JP3595385B2 - Terminal and lead wire joining structure and terminal and lead wire joining method - Google Patents

Terminal and lead wire joining structure and terminal and lead wire joining method Download PDF

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JP3595385B2
JP3595385B2 JP22107695A JP22107695A JP3595385B2 JP 3595385 B2 JP3595385 B2 JP 3595385B2 JP 22107695 A JP22107695 A JP 22107695A JP 22107695 A JP22107695 A JP 22107695A JP 3595385 B2 JP3595385 B2 JP 3595385B2
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Prior art keywords
lead wire
terminal
folded piece
substrate
spot welding
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JPH0950830A (en
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正浩 池島
高志 坂巻
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Niles Co Ltd
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Niles Co Ltd
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Description

【０００１】
【産業上の利用分野】
この発明は、ターミナルと一本の線材で構成されたリード線との接合部構造及びターミナルとリード線の接合方法に関するものである。
【０００２】
【従来の技術】
従来、ターミナルに上記リード線を接合する場合は、図８に示す様に、ターミナル２３上にリード線２６を載置し、両者を直接スポット溶接２７することが行われている。
【０００３】
【発明が解決しようとする課題】
しかしながら、ターミナル２３とリード線２６との接合後、両者を引き離す方向に力が加わった場合、接合強度が十分でないとリード線２６が外れたり、あるいはスポット溶接時の加圧力が大きすぎると接合部近傍でリード線２６が切断してしまうことがあった。
【０００４】
そこで、両者の接合強度、品質を確保するため、スポット溶接時の電流値、通電時間等という通常の管理に加え、リード線２６のつぶれ量を管理項目として加える必要があり、管理が複雑になると共に、生産性が悪いという問題があった。
【０００５】
本発明は、上記従来の問題点に鑑みなされたもので、ターミナルとリード線との接合部の強度及び品質が高く、且つ特別な管理項目を必要とすることのない、比較的簡単な工程で得られる接合部構造及びターミナルとリード線の接合方法を提供することを目的とするものである。
【０００６】
【課題を解決するための手段】
上記目的を達成するため、請求項１の発明では、ターミナルの基板に一本の線材からなるリード線を溶接により接合する構造において、前記ターミナルの基板に折返し片を設け、上記折返し片の基部に、強度の小さい首部を設けると共に、上記折返し片が上記基板に載置した上記リード線上に折り曲げ形成され、該リード線を上記基板と上記折返し片との間に挟持した状態でスポット溶接により結合し、前記ターミナル表面のメッキ層が融けて形成された合金層により前記リード線及びターミナル間が結合され、前記リード線の被覆部及びターミナルがつぶれていると共に前記折返し片が前記基板に対して平行に形成され、かつ前記基板と折返し片との間に隙間を設けたことを特徴としている。
【０００７】
また、請求項２の発明は、、リード線が先端に感温素子を接続し、上記ターミナルは、樹脂ケースを樹脂成形するときの位置決め用突起を先端部に有し、上記リード線接合部とは反対側の端部を除いて前記感温素子から接合部までを上記樹脂ケースを形成する樹脂で覆ったことを特徴とする構造である。
【０００８】
請求項３の発明は、基板及び折返し片を有するターミナルを板材より打ち抜く工程と、上記折返し片を基板上に略直角に折り曲げ成形する工程と、上記折返し片をリード線上に折り曲げる工程と、上記リード線を狭持した基板と折返し片を電極間に挟んで加圧、通電するスポット溶接の工程、を有すると共に、上記折返し片を基板上に略直角に折り曲げる工程において、基板と折返し片との間に、リード線の半径より大きな半径を有する湾曲部を形成し、上記スポット溶接の工程において、スポット溶接の電極の直径が、折返し片のリード線方向寸法より大きいものを用い、前記スポット溶接時の電極による加圧、通電時に折返し片が基板に対し平行状態を保ちつつ隙間を維持することを特徴とするターミナルとリード線の接合方法。
【０００９】
【実施例】
図１は、本発明を水温センサに適用した実施例を示すもので、この水温センサ１は、センサ部２とターミナル３及び樹脂ケース４で構成している。センサ部２は感温素子としてのサーミスタ５と、そこから延びる２本のリード線６，６からなり、各リード線６，６はサーミスタ５のガラス被覆部との馴染みを良くするため各々一本の鉄−ニッケル合金線に銅被覆を施したジュメット線を用い、その端部６ａ，６ｂを２つのターミナル３，３にそれぞれ接合する。樹脂ケース４は、例えばナイロンを素材としたもので、ターミナル３のリード線６との接合部とは反対側の端部を残して、サーミスタ５、リード線６、及びターミナル３のリード線５との接合部を覆っており、更に上記ターミナル３露出端部３５の周りを距離を設けて壁４ａで囲み、コネクタ７を形成している。
【００１０】
図２は、樹脂ケース４で覆う前の状態におけるセンサ部２とターミナル３との接合部分を示すもので、ターミナル３は、リン青銅板の表面に錫メッキした母材をプレスにより打抜き形成したもので、一端に後述のインサート成形時の位置決め用突起３４を有する長方形状の基板３１と、基板３１の位置決め用突起３４隣接部位において一側外方へ延びる折返し片３２と、この折返し片３２と基板３１とを結ぶ首部３３とからなっている。折返し片３２は、折返し片３２が連なる基板３１の幅ｗ1と同じ幅寸法ｗ2（＝ｗ1）を有しており、リード線６長手方向にはリード線６の接合時に必要な接合強度が得られる長さ寸法ｌを有している（図３（ａ））。一方首部３３は、折返し片３２を基板３１と平行位置まで曲げていく時（図３（ｂ））、折返し片３２及び基板３１そのものが変形することなく首部３３のみが変形する様に、曲げ強度を折返し片３２よりも小さく設定してあり、本実施例では基板３１、折返し片３２と同一の板厚でそのリード線６長手方向寸法を折返し片３２よりも所定寸法小さくすることにより、又、それに直交する方向には、折返し片３２を基板３１と平行に折り曲げるとき、リード線６直径に相当する空間を確保できるだけの寸法とすることにより上記の条件を満足させている。
【００１１】
次に、この水温センサ１の製造方法について説明する。まず、錫メッキを施したリン青銅板から所定形状のターミナル３をプレスにて打抜き（図４（ａ））、その後折返し片３２を首部３３から基板３１に対して略直角に折り曲げる（図４（ｂ））。この時、基板３１と折返し片３２とを結ぶ首部３３には、リード線６の半径ｒ１より大きな半径ｒ２（＞ｒ１）の湾曲部３６が形成される様、型８に沿って折り曲げる。
【００１２】
次に、サーミスタ５の各リード線６，６を、それぞれ平行に位置決めした２つのターミナル基板３１，３１上に、各リード線６，６の先端が折返し片３２，３２より突出する様に載置し（図４（ｃ））、折返し片３２をリード線６上に基板３１と平行となる様折り曲げる（図４（ｄ），（ｅ））。ここで、折返し片３２は基板３１と同じ幅寸法ｗ２を有しているので、加工工程中にリード線６位置が多少ずれても、基板３１の幅寸法ｗ１内であれば確実に両者間に挟持できる。又、首部３３の曲げ強度を折返し片３２より小さく、且つ首部３３にリード線６半径より大きな半径の湾曲部３６を形成しているので、基板３１、折返し片３２が変形することなく、確実に首部３３から折返し片３２と基板３１とがリード線６の直径に相当する空間を有して平行になる様折り曲げることができる。尚、基板３１へリード線６を載置する前に、折返し片３２を基板３１に対して直角に曲げておくのは、上記の通り首部３３に湾曲部３６を形成すると共に、リード線６載置後の工程を少なくすることにより、リード線６の位置ずれを少なくするためである。
【００１３】
続いて、基板３１下面と折返し片３２上面とにスポット溶接機の電極９，９を押し当て、電極９，９により基板３１、リード線６、折返し片３２の接合部を加圧し、両電極９，９間に通電する（図４（ｆ））。
この場合、電極９，９は折返し片３２のリード線６長手方向寸法ｌより直径ｄの大きなもの（ｄ＞ｌ）を用いることにより、折返し片３２を介して、リード線６の被挟持部全体を均一に加圧、通電できるようにし、十分な接合面積を確保すると共に、溶接強度のバラツキが出ない様にしている。
【００１４】
そして、所定時間通電後、両電極９，９を後退させる。この接合部は、図５に示す通り、リード線６の先端より若干内側部位を基板３１と折返し片３２とで挟持加圧することにより、ターミナル６より硬度の低いジュメット線の銅被覆部がまずつぶれ、その後ターミナル３がつぶれる。更に通電時の発熱により融点の低い錫メッキ層が融けてリード線６、ターミナル３間で合金層を形成し、結合を確実なものとしている。また、リード線６の先端が折り返し片３２から突出する様に挟持されるので、折返し片３２の被挟持部全体を総て有効に接合に利用できる。
【００１５】
次に、接合されたセンサ部２とターミナル３とを樹脂成形金型に入れて樹脂ケース４を成形する。この金型は、図６に示す通り、上型１１、下型１２、及びスライドブロック１３で構成されており、ターミナル３の位置決め用突起３４用の第１支持部１３ａと、サーミスタ５用の第２支持部１３ｂを有するスライドブロック１３は、上型１１に対してスプリング１４により突出方向に付勢されている。
【００１６】
従って、樹脂ケース４を成形する場合、先ずターミナル３端部を下型１２に位置決め保持し、続いてスライドブロック１３と共に上型１１を下型１２に被せる。この時、スライドブロック１３の第１支持部１３ａでターミナル３の位置決め用突起３４を、第２支持部１３ｂでサーミスタ５を位置決め保持する。
【００１７】
そして、ゲートより溶融樹脂を注入すると、上型１１と下型１２との空間内に溶融樹脂が満たされ、さらに注入を続けると、その圧力によりスプリング１４の付勢力に抗してスライドブロック１３が徐々に後退し、サーミスタ５とスライドブロック１３の第２支持部１３ｂとの間にも樹脂が流入してサーミスタ５を樹脂で被覆した状態となる。以上の工程を経た後、成形金型を冷却し、成形金型から取り出して水温センサ１が完成する。
【００１８】
尚、樹脂成形された状態では、ターミナル３の基板３１に対し、折返し片３２が積層された状態となるので、コネクタ７への脱着時にターミナル３の長手方向に力が加わるが、この力を前記積層部で受けることができ、ターミナル３とリード線６との接合部において両者の引外し方向の力が直接加わることを防止できる。
【００１９】
尚、上記実施例ではターミナル３の首部３３を折返し片３２のリード線６長手方向より小さくしているが、この寸法は折返し片３２と同じあるいは大きくして、板厚を折返し片３２より薄くすることにより所定の性能を得る様にしても良い。
【００２０】
更に、上記実施例では、水温センサにおけるリード線とターミナルとの接合部に適用した例を示したが、本発明はこれに限らず、他の温度センサを初め、各種接合部に用いることができ、要は一本のリード線をターミナルに接合する場合にはどこでも適用可能である。
【００２１】
【発明の効果】
以上、請求項１の発明では、リード線をターミナルの基板と折返し片とで挟持した状態でスポット溶接により結合しているので、大きな接合面積を得ることができ、両者を引き離す方向に力が加わった場合でも、外れたり切断することのない確実な接合構造が得られる。また、請求項１の発明では、折返し片が前記基板に対して平行に形成されているので、リード線を直接位置決め保持しなくても、折返し片が基板と非平行状態でリード線に接触して、リード線が首部に近付いたり離れたりすることがなく、接合部の結合が確実である。さらに、前記ターミナル表面のメッキ層が融けて形成された合金層により前記リード線及びターミナル間が結合され、前記リード線の被覆部及びターミナルがつぶれていると共に前記折返し片が前記基板に対して平行に形成され、かつ前記基板と折返し片との間に隙間を設けたため、リード線の潰れを抑制することができる。
【００２３】
請求項２の発明では、感温素子から接合部までを樹脂ケースで覆ったものに適用した場合、折返し片が基板に対し積層された状態となっている事により、ターミナルに対するコネクタ脱着等による外力が働いても、積層状態の折返し片が樹脂ケース引っ掛かりターミナルが抜けたり、リード線とターミナルとの接合部に両者を引き離す力が働くのを防止できる。
【００２４】
また請求項３に示す接合方法では、スポット溶接時の電極による加圧、通電時に折返し片が基板に対し平行状態を保ちつつ隙間を維持するので、リード線を直接保持しなくてもリード線が近付いたり遠ざかる方向に動いてしまうことがなく、安定した溶接を行い、確実な接合を得ることができる。また基板と折返し片の両者に大きな面積でリード線を接合しているので、従来の様にリード線のつぶれ量を管理する必要もなく、生産性が向上する。また、スポット溶接時の電極による加圧、通電時に折返し片が基板に対し平行状態を保ちつつ隙間を維持するため、折返し片がリード線を基板との間から押し出したりするこなく、安定した状態を確保できる。また、請求項３の発明では、折返し片のリード線長さ方向寸法より大きな電極でスポット溶接することにより、折返し片を介してリード線の被狭持部全体を均一に加圧、通電できるので、外れ難く安定した接合品質を得ることができる。
【図面の簡単な説明】
【図１】この発明を水温センサに適用した実施例を示す一部破断正面図である。
【図２】図１に示す水温センサの樹脂ケースを除いた平面図である。
【図３】この発明のターミナルの一実施例を示す平面図である。
【図４】この発明の接合工程を示す図である。
【図５】図３に示すターミナルを用いた接合部構造を示す斜視図である。
【図６】図１に示す水温センサの樹脂ケースを成形する金型構造を示す断面図である。
【図７】図６に示す金型で樹脂ケースを成形した状態を示す断面図である。
【図８】従来の接合部構造を示す正面図である。
【符号の説明】
１ 水温センサ
３ ターミナル
４ 樹脂ケース
５ ターミナル（感温素子）
６ リード線
９ 電極
３１ 基板
３２ 折返し片
３３ 首部
３６ 湾曲部[0001]
[Industrial applications]
The present invention relates to a joint structure between a terminal and a lead wire made of a single wire, and a method for joining a terminal and a lead wire.
[0002]
[Prior art]
Conventionally, when the above-mentioned lead wire is joined to a terminal, as shown in FIG. 8, a lead wire 26 is placed on a terminal 23, and both are directly spot-welded 27.
[0003]
[Problems to be solved by the invention]
However, when a force is applied in a direction in which the terminal 23 and the lead wire 26 are separated from each other after the connection, the lead wire 26 may come off if the bonding strength is not sufficient, or if the pressing force during spot welding is too large, the bonding portion In some cases, the lead wire 26 was cut off in the vicinity.
[0004]
Therefore, in order to secure the joining strength and quality of the two, it is necessary to add the amount of crushing of the lead wire 26 as a management item in addition to the usual management such as the current value and the energizing time during spot welding, which complicates the management. In addition, there was a problem that productivity was poor.
[0005]
The present invention has been made in view of the above-described conventional problems, and has a relatively simple process that has high strength and quality of a joint between a terminal and a lead wire and does not require a special management item. It is an object of the present invention to provide an obtained joint structure and a method for joining a terminal and a lead wire.
[0006]
[Means for Solving the Problems]
To achieve the above object, in the invention of claim 1, in the structure for joining by welding the lead wire made of a single wire to the substrate of the terminal, a folded piece provided on the substrate of the terminal, the base of the folded piece A small-strength neck portion is provided, and the folded piece is formed by bending on the lead wire placed on the board , and the lead wire is joined by spot welding while being sandwiched between the board and the folded piece. The lead wire and the terminal are joined by an alloy layer formed by melting the plating layer on the terminal surface, the covering part and the terminal of the lead wire are crushed, and the folded piece is parallel to the substrate. It is characterized in that a gap is formed between the substrate and the folded piece .
[0007]
Further, according to the invention of claim 2 , a lead wire connects a temperature sensing element to a tip, the terminal has a positioning projection at a tip portion when a resin case is molded with a resin, and the terminal has a lead wire joint portion. Is a structure characterized by covering from the temperature-sensitive element to the joint except for the end on the opposite side with the resin forming the resin case .
[0008]
The invention according to claim 3 includes a step of punching out a terminal having a substrate and a folded piece from a plate material, a step of bending and forming the folded piece on the substrate at a substantially right angle, a step of bending the folded piece on a lead wire, pressure across the substrate and folded piece which is sandwiched a line between the electrodes, the step of spot welding to be energized, and having a, in the step of bending at substantially right angles the folded piece on the substrate, between the substrate and the folded piece to form a curved portion having a radius greater than the radius of the lead wire, in the step of the spot welding, spot welding electrode diameter is, using a lead dimension larger ones of the folded pieces, at the time of the spot welding A method of joining a terminal and a lead wire, wherein a gap is maintained while a folded piece is kept parallel to a substrate when pressure and current are applied by an electrode .
[00 09 ]
【Example】
FIG. 1 shows an embodiment in which the present invention is applied to a water temperature sensor. The water temperature sensor 1 includes a sensor section 2, a terminal 3, and a resin case 4. The sensor unit 2 includes a thermistor 5 as a temperature sensing element and two lead wires 6 and 6 extending from the thermistor. Each of the lead wires 6 and 6 is one in order to improve familiarity with the glass coating portion of the thermistor 5. The end portions 6a and 6b are joined to the two terminals 3 and 3, respectively, using a dumet wire obtained by applying a copper coating to the iron-nickel alloy wire. The resin case 4 is made of, for example, nylon, and is connected to the thermistor 5, the lead wire 6, and the lead wire 5 of the terminal 3 except for the end opposite to the junction with the lead wire 6 of the terminal 3. The connector 7 is formed by surrounding the terminal 3 exposed end portion 35 with a distance and surrounding it with a wall 4a.
[0010]
FIG. 2 shows a joint portion between the sensor unit 2 and the terminal 3 before being covered with the resin case 4, and the terminal 3 is formed by stamping a surface of a phosphor bronze plate with a tin-plated base material by pressing. A rectangular substrate 31 having a positioning projection 34 at the time of insert molding described later at one end, a folded piece 32 extending outward on one side at a position adjacent to the positioning projection 34 of the substrate 31, and the folded piece 32 and the substrate And a neck part 33 connecting the base part 31 with the base part 31. The folded piece 32 has the same width dimension w2 (= w1) as the width w1 of the substrate 31 on which the folded piece 32 is continuous, and a required joining strength is obtained in the longitudinal direction of the lead wire 6 when the lead wire 6 is joined. It has a length dimension 1 (FIG. 3A). On the other hand, the bending strength of the neck 33 is such that when the folded piece 32 is bent to a position parallel to the substrate 31 (FIG. 3B), only the neck 33 is deformed without deforming the folded piece 32 and the substrate 31 itself. Yes set smaller than the folded piece 32, by decreasing the predetermined size than the substrate 31, the folded piece 32 same thickness at its lead wire 6 and the longitudinal dimension folded piece 32 in this embodiment, also, In a direction perpendicular to the above , the above-mentioned condition is satisfied by making the dimension sufficient to secure a space corresponding to the diameter of the lead wire 6 when the folded piece 32 is bent in parallel with the substrate 31.
[00 11]
Next, a method of manufacturing the water temperature sensor 1 will be described. First, a terminal 3 having a predetermined shape is punched out from a tin-plated phosphor bronze plate by a press (FIG. 4A), and then the folded piece 32 is bent from the neck 33 at a substantially right angle to the substrate 31 (FIG. b)). At this time, bending is performed along the mold 8 so that a curved portion 36 having a radius r2 (> r1) larger than the radius r1 of the lead wire 6 is formed in the neck portion 33 connecting the substrate 31 and the folded piece 32.
[00 12 ]
Next, the lead wires 6, 6 of the thermistor 5 are placed on the two terminal boards 31, 31, which are positioned in parallel with each other, such that the tips of the lead wires 6, 6 protrude from the folded pieces 32, 32. Then, the folded piece 32 is folded on the lead wire 6 so as to be parallel to the substrate 31 (FIGS. 4D and 4E). Here, since the folded piece 32 has the same width dimension w2 as the substrate 31, even if the position of the lead wire 6 is slightly displaced during the processing step, if the position is within the width dimension w1 of the substrate 31, it is ensured between them. Can be pinched. Also, since the bending strength of the neck 33 is smaller than that of the folded piece 32 and the neck 33 is formed with a curved portion 36 having a radius larger than the radius of the lead wire 6, the substrate 31 and the folded piece 32 are securely deformed. From the neck 33, the folded piece 32 and the substrate 31 can be bent so as to be parallel with a space corresponding to the diameter of the lead wire 6. It is to be noted that the bent piece 32 is bent at a right angle to the substrate 31 before the lead wire 6 is mounted on the substrate 31 because the curved portion 36 is formed in the neck 33 and the lead wire 6 is mounted on the neck 33 as described above. This is for reducing the displacement of the lead wire 6 by reducing the number of steps after the placement.
[0013]
Subsequently, the electrodes 9, 9 of the spot welding machine are pressed against the lower surface of the substrate 31 and the upper surface of the folded piece 32, and the joint between the substrate 31, the lead wire 6, and the folded piece 32 is pressed by the electrodes 9, 9. , 9 (FIG. 4 (f)).
In this case, by using the electrodes 9 having a diameter d (d> l) larger than the length l of the lead piece 6 in the longitudinal direction l of the lead piece 32, the entire sandwiched portion of the lead wire 6 via the return piece 32 is used. To ensure uniform pressurization and energization to ensure a sufficient joint area and prevent variations in welding strength .
[00 14 ]
Then, after energizing for a predetermined time, both electrodes 9, 9 are retracted. As shown in FIG. 5, the copper coating portion of the dumet wire having a lower hardness than the terminal 6 is first crushed by pinching and pressing a portion slightly inside the tip of the lead wire 6 between the substrate 31 and the folded piece 32 as shown in FIG. Then, Terminal 3 is crushed. Further, the tin plating layer having a low melting point is melted by the heat generated at the time of energization, and an alloy layer is formed between the lead wire 6 and the terminal 3 to secure the connection. In addition, since the leading end of the lead wire 6 is sandwiched so as to protrude from the folded piece 32, the entire clamped portion of the folded piece 32 can be effectively used for joining.
[00 15 ]
Next, the joined sensor unit 2 and terminal 3 are put into a resin molding die to form a resin case 4. As shown in FIG. 6, the mold includes an upper mold 11, a lower mold 12, and a slide block 13. The first support 13 a for the positioning protrusion 34 of the terminal 3 and the first support 13 a for the thermistor 5. The slide block 13 having the two support portions 13 b is urged by the spring 14 in the projecting direction with respect to the upper die 11.
[00 16]
Therefore, when molding the resin case 4, first, the end of the terminal 3 is positioned and held on the lower die 12, and then the upper die 11 is put on the lower die 12 together with the slide block 13. At this time, the positioning projection 34 of the terminal 3 is held by the first support 13a of the slide block 13, and the thermistor 5 is held by the second support 13b.
[00 17]
When the molten resin is injected from the gate, the space between the upper mold 11 and the lower mold 12 is filled with the molten resin. When the injection is continued, the slide block 13 is pressed against the urging force of the spring 14 by the pressure. The resin gradually retreats, and the resin flows into the space between the thermistor 5 and the second support portion 13b of the slide block 13 to cover the thermistor 5 with the resin. After the above steps, the mold is cooled, taken out of the mold, and the water temperature sensor 1 is completed.
[00 18 ]
In the resin-molded state, the folded pieces 32 are laminated on the substrate 31 of the terminal 3, so that a force is applied in the longitudinal direction of the terminal 3 when the terminal 3 is attached to or detached from the connector 7. It can be received by the laminated portion, and it is possible to prevent a force in the direction of tripping of the terminal 3 and the lead wire 6 from being directly applied at the joint portion.
[00 19 ]
In the above embodiment, the neck 33 of the terminal 3 is smaller than the longitudinal direction of the lead wire 6 of the folded piece 32. However, this dimension is the same as or larger than the folded piece 32, and the plate thickness is made thinner than the folded piece 32. Thus, a predetermined performance may be obtained.
[00 20 ]
Furthermore, in the above embodiment, an example in which the present invention is applied to a junction between a lead wire and a terminal in a water temperature sensor is shown. However, the present invention is not limited to this, and other temperature sensors can be used, and various junctions can be used. In short, it can be applied anywhere when one lead wire is joined to the terminal.
[0021]
【The invention's effect】
As described above, according to the first aspect of the present invention, since the lead wire is joined by spot welding while being sandwiched between the substrate of the terminal and the folded piece, a large joining area can be obtained, and a force is applied in the direction of separating the two. In this case, a reliable joint structure that does not come off or cut is obtained. Further, in the invention of claim 1, since the folded piece is formed parallel to the substrate, without directly positioning holding the lead wire, folded piece is in contact with the lead wire in a non-parallel state to the substrate Te, without lead wire and away from the neck, is Ru ensure der coupling junction. Further, the lead wire and the terminal are joined by an alloy layer formed by melting the plating layer on the terminal surface, the covering portion and the terminal of the lead wire are crushed, and the folded piece is parallel to the substrate. In addition, since a gap is provided between the substrate and the folded piece, the collapse of the lead wire can be suppressed.
[0023]
According to the second aspect of the present invention, when the present invention is applied to a structure in which the portion from the temperature sensing element to the joining portion is covered with a resin case, since the folded pieces are stacked on the substrate , an external force caused by detaching a connector from the terminal or the like. , The folded pieces in the stacked state can be prevented from being caught in the resin case and the terminal coming off, and a force for separating the lead wire and the terminal can be prevented from acting on the joint.
[0024]
In the bonding method according to the third aspect, the gap is maintained while the folded piece keeps the parallel state to the substrate when the electrode is pressurized and energized during spot welding , so that the lead wire can be formed without directly holding the lead wire. Stable welding is performed without moving in the direction of approaching or moving away, and reliable joining can be obtained. Further, since the lead wire is joined to both the substrate and the folded piece with a large area, there is no need to control the amount of crushing of the lead wire as in the related art, and the productivity is improved. In addition, when the electrode is pressurized and spot energized during spot welding, the folded piece keeps the gap while maintaining the parallel state with the board, so the folded piece does not push the lead wire from between the board and the stable state. Can be secured. According to the third aspect of the present invention, the entire portion to be held of the lead wire can be uniformly pressurized and energized through the folded piece by spot welding with an electrode larger than the length of the folded piece in the length direction of the lead wire. It is possible to obtain a stable joining quality that is hard to come off.
[Brief description of the drawings]
FIG. 1 is a partially broken front view showing an embodiment in which the present invention is applied to a water temperature sensor.
FIG. 2 is a plan view of the water temperature sensor shown in FIG. 1 excluding a resin case.
FIG. 3 is a plan view showing an embodiment of the terminal of the present invention.
FIG. 4 is a view showing a joining step of the present invention.
FIG. 5 is a perspective view showing a joint structure using the terminal shown in FIG. 3;
FIG. 6 is a sectional view showing a mold structure for molding a resin case of the water temperature sensor shown in FIG. 1;
FIG. 7 is a cross-sectional view showing a state where a resin case is molded with the mold shown in FIG.
FIG. 8 is a front view showing a conventional joint structure.
[Explanation of symbols]
1 Water temperature sensor 3 Terminal 4 Resin case 5 Terminal (temperature sensing element)
6 Lead wire 9 Electrode 31 Substrate 32 Folded piece 33 Neck 36 Curved portion

Claims (3)

ターミナルの基板に一本の線材からなるリード線を溶接により接合する構造において、
上記ターミナルの基板に折返し片を設け、
上記折返し片の基部に、強度の小さい首部を設けると共に、上記折返し片が上記基板に載置した上記リード線上に折り曲げ形成され、
該リード線を上記基板と上記折返し片との間に挟持した状態でスポット溶接により結合し、
前記ターミナル表面のメッキ層が融けて形成された合金層により前記リード線及びターミナル間が結合され、
前記リード線の被覆部及びターミナルがつぶれていると共に前記折返し片が前記基板に対して平行に形成され、かつ前記基板と折返し片との間に隙間を設けたことを特徴とするターミナルとリード線の接合部構造。In a structure in which a lead wire made of one wire is joined to the terminal board by welding,
A folded piece is provided on the board of the terminal,
At the base of the folded piece, a small neck is provided with a small strength, and the folded piece is formed by bending on the lead wire mounted on the substrate ,
The lead wire is joined by spot welding while being sandwiched between the substrate and the folded piece ,
The lead wire and the terminal are joined by an alloy layer formed by melting a plating layer on the terminal surface,
The terminal and the lead wire, wherein the covering portion and the terminal of the lead wire are crushed and the folded piece is formed parallel to the substrate, and a gap is provided between the substrate and the folded piece. Joint structure. 上記リード線は、先端に感温素子を接続し、
上記ターミナルは、樹脂ケースを樹脂成形するときの位置決め用突起を先端部に有し、上記リード線接合部とは反対側の端部を除いて前記感温素子から接合部までを上記樹脂ケースを形成する樹脂で覆ったことを特徴とする請求項１記載の接合部構造。Connect the temperature-sensitive element to the tip of the lead wire,
The terminal has a positioning projection at the tip end when the resin case is molded with the resin, and the resin case extends from the temperature sensing element to the joint except for the end opposite to the lead wire joint. The joint structure according to claim 1, wherein the joint structure is covered with a resin to be formed. 基板及び折返し片を有するターミナルを板材より打ち抜く工程と、
上記折返し片を基板上に略直角に折り曲げ成形する工程と、
上記折返し片をリード線上に折り曲げる工程と、
上記リード線を狭持した基板と折返し片を電極間に挟んで加圧、通電するスポット溶接の工程、を有すると共に、
上記折返し片を基板上に略直角に折り曲げる工程において、基板と折返し片との間に、リード線の半径より大きな半径を有する湾曲部を形成し、
上記スポット溶接の工程において、スポット溶接の電極の直径が、折返し片のリード線方向寸法より大きいものを用い、
前記スポット溶接時の電極による加圧、通電時に折返し片が基板に対し平行状態を保ちつつ隙間を維持することを特徴とするターミナルとリード線の接合方法。 A step of punching a terminal having a substrate and a folded piece from a plate material,
A step of bending and forming the folded piece at a substantially right angle on a substrate ,
A step of bending the folded piece on a lead wire,
With a step of spot welding in which the substrate and the folded piece sandwiching the lead wire are sandwiched between the electrodes and pressurized and energized,
In the step of bending the folded piece on the substrate at a substantially right angle, a curved portion having a radius larger than the radius of the lead wire is formed between the substrate and the folded piece,
In the step spot welding, the diameter of the spot welding electrodes, using a lead dimension larger ones of the folded pieces,
A method for joining a terminal and a lead wire, wherein a gap is maintained while the folded piece is kept parallel to the substrate when the electrode is pressurized and energized during the spot welding .
JP22107695A 1995-08-07 1995-08-07 Terminal and lead wire joining structure and terminal and lead wire joining method Expired - Fee Related JP3595385B2 (en)

Priority Applications (1)

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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22107695A JP3595385B2 (en) 1995-08-07 1995-08-07 Terminal and lead wire joining structure and terminal and lead wire joining method

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JPH11176552A (en) * 1997-12-11 1999-07-02 Hitachi Cable Ltd Terminal and conductor connecting method
JP4923188B2 (en) * 2005-11-21 2012-04-25 株式会社テージーケー Motor actuator
JP2010027316A (en) * 2008-07-17 2010-02-04 Omron Corp Welding method and welding structure of conductive terminal
JP2011038832A (en) * 2009-08-07 2011-02-24 Sumitomo Wiring Syst Ltd Temperature sensor and method for manufacturing the same
JP4827961B2 (en) 2009-10-19 2011-11-30 三菱電機株式会社 Flow measuring device
JP5689710B2 (en) * 2011-03-02 2015-03-25 木谷電器株式会社 Electrical connection structure of terminal box to solar cell module
CN104772548B (en) * 2014-12-26 2017-05-03 中国航天科技集团公司第五研究院第五一三研究所 Electric connector welding and clamping device

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