JP3494578B2 - Ultrasonic probe and manufacturing method thereof - Google Patents
Ultrasonic probe and manufacturing method thereofInfo
- Publication number
- JP3494578B2 JP3494578B2 JP22108998A JP22108998A JP3494578B2 JP 3494578 B2 JP3494578 B2 JP 3494578B2 JP 22108998 A JP22108998 A JP 22108998A JP 22108998 A JP22108998 A JP 22108998A JP 3494578 B2 JP3494578 B2 JP 3494578B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- backing material
- piezoelectric
- auxiliary plate
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は圧電エレメントを二次元
上に並べた超音波探触子を利用分野とし、特に配列型と
した短軸方向（圧電素子の長さ方向）をも分割して同方
向の開口面積を可変可能にした１．５Ｄ（Dimention）
型の超音波探触子（１．５Ｄ探触子）とする。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention has an application field of an ultrasonic probe in which piezoelectric elements are two-dimensionally arranged, and in particular, an array type short axis direction (length direction of piezoelectric element) is also divided. 1.5D (Dimention) with variable opening area in the same direction
The ultrasonic probe of the type (1.5D probe).
【０００２】[0002]
【従来の技術】（発明の背景）超音波探触子は、医用等
における超音波診断装置の超音波送受波部として有用さ
れる。例えば短冊状の圧電素子を幅方向に並べた配列型
のものは、リニア及びセクタ駆動等により電子走査さ
れ、これにより超音波診断装置は疾患部等におけ配列方
向（長軸方向）の分解像を得る。そして、１．５Ｄ探触
子は、圧電素子の長さ方向を複数の圧電エレメントに分
割し、診断の必要に応じて、圧電エレメントを結線して
その開口面積を変え、被検出体における深さ方向の焦点
を切り替え、診断効率を高めるものである。このような
ものの一つに本出願人による１．５Ｄ探触子がある（参
照：特願平９−９８３１２号）。(Background of the Invention) An ultrasonic probe is useful as an ultrasonic wave transmitting / receiving section of an ultrasonic diagnostic apparatus for medical purposes. For example, an array type in which strip-shaped piezoelectric elements are arranged side by side in the width direction is electronically scanned by linear or sector drive, etc., so that the ultrasonic diagnostic apparatus can decompose an image in the array direction (long axis direction) in a diseased part or the like. To get The 1.5D probe divides the length direction of the piezoelectric element into a plurality of piezoelectric elements, and connects the piezoelectric elements to change the opening area thereof to change the opening area according to the need of diagnosis. The focus of the direction is switched to improve the diagnostic efficiency. One of these is the 1.5D probe by the present applicant (see Japanese Patent Application No. 9-98312).
【０００３】（従来技術の一例）第１０図は、この種の
一従来例を説明する１．５Ｄ探触子の平面図である。
１．５Ｄ探触子は、短軸方向に分割された３つの圧電エ
レメント１（ａｂｃ）からなる圧電素子１を長軸方向に
並べてなる。このようなものでは、圧電素子１を短軸方
向に３つに分割したので、例えば中央の圧電エレメント
１ａのみを駆動すると焦点深度を小さくして生体の表面
近傍を診断できる。また、中央と両側の圧電エレメント
１（ａｂｃ）を電気的に共通接続して駆動すると、焦点
深度を大きくして生体の深部を診断できる。(One Example of Prior Art) FIG. 10 is a plan view of a 1.5D probe for explaining one conventional example of this type.
The 1.5D probe is formed by arranging the piezoelectric elements 1 composed of three piezoelectric elements 1 (abc) divided in the short axis direction in the long axis direction. In such a structure, since the piezoelectric element 1 is divided into three in the short axis direction, for example, if only the central piezoelectric element 1a is driven, the depth of focus can be reduced and the vicinity of the surface of the living body can be diagnosed. When the piezoelectric elements 1 (abc) on the center and both sides are electrically connected in common and driven, the depth of focus can be increased and the deep part of the living body can be diagnosed.
【０００４】第１１図乃至第１３図は、参照とした１．
５Ｄ探触子を説明する図である。この提案例では、バッ
キング材２中に多数の信号線路３からなる信号導出体と
しての複数の金属薄板４を、互いに板面を平行にしてバ
ッキング材中に埋設する（第１１図。なお、信号線路３
は連結部５により共通接続される。次に、バッキング材
２の表面を研磨等により露出する。そして、両主面に電
極６（ａｂ）を有する圧電板７をバッキング材２の表面
に、ここでは図示しない導電性接着剤８により固着する
（第１２図）。次に、各信号線路３の間を圧電板７上か
ら切断して連結部５とともに多数の圧電素子１に分割す
る「第１３図（ａ）」。さらに、金属薄板４の間を圧電
板７上から切断して圧電素子９をそれぞれ３つの圧電エ
レメント１（ａｂｃ）に分割する「第１３図（ｂ）」。
要するに、圧電板７を二次元方向に分割して、マトリク
ス上に並べられた圧電エレメントを得る。そして、各圧
電エレメントから個々に電極を導出する方法を提案して
いる。11 to 13 are referred to as 1.
It is a figure explaining a 5D probe. In this proposed example, a plurality of thin metal plates 4 as signal derivation bodies, which are composed of a large number of signal lines 3 in the backing material 2, are embedded in the backing material with their plate surfaces parallel to each other (Fig. 11, signal. Track 3
Are commonly connected by the connecting portion 5. Next, the surface of the backing material 2 is exposed by polishing or the like. Then, the piezoelectric plate 7 having the electrodes 6 (ab) on both main surfaces is fixed to the surface of the backing material 2 by a conductive adhesive 8 not shown here (FIG. 12). Next, the space between the signal lines 3 is cut from above the piezoelectric plate 7 and divided into a large number of piezoelectric elements 1 together with the connecting portion 5 (FIG. 13 (a)). Further, the space between the metal thin plates 4 is cut from above the piezoelectric plate 7 to divide the piezoelectric element 9 into three piezoelectric elements 1 (abc) (FIG. 13 (b)).
In short, the piezoelectric plate 7 is divided into two-dimensional directions to obtain piezoelectric elements arranged in a matrix. Then, a method of individually deriving electrodes from each piezoelectric element is proposed.
【０００５】[0005]
【発明が解決しようとする課題】（従来技術の問題点）
しかしながら、このようなものでは、導電性接着剤８に
よりバッキング材２と各圧電エレメント１とを固着する
ので、両者間の接合強度が小さく圧電エレメント１が剥
離してまう問題があった。すなわち、導電性接着剤８は
接着剤母体に銀等の粒子を混在させることから接着強度
自体が弱いことに加え、バッキング材２は一般にゴム系
の樹脂を主成分とすることから、界面間での密着度等が
悪い。そして、使用時の押圧力（衝撃）や消毒時の熱衝
撃等に起因したバッキング材２の機械的変形により、導
電性接着剤８との界面間での状態を変化させるので、剥
離を引き起こしてしまう問題があった。但し、導電性接
着剤８は、金属薄板４を露出したバッキング材２と圧電
板７との固着と電気的接続とを同時になし得るので、作
業上は非常に都合がよい。Problems to be Solved by the Invention (Problems of Prior Art)
However, in such a structure, since the backing material 2 and each piezoelectric element 1 are fixed by the conductive adhesive 8, there is a problem that the bonding strength between the two is small and the piezoelectric element 1 is peeled off. That is, the conductive adhesive 8 has a weak adhesive strength because particles of silver or the like are mixed in the adhesive matrix, and the backing material 2 generally contains a rubber-based resin as a main component. The degree of adhesion is poor. Then, the backing material 2 is mechanically deformed due to a pressing force (shock) during use, a thermal shock during disinfection, or the like, so that the state between the interface with the conductive adhesive 8 is changed, causing peeling. There was a problem. However, the conductive adhesive 8 can simultaneously fix and electrically connect the backing material 2 exposing the thin metal plate 4 and the piezoelectric plate 7, which is very convenient in terms of work.
【０００６】（発明の目的）本発明は、導電性接着剤の
利便を維持して、バッキング材と圧電エレメントとの接
合強度を維持した超音波探触子及びその製造方法を提供
することを目的とする。(Object of the Invention) An object of the present invention is to provide an ultrasonic probe which maintains the bonding strength between a backing material and a piezoelectric element while maintaining the convenience of a conductive adhesive, and a method for manufacturing the ultrasonic probe. And
【０００７】[0007]
【課題を解決するための手段】本発明は、二次元方向に
並べられた単位硬質補助板をバッキング材の表面に固着
してなる補助板付バッキング材と、前記補助板付バッキ
ング材を貫通して先端面が前記単位硬質補助板の表面に
露出してそれぞれが電気的に独立した多数の信号線路か
らなり、板面を平行にして平板状とした複数の信号導出
体と、前記硬質補助板の表面に導電性接着剤により固着
されて前記信号線路と電気的に接続する圧電エレメント
から構成したことを基本的な解決手段とする。DISCLOSURE OF THE INVENTION According to the present invention, a backing material with an auxiliary plate formed by fixing unit hard auxiliary plates arranged two-dimensionally to the surface of a backing material, and a tip penetrating the backing material with the auxiliary plate. A plurality of signal lines whose surfaces are exposed on the surface of the unit hard auxiliary plate and each of which is electrically independent, and the plate surfaces are parallel to each other, and a plurality of plate-shaped signal derivation bodies, and the surface of the hard auxiliary plate The basic solution means is that the piezoelectric element is fixed to the signal line with a conductive adhesive and electrically connected to the signal line.
【０００８】本発明は、バッキング材の表面に単位硬質
補助板を固着し、硬質補助板の表面に露出した信号導出
体と圧電エレメントとを固着したので、圧電エレメント
とバッキング材とを直接に導電性接着剤により接合する
ことがない。According to the present invention, the unit hard auxiliary plate is fixed to the surface of the backing material, and the signal lead-out body and the piezoelectric element exposed on the surface of the hard auxiliary plate are fixed. Therefore, the piezoelectric element and the backing material are directly conductive. It is not joined by a conductive adhesive.
【０００９】[0009]
【実施例】第１図乃至第３図は、本発明の一実施例を説
明する１．５Ｄ探触子の図である。第１図は超音波探触
子の斜視図、第２図は一部を破断した正断面図、第３図
は側断面図である。なお、前従来例図と同一部分には同
番号を付与してその説明は簡略する。1 to 3 are views of a 1.5D probe for explaining an embodiment of the present invention. FIG. 1 is a perspective view of an ultrasonic probe, FIG. 2 is a partially cutaway front sectional view, and FIG. 3 is a side sectional view. It should be noted that the same parts as those of the previous conventional example are given the same numbers to simplify the description.
【００１０】１．５Ｄ探触子は補助板付バッキング材９
と、複数の信号導出体１０と、長軸方向に並べられた圧
電素子１とからなる。補助板付バッキング材９は、バッ
キング材２の表面に二次元方向に絶縁性の単位硬質補助
板１１を図示しない接着剤により固着してなる。複数の
信号導出体１０は、それぞれが電気的に独立した多数の
信号線路１２を基板１３上に有する、平板状とした各プ
リント基板１４からなる。各プリント基板１４は互いに
板面を平行にして補助板付バッキング材９に一端側を埋
設する。そして、一端側の先端面を単位硬質補助板１１
の表面に露出する。The 1.5D probe is a backing material 9 with an auxiliary plate.
And a plurality of signal derivation bodies 10 and the piezoelectric elements 1 arranged in the long axis direction. The backing material 9 with an auxiliary plate is formed by fixing an insulating unit hard auxiliary plate 11 in a two-dimensional direction on the surface of the backing material 2 with an adhesive agent (not shown). Each of the plurality of signal derivation bodies 10 is formed of a flat printed circuit board 14 having a large number of electrically independent signal lines 12 on a board 13. One end side of each printed circuit board 14 is embedded in the backing material 9 with an auxiliary plate with their plate surfaces parallel to each other. Then, the tip surface on one end side is provided with the unit hard auxiliary plate 11
Exposed on the surface of.
【００１１】圧電素子１は短軸方向に分割された３つの
圧電エレメントからなり、両主面に電極を有する。そし
て、単位硬質補助板１１上に導電性接着剤により固着さ
れ、プリント基板１４の信号線路１３と電気的に接続す
る。そして、この実施例では、単位硬質補助板１１に固
着する各圧電エレメント１（ａｂｃ）の一方の主面に、
線状の無電極部１５を設けてなる。なお、各圧電素子
１、圧電エレメント１（ａｂｃ）及び単位硬質補助板１
１間は、バッキング材２に到達した切れ目１６によって
分割されている。The piezoelectric element 1 is composed of three piezoelectric elements divided in the short axis direction and has electrodes on both main surfaces. Then, it is fixed on the unit hard auxiliary plate 11 by a conductive adhesive and electrically connected to the signal line 13 of the printed board 14. Then, in this embodiment, one main surface of each piezoelectric element 1 (abc) fixed to the unit hard auxiliary plate 11 is
A linear electrodeless portion 15 is provided. In addition, each piezoelectric element 1, the piezoelectric element 1 (abc), and the unit hard auxiliary plate 1
The space 1 is divided by a cut 16 that reaches the backing material 2.
【００１２】このような構成であれば、各圧電エレメン
ト１（ａｂｃ）は単位硬質補助板１１と導電性接着剤８
により固着するので、密着度を良好として衝撃等による
機械的変形もなく、ゴム系のバッキング材２に直接に固
着した場合と比較して接着強度を高める。そして、この
実施例では、各圧電エレメント１（ａｂｃ）の一方の電
極には無電極部１５を設けて導電性接着剤８と固着した
ので、接合強度をさらに高めることができる。With this structure, each piezoelectric element 1 (abc) has a unitary hard auxiliary plate 11 and a conductive adhesive 8
The adhesive strength is improved, and the adhesive strength is increased as compared with the case where the rubber-based backing material 2 is directly fixed without mechanical deformation due to impact. In this embodiment, the electrodeless portion 15 is provided on one electrode of each piezoelectric element 1 (abc) and fixed to the conductive adhesive 8. Therefore, the bonding strength can be further increased.
【００１３】第４図内至第９図は、１．５Ｄ探触子の製
造方法を説明する工程図である。超音波探触子は、圧電
板７と、補助板付バッキング材９と、複数の信号導出体
１０を具備する（前第１図参照）。圧電板７は両主面に
電極６（ａｂ）を有し、この例では一方の主面６ｂに線
状の無電極部１５を縦横に形成する（第４図）。補助板
付バッキング材９は、第５図及び第６図に示したように
バッキング材２と硬質補助板１１Ａとを図示しない絶縁
性の接着剤により固着してなる。FIG. 4 to FIG. 9 are process drawings for explaining a method for manufacturing a 1.5D probe. The ultrasonic probe includes a piezoelectric plate 7, a backing material 9 with an auxiliary plate, and a plurality of signal derivation bodies 10 (see FIG. 1 above). The piezoelectric plate 7 has electrodes 6 (ab) on both main surfaces, and in this example, linear electrodeless portions 15 are formed vertically and horizontally on one main surface 6b (FIG. 4). As shown in FIGS. 5 and 6, the backing material 9 with an auxiliary plate is formed by fixing the backing material 2 and the hard auxiliary plate 11A with an insulative adhesive agent not shown.
【００１４】複数の信号導出体１０は信号線路を基板上
に有する前述のプリント基板１４からなる。そして、補
助板付バッキング材９に対して垂直方向に一端側を埋設
する。一端側の先端部はバッキング材２を貫通し、この
例では硬質補助板１１Ａの溝１７に挿入して被覆され
る。溝７はプリント基板１４の厚みより幅広として、例
えば固着時の接着剤により間隙が埋められる。The plurality of signal derivation bodies 10 are the above-mentioned printed boards 14 having signal lines on the boards. Then, one end side is embedded in the vertical direction with respect to the backing material 9 with the auxiliary plate. The tip portion on the one end side penetrates the backing material 2 and is inserted into the groove 17 of the hard auxiliary plate 11A to be covered in this example. The groove 7 is wider than the thickness of the printed board 14, and the gap is filled with, for example, an adhesive at the time of fixing.
【００１５】このようなものでは、先ず、補助板付バッ
キング材９（硬質補助板１１）の表面を研磨等によっ
て、プリント基板１４の先端面を露出する。そして、両
主面に電極６（ａｂ）を有する圧電板７の一方の主面６
ｂを硬質補助板１１の表面に導電性接着剤８によって固
着する（第７図）。In such a device, first, the front surface of the printed board 14 is exposed by polishing the surface of the backing material 9 with an auxiliary plate (hard auxiliary plate 11). Then, one main surface 6 of the piezoelectric plate 7 having the electrodes 6 (ab) on both main surfaces
b is fixed to the surface of the hard auxiliary plate 11 by the conductive adhesive 8 (FIG. 7).
【００１６】次に、プリント基板１４の多数の信号線路
１３間を圧電板７上からバッキング材２に到達する切れ
目１６を設けて、圧電板７と硬質補助板１１とを長軸方
向に切断し、各圧電素子１に分割する。第８図は圧電板
７を省略した平面図で、同図の矢印ＡーＡ’間を切断す
る。そして、同様にして、プリント基板１４間を短軸方
向に切断して各圧電素子１を３つの圧電エレメント１
（ａｂｃ）に分割する（第８図のＢーＢ’間）。Next, cut lines 16 are formed between the piezoelectric plate 7 and the backing material 2 between the plurality of signal lines 13 of the printed circuit board 14 to cut the piezoelectric plate 7 and the hard auxiliary plate 11 in the longitudinal direction. , Each piezoelectric element 1 is divided. FIG. 8 is a plan view in which the piezoelectric plate 7 is omitted, and a section between arrows AA ′ in FIG. 8 is cut. Then, similarly, the printed circuit boards 14 are cut in the minor axis direction so that each piezoelectric element 1 is separated into three piezoelectric elements 1.
It is divided into (abc) (between BB 'in FIG. 8).
【００１７】このような製造方法であれば、バッキング
材２上に単位硬質補助板１１Ａを有して、単位硬質補助
板１１Ａと導電性接着剤８により固着した、無電極部１
５を有する３つの圧電エレメント１（ａｂｃ）からなる
圧電素子１を長軸方向に並べて、各圧電エレメントから
電極を個々に導出した１．５Ｄ探触子（前第１図）を得
ることができる。According to such a manufacturing method, the electrode-free portion 1 having the unit hard auxiliary plate 11A on the backing material 2 and fixed to the unit hard auxiliary plate 11A with the conductive adhesive 8 is used.
Piezoelectric elements 1 composed of three piezoelectric elements 1 (abc) having 5 are arranged in the longitudinal direction to obtain a 1.5D probe (Fig. 1 before) in which electrodes are individually led out from each piezoelectric element. .
【００１８】[0018]
【他の事項】上記実施例では、無電極部１５を設けて圧
電板７と導電性接着剤８との接合強度をさらに高めると
したが、基本的には硬質補助板１１により接合強度を高
めることができるので、本発明では必ずしも無電極部１
５を必要とはしない。また、実施例における無電極部１
５は圧電エレメン１（ａｃ）の大きさ（長さ×幅）（約
３×０．６ｍｍ以上）に対してその幅を１／１００以下
とするので、圧電作用に対する影響は極めて少なく実質
的に無視できる。[Other Matters] In the above embodiment, the electrodeless portion 15 is provided to further increase the bonding strength between the piezoelectric plate 7 and the conductive adhesive 8. However, basically, the hard auxiliary plate 11 increases the bonding strength. Therefore, in the present invention, the electrodeless portion 1 is not always required.
You don't need 5. In addition, the electrodeless portion 1 in the embodiment
5 has a width of 1/100 or less with respect to the size (length × width) (about 3 × 0.6 mm or more) of the piezoelectric element 1 (ac), so that the influence on the piezoelectric action is extremely small and substantially. Can be ignored.
【００１９】また、圧電素子１を３個の圧電エレメント
に分割したが、さらに各圧電エレメント１（ａｂｃ）に
７０％以上の溝１８を設けて複数の例えば４分割し、そ
れそれが幅ｗと厚みｔの比ｗ／ｔを約０．４乃至０．６
として良好な振動特性を得るようにしてもよい（第９
図）。この場合、無電極部部１５が溝１８の位置になる
ように設定しておけば、無電極部１５による圧電作用へ
の影響は全くなくなる。Further, the piezoelectric element 1 is divided into three piezoelectric elements, but each piezoelectric element 1 (abc) is further provided with a groove 18 of 70% or more to be divided into a plurality of, for example, four, which are the width w. The ratio w / t of the thickness t is about 0.4 to 0.6
Good vibration characteristics may be obtained as
Figure). In this case, if the electrodeless portion 15 is set to the position of the groove 18, the piezoelectric effect of the electrodeless portion 15 is completely eliminated.
【００２０】また、補助板付バッキング材９は、バッキ
ング材２と信号導出体１０（プリント基板１４）の先端
側を挿入する溝１７を設けた硬質補助板１１とから形成
したが、硬質補助板１１は例えばプリント基板の先端が
突出したバッキング材２の表面にエポキシ系の樹脂等を
塗布して硬化させてもよい。Further, the backing material 9 with the auxiliary plate is formed from the backing material 2 and the hard auxiliary plate 11 provided with the groove 17 into which the tip side of the signal lead-out body 10 (printed circuit board 14) is inserted. For example, an epoxy resin or the like may be applied and cured on the surface of the backing material 2 from which the tip of the printed board protrudes.
【００２１】また、長軸方向に配列した圧電素子１を３
つの圧電エレメントに分割して短軸方向の開口面積を切
り替える１．５Ｄ探触子を例として説明したが、短軸方
向を３個以上に分割してもよく、さらに本発明は多数の
圧電エレメントを二次元方向に並べた超音波探触子探触
子に基本的に適用できる。したがって、長軸及び短軸方
向に電子的に操作して画像を得るいわゆるマトリクス探
触子にも応用できることは勿論である。Further, the piezoelectric elements 1 arranged in the long axis direction are
The 1.5D probe which is divided into two piezoelectric elements and switches the opening area in the minor axis direction has been described as an example. However, the minor axis direction may be divided into three or more pieces. Can be basically applied to an ultrasonic probe in which two are arranged in a two-dimensional direction. Therefore, it is needless to say that it can be applied to a so-called matrix probe that electronically operates in the major axis and minor axis directions to obtain an image.
【００２２】また、電極導出体１０はプリント基板１４
としたが、従来例のように金属薄板からなる信号線路の
みから形成してもよく、さらには図示しないフレキシブ
ルプリント基板から形成してもよい。そして、基板１２
の信号線路１３を例えば半田メッキ等を施し、その厚み
を大きくして先端面との電気的接続強度を高めても良
い。また、信号線路１３は個々に独立させたが、従来例
のように連結部を設けて共通接続し、圧電板７の切断時
に連結部を同時に切断してもよい。The electrode lead-out body 10 is a printed circuit board 14
However, as in the conventional example, it may be formed only from a signal line made of a thin metal plate, or may be formed from a flexible printed board (not shown). And the substrate 12
The signal line 13 may be subjected to, for example, solder plating to increase its thickness to enhance the electrical connection strength with the tip surface. Further, although the signal lines 13 are individually independent, a connecting portion may be provided and commonly connected as in the conventional example, and the connecting portion may be cut at the same time when the piezoelectric plate 7 is cut.
【００２３】本発明は、以上のように種々の変更が可能
であり、要はバッキング材２と圧電エレメント１（ａｂ
ｃ）とを直接に接合することなく、硬質補助板１１を介
在させてこれに圧電エレメント１（ａｂｃ）を導電性接
着剤８により固着して電極を導出したものは、本発明の
技術的範囲に基本的に属する。The present invention can be variously modified as described above, and in short, the backing material 2 and the piezoelectric element 1 (ab) are essential.
In the technical scope of the present invention, the hard auxiliary plate 11 is interposed and the piezoelectric element 1 (abc) is fixed to the piezoelectric element 1 (abc) by the conductive adhesive 8 without directly joining with c). Basically belongs to.
【００２４】[0024]
【発明の効果】本発明は、二次元方向に並べられた単位
硬質補助板をバッキング材の表面に固着してなる補助板
付バッキング材と、前記補助板付バッキング材を貫通し
て先端面が前記単位硬質補助板の表面に露出してそれぞ
れが電気的に独立した多数の信号線路からなり、板面を
平行にして平板状とした複数の信号導出体と、前記硬質
補助板の表面に導電性接着剤により固着されて前記信号
線路と電気的に接続する圧電エレメントから構成したの
で、導電性接着剤の利便を維持して、バッキング材と圧
電エレメンとの接合強度を維持した超音波探触子及びそ
の製造方法を提供できる。According to the present invention, a backing material with an auxiliary plate formed by fixing unit hard auxiliary plates arranged in a two-dimensional direction to the surface of a backing material, and a tip surface penetrating the backing material with the auxiliary plate is the unit described above. A plurality of signal conductors, which are exposed on the surface of the hard auxiliary plate and each of which is electrically independent of each other, and the plate surfaces of which are parallel to each other, and a plurality of signal derivation members in a flat plate shape, and conductive adhesion to the surface of the hard auxiliary plate. Since it is composed of a piezoelectric element that is fixed by an agent and electrically connected to the signal line, an ultrasonic probe that maintains the bonding strength between the backing material and the piezoelectric element while maintaining the convenience of the conductive adhesive and The manufacturing method can be provided.
【図１】本発明の一実施例を説明する１．５Ｄ探触子の
図である。FIG. 1 is a diagram of a 1.5D probe for explaining an embodiment of the present invention.
【図２】本発明一実施例を説明する１．５Ｄ探触子の一
部を破断した正断面図である。FIG. 2 is a front sectional view in which a part of a 1.5D probe for explaining the embodiment of the present invention is cut away.
【図３】本発明一実施例を説明する１．５Ｄ探触子の側
断面図である。FIG. 3 is a side sectional view of a 1.5D probe for explaining an embodiment of the present invention.
【図４】本発明一実施例を説明する圧電板の平面図であ
る。FIG. 4 is a plan view of a piezoelectric plate illustrating an embodiment of the present invention.
【図５】本発明の製造方法を説明する補助板付バッキン
グ材の分解斜視図である。FIG. 5 is an exploded perspective view of a backing material with an auxiliary plate for explaining the manufacturing method of the present invention.
【図６】本発明の製造方法を説明する補助板付バッキン
グ材の断面図である。FIG. 6 is a cross-sectional view of a backing material with an auxiliary plate for explaining the manufacturing method of the present invention.
【図７】本発明の製造方法を説明する補助板付バッキン
グ材の断面図である。FIG. 7 is a cross-sectional view of a backing material with an auxiliary plate for explaining the manufacturing method of the present invention.
【図８】本発明の製造方法を説明する圧電板の切断方向
を示す平面図である。FIG. 8 is a plan view showing a cutting direction of the piezoelectric plate for explaining the manufacturing method of the present invention.
【図９】本発明の他の実施例を説明する１．５Ｄ探触子
の一部図である。FIG. 9 is a partial view of a 1.5D probe for explaining another embodiment of the present invention.
【図１０】従来例を説明する１．５Ｄ探触子の平面図で
ある。FIG. 10 is a plan view of a 1.5D probe for explaining a conventional example.
【図１１】従来例を説明する１．５Ｄ探触子のバッキン
グ材の図である。FIG. 11 is a diagram of a backing material of a 1.5D probe for explaining a conventional example.
【図１２】従来例を説明する１．５Ｄ探触子の製造工程
上の分解図である。FIG. 12 is an exploded view of a 1.5D probe in a manufacturing process for explaining a conventional example.
【図１３】従来例を説明する１．５Ｄ探触子の図で、同
図（ａ）は正面図、同図（ａ）は側断面図である。13A and 13B are diagrams of a 1.5D probe for explaining a conventional example, where FIG. 13A is a front view and FIG. 13A is a side sectional view.
１ 圧電素子、２ バッキング材、３、１３ 信号線
路、４ 金属薄板、５連結部、６ 電極、７ 圧電板、
８ 導電性接着剤、９ 補助板付バッキング材、１０
信号導出体、１１ 単位硬質補助板、１２ 基板、１４
プリント基板、１５ 無電極部、１６ 切れ目、１
７、１８ 溝、DESCRIPTION OF SYMBOLS 1 piezoelectric element, 2 backing material, 3 and 13 signal lines, 4 thin metal plates, 5 connecting parts, 6 electrodes, 7 piezoelectric plates,
8 conductive adhesive, 9 backing material with auxiliary plate, 10
Signal derivation body, 11 unit hard auxiliary plate, 12 substrate, 14
Printed circuit board, 15 electrodeless part, 16 cut lines, 1
7, 18 grooves,
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H04R 17/00 332 H04R 17/00 330 A61B 8/00 G01N 29/24 502 ─────────────────────────────────────────────────── ─── Continuation of front page (58) Fields surveyed (Int.Cl. 7 , DB name) H04R 17/00 332 H04R 17/00 330 A61B 8/00 G01N 29/24 502
Claims (3)
ッキング材上に二次元方向に並べて、前記バッキング材
と対向する前記圧電エレメントの一方の主面の電極から
個々に電極を導出してなる超音波探触子において、前記
バッキング材の表面に単位硬質補助板を二次元方向に並
べて固着した補助板付バッキング材と、前記補助板付バ
ッキング材を貫通して先端面が前記単位硬質補助板の表
面に露出してそれぞれが電気的に独立した多数の信号線
路を有する板面を平行にして平板状とした複数の信号導
出体と、前記硬質補助板の表面に導電性接着剤により固
着されて前記信号線路と電気的に接続する圧電エレメン
とを具備したことを特徴とする超音波探触子。1. Piezoelectric elements having electrodes on both main surfaces are two-dimensionally arranged on a backing material, and the electrodes are individually led out from electrodes on one main surface of the piezoelectric element facing the backing material. In the ultrasonic probe, a backing material with an auxiliary plate in which unit hard auxiliary plates are arranged and fixed to the surface of the backing material in a two-dimensional direction, and a tip surface penetrating the backing material with the auxiliary plate has a front surface of the unit hard auxiliary plate. A plurality of signal lead-out bodies which are exposed to the surface and each of which has a plurality of electrically independent signal lines and whose plate surfaces are parallel to each other and are formed into a flat plate, and which are fixed to the surface of the hard auxiliary plate with a conductive adhesive An ultrasonic probe comprising a piezoelectric element electrically connected to a signal line.
る一方の主面には二次元方向の少なくとも一方に複数の
線状の無電極部を形成されて前記圧電板の素地を露出さ
せたことを特徴とする超音波探触子。2. The piezoelectric plate according to claim 1, wherein a plurality of linear electrodeless portions are formed on at least one of two-dimensional directions on one main surface to which the piezoelectric plate is fixed to expose the substrate of the piezoelectric plate. An ultrasonic probe characterized by that.
材上に設け、前記圧電板上から前記バッキング材に到達
する切れ目を設けて前記圧電板を縦横に切断し、前記圧
電板を二次元方向に並べられた多数の圧電エレメントに
分割して、前記バッキング材と対向する前記圧電エレメ
ントの一方の主面の電極から個々に電極を導出してなる
超音波探触子の製造方法において、前記バッキング材の
表面に硬質補助板を固着した補助板付バッキング材と、
前記補助板付バッキング材中に一端側が埋設して前記硬
質補助板に被覆されてそれぞれが電気的に独立した多数
の信号線路を有するとともに互いに板面を平行にして平
板状とした複数の信号導出体とを具備し、前記硬質補助
板の表面を研磨して前記信号導出体の先端面を露出させ
て、前記硬質補助板上に導電接着剤により前記圧電板を
固着し、前記多数の信号線路間及び前記複数の信号導出
体の間を前記圧電板上から前記バッキング材に到達する
切れ目を設けて前記圧電板と硬質補助板とを縦横に切断
し、前記圧電板を二次元方向に並べられた多数の圧電エ
レメントに分割するとともに、前記バッキング材と対向
する前記圧電エレメントの一方の主面の電極から前記信
号導出体により個々に電極を導出してなる超音波探触子
の製造方法。3. A piezoelectric plate having electrodes on both main surfaces is provided on a backing material, and a cut reaching from the piezoelectric plate to the backing material is provided to cut the piezoelectric plate vertically and horizontally. In a method for manufacturing an ultrasonic probe, which is divided into a number of piezoelectric elements arranged in a dimensional direction, each electrode is individually derived from an electrode on one main surface of the piezoelectric element facing the backing material, A backing material with an auxiliary plate having a hard auxiliary plate fixed to the surface of the backing material,
A plurality of signal derivation members which are embedded in the backing material with the auxiliary plate and have one end side covered with the hard auxiliary plate and each of which has a plurality of electrically independent signal lines and whose plate surfaces are parallel to each other and which are plate-shaped. And polishing the surface of the hard auxiliary plate to expose the tip surface of the signal lead-out body, fixing the piezoelectric plate with a conductive adhesive on the hard auxiliary plate, and connecting the plurality of signal lines. And a cut that reaches the backing material from above the piezoelectric plate is provided between the plurality of signal derivation bodies to vertically and horizontally cut the piezoelectric plate and the hard auxiliary plate, and the piezoelectric plates are arranged in a two-dimensional direction. A method for manufacturing an ultrasonic probe, which is divided into a large number of piezoelectric elements, and the electrodes are individually led out from the electrodes on one main surface of the piezoelectric element facing the backing material by the signal lead-out body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22108998A JP3494578B2 (en) | 1998-07-21 | 1998-07-21 | Ultrasonic probe and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22108998A JP3494578B2 (en) | 1998-07-21 | 1998-07-21 | Ultrasonic probe and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000041299A JP2000041299A (en) | 2000-02-08 |
| JP3494578B2 true JP3494578B2 (en) | 2004-02-09 |
Family
ID=16761327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22108998A Expired - Fee Related JP3494578B2 (en) | 1998-07-21 | 1998-07-21 | Ultrasonic probe and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3494578B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3883823B2 (en) | 2001-06-19 | 2007-02-21 | 日本電波工業株式会社 | Matrix-type ultrasonic probe and manufacturing method thereof |
| US7251884B2 (en) | 2004-04-26 | 2007-08-07 | Formfactor, Inc. | Method to build robust mechanical structures on substrate surfaces |
| JP2005349104A (en) * | 2004-06-14 | 2005-12-22 | Matsushita Electric Ind Co Ltd | Ultrasonic probe and ultrasonic diagnostic apparatus |
| JP4504255B2 (en) * | 2005-05-31 | 2010-07-14 | アロカ株式会社 | Ultrasonic probe and manufacturing method thereof |
| CN102151150B (en) * | 2011-01-25 | 2012-11-28 | 古伦勇 | Two-dimensional array and three-dimensional imaging transducer and manufacturing method thereof |
-
1998
- 1998-07-21 JP JP22108998A patent/JP3494578B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000041299A (en) | 2000-02-08 |
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