JP3528257B2 - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JP3528257B2 JP3528257B2 JP19770194A JP19770194A JP3528257B2 JP 3528257 B2 JP3528257 B2 JP 3528257B2 JP 19770194 A JP19770194 A JP 19770194A JP 19770194 A JP19770194 A JP 19770194A JP 3528257 B2 JP3528257 B2 JP 3528257B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- soft magnetic
- wiring board
- magnetic material
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント配線基板に関
し、特に不要電磁波の干渉によって生じる電磁波障害を
抑制できるプリント配線基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board, and more particularly to a printed wiring board capable of suppressing electromagnetic interference caused by interference of unnecessary electromagnetic waves.
【０００２】[0002]
【従来の技術】近年のデジタル電子機器においては、Ｒ
ＡＭ、ＲＯＭ、マイクロプロセッサ等の論理素子におけ
る演算速度の高速化が図られると共に、装置の軽薄短小
化も急速に進んでいる。それに伴い、プリント配線基板
への部品実装密度も飛躍的に高くなってきている。2. Description of the Related Art In recent digital electronic devices, R
The operation speed of logic elements such as AM, ROM, and microprocessors has been increased, and the size, weight, and size of devices have been rapidly reduced. Along with this, the density of mounting components on a printed wiring board has also increased dramatically.
【０００３】しかしながら、論理回路等において高速に
変化する信号は電圧、電流の急激な変化を伴うために、
高周波ノイズ発生の原因ともなっている。この高周波ノ
イズは、クロストークノイズやインピーダンスの不整合
によるノイズと相乗的に作用し、基板回路内での誤動作
や他のシステムへの悪影響を及ぼす。更に、プリント配
線基板の高密度実装や電子部品の小型化に伴い静電結合
が増大化するために、機器内での電磁波干渉が発生しや
すくなっている。However, since a signal that changes at high speed in a logic circuit or the like is accompanied by a rapid change in voltage and current,
It also causes high frequency noise. This high-frequency noise acts synergistically with crosstalk noise and noise due to impedance mismatch, and causes malfunction in the substrate circuit and adversely affects other systems. Furthermore, since electromagnetic coupling increases with high-density mounting of printed wiring boards and miniaturization of electronic components, electromagnetic interference easily occurs in the device.
【０００４】従来、電子機器に使用される一般的なプリ
ント配線基板は、低周波の場合には基板内部から発生す
る電磁誘導等の信号線間の電磁結合が比較的小さく問題
とならないが、動作周波数が高周波になるにつれて信号
線間の電磁結合が密となるため前記したような問題があ
った。Conventionally, in a general printed wiring board used for electronic equipment, when the frequency is low, electromagnetic coupling between signal lines such as electromagnetic induction generated from the inside of the board is relatively small and does not pose a problem, but it operates. As the frequency becomes higher, the electromagnetic coupling between the signal lines becomes denser, resulting in the above-mentioned problem.
【０００５】そこで、プリント配線基板自体にシールド
層を設けた構造で電磁波を遮蔽する、いわゆる電磁波シ
ールド配線基板が提案されている。Therefore, there has been proposed a so-called electromagnetic wave shield wiring board which shields electromagnetic waves with a structure in which a shield layer is provided on the printed wiring board itself.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら上述した
いわゆる電磁波シールド配線基板においては、ノイズ源
となる配線基板面と対向する配線基板面に対して遮蔽効
果は期待できるが、同じ配線基板面に対しては反射によ
る不要輻射が生じてしまい、ノイズ源側の同一配線基板
内での二次的な電磁結合が助長されるという問題が少な
からず発生している。更にフローティングされた電子機
器においては、シールド層がアンテナとなり二次的な輻
射ノイズが発生することが考えられる。However, in the above-mentioned so-called electromagnetic wave shield wiring board, a shielding effect can be expected for the wiring board surface opposite to the wiring board surface which becomes a noise source, but for the same wiring board surface. However, there is a considerable problem that unnecessary radiation due to reflection is generated, which promotes secondary electromagnetic coupling within the same wiring substrate on the noise source side. Furthermore, it is conceivable that in a floating electronic device, the shield layer acts as an antenna to generate secondary radiation noise.
【０００７】それ故に本発明の課題は、前記の電磁波シ
ールド配線基板の遮蔽効果を損なうことなく電磁波の透
過に対しては十分な遮蔽効果をもち、電磁波の反射に対
しては少なくとも反射による電磁結合を助長させること
のないプリント配線基板を提供することにある。Therefore, an object of the present invention is to have a sufficient shielding effect for transmission of electromagnetic waves without impairing the shielding effect of the electromagnetic wave shield wiring board, and at least for electromagnetic wave reflection by reflection. It is to provide a printed wiring board that does not promote the above.
【０００８】[0008]
【課題を解決するための手段】本発明によれば、プリン
ト配線基材の片面もしくは、両面に配線導体を有するプ
リント配線基板において、前記プリント配線基材が、導
電性支持体と、該導電性支持体の両面に設けられた絶縁
性軟磁性体の層を有し、該絶縁性軟磁性体の層は軟磁性
体粉末と有機結合剤とを含むことを特徴とするプリント
配線基板が得られる。According to the present invention, in a printed wiring board having a wiring conductor on one side or both sides of a printed wiring board, the printed wiring board is provided with a conductive support and the conductive support. A printed wiring board having an insulating soft magnetic material layer provided on both surfaces of a support, wherein the insulating soft magnetic material layer contains a soft magnetic material powder and an organic binder. .
【０００９】また、本発明によれば、プリント配線基材
の片面もしくは、両面に配線導体を有するプリント配線
基板において、前記プリント配線基材が、導電性支持体
と、該導電性支持体の両面に設けられた絶縁性軟磁性体
の層とを有すると共に、該絶縁性軟磁性体の層の少なく
とも片面に誘電体層を有し、前記絶縁性軟磁性体の層は
軟磁性体粉末と有機結合剤とを含み、前記誘電体層は誘
電体粉末と有機結合剤とを含むことを特徴とするプリン
ト配線基板が得られる。Further, according to the present invention, in a printed wiring board having a wiring conductor on one side or both sides of the printed wiring base material, the printed wiring base material is a conductive support and both surfaces of the conductive support. And a dielectric layer on at least one surface of the insulating soft magnetic material layer, and the insulating soft magnetic material layer is composed of a soft magnetic material powder and an organic material. A printed wiring board is obtained which comprises a binder and the dielectric layer contains a dielectric powder and an organic binder.
【００１０】また、本発明によれば、プリント配線基材
の片面もしくは、両面に配線導体を有するプリント配線
基板において、前記プリント配線基材が、導電性支持体
と、該導電性支持体の両面に設けられた絶縁性軟磁性体
の層とを有し、該絶縁性軟磁性体の層は、軟磁性体粉
末、誘電体粉末、及び有機結合剤を含むことを特徴とす
るプリント配線基板が得られる。Further, according to the present invention, in a printed wiring board having a wiring conductor on one side or both sides of the printed wiring substrate, the printed wiring substrate is a conductive support and both sides of the conductive support. And a layer of an insulating soft magnetic material provided on the printed wiring board, wherein the insulating soft magnetic material layer contains a soft magnetic material powder, a dielectric powder, and an organic binder. can get.
【００１１】また、本発明によれば、前記軟磁性体粉末
が、偏平状及び／または針状の粉末であることを特徴と
するプリント配線基板が得られる。Further, according to the present invention, there can be obtained a printed wiring board characterized in that the soft magnetic powder is a flat and / or acicular powder.
【００１２】[0012]
【作用】本発明のプリント配線基板は、導電性支持体の
両面に絶縁性軟磁性体の層が設けられた構成のプリント
配線基材上に配線導体が設けられている。また、本発明
のプリント配線基板は、導電性支持体の両面に絶縁性軟
磁性体の層を有すると共に、この絶縁性軟磁性体の層の
少なくとも片面に誘電体層が設けられた構成のプリント
配線基材上に配線導体が設けられている。In the printed wiring board of the present invention, the wiring conductor is provided on the printed wiring substrate having the structure in which the insulating soft magnetic material layers are provided on both surfaces of the conductive support. In addition, the printed wiring board of the present invention has a structure in which a conductive support has layers of an insulating soft magnetic material on both surfaces thereof, and a dielectric layer is provided on at least one surface of the insulating soft magnetic material layer. A wiring conductor is provided on the wiring base material.
【００１３】即ち、プリント配線基材を形成しているこ
の導電性支持体において、ノイズ源となる配線基板面と
対向する面に対しては上述したこの電磁波シールド配線
基板と同等の遮蔽効果が働き、電磁波干渉が抑制され
る。また、ノイズ源側の同一配線基板面内で発生する反
射による不要輻射での二次的な電磁結合は、軟磁性体粉
末と有機結合剤からなる絶縁性軟磁性体の層により抑制
される。また、軟磁性体粉末も形状が偏平状もしくは針
状であるために、形状異方性が出現し、高周波領域にて
磁気共鳴に基づく複素透磁率の増大化が生じ、不要輻射
成分が効率的に吸収、抑制される。この絶縁性軟磁性体
の層は、本来、導電性物質である軟磁性金属を用いても
微細粉末化し、絶縁性の有機結合剤と混練・分散するこ
とにより絶縁層とすることができる。また、誘電体粉末
の絶縁性軟磁性体の層への混合により空間とのインピー
ダンス整合が図られるため、絶縁性軟磁性体の層表面で
の不要輻射の反射が起こり難くなる。That is, in this conductive support forming the printed wiring base material, a shielding effect equivalent to that of the above-mentioned electromagnetic wave shield wiring board works on the surface facing the surface of the wiring board which becomes a noise source. , Electromagnetic wave interference is suppressed. In addition, secondary electromagnetic coupling due to unnecessary radiation due to reflection that occurs in the same wiring substrate surface on the noise source side is suppressed by the layer of the insulating soft magnetic material composed of the soft magnetic material powder and the organic binder. In addition, since the soft magnetic powder also has a flat shape or a needle shape, shape anisotropy appears, and the complex magnetic permeability increases due to magnetic resonance in the high frequency region, and unnecessary radiation components are efficiently generated. Absorbed and suppressed by. The layer of the insulating soft magnetic material can be made into an insulating layer by finely powdering the soft magnetic metal which is originally a conductive substance and kneading and dispersing it with an insulating organic binder. In addition, since the impedance matching with the space is achieved by mixing the dielectric powder with the layer of the insulating soft magnetic material, the reflection of unnecessary radiation on the surface of the layer of the insulating soft magnetic material does not easily occur.
【００１４】尚、このプリント配線基材の基本構成をな
す特性の検証は、本発明者らがすでに提案した特願平６
−４８６４号記載によるものである。The characteristics of the basic structure of the printed wiring board are verified by the Japanese Patent Application No. Hei 6 (1994) already proposed by the present inventors.
No. 4864.
【００１５】[0015]
【実施例】本発明の実施例について図面を参照しながら
説明する。Embodiments of the present invention will be described with reference to the drawings.
【００１６】図１は、本発明の実施例であるプリント配
線基板の一部断面図を示す。印刷またはエッチング等に
より形成された配線導体１がプリント配線基材Ａの上下
面に設けられている。更にスルーホール２がプリント配
線基材Ａの上面と下面との接続のため設けられている。FIG. 1 is a partial sectional view of a printed wiring board which is an embodiment of the present invention. Wiring conductors 1 formed by printing or etching are provided on the upper and lower surfaces of the printed wiring board A. Further, a through hole 2 is provided for connecting the upper surface and the lower surface of the printed wiring board A.
【００１７】図２は、本発明のプリント配線基板である
プリント配線基材の第一の実施例の構成例の一部断面図
を示す。プリント配線基材Ａは、導電性支持体３（もし
くは軟磁性を有する導電性軟磁性支持体）と、この導電
性支持体３の両面に設けられた絶縁性軟磁性体４の層と
を有している。絶縁性軟磁性体４の層は、偏平状及び／
または針状の軟磁性体粉末５と有機結合剤６とを含む。FIG. 2 is a partial cross-sectional view of a constitutional example of the first embodiment of the printed wiring board which is the printed wiring board of the present invention. The printed wiring board A has a conductive support 3 (or a conductive soft magnetic support having soft magnetism) and layers of insulating soft magnetic bodies 4 provided on both sides of the conductive support 3. is doing. The layer of the insulating soft magnetic material 4 is flat and / or
Alternatively, the needle-shaped soft magnetic powder 5 and the organic binder 6 are included.
【００１８】図３は、本発明のプリント配線基板である
プリント配線基材の第二の実施例の構成例の一部断面図
を示す。プリント配線基材Ａは、導電性支持体３（もし
くは軟磁性を有する導電性軟磁性支持体）と、この導電
性支持体３の両面に設けられた絶縁性軟磁性体４の層
と、その両面に設けられた誘電体層７とを有している。
（従って、図３は、導電性支持体３と誘電体層７との間
に絶縁性軟磁性体４の層が介在された構造となってい
る。）この絶縁性軟磁性体４の層は偏平状及び／または
針状の軟磁性体粉末５と有機結合剤６とを含む。誘電体
層７は、誘電体粉末８と有機結合剤６とを含む。FIG. 3 is a partial cross-sectional view of a constitutional example of a second embodiment of a printed wiring base material which is the printed wiring board of the present invention. The printed wiring board A includes a conductive support 3 (or a conductive soft magnetic support having soft magnetism), a layer of an insulating soft magnetic material 4 provided on both surfaces of the conductive support 3, and a layer thereof. It has a dielectric layer 7 provided on both sides.
(Thus, FIG. 3 has a structure in which the layer of the insulating soft magnetic material 4 is interposed between the conductive support 3 and the dielectric layer 7.) The layer of the insulating soft magnetic material 4 is It contains flat and / or acicular soft magnetic powder 5, and an organic binder 6. The dielectric layer 7 includes a dielectric powder 8 and an organic binder 6.
【００１９】図４は、本発明のプリント配線基板である
プリント配線基材の第三の実施例の構成例の一部断面図
を示す。プリント配線基材Ａは、導電性支持体３（もし
くは軟磁性を有する導電性軟磁性支持体）と、この導電
性支持体３の両面に設けられた絶縁性軟磁性体４の層と
を有している。この絶縁性軟磁性体４の層は、偏平状及
び／または針状の軟磁性体粉末５、誘電体粉末８、及び
有機結合剤６とを含む。FIG. 4 is a partial cross-sectional view of a constitutional example of the third embodiment of the printed wiring base material which is the printed wiring board of the present invention. The printed wiring board A has a conductive support 3 (or a conductive soft magnetic support having soft magnetism) and layers of insulating soft magnetic bodies 4 provided on both sides of the conductive support 3. is doing. The layer of the insulating soft magnetic material 4 contains flat and / or acicular soft magnetic material powder 5, dielectric powder 8, and organic binder 6.
【００２０】本発明の一つの構成要素である導電性支持
体３（もしくは導電性軟磁性支持体）としては、例え
ば、導電体板、編目状導電体板、もしくは導電性繊維の
織物が使用できる。また、導電性軟磁性支持体３として
は軟磁性金属板、編目状軟磁性金属板、もしくは軟磁性
金属繊維の織物が使用できる。また、銅薄板、ステンレ
ス薄板、アルミニウム薄板等の金属板、及びそれらに微
細な穴開け加工を施したいわゆるパンチングメタル、或
は薄板に微細な切れ目を施した後に、延伸加工を施した
いわゆるエキスパンドメタル、或は細線状の導体を編目
状に加工した金網等を使用できる。同様の形態にて材質
のみが軟磁性を有するパーマロイ或は鉄−珪素鋼等に代
えれば、特に比較的低い周波数での電磁波干渉抑制効果
の高まりが期待できるので、用途に応じて選択するのが
望ましい。As the conductive support 3 (or conductive soft magnetic support) which is one of the constituent elements of the present invention, for example, a conductive plate, a knitted conductive plate, or a conductive fiber woven fabric can be used. . As the conductive soft magnetic support 3, a soft magnetic metal plate, a knitted soft magnetic metal plate, or a soft magnetic metal fiber woven fabric can be used. Also, metal plates such as copper thin plate, stainless steel thin plate, aluminum thin plate, etc., and so-called punching metal obtained by finely punching them, or so-called expanded metal obtained by making fine cuts on the thin plate and then stretching. Alternatively, a wire net or the like in which a fine wire conductor is processed into a stitch can be used. In the same form, if only permalloy or iron-silicon steel or the like having soft magnetism is used as the material, an effect of suppressing electromagnetic wave interference can be expected to be enhanced particularly at a relatively low frequency, so it should be selected according to the application. desirable.
【００２１】また、銀、銅、パーマロイ、珪素鋼の金属
微粉末もしくは導電性カーボンブラック、導電性酸化チ
タン等を有機結合剤６とともに混練、分散し、これをシ
ート化したもの、或は直接シート化せずにポリイミド基
材等の絶縁基材の片面もしくは両面にドクターブレード
法、グラビアコート法或はリバースコート法等の手段に
より成膜したものを導電性支持体３（もしくは導電性軟
磁性支持体）として使用できる。また、ポリイミド基材
等の絶縁基材の片面もしくは両面に蒸着法やメッキ法等
により導電性のもしくは導電性軟磁性体膜を形成したも
のも導電性支持体３として使用できる。Also, fine powder of silver, copper, permalloy, silicon steel, conductive carbon black, conductive titanium oxide, etc. are kneaded and dispersed together with the organic binder 6 and formed into a sheet, or a direct sheet. A conductive support 3 (or a conductive soft magnetic support) is formed on one or both sides of an insulating base material such as a polyimide base material by means of a doctor blade method, a gravure coating method or a reverse coating method It can be used as a body. Further, a conductive base material 3 having a conductive or conductive soft magnetic material film formed on one or both surfaces of an insulating base material such as a polyimide base material by a vapor deposition method or a plating method can also be used.
【００２２】更に、誘電体層７、もしくは絶縁軟磁性体
４の層の形成に用いることのできる誘電体粉末８として
は、高周波領域での誘電率が大きく、かつ誘電率の周波
数特性が比較的平坦なものが好ましい。一例として、チ
タン酸バリウム系セラミック、チタン酸ジルコン酸系セ
ラミック、鉛ペロブスカイト系セラミック等を挙げるこ
とができる。Further, as the dielectric powder 8 that can be used for forming the dielectric layer 7 or the layer of the insulating soft magnetic material 4, the dielectric constant in the high frequency region is large and the frequency characteristic of the dielectric constant is relatively large. A flat one is preferable. Examples include barium titanate-based ceramics, zirconate titanate-based ceramics, lead perovskite-based ceramics, and the like.
【００２３】本発明のもう一つの構成要素である絶縁性
軟磁性体４の層の形成に用いることのできる偏平状及び
／または針状の軟磁性体粉末５としては、高周波透磁率
の大きな鉄アルミ珪素合金（センダスト）、鉄ニッケル
合金（パーマロイ）をその代表的素材として挙げること
ができ、粉末のアスペクト比は十分に大きい（おおよそ
５：１以上）ことが望ましい。As the flat and / or acicular soft magnetic material powder 5 which can be used for forming the layer of the insulating soft magnetic material 4 which is another component of the present invention, iron having a high high frequency permeability is used. Aluminum-silicon alloy (Sendust) and iron-nickel alloy (Permalloy) can be cited as typical materials, and it is desirable that the aspect ratio of the powder is sufficiently large (approximately 5: 1 or more).
【００２４】また、絶縁性軟磁性体４の層の形成に用い
る有機結合剤６としては、ポリエステル系樹脂、ポリ塩
化ビニル系樹脂、ポリビニルブチラール樹脂、ポリウレ
タン樹脂、セルロース系樹脂、ニトリル−ブタジエン系
ゴム、スチレン−ブタジエン系ゴム等の熱可塑性樹脂あ
るいはそれらの共重合体、エポキシ樹脂、フェノール樹
脂、アミド系樹脂、イミド系樹脂等の熱硬化性樹脂等を
あげることができる。As the organic binder 6 used for forming the layer of the insulating soft magnetic material 4, polyester resin, polyvinyl chloride resin, polyvinyl butyral resin, polyurethane resin, cellulose resin, nitrile-butadiene rubber is used. Examples thereof include thermoplastic resins such as styrene-butadiene rubber or copolymers thereof, and thermosetting resins such as epoxy resins, phenol resins, amide resins, and imide resins.
【００２５】また、プリント配線基材Ａの補強基材とし
ては、リンター紙、クラフト紙等の紙基材や、ガラスク
ロス、ガラスマット、ガラスペーパー、クォーツファイ
バー等のガラス基材、またはポリエステル繊維、アラミ
ド繊維等の合成樹脂繊維基材があり、電気特性やその他
特性を考慮して選択することが望ましい。Further, as the reinforcing base material of the printed wiring base material A, a paper base material such as linter paper or kraft paper, a glass base material such as glass cloth, glass mat, glass paper or quartz fiber, or polyester fiber, There are synthetic resin fiber base materials such as aramid fibers, and it is desirable to select them in consideration of electrical characteristics and other characteristics.
【００２６】また、本発明のプリント配線基板は、その
構成要素からわかるように容易に可とう性を付与するこ
とが可能であり、複雑な形状へも対応できる。Further, the printed wiring board of the present invention can be easily imparted with flexibility as can be seen from its constituent elements, and can cope with complicated shapes.
【００２７】図５（ａ）及び図５（ｂ）には、本発明の
効果を検証するにあたって、プリント配線基板の両面に
配線導体を有し、かつ電子部品が実装された状態の電磁
環境を想定したプリント配線基板の特性評価系の説明図
を示す。図５（ａ）は、透過レベル［ｄＢ］を測定する
ための評価系の説明図であり、図５（ｂ）は、結合レベ
ル［ｄＢ］を測定するための評価系の説明図である。各
々の場合とも、電磁界波源用発振器９及び電磁界強度測
定器１０には、ループ径２ｍｍ以下の電磁界送信用微小
ループアンテナ１１、電磁界受信用微小ループアンテナ
１２を用いている。透過レベルもしくは結合レベルの測
定には、スペクトラムアナライザ（図示せず）を使用し
た。5 (a) and 5 (b), in order to verify the effects of the present invention, an electromagnetic environment in which wiring conductors are provided on both sides of a printed wiring board and electronic parts are mounted is shown. The explanatory view of the characteristic evaluation system of the assumed printed wiring board is shown. FIG. 5A is an explanatory diagram of an evaluation system for measuring the transmission level [dB], and FIG. 5B is an explanatory diagram of an evaluation system for measuring the coupling level [dB]. In each case, the electromagnetic field wave source oscillator 9 and the electromagnetic field intensity measuring instrument 10 use an electromagnetic field transmitting minute loop antenna 11 and an electromagnetic field receiving minute loop antenna 12 having a loop diameter of 2 mm or less. A spectrum analyzer (not shown) was used to measure the transmission level or the coupling level.
【００２８】［検証例１］導電性支持体として７５μｍ
のポリイミドフィルムの両面に下記の＜組成１＞の配合
からなる銅ペーストをドクターブレード法にて成膜し、
その後この導電性支持体の両面に下記の＜組成２＞の配
合からなる軟磁性体ペーストをドクターブレード法によ
り塗工し、８５℃にて２４時間キュアリングを行い評価
用試料を得た。尚、振動型磁力計並びに走査型電子顕微
鏡を用いて解析したところ、磁化容易軸及び磁性粒子配
向方向は試料面内方向であった。また軟磁性体層の表面
にガラスクロスにポリイミド樹脂を含浸した補強基材を
設けた。[Verification Example 1] 75 μm as a conductive support
A copper paste composed of the following <composition 1> is formed on both sides of the polyimide film by the doctor blade method,
After that, a soft magnetic paste composed of the following <Composition 2> was applied to both surfaces of this conductive support by a doctor blade method, and curing was performed at 85 ° C. for 24 hours to obtain a sample for evaluation. When analyzed using a vibrating magnetometer and a scanning electron microscope, the easy axis of magnetization and the orientation direction of the magnetic particles were in the in-plane direction of the sample. Further, a reinforcing base material obtained by impregnating glass cloth with a polyimide resin was provided on the surface of the soft magnetic material layer.
【００２９】 ＜組成１＞ 銅微粉末 ・・・・・・ ９５重量部 平均粒径：３μｍ 有機結合剤 ポリビニルブチラール樹脂 ・・・・・・ ４重量部 硬化剤（イソシアネート化合物） ・・・・・・ １重量部 溶剤（エチルセロソルブ） ・・・・・・ ３５重量部 ＜組成２＞ 扁平状軟磁性体微粉末 ・・・・・・ ９０重量部 組成：Ｆｅ−Ａｌ−Ｓｉ合金 平均粒径：１０μｍ アスペクト比：＞５ 有機結合剤 ポリウレタン樹脂 ・・・・・・ ８重量部 硬化剤（イソシアネート化合物） ・・・・・・ ２重量部 溶剤（シクロヘキサノンとトルエンとの化合物）・・・・・・ ４０重量部 溶剤（エチルセロソルブ） ・・・・・・ ３５重量部[0029] <Composition 1> Fine copper powder --- 95 parts by weight Average particle size: 3 μm Organic binder Polyvinyl butyral resin: 4 parts by weight Curing agent (isocyanate compound): 1 part by weight Solvent (ethyl cellosolve) 35 parts by weight <Composition 2> Flat soft magnetic fine powder ..... 90 parts by weight Composition: Fe-Al-Si alloy Average particle size: 10 μm Aspect ratio:> 5 Organic binder Polyurethane resin: 8 parts by weight Curing agent (isocyanate compound): 2 parts by weight Solvent (compound of cyclohexanone and toluene): 40 parts by weight Solvent (ethyl cellosolve) 35 parts by weight
【００３０】［比較例１］比較試料として、７５μｍの
ポリイミドフィルムの両面に上記＜組成１＞の配合から
なる銅ペーストをドクターブレード法にて成膜し、その
後この導電性支持体の両面に評価用試料と同等の厚みと
なるようガラスクロスにポリイミド樹脂を含浸した補強
基材を設け、比較用試料を得た。[Comparative Example 1] As a comparative sample, a copper paste having the composition of <Composition 1> was formed on both sides of a 75 μm polyimide film by a doctor blade method, and then evaluated on both sides of this conductive support. A glass cloth was provided with a reinforcing base material impregnated with a polyimide resin so as to have a thickness equivalent to that of the test sample, and a comparative sample was obtained.
【００３１】評価用試料及び比較用試料の透過レベル及
び結合レベル図５（ａ）及び図５（ｂ）に示す評価系に
て測定した結果を図６（ａ）及び図６（ｂ）に示す。図
６（ａ）は、比較用試料及び評価用試料の透過レベル
［ｄＢ］の周波数ｆ［ＧＨｚ］特性である。ここで、透
過レベルの基準は、試料を挿入しない状態の電磁界強度
とした。図６（ｂ）は比較用試料及び評価用試料の結合
レベル［ｄＢ］の周波数ｆ［ＧＨｚ］特性図である。こ
こで、結合レベルの基準は、試料を挿入しない状態の電
磁界強度とした。Transmission Level and Binding Level of Evaluation Sample and Comparative Sample The results measured by the evaluation system shown in FIGS. 5 (a) and 5 (b) are shown in FIGS. 6 (a) and 6 (b). . FIG. 6A shows the frequency f [GHz] characteristic of the transmission level [dB] of the comparative sample and the evaluation sample. Here, the standard of the transmission level was the electromagnetic field strength in the state where the sample was not inserted. FIG. 6B is a frequency f [GHz] characteristic diagram of the coupling level [dB] of the comparative sample and the evaluation sample. Here, the standard of the coupling level was the electromagnetic field strength in the state where the sample was not inserted.
【００３２】図６（ａ）及び図６（ｂ）からも判るよう
に、比較用試料である導電体（銅ペースト）のみの場合
においては、透過レベルは大幅に低下するものの、結合
レベルが増大してしまい問題である。一方評価用試料に
おいては、透過レベルは比較用試料である導電体（銅ペ
ースト）と同様に十分低下しており、また結合レベルも
増大することがない。As can be seen from FIGS. 6 (a) and 6 (b), in the case of using only the conductor (copper paste) as the comparative sample, the transmission level is significantly lowered, but the coupling level is increased. It is a problem. On the other hand, in the sample for evaluation, the transmission level is sufficiently lowered similarly to the conductor (copper paste) which is the sample for comparison, and the bonding level is not increased.
【００３３】さらに、導電性支持体層と絶縁性軟磁性体
層からなるプリント配線基板に電子部品を実装し、電気
的回路動作を確認したところ磁性体及び導電体による悪
影響は見られなかった。Furthermore, when electronic components were mounted on a printed wiring board consisting of a conductive support layer and an insulating soft magnetic material layer and the electrical circuit operation was confirmed, no adverse effects of the magnetic material and the conductive material were observed.
【００３４】[0034]
【発明の効果】以上、実施例により説明したように、本
発明により、電磁波の遮蔽効果と電磁波の吸収効果をも
たせることが可能となり、しかも外部からの電磁波の影
響や回路からの電磁波の発生を抑制し得る極めて信頼性
の高いプリント配線基板が得られる。As described above with reference to the embodiments, according to the present invention, it is possible to have an electromagnetic wave shielding effect and an electromagnetic wave absorbing effect, and further, it is possible to prevent the influence of external electromagnetic waves and the generation of electromagnetic waves from circuits. An extremely reliable printed wiring board that can be suppressed can be obtained.
【図１】本発明の実施例であるプリント配線基板の一部
断面図。FIG. 1 is a partial cross-sectional view of a printed wiring board that is an embodiment of the present invention.
【図２】本発明のプリント配線基板であるプリント配線
基材の第一の実施例の一部断面図。FIG. 2 is a partial cross-sectional view of a first embodiment of a printed wiring base material that is the printed wiring board of the present invention.
【図３】本発明のプリント配線基板であるプリント配線
基材の第二の実施例の一部断面図。FIG. 3 is a partial cross-sectional view of a second embodiment of a printed wiring base material that is the printed wiring board of the present invention.
【図４】本発明のプリント配線基板であるプリント配線
基材の第三の実施例の一部断面図。FIG. 4 is a partial cross-sectional view of a third embodiment of a printed wiring base material that is the printed wiring board of the present invention.
【図５】電磁干渉の抑制効果を評価するために用いた評
価系の説明図。図５（ａ）は透過レベルを測定するため
の評価系の説明図。図５（ｂ）は結合レベルを測定する
ための評価系の説明図。FIG. 5 is an explanatory diagram of an evaluation system used to evaluate the effect of suppressing electromagnetic interference. FIG. 5A is an explanatory diagram of an evaluation system for measuring the transmission level. FIG. 5B is an explanatory diagram of an evaluation system for measuring the binding level.
【図６】検証用試料及び比較用試料を図５（ａ）及び図
５（ｂ）の評価系にて測定した抑制効果の周波数依存性
を示す特性図。図６（ａ）は透過レベルの周波数特性
図、図６（ｂ）は結合レベルの周波数特性図。FIG. 6 is a characteristic diagram showing the frequency dependence of the suppression effect obtained by measuring the verification sample and the comparative sample with the evaluation system of FIGS. 5 (a) and 5 (b). FIG. 6A is a transmission level frequency characteristic diagram, and FIG. 6B is a coupling level frequency characteristic diagram.
Ａ プリント配線基材 １ 配線導体 ２ スルーホール ３ 導電性支持体（または、導電性軟磁性支持体） ４ 絶縁性軟磁性体 ５ 軟磁性体粉末 ６ 有機結合剤 ７ 誘電体層 ８ 誘電体粉末 ９ 電磁界波源用発振器 １０ 電磁界強度測定器 １１ 電磁界送信用微小ループアンテナ １２ 電磁界受信用微小ループアンテナ A printed wiring board 1 wiring conductor 2 through holes 3 Conductive support (or conductive soft magnetic support) 4 Insulating soft magnetic material 5 Soft magnetic powder 6 Organic binder 7 Dielectric layer 8 Dielectric powder 9 Electromagnetic wave wave source oscillator 10 Electromagnetic field strength measuring instrument 11 Micro loop antenna for electromagnetic field transmission 12 Micro loop antenna for electromagnetic field reception
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平５−95197（ＪＰ，Ａ) 特開 平６−77684（ＪＰ，Ａ) 特開 平５−299873（ＪＰ，Ａ) 特開 平４−352498（ＪＰ，Ａ) 特開 平７−66587（ＪＰ，Ａ) 特開 平７−193369（ＪＰ，Ａ) 特開 平２−256291（ＪＰ，Ａ) 特開 昭63−246900（ＪＰ，Ａ) 実開 平１−176966（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 9/00 H05K 1/02 - 1/03 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-5-95197 (JP, A) JP-A-6-77684 (JP, A) JP-A-5-299873 (JP, A) JP-A-4- 352498 (JP, A) JP 7-66587 (JP, A) JP 7-193369 (JP, A) JP 2-256291 (JP, A) JP 63-246900 (JP, A) Actual Kaihei 1-176966 (JP, U) (58) Fields investigated (Int.Cl. 7 , DB name) H05K 9/00 H05K 1/02-1/03
Claims (4)
に配線導体を有するプリント配線基板において、前記プ
リント配線基材が、導電性支持体と、該導電性支持体の
両面に設けられた絶縁性軟磁性体の層を有し、該絶縁性
軟磁性体の層は軟磁性体粉末と有機結合剤とを含むこと
を特徴とするプリント配線基板。1. A printed wiring board having a wiring conductor on one side or both sides of a printed wiring substrate, wherein the printed wiring substrate is a conductive support and an insulating property provided on both sides of the conductive support. A printed wiring board having a layer of a soft magnetic material, the insulating soft magnetic material layer containing a soft magnetic material powder and an organic binder.
に配線導体を有するプリント配線基板において、前記プ
リント配線基材が、導電性支持体と、該導電性支持体の
両面に設けられた絶縁性軟磁性体の層とを有すると共
に、該絶縁性軟磁性体の層の少なくとも片面に誘電体層
を有し、前記絶縁性軟磁性体の層は軟磁性体粉末と有機
結合剤とを含み、前記誘電体層は誘電体粉末と有機結合
剤とを含むことを特徴とするプリント配線基板。2. A printed wiring board having wiring conductors on one side or both sides of a printed wiring base material, wherein the printed wiring base material is a conductive support, and an insulating property provided on both sides of the conductive support. With a layer of a soft magnetic material, a dielectric layer on at least one surface of the insulating soft magnetic material layer, the insulating soft magnetic material layer contains a soft magnetic powder and an organic binder, The printed wiring board according to claim 1, wherein the dielectric layer includes a dielectric powder and an organic binder.
に配線導体を有するプリント配線基板において、前記プ
リント配線基材が、導電性支持体と、該導電性支持体の
両面に設けられた絶縁性軟磁性体の層とを有し、該絶縁
性軟磁性体の層は、軟磁性体粉末、誘電体粉末、及び有
機結合剤を含むことを特徴とするプリント配線基板。3. A printed wiring board having a wiring conductor on one side or both sides of a printed wiring base material, wherein the printed wiring base material is a conductive support, and an insulating property provided on both sides of the conductive support. A layer of a soft magnetic material, the insulating soft magnetic material layer containing a soft magnetic material powder, a dielectric material powder, and an organic binder.
は針状の粉末であることを特徴とする請求項１、２また
は３記載のプリント配線基板。4. The printed wiring board according to claim 1, wherein the soft magnetic powder is a flat and / or acicular powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19770194A JP3528257B2 (en) | 1994-07-29 | 1994-07-29 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19770194A JP3528257B2 (en) | 1994-07-29 | 1994-07-29 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0846386A JPH0846386A (en) | 1996-02-16 |
| JP3528257B2 true JP3528257B2 (en) | 2004-05-17 |
Family
ID=16378928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19770194A Expired - Fee Related JP3528257B2 (en) | 1994-07-29 | 1994-07-29 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3528257B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1079593A (en) * | 1996-09-05 | 1998-03-24 | Tokin Corp | Magnetic prepreg, its manufacturing method and printed circuit board using it |
| JP3217326B2 (en) | 1999-03-19 | 2001-10-09 | 富士通株式会社 | Ferroelectric memory with electromagnetic shielding structure |
| JP2001237586A (en) * | 2000-02-25 | 2001-08-31 | Matsushita Electric Ind Co Ltd | Circuit board, module incorporating circuit part, and manufacturing method thereof |
| JP4500179B2 (en) * | 2005-02-23 | 2010-07-14 | 三共化成株式会社 | Circuit component manufacturing method |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63246900A (en) * | 1987-04-02 | 1988-10-13 | Tdk Corp | Composite radio wave absorber |
| JPH01176966U (en) * | 1988-06-02 | 1989-12-18 | ||
| JPH02256291A (en) * | 1988-12-26 | 1990-10-17 | Mitsubishi Rayon Co Ltd | Printed wiring board |
| JPH04352498A (en) * | 1991-05-30 | 1992-12-07 | Mitsui Toatsu Chem Inc | Insulation paste for electromagnetic shield with high permeability |
| JPH0595197A (en) * | 1991-10-01 | 1993-04-16 | Mitsui Toatsu Chem Inc | Printed wiring board and substrate used therefor |
| JP2857960B2 (en) * | 1992-04-22 | 1999-02-17 | テン株式会社 | Manufacturing method of radio wave absorber |
| JP3234956B2 (en) * | 1992-08-25 | 2001-12-04 | 株式会社トーキン | Printed circuit board and method of manufacturing the same |
| JPH0766587A (en) * | 1993-08-23 | 1995-03-10 | Cmk Corp | Printed wiring board having magnetic coating and electromgnetic shield layer, and its manufacture |
| JPH07193369A (en) * | 1993-12-27 | 1995-07-28 | Matsushita Electric Ind Co Ltd | Method of manufacturing thick film multilayer wiring substrate |
-
1994
- 1994-07-29 JP JP19770194A patent/JP3528257B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0846386A (en) | 1996-02-16 |
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