JP3504086B2 - Substrate heat treatment equipment - Google Patents
Substrate heat treatment equipmentInfo
- Publication number
- JP3504086B2 JP3504086B2 JP28277496A JP28277496A JP3504086B2 JP 3504086 B2 JP3504086 B2 JP 3504086B2 JP 28277496 A JP28277496 A JP 28277496A JP 28277496 A JP28277496 A JP 28277496A JP 3504086 B2 JP3504086 B2 JP 3504086B2
- Authority
- JP
- Japan
- Prior art keywords
- recess
- spacer
- substrate
- heat treatment
- diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、加熱手段または冷
却手段のうち少なくとも一方を備えた熱板の伝熱プレー
ト上面に形成された凹部にスペーサが入れられて、伝熱
プレート上に微小間隔を保って基板を支持して加熱処理
または冷却処理を行うように構成された基板熱処理装置
に係り、特には、凹部からのスペーサの抜け出しを防止
する技術に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention has a spacer formed in a recess formed on the upper surface of a heat transfer plate of a heat plate having at least one of a heating means and a cooling means to form a minute gap on the heat transfer plate. The present invention relates to a substrate heat treatment apparatus configured to hold a substrate to perform a heat treatment or a cooling treatment, and more particularly, to a technique for preventing a spacer from coming out of a recess.
【０００２】[0002]
【従来の技術】従来のこの種の基板熱処理装置として、
例えば、特開昭63−193833号公報に示すようなものがあ
る。2. Description of the Related Art As a conventional substrate heat treatment apparatus of this type,
For example, there is one as shown in JP-A-63-193833.
【０００３】この従来装置は、加熱手段または冷却手段
のうち少なくとも一方を備えた熱板の伝熱プレート上面
の３箇所以上に凹部が形成され、各凹部内に球体状のス
ペーサが入れられている。凹部内にスペーサが入るよう
に、凹部の開口の直径は球体状のスペーサの直径よりも
大きく形成されている。また、凹部の深さは球体状のス
ペーサの直径より浅く形成されていて、スペーサの直径
と凹部の深さとの差によって、スペーサに載置支持され
た基板の下面と伝熱プレートの上面との間に所定の微小
間隔を保って基板が支持されるように構成されている。In this conventional apparatus, recesses are formed at three or more locations on the upper surface of the heat transfer plate of the hot plate provided with at least one of heating means and cooling means, and spherical spacers are placed in each recess. . The diameter of the opening of the recess is formed to be larger than the diameter of the spherical spacer so that the spacer can be inserted into the recess. Further, the depth of the recess is formed to be shallower than the diameter of the spherical spacer, and due to the difference between the diameter of the spacer and the depth of the recess, the lower surface of the substrate placed and supported on the spacer and the upper surface of the heat transfer plate are separated. The substrate is configured to be supported with a predetermined minute gap therebetween.
【０００４】このように伝熱プレートから微小間隔を離
間させて基板を支持して加熱処理または冷却処理を行う
ことによって、伝熱プレート上面からの熱輻射によって
均一に基板を加熱または冷却することができる。As described above, the substrate is supported at a minute distance from the heat transfer plate to perform the heating process or the cooling process, so that the substrate is uniformly heated or cooled by the heat radiation from the upper surface of the heat transfer plate. it can.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上記公
報開示の従来装置では、スペーサが凹部内に単に入れら
れている（落とし込まれている）だけであるため、以下
のような問題が起こっていた。However, in the conventional device disclosed in the above publication, the spacers are simply put (dropped) in the recesses, so that the following problems occur. .
【０００６】基板（半導体ウエハや液晶表示基用のガラ
ス基板など）に対するこの基板熱処理装置による熱処理
（加熱処理や冷却処理）の前工程の処理などによって基
板の下面が粘着性を有している場合がある。そのような
場合、基板への熱処理が終了して基板を基板熱処理装置
から搬出する際、基板の下面にスペーサがくっついて凹
部から抜け出して無くなり、次の基板が基板熱処理装置
に搬入されても、凹部内にスペーサが無いので、伝熱プ
レート上に所定の微小間隔を保って基板が支持されず均
一な熱処理が行えなくなる。以降に搬入される基板に対
しても同様に均一な熱処理が行えなくなる。基板に対す
る熱処理が均一に行えないと、後工程の処理が精度良く
行えなくなり、不良品を連続して出すことになる。In the case where the lower surface of the substrate has an adhesive property due to the pretreatment of the heat treatment (heat treatment or cooling treatment) by the substrate heat treatment apparatus for the substrate (semiconductor wafer, glass substrate for liquid crystal display substrate, etc.) There is. In such a case, when the substrate is carried out from the substrate heat treatment apparatus after the heat treatment is completed, the spacer sticks to the lower surface of the substrate and does not come out of the recess, and the next substrate is carried into the substrate heat treatment apparatus. Since there is no spacer in the concave portion, the substrate is not supported on the heat transfer plate with a predetermined minute interval, and uniform heat treatment cannot be performed. Similarly, uniform heat treatment cannot be performed on the substrates carried in thereafter. If the heat treatment cannot be performed uniformly on the substrate, the subsequent processes cannot be performed accurately, and defective products will be continuously produced.
【０００７】また、基板の下面の汚染を防止するため
に、定期的に作業者が伝熱プレート上面をワイパーで掃
くなどして清掃しているが、その清掃の際にスペーサが
凹部から掃き出されて紛失することもあった。さらに、
凹部からスペーサを掃き出したことに気付かずに基板へ
の熱処理を開始すれば、上述したように、基板への熱処
理が均一に行えないことになる。Further, in order to prevent the lower surface of the substrate from being contaminated, an operator regularly cleans the upper surface of the heat transfer plate by wiping it with a wiper. When the cleaning is performed, the spacer is swept from the concave portion. Sometimes it was lost and was lost. further,
If the heat treatment on the substrate is started without noticing that the spacer has been swept out from the recess, the heat treatment on the substrate cannot be performed uniformly as described above.
【０００８】本発明は、このような事情に鑑みてなされ
たものであって、基板への熱処理を常に均一に行える基
板熱処理装置を提供することを目的とする。The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate heat treatment apparatus capable of uniformly performing heat treatment on a substrate.
【０００９】[0009]
【課題を解決するための手段】本発明は、このような目
的を達成するために、次のような構成をとる。すなわ
ち、請求項１に記載の発明は、加熱手段または冷却手段
のうち少なくとも一方を備えた熱板の伝熱プレート上面
に形成された凹部にスペーサが入れられて、伝熱プレー
ト上に微小間隔を保って基板を支持して加熱処理または
冷却処理を行うように構成された基板熱処理装置におい
て、前記凹部の底面を除く内周面と前記スペーサとを接
着剤で接着固定して、前記スペーサを前記凹部内に固定
したことを特徴とするものである。The present invention has the following constitution in order to achieve such an object. That is, according to the first aspect of the present invention, the spacer is inserted in the recess formed in the upper surface of the heat transfer plate of the heat plate provided with at least one of the heating means and the cooling means, and a minute gap is provided on the heat transfer plate. In a substrate heat treatment apparatus configured to hold and support a substrate for heat treatment or cooling treatment, an inner peripheral surface of the recess other than the bottom surface is in contact with the spacer.
It is characterized in that the spacer is fixed in the recess by adhesively fixing it with an adhesive .
【００１０】基板に冷却処理を行う基板熱処理装置（基
板冷却装置）の場合の接着剤としては、シアノアクリレ
ート系接着剤（いわゆる瞬間接着剤）や無機系接着剤な
どを用いることができる。なお、冷却処理の前に加熱処
理が行われ、基板が高温の状態で基板冷却装置に搬入さ
れる場合には、高温の基板からの熱輻射に耐えるため
に、若干の耐熱性を持つことが望ましく、そのような場
合には無機系接着剤を用いることが好ましい。A cyanoacrylate adhesive (so-called instant adhesive), an inorganic adhesive, or the like can be used as an adhesive in the case of a substrate heat treatment apparatus (substrate cooling apparatus) for cooling a substrate. When the substrate is carried into the substrate cooling device in a high temperature state after being subjected to the heat treatment before the cooling treatment, it may have some heat resistance to withstand the heat radiation from the high temperature substrate. Desirably, in such a case, it is preferable to use an inorganic adhesive.
【００１１】また、基板に加熱処理を行う基板熱処理装
置（基板加熱装置）の場合は、伝熱プレート自体が加熱
されるので、伝熱プレートに接触する接着剤としては、
基板冷却装置に用いる接着剤と異なり耐熱性を持つ必要
がある。このような耐熱性の接着剤としては、アロンセ
ラミックＥ（東亜合成化学工業株式会社）などの耐熱性
無機系接着剤を用いることができる。In the case of a substrate heat treatment apparatus (substrate heating apparatus) that heats a substrate, since the heat transfer plate itself is heated, the adhesive that contacts the heat transfer plate is
Unlike the adhesive used in the substrate cooling device, it must have heat resistance. As such a heat resistant adhesive, a heat resistant inorganic adhesive such as Aron Ceramic E (Toagosei Kagaku Kogyo Co., Ltd.) can be used.
【００１２】また、請求項２に記載の発明は、加熱手段
または冷却手段のうち少なくとも一方を備えた熱板の伝
熱プレート上面に形成された凹部にスペーサが入れられ
て、伝熱プレート上に微小間隔を保って基板を支持して
加熱処理または冷却処理を行うように構成された基板熱
処理装置において、前記凹部に脱落防止部材を嵌め込む
ことによって、前記スペーサを前記凹部内に保持したこ
とを特徴とするものである。Further, according to the invention as defined in claim 2 , a spacer is put in a recess formed in the upper surface of the heat transfer plate of the hot plate provided with at least one of the heating means and the cooling means, and the spacer is put on the heat transfer plate. In a substrate heat treatment apparatus configured to support a substrate at a minute interval and perform heat treatment or cooling treatment, a fall prevention member is fitted in the recess.
As a result , the spacer is held in the recess.
【００１３】また、請求項３に記載の発明は、上記請求
項２に記載の基板熱処理装置において、前記スペーサを
球体状の部材で構成し、前記凹部は、その開口の直径が
前記球体状のスペーサの直径より大きく、かつ、深さが
前記球体状のスペーサの直径より浅くなるように形成
し、前記脱落防止部材は、外径が前記凹部の開口の直径
よりも大きいリング状の一部を切り欠いたバネ状の部材
で構成し、この脱落防止部材を前記凹部に嵌め込んだ状
態での脱落防止部材の内径が前記球体状のスペーサの直
径よりも小さくなるように構成したことを特徴とするも
のである。Further, the invention according to claim 3, in the substrate heat treatment apparatus according to claim 2, the spacer constituted by spherical member, the recess, the diameter of the opening is the spherical It is formed so that the diameter is larger than the diameter of the spacer and the depth is shallower than the diameter of the spherical spacer, and the fall-prevention member has a ring-shaped part whose outer diameter is larger than the diameter of the opening of the recess. It is configured by a notched spring-like member, and the inside diameter of the fall-out prevention member when the fall-off prevention member is fitted in the recess is smaller than the diameter of the spherical spacer. To do.
【００１４】[0014]
【作用】請求項１に記載の発明によれば、凹部の底面を
除く内周面とスペーサとを接着剤で接着固定して、スペ
ーサを凹部内に固定しているので、スペーサが基板の下
面にくっついたり、伝熱プレート上面をワイパーなどで
掃いても、スペーサが凹部から抜け出したり掃き出され
るようなことがなく、常に伝熱プレート上に所定の微小
間隔を保って基板を支持することができ、基板への熱処
理を常に均一に行うことができる。According to the first aspect of the invention, the bottom surface of the recess is
Since the inner peripheral surface except for and the spacer are adhesively fixed with an adhesive and the spacer is fixed in the recess, even if the spacer sticks to the lower surface of the substrate or the upper surface of the heat transfer plate is swept with a wiper, etc. The substrate can be always supported on the heat transfer plate at a predetermined minute interval without being pulled out or swept out from the concave portion, and the heat treatment to the substrate can be always performed uniformly.
【００１５】請求項２に記載の発明によれば、凹部に脱
落防止部材を嵌め込むことによって、スペーサを凹部内
に保持しているので、スペーサが基板の下面にくっつい
たり、伝熱プレート上面をワイパーなどで掃いても、ス
ペーサが凹部から抜け出したり掃き出されるようなこと
がなく、常に伝熱プレート上に所定の微小間隔を保って
基板を支持することができ、基板への熱処理を常に均一
に行うことができる。According to the second aspect of the invention, the recess is removed.
Since the spacer is held in the recess by fitting the drop prevention member , the spacer will slip out of the recess even if the spacer sticks to the bottom surface of the substrate or the top surface of the heat transfer plate is swept with a wiper. Without such a situation, the substrate can be always supported on the heat transfer plate at a predetermined minute interval, and the heat treatment to the substrate can always be performed uniformly.
【００１６】請求項３に記載の発明によれば、まず、球
体状のスペーサが凹部内に落とし込まれる。凹部内にス
ペーサが入るように、凹部の開口の直径は球体状のスペ
ーサの直径よりも大きく形成されている。次に、外径が
凹部の開口の直径よりも大きいリング状の一部を切り欠
いたバネ状の脱落防止部材の切り欠き部分を接合させる
ように変形させて、その外径を凹部の開口の直径よりも
小径にして凹部内に嵌め込む。これで、脱落防止部材の
付勢力によって脱落防止部材が凹部の内周面を押して脱
落防止部材が凹部内からはずれることが防止される。こ
のとき、脱落防止部材の内径は球体状のスペーサの直径
よりも小さいので、脱落防止部材によって球体状のスペ
ーサは凹部内に保持され、スペーサが凹部から抜け出す
ことを防止できる。なお、凹部の深さは球体状のスペー
サの直径よりも浅く形成されているので、この差によっ
て、基板を伝熱プレート上に所定の微小間隔を保って支
持することができる。According to the third aspect of the invention, first, the spherical spacer is dropped into the recess. The diameter of the opening of the recess is formed to be larger than the diameter of the spherical spacer so that the spacer can be inserted into the recess. Next, the outer diameter of the opening of the recess is changed so that the cutout portion of the spring-shaped fall-out prevention member, which is formed by cutting out a ring-shaped part whose outer diameter is larger than the diameter of the opening of the recess, is joined. Make the diameter smaller than the diameter and fit into the recess. As a result, it is prevented that the drop-preventing member pushes the inner peripheral surface of the recess due to the urging force of the drop-preventing member and the drop-preventing member is disengaged from the recess. At this time, since the inner diameter of the drop-out prevention member is smaller than the diameter of the spherical spacer, the drop-out prevention member holds the spherical spacer in the recess, and the spacer can be prevented from slipping out of the recess. Since the depth of the recess is smaller than the diameter of the spherical spacer, the difference allows the substrate to be supported on the heat transfer plate at a predetermined minute interval.
【００１７】[0017]
【発明の実施の形態】以下、図面を参照して本発明の実
施の形態を説明する。図１（ａ）は、本発明に係る基板
熱処理装置の全体的な概略構成を示す平面図であり、同
図（ｂ）は、その縦断面図である。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1A is a plan view showing an overall schematic configuration of a substrate heat treatment apparatus according to the present invention, and FIG. 1B is a vertical sectional view thereof.
【００１８】この種の基板熱処理装置は、熱板１と昇降
ピン２などを備えて構成されている。熱板１は、冷却手
段や加熱手段としてのペルチェ素子３と、アルミニウム
やセラミックなどを材料とした伝熱プレート（基板冷却
装置の場合は吸熱板、基板加熱装置の場合は放熱板）
４、放熱板（基板冷却装置の場合）または吸熱板（基板
加熱装置の場合）５などで構成されている。なお、基板
加熱装置においては、加熱手段としてヒーターが用いら
れることもある。This type of substrate heat treatment apparatus comprises a heating plate 1 and lifting pins 2. The heat plate 1 is a Peltier element 3 as a cooling unit or a heating unit, and a heat transfer plate made of a material such as aluminum or ceramic (a heat absorbing plate in the case of a substrate cooling device, a heat radiating plate in the case of a substrate heating device).
4, a heat radiating plate (for a substrate cooling device), a heat absorbing plate (for a substrate heating device) 5, and the like. A heater may be used as the heating means in the substrate heating device.
【００１９】熱板１には昇降ピン２を昇降自在に貫通さ
せる貫通孔６が設けられている。昇降ピン２は、図示し
ない搬送アームとの間で基板Ｗを受け渡すためのもので
３本以上備えている。これら昇降ピン２は、基端部がベ
ース部材７に支持されている。そして、図示しないエア
シリンダによってベース部材７を昇降させることによ
り、基板Ｗを載置支持する各昇降ピン２の先端部が、伝
熱プレート４内に収納された状態と伝熱プレート４から
突出された状態との間で一体的に昇降されるようになっ
ている。The hot plate 1 is provided with a through hole 6 through which the elevating pin 2 is vertically movable. The lifting pins 2 are for transferring the substrate W to and from a transfer arm (not shown), and are provided with three or more pins. The base ends of the lifting pins 2 are supported by the base member 7. Then, the base member 7 is moved up and down by an air cylinder (not shown), so that the tips of the lift pins 2 for mounting and supporting the substrate W are protruded from the heat transfer plate 4 while being housed in the heat transfer plate 4. It is designed so that it can be lifted up and down as a unit.
【００２０】伝熱プレートの上面には、３箇所以上に凹
部８が形成され、各凹部８に球体状のスペーサ９が入れ
られるようになっている。スペーサ９は、例えば、アル
ミナやアテアタイトなどの低伝熱部材によって構成され
る。Recesses 8 are formed at three or more places on the upper surface of the heat transfer plate, and a spherical spacer 9 is inserted in each recess 8. The spacer 9 is made of, for example, a low heat transfer member such as alumina or ateatite.
【００２１】次に、上記構成の基板熱処理装置の実施例
を図面を参照して説明する。図２は、本発明の第１実施
例装置の要部の構成を示す縦断面図である。Next, an embodiment of the substrate heat treatment apparatus having the above structure will be described with reference to the drawings. FIG. 2 is a vertical cross-sectional view showing the configuration of the main part of the device according to the first embodiment of the present invention.
【００２２】凹部８にスペーサ９が入るように、凹部８
の開口の直径ＨＤは球体状のスペーサ９の直径ＱＤより
も大きく形成されている。また、凹部８の深さＨＨは球
体状のスペーサ９の直径ＱＤよりも浅く形成されてい
て、この差ｄ（ＱＤ−ＨＨ）によって、基板Ｗを伝熱プ
レート４上に所定の微小間隔ｄを保って支持するように
構成している。The recess 8 is formed so that the spacer 9 fits in the recess 8.
The diameter HD of the opening is larger than the diameter QD of the spherical spacer 9. Further, the depth HH of the concave portion 8 is formed to be shallower than the diameter QD of the spherical spacer 9, and the difference d (QD-HH) allows the substrate W to be placed on the heat transfer plate 4 at a predetermined minute distance d. It is configured to keep and support.
【００２３】そして、この第１実施例装置では、各スペ
ーサ９を接着剤１０で各凹部８内に接着固定している。
これにより、スペーサ９が凹部８から抜け出すことがな
く、常に伝熱プレート４上に所定の微小間隔ｄを保って
基板Ｗを支持することができ、基板Ｗへの熱処理を常に
均一に行うことができる。In the first embodiment, each spacer 9 is adhesively fixed in each recess 8 with the adhesive 10.
As a result, the spacer 9 does not come out of the recess 8 and the substrate W can be always supported on the heat transfer plate 4 with a predetermined minute gap d, so that the heat treatment on the substrate W can be always performed uniformly. it can.
【００２４】基板冷却装置の場合の接着剤としては、シ
アノアクリレート系接着剤や無機系接着剤などを用いる
ことができる。また、基板加熱装置の場合の接着剤とし
ては、耐熱性無機系接着剤などを用いることができる。As the adhesive in the case of the substrate cooling device, a cyanoacrylate adhesive or an inorganic adhesive can be used. Further, as the adhesive in the case of the substrate heating device, a heat resistant inorganic adhesive or the like can be used.
【００２５】次に、スペーサ９の凹部８内への接着作業
を図３を参照して説明する。図では、（耐熱性）無機系
接着剤による接着作業を示している。Next, the work of bonding the spacer 9 into the recess 8 will be described with reference to FIG. The figure shows a bonding operation using a (heat resistant) inorganic adhesive.
【００２６】まず、図３（ａ）に示すように凹部８の内
周面８ａに接着剤１０を付ける。次に、図３（ｂ）に示
すように凹部８内に球体状のスペーサ９を入れる。そし
て、図３（ｃ）に示すように各スペーサ９の上に（８０
０ｇ程度の）重り１１を乗せて約２４時間静置させて、
接着剤１０を硬化させスペーサ９を凹部８内に接着固定
させる。First, as shown in FIG. 3A, the adhesive 10 is applied to the inner peripheral surface 8a of the recess 8. Next, as shown in FIG. 3B, a spherical spacer 9 is put in the recess 8. Then, as shown in FIG. 3C, (80
Place a weight 11 (about 0 g) and let stand for about 24 hours,
The adhesive 10 is hardened and the spacers 9 are fixedly adhered in the recesses 8.
【００２７】なお、上記図３（ａ）、（ｂ）の作業にお
いて、凹部８内に入れられたスペーサ９と凹部８の底面
８ｂとの間に接着剤１０を挟み込まないように、接着剤
１０を凹部８の内周面８ａに付ける際に接着剤１０が凹
部８の底面８ｂに付かないようにするとともに、適量の
接着剤１０を付けてスペーサ９を凹部８内に入れる際に
接着剤１０がスペーサ９と凹部８の底面８ｂとの間に流
れ込まないようにする。もちろん、スペーサ９を凹部８
内に入れる際にも接着剤１０がスペーサ９と凹部８の底
面８ｂとの間に入り込まないようにスペーサ９を凹部８
に入れる。凹部８内に入れられたスペーサ９と凹部８の
底面８ｂとの間に接着剤１０を挟み込むと、そのぶんだ
け凹部８から突出するスペーサ９の高さ（ｄ）が大きく
なるので、予め決められた微小隙間を保って基板Ｗを支
持できず、また、各スペーサ９の各凹部８からの突出高
さ（各ｄ）がまちまちになり、安定して基板Ｗを保持で
きなくなる。従って、上記したように、接着作業におい
て凹部８内に入れられたスペーサ９と凹部８の底面８ｂ
との間に接着剤１０を挟み込まないようにしている。In the work shown in FIGS. 3 (a) and 3 (b), the adhesive 10 is placed so as not to be sandwiched between the spacer 9 put in the recess 8 and the bottom surface 8b of the recess 8. The adhesive 10 is prevented from adhering to the bottom surface 8b of the recess 8 when it is applied to the inner peripheral surface 8a of the recess 8, and the adhesive 10 is applied when the spacer 9 is put into the recess 8 with an appropriate amount of the adhesive 10. Are prevented from flowing between the spacer 9 and the bottom surface 8b of the recess 8. Of course, the spacer 9 is not
Even when the spacer 9 is put in the inside, the spacer 9 is formed so that the adhesive 10 does not enter between the spacer 9 and the bottom surface 8b of the recess 8.
Put in. If the adhesive 10 is sandwiched between the spacer 9 placed in the recess 8 and the bottom surface 8b of the recess 8, the height (d) of the spacer 9 protruding from the recess 8 is correspondingly increased. In addition, the substrate W cannot be supported with a small gap maintained, and the projection height (each d) of each spacer 9 from each recess 8 is varied, so that the substrate W cannot be stably held. Therefore, as described above, the spacer 9 put in the recess 8 and the bottom surface 8b of the recess 8 in the bonding work.
The adhesive 10 is not sandwiched between and.
【００２８】また、上記図３（ｃ）の作業において、重
り１１やスペーサ９を動かすと、接着剤１０に亀裂が入
っるなど接着剤１０が硬化した後、スペーサ９が凹部８
内に固定されないことにもなるので、図３（ｃ）の作業
においては、重り１１やスペーサ９を動かさずに静置さ
せておく。In the work shown in FIG. 3 (c), when the weight 11 and the spacer 9 are moved, the adhesive 10 is hardened such that the adhesive 10 is cracked and the spacer 9 is recessed.
Since it is not fixed inside, the weight 11 and the spacer 9 are left stationary without moving in the work of FIG. 3C.
【００２９】次に、本発明の第２実施例装置の構成を図
４を参照して説明する。図４（ａ）は、本発明の第２実
施例装置の要部の構成を示す縦断面図であり、同図
（ｂ）は、その平面図、同図（ｃ）は、脱落防止部材の
構成を示す平面図である。Next, the configuration of the second embodiment device of the present invention will be described with reference to FIG. FIG. 4A is a vertical cross-sectional view showing the configuration of the main part of the device of the second embodiment of the present invention, FIG. 4B is its plan view, and FIG. It is a top view which shows a structure.
【００３０】凹部８の開口の直径ＨＤおよび深さＨＨと
球体状のスペーサ９の直径ＱＤの大小関係は上記第１実
施例装置と同じ（ＨＤ＞ＱＤ＞ＨＨ）である。The magnitude relationship between the diameter HD and depth HH of the opening of the recess 8 and the diameter QD of the spherical spacer 9 is the same as that of the first embodiment device (HD>QD> HH).
【００３１】上記第１実施例装置では、スペーサ９を接
着剤１０で凹部８内に接着固定したが、この第２実施例
装置では、スペーサ９を脱落防止部材２０によって凹部
８内に保持してスペーサ９が凹部８から抜け出すのを防
止するように構成している。In the device of the first embodiment, the spacer 9 is adhesively fixed in the recess 8 with the adhesive 10. However, in the device of the second embodiment, the spacer 9 is held in the recess 8 by the fall prevention member 20. The spacer 9 is configured to prevent the spacer 9 from coming out of the recess 8.
【００３２】この脱落防止部材２０は、例えば、図４
（ｃ）に示すように、外径ＢＧが凹部８の開口の直径Ｈ
Ｄよりも大きい（ＢＧ＞ＨＤ）リング状の一部を切り欠
いたバネ状の部材で実現することができる。なお、脱落
防止部材２０は、ステンレス鋼などで形成する。The fall prevention member 20 is, for example, as shown in FIG.
As shown in (c), the outer diameter BG is the diameter H of the opening of the recess 8.
It can be realized by a spring-shaped member in which a part of a ring shape larger than D (BG> HD) is cut out. The fall prevention member 20 is made of stainless steel or the like.
【００３３】次に、この脱落防止部材２０の装着作業を
交えて脱落防止部材２０によるスペーサ９の保持状態を
説明する。Next, the holding state of the spacer 9 by the drop-preventing member 20 will be described together with the work of mounting the drop-preventing member 20.
【００３４】まず、球体状のスペーサ９が凹部８内に落
とし込まれる。次に、脱落防止部材２０の切り欠き部分
２１を接合させるように変形させて、その外径ＢＧを凹
部８の直径ＨＤよりも小径にして凹部８内に嵌め込む。
これで、脱落防止部材２０の付勢力（図４（ａ）、
（ｂ）に点線の矢印ＦＹで示す方向に作用する力）によ
って脱落防止部材２０が凹部８の内周面を押して脱落防
止部材２０が凹部８内からはずれることが防止される。
なお、脱落防止部材２０は、伝熱プレート４を構成する
材料（アルミニウムなど）より硬い材料（ステンレス鋼
など）で形成しているので、スペーサ９が基板Ｗの下面
にくっついて持ち上げられたり、ワイパーなどで伝熱プ
レート４上面を掃いたりすることで脱落防止部材２０が
凹部８内からはずれることはない。First, the spherical spacer 9 is dropped into the recess 8. Next, the notch portion 21 of the drop-off prevention member 20 is deformed so as to be joined, and its outer diameter BG is made smaller than the diameter HD of the recess 8 and fitted into the recess 8.
With this, the urging force of the fall prevention member 20 (see FIG. 4 (a),
It is prevented that the fall prevention member 20 pushes the inner peripheral surface of the recess 8 by the force acting in the direction indicated by the dotted line FY in (b) to disengage the fall prevention member 20 from the inside of the recess 8.
Since the captive prevention member 20 is made of a material (stainless steel or the like) that is harder than the material (aluminum or the like) that constitutes the heat transfer plate 4, the spacer 9 sticks to the lower surface of the substrate W and is lifted, or the wiper is wiped. For example, by sweeping the upper surface of the heat transfer plate 4 or the like, the fall prevention member 20 does not move out of the recess 8.
【００３５】脱落防止部材２０を凹部８に嵌め込んだ状
態における脱落防止部材２０の内径ＢＮは球体状のスペ
ーサ９の直径ＱＤよりも小さくなるように構成している
ので、脱落防止部材２０によって球体状のスペーサ９は
凹部８内に保持され、スペーサ９が凹部８から抜け出す
ことを防止できる。そして、脱落防止部材２０によって
凹部８内に保持された球体状のスペーサ９の直径ＱＤと
凹部の深さＨＨとの差ｄ（ＱＤ−ＨＨ）によって、基板
Ｗは伝熱プレート４上に所定の微小間隔ｄを保って支持
され、加熱処理または冷却処理が施される。Since the inner diameter BN of the drop-preventing member 20 in a state where the drop-preventing member 20 is fitted in the recess 8 is smaller than the diameter QD of the spherical spacer 9, the drop-preventing member 20 causes the spherical shape. The spacers 9 are held in the recesses 8 to prevent the spacers 9 from coming out of the recesses 8. The difference between the diameter QD of the spherical spacer 9 held in the recess 8 by the drop-off prevention member 20 and the depth HH of the recess d (QD-HH) allows the substrate W to be placed on the heat transfer plate 4 in a predetermined manner. It is supported with a minute gap d maintained and is subjected to heat treatment or cooling treatment.
【００３６】なお、脱落防止部材２０を凹部８に嵌め込
んだ状態における脱落防止部材２０の内径ＢＮが球体状
のスペーサ９の直径ＱＤよりも小さくなるように構成す
るには、脱落防止部材２０の肉厚ＢＤを、（ＨＤ−Ｑ
Ｄ）／２よりも大きくすればよい。ただし、脱落防止部
材２０の肉厚ＢＤを厚くし過ぎると、脱落防止部材２０
を凹部８内に嵌め込めなくなる。従って、脱落防止部材
２０の肉厚ＢＤは、（ＨＤ−ＱＤ）／２よりも大きく、
脱落防止部材２０を凹部８内に嵌め込める範囲内とする
ように、凹部８の開口の直径ＨＤや球体状のスペーサ９
の直径ＱＤに応じて設計する。In order to make the inner diameter BN of the drop-preventing member 20 fitted into the recess 8 smaller than the diameter QD of the spherical spacer 9, the drop-preventing member 20 should be formed. The wall thickness BD is (HD-Q
It should be larger than D) / 2. However, if the wall-thickness BD of the captive prevention member 20 is made too thick, the captive prevention member 20
Cannot be fitted into the recess 8. Therefore, the wall thickness BD of the fall prevention member 20 is larger than (HD-QD) / 2,
The diameter HD of the opening of the recess 8 and the spherical spacer 9 are set so that the fall prevention member 20 can be fitted in the recess 8.
Design according to the diameter QD.
【００３７】また、図では、脱落防止部材２０が凹部８
内に嵌め込まれた状態で脱落防止部材２０がスペーサ９
と接触しているが、脱落防止部材２０が凹部８内に嵌め
込まれた状態で脱落防止部材２０がスペーサ９と非接触
であっても、スペーサ９が凹部８から抜け出すのを防止
することができる。Further, in the figure, the drop-off preventing member 20 is shown as the recess 8
The stopper member 20 is attached to the inside of the spacer 9 when it is fitted inside.
However, the spacer 9 can be prevented from coming out of the concave portion 8 even if the stopper member 20 is not in contact with the spacer 9 in the state where the stopper member 20 is fitted in the concave portion 8. .
【００３８】さらに、図では、脱落防止部材２０が凹部
８内に嵌め込まれた状態で脱落防止部材２０の切り欠き
部分２１の断面が当接するように脱落防止部材２０の切
り欠き部分２１を構成しているが、脱落防止部材２０が
凹部８内に嵌め込まれた状態で脱落防止部材２０の切り
欠き部分２１の断面が当接していなくても、スペーサ９
が凹部８から抜け出すのを防止することができる。Further, in the figure, the cutout portion 21 of the dropout prevention member 20 is configured so that the cross section of the cutout portion 21 of the dropout prevention member 20 comes into contact with the dropout prevention member 20 fitted in the recess 8. However, even if the cross section of the cutout portion 21 of the drop-preventing member 20 is not in contact with the drop-preventing member 20 fitted in the recess 8, the spacer 9
Can be prevented from coming out of the recess 8.
【００３９】この第２実施例装置では、脱落防止部材２
０を凹部８内に嵌め込むという簡単な作業でスペーサ９
が凹部８から抜け出すのを防止できる。また、脱落防止
部材２０は、リング状の一部を切り欠いたバネ状の部材
という簡単な部材で実現でき、コスト的にも安くするこ
とができる。In this second embodiment device, the fall prevention member 2
The spacer 9 can be installed by a simple operation of fitting 0 into the recess 8.
Can be prevented from coming out of the recess 8. Further, the fall-off prevention member 20 can be realized by a simple member such as a spring-shaped member having a ring-shaped part cut out, and the cost can be reduced.
【００４０】次に、脱落防止部材２０の変形例を図５を
参照して説明する。第２実施例装置の脱落防止部材２０
は、構造を簡単にするために脱落防止部材２０の断面を
円形に構成しているが、その断面を図５（ａ）、（ｂ）
に示すように構成してもよい。すなわち、脱落防止部材
２０が凹部８に嵌め込まれた状態で、脱落防止部材２０
の上面が、伝熱プレート４の上面と同一平面を形成し、
凹部８の外周とスペーサ９との間の隙間を埋める長さＬ
を有するものである。なお、この長さＬは以下の式で求
められる。Next, a modified example of the fall prevention member 20 will be described with reference to FIG. Fall prevention member 20 of the second embodiment device
In order to simplify the structure, the falling prevention member 20 has a circular cross section, and the cross section is shown in FIGS. 5 (a) and 5 (b).
It may be configured as shown in. That is, in the state where the fall prevention member 20 is fitted in the recess 8, the fall prevention member 20
The upper surface of the heat transfer plate 4 is flush with the upper surface of the heat transfer plate 4,
Length L that fills the gap between the outer periphery of the recess 8 and the spacer 9
Is to have. The length L is calculated by the following formula.
【００４１】
Ｌ ＝（ＨＤ／２）−ＬＬ
ＬＬ＝√（（ＱＤ／２）２ −（（ＱＤ／２）−ｄ）２ ）
なお、図中のＱＱは、球体状のスペーサ９の中心を示
す。L = (HD / 2) −LL LL = √ ((QD / 2) 2 − ((QD / 2) −d) 2 ). Here, QQ in the figure is the center of the spherical spacer 9. Show.
【００４２】また、脱落防止部材２０の内周面は、図５
（ａ）に示すようにスペーサ９の外周に沿うように構成
してもよいし、図５（ｂ）に示すようにスペーサ９の外
周に沿わないように構成してもよい。The inner peripheral surface of the drop-off preventing member 20 is shown in FIG.
The spacer 9 may be arranged along the outer circumference of the spacer 9 as shown in FIG. 5A, or may be arranged not along the outer circumference of the spacer 9 as shown in FIG.
【００４３】脱落防止部材２０が凹部８内に嵌め込まれ
た状態で脱落防止部材２０の切り欠き部分２１の断面が
当接するように脱落防止部材２０の切り欠き部分２１を
構成して、凹部８の外周とスペーサ９との間の隙間を全
周にわたって脱落防止部材２０で埋めている。The cutout portion 21 of the drop-prevention member 20 is formed so that the cross-section of the cutout portion 21 of the drop-out prevention member 20 is in contact with the drop-out prevention member 20 in the recess 8. The gap between the outer circumference and the spacer 9 is filled with the fall prevention member 20 over the entire circumference.
【００４４】脱落防止部材２０は、スペーサ９のように
低伝熱部材ではないので、脱落防止部材２０上面におい
ても、伝熱プレート４上面と同等の熱輻射によって、凹
部８付近における基板Ｗへの熱処理が行える。凹部８の
外周とスペーサ９との間の隙間が空いている場合には、
その部分の基板Ｗへの熱処理が不十分となって、基板Ｗ
への熱処理が部分的に不均一になるが、図５の変形例で
は、そのような不都合を幾分改善することができる。Since the falling prevention member 20 is not a low heat transfer member like the spacer 9, the upper surface of the falling prevention member 20 radiates the same amount of heat as the upper surface of the heat transfer plate 4 to the substrate W in the vicinity of the recess 8. Can be heat treated. If there is a gap between the outer periphery of the recess 8 and the spacer 9,
The heat treatment to that part of the substrate W becomes insufficient, and the substrate W
Although the heat treatment to be partially non-uniform, such an inconvenience can be alleviated in the modification of FIG.
【００４５】[0045]
【発明の効果】以上の説明から明らかなように、請求項
１に記載の発明によれば、凹部の底面を除く内周面とス
ペーサとを接着剤で接着固定して、スペーサを凹部内に
固定しているので、スペーサが凹部から抜け出すことが
なく、常に伝熱プレート上に所定の微小間隔を保って基
板を支持することができ、基板への熱処理を常に均一に
行うことができる。As is apparent from the above description, according to the invention as set forth in claim 1, the inner peripheral surface excluding the bottom surface of the concave portion and the slit.
Since the spacer and the spacers are fixed in the recess by adhering and fixing them with the adhesive , the spacer does not come out of the recess, and the substrate can be always supported on the heat transfer plate with a predetermined minute interval. Therefore, the heat treatment on the substrate can always be performed uniformly.
【００４６】請求項２に記載の発明によれば、凹部に脱
落防止部材を嵌め込むことによって、スペーサを凹部内
に保持しているので、スペーサが凹部から抜け出すこと
がなく、常に伝熱プレート上に所定の微小間隔を保って
基板を支持することができ、基板への熱処理を常に均一
に行うことができる。According to the second aspect of the invention, the recess is removed.
Since the spacer is held in the recess by fitting the drop prevention member , the spacer does not come out of the recess, and the substrate can be always supported on the heat transfer plate with a predetermined minute interval, The heat treatment on the substrate can always be performed uniformly.
【００４７】請求項３に記載の発明によれば、球体状の
スペーサを凹部内に保持する脱落防止部材を、リング状
の一部を切り欠いた部材で構成しているので、製作が容
易でコストもかからない簡単な構成の脱落防止部材によ
って球体状のスペーサの凹部からの抜け出しを防止する
ことができる。また、脱落防止部材を凹部内に嵌め込む
という簡単な作業で球体状のスペーサの凹部からの抜け
出しを防止することができ、作業者の手間を軽減するこ
ともできる。According to the third aspect of the present invention, since the falling-off preventing member for holding the spherical spacer in the recess is formed by a member having a ring-shaped part cut out, the manufacturing is easy. The drop-out preventing member having a simple structure that does not cost much can prevent the spherical spacer from coming out of the recess. Further, it is possible to prevent the spherical spacer from coming out of the recess by a simple work of fitting the drop-out prevention member into the recess, and it is possible to reduce the labor of the operator.
【図１】本発明に係る基板熱処理装置の全体的な概略構
成を示す平面図と縦断面図である。FIG. 1 is a plan view and a vertical sectional view showing an overall schematic configuration of a substrate heat treatment apparatus according to the present invention.
【図２】本発明の第１実施例装置の要部の構成を示す縦
断面図である。FIG. 2 is a vertical cross-sectional view showing the configuration of the main part of the device according to the first embodiment of the present invention.
【図３】スペーサの凹部内への接着作業を説明するため
の図である。FIG. 3 is a diagram for explaining an operation of adhering a spacer into a recess.
【図４】本発明の第２実施例装置の要部の構成を示す縦
断面図と平面図および脱落防止部材の構成を示す平面図
である。FIG. 4 is a vertical cross-sectional view and a plan view showing a configuration of a main part of an apparatus according to a second embodiment of the present invention, and a plan view showing a configuration of a fall prevention member.
【図５】脱落防止部材の変形例の構成を示す縦断面図と
平面図である。5A and 5B are a vertical cross-sectional view and a plan view showing a configuration of a modified example of the fall-out prevention member.
１ 熱板
３ ペルチェ素子（加熱手段または冷却手段）
４ 伝熱プレート
８ 凹部
９ スペーサ
１０ 接着剤
２０ 脱落防止部材
Ｗ 基板
ｄ 微小間隔
ＨＤ 凹部の開口の直径
ＨＨ 凹部の深さ
ＱＤ 球体状のスペーサの直径
ＢＧ 脱落防止部材の外径
ＢＮ 脱落防止部材を凹部に嵌め込んだ状態での脱落防
止部材の内径1 Heat Plate 3 Peltier Element (Heating or Cooling Means) 4 Heat Transfer Plate 8 Recess 9 Recess 9 Spacer 10 Adhesive 20 Fall Prevention Member W Substrate d Minute Spacing HD Recess Opening Diameter HH Recess Depth QD Spherical Spacer Diameter BG Outer diameter of the fall prevention member BN Inner diameter of the fall prevention member with the fall prevention member fitted in the recess
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平８−70007（ＪＰ，Ａ) 特開 平５−47652（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/26 - 21/268 H01L 21/322 - 21/326 H01L 21/205 H01L 21/68 ─────────────────────────────────────────────────── ─── Continuation of front page (56) References JP-A-8-70007 (JP, A) JP-A-5-47652 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) H01L 21/26-21/268 H01L 21/322-21/326 H01L 21/205 H01L 21/68
Claims (3)
も一方を備えた熱板の伝熱プレート上面に形成された凹
部にスペーサが入れられて、伝熱プレート上に微小間隔
を保って基板を支持して加熱処理または冷却処理を行う
ように構成された基板熱処理装置において、前記凹部の底面を除く内周面と前記スペーサとを接着剤
で接着固定して、 前記スペーサを前記凹部内に固定したことを特徴とする
基板熱処理装置。1. A spacer is inserted in a recess formed in the upper surface of a heat transfer plate of a heat plate having at least one of a heating means and a cooling means to support a substrate on the heat transfer plate at a minute interval. In a substrate heat treatment apparatus configured to perform a heat treatment or a cooling treatment by an adhesive, the inner peripheral surface excluding the bottom surface of the concave portion and the spacer are adhesive.
A substrate heat treatment apparatus, characterized in that the spacers are fixed in the recesses by adhesive bonding .
も一方を備えた熱板の伝熱プレート上面に形成された凹
部にスペーサが入れられて、伝熱プレート上に微小間隔
を保って基板を支持して加熱処理または冷却処理を行う
ように構成された基板熱処理装置において、前記凹部に 脱落防止部材を嵌め込むことによって、前記
スペーサを前記凹部内に保持したことを特徴とする基板
熱処理装置。2. A spacer is inserted into a recess formed in the upper surface of the heat transfer plate of a heat plate having at least one of heating means and cooling means to support a substrate on the heat transfer plate at a minute interval. in the substrate heat treatment apparatus configured to perform the heat treatment or cooling treatment Te, by fitting the stopper member in the recess, the
A substrate heat treatment apparatus, characterized in that a spacer is held in the recess.
て、 前記スペーサを球体状の部材で構成し、 前記凹部は、その開口の直径が前記球体状のスペーサの
直径より大きく、かつ、深さが前記球体状のスペーサの
直径より浅くなるように形成し、 前記脱落防止部材は、外径が前記凹部の開口の直径より
も大きいリング状の一部を切り欠いたバネ状の部材で構
成し、 この脱落防止部材を前記凹部に嵌め込んだ状態での脱落
防止部材の内径が前記球体状のスペーサの直径よりも小
さくなるように構成したことを特徴とする基板熱処理装
置。3. The substrate heat treatment apparatus according to claim 2 , wherein the spacer is formed of a spherical member, and the recess has an opening whose diameter is larger than that of the spherical spacer and has a depth. Is formed so as to be shallower than the diameter of the spherical spacer, and the drop-off preventing member is formed by a notched spring-shaped member having a ring-shaped part having an outer diameter larger than the diameter of the opening of the recess. A substrate heat treatment apparatus, characterized in that the inside diameter of the fall-off prevention member in a state where the fall-off prevention member is fitted in the recess is smaller than the diameter of the spherical spacer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28277496A JP3504086B2 (en) | 1996-10-25 | 1996-10-25 | Substrate heat treatment equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28277496A JP3504086B2 (en) | 1996-10-25 | 1996-10-25 | Substrate heat treatment equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10135228A JPH10135228A (en) | 1998-05-22 |
| JP3504086B2 true JP3504086B2 (en) | 2004-03-08 |
Family
ID=17656908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28277496A Expired - Lifetime JP3504086B2 (en) | 1996-10-25 | 1996-10-25 | Substrate heat treatment equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3504086B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4014379B2 (en) | 2001-02-21 | 2007-11-28 | 株式会社日立製作所 | Defect review apparatus and method |
| JP4935002B2 (en) * | 2005-06-30 | 2012-05-23 | ウシオ電機株式会社 | Heating unit |
| JP4745191B2 (en) * | 2006-10-13 | 2011-08-10 | 株式会社Ｓｏｋｕｄｏ | Heat treatment equipment |
| JP2007294990A (en) * | 2007-06-21 | 2007-11-08 | Hitachi Kokusai Electric Inc | Substrate processing apparatus |
| JP2010129709A (en) * | 2008-11-27 | 2010-06-10 | Kyocera Corp | Sample supporter, and heating device |
| JP5641980B2 (en) * | 2011-03-01 | 2014-12-17 | 三菱電機株式会社 | Cooker |
-
1996
- 1996-10-25 JP JP28277496A patent/JP3504086B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10135228A (en) | 1998-05-22 |
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