JP3532065B2 - Plating method and apparatus - Google Patents
Plating method and apparatusInfo
- Publication number
- JP3532065B2 JP3532065B2 JP11010797A JP11010797A JP3532065B2 JP 3532065 B2 JP3532065 B2 JP 3532065B2 JP 11010797 A JP11010797 A JP 11010797A JP 11010797 A JP11010797 A JP 11010797A JP 3532065 B2 JP3532065 B2 JP 3532065B2
- Authority
- JP
- Japan
- Prior art keywords
- plated
- mounting plate
- plating
- shaped
- disk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
【0001】[0001]
【発明の属する技術分野】本発明は、平板状又は円盤状
の被めっき物のめっき膜厚の面内均一性、電流効率を向
上させ、めっき粒子を改善することができる電気めっき
方法及び装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroplating method and apparatus capable of improving in-plane uniformity of plating film thickness and current efficiency of a plate-shaped or disk-shaped object to be plated and improving plating particles. .
【0002】[0002]
【従来の技術】半導体工業においては、シリコンウェハ
上に形成された多数の素子に、電気めっき方法によって
バンプと称される突起状の電極を形成し、接続用の電極
とする方法が採用されている。このバンプのめっきにお
いては、バンプの高さ及び形状を極力一定にする必要が
あるところから、被めっき物表面に対してめっき液を高
速で流動させることが行われている。2. Description of the Related Art In the semiconductor industry, a method has been adopted in which a large number of elements formed on a silicon wafer are provided with protruding electrodes called bumps by an electroplating method and used as electrodes for connection. There is. In the plating of the bumps, since it is necessary to keep the height and shape of the bumps as constant as possible, the plating solution is made to flow at high speed over the surface of the object to be plated.
【0003】この目的のため、図1に略図として示しよ
うに、被めっき物1の表面のバンプに対して噴流を照射
する方式が採用されることが多いが、この方式はポンプ
や噴射ノズル或いはそれに伴う配管等の点で、 装置が複
雑となるという欠点があった。For this purpose, a method of irradiating the bumps on the surface of the object to be plated with a jet is often adopted as shown in the schematic view of FIG. As a result, there was a drawback in that the equipment became complicated in terms of piping, etc.
【0004】これに対して、通常の被めっき物に対して
旧来から行われていると同様に、めっき浴中に被めっき
対象物を浸漬してめっきする方法を改良したものがあ
る。この方法では、装置は比較的簡易であるという利点
がある。例えば、特開平7−243097号公報には、
その略図を図2に示したように、垂直に保持したラック
にウェハ1を吊るし、該ラックを回転させる方法などが
開示されている。この方法では、同時に2枚を回転させ
ながら処理できるという作業能率上の利点もあるが、回
転方向が平板状の被めっき面に対して水平でないために
回転速度に限界があり、満足できる液の流動、ひいては
結果的にバンプ高さや形状において満足できる均一性が
得られないという限界があった。On the other hand, there is an improved method of plating by immersing an object to be plated in a plating bath, as has been conventionally done for an ordinary object to be plated. This method has the advantage that the device is relatively simple. For example, in Japanese Patent Laid-Open No. 7-243097,
As shown in the schematic diagram of FIG. 2, a method of suspending the wafer 1 on a rack held vertically and rotating the rack is disclosed. This method also has the advantage of working efficiency that two sheets can be processed while rotating at the same time, but the rotation speed is limited because the rotation direction is not horizontal to the plate-shaped surface to be plated, and a satisfactory solution There was a limit that the flow, and eventually, the bump height and shape could not have satisfactory uniformity.
【0005】一方、その略図を図3に示したように、垂
直に配置したジグに被めっき物1が水平になるように保
持し、ジグを回転させる方法がある。この方法では、被
めっき対象物のめっきをめっき面に対して水平に回転さ
せることができ、回転速度を速くすることができるとい
う利点はあるが、被めっき物を陽極と対向する位置に配
置するために一度に1枚の被めっき物しかめっきでき
ず、作業能率が悪かった。On the other hand, as shown in the schematic view of FIG. 3, there is a method of holding the object to be plated 1 horizontally on a jig arranged vertically and rotating the jig. This method has the advantage that the plating of the object to be plated can be rotated horizontally with respect to the plating surface and the rotation speed can be increased, but the object to be plated is arranged at a position facing the anode. Therefore, it was possible to plate only one object at a time, and the work efficiency was poor.
【0006】[0006]
【発明が解決しようとする課題】このような現状に対し
て、本発明者らは、簡易な装置でめっきが可能な浸漬法
を用いて、満足できるめっき厚さ及び形状の均一性或い
は高電流効率が達成されると共にめっき粒子が改善され
且つ2枚のウェハを同時に処理することができるめっき
方法及び装置の開発を本発明の課題とした。In view of such a situation, the inventors of the present invention have used a dipping method capable of plating with a simple apparatus to achieve satisfactory plating thickness and shape uniformity or high current. It is an object of the present invention to develop a plating method and apparatus that can achieve efficiency, improve plating particles, and process two wafers at the same time.
【0007】[0007]
【課題を解決するための手段】上記の目的を達成するた
めに、本発明は、簡易な装置を用いることができる浸漬
式めっき方法において、車の両輪の如く回転する円盤状
の装着板を配置し、該装着板に取り付けられた支持金具
によって被めっき物を支持することによって、2枚の被
めっき物を同時にめっき処理できると共に、被めっき物
をめっき面に対して水平に回転させることができ、よっ
て高速での回転を可能とし、満足できる液の流動、ひい
てはバンプ高さや形状、粒子形状において満足できる均
一性並びに高い電流効率が得られる、平板状又は円盤状
の被めっき物の電気めっき方法及び装置を提供する。In order to achieve the above object, the present invention provides a disk-shaped mounting plate that rotates like two wheels of a vehicle in an immersion plating method that can use a simple device. By supporting the object to be plated with the support fittings attached to the mounting plate, the two objects to be plated can be plated at the same time, and the object to be plated can be rotated horizontally with respect to the plated surface. Therefore, the method of electroplating a plate-shaped or disk-shaped object to be plated, which enables high-speed rotation and can achieve satisfactory liquid flow, and thus satisfactory uniformity in bump height, shape, and particle shape, and high current efficiency. And a device.
【0008】即ち、本発明の第一の態様は、平板状又は
円盤状の被めっき物をめっき液に浸漬して電気めっきす
るにあたり、回転軸により垂直面で回転できる一対の対
向する円盤状の装着板に被めっき物を陽極と対面させて
支持し、該被めっき物を装着板と共に回転させ、しかも
装着板を左右方向及び(又は)上下方向に揺動させなが
らめっきすることを特徴とする、平板状又は円盤状の被
めっき物の電気めっき方法である。That is, according to the first aspect of the present invention, when a flat plate-shaped or disk-shaped object to be plated is immersed in a plating solution for electroplating, a pair of opposed disk-shaped members that can be rotated in a vertical plane by a rotating shaft are used. the object to be plated supported so as to face an anode in the mounting plate, rotate the該被plated with mounting plate, moreover
A method of electroplating a plate-shaped or disk-shaped object to be plated, which comprises plating the mounting plate while swinging the mounting plate horizontally and / or vertically .
【0009】本発明の第二の態様は、平板状又は円盤状
の被めっき物を保持し且つ該被めっき物表面が垂直配向
となるように回転させるために垂直に配置された2枚の
装着板と、該装着板に被めっき物を保持し且つ通電する
ための通電金具(チャック)と、該装着板を各端に保持
し装着板の回転中心となり且つ該被めっき物への通電を
行うための回転軸と、該回転軸を回転自在に支持し該回
転軸に通電するための付帯構造と、被めっき物と対面す
る陽極と、装着板を左右方向及び(又は)上下方向に揺
動させるための手段とをめっき槽に設けてなる、前記の
方法を実施するための装置である。A second aspect of the present invention is to mount two plate-like or disk-shaped objects to be plated and vertically arranged to rotate the surfaces of the objects to be plated in a vertical orientation. A plate, a metal fitting (chuck) for holding and energizing the object to be plated on the mounting plate, and holding the mounting plate at each end to become the center of rotation of the mounting plate and to energize the object to be plated Rotation shaft, an auxiliary structure for rotatably supporting the rotation shaft and energizing the rotation shaft, an anode facing the object to be plated, and a mounting plate in a horizontal direction and / or a vertical direction.
An apparatus for carrying out the above method, which is provided with a means for moving the plating tank.
【0010】[0010]
【発明の実施の形態】本発明は、平板状又は円盤状の被
めっき物をめっき液に浸漬して電気めっきするにあた
り、回転軸により垂直面で回転できる一対の対向する円
盤状の装着板に被めっき物を支持し、該被めっき物を回
転させながらめっきすることを特徴とする、平板状又は
円盤状の被めっき物の電気めっき方法であるでるが、こ
の方法を具体化できるめっき装置の一例を図4に示し、
これに基づいて本発明を説明する。図4を参照するに、
本発明に従うめっき装置においては、めっき槽8内に、
円盤状の被めっき物1を保持し且つ被めっき物表面に対
して水平に回転させるために垂直に配置された2枚の装
着板2、該装着板に被めっき物1を保持し且つ通電すめ
ための通電金具(チャック)3、さらに該装着板2を保
持し装着板の回転中心となり且つ被めっき物への通電を
行うための回転軸4、該回転軸4を駆動させるためのモ
ーター5及び回転伝達シャフト6を含む、該回転軸4を
回転自在に支持し且つ該回転軸4に通電するための主要
構成部分保持筐体9、並びに陽極7が配置される。BEST MODE FOR CARRYING OUT THE INVENTION The present invention provides a pair of opposed disc-shaped mounting plates which can be rotated in a vertical plane by a rotating shaft when a plate-shaped or disc-shaped object to be plated is immersed in a plating solution for electroplating. It is a method of electroplating a plate-shaped or disk-shaped object to be plated, which is characterized by supporting the object to be plated and rotating the object to be plated, and a plating apparatus capable of embodying this method. An example is shown in FIG.
The present invention will be described based on this. Referring to FIG. 4,
In the plating apparatus according to the present invention, in the plating tank 8,
Two mounting plates 2 vertically arranged to hold the disk-shaped object 1 to be plated and to rotate horizontally with respect to the surface of the object to be plated. A metal fitting (chuck) 3 for holding the mounting plate 2, a rotating shaft 4 for holding the mounting plate 2 as a center of rotation of the mounting plate and for energizing the object to be plated, a motor 5 for driving the rotating shaft 4, and A main component holding housing 9 for rotatably supporting the rotating shaft 4 and energizing the rotating shaft 4, including a rotation transmission shaft 6, and an anode 7 are arranged.
【0011】本発明の方法によれば、図4に示したよう
に、円盤状の被めっき物1を円盤面に対して水平に回転
でき且つ2枚の被めっき物を同時にめっきできるよう
に、しかも水平な軸4を中心として回転できるように、
装着板2を垂直に配置し、該装着板に被めっき物1を保
持することによって被めっき物1が垂直面で高速で回転
し得るようにしたので、被めっき物1の表面に対してめ
っき液を高速で流動させることができる。According to the method of the present invention, as shown in FIG. 4, the disk-shaped object to be plated 1 can be rotated horizontally with respect to the disk surface and two objects can be plated at the same time. Moreover, so that it can rotate around the horizontal axis 4,
By mounting the mounting plate 2 vertically and holding the object to be plated 1 on the mounting plate so that the object to be plated 1 can rotate at a high speed on a vertical surface, the surface of the object to be plated 1 is plated. The liquid can be made to flow at high speed.
【0012】さらに、装着板の回転速度並びに回転方向
を自由に変更し得る機構を備えることによってサイズや
形状の異なる被めっき対象物に対して、それぞれに最適
な回転条件を選定することが可能となった。Further, by providing a mechanism capable of freely changing the rotation speed and the rotation direction of the mounting plate, it is possible to select the optimum rotation conditions for the objects to be plated having different sizes and shapes. became.
【0013】モーター5の回転は、伝達シャフト6及び
回転軸4を介して該装着板2を回転させる。回転方向及
び回転速度可変のモーターの使用により、電気的に該装
着板2の回転速度並びに正逆を変更することができ、こ
のことによって被めっき物の種類に応じて、最も適正な
回転条件を与えることができる。回転速度は、通常、5
〜100rpm程度が好ましいが、被めっき物の種類に
応じては3〜200rpm程度の範囲で変化させて最も
適性な条件を見い出すのが好ましい。The rotation of the motor 5 causes the mounting plate 2 to rotate via the transmission shaft 6 and the rotary shaft 4. By using a motor with a variable rotation direction and rotation speed, it is possible to electrically change the rotation speed and forward / reverse of the mounting plate 2, and thus the most appropriate rotation condition can be set according to the type of the object to be plated. Can be given. The rotation speed is usually 5
Approximately 100 rpm is preferable, but it is preferable to find the most suitable condition by changing the range of approximately 3 to 200 rpm depending on the type of the object to be plated.
【0014】通常は、被めっき物1は、該被めっき物1
の中心と該装着板2の中心を一致させて該装着板2に通
電金具(チャック)3によって保持されるが、該被めっ
き物1を該装着板2の回転中心から偏心させて保持する
ことによって、被めっき面とめっき液の相対速度が小さ
くなる箇所をなくすことができることを見い出し、一層
めっき厚さの面内均一性を向上させることができること
を見い出した。即ち、回転する物体とめっき液の相対速
度は円周部ほど速く、中心部では遅い。従って、被めっ
き物を装着板の中心に配置すると、中心部と円周部では
撹拌条件が異なるためにめっき厚さ或いはめっき形状に
変化が生じやすい。鋭意研究の結果、被めっき物を装着
板中心から偏心させて保持し、被めっき物の中心から回
転中心をずらすと、被めっき面とめっき液の相対速度が
小さくなる箇所がなくすことができることを見い出し
た。幾何学的にはたとえ偏心させて保持しても回転中心
は存在するために、その部分では流速が遅くなると予想
されるが、回転が対称的でなくなるためにめっき液の流
れが不規則となり、膜厚の均一性が非常に向上する結果
となったのである。Usually, the object 1 to be plated is the object 1 to be plated.
The center of the mounting plate 2 and the center of the mounting plate 2 are aligned and held by the mounting plate 2 by a current-carrying metal fitting (chuck) 3. The object to be plated 1 is held eccentrically from the rotation center of the mounting plate 2. It was found that it is possible to eliminate a portion where the relative velocity of the plating surface and the plating solution becomes small, and it is possible to further improve the in-plane uniformity of the plating thickness. That is, the relative velocity between the rotating object and the plating solution is faster in the circumferential portion and slower in the central portion. Therefore, when the object to be plated is placed at the center of the mounting plate, the plating thickness or the plating shape is likely to change because the stirring conditions are different between the central portion and the circumferential portion. As a result of diligent research, it was found that if the object to be plated is held eccentrically from the center of the mounting plate and the center of rotation is offset from the center of the object to be plated, it is possible to eliminate locations where the relative speed between the surface to be plated and the plating solution decreases. I found it. Geometrically, even if it is eccentrically held, there is a center of rotation, so it is expected that the flow velocity will be slow in that part, but since the rotation is not symmetrical, the flow of the plating solution becomes irregular, The result is that the uniformity of the film thickness is greatly improved.
【0015】偏心の大きさは装着板径の2%程度以上あ
ればよいが、200mm以下の装着板の場合には2%で
は偏心がごくわずかになるため、被めっき物1の中心か
ら5mm程度以上異常或いは装着板径の2%以上偏心さ
せることが好ましい。The size of the eccentricity may be about 2% or more of the diameter of the mounting plate, but in the case of a mounting plate of 200 mm or less, the eccentricity becomes very small at 2%, so about 5 mm from the center of the object to be plated 1. It is preferable that the above-mentioned abnormality or eccentricity is 2% or more of the diameter of the mounting plate.
【0016】本発明のめっき装置では、さらに、構成要
素1〜6を含む主要構成部分全体を保持する筐体9を左
右方向に揺動させる機構、例えばクランクシャフトを設
けることによって、めっき液の流動を一層促進すること
ができた。このような装着板の左右方向への揺動のため
に、めっき液面が上下するので、めっき槽はオーバーフ
ローが可能な形態とし、オーバーフローしためっき液を
保持するための予備槽並びに本槽へめっき液を戻すため
のポンプを設けることによって一層好ましい結果を得
た。In the plating apparatus of the present invention, the flow of the plating solution is further provided by providing a mechanism, for example, a crankshaft, for swinging the casing 9 holding the entire main constituent parts including the constituent elements 1 to 6 in the left-right direction. Could be further promoted. Since the surface of the plating solution moves up and down due to such swinging of the mounting plate in the left-right direction, the plating tank should be configured to allow overflow, and plating should be performed in the preliminary tank and the main tank for holding the overflowing plating solution. More favorable results were obtained by providing a pump for returning the liquid.
【0017】主要構成部分保持筐体9の上述のような左
右への揺動は、具体的には、モーター10の回転をクラ
ンク11によって左右方向への運動に変え、該主要構成
部分全体をガイドレール12の上を左右に滑らせること
によって行われる。また、主要構成部分保持筐体9のス
ライド方向を上下方向とすることによって揺動を行って
もよい。The swinging of the main component holding casing 9 to the left and right as described above, specifically, changes the rotation of the motor 10 into a horizontal movement by the crank 11 to guide the entire main component. It is performed by sliding the rail 12 right and left. Further, the main component holding casing 9 may be swung by setting the sliding direction to be the vertical direction.
【0018】本発明のめっき装置では、さらにめっき液
の撹拌を促進するために、被めっき面への噴流の照射、
超音波の照射、或いはスキジーの使用などを併用してめ
っきすることもできる。特に超音波の併用においては、
一般に静止状態で超音波を照射しながらめっきする場合
には、直接照射された超音波と壁面で反射した波が共鳴
して、音波の強い部分と弱い部分が生じ、そのことによ
るめっきのムラが生じることがあるのに対して、本発明
のめっき装置においては、被めっき面は回転によって常
にその位置が変化しているため、上述のような不都合が
生じなく、したがって、めっき界面の撹拌に有利な超音
波照射を安心して行うことができるという特徴がある。In the plating apparatus of the present invention, in order to further promote the stirring of the plating solution, the surface to be plated is irradiated with a jet stream,
It is also possible to perform plating by using ultrasonic irradiation or using squeegee together. Especially in the combined use of ultrasonic waves,
Generally, when plating while irradiating ultrasonic waves in a stationary state, the ultrasonic waves directly irradiated and the waves reflected on the wall resonate, causing strong and weak sound waves, which causes uneven plating. On the other hand, in the plating apparatus of the present invention, the position of the surface to be plated is constantly changed by rotation, so that the above-mentioned inconvenience does not occur, and therefore it is advantageous for stirring the plating interface. There is a feature that you can safely perform various ultrasonic irradiation.
【0019】本発明のめっき装置においては、被めっき
対象物の回転中心に対して凸に湾曲した陽極を用いるこ
とができ、電流密度の分布を一層改善することができ
る。In the plating apparatus of the present invention, an anode which is convexly curved with respect to the center of rotation of the object to be plated can be used, and the distribution of current density can be further improved.
【0020】また、本発明のめっき装置においては、通
常のめっき装置に付帯され得る付帯設備即ち撹拌機、濾
過器、温度コントローラ、pHコントローラ等を付帯さ
せて用いることができる。さらに、該装置を用いてめっ
きするに際しては一般の直流電流ばかりではなく、パル
ス電流、反転電流或いは交流を重畳させた電流等を使用
することもできる。Further, in the plating apparatus of the present invention, auxiliary equipment that can be added to a normal plating apparatus, that is, a stirrer, a filter, a temperature controller, a pH controller and the like can be added and used. Further, when plating is performed using the apparatus, not only a general direct current but also a pulse current, a reversal current, a current in which an alternating current is superimposed, or the like can be used.
【0021】[0021]
【実施例】以下、本発明を実施例により更に詳細に説明
する。これらの試験では、図4に示すめっき装置を用い
て、円盤状被めっき物にめっきを施し、めっき厚さの面
内均一性の改善を達成した結果について説明する。EXAMPLES The present invention will now be described in more detail with reference to examples. In these tests, the results of plating the disk-shaped object to be plated using the plating apparatus shown in FIG. 4 and achieving improvement in the in-plane uniformity of the plating thickness will be described.
【0022】比較例1
市販のはんだめっき浴を用いてφ300mmの円盤状の
装着板にφ8インチの円盤状被めき物を装着板の中心に
保持し、装着板に回転を与えず静止状態で、ポンプ撹拌
しながらめっきを行った。被めっき物の円周から10m
m内部で、円周を4等分した箇所4点(A〜D)と被め
っき物の中心点(E)のめっき膜厚を比較した。めっき
条件は2.5A/dm2 、めっき時間40分、20℃で
ある。Comparative Example 1 A commercially available solder plating bath was used to hold a φ8-inch disk-shaped workpiece on a disk-shaped mounting plate having a diameter of 300 mm at the center of the mounting plate, and the mounting plate was not rotated and was stationary. The plating was performed while stirring the pump. 10m from the circumference of the object to be plated
Within 4 m, the plating film thicknesses at four points (A to D) where the circumference was divided into four equal parts and the center point (E) of the object to be plated were compared. The plating conditions are 2.5 A / dm 2 , plating time 40 minutes, and 20 ° C.
【0023】実施例1
比較例1と同じく、円盤状被めっき物を装着板の中心に
保持し、装着板を60rpmで回転させてめっきを行っ
た。めっき条件は比較例1と同じである。Example 1 As in Comparative Example 1, the disk-shaped object to be plated was held at the center of the mounting plate, and the mounting plate was rotated at 60 rpm for plating. The plating conditions are the same as in Comparative Example 1.
【0024】実施例2
円盤状被めっき物を装着板の中心から15mm偏心させ
て保持してめっきを行った。比較例1、実施例1の測定
点に加えて、円盤状被めっき物の回転中心となる部分
(F)のめっき厚さも測定した。Example 2 A disk-shaped object to be plated was eccentrically held by 15 mm from the center of the mounting plate and held to perform plating. In addition to the measurement points of Comparative Example 1 and Example 1, the plating thickness of the portion (F) that serves as the rotation center of the disk-shaped object to be plated was also measured.
【0025】実施例3
実施例2の条件に加えて、回転を1分毎に反転させてめ
っきを行った。Example 3 In addition to the conditions of Example 2, plating was performed by reversing the rotation every 1 minute.
【0026】実施例4
実施例3の条件に加えて、主要構成部分保持筐体を左右
に揺動させて被めっき物の装着板を揺動させてめっきを
行った。揺動距離は50mm、揺動速度は50mm/秒
とした。Example 4 In addition to the conditions of Example 3, plating was performed by swinging the main component holding casing to the left and right to swing the mounting plate of the object to be plated. The swing distance was 50 mm and the swing speed was 50 mm / sec.
【0027】比較例1、実施例1〜4で得た結果を表1
に示した。The results obtained in Comparative Example 1 and Examples 1 to 4 are shown in Table 1.
It was shown to.
【表1】 [Table 1]
【0028】[0028]
【発明の効果】以上説明した如く、本発明によると、平
板状又は円盤状の被めき物に対するめっきにおいて、簡
便なる装置を用いる浸漬方式において、2枚の被めっき
物を同時に処理することが可能となり、しかもめっき厚
さやめっき形状の面内均一性、電流効率を大幅に改善す
ることができる。As described above, according to the present invention, it is possible to treat two plate-shaped objects at the same time in the plating method for a plate-shaped or disk-shaped object to be plated in an immersion method using a simple device. In addition, the in-plane uniformity of the plating thickness and plating shape and the current efficiency can be greatly improved.
【図1】従来の噴流式のめっき装置を示す概念図であ
る。FIG. 1 is a conceptual diagram showing a conventional jet-type plating apparatus.
【図2】従来の浸漬式のめっき装置を示す概念図(2枚
同時めっきタイプ)である。FIG. 2 is a conceptual diagram (two-plate simultaneous plating type) showing a conventional immersion type plating apparatus.
【図3】従来の浸漬式のめっき装置を示す概念図(水平
回転タイプ)である。FIG. 3 is a conceptual diagram (horizontal rotation type) showing a conventional immersion type plating apparatus.
【図4】本発明の方法を具体化できる装置の一例を示す
説明図である。FIG. 4 is an explanatory diagram showing an example of an apparatus that can embody the method of the present invention.
1・・円盤状被めっき物 2・・装着板 3・・通電及び取り付け金具(チャック) 4・・軸 5・・モーター 6・・回転伝達シャフト 7・・陽極 8・・めっき槽 9・・主要構成部分保持筐体 10・・モーター 11・・クランク 12・・ガイドレール 1 ... Disk-shaped object to be plated 2 ... Mounting plate 3 ... Energization and mounting bracket (chuck) 4 ... Axis 5 ... Motor 6 ... Rotation transmission shaft 7 ... Anode 8 ... Plating tank 9 ... Main component holding housing 10 ... Motor 11. Crank 12 ... Guide rails
───────────────────────────────────────────────────── フロントページの続き (72)発明者 小幡 惠吾 兵庫県明石市二見町南二見21−8株式会 社大和化成研究所内 (56)参考文献 特開 平5−33196(JP,A) 特開 平7−243097(JP,A) 特開 平4−131395(JP,A) 特開 平5−230688(JP,A) 特開 平8−311689(JP,A) 特開 昭50−104730(JP,A) 特開 昭50−95138(JP,A) 実開 昭57−65968(JP,U) (58)調査した分野(Int.Cl.7,DB名) C25D 5/00 - 7/12 C25D 17/00 - 17/08 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Keigo Obata 21-8 Minami Futami, Futami-cho, Akashi-shi, Hyogo Daiwa Kasei Research Institute Co., Ltd. (56) Reference JP-A-5-33196 (JP, A) Japanese Patent Laid-Open No. 7-243097 (JP, A) Japanese Patent Laid-Open No. 4-131395 (JP, A) Japanese Patent Laid-Open No. 5-230688 (JP, A) Japanese Patent Laid-Open No. 8-311689 (JP, A) Japanese Patent Laid-Open No. 50-104730 (JP , A) Japanese Patent Laid-Open No. 50-95138 (JP, A) Actual Development No. 57-65968 (JP, U) (58) Fields investigated (Int.Cl. 7 , DB name) C25D 5/00-7/12 C25D 17/00-17/08
Claims (4)
液に浸漬して電気めっきするにあたり、回転軸により垂
直面で回転できる一対の対向する円盤状の装着板に被め
っき物を陽極と対面させて支持し、該被めっき物を装着
板と共に回転させ、しかも装着板を左右方向及び(又
は)上下方向に揺動させながらめっきすることを特徴と
する、平板状又は円盤状の被めっき物の電気めっき方
法。1. When a flat plate-shaped or disk-shaped object to be plated is immersed in a plating solution for electroplating, the object to be plated is used as an anode on a pair of opposed disk-shaped mounting plates that can be rotated in a vertical plane by a rotating shaft. It is supported face-to-face, the object to be plated is rotated together with the mounting plate , and the mounting plate is moved in the horizontal direction (
A) A method for electroplating a plate-shaped or disk-shaped object to be plated, which comprises oscillating vertically .
装着板の回転中心から該装着板径の2%以上又は5mm
以上偏心させて該装着板に保持してめっきすることを特
徴とする請求項1記載の方法。2. The center of the plate-shaped or disk-shaped object to be plated is 2% or more of the diameter of the mounting plate or 5 mm from the center of rotation of the mounting plate.
2. The method according to claim 1, wherein the plating is eccentrically held on the mounting plate and plated.
タイマーによって、装着板の回転方向を正逆反転させな
がら、しかも正逆回転の時間を自由に変更してめっきす
る請求項1又は2記載の方法。3. The rotation speed of the mounting plate is variable, and
The method according to claim 1 or 2, wherein the plating is performed by reversing the rotation direction of the mounting plate with a timer and freely changing the time of the normal rotation.
且つ該被めっき物表面が垂直配向となるように回転させ
るために垂直に配置された2枚の装着板と、該装着板に
被めっき物を保持し且つ通電するための通電金具(チャ
ック)と、該装着板を各端に保持し装着板の回転中心と
なり且つ該被めっき物への通電を行うための回転軸と、
駆動源と連繋した該回転軸を回転自在に支持し且つ該回
転軸に通電するための付帯構造と、被めっき物と対面す
る陽極と、装着板を左右方向及び(又は)上下方向に揺
動させるための手段とをめっき槽に設けてなる、請求項
1に記載の方法を実施するための装置。4. Two mounting plates arranged vertically for holding a plate-shaped or disk-shaped object to be plated and rotating so that the surface of the object to be plated has a vertical orientation, and the mounting plate. A metal fitting (chuck) for holding and energizing the object to be plated, and a rotary shaft for holding the mounting plate at each end to serve as a center of rotation of the mounting plate and for energizing the object to be plated,
An auxiliary structure for rotatably supporting the rotating shaft connected to the drive source and energizing the rotating shaft, an anode facing the object to be plated, and a mounting plate shaken in the horizontal direction and / or the vertical direction.
Apparatus for performing the method of claim 1, wherein the plating bath is provided with means for moving .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP11010797A JP3532065B2 (en) | 1997-04-14 | 1997-04-14 | Plating method and apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11010797A JP3532065B2 (en) | 1997-04-14 | 1997-04-14 | Plating method and apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH10287993A JPH10287993A (en) | 1998-10-27 |
JP3532065B2 true JP3532065B2 (en) | 2004-05-31 |
Family
ID=14527228
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JP11010797A Expired - Lifetime JP3532065B2 (en) | 1997-04-14 | 1997-04-14 | Plating method and apparatus |
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WO2022137514A1 (en) * | 2020-12-25 | 2022-06-30 | 株式会社荏原製作所 | Plating apparatus and method for controlling plating apparatus |
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