JP3512470B2 - Method for producing copper / aluminum joined body - Google Patents
Method for producing copper / aluminum joined bodyInfo
- Publication number
- JP3512470B2 JP3512470B2 JP14581794A JP14581794A JP3512470B2 JP 3512470 B2 JP3512470 B2 JP 3512470B2 JP 14581794 A JP14581794 A JP 14581794A JP 14581794 A JP14581794 A JP 14581794A JP 3512470 B2 JP3512470 B2 JP 3512470B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- alloy
- less
- brazing material
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、銅部材とＡｌ合金部材
とを良好に接合する銅・アルミニウム接合体の製造方法
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a copper / aluminum joined body for satisfactorily joining a copper member and an Al alloy member.
【０００２】[0002]
【従来の技術】真空装置部品等には、部材をろう付など
によって接合した精密組立接合体が使用されることが多
く、例えば、Ａｌ合金製の接合体では、複数のＡｌ合金
部材をＡｌ合金ろう材とともに組立て、この組立体を高
真空下で加熱して、真空ろう付することによって清浄な
接合体を製造している。ところで、周知のように通常の
Ａｌ合金ろう材やＡｌ合金部材の表面には３００Å以上
の安定した酸化皮膜が形成されており、ろう付時には、
ろうのぬれを阻害するこの皮膜を破壊する必要がある。
フラックスを用いない真空ろう付方法では、ＪＩＳ Ａ
４００４や同Ａ４１０４に代表されるＡｌ−Ｓｉ−Ｍｇ
系のろう材を使用し、６００℃程度に加熱した雰囲気下
において、ろう材中に１〜２％程度含まれているＭｇで
前記酸化皮膜を破壊することによってろう付を行ってい
る。2. Description of the Related Art For vacuum equipment parts and the like, precision assembled joints in which members are joined by brazing are often used. For example, in the case of Al alloy joints, a plurality of Al alloy members are made of Al alloys. A clean joint is manufactured by assembling with a brazing material, heating this assembly under high vacuum, and vacuum brazing. By the way, as is well known, a stable oxide film of 300 Å or more is formed on the surface of a normal Al alloy brazing material or Al alloy member.
It is necessary to destroy this film that inhibits the wetting of the wax.
With the vacuum brazing method that does not use flux, JIS A
Al-Si-Mg represented by 4004 and A4104
Brazing is performed by using a system brazing filler metal and destroying the oxide film with Mg contained in the brazing filler metal in an amount of about 1 to 2% in an atmosphere heated to about 600 ° C.
【０００３】また真空装置部品には、Ａｌ、Ｃｕのそれ
ぞれの材質の特徴を生かした銅・アルミニウム接合体が
使用されることもあるが、この組立体の接合には、上記
した真空ろう付の方法は採用されていない。この組立体
の接合において、仮に真空ろう付を採用するとすれば、
前記と同様にＡｌ合金部材の酸化皮膜を破壊するために
Ａｌ−Ｓｉ−Ｍｇ系ろう材の使用が必須である。しか
し、これらのろう材では６００℃程度のろう付温度が必
要であり、ろう付中に溶融した高温のろうは、ろう付相
手材であるＣｕを急激に溶融させて、界面に脆弱なＡｌ
−Ｃｕ凝固層を形成してしまう。この凝固層は、接合不
良部や真空漏れのリーク部の原因になるため接合体の品
質を著しく低下させるという問題がある。そこで従来
は、銅・アルミニウム精密組立接合体の製造方法として
は、真空ろう付方法は行わず、摩擦溶接、熱圧着などの
固相溶接法が採用されている。これら固相溶接法では、
銅部材とＡｌ部材とを加圧して塑性変形させ、これによ
って対向する表面層を破壊あるいは分解し、清浄な金属
面同士を密着させて接合している。Further, a copper / aluminum bonded body which makes the best use of the characteristics of Al and Cu materials may be used for the vacuum device parts, and the above-mentioned vacuum brazing is used for bonding this assembly. No method has been adopted. If vacuum brazing is adopted in the joining of this assembly,
Similarly to the above, it is essential to use an Al-Si-Mg-based brazing material in order to destroy the oxide film of the Al alloy member. However, these brazing materials require a brazing temperature of about 600 ° C., and the high-temperature brazing material melted during brazing abruptly melts Cu, which is the mating material for the brazing, to form Al fragile at the interface.
-Cu solidified layer is formed. This solidified layer causes a defective joint portion or a leak portion such as a vacuum leak, and thus has a problem of significantly lowering the quality of the joined body. Therefore, conventionally, as a method for manufacturing a copper / aluminum precision assembly joined body, a solid-state welding method such as friction welding or thermocompression bonding has been adopted without performing the vacuum brazing method. In these solid phase welding methods,
The copper member and the Al member are pressed and plastically deformed, whereby the opposing surface layers are destroyed or decomposed, and clean metal surfaces are brought into close contact with each other and joined.
【０００４】[0004]
【発明が解決しようとする問題点】しかし、従来の固相
溶接法では、溶接変形が大きいため寸法精度が悪く、精
密品としての品質を低下させるという問題があり、ま
た、塑性変形を伴うため形状の制約を受けるという問題
もある。さらに、接合部での返り材の切削除去が必要に
なり、作業能率を低下させるという問題もある。この発
明は、上記事情を背景としてなされたものであり、真空
ろう付を利用して銅部材とアルミニウム部材とを良好に
接合できる銅・アルミニウム接合体の製造方法を提供す
るものである。However, the conventional solid-phase welding method has a problem that dimensional accuracy is poor because the welding deformation is large and the quality as a precision product is deteriorated, and it is accompanied by plastic deformation. There is also the problem of being restricted in shape. Further, the return material needs to be cut and removed at the joint portion, which causes a problem of lowering work efficiency. The present invention has been made in view of the above circumstances, and provides a method for manufacturing a copper / aluminum joined body capable of favorably joining a copper member and an aluminum member by utilizing vacuum brazing.
【０００５】[0005]
【問題を解決するための手段】すなわち本発明の銅・ア
ルミニウム接合体の製造方法のうち第１の発明は、Ａｌ
−Ｓｉ系合金ろう材とＡｌ合金部材の少なくとも接合部
の酸化皮膜厚さを接合加熱前において２００Å以下に調
整し、このＡｌ合金部材および銅部材の接合部間に、前
記Ａｌ−Ｓｉ系合金ろう材をインサート材として配置
し、これら材料を１０-4Ｔｏｒｒ以下の真空下で５００
〜５５０℃に加熱してＡｌ合金部材と銅部材とを接合す
ることを特徴とする。That is, the first invention of the method for producing a copper / aluminum joined body of the present invention is
-The thickness of the oxide film of at least the joint between the Si-based alloy brazing material and the Al alloy member is adjusted to 200 Å or less before joining and heating, and the Al-Si based alloy brazing material is provided between the joints of the Al alloy member and the copper member. Materials are arranged as insert materials, and these materials are placed under a vacuum of 10 -4 Torr or less for 500
It is characterized in that the Al alloy member and the copper member are joined by heating to 550 ° C.
【０００６】また第２の発明は、第１の発明において酸
化皮膜厚さの調整を酸処理によって行うことを特徴とす
る。第３の発明は、第１または第２の発明において、Ａ
ｌ−Ｓｉ系合金ろう材およびＡｌ合金部材のＭｇ含有量
をそれぞれ０．１重量％以下に規制したことを特徴とす
る。第４の発明は、第１から第３の発明において、酸化
皮膜厚さを接合加熱前において１００Å以下、接合加熱
中において１５０Å以下に制限したことを特徴とする。A second aspect of the invention is characterized in that the oxide film thickness is adjusted by acid treatment in the first aspect. A third invention is the same as the first or second invention, except that A
The Mg content of the 1-Si alloy brazing material and the Al alloy member is regulated to 0.1% by weight or less, respectively. A fourth invention is characterized in that, in the first to third inventions, the thickness of the oxide film is limited to 100 Å or less before heating for bonding and 150 Å or less during heating for bonding.
【０００７】なお本願発明で接合対象となるＡｌ合金部
材は、特に組成が限定されるものではないが、第３の発
明に示されるように、Ｍｇが重量％で０．１％以下であ
るのが望ましい（一層望ましくは０．０５％以下）。ま
た、Ｍg と同様にＺｎも重量％で０．１％以下とするの
が望ましく（一層望ましくは０．０５％以下）、さらに
は両者（ＭｇとＺｎ）の合計量を０．１％以下にするの
が望ましい（一層望ましくは０．０５％以下）。またＡ
ｌ合金部材と接合される銅部材は、銅または各種銅合金
からなるものであり、その組成も特に限定されるもので
はなく、例えば純銅、黄銅、青銅等が例示される。The composition of the Al alloy member to be joined in the present invention is not particularly limited, but as shown in the third invention, Mg is 0.1% or less by weight%. Is preferable (more preferably 0.05% or less). Similarly to Mg, Zn is preferably 0.1% or less by weight (more preferably 0.05% or less), and the total amount of both (Mg and Zn) is 0.1% or less. Is preferable (more preferably 0.05% or less). Also A
The copper member joined to the l-alloy member is made of copper or various copper alloys, and the composition thereof is not particularly limited, and examples thereof include pure copper, brass, bronze and the like.
【０００８】次に本発明におけるろう材は、Ｍｇを含有
しないＡｌ−Ｓｉ系のものであり、代表的にはＳｉを重
量％で５〜１５％含むものが挙げられる。そして、接合
が容易になされるように、望ましくは固相線温度が５０
０〜５５０℃の範囲内にあるものが選択される。本発明
におけるろう材は、不純物中のＭｇ含有量を０．１％以
下に規制したものが望ましい。また犠牲陽極作用などを
目的として添加されるＺｎも重量％で０．１％以下にす
るのが望ましく、さらにＭｇとＺｎの合計量も０．１％
以下に規制するのが望ましい。なお、上記Ｍｇ、Ｚｎ、
合計量の規制はさらに０．０５％にするのが一層望まし
い。[0008] Next, the brazing material in the present invention is an Al-Si based material which does not contain Mg, and typically includes a material containing 5 to 15% by weight of Si. The solidus temperature is preferably 50 so as to facilitate the bonding.
Those in the range of 0 to 550 ° C are selected. The brazing material in the present invention is preferably one in which the content of Mg in the impurities is regulated to 0.1% or less. Also, Zn added for the purpose of sacrificial anode function is preferably 0.1% or less by weight, and the total amount of Mg and Zn is 0.1%.
The following restrictions are desirable. The above Mg, Zn,
It is more desirable to regulate the total amount to 0.05%.
【０００９】また、ろう材は、銅部材とＡｌ合金部材と
の間に、インサート材として配置されるので、必要に応
じて、予め所定形状に成形される。このろう材は、ろう
付の際に銅部材とＡｌ合金部材との間に配置する他に、
Ａｌ合金部材や銅部材にクラッドしたものであってもよ
く、少なくとも接合部間に配置されるものであればよ
い。Further, since the brazing material is disposed as an insert material between the copper member and the Al alloy member, it is preliminarily formed into a predetermined shape if necessary. This brazing material is placed between the copper member and the Al alloy member during brazing,
It may be clad with an Al alloy member or a copper member, and may be arranged at least between the joints.
【００１０】また、ろう材およびＡｌ合金部材の接合加
熱前の酸化皮膜厚の調整は、硝酸や硫酸を用いた酸処理
によって行うのが望ましい。処理対象は材料全体が必須
となるものではなく、少なくとも接合部が対象となって
いればよい。この酸処理は、通常は浸漬によって行う
が、塗布や噴霧によって行うことも可能である。なお酸
処理に先立っては、脱脂などの前処理を行うことも可能
であり、苛性処理した後、酸処理するのが望ましい。ま
た酸処理後は、通常、処理表面の洗浄を行うが、酸化皮
膜の変質や成長を避けるために純水で洗浄するのが望ま
しい。Further, it is desirable to adjust the thickness of the oxide film before joining and heating the brazing material and the Al alloy member by acid treatment using nitric acid or sulfuric acid. The material to be treated is not necessarily the entire material, and it is sufficient that at least the joint portion is the object. This acid treatment is usually carried out by dipping, but it can also be carried out by coating or spraying. Prior to the acid treatment, pretreatment such as degreasing can be performed, and it is desirable to perform the acid treatment after the caustic treatment. After the acid treatment, the treated surface is usually washed, but it is desirable to wash with pure water in order to avoid alteration and growth of the oxide film.
【００１１】[0011]
【作用】すなわち本発明によれば、Ａｌ−Ｓｉ系合金ろ
う材およびＡｌ合金部材は、表面酸化皮膜厚さが接合加
熱前に調整されており、高真空下での加熱において清浄
な金属表面が確保される。したがって、接合加熱中にお
いても皮膜厚さが大きく成長しないで一定の範囲内に維
持されているのが望ましく、特に酸処理した皮膜では、
この加熱時の成長が抑制される。これは酸処理した皮膜
は、大気中放置で形成される多孔性の皮膜と異なり、緻
密で不働態化しているので、加熱時にも成長が抑制され
るためと考えられる。特に硝酸や硫酸中に材料を浸漬す
ることによってバリア性の高い皮膜が得られる。In other words, according to the present invention, the Al—Si alloy brazing filler metal and the Al alloy member have the surface oxide film thickness adjusted before the joining and heating, and a clean metal surface is obtained by heating under high vacuum. Reserved. Therefore, it is desirable that the coating thickness does not grow greatly even during bonding heating and is maintained within a certain range.
Growth during this heating is suppressed. This is presumably because the acid-treated film is dense and passivated, unlike a porous film formed by leaving it in the air, and therefore growth is suppressed even when heated. In particular, a film having a high barrier property can be obtained by immersing the material in nitric acid or sulfuric acid.
【００１２】接合加熱の際には、清浄なＡｌ部材または
銅部材の金属表面とろう材面とが接触している。特に、
従来の真空ろう付と異なり、本発明ではＭｇを添加して
いないろう材を使用するのでＭｇの蒸散による汚染がな
く清浄性が保たれる。そして接合加熱は比較的低い温度
でなされるので、ろう材と銅部材との間では銅の急激な
溶融が生ずることはなく、局部的な溶融のみが生じる。
したがって両者の界面部には脆弱なＡｌ−Ｃｕ合金層は
形成されず、強靱なＡｌ−Ｓｉ−Ｃｕ合金層が形成さ
れ、ろう材と銅部材とは良好に接合される。そして、ろ
う材とＡｌ合金部材との間でも良好な溶融接合がなされ
ており、ろう材をインサート材とし、良好な接合状態を
有する銅・アルミニウム接合体が能率よく得られる。得
られた接合体は、リーク部もなく接合強度にも優れてお
り、また製造時の形状の制約も小さいという利点を有し
ており、寸法精度にも優れている。At the time of joining and heating, the metal surface of the clean Al member or the copper member and the brazing material surface are in contact with each other. In particular,
Unlike the conventional vacuum brazing, since the present invention uses a brazing material to which Mg is not added, cleanliness is maintained without contamination due to Mg evaporation. Since the joining heating is performed at a relatively low temperature, the copper is not rapidly melted between the brazing material and the copper member, but only the local melting is generated.
Therefore, the fragile Al-Cu alloy layer is not formed at the interface between the two, a tough Al-Si-Cu alloy layer is formed, and the brazing material and the copper member are bonded well. Good fusion bonding is also performed between the brazing material and the Al alloy member, and the brazing material is used as an insert material to efficiently obtain a copper / aluminum bonded body having a good bonding state. The obtained bonded body has an advantage that there is no leak portion and the bonding strength is excellent, and that there are few restrictions on the shape at the time of manufacturing, and the dimensional accuracy is also excellent.
【００１３】なお、本発明の各条件における限定理由を
以下に説明する。
（１）真空圧：１０-4Ｔｏｒｒ以下
酸化皮膜の成長を抑えるために高真空度が必要である。
ここで真空度が不十分で真空圧が１０-4Ｔｏｒｒよりも
大きいと、酸化皮膜が成長して、材料が良好に接合され
ないので、１０-4Ｔｏｒｒ以下に限定する。なお、同様
の理由で雰囲気圧を１０-6Ｔｏｒｒ以下とするのがさら
に望ましい。The reasons for limitation in each condition of the present invention will be described below. (1) Vacuum pressure: 10 -4 Torr or less A high degree of vacuum is required to suppress the growth of an oxide film.
Here, if the degree of vacuum is insufficient and the vacuum pressure is higher than 10 -4 Torr, an oxide film grows and the materials are not joined well, so the limit is limited to 10 -4 Torr or less. For the same reason, it is more desirable to set the atmospheric pressure to 10 −6 Torr or less.
【００１４】（２）酸化皮膜厚
Ａｌ−Ｓｉ系合金ろう材およびＡｌ合金部材の酸化皮膜
は、良好な接合がなされるように、２００Å以下に調整
する必要があり、これを超えると、酸化皮膜が阻害して
良好な接合がなされない。したがって、接合加熱中にも
厚さが２００Å以下に維持されるのが望ましい。さらに
は、接合加熱中の皮膜厚さを１５０Å以下とするのが望
ましい。また接合加熱前においては、加熱中の若干の皮
膜の成長を考慮して１００Å以下に制限するのが一層望
ましい。(2) Oxide film thickness The oxide film of the Al-Si alloy brazing material and Al alloy member needs to be adjusted to 200 Å or less so that good joining can be achieved. Prevents the good joining. Therefore, it is desirable that the thickness be maintained at 200 Å or less even during bonding heating. Further, it is desirable that the film thickness during the heating of the bonding is 150 Å or less. Further, it is more desirable to limit it to 100 Å or less before the heating of the bonding in consideration of a slight film growth during the heating.
【００１５】（３）接合加熱温度
加熱温度が５００℃未満であるとＡｌ−Ｓｉ−Ｃｕ合金
層の形成が不十分であり、接合不良部が生じてしまう。
また５５０℃を越えると、脆弱なＡｌ−Ｃｕ凝固層が形
成されるので５００〜５５０℃に限定する。(3) Bonding heating temperature If the heating temperature is less than 500 ° C., the Al—Si—Cu alloy layer is not sufficiently formed, resulting in defective bonding.
If it exceeds 550 ° C, a brittle Al-Cu solidified layer is formed, so the temperature is limited to 500 to 550 ° C.
【００１６】（４）Ｍｇ含有量：０．１％以下
Ａｌ合金部材、Ａｌ−Ｓｉろう材にＭｇを０．１％を越
えて含有させると、ろう付中に蒸散して、雰囲気内（真
空炉）およびろう付品を汚染するので、所望により上限
を０．１％とする。 またＭｇ含有量をさらに０．０５
％以下にすると、ろう付品の汚染は一層少なくなる。(4) Mg content: 0.1% or less When an Al alloy member or an Al-Si brazing material contains more than 0.1% of Mg, it evaporates during brazing and the atmosphere (vacuum) The upper limit is set to 0.1% if desired, since it contaminates the furnace) and brazed products. Moreover, the Mg content is further 0.05.
If it is less than%, the contamination of the brazed product is further reduced.
【００１７】[0017]
【実施例】表１〜３に示す組成のろう材、Ａｌ合金部材
および銅部材をそれぞれ用意し、板状に成形したＡｌ合
金部材１の孔に、リング状のＡｌ−Ｓｉ系合金ろう材２
を介してパイプ状の銅部材３を貫通させて組み立てた。
なお、ろう材及びＡｌ合金部材については、表４に示
す前処理（一部は未処理）を行って酸化皮膜厚さを調整
した。 前処理における酸処理は、１０％苛性ソーダ液
中で脱脂、水洗後、直ちに１５％硝酸中へ浸漬し、純水
で水洗、乾燥する方法で行った。次いで表４に示す組み
合わせで組み立てた組立体を、１０-5Ｔｏｒｒに調整し
た真空炉内に置き、表４に示す各温度で３分間の加熱を
行って銅・アルミニウム接合体を製造した。EXAMPLE A brazing material having the composition shown in Tables 1 to 3, an Al alloy member and a copper member were prepared respectively, and a ring-shaped Al-Si alloy brazing material 2 was placed in the hole of the plate-shaped Al alloy member 1.
The pipe-shaped copper member 3 was penetrated through the assembly and assembled.
The brazing material and the Al alloy member were subjected to pretreatment (partly untreated) shown in Table 4 to adjust the oxide film thickness. The acid treatment in the pretreatment was performed by degreasing in 10% caustic soda solution, washing with water, immediately immersing in 15% nitric acid, washing with pure water, and drying. Next, the assembly assembled with the combinations shown in Table 4 was placed in a vacuum furnace adjusted to 10 −5 Torr, and heated at each temperature shown in Table 4 for 3 minutes to manufacture a copper / aluminum bonded body.
【００１８】得られた接合体について、接合部の観察に
よる、ろう付性の評価、引張試験及び衝撃試験による接
合強度の評価を行い、さらに、炉内汚染度について調査
し、それぞれの評価結果を表４に示した。表４から明ら
かなように、実施例の供試材は、いずれの評価項目でも
良好な結果が得られており、特に酸処理で皮膜の調整を
行ったものでより良好な結果が得られている。With respect to the obtained joined body, the brazing property was evaluated by observing the joint portion, the joint strength was evaluated by the tensile test and the impact test, and the degree of contamination in the furnace was investigated, and the respective evaluation results were shown. The results are shown in Table 4. As is clear from Table 4, the test materials of the examples have good results in all evaluation items, and particularly good results are obtained when the coating is adjusted by acid treatment. There is.
【００１９】[0019]
【表１】 [Table 1]
【００２０】[0020]
【表２】 [Table 2]
【００２１】[0021]
【表３】 [Table 3]
【００２２】[0022]
【表４】 [Table 4]
【００２３】[0023]
【発明の効果】以上説明したように本願発明の銅・アル
ミニウム接合体の製造方法によれば、Ａｌ−Ｓｉ系合金
ろう材とＡｌ合金部材の少なくとも接合部の酸化皮膜厚
さを接合加熱前において２００Å以下に調整し、Ａｌ合
金部材および銅部材の接合部間に、Ａｌ−Ｓｉ系合金ろ
う材をインサート材として配置し、これら材料を１０-4
Ｔｏｒｒ以下の真空下で５００〜５５０℃に加熱して接
合するので、Ａｌ合金部材とろう部材とを良好に接合す
ることができ、さらに、製造方法に起因する形状の制約
や寸法精度の低下がないという効果がある。また、接合
後の切削作業等が不要となり、作業能率が向上する効果
もある。また、ろう材、Ａｌ合金部材のＭｇ含有量を規
制することにとり、Ｍｇ蒸散による炉内の汚染やろう付
品の汚染が避けられるという効果もある。As described above, according to the method for manufacturing a copper / aluminum joined body of the present invention, the oxide film thickness of at least the joint between the Al—Si alloy brazing material and the Al alloy member is measured before joining and heating. Adjusted to 200 Å or less, arrange Al-Si alloy brazing filler metal as an insert material between the joints of Al alloy member and copper member, and set these materials to 10 -4.
Since it is heated to 500 to 550 [deg.] C. and bonded under a vacuum of Torr or lower, the Al alloy member and the brazing member can be bonded well, and further, there are restrictions on the shape and a decrease in dimensional accuracy due to the manufacturing method. There is an effect that there is no. In addition, there is also an effect that cutting work after joining becomes unnecessary and work efficiency is improved. Further, by controlling the Mg content of the brazing material and the Al alloy member, there is an effect that contamination of the inside of the furnace due to Mg evaporation and contamination of the brazed product can be avoided.
【図１】図１は、本発明の一実施例の断面図である。FIG. 1 is a sectional view of an embodiment of the present invention.
１ Ａｌ合金部材 ２ ろう材 ３ 銅部材 1 Al alloy member 2 Brazing material 3 Copper member
フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ Ｃ２３Ｇ 1/12 Ｃ２３Ｇ 1/12 // Ｂ２３Ｋ 103:10 Ｂ２３Ｋ 103:10 103:12 103:12 (72)発明者 当摩 建 静岡県裾野市平松85 三菱アルミニウム 株式会社内 (56)参考文献 特開 昭51−132148（ＪＰ，Ａ) 特開 昭57−149446（ＪＰ，Ａ) 特開 平３−297592（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) B23K 1/19 Continuation of front page (51) Int.Cl. 7 Identification code FI C23G 1/12 C23G 1/12 // B23K 103: 10 B23K 103: 10 103: 12 103: 12 (72) Inventor Ken Tama Shizuoka Susono Ichihiramatsu 85 Mitsubishi Aluminum Co., Ltd. (56) Reference JP-A-51-132148 (JP, A) JP-A-57-149446 (JP, A) JP-A-3-297592 (JP, A) (58) Survey Areas (Int.Cl. 7 , DB name) B23K 1/19
Claims (4)
の少なくとも接合部の酸化皮膜厚さを接合加熱前におい
て２００Å以下に調整し、このＡｌ合金部材および銅部
材の接合部間に、前記Ａｌ−Ｓｉ系合金ろう材をインサ
ート材として配置し、これら材料を１０-4Ｔｏｒｒ以下
の真空下で５００〜５５０℃に加熱してＡｌ合金部材と
銅部材とを接合することを特徴とする銅・アルミニウム
接合体の製造方法1. An oxide film thickness of at least a joint portion of an Al—Si alloy brazing material and an Al alloy member is adjusted to 200 Å or less before joining and heating, and between the joint portion of the Al alloy member and the copper member, A copper characterized in that an Al-Si alloy brazing material is arranged as an insert material, and these materials are heated to 500 to 550 ° C under a vacuum of 10 -4 Torr or less to join the Al alloy member and the copper member.・ Method for manufacturing aluminum bonded body
うことを特徴とする請求項１記載の銅・アルミニウム接
合体の製造方法2. The method for producing a copper / aluminum joined body according to claim 1, wherein the oxide film thickness is adjusted by acid treatment.
部材のＭｇ含有量をそれぞれ０．１重量％以下に規制し
たことを特徴とする請求項１または２に記載の銅・アル
ミニウム接合体の製造方法3. The copper-aluminum joint body according to claim 1, wherein the Mg contents of the Al—Si alloy brazing material and the Al alloy member are regulated to 0.1% by weight or less, respectively. Production method
０Å以下、接合加熱中において１５０Å以下に制限した
ことを特徴とする請求項１〜３のいずれかに記載の銅・
アルミニウム接合体の製造方法。4. The oxide film thickness is set to 10 before the bonding and heating.
The copper according to any one of claims 1 to 4 , which is limited to 0 Å or less and 150 Å or less during heating for bonding.
A method for manufacturing an aluminum joined body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14581794A JP3512470B2 (en) | 1994-06-06 | 1994-06-06 | Method for producing copper / aluminum joined body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14581794A JP3512470B2 (en) | 1994-06-06 | 1994-06-06 | Method for producing copper / aluminum joined body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07328764A JPH07328764A (en) | 1995-12-19 |
| JP3512470B2 true JP3512470B2 (en) | 2004-03-29 |
Family
ID=15393828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14581794A Expired - Fee Related JP3512470B2 (en) | 1994-06-06 | 1994-06-06 | Method for producing copper / aluminum joined body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3512470B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4544672B2 (en) * | 1999-11-08 | 2010-09-15 | 住友軽金属工業株式会社 | Method for manufacturing sandwich panel and sandwich panel obtained thereby |
| WO2012000532A1 (en) * | 2010-06-28 | 2012-01-05 | Comet Ag | Vacuum variable capacitor |
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1994
- 1994-06-06 JP JP14581794A patent/JP3512470B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07328764A (en) | 1995-12-19 |
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