JP3505691B2 - Electronic equipment - Google Patents
Electronic equipmentInfo
- Publication number
- JP3505691B2 JP3505691B2 JP00849295A JP849295A JP3505691B2 JP 3505691 B2 JP3505691 B2 JP 3505691B2 JP 00849295 A JP00849295 A JP 00849295A JP 849295 A JP849295 A JP 849295A JP 3505691 B2 JP3505691 B2 JP 3505691B2
- Authority
- JP
- Japan
- Prior art keywords
- soft magnetic
- wiring board
- electronic device
- insulating soft
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Description
【発明の詳細な説明】Detailed Description of the Invention
【０００１】[0001]
【産業上の利用分野】本発明は電子装置に関し、特に、
配線基板上に半導体素子等の能動素子が実装された電子
装置に関する。FIELD OF THE INVENTION This invention relates to electronic devices, and in particular
The present invention relates to an electronic device in which an active element such as a semiconductor element is mounted on a wiring board.
【０００２】[0002]
【従来の技術】ディジタル電子機器をはじめとして高周
波を利用する電子機器類が小型化の傾向にある。そし
て、配線基板への部品実装密度が高いディジタル電子機
器においては、中央演算処理装置（ＣＰＵ）又は画像プ
ロセッサ算術論理演算装置（ＩＰＡＬＵ）等のＬＳＩ及
びＩＣが配線基板上に実装されている。これらＬＳＩ及
びＩＣは多数の半導体素子で構成されており、これら半
導体素子は、外部からエネルギーの供給を受けて、増幅
又は発振等の作用を行うため、一般に能動素子と呼ばれ
ている。そして、このような能動素子は誘導性ノイズを
発生することが多い。この誘導性ノイズによって配線基
板の素子実装面と同一面及び反対面には高周波磁界が誘
導される。2. Description of the Related Art Electronic devices such as digital electronic devices that utilize high frequencies tend to be miniaturized. In a digital electronic device having a high component mounting density on a wiring board, an LSI and an IC such as a central processing unit (CPU) or an image processor arithmetic logic unit (IPALU) are mounted on the wiring board. These LSIs and ICs are composed of a large number of semiconductor elements, and these semiconductor elements are generally called active elements because they receive an energy supply from the outside and perform an operation such as amplification or oscillation. And, such active elements often generate inductive noise. Due to this inductive noise, a high-frequency magnetic field is induced on the same surface as the element mounting surface of the wiring board and the opposite surface.
【０００３】この誘導高周波磁界によって配線基板にお
いて電磁結合による線間結合が増大するばかりでなく放
射ノイズが発生する。このように、放射ノイズが発生す
ると、装置内部において誤動作が生じるばかりでなく、
この放射ノイズが外部接続端子を経て外部に放射され
る。この結果、他の機器に悪影響を及ぼすことがある。
このような誤動作及び他の機器への悪影響は一般に電磁
障害と呼ばれる。This induced high frequency magnetic field not only increases line coupling due to electromagnetic coupling in the wiring board, but also causes radiation noise. In this way, when radiation noise occurs, not only malfunctions occur inside the device, but also
This radiation noise is radiated to the outside through the external connection terminal. As a result, other devices may be adversely affected.
Such malfunctions and adverse effects on other devices are generally called electromagnetic interference.
【０００４】このような電磁障害に対して従来次の対策
が一般に採られている。Conventionally, the following measures have conventionally been taken against such electromagnetic interference.
【０００５】電子機器において誘導性ノイズを発生す
る回路にフィルタを接続する。
問題となる回路（誘導性ノイズを発生する回路）を影
響を受ける回路から遠ざける。
シールディングを行う。
グラウンディングを行う。A filter is connected to a circuit that generates inductive noise in an electronic device. Move problematic circuits (circuits that generate inductive noise) away from affected circuits. Shield. Perform grounding.
【０００６】上述の乃至の対策を講じることによっ
て、電磁障害の原因となる電磁結合、不要輻射、及び伝
導ノイズを抑制している。By taking the above-mentioned measures (1) to (3), the electromagnetic coupling, unnecessary radiation, and conduction noise that cause electromagnetic interference are suppressed.
【０００７】[0007]
【発明が解決しようとする課題】ところが、能動素子を
含む電子部品が高密度実装された配線基板において、上
述の電磁障害を効率的に処置しようとする場合、従来の
対策（ノイズ抑制方法）では次のような問題点がある。However, in order to efficiently deal with the above electromagnetic interference in a wiring board in which electronic components including active elements are mounted at a high density, conventional measures (noise suppressing method) are used. There are the following problems.
【０００８】ノイズ対策の専門的知識と経験を必要と
する。
対策に時間を要する。
使用するフィルタが高価である。
フィルタを実装するスペースに制約のあることが多
い。
フィルタの実装作業に困難性を伴う。
フィルタ等を用いるので電子装置を組み立てるための
所要工程数が多くなってコストアップとなってしまう。Expert knowledge and experience in noise suppression are required. It takes time to take measures. The filters used are expensive. There are often restrictions on the space for implementing filters. Difficulty is involved in the filter mounting work. Since a filter or the like is used, the number of steps required for assembling the electronic device is increased and the cost is increased.
【０００９】特に、同一回路内の部品間で発生する信号
線間の電磁誘導及び不要電磁波による相互干渉を抑制し
ようとする場合、特に、対策を講じる必要があるが、従
来の抑制方法ではそれが充分でない。さらに、電子装置
の小型軽量化を図る際には、フィルタ及びその実装スペ
ースの排除を行う必要がある。In particular, in order to suppress the electromagnetic interference between the signal lines generated between the components in the same circuit and the mutual interference due to the unnecessary electromagnetic waves, it is necessary to take a countermeasure, but in the conventional suppressing method, it is necessary. Not enough. Further, in order to reduce the size and weight of the electronic device, it is necessary to eliminate the filter and its mounting space.
【００１０】本発明の目的は、小型軽量でしかも電磁障
害を効果的に抑制することのできる電子装置を提供する
ことにある。It is an object of the present invention to provide an electronic device which is small and lightweight and which can effectively suppress electromagnetic interference.
【００１１】[0011]
【課題を解決するための手段】本発明によれば、配線基
板と、該配線基板上に実装され誘導性ノイズを放射する
能動素子とを有する電子装置において、前記配線基板と
前記能動素子との間には絶縁性軟磁性体層が形成されて
いることを特徴とする電子装置が得られる。この際、前
記配線基板のパターン間にも絶縁性軟磁性体層が形成さ
れる。絶縁性軟磁性体層は、有機結合剤と、該有機結合
剤中に分散された軟磁性体粉末とを有しており、軟磁性
体粉末はその形状が偏平状及び針状のうち少なくとも一
つの形状であることが望ましい。According to the present invention, in an electronic device having a wiring board and an active element mounted on the wiring board and radiating inductive noise, the wiring board and the active element are provided. An electronic device is obtained in which an insulating soft magnetic material layer is formed between them. At this time, the insulating soft magnetic layer is also formed between the patterns on the wiring board. The insulating soft magnetic material layer has an organic binder and a soft magnetic powder dispersed in the organic binder, and the soft magnetic powder has at least one of a flat shape and a needle shape. It is desirable to have two shapes.
【００１２】[0012]
【作用】配線基板と前記能動素子との間に絶縁性軟磁性
体層を形成するとともに配線基板のパターン間に絶縁性
軟磁性体層を形成することによって、不要輻射による電
磁結合の増大は絶縁性軟磁性体層によって抑制される。
この絶縁性軟磁性体層は、本来、導電性物質である軟磁
性金属を微細粉末化して、絶縁性の有機結合剤と混練し
て、有機結合剤中に軟磁性体粉末を分散させることによ
って、絶縁層となっている。そして、軟磁性体粉末の形
状を偏平状及び針状のうち少なくとも一つの形状とする
ことによって、形状磁気異方性が出現し、高周波領域に
おいて磁気共鳴に基づく複素透磁率が増大して、これに
よって、不要輻射成分を効率的に吸収抑制することがで
きる。By forming an insulating soft magnetic material layer between the wiring board and the active element and forming an insulating soft magnetic material layer between the patterns of the wiring board, increase in electromagnetic coupling due to unnecessary radiation is prevented. Suppressed by the soft magnetic layer.
This insulative soft magnetic layer is made by finely powdering soft magnetic metal, which is originally a conductive substance, and kneading with an insulating organic binder to disperse the soft magnetic powder in the organic binder. , Is an insulating layer. Then, by making the shape of the soft magnetic powder into at least one of a flat shape and a needle shape, shape magnetic anisotropy appears, and the complex magnetic permeability based on magnetic resonance increases in the high frequency region. This makes it possible to efficiently absorb and suppress unnecessary radiation components.
【００１３】[0013]
【実施例】以下本発明について実施例によって説明す
る。EXAMPLES The present invention will be described below with reference to examples.
【００１４】図１を参照して、図示の電子装置では配線
基板１上にＬＳＩ２が実装されている。そして、ＬＳＩ
２の下側に位置して配線基板１の裏面には配線導体（パ
ターン）３が配線されている。図示のように、ＬＳＩ２
は配線基板１から僅かに浮いた状態で配線基板１上に実
装されており、配線基板１とＬＳＩ２との間において、
配線基板１上には絶縁性軟磁性体層Ａが印刷されてい
る。この実施例では、絶縁性軟磁性体層ＡはＬＳＩ２の
真下に位置し、絶縁性軟磁性体層Ａの面積はＬＳＩ２の
面積と同一である。Referring to FIG. 1, in the illustrated electronic device, an LSI 2 is mounted on a wiring board 1. And LSI
Wiring conductors (patterns) 3 are wired on the back surface of the wiring board 1 located below the wiring board 2. LSI2 as shown
Is mounted on the wiring board 1 in a state of slightly floating from the wiring board 1, and between the wiring board 1 and the LSI 2,
An insulating soft magnetic layer A is printed on the wiring board 1. In this embodiment, the insulating soft magnetic material layer A is located directly below the LSI 2, and the area of the insulating soft magnetic material layer A is the same as the area of the LSI 2.
【００１５】上述のように、絶縁性軟磁性体層Ａを設け
ると、絶縁性軟磁性体層Ａは、ＬＳＩ２が発生する高周
波電磁界における磁束を集束する。この結果、ＬＳＩ２
と配線基板１との誘導結合が微弱となって、配線基板３
に生じるノイズを効率的に抑制することができる。As described above, when the insulating soft magnetic material layer A is provided, the insulating soft magnetic material layer A focuses the magnetic flux in the high frequency electromagnetic field generated by the LSI 2. As a result, LSI2
The inductive coupling between the wiring board 1 and the wiring board 1 becomes weak, and the wiring board 3
It is possible to efficiently suppress the noise generated in the.
【００１６】図２を参照して、本発明による電子装置の
他の実施例について説明する。図示の電子装置では配線
基板１上にＬＳＩ２及び４が実装され、図示のように、
これらＬＳＩ２及び４は配線導体（パターン）５，６、
及び７によって接続されている。配線導体５及び６間と
配線導体６及び７間とにおいて、配線基板１上には絶縁
性軟磁性体層Ａが印刷されている。Another embodiment of the electronic device according to the present invention will be described with reference to FIG. In the illustrated electronic device, the LSIs 2 and 4 are mounted on the wiring board 1, and as shown in the drawing,
These LSIs 2 and 4 are wiring conductors (patterns) 5, 6,
And 7 are connected. An insulating soft magnetic material layer A is printed on the wiring board 1 between the wiring conductors 5 and 6 and between the wiring conductors 6 and 7.
【００１７】このように、絶縁性軟磁性体層Ａを設ける
と、絶縁性軟磁性体層Ａは、各配線導体から発生する高
周波電磁界による磁束を集束する。その結果、配線導体
間のクロストークが抑制される。As described above, when the insulating soft magnetic layer A is provided, the insulating soft magnetic layer A focuses the magnetic flux generated by the high frequency electromagnetic field generated from each wiring conductor. As a result, crosstalk between the wiring conductors is suppressed.
【００１８】ここで、図３を参照して、上述の絶縁性軟
磁性体層Ａについて説明する。この絶縁性軟磁性体層Ａ
は軟磁性体粉末８と有機結合剤９とを含んでいる。具体
的には、図示のように有機結合剤９中に軟磁性体粉末８
が均一に分散されている。ここで、軟磁性体粉末８の形
状は偏平状又は針状であるか偏平状及び針状である。つ
まり、軟磁性体粉末８の形状は、偏平状及び針状の少な
くとも一形状である。Here, the insulating soft magnetic material layer A will be described with reference to FIG. This insulating soft magnetic layer A
Contains the soft magnetic powder 8 and the organic binder 9. Specifically, as shown in the figure, the soft magnetic powder 8 is added to the organic binder 9.
Are evenly dispersed. Here, the shape of the soft magnetic powder 8 is flat or needle-like, or flat and needle-like. That is, the soft magnetic powder 8 has at least one of a flat shape and a needle shape.
【００１９】軟磁性体粉末８として、高周波透磁率の大
きな粉末が用いられる。例えば、鉄アルミ珪素合金粉末
（センダスト）又は鉄ニッケル合金粉末（パーマロイ）
が用いられる。なお、軟磁性体粉末８のアスペクト比は
十分大きい（約５：１以上）であることが望ましい。As the soft magnetic powder 8, a powder having a high magnetic permeability is used. For example, iron aluminum silicon alloy powder (Sendust) or iron nickel alloy powder (Permalloy)
Is used. The aspect ratio of the soft magnetic powder 8 is preferably sufficiently large (about 5: 1 or more).
【００２０】有機結合剤９として、例えば、ホリエステ
ル系樹脂、ポリ塩化ビニル系樹脂、ホリビニルブチラー
ル樹脂、ポリウレタン樹脂、セルロース系樹脂、ニトリ
ル−ブタジエン系ゴム、スチレン−ブタジエン系ゴム等
の熱可塑性樹脂、又はこれらの共重合体、エポキシ樹
脂、フェノール樹脂、アミド系樹脂、及びイミド系樹脂
等の熱硬化性樹脂等が用いられる。As the organic binder 9, for example, thermoplastic resin such as polyester resin, polyvinyl chloride resin, polyvinyl butyral resin, polyurethane resin, cellulose resin, nitrile-butadiene rubber, styrene-butadiene rubber, etc. Alternatively, a thermosetting resin such as a copolymer thereof, an epoxy resin, a phenol resin, an amide resin, or an imide resin may be used.
【００２１】ここで、上述した電子装置の一例を具体的
に説明する。Here, an example of the above-mentioned electronic device will be specifically described.
【００２２】能動素子が実装される基板部分及び互いに
平行に配列された配線導体間の基板部分において、配線
基板上には下記の＜組成１＞で示す軟磁性体ペーストが
印刷されて、乾燥・硬化された。この結果、厚みが０．
３ｍｍの絶縁性軟磁性体層を配線基板上に形成した。こ
の絶縁性軟磁性体層を振動型磁力計及び走査型電子顕微
鏡を用いて解析したところ、磁化容易軸及び磁性粒子配
向方向は試料面内方向であった。In the board portion on which the active element is mounted and the board portion between the wiring conductors arranged in parallel with each other, a soft magnetic paste represented by the following <composition 1> is printed on the wiring board and dried. Cured As a result, the thickness is 0.
An insulating soft magnetic layer of 3 mm was formed on the wiring board. When this insulating soft magnetic layer was analyzed using a vibrating magnetometer and a scanning electron microscope, the easy axis of magnetization and the orientation of magnetic particles were in the in-plane direction of the sample.
【００２３】＜組成１＞
（１）偏平状軟磁性体微分末…９０重量部
組成：Ｆｅ−Ａｌ−Ｓｉ合金
平均粒径：１０μｍ
アスペクト比：＞５
（２）有機結合剤
ポリウレタン樹脂…８重量部
硬化材（イソシアネート化合物）…２重量部
（３）溶剤（シクロヘキサノンとトルエンとの化合物）
…４０重量部
上述のようにして絶縁性軟磁性体層を形成した配線基板
において、所定の部品を実装した後、回路を動作させ
た。この状態で、配線基板下の電磁界強度をスペクトラ
ムアナライザで測定して、電磁干渉抑制の効果を確認し
た。<Composition 1> (1) Flat soft magnetic material differential powder ... 90 parts by weight Composition: Fe-Al-Si alloy average particle size: 10 μm Aspect ratio:> 5 (2) Organic binder polyurethane resin: 8 parts by weight Part curing material (isocyanate compound) 2 parts by weight (3) Solvent (compound of cyclohexanone and toluene)
40 parts by weight On the wiring board on which the insulating soft magnetic material layer was formed as described above, after mounting predetermined components, the circuit was operated. In this state, the electromagnetic field strength under the wiring board was measured with a spectrum analyzer to confirm the effect of suppressing electromagnetic interference.
【００２４】なお、絶縁性軟磁性体層が形成されていな
い配線基板についても、所定の部品を実装した後、回路
を動作させた状態で、配線基板下の電磁界強度をスペク
トラムアナライザで測定した。For a wiring board on which an insulating soft magnetic material layer is not formed, the electromagnetic field strength under the wiring board was measured with a spectrum analyzer in a state where the circuit was operated after mounting predetermined components. .
【００２５】図４乃至図７にその測定結果を示す。な
お、ここでは、部品としてＬＳＩ２及び４が実装されＬ
ＳＩ２及び４が配線導体５乃至７で接続された電子装置
について配線基板下の電磁界強度を測定した結果が示さ
れている。図４は絶縁性軟磁性体層が形成されていない
配線基板を用いた際のＬＳＩ１２実装面の裏側（裏面）
における電磁界強度の周波数特性を示す。図５は絶縁性
軟磁性体層が形成された配線基板を用いた際のＬＳＩ１
２実装面の裏側（裏面）における電磁界強度の周波数特
性を示す。図６は絶縁性軟磁性体層が形成されていない
配線基板を用いた際の配線導体７に対応する配線基板裏
面における電磁界強度の周波数特性を示す。図７は絶縁
性軟磁性体層が形成された配線基板を用いた際の配線導
体７に対応する配線基板裏面における電磁界強度の周波
数特性を示す。The measurement results are shown in FIGS. 4 to 7. Here, the LSIs 2 and 4 are mounted as parts and
The results of measuring the electromagnetic field strength under the wiring board for the electronic device in which SIs 2 and 4 are connected by wiring conductors 5 to 7 are shown. FIG. 4 shows the back side (back side) of the LSI 12 mounting surface when using a wiring board on which the insulating soft magnetic material layer is not formed.
The frequency characteristic of the electromagnetic field strength in is shown. FIG. 5 shows an LSI 1 using a wiring board on which an insulating soft magnetic material layer is formed.
2 shows frequency characteristics of electromagnetic field strength on the back side (back side) of the mounting surface. FIG. 6 shows frequency characteristics of electromagnetic field strength on the back surface of the wiring board corresponding to the wiring conductor 7 when the wiring board on which the insulating soft magnetic material layer is not formed is used. FIG. 7 shows frequency characteristics of electromagnetic field intensity on the back surface of the wiring board corresponding to the wiring conductor 7 when the wiring board having the insulating soft magnetic layer is used.
【００２６】図５乃至図７から容易に理解できるよう
に、絶縁性軟磁性体層が形成された配線基板を用いる
と、能動素子（ＬＳＩ）が実装された配線基板裏面の電
磁界強度は広帯域で抑制されることがわかる。また、隣
接する配線導体間におけるクロストークも低減されるこ
とがわかる。As can be easily understood from FIGS. 5 to 7, when the wiring board on which the insulating soft magnetic material layer is formed is used, the electromagnetic field strength on the back surface of the wiring board on which the active element (LSI) is mounted is wide band. It turns out that is suppressed by. Further, it can be seen that crosstalk between adjacent wiring conductors is also reduced.
【００２７】このように、配線基板上において不要輻射
が問題となる箇所に絶縁性軟磁性体層を設けることによ
って電磁干渉を効果的に抑制することができる。As described above, the electromagnetic interference can be effectively suppressed by providing the insulating soft magnetic material layer on the wiring substrate at a position where unnecessary radiation is a problem.
【００２８】なお、上述の実施例から容易にわかるよう
に、絶縁性軟磁性体層に可とう性をもたせることがで
き、この結果、複雑な形状に変形させることができるば
かりでなく衝撃に対しても良好に対応することができ
る。As can be easily understood from the above-mentioned embodiments, the insulating soft magnetic material layer can be made to have flexibility, and as a result, not only can it be deformed into a complicated shape, but also it can be impacted. However, it can respond well.
【００２９】[0029]
【発明の効果】以上説明したように、本発明ではノイズ
源となる能動素子と配線基板との間に絶縁性軟磁性体を
設け、必要に応じて配線導体間にも絶縁性軟磁性体を設
けるようにしたから、電磁誘導及び不要電磁波による相
互干渉を効果的に抑制することが可能であり、しかもフ
ィルタ等が不要であるから小型軽量化を達成することが
できるという効果がある。この結果、移動体通信機器を
はじめとする高周波機器内における電磁干渉を抑制でき
る。As described above, according to the present invention, the insulating soft magnetic material is provided between the active element which becomes the noise source and the wiring board, and the insulating soft magnetic material is also provided between the wiring conductors if necessary. Since it is provided, it is possible to effectively suppress mutual interference due to electromagnetic induction and unnecessary electromagnetic waves, and further, it is possible to achieve size reduction and weight reduction because a filter or the like is unnecessary. As a result, it is possible to suppress electromagnetic interference in high frequency equipment such as mobile communication equipment.
【図１】本発明による電子装置の一実施例を示す断面図
である。FIG. 1 is a sectional view showing an embodiment of an electronic device according to the present invention.
【図２】本発明による電子装置の他の実施例を部分的に
示す平面図である。FIG. 2 is a plan view partially showing another embodiment of the electronic device according to the present invention.
【図３】図１及び図２に示す絶縁性軟磁性体層の部分断
面図である。FIG. 3 is a partial cross-sectional view of the insulating soft magnetic layer shown in FIGS. 1 and 2.
【図４】絶縁性軟磁性体層が形成されていない電子装置
において能動素子実装面の裏側（裏面）における電磁界
強度の周波数特性を示す図である。FIG. 4 is a diagram showing frequency characteristics of electromagnetic field intensity on the back side (back surface) of the active element mounting surface in an electronic device in which an insulating soft magnetic layer is not formed.
【図５】絶縁性軟磁性体層が形成されている電子装置に
おいて能動素子実装面の裏側（裏面）における電磁界強
度の周波数特性を示す図である。FIG. 5 is a diagram showing frequency characteristics of electromagnetic field intensity on the back side (back surface) of the active element mounting surface in an electronic device in which an insulating soft magnetic layer is formed.
【図６】絶縁性軟磁性体層が形成されていない電子装置
において配線導体に対応する配線基板裏面における電磁
界強度の周波数特性を示す図である。FIG. 6 is a diagram showing frequency characteristics of electromagnetic field intensity on the back surface of a wiring board corresponding to a wiring conductor in an electronic device in which an insulating soft magnetic layer is not formed.
【図７】絶縁性軟磁性体層が形成されている電子装置に
おいて配線導体に対応する配線基板裏面における電磁界
強度の周波数特性を示す図である。FIG. 7 is a diagram showing frequency characteristics of electromagnetic field intensity on a back surface of a wiring substrate corresponding to a wiring conductor in an electronic device in which an insulating soft magnetic layer is formed.
Ａ 絶縁性軟磁性体層 １ 配線基板 ２，４ ＬＳＩ（能動素子） ３，５，６，７ 配線導体 A Insulating soft magnetic layer 1 wiring board 2,4 LSI (Active element) 3,5,6,7 wiring conductor
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平４−294567（ＪＰ，Ａ) 特開 昭60−186040（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 23/00 ─────────────────────────────────────────────────── ─── Continuation of front page (56) Reference JP-A-4-294567 (JP, A) JP-A-60-186040 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) H01L 23/00
Claims (3)
導性ノイズを放射する能動素子とを有する電子装置にお
いて、前記配線基板と前記能動素子とに挟まれた領域の
前記配線基板上に絶縁性軟磁性体層が形成されているこ
とを特徴とする電子装置。1. An electronic device having a wiring board and an active element mounted on the wiring board and radiating inductive noise, in an area sandwiched between the wiring board and the active element .
An electronic device, wherein an insulating soft magnetic material layer is formed on the wiring board .
て、前記絶縁性軟磁性体層は、有機結合剤と、該有機結
合剤中に分散された軟磁性体粉末とを有することを特徴
とする電子装置。2. The electronic device according to claim 1 , wherein the insulating soft magnetic layer includes an organic binder and a soft magnetic powder dispersed in the organic binder. Electronic device to do.
て、前記軟磁性体粉末はその形状が偏平状及び針状のう
ち少なくとも一つの形状であることを特徴とする電子装
置。3. The electronic device according to claim 2 , wherein the soft magnetic powder has at least one of a flat shape and a needle shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP00849295A JP3505691B2 (en) | 1995-01-23 | 1995-01-23 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP00849295A JP3505691B2 (en) | 1995-01-23 | 1995-01-23 | Electronic equipment |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003369981A Division JP4157012B2 (en) | 2003-10-30 | 2003-10-30 | Electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08204054A JPH08204054A (en) | 1996-08-09 |
| JP3505691B2 true JP3505691B2 (en) | 2004-03-08 |
Family
ID=11694623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP00849295A Expired - Lifetime JP3505691B2 (en) | 1995-01-23 | 1995-01-23 | Electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3505691B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1594163A1 (en) * | 2004-05-03 | 2005-11-09 | Commissariat A L'energie Atomique | A screened electrical device and a process for manufacturing the same |
-
1995
- 1995-01-23 JP JP00849295A patent/JP3505691B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08204054A (en) | 1996-08-09 |
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