51 via the air valve 76 and the suck back mechanism 77 under pressure. Therefore, when the application liquid is pressure-fed to the nozzle unit 5 by the operation of the pump 73, the application liquid is discharged from the needle-shaped nozzle 52 toward the surface of the substrate 1 supported by the spin chuck 2. In this embodiment, by providing the suck-back mechanism 77, dripping of the coating liquid from the needle nozzle 52, that is, so-called "dropping" is effectively prevented. Further, instead of the pump 73, a nitrogen gas or air may be fed into the coating liquid tank 71 to increase the pressure in the tank 71 and feed the coating liquid under pressure.
[0012]
Next, an operation of forming a resist thin film by applying a coating liquid, for example, a photoresist by the coating apparatus configured as described above will be described. When the substrate 1 is transported onto the spin chuck 2 by a transport mechanism (not shown), the nozzle block 51 is moved from a nozzle evacuation pot (not shown) for preventing drying of the nozzle tip from an application start position (for example, the substrate shown in FIG. 2). 1 corresponding to the upper left corner and at a fixed height from the substrate surface).
[0013]
Subsequently, the nozzle block 51 is moved from one side to the other side of the substrate 1 in the horizontal (+ Y) direction while the photoresist is discharged from the needle nozzle 52 by operating the pump 73 (arrow A in FIG. 2). . In addition, the nozzle block 51 is moved in the horizontal (+ X) direction while discharging the photoresist (arrow B in the same drawing), and then moved to one side of the substrate 1 in the horizontal (-Y) direction (FIG. 2). Arrow C). Thereby, the nozzle block 51 scans the surface of the substrate 1 and the photoresist is supplied to the surface of the substrate 1 along the scan path.
[0014]
Further, the nozzle block 51 is moved in the horizontal X and horizontal Y directions while discharging the photoresist from the needle-shaped nozzle 52 in the same manner as described above until the nozzle block 51 scans the entire predetermined range smaller than the entire surface of the substrate 1. The photoresist is moved to supply the photoresist to the substrate surface. Thus, when the supply of the photoresist to the substrate surface is completed, the photoresist 8 is supplied to the entire surface of the substrate over a predetermined area smaller than the entire surface. FIG. 3 is a cross-sectional view of the substrate 1 in which the photoresist 8 has been supplied to the entire predetermined range.
[0015]
When the supply of the photoresist 8 to the substrate surface is completed as described above, the nozzle unit 5 is moved to the nozzle evacuation pot, and then the motor 4 is operated to rotate the substrate 1 integrally with the spin chuck 2. The photoresist 8 is diffused by centrifugal force, and the coating liquid is spread over the entire surface of the substrate, thereby forming a resist thin film on the substrate 1.
[0016]
As described above, in this embodiment, the photoresist (coating solution) 8 is supplied to the entire predetermined range of the substrate 1, so that the photoresist 8 is applied to the surface of the substrate slightly more than the amount required for forming a thin film. A desired thin film can be formed simply by supplying the photoresist, and as a result, the amount of photoresist used can be reduced.
[0017]
In the above embodiment, the substrate 1 is rotated after the photoresist 8 is supplied to the surface of the substrate. However, the substrate 1 is rotated at a low speed while scanning the nozzles as in the above embodiment. The application liquid may be supplied to the above predetermined range, and thereafter, the substrate 1 may be rotated at a high speed to diffuse the application liquid over the entire surface of the substrate.
[0018]
Also, when the substrate 1 is rotated, the photoresist 8 on the substrate surface tends to diffuse radially from the center of rotation, so that a relatively large amount of photoresist 8 is placed on the central region (region surrounded by a dotted line in FIG. 4) 1b of the substrate surface. When the photoresist 8 is supplied and a relatively small amount of the photoresist 8 is supplied on the other surface area, the amount of the photoresist supplied to the surface of the substrate 1 can be made close to the amount required for forming a thin film. The amount of the resist 8 used can be further reduced. Specifically, when scanning the nozzle block 51, the moving speed of the nozzle block 51 is reduced at a position corresponding to the central area 1b, that is, while scanning the path indicated by the dashed line in FIG. Can be increased.
[0019]
In the above embodiment, the nozzle block 51 whose long side is shorter than one side of the substrate 1 is used, and the nozzle block 51 is moved two-dimensionally (in the horizontal X and Y directions). When a nozzle block having a length slightly shorter than one side and covering one side of the predetermined range is used, the nozzle block is reciprocated in a direction perpendicular to the one side, and the entire surface of the substrate is similar to the above. Can be coated with a photoresist 8. In this case, by increasing the diameter of the central nozzle among the needle-like nozzles protruding in a row in the nozzle block from the other nozzles, a relatively large amount of photoresist 8 is formed in the central region 1b of the substrate surface. Can be supplied.
[0020]
Further, in the above embodiment, the nozzle block 51 is oscillated in a rectangular shape (see FIGS. 2 and 4). However, as shown in FIG. May be swung. In the above-described embodiment, the nozzle block 51 is moved. However, the nozzle unit 5 may be fixed and the substrate 1 may be moved. What is necessary is just to make it move.
[0021]
In addition, the arrangement of the nozzles 52 is not limited to one-row arrangement, but may be arranged in a plurality of rows arranged in a direction orthogonal to the scanning direction D, for example, two rows as shown in FIG. More nozzles 52 can be arranged in the long side direction of the nozzle block 51.
[0022]
In the above embodiment, eight needle-like nozzles 52 are attached to one nozzle block 51. However, the number of nozzles is not limited to this, and one or more nozzles can be attached. Also, the number of nozzle blocks connected to one arm 62 is not limited, and a plurality of nozzle blocks may be attached. Further, a plurality of arms 62 may be provided.
[0023]
Further, in the above-described embodiment, the nozzle unit 5 in which the needle-shaped nozzle 52 is protruded from the nozzle block 51 is used, but instead of the nozzle unit 5, a single slit-shaped discharge port as shown in FIG. A slit nozzle 5 ′ formed at the lower end and having a length corresponding to one side of the predetermined range may be used.
[0024]
【The invention's effect】
As described above, according to the present invention, the substrate of the nozzle portion while discharging the coating solution toward the surface of the substrate from the nozzle unit relative movement with respect to the surface of the substrate, on the surface of the substrate Since the coating liquid is supplied to a predetermined range slightly smaller than the surface of the substrate , even if the amount of the coating liquid used is reduced, the coating liquid is spread over the entire surface of the substrate , and the thin film is formed on the entire surface of the substrate. Can be formed.
[Brief description of the drawings]
FIG. 1 is a view showing one embodiment of a coating apparatus according to the present invention.
FIG. 2 is a partial perspective view of the coating apparatus of FIG.
FIG. 3 is a cross-sectional view showing a state of supplying a photoresist to a substrate surface in the apparatus of FIG.
FIG. 4 is a diagram illustrating a scan path of a nozzle block.
FIG. 5 is a view showing a modification of the coating apparatus according to the present invention.
FIG. 6 is a view showing another modification of the coating apparatus according to the present invention.
FIG. 7 is a view showing still another modified example of the coating apparatus according to the present invention.
FIG. 8 is a diagram showing a conventional state of supplying a photoresist to a substrate surface.
[Explanation of symbols]
1 substrate 2 spin chuck (substrate support means)
3 coating liquid supply unit 4 motor (substrate rotating means)
5 Nozzle unit 6 3D moving mechanism

Claims (6)

基板の表面に所定の塗布液を供給して、前記基板の表面に薄膜を形成する塗布装置において、
基板を水平状態で支持する回転可能な基板支持手段と、
前記基板支持手段により支持された前記基板の表面の所定の範囲に塗布液を供給する塗布液供給手段と、
前記基板支持手段を回転させることにより、前記塗布液供給手段によって塗布液が供給された前記基板を回転させて、前記基板の表面の前記所定の範囲に供給された塗布液を前記基板の表面全体に拡散させる基板回転手段と、
を有し、
前記塗布液供給手段が、
前記基板支持手段に支持される前記基板の表面に沿って第１方向に延び、前記基板の表面の前記第１方向に沿った線状の領域に塗布液を供給するノズル部と、
前記ノズル部を前記第１方向と交差し、かつ前記基板の表面に沿った第２方向に直線移動させる移動手段と、
を有し、
前記所定の範囲は、前記基板の表面より若干小さい範囲であり、
前記ノズル部は、前記第１方向に沿って伸びるスリット状の吐出口を有するスリットノズルであって、前記吐出口の前記第１方向の長さは、前記所定の範囲の一辺に対応する長さであることを特徴とする塗布装置。By supplying a predetermined coating liquid on the surface of the substrate, in the coating apparatus for forming a thin film on the surface of the substrate,
Rotatable substrate support means for supporting the substrate in a horizontal state,
Coating liquid supply means for supplying a coating liquid to a predetermined range of the surface of the substrate supported by the substrate supporting means ,
By rotating the substrate supporting means, said by coating liquid supply means rotating the substrate in which the coating liquid has been supplied, the entire surface of the substrate a coating solution supplied to the predetermined range of the surface of the substrate Substrate rotating means for diffusing the
Have a,
The coating liquid supply means,
A nozzle portion extending in a first direction along a surface of the substrate supported by the substrate support means and supplying a coating liquid to a linear region on the surface of the substrate along the first direction;
Moving means for linearly moving the nozzle portion in a second direction intersecting the first direction and along the surface of the substrate;
Has,
The predetermined range is a range slightly smaller than the surface of the substrate,
The nozzle portion is a slit nozzle having a slit-shaped discharge port extending along the first direction, and the length of the discharge port in the first direction is a length corresponding to one side of the predetermined range. coating and wherein the at. 前記ノズル部は、前記基板支持手段に支持された前記基板の辺のうち、前記第１方向に配置される辺の長さよりも短い長さの前記線状の領域に塗布液を供給するものであることを特徴とする請求項１に記載の塗布装置。The nozzle unit supplies the coating liquid to the linear region having a length shorter than the length of the side arranged in the first direction among the sides of the substrate supported by the substrate supporting means. The coating device according to claim 1, wherein the coating device is provided. 基板の表面に所定の塗布液を供給して、前記基板の表面に薄膜を形成する塗布装置において、In a coating apparatus for supplying a predetermined coating liquid to the surface of the substrate and forming a thin film on the surface of the substrate,
基板を水平状態で支持する回転自在な基板支持手段と、Rotatable substrate support means for supporting the substrate in a horizontal state,
前記基板支持手段に支持される前記基板の表面よりも若干小さい所定の範囲に塗布液を供給する塗布液供給手段と、Coating liquid supply means for supplying a coating liquid to a predetermined range slightly smaller than the surface of the substrate supported by the substrate supporting means,
前記基板支持手段を回転させることにより、前記塗布液供給手段によって塗布液が供給された前記基板を回転させて、前記基板の表面の前記所定の範囲に供給された塗布液を前記基板の表面全体に拡散させる基板回転手段と、By rotating the substrate supporting means, the substrate supplied with the coating liquid by the coating liquid supply means is rotated, and the coating liquid supplied to the predetermined area on the surface of the substrate is applied to the entire surface of the substrate. Substrate rotating means for diffusing the
を有し、Has,
前記塗布液供給手段が、The coating liquid supply means,
前記基板支持手段に支持される前記基板の表面に塗布液を供給するノズル部と、A nozzle unit for supplying a coating liquid to the surface of the substrate supported by the substrate supporting means,
前記ノズル部を前記基板の表面に沿って移動させる移動手段と、Moving means for moving the nozzle portion along the surface of the substrate,
を有し、Has,
前記ノズル部は、前記基板支持手段に支持される前記基板の表面に沿って第１方向に伸びるスリット状の吐出口を有するスリットノズルであって、前記吐出口の前記第１方向の長さは、前記所定の範囲の一辺に対応する長さであり、The nozzle portion is a slit nozzle having a slit-shaped discharge port extending in a first direction along the surface of the substrate supported by the substrate support means, and the length of the discharge port in the first direction is , A length corresponding to one side of the predetermined range,
基板を支持した前記基板支持手段を前記基板回転手段によって回転させた状態で、前記ノズル部から塗布液を吐出しつつ前記移動手段により前記ノズル部を前記基板の表面に沿って移動させて、前記所定の範囲に塗布液を供給し、その後さらに前記基板支持手段を回転させて前記基板の表面の塗布液を前記基板の表面全体に拡散させることを特徴とする塗布装置。In a state where the substrate supporting unit supporting the substrate is rotated by the substrate rotating unit, the nozzle unit is moved along the surface of the substrate by the moving unit while discharging the application liquid from the nozzle unit, A coating apparatus, comprising: supplying a coating liquid to a predetermined range; and further rotating the substrate supporting means to diffuse the coating liquid on the surface of the substrate over the entire surface of the substrate. 前記塗布液はフォトレジストであることを特徴とする請求項１乃至３のいずれかに記載の塗布装置。4. The coating apparatus according to claim 1, wherein the coating liquid is a photoresist. 角型の基板の表面に所定の塗布液を供給して、前記基板の表面に薄膜を形成する塗布方法において、In a coating method of supplying a predetermined coating liquid to the surface of the rectangular substrate and forming a thin film on the surface of the substrate,
基板を回転可能な基板支持手段により水平状態で支持する工程と、A step of supporting the substrate in a horizontal state by rotatable substrate support means,
スリット状の吐出口により線状の領域に塗布液を供給するノズル部を、前記基板支持手A nozzle part for supplying a coating liquid to a linear area by a slit-shaped discharge port is provided on the substrate supporting hand. 段に支持された前記基板の一辺に沿うように配置する工程と、Arranging along one side of the substrate supported by a step,
前記ノズル部から前記基板の表面に向けて塗布液を吐出しつつ、前記ノズル部を前記基板の前記一辺と交差する他辺に沿う方向に前記基板の表面に沿って移動させて、前記基板の表面よりも若干小さい所定の範囲に塗布液を供給する工程と、While discharging the coating liquid from the nozzle portion toward the surface of the substrate, the nozzle portion is moved along the surface of the substrate in a direction along another side that intersects the one side of the substrate to move the nozzle portion. A step of supplying the coating liquid to a predetermined range slightly smaller than the surface,
前記基板支持手段にて前記基板を支持した状態で当該基板を回転させて、前記所定の範囲に供給された塗布液を前記基板の表面全体に拡散させる工程と、Rotating the substrate in a state where the substrate is supported by the substrate supporting means, and diffusing the coating liquid supplied to the predetermined range over the entire surface of the substrate;
を有し、Has,
前記吐出口の長手方向の長さは、前記所定の範囲の一辺に対応する長さであることを特徴とする塗布方法。The coating method, wherein the length of the discharge port in the longitudinal direction is a length corresponding to one side of the predetermined range. 基板の表面に所定の塗布液を供給して、前記基板の表面に薄膜を形成する塗布方法において、A coating method for supplying a predetermined coating liquid to the surface of the substrate and forming a thin film on the surface of the substrate,
基板を回転可能な基板支持手段により水平状態で支持する工程と、A step of supporting the substrate in a horizontal state by rotatable substrate support means,
前記基板支持手段を回転させて前記基板を回転させつつ、ノズル部から塗布液を吐出しながら回転中の前記基板の表面上を移動させて、前記基板の表面よりも若干小さい所定の範囲に塗布液を供給する工程と、While rotating the substrate by rotating the substrate supporting means, the coating liquid is moved on the surface of the rotating substrate while discharging the application liquid from the nozzle portion, and is applied to a predetermined range slightly smaller than the surface of the substrate. Supplying a liquid;
その後さらに前記基板支持手段を回転させて、前記基板の表面の塗布液を前記基板の表面全体に拡散させる工程と、Thereafter, further rotating the substrate supporting means, the step of diffusing the coating liquid on the surface of the substrate over the entire surface of the substrate,
を有し、Has,
前記ノズル部は、前記基板支持手段により支持された前記基板の表面に沿った第１方向に伸びるスリット状の吐出口を有し、The nozzle portion has a slit-shaped discharge port extending in a first direction along a surface of the substrate supported by the substrate support means,
前記吐出口の前記第１方向の長さは、前記所定の範囲の一辺に対応する長さであることを特徴とする塗布方法。The coating method, wherein the length of the discharge port in the first direction is a length corresponding to one side of the predetermined range.
JP34614193A 1993-12-21 1993-12-21 Coating device and coating method Expired - Lifetime JP3597214B2 (en)

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JP3824054B2 (en) * 2000-03-24 2006-09-20 東京エレクトロン株式会社 Coating processing method and coating processing apparatus
JP4506118B2 (en) * 2003-07-02 2010-07-21 セイコーエプソン株式会社 Discharge device, color filter substrate manufacturing device, electroluminescence display device manufacturing device, plasma display device manufacturing device, wiring manufacturing device, and coating method.
KR100780718B1 (en) 2004-12-28 2007-12-26 엘지.필립스 엘시디 주식회사 Slit coater having apparatus of supplying coating fluid
KR100700180B1 (en) 2004-12-31 2007-03-27 엘지.필립스 엘시디 주식회사 Slit coater having pre-spreading unit and method of coating using thereof
KR100700181B1 (en) 2004-12-31 2007-03-27 엘지.필립스 엘시디 주식회사 Slit coater having standby unit of nozzle and method of coating using thereof
KR100675643B1 (en) 2004-12-31 2007-02-02 엘지.필립스 엘시디 주식회사 Slit coater
US8707890B2 (en) 2006-07-18 2014-04-29 Asml Netherlands B.V. Imprint lithography

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