JP3507337B2 - Fine adjustment method of resistance value of shunt resistor - Google Patents
Fine adjustment method of resistance value of shunt resistorInfo
- Publication number
- JP3507337B2 JP3507337B2 JP17972698A JP17972698A JP3507337B2 JP 3507337 B2 JP3507337 B2 JP 3507337B2 JP 17972698 A JP17972698 A JP 17972698A JP 17972698 A JP17972698 A JP 17972698A JP 3507337 B2 JP3507337 B2 JP 3507337B2
- Authority
- JP
- Japan
- Prior art keywords
- shunt resistor
- resistance value
- resistance
- slit
- shunt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Description
【発明の詳細な説明】
【０００１】
【発明の属する技術分野】本発明は，シャント抵抗の抵
抗値の微調整方法に関するものである。
【０００２】
【従来の技術】モータコントロール，充電器，めっき用
電源，溶接機などの電源装置は，商用交流をダイオード
により整流し，この整流した直流をトランジスタ等のス
イッチング素子により高周波変換し，この高周波交流を
変圧器により変圧する電源装置が採用され，小型化され
ている。さらに，近年これら電源装置には，複数個のダ
イオード，トランジスタ等の電源用半導体チップを１つ
の金属ベース上に絶縁させて搭載する電力用半導体モジ
ュールが採用されている。尚，電力用半導体モジュール
には，トランジスタ等のスイッチング素子を制御する制
御装置も搭載されている。
【０００３】さらに，この種の電源装置は，電力用半導
体チップの保護，又は制御用にシャント抵抗が用いられ
る。
【０００４】
【発明が解決しようとする課題】これらの電源装置は，
負荷容量に応じて各種必要であり，シャント抵抗も負荷
容量に応じて各種必要であった。また，シャント抵抗を
電力用半導体モジュール内に搭載する場合には，シャン
ト抵抗を大きくすることができなかった。
【０００５】
【課題を解決するための手段】本発明のシャント抵抗の
抵抗値の微調整方法は，金属板を金型により幅１〜１．
５ｍｍのスリットを１個以上有するシャント抵抗に打ち
抜き加工し，シャント抵抗の抵抗値を小さくする場合，
上記スリットに半田が埋められ，シャント抵抗の抵抗値
を大きくする場合，側端部とスリット間又は，スリット
相互間の抵抗形成部が切断工具により切断される。
【０００６】すなわち，スリットに半田が埋められる
と，半田が抵抗形成部と並列接続され，抵抗値が低下す
る。また，抵抗形成部を切断することにより抵抗値が大
きくなる。これにより，シャント抵抗の抵抗値を微調整
することが可能となる。
【０００７】
【発明の実施の形態】本発明をその一実施例を示した図
１に基づき説明する。１はシャント抵抗であり，例えば
０．１〜０．５ｍｍ厚のニッケル銀合金あるいはマンガ
ン等の金属板を金型で幅が３〜１０ｍｍの板に打ち抜き
加工される。この打ち抜き加工時，天部２に幅が１〜
１．５ｍｍで長さが５〜１０ｍｍのスリット４ａ，４
ｂ，４ｃ，４ｄ，４ｅを得ると共に，端部を折り曲げて
高さが３〜１０ｍｍの取り付け部３を形成して，１ｍΩ
ないし４０ｍΩ程度のシャント抵抗を得る。
【０００８】このようにして形成されたシャント抵抗
は，電力用半導体モジュール等の電源装置に搭載され，
電力用半導体素子の保護又は制御用に用いられる。
【０００９】今，シャント抵抗が電力用半導体モジュー
ルに搭載され，シャント抵抗の抵抗値が小さいものを要
求するときには，図２に示すように例えばスリット４ａ
を半田で埋めていく。従って，スリット４ａを有する標
準のシャント抵抗から例えばシャント４ａに半田が埋め
られたとき，その半田が標準のシャント抵抗に並列接続
されたことになり，シャント抵抗の抵抗値は小さくな
る。
【００１０】もし，シャント抵抗の抵抗値が大きいもの
を要求される場合には，図３に示すように例えば天部２
の側端部とスリット間の抵抗形成部２ａ，スリット相互
間の抵抗形成部２ｂをニッパ等の切断工具により切断す
る。従って，標準のシャント抵抗から例えば抵抗形成部
２ａ，２ｂを切断すると，シャント抵抗は抵抗形成部２
ｃ，２ｄ，２ｅ，２ｆにより形成されるためにシャント
抵抗の抵抗値は大きくなる。
【００１１】上記実施の形態では，スリット４ａ〜４ｅ
は，１〜１．５ｍｍの大きさを選択しており，この幅を
広くすると，スリットに半田を埋めにくくなる。また，
スリット４ａ〜４ｅの幅を板厚程度の幅まで狭くする
と，打ち抜き加工ができなくなる。
【００１２】
【発明の効果】本発明によれば，スリットに半田を埋め
ることにより抵抗値を小さい方向に微調整でき，抵抗形
成部を切断することによって抵抗値を大きい方向に微調
整することができる。このため，容量の異なる電源装置
にも１種類のシャント抵抗で対応することができる。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for finely adjusting the resistance value of a shunt resistor. 2. Description of the Related Art A power supply device such as a motor control, a charger, a plating power supply, and a welding machine rectifies a commercial AC by a diode, converts the rectified DC to a high frequency by a switching element such as a transistor, and converts the DC into a high frequency. A power supply device that transforms high-frequency alternating current with a transformer is employed, and the size is reduced. Furthermore, in recent years, these power supply devices employ a power semiconductor module in which a plurality of power supply semiconductor chips such as diodes and transistors are mounted on one metal base in an insulated manner. The power semiconductor module is also equipped with a control device for controlling a switching element such as a transistor. Further, in this type of power supply device, a shunt resistor is used for protecting or controlling a power semiconductor chip. [0004] These power supplies are:
Various types were required according to the load capacity, and various shunt resistances were also required according to the load capacity. Further, when the shunt resistor is mounted in the power semiconductor module, the shunt resistance cannot be increased. According to the method for finely adjusting the resistance value of a shunt resistor according to the present invention, a metal plate is formed with a width of 1 to 1.
When punching into a shunt resistor having one or more 5 mm slits to reduce the resistance of the shunt resistor,
When solder is buried in the slit to increase the resistance value of the shunt resistor, the resistance forming portion between the side end and the slit or between the slits is cut by a cutting tool. That is, when the solder is buried in the slit, the solder is connected in parallel with the resistance forming portion, and the resistance value decreases. In addition, cutting the resistance forming portion increases the resistance value. As a result, the resistance value of the shunt resistor can be finely adjusted. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described with reference to FIG. Reference numeral 1 denotes a shunt resistor, which is formed by stamping a metal plate of, for example, nickel silver alloy or manganese having a thickness of 0.1 to 0.5 mm into a plate having a width of 3 to 10 mm using a mold. During this punching process, the width of the top 2 is 1 to
Slits 4a, 4 1.5mm long and 5-10mm long
b, 4c, 4d, 4e are obtained, and the end is bent to form a mounting portion 3 having a height of 3 to 10 mm, and 1 mΩ
A shunt resistance of about 40 mΩ is obtained. The shunt resistor thus formed is mounted on a power supply device such as a power semiconductor module.
It is used for protection or control of power semiconductor elements. Now, when a shunt resistor is mounted on a power semiconductor module and a low shunt resistor is required, as shown in FIG.
Is filled with solder. Therefore, when the solder is buried in the shunt 4a from the standard shunt resistor having the slit 4a, for example, the solder is connected in parallel with the standard shunt resistor, and the resistance value of the shunt resistor decreases. If the shunt resistor is required to have a large resistance value, as shown in FIG.
The resistance forming portion 2a between the side end and the slit and the resistance forming portion 2b between the slits are cut by a cutting tool such as a nipper. Therefore, for example, when the resistance forming sections 2a and 2b are cut from the standard shunt resistance, the shunt resistance becomes
The resistance value of the shunt resistor becomes large because it is formed by c, 2d, 2e, and 2f. In the above embodiment, the slits 4a to 4e
Has a size of 1 to 1.5 mm, and if the width is increased, it becomes difficult to fill the slit with solder. Also,
If the width of the slits 4a to 4e is reduced to a width of about the plate thickness, punching cannot be performed. According to the present invention, the resistance value can be finely adjusted in a small direction by filling the slit with solder, and the resistance value can be finely adjusted in a large direction by cutting the resistance forming portion. it can. For this reason, power supplies having different capacities can be handled by one type of shunt resistor.
【図面の簡単な説明】
【図１】本発明に使用されるシャント抵抗の１実施の形
態の正面図と平面図である。
【図２】図１のシャント抵抗の抵抗値を小さくする場合
の説明図である。
【図３】図１のシャント抵抗の抵抗値を大きくする場合
の説明図である。
【符号の説明】
１ シャント抵抗
２ 天部
２ａ，２ｂ，２ｃ，２ｄ，２ｅ，２ｆ 抵抗形成部
３ 取付け部
４ａ，４ｂ，４ｃ，４ｄ，４ｅ スリットBRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a front view and a plan view of an embodiment of a shunt resistor used in the present invention. FIG. 2 is an explanatory diagram when a resistance value of a shunt resistor in FIG. 1 is reduced. FIG. 3 is an explanatory diagram when a resistance value of a shunt resistor in FIG. 1 is increased. [Description of Signs] 1 Shunt resistor 2 Top part 2a, 2b, 2c, 2d, 2e, 2f Resistance forming part 3 Mounting part 4a, 4b, 4c, 4d, 4e Slit
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01C 17/245 H01C 7/00 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) H01C 17/245 H01C 7/00
Claims (1)
スリットを１個以上有するシャント抵抗に打ち抜き加工
し，シャント抵抗の抵抗値を小さくする場合，上記スリ
ットに半田が埋められ，シャント抵抗の抵抗値を大きく
する場合，側端部とスリット間又は，スリット相互間の
抵抗形成部が切断工具により切断されてなるシャント抵
抗の抵抗値の微調整方法。(57) [Claim 1] When a metal plate is punched by a mold into a shunt resistor having one or more slits having a width of 1 to 1.5 mm to reduce the resistance value of the shunt resistor, When the solder is buried in the slit and the resistance value of the shunt resistor is increased, a method of finely adjusting the resistance value of the shunt resistor obtained by cutting the resistance forming portion between the side end and the slit or between the slits with a cutting tool. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17972698A JP3507337B2 (en) | 1998-06-11 | 1998-06-11 | Fine adjustment method of resistance value of shunt resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17972698A JP3507337B2 (en) | 1998-06-11 | 1998-06-11 | Fine adjustment method of resistance value of shunt resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11354309A JPH11354309A (en) | 1999-12-24 |
| JP3507337B2 true JP3507337B2 (en) | 2004-03-15 |
Family
ID=16070805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17972698A Expired - Fee Related JP3507337B2 (en) | 1998-06-11 | 1998-06-11 | Fine adjustment method of resistance value of shunt resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3507337B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11136684B2 (en) * | 2016-03-09 | 2021-10-05 | Industrie De Nora S.P.A. | Electrode structure provided with resistors |
-
1998
- 1998-06-11 JP JP17972698A patent/JP3507337B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11354309A (en) | 1999-12-24 |
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