JP3533073B2 - PCB mounting structure for electronic components - Google Patents
PCB mounting structure for electronic componentsInfo
- Publication number
- JP3533073B2 JP3533073B2 JP26496597A JP26496597A JP3533073B2 JP 3533073 B2 JP3533073 B2 JP 3533073B2 JP 26496597 A JP26496597 A JP 26496597A JP 26496597 A JP26496597 A JP 26496597A JP 3533073 B2 JP3533073 B2 JP 3533073B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- electronic component
- electrode
- substrate
- fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【発明の詳細な説明】
【0001】
【発明の属する技術分野】本発明は電子部品の基板取付
構造に関するものである。
【0002】
【従来の技術】従来、フレキシブル基板に設けた回路パ
ターンにチップ型の電子部品の電極部を接続するには、
半田や低温半田や導電性接着剤等が用いられてきた。
【0003】即ち半田または低温半田によって接続する
場合は、フレキシブル基板に半田クリームを印刷し、そ
の上に自動装着機にてチップ型の電子部品を載せた上で
このフレキシブル基板を加熱炉に通して前記半田クリー
ムを溶かして電子部品との接続を行なう。
【0004】ところでフレキシブル基板は容易に撓むの
で半田による接続固定のみではその強度が弱い。従って
さらに電子部品の上にこれを封止するようにUV硬化型
の接着剤を塗布し、これをUV炉に通して硬化させて補
強することが行なわれる。
【0005】一方フレキシブル基板上に銀ペーストを印
刷形成してなる回路パターンの場合、銅箔のエッチング
によって形成される回路パターンと相違して、半田との
接着性に問題があるので、通常は半田の代わりにホット
メルトタイプの導電性接着剤が用いられる。またフレキ
シブル基板として耐熱温度の低いフイルム(ポリエチレ
ンテレフタレート(PET)フイルム等)を用いた場合
も、導電性接着剤を用いる必要がある。
【0006】そしてこの場合は、フレキシブル基板上に
ホットメルトタイプの導電性接着剤を印刷乾燥し、その
上に自動装着機にて電子部品を載せた上で、このフレキ
シブル基板と電子部品間を加熱・加圧することで前記導
電性接着剤を溶かして両者間の接続を行なう。
【0007】この場合もフレキシブル基板と電子部品間
の接続強度がそれほど強くないので、さらに電子部品の
上にUV硬化型の接着剤を塗布して硬化させることが行
なわれる。
【0008】
【発明が解決しようとする課題】上記何れの接続方法に
おいても、フレキシブル基板上に取り付ける電子部品の
数が多い場合は、電子部品を載置したフレキシブル基板
を加熱炉やUV照射炉に通すことで多数個の電子部品の
接続が同時に完了するので効率的である。
【0009】しかしながらフレキシブル基板に取り付け
る電子部品の数が少ない場合は、逆に製造効率が悪くな
ってしまう。即ち搭載する電子部品の数が少ない場合で
も、フレキシブル基板に電子部品を載置して加熱炉を通
してこれを接続固定し、さらにUV硬化型の接着剤を塗
布してUV照射炉に通す必要があるからである。
【0010】また加熱炉やUV照射炉を設置する必要が
あるので設備コストの増大をも招いてしまう。
【0011】上記問題点を解決するためには、個々の電
子部品を加熱炉などを使用しない方法で1個ずつフレキ
シブル基板に取り付けることができれば良い。しかしな
がら従来このような取付構造として簡易且つ容易確実な
ものはなかった。
【0012】本発明は上述の点に鑑みてなされたもので
ありその目的は、容易、確実且つ簡易に電子部品を基板
に取り付けることのできる電子部品の基板取付構造を提
供することにある。
【0013】
【課題を解決するための手段】上記問題点を解決するた
め本発明は、電極部を設けてなる電子部品と、少なくと
も一方がフレキシブルシート製の2枚の板部材を重ね合
わせるとともに2枚の板部材の対向する側の面の内の少
なくとも何れか一方の面に電極パターンを形成してなる
基板と、弾性板製であって前記電子部品の電極部を除く
部分を挿入する電子部品挿入部を設けるとともに、該電
子部品挿入部の内周辺部分に弾発部を設けてなる押え板
とを具備し、前記基板を構成する2枚の板部材の間に電
子部品の電極部を挟み込んだ状態でフレキシブルシート
製の板部材上に押え板を配設し、その際押え板の電子部
品挿入部に電子部品の電極部を除く部分を挿入するとと
もに、押え板の弾発部を該フレキシブルシート製の板部
材に弾発せしめて前記電極部と前記電極パターン間を圧
接せしめることによって電子部品の基板取付構造を構成
した。
【0014】
【発明の実施の形態】以下、本発明の実施形態を図面に
基づいて詳細に説明する。
〔第一実施形態〕図2,図3は本発明の第一実施形態を
示す分解斜視図であり、両図で1つの分解斜視図を構成
する。両図に示すようにこの実施形態は、補強板80の
上に、基板10を構成する下側の板部材11と、電子部
品30と、基板10を構成する上側の板部材21と、押
え板40と、固定板50とを載置し、補強板80と固定
板50間を固定することで電子部品30の取り付けが行
なわれる。以下各構成部品について説明する。
【0015】補強板80は平板状の金属板で構成されて
おり、その所定位置に2つの位置決め孔81と2つの固
定用孔83とが設けられている。
【0016】板部材11は合成樹脂フイルム、例えばポ
リエチレンテレフタレート(以下「PET」という)製
のフレキシブルシート12上に6つの電極パターン13
と、各電極パターン13から引き出される回路パターン
15とを銀ペーストをスクリーン印刷することによって
形成することで構成されている。また板部材11の所定
位置には2つの位置決め孔17と2つの固定用孔19と
が設けられている。なおこのフレキシブルシート12の
上面には、図示はしないが別の部分にメンブレンスイッ
チ用のスイッチパターンやその他の電子回路が印刷形成
されている。
【0017】電子部品30はこの実施形態ではチップ型
ダイオードアレイであり、樹脂封止されたケース31の
両側面から3本ずつの金属端子(電極部)33を突出し
て構成されている。
【0018】板部材21は合成樹脂フイルム、例えばP
ET製のフレキシブルシート22の所定位置に前記電子
部品30のケース31の部分のみを挿通する電子部品挿
通部23を設けて構成されている。また板部材21の所
定位置には2つの位置決め孔25と2つの固定用孔27
とが設けられている。なおこのフレキシブルシート22
の図示する部分の下面には各種回路パターンは形成され
ていないが、図示しない更に周囲の部分にはメンブレン
スイッチ用のスイッチパターンやその他の電子回路が印
刷形成されている。
【0019】押え板40は弾性金属板を略矩形状に形成
して構成されており、その中央に前記電子部品30のケ
ース31の部分のみを挿入する電子部品挿入部41を設
け、また電子部品挿入部41の内周辺の2つの対抗する
二辺にそれぞれ3本ずつの櫛歯状の弾発部43を設けて
構成されている。
【0020】押え板40の各弾発部43の部分は下方向
に所定角度折り曲げられており、また折り曲げられてい
ない基部45の部分には、2つの位置決め孔47が設け
られている。
【0021】固定板50はモールド樹脂製であり、その
所定位置に開口51を設けて構成されている。ここで図
4は固定板50を裏面側から見た要部斜視図である。図
2,4から明らかなように固定板50の下面の開口51
を取り囲む部分には、口の字状の押え突起53が突設さ
れている。
【0022】また押え突起53の所定位置には2つの位
置決め突起55が突設されている。又押え突起53から
外方に延びる枠部材54の所定位置には2つの固定用突
起57が設けられている。
【0023】そして上記各部品を組み立てるには、図2
に示す固定板50を裏返してその上に裏返した各部品を
載置していく。即ちまず裏返した固定板50の上に裏返
した押え板40を載置する。その際固定板50の2つの
位置決め突起55(図4参照)を押え板40の位置決め
孔47に挿入する。
【0024】次に押え板40の上に裏返した板部材21
を載置する。その際前記2つの位置決め突起55を位置
決め孔25に挿入し、2つの固定用突起57(図4参
照)を2つの固定用孔27に挿入する。
【0025】次に板部材21の上に裏返した電子部品3
0を載置する。その際電子部品30のケース31は板部
材21の電子部品挿通部23と押え板40の電子部品挿
入部41を貫通して固定板50の開口51に少し露出す
る。なお電子部品30の金属端子33は電子部品挿通部
23を貫通しない。
【0026】次にその上に裏返した板部材11を載置す
る。その際前記2つの位置決め突起55を板部材11の
位置決め孔17に挿入し、2つの固定用突起57を板部
材11の固定用孔19に挿入する。このとき板部材11
上に設けた各電極パターン13に電子部品30の各金属
端子33が何ら接着剤や半田なしに直接接触される。
【0027】次にその上に裏返した補強板80を載置す
る。その際前記2つの位置決め突起55を補強板80の
位置決め孔81に挿入し、2つの固定用突起57を補強
板80の固定用孔83に挿入し、2つの固定用突起57
の先端を補強板80の下面で熱カシメする。
【0028】図1は以上のようにして完成した電子部品
の基板取付構造を示す図であり、同図(a)は要部平面
図、同図(b)は同図(a)のA−A断面図である。
【0029】同図に示すように固定用突起57の熱カシ
メによって、固定板50の押え突起53が押え板40の
基部45の部分を押圧し、これによって該基部45と2
枚の板部材11,21からなる基板10が挟持され、固
定される。
【0030】その際、押え板40の6本の弾発部43は
板部材21の上から、各金属端子33を下方向に弾発す
るように押し下げ、これによって各金属端子33は板部
材11に設けた電極パターン13に圧接され、両者間は
電気的・機械的にその固定が確実に行なわれる。
【0031】なお金属端子33と弾発部43の間に絶縁
性の板部材21を介在させたのは、導電性の金属板で構
成された押え板40によって各金属端子33間がショー
トしないようにするためである。
【0032】またこの実施形態では、基板10を構成す
る2枚の板部材11,21の図示している部分以外の部
分にそれぞれメンブレンスイッチ用のスイッチパターン
を設けているので、これらスイッチパターン間を対向さ
せることによってメンブレンスイッチ基板をも構成して
いる。言い替えればメンブレンスイッチ基板の中に電子
部品30を機械的手段にて取り付けている。
【0033】なおこの実施形態においては電極パターン
13を下側の板部材11に設けたが、その代りに上側の
板部材21の各金属端子33が当接する部分に設けても
良い。また電極パターン13は板部材11,12の両者
に設けても良い。
【0034】また上記実施形態では補強板80を金属板
製としたので、固定板50側に固定用突起57を設けた
が、補強板80を合成樹脂板などによって形成した場合
は、補強板80側に固定用突起を設け、固定板50に設
けた孔内に挿入して熱カシメしても良い。なお上記実施
形態では固定用突起57の数や位置決め突起55の数を
2つとしたが、その数は必要に応じて増減できる。
【0035】また上記実施形態では押え板40の弾発部
43を各金属端子33毎に別々に押圧してそれぞれ確実
に接続できるようにするために櫛歯状に形成したが、各
金属端子33の厚みや長さが均一であるならば弾発部4
3を櫛歯にしないで1枚の平板状の板で一度に多数本の
金属端子33を押圧するように構成しても良い。又逆に
金属端子33の数よりも櫛歯の数を多くして、例えば2
本の櫛歯で1本の金属端子33を押圧するように構成し
ても良い。
【0036】〔第二実施形態〕図5は本発明の第二実施
形態を示す分解斜視図である。この実施形態において第
一実施形態と相違する点は、補強板80−2の構造を変
更した点と、それに伴って板部材11−2と板部材21
−2の構造を変更した点と、固定板50を省略した点で
ある。
【0037】即ちこの実施形態における補強板80−2
は第一実施形態と相違して合成樹脂板製とし、第一実施
形態における位置決め孔81と固定用孔83の代わり
に、2本の固定用突起85を設けている。
【0038】これに伴って板部材11−2,21−2か
らそれぞれ第一実施形態に示す固定用孔19と固定用孔
27とを省略している。
【0039】そしてこの実施形態の場合、補強板80−
2の上に、板部材11−2と電子部品30と板部材21
−2と押え板40を載置し、その際補強板80−2の固
定用突起85を板部材11−2の位置決め孔17と板部
材21−2の位置決め孔25と押え板40の位置決め孔
47に挿入した状態で、該固定用突起85の先端を熱カ
シメする。
【0040】このように構成すれば、電子部品30の固
定に第一実施形態に示す固定板50が不要になる。
【0041】〔第3実施形態〕図6は本発明の第三実施
形態に用いる電子部品30−3とこれを取り付ける2枚
の板部材11−3,21−3と、押え板40−3の部分
を示す要部分解斜視図である。なおそれ以外の構成部品
は第一実施形態と全く同一なのでその記載は省略してい
る。
【0042】この実施形態において第一実施形態と相違
する点は、電子部品30−3の構造を変更した点と、そ
れに伴って板部材11−3と板部材21−3と押え板4
0−3の構造を変更した点である。
【0043】即ちこの実施形態に用いた電子部品30−
3はチップ型発光ダイオードであり、その外形は凸形状
である。そしてその両側から突出する突起部に電極部3
5,35を形成している。
【0044】これに伴って板部材11−3に設ける電極
パターン13−3を2つとし、また板部材21−3に設
ける電子部品挿通部23−3の寸法を小さくし、また押
え板40−3の弾発部43−3を左右1つずつとしてい
る。
【0045】この実施形態の場合、電子部品30−3に
設ける電極部35,35が左右1つずつなので、これに
合わせて上記各部材の形状を変更したものであり、その
他の点は全て第一実施形態と同一なのでその詳細な説明
は省略する。
【0046】以上本発明の実施形態を説明したが、本発
明は上記各実施形態に限定されるものではなく、例えば
以下のような種々の変形が可能である。
【0047】電子部品の種類は上記電子部品に限定さ
れず、他の種々の機能を有する電子部品にも適用可能で
ある。また電子部品やその他の構成部材の形状について
も種々の変形が可能である。
【0048】上記実施形態では電極パターンとして銀
ペーストを印刷形成したものを用いているが、本発明は
これに限定されず、銅箔をエッチングして形成したもの
や、それ以外の方法によって形成したものであっても良
い。
【0049】さらなる補強のために半田や接着剤を併
用しても良い。
【0050】上記各実施形態では、基板10を構成す
る板部材11,21をいずれもフレキシブルシートで構
成することで全体としてフレキシブル基板としたが、下
側の板部材11は硬質基板で構成しても良い。この場合
はその下に設置する補強板80を省略しても良い。
【0051】
【発明の効果】以上詳細に説明したように本発明によれ
ば以下のような優れた効果を有する。
基板に電子部品を機械的弾発手段によって簡易且つ容
易に取り付けることができる。また電子部品の取り付け
に加熱炉やUV炉を使用する必要がなくなるので、基板
に取り付ける電子部品の数が少なくても、製造効率を良
い状態に維持できる。また加熱炉等の製造設備が不要と
なり、製造コストの低減化が図れる。
【0052】押え板の弾発部を基板の上から弾発せし
めて電子部品の電極部と基板の電極パターン間を圧接せ
しめる構造なので、基板への電子部品の固定が確実に行
なえ、別途接着剤で補強するなどの必要がなくなる。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component substrate mounting structure. 2. Description of the Related Art Conventionally, to connect an electrode portion of a chip type electronic component to a circuit pattern provided on a flexible substrate,
Solder, low-temperature solder, conductive adhesive and the like have been used. That is, when connection is made by soldering or low-temperature soldering, solder cream is printed on a flexible substrate, and chip-type electronic components are mounted thereon by an automatic mounting machine, and the flexible substrate is passed through a heating furnace. The solder cream is melted to make connection with the electronic component. Since the flexible substrate is easily bent, its strength is low only by connection and fixing with solder. Therefore, a UV-curable adhesive is further applied on the electronic component so as to seal the same, and this is passed through a UV furnace to be cured and reinforced. On the other hand, in the case of a circuit pattern formed by printing a silver paste on a flexible substrate, unlike a circuit pattern formed by etching a copper foil, there is a problem in adhesion to solder. Instead, a hot-melt type conductive adhesive is used. Also, when a film having a low heat resistance temperature (such as a polyethylene terephthalate (PET) film) is used as the flexible substrate, it is necessary to use a conductive adhesive. In this case, a hot-melt type conductive adhesive is printed and dried on a flexible substrate, and electronic components are mounted thereon by an automatic mounting machine. Then, the space between the flexible substrate and the electronic components is heated. -The conductive adhesive is melted by applying pressure to make a connection between them. Also in this case, since the connection strength between the flexible substrate and the electronic component is not so strong, a UV-curable adhesive is further applied on the electronic component and cured. [0008] In any of the above connection methods, when the number of electronic components mounted on the flexible substrate is large, the flexible substrate on which the electronic components are mounted is placed in a heating furnace or a UV irradiation furnace. This is efficient because the connection of a large number of electronic components is completed at the same time. However, when the number of electronic components mounted on the flexible substrate is small, the manufacturing efficiency is deteriorated. That is, even when the number of electronic components to be mounted is small, it is necessary to place the electronic components on a flexible substrate, connect and fix them through a heating furnace, apply a UV-curable adhesive, and pass through a UV irradiation furnace. Because. [0010] Further, since it is necessary to install a heating furnace and a UV irradiation furnace, equipment costs are increased. In order to solve the above-mentioned problems, it is only necessary that the individual electronic components can be mounted one by one on a flexible substrate without using a heating furnace or the like. However, there has been no simple, easy and reliable conventional mounting structure. SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and an object of the present invention is to provide a board mounting structure for an electronic component which can easily, reliably and easily mount an electronic component on a board. [0013] In order to solve the above problems, the present invention provides an electronic component provided with an electrode portion and at least one of two plate members made of a flexible sheet. A substrate in which an electrode pattern is formed on at least one of the opposing surfaces of the plate members, and an elastic plate , excluding the electrode portion of the electronic component
And an electronic component insertion part for inserting the part.
A press plate provided with a resilient portion at an inner peripheral portion of the child component insertion portion; and a flexible sheet made of a flexible sheet in a state where an electrode portion of the electronic component is sandwiched between two plate members constituting the substrate. A holding plate is placed on a plate member, and the electronic part of the holding plate
When inserting parts other than the electrode part of the electronic component into the product insertion part
In particular, a resilient portion of the pressing plate was repelled to the plate member made of the flexible sheet, and the electrode portion and the electrode pattern were pressed against each other to form a substrate mounting structure for an electronic component. Embodiments of the present invention will be described below in detail with reference to the drawings. [First Embodiment] FIGS. 2 and 3 are exploded perspective views showing a first embodiment of the present invention, and both figures constitute one exploded perspective view. As shown in both figures, this embodiment is different from the first embodiment in that a lower plate member 11 constituting the substrate 10, an electronic component 30, an upper plate member 21 constituting the substrate 10, and a holding plate The electronic component 30 is mounted by mounting the fixing plate 40 and the fixing plate 50 and fixing the reinforcing plate 80 and the fixing plate 50. Hereinafter, each component will be described. The reinforcing plate 80 is formed of a flat metal plate, and has two positioning holes 81 and two fixing holes 83 at predetermined positions. The plate member 11 has six electrode patterns 13 on a flexible sheet 12 made of a synthetic resin film, for example, polyethylene terephthalate (hereinafter referred to as "PET").
And a circuit pattern 15 drawn from each electrode pattern 13 are formed by screen printing silver paste. Further, two positioning holes 17 and two fixing holes 19 are provided at predetermined positions of the plate member 11. Although not shown, a switch pattern for a membrane switch and other electronic circuits are formed on another upper surface of the flexible sheet 12 by printing. The electronic component 30 is a chip type diode array in this embodiment, and is formed by projecting three metal terminals (electrode portions) 33 from both sides of a resin-sealed case 31. The plate member 21 is made of a synthetic resin film, for example, P
An electronic component insertion portion 23 for inserting only the case 31 of the electronic component 30 is provided at a predetermined position of the flexible sheet 22 made of ET. Further, two positioning holes 25 and two fixing holes 27 are provided at predetermined positions of the plate member 21.
Are provided. The flexible sheet 22
Although various circuit patterns are not formed on the lower surface of the illustrated portion, a switch pattern for a membrane switch and other electronic circuits are printed and formed on a further peripheral portion (not shown). The holding plate 40 is formed by forming an elastic metal plate into a substantially rectangular shape. An electronic component insertion portion 41 for inserting only the case 31 of the electronic component 30 is provided at the center thereof. Each of the two opposing sides on the inner periphery of the insertion portion 41 is provided with three comb-shaped resilient portions 43 each. Each of the resilient portions 43 of the holding plate 40 is bent downward at a predetermined angle, and two unpositioned portions of the base 45 are provided with two positioning holes 47. The fixing plate 50 is made of a molded resin, and has an opening 51 at a predetermined position. Here, FIG. 4 is a perspective view of a main part of the fixing plate 50 as viewed from the back side. As is apparent from FIGS.
A mouth-shaped pressing protrusion 53 is protruded from a portion surrounding. Two positioning projections 55 are provided at predetermined positions of the pressing projections 53. Two fixing protrusions 57 are provided at predetermined positions of the frame member 54 extending outward from the pressing protrusions 53. To assemble the above parts, FIG.
Is turned upside down, and each of the turned upside down parts is placed thereon. That is, first, the inverted presser plate 40 is placed on the inverted fixed plate 50. At this time, the two positioning protrusions 55 (see FIG. 4) of the fixed plate 50 are inserted into the positioning holes 47 of the holding plate 40. Next, the plate member 21 turned over on the holding plate 40
Is placed. At this time, the two positioning projections 55 are inserted into the positioning holes 25, and the two fixing projections 57 (see FIG. 4) are inserted into the two fixing holes 27. Next, the electronic component 3 turned over on the plate member 21
Place 0. At this time, the case 31 of the electronic component 30 penetrates through the electronic component insertion portion 23 of the plate member 21 and the electronic component insertion portion 41 of the holding plate 40 and is slightly exposed at the opening 51 of the fixing plate 50. The metal terminal 33 of the electronic component 30 does not penetrate the electronic component insertion portion 23. Next, the inverted plate member 11 is placed thereon. At this time, the two positioning projections 55 are inserted into the positioning holes 17 of the plate member 11, and the two fixing projections 57 are inserted into the fixing holes 19 of the plate member 11. At this time, the plate member 11
Each metal terminal 33 of the electronic component 30 is directly contacted with each electrode pattern 13 provided above without any adhesive or solder. Next, the inverted reinforcing plate 80 is placed thereon. At this time, the two positioning protrusions 55 are inserted into the positioning holes 81 of the reinforcing plate 80, the two fixing protrusions 57 are inserted into the fixing holes 83 of the reinforcing plate 80, and the two fixing protrusions 57 are inserted.
Is heat caulked on the lower surface of the reinforcing plate 80. FIG. 1 is a view showing a substrate mounting structure of an electronic component completed as described above. FIG. 1A is a plan view of a main part, and FIG. It is A sectional drawing. As shown in the figure, the pressing projection 53 of the fixing plate 50 presses the base 45 of the pressing plate 40 by the heat caulking of the fixing projection 57, whereby the bases 45 and 2 are pressed.
The substrate 10 composed of the plate members 11 and 21 is sandwiched and fixed. At this time, the six resilient portions 43 of the holding plate 40 push down the metal terminals 33 from above the plate member 21 so as to resiliently push the metal terminals 33 downward. The electrode pattern 13 is pressed against the provided electrode pattern 13, and the two are securely fixed electrically and mechanically. The reason why the insulating plate member 21 is interposed between the metal terminal 33 and the resilient portion 43 is that the metal terminals 33 are not short-circuited by the holding plate 40 made of a conductive metal plate. In order to In this embodiment, since the switch patterns for the membrane switch are provided on the portions other than the illustrated portions of the two plate members 11 and 21 constituting the substrate 10, respectively, the gap between these switch patterns is provided. The membrane switch substrate is also configured by facing the membrane switch substrate. In other words, the electronic component 30 is mounted in the membrane switch board by mechanical means. In this embodiment, the electrode pattern 13 is provided on the lower plate member 11, but instead may be provided on the upper plate member 21 at a portion where each metal terminal 33 contacts. The electrode pattern 13 may be provided on both the plate members 11 and 12. In the above embodiment, since the reinforcing plate 80 is made of a metal plate, the fixing projection 57 is provided on the fixing plate 50 side. However, when the reinforcing plate 80 is formed of a synthetic resin plate or the like, the reinforcing plate 80 A fixing protrusion may be provided on the side, and inserted into a hole provided in the fixing plate 50 to perform heat caulking. In the above embodiment, the number of the fixing projections 57 and the number of the positioning projections 55 are two, but the number can be increased or decreased as necessary. Further, in the above embodiment, the resilient portions 43 of the holding plate 40 are formed in a comb-teeth shape so as to be pressed separately for each metal terminal 33 so as to be surely connected to each other. If the thickness and length of the spring are uniform,
A configuration in which a large number of metal terminals 33 are pressed at a time by one flat plate without using the combs 3 may be used. Conversely, if the number of comb teeth is larger than the number of metal terminals 33, for example, 2
The configuration may be such that one metal terminal 33 is pressed by one comb tooth. [Second Embodiment] FIG. 5 is an exploded perspective view showing a second embodiment of the present invention. This embodiment is different from the first embodiment in that the structure of the reinforcing plate 80-2 is changed, and the plate member 11-2 and the plate member 21 are changed accordingly.
-2 and a point where the fixing plate 50 is omitted. That is, the reinforcing plate 80-2 in this embodiment.
Is made of a synthetic resin plate unlike the first embodiment, and is provided with two fixing projections 85 instead of the positioning holes 81 and the fixing holes 83 in the first embodiment. Accordingly, the fixing holes 19 and the fixing holes 27 shown in the first embodiment are omitted from the plate members 11-2 and 21-2. In the case of this embodiment, the reinforcing plate 80-
2, a plate member 11-2, an electronic component 30, and a plate member 21.
-2 and the holding plate 40 are placed, and at this time, the fixing projection 85 of the reinforcing plate 80-2 is positioned with the positioning hole 17 of the plate member 11-2, the positioning hole 25 of the plate member 21-2, and the positioning hole of the holding plate 40. In the state of being inserted into the 47, the tip of the fixing projection 85 is heat caulked. With this configuration, the fixing plate 50 shown in the first embodiment is not required for fixing the electronic component 30. Third Embodiment FIG. 6 shows an electronic component 30-3 used in a third embodiment of the present invention, two plate members 11-3 and 21-3 to which the electronic component 30-3 is attached, and a holding plate 40-3. It is a principal part exploded perspective view which shows a part. The other components are completely the same as those of the first embodiment, so that the description thereof is omitted. This embodiment differs from the first embodiment in that the structure of the electronic component 30-3 is changed, and the plate member 11-3, the plate member 21-3, and the holding plate 4
This is the point where the structure of 0-3 is changed. That is, the electronic component 30-
Reference numeral 3 denotes a chip-type light emitting diode, the outer shape of which is convex. The electrode portions 3 are provided on the protrusions protruding from both sides thereof.
5, 35 are formed. Accordingly, the number of electrode patterns 13-3 provided on the plate member 11-3 is reduced, the size of the electronic component insertion portion 23-3 provided on the plate member 21-3 is reduced, and the pressing plate 40-3 is provided. The three resilient portions 43-3 are provided one each for the left and right sides. In this embodiment, since the left and right electrode portions 35, 35 provided on the electronic component 30-3 are provided one by one, the shapes of the respective members are changed in accordance with this. Since it is the same as one embodiment, the detailed explanation is omitted. Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications as described below are possible, for example. The type of electronic component is not limited to the above-mentioned electronic component, but can be applied to other electronic components having various functions. Also, various modifications can be made to the shapes of the electronic components and other components. In the above embodiment, the electrode pattern formed by printing a silver paste is used. However, the present invention is not limited to this. The electrode pattern is formed by etching a copper foil or formed by other methods. It may be something. For further reinforcement, a solder or an adhesive may be used in combination. In each of the above embodiments, the plate members 11 and 21 constituting the substrate 10 are both made of a flexible sheet to form a flexible substrate as a whole, but the lower plate member 11 is made of a rigid substrate. Is also good. In this case, the reinforcing plate 80 provided thereunder may be omitted. As described in detail above, the present invention has the following excellent effects. Electronic components can be easily and easily attached to the substrate by mechanical resilient means. Further, since it is not necessary to use a heating furnace or a UV furnace for mounting the electronic components, even if the number of the electronic components to be mounted on the substrate is small, the production efficiency can be maintained in a good state. In addition, manufacturing equipment such as a heating furnace becomes unnecessary, so that manufacturing costs can be reduced. Since the resilient portion of the holding plate is repelled from above the substrate to press the electrode portion of the electronic component and the electrode pattern of the substrate under pressure, the electronic component can be securely fixed to the substrate, and a separate adhesive is used. There is no need to reinforce.
【図面の簡単な説明】
【図1】第一実施形態にかかる電子部品の基板取付構造
を示す図であり、図1(a)は要部平面図、図1(b)
は図1(a)のA−A断面図である。
【図2】第一実施形態の上側の部品を示す分解斜視図で
ある。
【図3】第一実施形態の下側の部品を示す分解斜視図で
ある。
【図4】固定板50を裏面側から見た要部斜視図であ
る。
【図5】第二実施形態を示す分解斜視図である。
【図6】第三実施形態の要部分解斜視図である。
【符号の説明】
10 基板
11 板部材
13 電極パターン
21 板部材
23 電子部品挿通部
30 電子部品
33 金属端子(電極部)
40 押え板
41 電子部品挿入部
43 弾発部
45 基部
50 固定板
80 補強板BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view showing a substrate mounting structure of an electronic component according to a first embodiment, FIG. 1 (a) is a plan view of a main part, and FIG. 1 (b).
FIG. 2 is a sectional view taken along the line AA in FIG. FIG. 2 is an exploded perspective view showing an upper part of the first embodiment. FIG. 3 is an exploded perspective view showing a lower part of the first embodiment. FIG. 4 is a perspective view of a main part of the fixing plate 50 as viewed from the back side. FIG. 5 is an exploded perspective view showing a second embodiment. FIG. 6 is an exploded perspective view of a main part of the third embodiment. DESCRIPTION OF SYMBOLS 10 Substrate 11 Plate member 13 Electrode pattern 21 Plate member 23 Electronic component insertion part 30 Electronic component 33 Metal terminal (electrode part) 40 Holding plate 41 Electronic component insertion part 43 Resilient part 45 Base 50 Fixed plate 80 Reinforcement Board
Claims (1)
を重ね合わせるとともに、2枚の板部材の対向する側の
面の内の少なくとも何れか一方の面に電極パターンを形
成してなる基板と、 弾性板製であって前記電子部品の電極部を除く部分を挿
入する電子部品挿入部を設けるとともに、該電子部品挿
入部の内周辺部分に弾発部を設けてなる押え板とを具備
し、 前記基板を構成する2枚の板部材の間に電子部品の電極
部を挟み込んだ状態でフレキシブルシート製の板部材上
に押え板を配設し、その際押え板の電子部品挿入部に電
子部品の電極部を除く部分を挿入するとともに、押え板
の弾発部を該フレキシブルシート製の板部材に弾発せし
めて前記電極部と前記電極パターン間を圧接せしめるこ
とを特徴とする電子部品の基板取付構造。(57) Claims 1. An electronic component provided with an electrode portion and at least one of two plate members made of a flexible sheet are overlapped, and the two plate members are opposed to each other. A substrate on which an electrode pattern is formed on at least one of the surfaces; and a portion made of an elastic plate and excluding an electrode portion of the electronic component.
And an electronic component insertion portion for inserting the electronic component.
A press plate provided with a resilient portion at an inner peripheral portion of the input portion, wherein the electrode portion of the electronic component is sandwiched between two plate members constituting the substrate on a flexible sheet member. the holding plate is disposed in, conductive electronic parts insertion portion of that time pressing plate
A part of the electronic component, characterized in that a part excluding the electrode part of the child part is inserted, and a resilient part of the holding plate is repelled to the flexible sheet member so that the electrode part and the electrode pattern are pressed against each other. Board mounting structure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26496597A JP3533073B2 (en) | 1997-09-11 | 1997-09-11 | PCB mounting structure for electronic components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26496597A JP3533073B2 (en) | 1997-09-11 | 1997-09-11 | PCB mounting structure for electronic components |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH1187876A JPH1187876A (en) | 1999-03-30 |
JP3533073B2 true JP3533073B2 (en) | 2004-05-31 |
Family
ID=17410673
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26496597A Expired - Fee Related JP3533073B2 (en) | 1997-09-11 | 1997-09-11 | PCB mounting structure for electronic components |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3533073B2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT412603B (en) * | 2003-03-12 | 2005-04-25 | Datacon Semiconductor Equip | DEVICE FOR CONNECTING ELECTRONIC CIRCUITS |
US7061076B2 (en) | 2004-08-12 | 2006-06-13 | Honeywell International Inc. | Solderless component packaging and mounting |
DE102006062485A1 (en) * | 2006-12-28 | 2008-07-03 | Robert Bosch Gmbh | Electrical contacting device for electrical/electronic circuit, has electrically conductive contact unit arranged on electrically non-conducting substrate, which is formed of elastic flexible material |
-
1997
- 1997-09-11 JP JP26496597A patent/JP3533073B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH1187876A (en) | 1999-03-30 |
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