JP3511584B2 - Surface polishing machine - Google Patents
Surface polishing machineInfo
- Publication number
- JP3511584B2 JP3511584B2 JP33408599A JP33408599A JP3511584B2 JP 3511584 B2 JP3511584 B2 JP 3511584B2 JP 33408599 A JP33408599 A JP 33408599A JP 33408599 A JP33408599 A JP 33408599A JP 3511584 B2 JP3511584 B2 JP 3511584B2
- Authority
- JP
- Japan
- Prior art keywords
- revolution
- work
- polishing
- rotation
- axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ワークの一面を研
磨定盤を用いて平坦に研磨するための平面研磨装置に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flat surface polishing apparatus for flatly polishing one surface of a work using a polishing platen.
【０００２】[0002]
【従来の技術】ラップ盤、ラッピング装置、ポリッシン
グ機などと称される平面研磨装置が知られている。この
ような平面研磨装置の一種に、垂直軸心まわりに回転駆
動される研磨定盤の上面に設けられた平坦な研磨加工面
に摺接状態で保持され且つ荷重が掛けられたワークを自
転駆動および公転駆動してそのワークの一面を平坦に研
磨する場合がある。このようにすれば、研磨定盤の研磨
加工面上に存在する砥粒のうちワークの周辺部を通過す
るものとワークの中心部を通過するものとの差が抑制さ
れ、ワークの一面のうちの中央部が凸となる傾向が緩和
されて高い平坦度が得られるようになる。たとえば、本
出願人が先に出願した特願平１０−３４２８４７号の明
細書に記載された平面研磨装置がそれである。2. Description of the Related Art Planar polishing machines called lapping machines, lapping machines, polishing machines and the like are known. One type of such a planar polishing device is a drive for rotating a work, which is held in a sliding contact state with a flat polishing surface provided on the upper surface of a polishing platen that is rotationally driven about a vertical axis and is loaded with a load. In some cases, the work is orbitally driven to flatten one surface of the work. In this way, among the abrasive grains present on the polishing surface of the polishing surface plate, the difference between those passing through the peripheral portion of the work and those passing through the central portion of the work is suppressed, and among the one surface of the work. The tendency that the central part of the is convex is alleviated, and high flatness can be obtained. For example, the flat polishing apparatus described in the specification of Japanese Patent Application No. 10-342847 previously filed by the present applicant is that.
【０００３】ところで、上記従来の平面研磨装置は、ワ
ークが下面に貼り付けられることによりそのワークを保
持する円形の貼付板に当接させるための１対のローラを
備えたアーム部材が設けられ、そのアーム部材自体が公
転軌道に沿って平行移動させられるとともに上記１対の
ローラを介して上記貼付板が回転駆動されることによ
り、ワークが研磨定盤の上で自転および公転させられる
ようになっている。By the way, the above-mentioned conventional flat polishing apparatus is provided with an arm member having a pair of rollers for contacting a circular sticking plate holding a work by sticking the work on the lower surface, The arm member itself is moved in parallel along the revolution path and the sticking plate is rotationally driven through the pair of rollers, so that the work can be rotated and revolved on the polishing platen. ing.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記従
来の平面研磨装置においては、アーム部材がその公転軌
道に沿って平行移動させられる過程で研磨定盤の回転方
向の方向成分を含む方向へ移動させられる過程では、貼
付板とその外周面に当接する１対のローラとの間の接触
圧が小さくなってスリップが発生するため、ワークの自
転が不安定となって研磨品質すなわち平坦度が低下する
可能性があった。However, in the above-described conventional surface polishing apparatus, the arm member is moved in the direction including the direction component of the rotation direction of the polishing platen in the process of being translated along the revolution path of the arm member. In the process, the contact pressure between the sticking plate and the pair of rollers abutting on the outer peripheral surface of the plate becomes small and slip occurs, so that the rotation of the work becomes unstable and the polishing quality, that is, the flatness deteriorates. There was a possibility.
【０００５】本発明は以上の事情を背景として為された
ものであり、その目的とするところは、ワークが安定し
て自転させられる平面研磨装置を提供することにある。The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a flat surface polishing apparatus capable of stably rotating a workpiece.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するため
の本発明の要旨とするところは、回転する研磨定盤の研
磨加工面に対して摺接させられた状態で保持されたワー
クを自転させるとともに、該ワークの自転軸心を所定の
公転軸心まわりに回転させることにより該ワークの一面
を平坦に研磨する平面研磨装置であって、(a) 前記自転
軸心および公転軸心に平行な軸心まわりに回転可能に設
けられ、且つ互いに同期して回転させられる複数個の回
転体と、(b) その複数個の回転体にそれぞれ相対回転可
能に連結されることにより前記公転軸心まわりの公転軌
跡に沿って平行移動させられる公転部材と、(c) その公
転部材に設けられ、前記ワークが保持されたワーク保持
部材をその自転軸心まわりの回転が可能に把持し、その
ワーク保持部材を回転駆動することにより該ワークを自
転させるワーク自転駆動装置とを、含むことにある。SUMMARY OF THE INVENTION In order to achieve the above object, the gist of the present invention is to rotate a work held in a state of sliding contact with a polishing surface of a rotating polishing platen. A flat polishing device for flattening one surface of the work by rotating the rotation axis of the work around a predetermined revolution axis, and (a) is parallel to the rotation axis and the revolution axis. A plurality of rotating bodies which are rotatably provided around different axes and are rotated in synchronization with each other, and (b) the revolution axis center by being rotatably connected to the plurality of rotating bodies, respectively. An orbiting member that is translated along an orbit of the surrounding revolution, and (c) a work holding member that is provided on the orbiting member and holds the work so that it can rotate about its axis of rotation, Rotate the holding member And a workpiece rotation drive device for rotating the workpiece by moving is to contain.
【０００７】[0007]
【発明の効果】このようにすれば、公転軌跡に沿って平
行移動させられる公転部材に設けられたワーク自転駆動
装置により、ワークが保持されたワーク保持部材がその
自転軸心まわりの回転が可能に把持されるので、上記公
転部材が公転軌道に沿って平行移動させられる過程で研
磨定盤の回転方向の方向成分を含む方向へ移動させられ
るときでも、公転部材とその公転部材を把持するローラ
との間の接触圧が変化せず、スリップが発生しないた
め、ワークの自転が安定となって研磨品質すなわち平坦
度が確保される。また、上記公転部材は複数個の回転体
にそれぞれ相対回転可能に連結されることにより前記公
転軸心まわりの公転軌跡に沿って平行移動させられるの
で、ＸＹスライド機構により支持される場合に比較し
て、機構的な無理すなわちこじれがなく、公転が安定的
に行われる利点がある。According to this structure, the work rotation driving device provided on the revolving member that is translated along the revolution locus allows the work holding member holding the work to rotate about its rotation axis. Therefore, even when the revolving member is moved in the direction including the directional component of the rotation direction of the polishing platen in the process of translating the revolving member along the revolving orbit, the revolving member and the roller that grips the revolving member. Since the contact pressure between and does not change and slip does not occur, the rotation of the work is stabilized and the polishing quality, that is, the flatness is secured. Further, since the revolving member is connected to a plurality of rotating bodies so as to be rotatable relative to each other, the revolving member can be translated in parallel along the revolving locus around the revolving axis, so that the revolving member is supported by an XY slide mechanism. Therefore, there is an advantage that there is no mechanical impossibility, that is, no twisting, and the revolution is stable.
【０００８】[0008]
【発明の他の態様】ここで、好適には、前記ワーク自転
駆動装置は、前記公転部材の一端部に形成された凹湾状
の切欠と、前記ワーク保持部材を自転駆動するためにそ
の公転部材の一端部において該切欠の内側へ少なくとも
一部が突き出すように設けられた自転駆動ローラと、前
記ワーク保持部材の外周面に係合させるための係合ロー
ラを有して該公転部材の切欠の両端部にそれぞれ連結さ
れ、該自転駆動ローラとの間で前記ワーク保持部材を把
持する把持部材とを含むものである。このようにすれ
ば、ワーク保持部材は自転駆動ローラと係合ローラとに
より把持されるので、公転部材が公転軌道に沿って平行
移動させられる過程で研磨定盤の回転方向の方向成分を
含む方向へ移動させられる場合でも、公転部材とその公
転部材を把持するローラとの間の接触圧が変化せず、ス
リップが発生しないため、ワークの自転が安定する。According to another aspect of the present invention, preferably, the work rotation driving device includes a recessed notch formed at one end of the revolving member, and a revolution of the work holding member for rotating the work holding member. A notch of the revolving member having a rotation driving roller provided at least at one end of the member so as to project to the inside of the notch and an engagement roller for engaging the outer peripheral surface of the work holding member. And a gripping member that is connected to both ends of the work holding member and that grips the work holding member between itself and the rotation driving roller. With this configuration, since the work holding member is gripped by the rotation driving roller and the engagement roller, the direction including the direction component of the rotation direction of the polishing surface plate in the process of parallel movement of the revolution member along the revolution path. Even when the work is moved to, the contact pressure between the revolution member and the roller that grips the revolution member does not change and slip does not occur, so that the rotation of the work is stabilized.
【０００９】また、好適には、前記把持部材は前記切欠
に接近する方向の移動が可能に前記公転部材の切欠の両
端部にそれぞれ連結されたものであり、把持部材をその
切欠に接近する方向へ付勢するスプリングがさらに設け
られたものである。このようにすれば、公転部材はスプ
リングのばね力に従って自転駆動ローラと係合ローラと
により把持されるので、把持力が安定する利点がある。Further, preferably, the gripping member is connected to both ends of the cutout of the revolution member so as to be movable in a direction of approaching the cutout, and the gripping member approaches the cutout. A spring for urging the spring is further provided. With this configuration, the revolving member is gripped by the rotation driving roller and the engagement roller in accordance with the spring force of the spring, so that the gripping force is stable.
【００１０】また、好適には、前記把持部材は、前記公
転部材の切欠の両端部のうちの少なくとも一方に対して
着脱可能に連結されたものである。このようにすれば、
把持部材の端部を公転部材から解放させることによりワ
ーク保持部材を公転部材に対して容易に着脱させ得る利
点がある。Preferably, the grip member is detachably connected to at least one of both ends of the cutout of the revolution member. If you do this,
There is an advantage that the work holding member can be easily attached to and detached from the revolution member by releasing the end portion of the gripping member from the revolution member.
【００１１】また、好適には、前記複数個の回転体は、
共通の公転駆動ギヤに直接噛み合う３つの支持ギヤであ
り、前記公転部材はその３つの支持ギヤに対してそれぞ
れ相対回転可能に連結されたものである。このようにす
れば、公転部材は公転駆動ギヤにより同期回転させられ
るその３つのギヤに支持されると同時に、それら３つの
ギヤの回転に伴って公転軌跡に沿って平行移動させられ
るので、公転機構が小型となる。Also, preferably, the plurality of rotating bodies are
These are three support gears that directly mesh with a common revolution drive gear, and the revolution member is connected to the three support gears so as to be rotatable relative to each other. With this configuration, the revolving member is supported by the three gears that are rotated synchronously by the revolving drive gear and, at the same time, is translated along the revolution locus as the three gears rotate. Becomes smaller.
【００１２】また、好適には、前記ワークは、そのワー
クの一面内に位置する自転軸心まわりに自転させられる
とともに、そのワークの外接円内に位置する公転軸心ま
わりにその自転軸心が回転させられるものである。この
ようにすれば、たとえ大型ワークであったとしてもワー
クの一面の中央部が凸となったり傾斜したりする傾向が
分散されて好適な平坦度および研磨加工精度が得られ
る。また、公転軸心がワークの外接円内に位置するた
め、ワークの外径の２倍以上のワーク保持板を用いる必
要がなく研磨定盤および研磨装置が小型となるので、研
磨加工費用および装置が安価となる。Further, preferably, the work is rotated about a rotation axis located in one surface of the work, and its rotation axis is located around a revolution axis located in a circumscribed circle of the work. It can be rotated. By doing so, even if it is a large work, the tendency that the central portion of one surface of the work becomes convex or inclined is dispersed, and suitable flatness and polishing accuracy can be obtained. Further, since the revolution axis is located within the circumscribed circle of the work, it is not necessary to use a work holding plate having a diameter equal to or more than twice the outer diameter of the work, and the polishing platen and the polishing apparatus are downsized. Will be cheaper.
【００１３】また、好適には、前記研磨定盤の回転、前
記ワークの自転の回転方向、およびそのワークの自転軸
心の公転回転方向は同じ回転方向に設定される。このよ
うにすれば、ワークの一面において、研磨定盤の研磨加
工面の外周側に位置したときの研磨速度と内周側に位置
したときの研磨速度の差が緩和されるので、ワークの一
面における平坦度が一層高められる。Preferably, the rotation of the polishing platen, the rotation direction of the rotation of the work, and the revolution rotation direction of the rotation axis of the work are set to be the same rotation direction. By doing so, the difference between the polishing rate when the work surface is located on the outer peripheral side of the polishing surface of the polishing platen and the polishing rate when the work surface is located on the inner peripheral side is reduced. The flatness at is further enhanced.
【００１４】また、好適には、前記ワークの公転軸心ま
わりの回転周期をＴB 、そのワークの自転軸心まわりの
回転周期をＴA としたとき、０．１≦ＴB ／ＴA ＜１、
または１＜ＴB ／ＴA ≦１０となるように換言すれば
０．１≦ＴB ／ＴA ≦１０かつＴB ／ＴA ≠１となるよ
うにワークの自転および公転が回転駆動される。さらに
好適には、０．８≦ＴB ／ＴA ＜１、または１＜ＴB ／
ＴA ≦１．２５となるように換言すれば０．８≦ＴB ／
ＴA ≦１．２５かつＴB ／ＴA ≠１となるようにワーク
の自転および公転が回転駆動される。このようにすれ
ば、自転周期および公転周期が確実にずれるので、ワー
クの一面における平坦度が一層高められる。Preferably, when the rotation cycle of the work about the revolution axis is T B and the rotation cycle of the work about the rotation axis is T A , 0.1 ≦ T B / T A < 1,
Or, in other words, the rotation and the revolution of the workpiece are rotationally driven so that 1 <T B / T A ≦ 10, that is, 0.1 ≦ T B / T A ≦ 10 and T B / T A ≠ 1. . More preferably, 0.8 ≦ T B / T A <1, or 1 <T B /
In other words, so that T A ≦ 1.25, 0.8 ≦ T B /
The rotation and revolution of the work are rotationally driven so that T A ≦ 1.25 and T B / T A ≠ 1. In this way, the rotation cycle and the revolution cycle are surely deviated, so that the flatness on one surface of the work is further enhanced.
【００１５】また、好適には、前記自転軸心の公転軸心
まわりの公転半径は、前記ワークの内接円の半径の５％
以上に設定される。さらに好適には、上記公転半径は、
上記ワークの内接円の半径以上であって外接円の半径以
下の値に設定される。このようにすれば、ワークの一面
における平坦度が一層高められる。Further, preferably, the revolution radius of the rotation axis around the revolution axis is 5% of the radius of the inscribed circle of the work.
The above is set. More preferably, the revolution radius is
It is set to a value that is greater than or equal to the radius of the inscribed circle of the work and less than or equal to the radius of the circumscribed circle. By doing so, the flatness on one surface of the work can be further enhanced.
【００１６】また、好適には、前記公転軸心は、前記研
磨定盤の研磨加工面の内径と外径との間に位置し、且つ
その研磨加工面の内径は、前記ワークの公転径よりも大
きいものである。このようにすれば、ワークの自転軸心
が研磨定盤の研磨加工面の内周縁よりも内側或いは外周
縁よりも外側へ外れないので、研磨品質が維持されると
ともに、ワークが上記公転によって研磨加工面の内側へ
移動してもその移動量は研磨加工面の内径よりも小さく
されていてワークが回転軸心を越えた反対側の研磨加工
面に接触することがない利点がある。Preferably, the revolution axis is located between the inner diameter and the outer diameter of the polishing surface of the polishing platen, and the inner diameter of the polishing surface is larger than the revolution diameter of the workpiece. Is also large. In this way, the rotation axis of the work does not come off inside the inner peripheral edge or outside the outer peripheral edge of the polishing surface of the polishing surface plate, so that the polishing quality is maintained and the workpiece is polished by the revolution. Even if it moves to the inside of the processing surface, the amount of movement is smaller than the inner diameter of the polishing surface, and there is an advantage that the work does not come into contact with the polishing surface on the opposite side beyond the axis of rotation.
【００１７】[0017]
【発明の好適な実施の形態】以下、本発明の一実施例を
図面に基づいて詳細に説明する。図１は、本発明の一実
施例の平面研磨装置１０の構成を示す平面図であって、
図２は要部を拡大した断面図、図３は要部を拡大した平
面図である。BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described in detail below with reference to the drawings. FIG. 1 is a plan view showing the configuration of a flat polishing apparatus 10 according to an embodiment of the present invention,
FIG. 2 is an enlarged cross-sectional view of a main part, and FIG. 3 is an enlarged plan view of the main part.
【００１８】上記図１において、フレーム（機枠）１２
には、研磨定盤１４が垂直軸心まわりに回転可能に支持
された状態で設けられており、その研磨定盤１４は、図
示しない定盤駆動モータにより一回転方向Ｐへ回転駆動
されるようになっている。この研磨定盤１４は、内径Ｄ
1 および外径Ｄ2 を有する平坦且つ円環状の研磨加工面
（ラップ面、研磨平面）１６を備えている。In FIG. 1, the frame (machine frame) 12
Is provided with a polishing platen 14 rotatably supported around a vertical axis, and the polishing platen 14 is driven to rotate in one rotation direction P by a platen drive motor (not shown). It has become. This polishing platen 14 has an inner diameter D
A flat and annular polishing surface (lap surface, polishing flat surface) 16 having an outer diameter D 1 and an outer diameter D 2 is provided.
【００１９】上記研磨定盤１４は、平面研磨装置１０が
遊離砥粒を用いて研磨する遊離砥粒型である場合には錫
或いは銅などの軟質金属などから構成され、平面研磨装
置１０が固定砥粒を用いて研磨する固定砥粒型である場
合にはたとえば特開平１０−２８６７５５号公報に記載
された砥粒を含むラップ用砥石などから構成される。ま
た、この研磨定盤１４内には冷却液が循環させられるよ
うになっており、研磨加工中において冷却されるように
なっている。The polishing surface plate 14 is made of a soft metal such as tin or copper when the surface polishing apparatus 10 is a free-abrasive-grain type polishing with free-abrasive particles, and the surface polishing apparatus 10 is fixed. In the case of a fixed-abrasive type in which abrasive grains are used for polishing, for example, a lapping stone containing abrasive grains described in JP-A-10-286755 is used. A cooling liquid is circulated in the polishing platen 14 to be cooled during the polishing process.
【００２０】上記研磨定盤１４の周囲には、上記フレー
ム１２に支持された台板１８と、矩形板状のワーク３４
が下面の同心位置に貼り着けられた円柱形のワーク保持
部材２０をその垂直な自転軸心Ａまわりに自転させるワ
ーク自転駆動装置２２と、そのワーク３４の自転軸心Ａ
をそれに平行な所定の公転軸心Ｂまわりに駆動してワー
ク３４を公転させるワーク公転駆動装置２４と、研磨期
間中において短円筒状の修正リング２６をその垂直な自
転軸心まわりに回転駆動する修正リング回転駆動装置２
８と、両端部がフレーム１２に固定されることにより研
磨定盤１４上に架け渡された長手状の案内部材３０に案
内される回転式修正装置３２とが、それぞれ設けられて
いる。Around the polishing platen 14, a base plate 18 supported by the frame 12 and a rectangular plate-shaped work 34 are provided.
Is a work rotation device 22 for rotating a cylindrical work holding member 20 attached at a concentric position on the lower surface around its vertical rotation axis A, and a rotation axis A of the work 34.
The work revolution drive device 24 for revolving the work 34 by driving about a predetermined revolution axis B parallel thereto, and the short cylindrical correction ring 26 for rotation during the polishing period about the perpendicular rotation axis. Correction ring rotation drive device 2
8 and a rotary correction device 32 that is guided by a long guide member 30 that is bridged on the polishing platen 14 by fixing both ends to the frame 12.
【００２１】上記修正リング回転駆動装置２８は、短円
筒状の修正リング２６をその垂直な軸心まわりに回転駆
動するものであって、研磨定盤１４の外周側に位置する
ようにフレーム１２上において研磨定盤１４の径方向に
平行な方向に往復移動可能に設けられた往復テーブル４
０と、その往復テーブル４０から研磨定盤１４の上に伸
び且つ研磨加工面１６上に載置された修正リング２６の
外周面に当接させるための１対のローラ４２、４４を備
えたアーム部材４６と、それら１対のローラ４２および
４４の一方を研磨定盤１４の回転方向Ｐと同じ回転方向
で研磨加工中は常時回転駆動する回転駆動モータ４８
と、上記往復テーブル４０を研磨加工中は常時往復駆動
する往復駆動モータ５０とを備えている。The correction ring rotation drive device 28 is for rotating and driving the short cylindrical correction ring 26 around its vertical axis, and is mounted on the frame 12 so as to be positioned on the outer peripheral side of the polishing platen 14. Reciprocating table 4 provided so as to reciprocate in a direction parallel to the radial direction of the polishing platen 14.
0, and an arm having a pair of rollers 42, 44 extending from the reciprocating table 40 onto the polishing platen 14 and abutting against the outer peripheral surface of the correction ring 26 placed on the polishing surface 16. A rotary drive motor 48 that constantly rotates the member 46 and one of the pair of rollers 42 and 44 in the same rotational direction as the rotational direction P of the polishing platen 14 during polishing.
And a reciprocating drive motor 50 for constantly reciprocating the reciprocating table 40 during polishing.
【００２２】また、前記回転式修正装置３２は、研磨定
盤１４の回転軸心に平行な軸心、或いは研磨加工面１６
に対して垂直な軸心まわりに回転駆動される修正工具５
６と、その修正工具５６を回転駆動する図示しない工具
駆動モータと、それら修正工具５６および工具駆動モー
タを上下させる上下方向駆動装置６０と、その上下方向
駆動装置６０を案内部材３０の長手方向すなわち水平方
向に沿って移動させる水平方向駆動装置６２とを備えて
いる。上記回転式修正装置３２は、上記案内部材３０に
沿って案内されると、その修正工具５６が研磨加工面１
６をその径方向に横切るように構成されており、その横
切る過程で、修正工具５６を研磨定盤１４の回転軸心と
平行な回転軸心まわりに回転させつつその研磨定盤１４
の研磨加工面１６に摺接させ、所定の周期で研磨加工面
１６を平坦に修正するようになっている。この修正工具
５６は、円盤状を成し、研磨加工面１６に摺接する修正
加工面にはダイヤモンド粒子が電着法によって固着され
ている。The rotary correction device 32 has an axis parallel to the axis of rotation of the polishing platen 14 or the polishing surface 16
Correction tool 5 driven to rotate about an axis perpendicular to the
6, a tool drive motor (not shown) that rotationally drives the correction tool 56, a vertical drive device 60 that moves the correction tool 56 and the tool drive motor up and down, and the vertical drive device 60 in the longitudinal direction of the guide member 30, that is, And a horizontal driving device 62 for moving along the horizontal direction. When the rotary correction device 32 is guided along the guide member 30, the correction tool 56 moves the polishing tool 1 to the polishing surface 1.
6 is crossed in the radial direction, and in the process of crossing, the correction tool 56 is rotated around a rotation axis parallel to the rotation axis of the polishing platen 14, and the polishing platen 14 is rotated.
The surface to be polished 16 is slidably contacted with the surface 16 to be flattened at a predetermined cycle. The correction tool 56 has a disk shape, and diamond particles are fixed by an electrodeposition method on the correction processing surface that is in sliding contact with the polishing processing surface 16.
【００２３】図２および図３に拡大して示すように、前
記ワーク自転駆動装置２２を支持するワーク公転駆動装
置２４は、研磨定盤１４の外周側に位置するようにフレ
ーム１２に対して水平な状態で固定された固定板６４
と、この固定板６４に固定された公転駆動モータ６６
と、この公転駆動モータ６６により垂直な軸心まわりに
回転駆動される公転駆動ギヤ６８と、その公転駆動ギヤ
６８の周りに位置するように固定板６４に対して垂直な
軸心まわりにそれぞれ回転可能に設けられ且つその公転
駆動ギヤ６８とそれぞれ噛み合うことにより互いに同期
して回転させられる同型（同歯数）の３つの支持ギヤ７
０、７２、７４と、それら３つの支持ギヤ７０、７２、
７４の同じ回転角度となる偏心位置に対してピン７６、
７８、８０により相対回転可能に連結或いは支持される
ことにより、上記駆動ギヤ６８或いは支持ギヤ７０、７
２、７４の軸心に平行な公転軸心Ｂまわりの公転軌跡Ｋ
に沿って平行移動させられる板状の公転部材８２とを備
えている。As shown enlarged in FIGS. 2 and 3, the work revolution drive device 24 supporting the work rotation drive device 22 is horizontal to the frame 12 so as to be located on the outer peripheral side of the polishing surface plate 14. Fixed plate 64 fixed in a loose state
And a revolution drive motor 66 fixed to the fixing plate 64.
And an orbital drive gear 68 which is rotationally driven by the orbital drive motor 66 about a vertical axis, and a revolving drive gear 68 which rotates around an axis perpendicular to the fixed plate 64 so as to be located around the orbital drive gear 68. Three support gears 7 of the same type (having the same number of teeth) that are movably provided and that are rotated in synchronization with each other by meshing with the revolution drive gears 68.
0, 72, 74 and their three supporting gears 70, 72,
The eccentric position where the rotation angle of 74 is the same, the pin 76,
The drive gear 68 or the support gears 70, 7 are connected or supported by 78, 80 so as to be relatively rotatable.
Revolution trajectory K around the revolution axis B parallel to the axis of 2,74
And a plate-shaped revolving member 82 that can be translated along.
【００２４】上記ワーク自転駆動装置２２は、ワーク３
４が保持されたワーク保持部材２０を自転軸心Ａまわり
の回転が可能に把持し、そのワーク保持部材２０を回転
駆動するものであって、上記公転部材８２のうちの凹状
に湾曲した切欠８４が形成された内周側の一端部に設け
られている。このワーク自転駆動装置２２は、切欠８４
の両端部において突設され且つその切欠８４の内周側へ
突き出すように位置する１対の自転駆動ローラ８６およ
び８８をそれぞれ駆動する１対の自転駆動モータ９０お
よび９２が固定された１対のブラケット９４および９６
と、ワーク保持部材２０の外周面に係合させられるロー
ラ９８を有して上記切欠８４の両端部すなわちそれに固
定された１対のブラケット９４および９６にそれぞれ連
結され、上記１対の自転駆動ローラ８６および８８と共
にワーク保持部材２０を自転可能に把持する円弧形状の
把持部材１００とを備え、ワーク３４を研磨定盤１４と
同じ回転方向へ回転させる。The work rotation drive device 22 is used for the work 3
4 holds the work holding member 20 holding 4 so that it can rotate about the rotation axis A, and drives the work holding member 20 to rotate. The notch 84 curved in a concave shape of the revolution member 82. Is provided at one end portion on the inner peripheral side where is formed. This work rotation drive device 22 has a cutout 84.
A pair of rotation drive motors 90 and 92 for driving a pair of rotation drive rollers 86 and 88, respectively, which are projectingly provided at both end portions of the notch 84 and project to the inner peripheral side of the notch 84. Brackets 94 and 96
And a pair of brackets 94 and 96 fixed to both ends of the notch 84, that is, having rollers 98 to be engaged with the outer peripheral surface of the work holding member 20, respectively, and the pair of rotation driving rollers. 86 and 88, and an arcuate gripping member 100 that grips the work holding member 20 so that it can rotate, the work 34 is rotated in the same rotation direction as the polishing platen 14.
【００２５】上記把持部材１００の一端部は、ブラケッ
ト９４および把持部材１００の一端部にそれぞれ形成さ
れた穴に差し入れられる連結ピン１０２により着脱可能
且つ回動可能にブラケット９４に連結されており、把持
部材１００の他端部は回動可能且つ所定の範囲で上記ロ
ーラ９８或いは把持部材１００を切欠８４に接近する方
向に相対移動可能にブラケット９６に連結されており、
スプリング１０４によりその切欠８４に接近する方向に
付勢されている。この把持部材１００の他端部に形成さ
れた長穴１０６内にブラケット９６に固定された連結ピ
ン１０８が差し入れられており、上記スプリング１０４
の両端部がブラケット９６および把持部材１００の他端
部に固定されているのである。One end of the grip member 100 is detachably and rotatably connected to the bracket 94 by a connecting pin 102 inserted into a hole formed in each of the bracket 94 and one end of the grip member 100. The other end of the member 100 is rotatably connected to the bracket 96 so as to be relatively movable within a predetermined range in the direction in which the roller 98 or the grip member 100 approaches the notch 84,
It is biased by the spring 104 in a direction approaching the notch 84. A connecting pin 108 fixed to a bracket 96 is inserted into an elongated hole 106 formed at the other end of the grip member 100, and the spring 104 is provided.
Both ends of are fixed to the bracket 96 and the other end of the grip member 100.
【００２６】上記のようにして構成された平面研磨加工
装置１０では、研磨定盤１４が回転駆動され且つ図示し
ない研磨液供給装置から研磨液が研磨定盤１４上に供給
され、必要に応じてその研磨液と共に遊離砥粒も供給さ
れる状態で、研磨加工面１６上に載置されたワーク３４
が研磨される。このワーク３４の研磨過程では、上記自
転駆動ローラ８６および８８が回転駆動されるに伴って
それにより把持されたワーク保持部材２０およびこれに
同心に貼り付けられたワーク３４はその自転軸心Ａまわ
りに回転駆動される。同時に、公転駆動モータ６６が回
転駆動されるに伴って公転部材８２が公転軸心Ｂまわり
の公転軌跡Ｋに沿って平行移動させられることにより、
上記ワーク保持部材２０およびこれに同心に貼り付けら
れたワーク３４は自転軸心Ａと平行な公転軸心Ｂまわり
に自転させられつつ公転させられる。すなわち、ワーク
３４は自転軸心Ａが上記公転軸心Ｂを中心とする回転半
径ＲB の公転軌跡Ｋに沿って回転させられるのである。In the flat surface polishing apparatus 10 having the above-described structure, the polishing platen 14 is rotationally driven, and the polishing liquid is supplied onto the polishing platen 14 from a polishing liquid supply device (not shown). A work 34 placed on the polishing surface 16 in a state where loose abrasive grains are also supplied together with the polishing liquid.
Are polished. In the polishing process of the work 34, the work holding member 20 gripped by the rotation driving rollers 86 and 88 and the work 34 concentrically attached thereto are rotated around the rotation axis A thereof. Is driven to rotate. At the same time, as the revolution drive motor 66 is rotationally driven, the revolution member 82 is translated in parallel along the revolution trajectory K around the revolution axis B,
The work holding member 20 and the work 34 concentrically attached to the work holding member 20 are revolved while being rotated around a revolution axis B parallel to the rotation axis A. That is, the work 34 is rotated along the revolution locus K with the rotation axis A having the rotation axis A as the center and the rotation radius R B.
【００２７】ここで、上記ワーク３４を公転させるため
の、公転駆動ギヤ６８により同期回転させられる３つの
公転ギヤ７０、７２、７４およびそれらにより相対回転
可能に支持された公転部材８２は、上記そのワーク保持
部材２０すなわちその下面に貼り着けられたワーク３４
の公転軸心Ｂまわりの回転周期をＴB 、そのワーク３４
の自転軸心Ａまわりの回転周期をＴA としたとき、０．
１≦ＴB ／ＴA ＜１、または１＜ＴB ／ＴA ≦１０とな
るように換言すれば０．１≦ＴB ／ＴA ≦１０かつＴB
／ＴA ≠１となるように、さらに好適には、０．８≦Ｔ
B ／ＴA ＜１、または１＜ＴB ／ＴA ≦１．２５となる
ように換言すれば０．８≦ＴB ／ＴA ≦１．２５かつＴ
B ／ＴA ≠１となるように、構成されている。Here, the three revolution gears 70, 72, 74 for revolving the work 34, which are synchronously rotated by the revolution drive gear 68, and the revolution member 82 rotatably supported by them, are the same as those mentioned above. The work holding member 20, that is, the work 34 attached to the lower surface thereof
T B the revolution axis rotation period around B of the work 34
When the rotation period around the rotation axis A of T is T A , 0.
In other words, 1 ≦ T B / T A <1, or 1 <T B / T A ≦ 10, that is, 0.1 ≦ T B / T A ≦ 10 and T B
/ T A ≠ 1, more preferably 0.8 ≦ T
B / T A <1, or 1 <T B / T A ≦ 1.25 In other words, 0.8 ≦ T B / T A ≦ 1.25 and T
It is configured so that B / T A ≠ 1.
【００２８】また、自転軸心Ａはワーク３４の内接円Ｎ
内に位置させられており、その自転軸心Ａの公転軸心Ｂ
まわりの公転半径ＲB がワーク３４の内接円Ｎの半径Ｒ
N の５％以上となるように、さらに好適には、上記公転
半径ＲB がワーク３４の内接円Ｎの半径ＲN 以上であっ
て外接円Ｇの半径ＲG 以下の値に設定されている。ま
た、公転軸心Ｂは、前記研磨定盤１４の研磨加工面１６
の内径と外径との間に位置し、且つその研磨加工面１６
の内径Ｄ1 は、ワーク３２の公転径２ＲB よりも大きい
値となるように設定されている。The rotation axis A is an inscribed circle N of the work 34.
It is located inside the orbital axis B of the rotation axis A
The revolution radius R B of the surrounding is the radius R of the inscribed circle N of the work 34.
Such that the N 5% or more, more preferably, the radius of revolution R B is set to a radius R G following values of the circumscribed circle G A at radius R N or more inscribed circle N of the workpiece 34 There is. The revolution axis B is the polishing surface 16 of the polishing platen 14.
Located between the inner diameter and the outer diameter of the polishing surface 16
The inner diameter D 1 of the is set to a value larger than the revolution diameter 2R B of the workpiece 32.
【００２９】上述のように、本実施例によれば、公転軌
跡Ｋに沿って平行移動させられる公転部材８２に設けら
れたワーク自転駆動装置２２により、ワーク３４が保持
されたワーク保持部材２０がその自転軸心Ａまわりの回
転が可能に把持されるので、上記公転部材８２が公転軌
跡Ｋに沿って平行移動させられる過程で研磨定盤１４の
回転方向Ｐの方向成分を含む方向へ移動させられるとき
でも、公転部材８２とその公転部材８２を把持するロー
ラ８６、８８、９８との間の接触圧が変化せず、自転駆
動ローラ８６、８８との間でスリップが発生しないた
め、ワーク３４の自転が安定となって研磨品質すなわち
平坦度が確保される。また、上記公転部材８２は３個の
支持ギヤ（回転体）７０、７２、７４にそれぞれ相対回
転可能に連結されることにより公転軸心Ｂまわりの公転
軌跡Ｋに沿って平行移動させられるので、ＸＹスライド
機構により支持される場合に比較して、機構的な無理す
なわちこじれがなく、公転が安定的に行われる利点があ
る。As described above, according to this embodiment, the work holding member 20 holding the work 34 is held by the work rotation drive device 22 provided on the revolving member 82 which is translated along the revolution locus K. Since the rotation member 82 is gripped so as to be rotatable about the rotation axis A, it is moved in a direction including a direction component of the rotation direction P of the polishing platen 14 in the process of parallel movement of the revolution member 82 along the revolution trajectory K. Even when the rotating member 82 is rotated, the contact pressure between the revolving member 82 and the rollers 86, 88, 98 holding the revolving member 82 does not change, and slip does not occur between the revolving drive rollers 86, 88. The rotation is stable and the polishing quality, that is, the flatness is secured. Further, since the revolution member 82 is connected to the three support gears (rotators) 70, 72 and 74 so as to be rotatable relative to each other, the revolution member 82 can be translated in parallel along the revolution trajectory K around the revolution axis B. Compared with the case of being supported by the XY slide mechanism, there is an advantage that mechanical revolution does not occur, that is, twisting does not occur, and revolution is performed stably.
【００３０】また、本実施例によれば、ワーク自転駆動
装置２２は、前記公転部材の一端部に形成された凹湾状
の切欠８４と、ワーク保持部材２０を自転駆動するため
にその公転部材８２の一端部において切欠８４の内側へ
少なくとも一部が突き出すように設けられた自転駆動ロ
ーラ８６、８８と、ワーク保持部材２０の外周面に係合
させるための係合ローラ９８を有して公転部材８２の切
欠８４の両端部にそれぞれ連結され、自転駆動ローラ８
６、８８との間でそのワーク保持部材２０を把持する把
持部材１００とを含むものであることから、ワーク保持
部材２０は自転駆動ローラ８６、８８と係合ローラ９８
とにより把持されるので、公転部材８２が公転軌道Ｋに
沿って平行移動させられる過程で研磨定盤１４の回転方
向Ｐの方向成分を含む方向へ移動させられる場合でも、
公転部材８２とその公転部材８２を把持する自転駆動ロ
ーラ８６、８８との間の接触圧が変化せず、スリップが
発生しないため、ワーク３４の自転が安定する。Further, according to this embodiment, the work rotation drive device 22 includes the recessed notch 84 formed at one end of the revolution member and the revolution member for driving the work holding member 20 to rotate. The rotary drive rollers 86 and 88 are provided so that at least a part thereof protrudes into the inside of the notch 84 at one end of 82, and the engagement roller 98 for engaging with the outer peripheral surface of the work holding member 20. The rotation driving roller 8 is connected to both ends of the notch 84 of the member 82.
6 and 88 includes the gripping member 100 that grips the work holding member 20, the work holding member 20 includes the rotation driving rollers 86 and 88 and the engagement roller 98.
Since the revolving member 82 is gripped by, even when the revolving member 82 is moved in the direction including the direction component of the rotation direction P of the polishing platen 14 in the process of being translated along the revolving orbit K,
Since the contact pressure between the revolution member 82 and the rotation driving rollers 86 and 88 that grips the revolution member 82 does not change and slip does not occur, the rotation of the work 34 is stabilized.
【００３１】また、本実施例によれば、把持部材１００
は切欠８４に接近する方向の移動が可能に公転部材８２
の切欠８４の両端部位置にそれぞれ連結されたものであ
り、把持部材１００をその切欠に接近する方向へ付勢す
るスプリング１０４がさらに設けられたものであること
から、公転部材８２はスプリング１０４のばね力に従っ
て自転駆動ローラ８６、８８と係合ローラ９８とにより
把持されるので、把持力が安定する利点がある。Further, according to the present embodiment, the gripping member 100
The revolving member 82 can move in a direction approaching the notch 84.
The revolving member 82 is connected to both ends of the notch 84 and is further provided with a spring 104 for urging the gripping member 100 in a direction approaching the notch. Since it is gripped by the rotation driving rollers 86 and 88 and the engagement roller 98 according to the spring force, there is an advantage that the gripping force is stable.
【００３２】また、本実施例によれば、把持部材１００
は、公転部材８２の切欠８４の両端部のうちの少なくと
も一方に対して着脱可能に連結されたものであるので、
把持部材１００の端部を公転部材８２から解放させるこ
とによりワーク保持部材２０を公転部材８２に対して容
易に着脱させ得る利点がある。Further, according to the present embodiment, the gripping member 100
Is detachably connected to at least one of both ends of the notch 84 of the revolution member 82,
There is an advantage that the work holding member 20 can be easily attached to and detached from the revolution member 82 by releasing the end portion of the gripping member 100 from the revolution member 82.
【００３３】また、本実施例によれば、３個の支持ギヤ
（回転体）７０、７２、７４は、共通の公転駆動ギヤ６
８に直接噛み合わせられており、公転部材８２はその３
つの支持ギヤ７０、７２、７４の同じ回転位相角度位置
に対してそれぞれ相対回転可能に連結されたものである
ことから、公転部材８２は公転駆動ギヤ６８により同期
回転させられるその３つの支持ギヤ７０、７２、７４に
支持されると同時に、それら３つの支持ギヤ７０、７
２、７４の回転に伴って公転軌跡Ｋに沿って平行移動さ
せられるので、公転機構が小型となる。Further, according to the present embodiment, the three support gears (rotating bodies) 70, 72, 74 are the common revolution drive gear 6.
8 and the revolution member 82 is
Since the two support gears 70, 72, and 74 are connected so as to be relatively rotatable with respect to the same rotational phase angle position, the revolving member 82 is synchronously rotated by the revolving drive gear 68. , 72, 74, and at the same time, these three support gears 70, 7
Since it is moved in parallel along the revolution path K with the rotation of 2, 74, the revolution mechanism becomes compact.
【００３４】また、本実施例によれば、研磨定盤１４の
研磨加工面１６に対して摺接状態で保持されるワーク３
４が、ワーク自転駆動装置２２によって上記研磨定盤１
４の回転軸心に平行であってそのワーク３４の一面内に
位置する自転軸心Ａまわりに自転させられると同時に、
公転部材８２によって上記研磨定盤１４の回転軸心に平
行であってワーク３４の一面の外接円Ｇ内に位置する公
転軸心Ｂまわりに公転させられるので、たとえワーク３
４が大型であったとしてもワーク３４の一面（被研磨
面）の中央部が凸となったり傾斜したりする傾向が上記
公転により分散されて好適な平坦度および研磨加工精度
が得られる。また、公転軸心Ｂがワーク３４の外接円Ｇ
内に位置しているため、ワーク３４の外径の２倍以上の
ワーク保持部材２０を用いる必要がなく研磨定盤１４お
よび平面研磨加工装置１０が小型なものとなるので、研
磨加工費用および装置が安価となる。Further, according to the present embodiment, the work 3 held in sliding contact with the polishing surface 16 of the polishing surface plate 14.
4 is the polishing surface plate 1 by the work rotation drive device 22.
At the same time as being rotated about a rotation axis A which is parallel to the rotation axis of No. 4 and is located in one surface of the work 34,
The revolution member 82 revolves around the revolution axis B which is parallel to the rotation axis of the polishing surface plate 14 and is located in the circumscribed circle G on one surface of the work 34.
Even if 4 is large, the tendency of the central portion of one surface (surface to be polished) of the work 34 to be convex or inclined is dispersed by the revolution, and suitable flatness and polishing processing accuracy can be obtained. Further, the revolution axis B is the circumscribed circle G of the work 34.
Since it is located inside, it is not necessary to use the work holding member 20 having a diameter equal to or more than twice the outer diameter of the work 34, and the polishing surface plate 14 and the surface polishing processing device 10 are small in size. Will be cheaper.
【００３５】また、本実施例によれば、研磨定盤１４の
回転、ワーク３４の自転、およびそのワーク３４の公転
は同じ回転方向に設定されていることから、ワーク３４
の一面（被研磨面）において、研磨定盤１４の研磨加工
面１６の外周側に位置したときの研磨速度と内周側に位
置したときの研磨速度の差が緩和されるので、ワーク３
４の一面における平坦度が一層高められる。Further, according to this embodiment, the rotation of the polishing platen 14, the rotation of the work 34, and the revolution of the work 34 are set in the same rotation direction.
On one surface (surface to be polished), the difference between the polishing rate when the polishing surface 14 of the polishing platen 14 is located on the outer peripheral side and the polishing rate when it is located on the inner peripheral side is reduced, so that the work 3
The flatness on one surface of No. 4 is further enhanced.
【００３６】また、本実施例によれば、ワーク３４の公
転軸心Ｂまわりの回転周期をＴB 、そのワーク３４の自
転軸心まわりの回転周期をＴA としたとき、０．１≦Ｔ
B ／ＴA ＜１、または１＜ＴB ／ＴA ≦１０となるよう
に換言すれば０．１≦ＴB ／ＴA ≦１０かつＴB ／ＴA
≠１となるように、さらに好適には、０．８≦ＴB ／Ｔ
A ＜１、または１＜ＴB ／ＴA ≦１．２５となるように
換言すれば０．８≦Ｔ B ／ＴA ≦１．２５かつＴB ／Ｔ
A ≠１となるように、ワーク３４の自転および公転が行
われることから、ワーク３４の自転周期および公転周期
が相互に確実にずれるので、ワーク３４の一面における
平坦度が一層高められる。Further, according to the present embodiment, the workpiece 34 is exposed to the public.
The rotation cycle around the axis B is TB, The work 34 itself
The rotation cycle around the axis of rotation is TAAnd 0.1 ≦ T
B/ TA<1 or 1 <TB/ TASo that ≦ 10
In other words, 0.1 ≦ TB/ TA≤10 and TB/ TA
More preferably, 0.8 ≦ T so that ≠ 1.B/ T
A<1 or 1 <TB/ TASo that ≦ 1.25
In other words, 0.8 ≦ T B/ TA≤1.25 and TB/ T
AThe work 34 rotates and revolves so that ≠ 1.
Therefore, the rotation cycle and the revolution cycle of the work 34
On the one side of the work 34
Flatness is further enhanced.
【００３７】また、本実施例によれば、自転軸心Ａの公
転軸心Ｂまわりの公転半径ＲB は、ワーク３４の内接円
Ｎの半径ＲN の５％以上の値に、さらに好適には、上記
公転半径ＲB は、上記ワーク３４の内接円Ｎの半径ＲN
以上であって外接円Ｇの半径ＲG 以下の値に設定される
ので、ワーク３４の一面における平坦度が一層高められ
る。Further, according to this embodiment, the revolution radius R B of the rotation axis A around the revolution axis B is more preferably 5% or more of the radius R N of the inscribed circle N of the work 34. In addition, the revolution radius R B is the radius R N of the inscribed circle N of the work 34.
As described above, the radius R G of the circumscribing circle G is set to a value equal to or smaller than the radius R G, so that the flatness of one surface of the work 34 is further enhanced.
【００３８】また、本実施例によれば、公転軸心Ｂは、
研磨定盤１４の研磨加工面１６の内径Ｄ1 と外径Ｄ2 と
の間に位置し、且つその研磨加工面１６の内径Ｄ1 は、
ワーク３４の公転径２ＲB よりも大きい値に設定されて
いることから、ワーク３４の自転軸心Ａが研磨定盤１４
の研磨加工面１６の内周縁よりも内側へ或いは外周縁よ
りも外側へ外れないので、研磨品質が維持されるととも
に、ワーク３４が上記の公転によって研磨加工面１６の
内側へ移動してもその移動量は研磨加工面１６の内径Ｄ
1 よりも小さくされていてワーク３４が研磨加工面１６
の回転軸心を越えた反対側の研磨加工面１６に接触する
ことがない利点がある。Further, according to this embodiment, the revolution axis B is
The polishing surface 16 of the polishing platen 14 is located between the inner diameter D 1 and the outer diameter D 2 , and the inner diameter D 1 of the polishing surface 16 is
Since it was set to a value greater than the revolution diameter 2R B of the workpiece 34, the polishing rotation axis A of the workpiece 34 is platen 14
Since it does not come inward from the inner peripheral edge of the polishing surface 16 or outward from the outer peripheral edge, the polishing quality is maintained, and even if the work 34 moves to the inside of the polishing surface 16 by the above revolution. The amount of movement is the inner diameter D of the polished surface 16
The work 34 is smaller than 1 and the work 34 is polished surface 16
There is an advantage that it does not come into contact with the polishing surface 16 on the opposite side beyond the axis of rotation of.
【００３９】以上、本発明の一実施例を図面を用いて説
明したが、本発明はその他の態様においても適用され
る。Although one embodiment of the present invention has been described with reference to the drawings, the present invention can be applied to other modes.
【００４０】たとえば、前述の実施例では、公転部材８
２が相対回転可能に連結される複数個の回転体として、
互いに平行な軸心まわりに同期回転させられる３つの支
持ギヤ７０、７２、７４が用いられていたが、２個の支
持ギヤ、或いは４個以上の支持ギヤが用いられても差し
支えない。For example, in the above-mentioned embodiment, the revolving member 8
2 is a plurality of rotating bodies that are connected so that they can rotate relative to each other,
Although the three support gears 70, 72, and 74 that are synchronously rotated about the axes parallel to each other have been used, two support gears or four or more support gears may be used.
【００４１】また、前述の実施例では、ワーク保持部材
２０をその自転軸心Ａまわりの回転が可能に把持してそ
れを回転駆動するワーク自転駆動装置２２は、ワーク保
持部材２０を取り囲む公転部材８２とそれに連結された
把持部材１００とによりそのワーク保持部材２０を把持
するように構成されていたが、ワーク保持部材２０の一
部を取り囲む部材によって把持するものであってもよ
い。Further, in the above-described embodiment, the work rotation drive device 22 which holds the work holding member 20 so as to be rotatable about its rotation axis A and rotationally drives the work holding member 20 is a revolving member surrounding the work holding member 20. Although the work holding member 20 is held by 82 and the holding member 100 connected thereto, the work holding member 20 may be held by a member surrounding a part of the work holding member 20.
【００４２】また、前述の実施例では、把持部材１００
は、公転部材８２の切欠８４の両端部位置のうちの一方
すなわちブラケット９４に対して着脱可能に連結された
ものであったが、他方すなわちブラケット９６に対して
着脱可能に連結されても差し支えない。Further, in the above-described embodiment, the gripping member 100 is used.
Is detachably connected to one of the positions of both ends of the notch 84 of the revolution member 82, that is, the bracket 94, but may be detachably connected to the other, that is, the bracket 96. .
【００４３】また、前述の実施例のワーク３４は矩形板
状であったが、円板状であっても差し支えない。Further, although the work 34 in the above-described embodiment has a rectangular plate shape, it may have a disk shape.
【００４４】また、前述の実施例のワーク自転駆動装置
２２および公転部材８２により、ワーク３４が研磨定盤
１４と同じ回転方向で自転および公転させられるように
なっていたが、研磨定盤１４の内周側および外周側の周
速差が問題とならない場合には、ワーク３４は必ずしも
研磨定盤１４と同じ回転方向で自転或いは公転させられ
なくてもよい。Further, although the work rotating device 22 and the revolving member 82 of the above-described embodiment can rotate and revolve the work 34 in the same rotation direction as the polishing surface plate 14, When the difference in peripheral speed between the inner peripheral side and the outer peripheral side does not matter, the work 34 does not necessarily have to rotate or revolve in the same rotation direction as the polishing platen 14.
【００４５】また、前述の実施例において、ワーク３４
はワーク保持部材２０の下面に貼り付けられることによ
り保持されていたが、凹嵌部に嵌め入れられるなどの他
の保持機構が用いられてもよいし、ワーク３４に荷重を
掛けるためのウエイトが上記ワーク保持部材２０の上面
に載置されてもよい。Further, in the above-described embodiment, the work 34
Was held by being attached to the lower surface of the work holding member 20, but another holding mechanism such as being fitted in a concave fitting portion may be used, and a weight for applying a load to the work 34 may be provided. It may be placed on the upper surface of the work holding member 20.
【００４６】なお、上述したのはあくまでも本発明の一
実施例であり、本発明はその主旨を逸脱しない範囲にお
いて種々の変更が加えられ得るものである。The above description is merely one embodiment of the present invention, and the present invention can be modified in various ways without departing from the spirit of the invention.
【図１】本発明の一実施例の平面研磨装置の構成を説明
する平面図である。FIG. 1 is a plan view illustrating the configuration of a flat polishing apparatus according to an embodiment of the present invention.
【図２】図１の平面研磨装置の要部を拡大して説明する
断面図である。FIG. 2 is a cross-sectional view illustrating an enlarged main part of the flat-surface polishing apparatus of FIG.
【図３】図１の平面研磨装置の要部を拡大して説明する
平面図である。FIG. 3 is a plan view illustrating an enlarged main part of the flat surface polishing apparatus of FIG.
１０：平面研磨装置 １４：研磨定盤 ２０：ワーク保持部材 ２２：ワーク自転駆動装置 ３４：ワーク ６８：公転駆動ギヤ ７０、７２、７４：支持ギヤ（回転体） ８４：切欠 ８６、８８：自転駆動ローラ ９８：ローラ １００：把持部材 １０４：スプリング 10: Flat polishing device 14: Polishing surface plate 20: Work holding member 22: Work rotation drive device 34: Work 68: Revolution drive gear 70, 72, 74: Support gear (rotating body) 84: Notch 86, 88: rotation driving roller 98: Laura 100: gripping member 104: Spring
───────────────────────────────────────────────────── フロントページの続き (72)発明者 佐藤 誠 愛知県名古屋市西区則武新町三丁目１番 36号 株式会社ノリタケカンパニーリミ テド内 (56)参考文献 特開 平５−74749（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) B24B 7/04 B24B 37/04 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Makoto Sato No. 1-36 No. 36, Noritake Shinmachi, Nishi-ku, Nagoya-shi, Aichi Noritake Company Limited (56) Reference Japanese Patent Laid-Open No. 5-74749 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) B24B 7/04 B24B 37/04
Claims (5)
摺接させられた状態で保持されたワークを自転させると
ともに、該ワークの自転軸心を所定の公転軸心まわりに
回転させることにより該ワークの一面を平坦に研磨する
平面研磨装置であって、 前記自転軸心および公転軸心に平行な軸心まわりに回転
可能に設けられ、且つ互いに同期して回転させられる複
数個の回転体と、 該複数個の回転体にそれぞれ相対回転可能に連結される
ことにより前記公転軸心まわりの公転軌跡に沿って平行
移動させられる公転部材と、 該公転部材に設けられ、前記ワークが保持されたワーク
保持部材をその自転軸心まわりの回転が可能に把持し、
該ワーク保持部材を回転駆動することにより該ワークを
自転させるワーク自転駆動装置とを、含むことを特徴と
する平面研磨装置。1. A method of rotating a workpiece held in a state of sliding contact with a polishing surface of a rotating polishing platen and rotating a rotation axis of the workpiece around a predetermined revolution axis. A flat polishing device for polishing one surface of the workpiece flat by means of a plurality of rotations rotatably provided around an axis parallel to the rotation axis and the revolution axis, and rotated in synchronization with each other. A body, an orbiting member that is connected to the plurality of rotating bodies so as to be rotatable relative to each other, and is translated in parallel along an orbit of revolution around the orbital axis; and a revolving member that holds the workpiece. Grips the workpiece holding member so that it can rotate around its rotation axis,
And a work rotation driving device that rotates the work by rotating the work holding member.
材の一端部に形成された凹湾状の切欠と、前記ワーク保
持部材を自転駆動するために該公転部材の一端部におい
て該切欠の内側へ少なくとも一部が突き出すように設け
られた自転駆動ローラと、前記ワーク保持部材の外周面
に係合させるためのローラを有して該公転部材の切欠の
両端部にそれぞれ連結され、該自転駆動ローラとの間で
前記ワーク保持部材を把持する把持部材とを含むもので
ある請求項１の平面研磨装置。2. The work rotation drive device includes a recessed notch formed in one end of the revolution member, and an inside of the notch at one end of the revolution member for rotating the work holding member. A rotation driving roller provided so that at least a part thereof protrudes, and a roller for engaging with the outer peripheral surface of the work holding member, which are respectively connected to both ends of the cutout of the revolution member, The flat surface polishing apparatus according to claim 1, further comprising a gripping member that grips the work holding member between the roller and the roller.
の移動が可能に前記公転部材の切欠の両端部にそれぞれ
連結されたものであり、該把持部材を該切欠に接近する
方向へ付勢するスプリングがさらに設けられたものであ
る請求項２の平面研磨装置。3. The gripping member is connected to both ends of the cutout of the revolving member so as to be movable in a direction of approaching the cutout, and the gripping member is biased in a direction of approaching the cutout. The flat surface polishing apparatus according to claim 2, further comprising a spring for rotating.
両端部のうちの少なくとも一方に対して着脱可能に連結
されたものである請求項２または３の平面研磨装置。4. The surface polishing apparatus according to claim 2, wherein the gripping member is detachably connected to at least one of both ends of the cutout of the revolution member.
ギヤに直接噛み合う３つの支持ギヤであり、前記公転部
材は該３つの支持ギヤに対してそれぞれ相対回転可能に
連結されたものである請求項１乃至４のいずれかの平面
研磨装置。5. The plurality of rotating bodies are three support gears that directly mesh with a common revolution drive gear, and the revolution member is connected to the three support gears so as to be rotatable relative to each other. The flat polishing apparatus according to any one of claims 1 to 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33408599A JP3511584B2 (en) | 1999-11-25 | 1999-11-25 | Surface polishing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33408599A JP3511584B2 (en) | 1999-11-25 | 1999-11-25 | Surface polishing machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001150338A JP2001150338A (en) | 2001-06-05 |
| JP3511584B2 true JP3511584B2 (en) | 2004-03-29 |
Family
ID=18273366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33408599A Expired - Lifetime JP3511584B2 (en) | 1999-11-25 | 1999-11-25 | Surface polishing machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3511584B2 (en) |
-
1999
- 1999-11-25 JP JP33408599A patent/JP3511584B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001150338A (en) | 2001-06-05 |
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