JP3488218B2 - Manufacturing method of liquid crystal display device - Google Patents
Manufacturing method of liquid crystal display deviceInfo
- Publication number
- JP3488218B2 JP3488218B2 JP2001265191A JP2001265191A JP3488218B2 JP 3488218 B2 JP3488218 B2 JP 3488218B2 JP 2001265191 A JP2001265191 A JP 2001265191A JP 2001265191 A JP2001265191 A JP 2001265191A JP 3488218 B2 JP3488218 B2 JP 3488218B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- circuit board
- liquid crystal
- release paper
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Combinations Of Printed Boards (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、液晶表示装置また
はＥＬ表示装置などの表示装置の製造に使用するもの
で、細長の回路基板と少なくとも電極を有するフィルム
（例えば、ＴＡＢフィルム）とを接着固定するための粘
着層積層体を用いた表示装置、およびその製造方法に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used for manufacturing a display device such as a liquid crystal display device or an EL display device, and adheres and fixes an elongated circuit board and a film (for example, a TAB film) having at least electrodes. The present invention relates to a display device using a pressure-sensitive adhesive layer laminate and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】従来の液晶表示装置は、液晶パネルに複
数のＴＡＢフィルムが電気的に接続されるとともに、こ
れら複数のＴＡＢフィルムに細長の回路基板が電気的に
接続されて形成されていた。2. Description of the Related Art A conventional liquid crystal display device is formed by electrically connecting a plurality of TAB films to a liquid crystal panel and electrically connecting an elongated circuit board to the plurality of TAB films.
【０００３】以下、これら複数のＴＡＢフィルムと細長
の回路基板との電気的な接続方法について簡単に説明す
る。A method for electrically connecting the plurality of TAB films to the elongated circuit board will be briefly described below.
【０００４】まず、細長の回路基板と複数のＴＡＢフィ
ルムとを所定の位置に位置合わせするために、剥離紙と
粘着層とから構成されリール状に捲回されたストレート
形状の粘着層付きテープから、液晶パネルの１辺に配置
される複数のＴＡＢフィルムに跨がる長さだけカット
し、そのカットした粘着層付きテープを細長の１つの回
路基板上に平行にストレートに貼り付ける。First, in order to align a slender circuit board and a plurality of TAB films at predetermined positions, a tape having a straight adhesive layer which is composed of a release paper and an adhesive layer and is wound in a reel shape is used. , A length that spans a plurality of TAB films arranged on one side of a liquid crystal panel is cut, and the cut adhesive layer-attached tape is stuck straight on one elongated circuit board in parallel.
【０００５】そして、剥離紙を剥がして粘着層を露出さ
せ、液晶パネルに接続された複数のＴＡＢフィルムと回
路基板とを、両電極端子が一致するように位置合わせを
し、ＴＡＢフィルムを回路基板に重ね、粘着層の部分を
ＴＡＢフィルム側から押圧し、ＴＡＢフィルムと回路基
板とを接着固定する。Then, the release paper is peeled off to expose the adhesive layer, and the plurality of TAB films connected to the liquid crystal panel and the circuit board are aligned so that both electrode terminals are aligned, and the TAB film is arranged on the circuit board. Then, the adhesive layer portion is pressed from the TAB film side to bond and fix the TAB film and the circuit board.
【０００６】その後、ＴＡＢフィルムの電極端子と回路
基板の電極端子とを、半田付けにより電気的に接続して
いた。After that, the electrode terminals of the TAB film and the electrode terminals of the circuit board were electrically connected by soldering.
【０００７】[0007]
【発明が解決しようとする課題】ところで、最近では液
晶表示装置の表示窓枠部を狭くして有効表示面積率を向
上させる提案がなされているが、上記従来技術では、回
路基板の幅を狭くすることができないという問題点があ
った。By the way, recently, a proposal has been made to narrow the display window frame portion of a liquid crystal display device to improve the effective display area ratio. However, in the above-mentioned prior art, the width of the circuit board is narrowed. There was a problem that I could not do it.
【０００８】すなわち、回路基板上に密にコンデンサ
ー、バッファー用ＩＣ、およびオペアンプなどの電子部
品を搭載する、プラスチックシャーシに固定するための
ビス穴を設ける、さらにプラスチックシャーシにベゼル
の爪を掛けて液晶パネルなどを固定するための切り欠き
を設けるなどの必要性が発生しているが、上記従来技術
の場合には、前記電子部品上に粘着層が載る、前記電子
部品近くで粘着層が基板から浮いてしまう、さらに粘着
層がビス穴や切り欠きを塞いでしまうなどという問題点
が発生し、従来のように粘着層付きテープを直線上に長
く伸ばしたまま１つの回路基板上に貼ることができなく
なってきた。That is, electronic parts such as a capacitor, a buffer IC, and an operational amplifier are densely mounted on a circuit board, screw holes for fixing to a plastic chassis are provided, and a bezel claw is hooked on the plastic chassis to form a liquid crystal. Although it is necessary to provide a notch for fixing a panel or the like, in the case of the above-mentioned conventional technology, an adhesive layer is placed on the electronic component, and the adhesive layer is near the electronic component from the substrate. Problems such as floating up and the adhesive layer closing screw holes and notches occur, and it is possible to stick the tape with the adhesive layer on a single circuit board while stretching it linearly for a long time as in the past. I can't.
【０００９】このような問題点を改良するために、１つ
のＴＡＢフィルムに対して、ＴＡＢフィルムの電極端子
部の位置に対応させることなく、複数の粘着層を回路基
板上に配置させる方法が考えられている。In order to improve such a problem, a method of arranging a plurality of adhesive layers on a circuit board without considering the position of the electrode terminal portion of the TAB film for one TAB film is considered. Has been.
【００１０】しかしながら、このような方法では、ＴＡ
Ｂフィルムの電極端子部の位置に対応させることなく、
部分的に複数の粘着層を配置しているため、ＴＡＢフィ
ルムの電極端子を回路基板の電極端子に半田接続させる
場合において、粘着層が配置されない部分近傍のフィル
ム端子が浮きやすくなり、半田接続不良などが発生しや
すいという問題点を有していた。However, in such a method, TA
Without corresponding to the position of the electrode terminal of the B film,
When multiple TAB film electrode terminals are soldered to the circuit board electrode terminals because multiple adhesive layers are partially arranged, the film terminals near the area where the adhesive layer is not laid tend to float, resulting in poor solder connection. However, there is a problem that such a problem is likely to occur.
【００１１】また、半田接続した場合においても、粘着
層が配置されない箇所については接着強度が弱いため、
液晶表示装置の製造作業時にかかる引っ張り応力などに
より、ＴＡＢフィルムが剥がれたり、半田接続が断線し
やすくなるという問題点を有していた。Further, even when the solder connection is made, since the adhesive strength is weak at the portion where the adhesive layer is not arranged,
There are problems that the TAB film is peeled off and the solder connection is easily broken due to tensile stress applied during the manufacturing operation of the liquid crystal display device.
【００１２】さらに、複数の粘着層をそれぞれひとつず
つ回路基板上に形成しているため、作業効率が悪く、コ
スト高になるという問題点も有していた。Further, since each of the plurality of adhesive layers is formed on the circuit board, there is a problem in that the work efficiency is poor and the cost is high.
【００１３】本発明は、上記問題点に鑑みてなされたも
のであり、各回路基板の所定位置に対応した複数の粘着
層を連結回路基板の各回路基板に跨がって貼り付けるこ
とにより、低コストを実現でき、回路基板への粘着層貼
り付け作業の効率を向上させ、ＴＡＢフィルムと回路基
板との電気的接続の信頼性を高くするような粘着層積層
体を使用し、表示窓枠が狭く、コンパクトで電気的接続
信頼性の高い液晶表示装置およびその製造方法を提供す
ることを目的としている。The present invention has been made in view of the above problems, and by adhering a plurality of adhesive layers corresponding to predetermined positions of each circuit board across each circuit board of the connection circuit board, A display window frame using a pressure-sensitive adhesive layer laminate that can realize low cost, improve the efficiency of the work of attaching the pressure-sensitive adhesive layer to the circuit board, and increase the reliability of the electrical connection between the TAB film and the circuit board. It is an object of the present invention to provide a liquid crystal display device having a small size, a compact size, and high reliability of electrical connection, and a manufacturing method thereof.
【００１４】さらに、連結回路基板の状態で異方性導電
接着剤層を形成することにより、作業効率に優れ、低コ
ストの液晶表示装置を得ることができる液晶表示装置の
製造方法を提供することを目的としている。Further, by providing an anisotropic conductive adhesive layer in the state of a connected circuit board, it is possible to provide a method of manufacturing a liquid crystal display device which can obtain a liquid crystal display device having excellent work efficiency and low cost. It is an object.
【００１５】[0015]
【課題を解決するための手段】上記の目的を達成するた
めに、本発明では次のような構成、手段を施すものであ
る。In order to achieve the above object, the present invention provides the following configurations and means.
【００１６】本発明の液晶表示装置の製造方法は、液晶
パネルと接続された複数の少なくとも電極を有するフィ
ルムと、部品搭載部を有する細長の回路基板とを、電気
的に接続する液晶表示装置の製造方法であって、各長辺
同士を互いに平行にして横並びに配された複数の回路基
板における各隣接間に隙間を設け、かつこれら複数の各
回路基板の両短辺と連結基板とがそれぞれＶ溝を介して
連なって成る連結回路基板に対して、長方形の第１の剥
離紙上に細長形状の粘着層を各回路基板の間隔に対応し
て複数設け、かつ該第１の剥離紙の短手方向と該粘着層
の長手方向とが略平行に形成されている粘着層積層体を
用いて、前記粘着層が回路基板側になるようにした状態
で前記第１の剥離紙が複数連なる該回路基板に跨がって
かつ粘着層が部品搭載部を避けるようにして、各粘着層
を所定位置に形成する工程と、該粘着層付き連結回路基
板を、各回路基板毎にブレイキングして分割する工程
と、該粘着層付き回路基板と、前記少なくとも電極を有
するフィルムとを、それぞれの電極端子にて電気的に接
続する工程とを有することを特徴としており、そのこと
により、上記目的が達成される。A method of manufacturing a liquid crystal display device according to the present invention is a liquid crystal display device in which a film having at least a plurality of electrodes connected to a liquid crystal panel and an elongated circuit board having a component mounting portion are electrically connected. Manufacturing method, each long side
Circuit boards arranged side by side with each other parallel to each other
A gap is provided between each adjacent part of the plate, and each of these plural
Both short sides of the circuit board and the connecting board are respectively connected through the V groove.
For the connecting circuit board formed by continuous, first peeling rectangle
An elongated adhesive layer on the release paper corresponds to the spacing between circuit boards.
And a plurality of them, and the short side direction of the first release paper and the adhesive layer.
Of the adhesive layer laminate in which the longitudinal direction of
State where the adhesive layer is on the circuit board side
So that the first release paper is spread over the circuit board
In addition, make sure that the adhesive layer avoids the parts mounting part.
Forming a predetermined position, the connecting circuit board with the adhesive layer, and the step of dividing by breaking each circuit board, and the circuit board with the adhesive layer, and said film having at least electrodes, respectively and characterized by a step of electrically connecting at the electrode terminal, by its, the above-mentioned object can be achieved.
【００１７】また、本発明の液晶表示装置の製造方法
は、液晶パネルと接続された複数の少なくとも電極を有
するフィルムと、部品搭載部を有する細長の回路基板と
を、電気的に接続する液晶表示装置の製造方法であっ
て、各長辺同士を互いに平行にして横並びに配された複
数の回路基板における各隣接間に隙間を設け、かつこれ
ら複数の各回路基板の両短辺と連結基板とがそれぞれＶ
溝を介して連なって成る連結回路基板に対して、長方形
の第１の剥離紙上に細長形状の粘着層を各回路基板の間
隔に対応して複数設け、かつ該第１の剥離紙の短手方向
と該粘着層の長手方向とが略平行に形成されている粘着
層積層体を用いて、前記粘着層が回路基板側になるよう
にした状態で前記第１の剥離紙が複数連なる該回路基板
に跨がってかつ粘着層が部品搭載部を避けるようにし
て、各粘着層を所定位置に形成する工程と、該粘着層付
き連結回路基板を、各回路基板毎に分割する工程と、該
粘着層付き回路基板に異方性導電接着剤層を形成する工
程と、該粘着層および該異方性導電接着剤層付き回路基
板と、前記少なくとも電極を有するフィルムとを、該粘
着層を介して接着固定する工程と、該回路基板と、該少
なくとも電極を有するフィルムとを、該異方性導電接着
剤層を加圧加熱して電気的に接続する工程とを有するこ
とを特徴としており、そのことにより、上記目的が達成
される。The method for manufacturing a liquid crystal display device of the present invention is a liquid crystal display in which a film having at least a plurality of electrodes connected to a liquid crystal panel and an elongated circuit board having a component mounting portion are electrically connected. A method for manufacturing a device, comprising a plurality of long sides arranged parallel to each other and arranged side by side.
A gap between each adjoining number of circuit boards, and
From both sides of each of the plurality of circuit boards and the connecting board are respectively V
For the connecting circuit board comprising continuous through the groove, rectangular
A strip-shaped adhesive layer on each first release paper between the circuit boards
A plurality of sheets are provided corresponding to the distance, and the short side direction of the first release paper
And an adhesive in which the longitudinal direction of the adhesive layer is formed substantially parallel to
Use the layer stack so that the adhesive layer is on the circuit board side.
In such a state, the first release paper straddles the circuit board having a plurality of lines and the adhesive layer avoids the component mounting portion.
Te to form a step of forming each adhesive layer to a predetermined position, the connecting circuit board with the adhesive layer, and the step of dividing each circuit board, the anisotropic conductive adhesive layer on the circuit board with the adhesive layer A step of adhering and fixing the adhesive layer and the circuit board with the anisotropic conductive adhesive layer, and the film having at least the electrode via the adhesive layer; and the circuit board and the at least electrode. And a process of electrically heating the anisotropic conductive adhesive layer by pressurizing and heating the anisotropic conductive adhesive layer, thereby achieving the above object.
【００１８】また、本発明の液晶表示装置の製造方法
は、液晶パネルと接続された複数の少なくとも電極を有
するフィルムと、部品搭載部を有する細長の回路基板と
を、電気的に接続する液晶表示装置の製造方法であっ
て、各長辺同士を互いに平行にして横並びに配された複
数の回路基板における各隣接間に隙間を設け、かつこれ
ら複数の各回路基板の両短辺と連結基板とがそれぞれＶ
溝を介して連なって成る連結回路基板に、異方性導電接
着剤層を形成する工程と、該異方性導電接着剤層付き連
結回路基板に対して、長方形の第１の剥離紙上に細長形
状の粘着層を各回路基板の間隔に対応して複数設け、か
つ該第１の剥離紙の短手方向と該粘着層の長手方向とが
略平行に形成されている粘着層積層体を用いて、前記粘
着層が回路基板側になるようにした状態で前記第１の剥
離紙が複数連なる該回路基板に跨がってかつ粘着層が部
品搭載部を避けるようにして、各粘着層を所定位置に形
成する工程と、該異方性導電接着剤層および該粘着層付
き連結回路基板を、各回路基板毎に分割する工程と、該
異方性導電接着剤層および該粘着層付き回路基板と、前
記少なくとも電極を有するフィルムとを、該粘着層を介
して接着固定する工程と、該回路基板と、該少なくとも
電極を有するフィルムとを、該異方性導電接着剤層を加
圧加熱して電気的に接続する工程とを有することを特徴
としており、そのことにより、上記目的が達成される。The method of manufacturing a liquid crystal display device according to the present invention is a liquid crystal display in which a film having at least a plurality of electrodes connected to a liquid crystal panel and an elongated circuit board having a component mounting portion are electrically connected. A method for manufacturing a device, comprising a plurality of long sides arranged parallel to each other and arranged side by side.
A gap between each adjoining number of circuit boards, and
From both sides of each of the plurality of circuit boards and the connecting board are respectively V
The connection circuit board comprising continuous through the groove, and forming an anisotropic conductive adhesive layer, for to the anisotropic conductive adhesive layer-provided connecting circuit board, elongated in the first release paper rectangle form
Provide a plurality of adhesive layers corresponding to the distance between each circuit board,
Between the lateral direction of the first release paper and the longitudinal direction of the adhesive layer
Using the adhesive layer laminate formed substantially in parallel, the adhesive
With the adhesive layer on the circuit board side, the first peeling is performed.
The adhesive layer extends over the circuit board in which a plurality of release papers are connected.
Form each adhesive layer in place, avoiding the product loading area.
A step of forming, the anisotropic conductive adhesive layer and the adhesive layer-provided connecting circuit board, a step of dividing each circuit board, and the circuit board with the anisotropic conductive adhesive layer and the adhesive layer, The step of adhesively fixing the film having at least the electrode through the adhesive layer, the circuit board, and the film having at least the electrode are electrically heated by pressurizing and heating the anisotropic conductive adhesive layer. And a step of electrically connecting them, thereby achieving the above object.
【００１９】以下、その作用について説明する。The operation will be described below.
【００２０】本発明の粘着層積層体は、複数の回路基板
の所定位置に対応した粘着層を有し、該粘着層を該複数
の回路基板に跨がって貼り付けできるように構成されて
いることにより、粘着層付き回路基板のマルチ取りが可
能となり、粘着層付き回路基板を低コストで作製するこ
とができる。The pressure-sensitive adhesive layer laminate of the present invention has pressure-sensitive adhesive layers corresponding to predetermined positions of a plurality of circuit boards, and is constructed so that the pressure-sensitive adhesive layers can be attached across the plurality of circuit boards. By doing so, it is possible to take multiple circuit boards with an adhesive layer, and the circuit board with an adhesive layer can be manufactured at low cost.
【００２１】また、本発明の粘着層積層体においては、
前記粘着層積層体は、細長形状の第１の剥離紙と、第２
の剥離紙と、該第１の剥離紙と該第２の剥離紙との間に
介在されて成る細長形状の粘着層とから構成されてお
り、該第１の剥離紙には複数の該粘着層が形成されると
ともに、該第１の剥離紙の短手方向と該粘着層の長手方
向とが略平行に形成されていることにより、連結回路基
板への粘着層の貼り付けおよび粘着層に付着している第
１の剥離紙の剥離が容易に可能となる。Further, in the adhesive layer laminate of the present invention,
The pressure-sensitive adhesive layer stack comprises an elongated first release paper and a second release paper.
Release paper, and an elongated adhesive layer interposed between the first release paper and the second release paper, and the first release paper has a plurality of adhesives. Since the layer is formed and the lateral direction of the first release paper and the longitudinal direction of the adhesive layer are formed substantially parallel to each other, the adhesive layer is attached to the connecting circuit board and the adhesive layer is formed. It is possible to easily peel off the attached first release paper.
【００２２】また、本発明の粘着層積層体においては、
前記第１の剥離紙と前記粘着層との接着強度が、前記第
２の剥離紙と前記粘着層との接着強度よりも高いことに
より、該粘着層積層体から最初に第２の剥離紙を剥が
し、その状態で粘着層の面を回路基板に押しつけ、その
後、第１の剥離紙を粘着層から剥がすことが容易に可能
となる。In the adhesive layer laminate of the present invention,
Since the adhesive strength between the first release paper and the pressure-sensitive adhesive layer is higher than the adhesive strength between the second release paper and the pressure-sensitive adhesive layer, the second release paper is first transferred from the pressure-sensitive adhesive layer laminate. It becomes possible to easily peel off, press the surface of the adhesive layer against the circuit board in this state, and then peel off the first release paper from the adhesive layer.
【００２３】また、本発明の粘着層積層体においては、
前記第１の剥離紙は、前記第２の剥離紙上に複数形成さ
れるとともに、その配列が繰り返し配列または対向配列
であることにより、１枚の粘着層積層体に多くの粘着層
を形成することができる。In the pressure-sensitive adhesive layer laminate of the present invention,
A plurality of the first release papers are formed on the second release paper, and the arrangement is a repeating arrangement or a facing arrangement, so that many adhesive layers are formed in one adhesive layer laminate. You can
【００２４】また、本発明の粘着層積層体においては、
前記第１の剥離紙は、前記第２の剥離紙上に複数形成さ
れるとともに、その形状が櫛歯形状を成し、一対の該第
１の剥離紙が噛み合って配列していることにより、さら
に無駄が少なくなり、１枚の第２の剥離紙に対する第１
の剥離紙の取り数が、他の形状に比べてさらに多くする
ことができる。In the pressure-sensitive adhesive layer laminate of the present invention,
A plurality of the first release papers are formed on the second release paper, the shape of the first release papers is a comb tooth shape, and the pair of first release papers are arranged in mesh with each other. Waste is reduced, and 1st for 1st 2nd release paper
The number of release papers can be increased more than other shapes.
【００２５】また、本発明の粘着層積層体においては、
前記第１の剥離紙に形成された前記粘着層は、前記回路
基板が複数連なって成る連結回路基板における各回路基
板の間隔に対応するように形成されていることにより、
連結回路基板への粘着層の貼り付けおよび粘着層に付着
している第１の剥離紙の剥離が容易に可能となる。In the pressure-sensitive adhesive layer laminate of the present invention,
The pressure-sensitive adhesive layer formed on the first release paper is formed so as to correspond to the interval between the circuit boards in the connected circuit board in which the circuit boards are arranged in series.
It becomes possible to easily attach the adhesive layer to the connection circuit board and peel off the first release paper attached to the adhesive layer.
【００２６】また、本発明の粘着層積層体においては、
前記粘着層が、少なくとも電極を有するフィルム１つに
対して、１つの粘着層が対応するように形成されている
ことにより、少なくとも電極を有するフィルムの電極端
子と回路基板の電極端子との距離を一様にすることがで
き、半田付けおよび異方性導電接着剤による電気的接続
の作業が行い易く、また、電気的接続不良を発生しにく
くすることができる。In the pressure-sensitive adhesive layer laminate of the present invention,
Since the adhesive layer is formed so that one adhesive layer corresponds to at least one film having electrodes, the distance between the electrode terminals of the film having at least electrodes and the electrode terminals of the circuit board can be increased. It is possible to make uniform, it is easy to perform the work of soldering and electrical connection by the anisotropic conductive adhesive, and it is possible to make the electrical connection failure less likely to occur.
【００２７】また、本発明の粘着層積層体においては、
前記粘着層の長さが、前記少なくとも電極を有するフィ
ルムに形成された電極端子部の長さとほぼ同等の長さで
あることにより、少なくとも電極を有するフィルムの電
極端子と回路基板の電極端子との電気的接続部にかかる
引っ張り時などの応力負荷が、各電極端子間毎でほぼ一
様になり、液晶表示装置の製造時における応力負荷など
による断線などの電気的接続不良を発生しにくくするこ
とができる。In the adhesive layer laminate of the present invention,
Since the length of the adhesive layer is substantially the same as the length of the electrode terminal portion formed on the film having at least the electrode, the electrode terminal of the film having at least the electrode and the electrode terminal of the circuit board The stress load applied to the electrical connection, such as when it is pulled, is almost uniform between the electrode terminals, and it is difficult for electrical connection defects such as disconnection due to stress load during the manufacturing of liquid crystal display devices to occur. You can
【００２８】本発明の回路基板の製造方法は、粘着層を
有する回路基板の製造方法であって、該回路基板が複数
連なって成る連結回路基板に、複数連なる該回路基板に
跨がって所定位置に対応して該粘着層を形成する工程
と、該粘着層付き連結回路基板を各回路基板毎に分割す
る工程とを有することにより、回路基板への粘着層形成
における作業の効率化が図れ、低コスト化することが可
能となる。例えば、幅の細い回路基板の場合、一つの連
結回路基板から多くの回路基板を取ることができるた
め、連結回路基板における回路基板の数が、一つの回路
基板に形成される粘着層の数より多くなり、各回路基板
毎に分割してから粘着層を形成するよりも作業の効率化
には極めて有効となる。A method of manufacturing a circuit board according to the present invention is a method of manufacturing a circuit board having an adhesive layer, wherein a predetermined number is provided across a plurality of connected circuit boards which are connected to each other. By having the step of forming the adhesive layer corresponding to the position and the step of dividing the connected circuit board with the adhesive layer into each circuit board, the work efficiency in forming the adhesive layer on the circuit board can be improved. It is possible to reduce the cost. For example, in the case of a narrow circuit board, since many circuit boards can be taken from one connected circuit board, the number of circuit boards in the connected circuit board is smaller than the number of adhesive layers formed on one circuit board. This is much more effective in improving the work efficiency than forming the adhesive layer after dividing each circuit board.
【００２９】本発明の液晶表示装置の製造方法は、液晶
パネルと接続された複数の少なくとも電極を有するフィ
ルムと、回路基板とを、電気的に接続する液晶表示装置
の製造方法であって、該回路基板が複数連なって成る連
結回路基板に、複数連なる該回路基板に跨がって所定位
置に対応して粘着層を形成する工程と、該粘着層付き連
結回路基板を各回路基板毎に分割する工程と、該粘着層
付き回路基板と、該少なくとも電極を有するフィルムと
を、該粘着層を介して接着固定する工程と、該回路基板
と、該少なくとも電極を有するフィルムとを、それぞれ
の電極端子を半田付けし、電気的に接続する工程とを有
することにより、容易に液晶表示装置の表示窓枠を狭く
することができるとともに、電気的接続の信頼性を高め
ることが可能となる。A method of manufacturing a liquid crystal display device according to the present invention is a method of manufacturing a liquid crystal display device in which a film having at least a plurality of electrodes connected to a liquid crystal panel and a circuit board are electrically connected to each other. A step of forming an adhesive layer on a connected circuit board having a plurality of circuit boards arranged at a predetermined position across the plurality of connected circuit boards, and dividing the connected circuit board with an adhesive layer for each circuit board. The step of adhering and fixing the circuit board with the adhesive layer and the film having at least the electrode via the adhesive layer, the circuit board, and the film having at least the electrode. By including the step of soldering the terminals and electrically connecting them, it is possible to easily narrow the display window frame of the liquid crystal display device and improve the reliability of the electrical connection. .
【００３０】また、本発明の液晶表示装置の製造方法
は、液晶パネルと接続された複数の少なくとも電極を有
するフィルムと、回路基板とを、電気的に接続する液晶
表示装置の製造方法であって、該回路基板が複数連なっ
て成る連結回路基板に、複数連なる該回路基板に跨がっ
て所定位置に対応して粘着層を形成する工程と、該粘着
層付き連結回路基板を各回路基板毎に分割する工程と、
該粘着層付き連結回路基板に異方性導電接着剤層を形成
する工程と、該粘着層および該異方性導電接着剤層付き
回路基板と、該少なくとも電極を有するフィルムとを、
該粘着層を介して接着固定する工程と、該回路基板と、
該少なくとも電極を有するフィルムとを、該異方性導電
接着剤層を加圧加熱して電気的に接続する工程とを有す
ることにより、容易に液晶表示装置の表示窓枠を狭くす
ることができるとともに、電気的接続の信頼性を高める
ことが可能となる。The method of manufacturing a liquid crystal display device according to the present invention is a method of manufacturing a liquid crystal display device in which a film having at least a plurality of electrodes connected to a liquid crystal panel and a circuit board are electrically connected. A step of forming an adhesive layer on a connected circuit board formed by connecting a plurality of the circuit boards at a predetermined position across the plurality of connected circuit boards, and the connected circuit board with the adhesive layer for each circuit board The process of dividing into
A step of forming an anisotropic conductive adhesive layer on the connection circuit board with an adhesive layer, the adhesive layer and the circuit board with the anisotropic conductive adhesive layer, and a film having at least an electrode,
A step of adhering and fixing via the adhesive layer, the circuit board,
The display window frame of the liquid crystal display device can be easily narrowed by the step of pressing and heating the anisotropic conductive adhesive layer to electrically connect the film having at least the electrodes. At the same time, the reliability of electrical connection can be improved.
【００３１】また、本発明の液晶表示装置の製造方法
は、液晶パネルと接続された複数の少なくとも電極を有
するフィルムと、回路基板とを、電気的に接続する液晶
表示装置の製造方法であって、該回路基板が複数連なっ
て成る連結回路基板に、異方性導電接着剤層を形成する
工程と、該異方性導電接着剤層付き連結回路基板に、複
数連なる該回路基板に跨がって所定位置に対応して粘着
層を形成する工程と、該異方性導電接着剤層および該粘
着層付き連結回路基板を各回路基板毎に分割する工程
と、該異方性導電接着剤層および該粘着層付き回路基板
と、該少なくとも電極を有するフィルムとを、該粘着層
を介して接着固定する工程と、該回路基板と、該少なく
とも電極を有するフィルムとを、該異方性導電接着剤層
を加圧加熱して電気的に接続する工程とを有することに
より、異方性導電接着剤層および粘着層を効率良く形成
することが可能となる。また、容易に液晶表示装置の表
示窓枠を狭くすることができるとともに、電気的接続の
信頼性を高めることが可能となる。The method of manufacturing a liquid crystal display device of the present invention is a method of manufacturing a liquid crystal display device in which a film having at least a plurality of electrodes connected to a liquid crystal panel and a circuit board are electrically connected. A step of forming an anisotropic conductive adhesive layer on a connected circuit board formed by connecting a plurality of the circuit boards, and a step of forming a plurality of connected circuit boards on the connected circuit board with an anisotropic conductive adhesive layer. Forming an adhesive layer corresponding to a predetermined position, dividing the anisotropic conductive adhesive layer and the connecting circuit board with the adhesive layer into circuit boards, and the anisotropic conductive adhesive layer. And a step of adhering and fixing the circuit board with the adhesive layer and the film having at least the electrode via the adhesive layer, the circuit board and the film having the at least electrode using the anisotropic conductive adhesive. Electrically heat the agent layer under pressure By having a step of connecting, it is possible to an anisotropic conductive adhesive layer and the adhesive layer formed efficiently. In addition, the display window frame of the liquid crystal display device can be easily narrowed, and the reliability of electrical connection can be improved.
【００３２】[0032]
【発明の実施の形態】以下、本発明を図面に示す実施の
形態に基づいて詳細に説明する。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below in detail based on the embodiments shown in the drawings.
【００３３】図１乃至図５を用いて、本発明の粘着層積
層体１の構成について詳細に説明する。図１は本発明の
粘着層積層体１に係わる第１の例を示す平面図、図２は
図１のＸ−Ｘ線における断面図、図３は本発明の粘着層
積層体１に係わる第２の例を示す平面図、図４は本発明
の粘着層積層体１に係わる第３の例を示す平面図、図５
は本発明に係わる粘着層積層体１を液晶表示装置の組み
立てに用いた場合の各構成部品の接続関係を示す説明図
である。The structure of the pressure-sensitive adhesive layer laminate 1 of the present invention will be described in detail with reference to FIGS. 1 to 5. 1 is a plan view showing a first example of the pressure-sensitive adhesive layer laminate 1 of the present invention, FIG. 2 is a sectional view taken along line XX of FIG. 1, and FIG. 3 is a cross-sectional view of the pressure-sensitive adhesive layer laminate 1 of the present invention. 2 is a plan view showing an example 2, FIG. 4 is a plan view showing a third example of the adhesive layer laminate 1 of the present invention, FIG.
FIG. 4 is an explanatory diagram showing a connection relationship of each component when the pressure-sensitive adhesive layer laminate 1 according to the present invention is used for assembling a liquid crystal display device.
【００３４】図１および図２に示すように、本発明の粘
着層積層体１は、透明なシリコン表面処理ポリエステル
フィルムからなる第１の剥離紙２と、着色された粘着層
３と、不透明なシリコン表面処理紙からなる第２の剥離
紙４との３層が積層された構造となっている。As shown in FIGS. 1 and 2, the pressure-sensitive adhesive layer laminate 1 of the present invention comprises a first release paper 2 made of a transparent silicon surface-treated polyester film, a colored pressure-sensitive adhesive layer 3, and an opaque layer. It has a structure in which three layers including the second release paper 4 made of silicon surface treated paper are laminated.
【００３５】第１の剥離紙２は、略長方形の形状を成
し、その短辺には、第１の剥離紙２を粘着層３から剥が
す際に、手などでつまむ箇所としての凸部が設けられて
いる。The first release paper 2 has a substantially rectangular shape, and a short side thereof has a convex portion as a portion to be pinched by a hand or the like when the first release paper 2 is peeled off from the adhesive layer 3. It is provided.
【００３６】第１の剥離紙２と第２の剥離紙４との間に
介在する粘着層３は、第１の剥離紙２側からシリコン系
粘着剤、ポリエステルフィルム基材、アクリル系粘着剤
の順に３層で構成され、回路基板が複数連なって成る連
結回路基板における各回路基板の間隔および数に対応す
るように形成されているとともに、第１の剥離紙２の短
手方向と粘着層３の長手方向とが略平行になるように形
成されている。The pressure-sensitive adhesive layer 3 interposed between the first release paper 2 and the second release paper 4 comprises a silicon-based pressure-sensitive adhesive, a polyester film substrate, and an acrylic pressure-sensitive adhesive from the first release paper 2 side. It is composed of three layers in order, and is formed so as to correspond to the distance and the number of each circuit board in the connected circuit board in which a plurality of circuit boards are connected, and the short side direction of the first release paper 2 and the adhesive layer 3 are formed. Is formed so as to be substantially parallel to the longitudinal direction thereof.
【００３７】また、粘着層積層体１において、複数（連
結回路基板における回路基板の数：本実施形態では５）
の粘着層３と接着している第１の剥離紙２は、１枚の第
２の剥離紙４上に複数枚（本実施形態では４枚）の列を
形成している。In addition, in the pressure-sensitive adhesive layer laminate 1, a plurality of (the number of circuit boards in the connection circuit board: 5 in the present embodiment).
The first release paper 2 adhered to the adhesive layer 3 is formed of a plurality of rows (four sheets in this embodiment) on one second release paper 4.
【００３８】本実施形態においては、第１の剥離紙２の
配列方法として、図１に示すような単純な繰り返し配列
の方法を用いたが、その他にも以下のような配列方法が
考えられる。In the present embodiment, a simple repeating arrangement method as shown in FIG. 1 is used as the arrangement method of the first release paper 2, but the following arrangement method is also conceivable.
【００３９】まず、図３に示される粘着層積層体１は、
３層の積層構造で図１と同じ断面構成であるが、第２の
剥離紙４上での第１の剥離紙２の配列方法が、一対の第
１の剥離紙２が対向配置されており、その一対の第１の
剥離紙２が繰り返し配列されている。First, the adhesive layer laminate 1 shown in FIG.
Although it has a three-layer laminated structure and the same cross-sectional configuration as in FIG. 1, the first release paper 2 is arranged on the second release paper 4 such that a pair of the first release papers 2 are arranged to face each other. , The pair of first release papers 2 are repeatedly arranged.
【００４０】また、図４に示される粘着層積層体１は、
３層の積層構造であることはこれまでと同じであるが、
第２の剥離紙４上での第１の剥離紙２の配列方法が、第
１の剥離紙２が櫛歯の形状を有しており、その一対の第
１の剥離紙２が噛み合った状態で対向配置されており、
この一対の第１の剥離紙２が繰り返し配列されている。
このような配列方法を行うことにより、１枚の粘着層積
層体１により多くの粘着層３を形成することが可能とな
る。The pressure-sensitive adhesive layer laminate 1 shown in FIG.
Although it is the same as before, it has a three-layer laminated structure,
A method of arranging the first release paper 2 on the second release paper 4 is such that the first release paper 2 has a comb-teeth shape, and the pair of first release papers 2 mesh with each other. Are opposed to each other,
The pair of first release papers 2 are repeatedly arranged.
By performing such an arranging method, it becomes possible to form more adhesive layers 3 in one adhesive layer laminate 1.
【００４１】図５に示すように、粘着層３と少なくとも
電極を有するフィルム（本実施形態ではＴＡＢフィルム
を用いる）５との接続関係は、１枚のＴＡＢフィルム５
に対して１つの粘着層３が対応しており、この粘着層３
の長さＡは、第１の剥離紙２の短手方向の長さと同等ま
たはそれ以下であるとともに、ＴＡＢフィルム５の電極
端子部の長さＢとほぼ同等の長さを有している。この電
極端子部の長さＢとは、電極端子部の両端にある電極端
子の端子間の距離を表している。As shown in FIG. 5, the connection relationship between the adhesive layer 3 and the film having at least an electrode (TAB film is used in this embodiment) 5 is one TAB film 5.
One adhesive layer 3 corresponds to
The length A is equal to or less than the length of the first release paper 2 in the lateral direction, and is substantially equal to the length B of the electrode terminal portion of the TAB film 5. The length B of the electrode terminal portion represents the distance between the terminals of the electrode terminals at both ends of the electrode terminal portion.
【００４２】このように電極端子の配列や大きさに対応
して粘着層３を形成することにより、ＴＡＢフィルム５
の電極端子と回路基板６の電極端子とが、一様な応力状
態または間隙状態となって、ＴＡＢフィルム５と回路基
板６との電気的接続が容易になり、電気的接続不良が発
生しにくくなる。By thus forming the adhesive layer 3 in accordance with the arrangement and size of the electrode terminals, the TAB film 5 is formed.
And the electrode terminals of the circuit board 6 are in a uniform stress state or a gap state, and the electrical connection between the TAB film 5 and the circuit board 6 is facilitated, and electrical connection failure is unlikely to occur. Become.
【００４３】図６乃至図９を用いて、本発明の回路基板
６の製造方法について詳細に説明する。図６は本発明の
回路基板６の製造方法に係わる粘着層３形成前の連結回
路基板７を示す平面図、図７は本発明の回路基板６の製
造方法に係わる粘着層３および第１の剥離紙２付き連結
回路基板７を示す平面図、図８は本発明の回路基板６の
製造方法に係わる粘着層３形成後の連結回路基板７を示
す平面図、図９は本発明の回路基板６の製造方法によっ
て得られる回路基板６を示す平面図である。The method of manufacturing the circuit board 6 of the present invention will be described in detail with reference to FIGS. FIG. 6 is a plan view showing the connecting circuit board 7 before the formation of the adhesive layer 3 according to the method for manufacturing the circuit board 6 of the present invention, and FIG. FIG. 8 is a plan view showing the connection circuit board 7 with the release paper 2, FIG. 8 is a plan view showing the connection circuit board 7 after the adhesive layer 3 is formed according to the method for manufacturing the circuit board 6 of the present invention, and FIG. 9 is the circuit board of the present invention. 6 is a plan view showing a circuit board 6 obtained by the manufacturing method of FIG.
【００４４】図６に示すように、連結回路基板７は、電
極端子８が形成された複数枚の回路基板６と、これらを
連結する連結基板９とから構成されている。また、この
回路基板６と連結基板９との境界には、分割用のＶ溝１
０が形成されている。この連結回路基板７は、その材質
がガラエポ材料であり、クリーム半田塗布、各種部品の
マウント、リフロー、検査の工程などは、公知の技術を
使用して製造されたものを使用することができる。As shown in FIG. 6, the connection circuit board 7 is composed of a plurality of circuit boards 6 on which electrode terminals 8 are formed, and a connection board 9 for connecting them. Further, at the boundary between the circuit board 6 and the connection board 9, the dividing V groove 1 is formed.
0 is formed. The connection circuit board 7 is made of a glass epoxy material, and the solder paste application, the mounting of various parts, the reflow process, the inspection process, and the like can be made by using known techniques.
【００４５】本発明の粘着層積層体１において、第１の
剥離紙２を第２の剥離紙４から剥がすことにより、第１
の剥離紙２に複数枚の粘着層３が接着した状態のものが
得られる。この粘着層３付き第１の剥離紙２を、粘着層
３を回路基板６側にした状態で、連結回路基板７の電子
部品搭載部、切り欠き部およびビス穴などを避けて位置
合わせを行い、粘着層３を押さえつけて連結回路基板７
の所定の位置に貼り付ける。In the pressure-sensitive adhesive layer laminate 1 of the present invention, the first release paper 2 is peeled off from the second release paper 4 to give the first release paper 4.
A plurality of adhesive layers 3 are adhered to the release paper 2 of 1. The first release paper 2 with the adhesive layer 3 is aligned with the adhesive layer 3 on the circuit board 6 side while avoiding the electronic component mounting portion, the cutout portion, the screw hole, etc. of the connection circuit board 7. , Pressing the adhesive layer 3 to connect the circuit board 7
Stick it in place.
【００４６】これと同様にして、粘着層３付き第１の剥
離紙２を複数枚、連結回路基板７の所定の位置に貼り付
ける。この状態を図７に示す。In the same manner as above, a plurality of the first release papers 2 with the adhesive layer 3 are attached to predetermined positions of the connection circuit board 7. This state is shown in FIG.
【００４７】そして、粘着層３付き第１の剥離紙２を貼
り付けた連結回路基板７から、第１の剥離紙２を、凸部
を手などでつまんで剥離し、図８に示すような粘着層３
が露出した連結回路基板７を作製する。Then, the first release paper 2 is peeled off from the connection circuit board 7 to which the first release paper 2 with the adhesive layer 3 is attached by grasping the convex portions with a hand or the like, as shown in FIG. Adhesive layer 3
The connected circuit board 7 having exposed parts is produced.
【００４８】次に、回路基板６を連結した連結基板９か
ら、Ｖ溝１０の箇所でブレイキングし、図９に示すよう
な、粘着層３付き回路基板６を得ることができる。Next, the circuit board 6 with the adhesive layer 3 as shown in FIG. 9 can be obtained by breaking the connection board 9 to which the circuit boards 6 are connected at the position of the V groove 10.
【００４９】図５および図１０乃至図１６を用いて、本
発明の液晶表示装置とその製造方法について詳細に説明
する。図１０は本発明に係わる液晶表示装置の平面図、
図１１は図１０のＹ−Ｙ線における断面図、図１２は異
方性導電接着剤積層体１１の断面図、図１３は本発明の
液晶表示装置の製造方法に係わる異方性導電接着剤層
（本実施形態ではドライフィルムを用いる）１２形成後
の連結回路基板７を示す平面図、図１４は本発明の液晶
表示装置の製造方法に係わるドライフィルム１２、粘着
層３および第１の剥離紙２付き連結回路基板７を示す平
面図、図１５は図１４のＺ−Ｚ線における断面図、図１
６は本発明の液晶表示装置の製造方法に係わるドライフ
ィルム１２および粘着層３付き回路基板６を示す平面図
である。The liquid crystal display device of the present invention and the manufacturing method thereof will be described in detail with reference to FIGS. 5 and 10 to 16. FIG. 10 is a plan view of a liquid crystal display device according to the present invention,
11 is a sectional view taken along the line YY of FIG. 10, FIG. 12 is a sectional view of the anisotropic conductive adhesive laminate 11, and FIG. 13 is an anisotropic conductive adhesive according to the method for manufacturing a liquid crystal display device of the present invention. FIG. 14 is a plan view showing the connection circuit board 7 after formation of the layer (a dry film is used in this embodiment) 12, FIG. 14 is a dry film 12, an adhesive layer 3 and a first peeling layer according to the method for manufacturing a liquid crystal display device of the present invention. FIG. 15 is a plan view showing the connection circuit board 7 with the paper 2, FIG. 15 is a sectional view taken along line ZZ of FIG.
6 is a plan view showing the dry film 12 and the circuit board 6 with the adhesive layer 3 according to the method for manufacturing a liquid crystal display device of the present invention.
【００５０】図１０および図１１に示すように、本発明
の液晶表示装置は、液晶パネル１３と、上述した製造方
法によって得られる回路基板６と、ＴＡＢフィルム５と
から構成されている。As shown in FIGS. 10 and 11, the liquid crystal display device of the present invention comprises a liquid crystal panel 13, a circuit board 6 obtained by the above-described manufacturing method, and a TAB film 5.
【００５１】これらの各構成部品の接続関係は、図５に
示すように、１枚のＴＡＢフィルム５に対して１つの粘
着層３が対応しており、この粘着層３の長さＡは、第１
の剥離紙２の短手方向の長さと同等またはそれ以下であ
るとともに、ＴＡＢフィルム５の電極端子部の長さＢと
ほぼ同等の長さを有している。As shown in FIG. 5, one adhesive layer 3 corresponds to one TAB film 5, and the length A of the adhesive layer 3 is as follows. First
The length is equal to or shorter than the length of the release paper 2 in the short side direction and is substantially equal to the length B of the electrode terminal portion of the TAB film 5.
【００５２】このように電極端子の配列や大きさに対応
して粘着層３を形成することにより、ＴＡＢフィルム５
の電極端子と回路基板６の電極端子８とが、一様な応力
状態または間隙状態となって、ＴＡＢフィルム５と回路
基板６とをドライフィルム１２を介して電気的に接続す
ることが容易になり、電気的接続不良が発生しにくくな
る。By thus forming the adhesive layer 3 in accordance with the arrangement and size of the electrode terminals, the TAB film 5 is formed.
And the electrode terminals 8 of the circuit board 6 are in a uniform stress state or a gap state, and the TAB film 5 and the circuit board 6 can be easily electrically connected via the dry film 12. As a result, poor electrical connection is less likely to occur.
【００５３】本発明の液晶表示装置の製造方法における
第１の方法は、まずＬＳＩ１４を搭載した複数のＴＡＢ
フィルム５と液晶パネル１３とを、以下のような方法で
電気的に接続する。尚、ＴＡＢフィルム５には、半田付
けを容易に行えるようにスリットを設けておく。The first method in the method of manufacturing a liquid crystal display device according to the present invention is as follows. First, a plurality of TABs on which the LSI 14 is mounted are mounted.
The film 5 and the liquid crystal panel 13 are electrically connected by the following method. The TAB film 5 is provided with slits so that soldering can be performed easily.
【００５４】図１２に示すような、ドライフィルム１２
上に保護フィルム１５が形成された異方性導電接着剤積
層体１１を液晶パネル１３の電極端子上に配置し、異方
性導電接着剤積層体１１を６０〜１００℃に加熱しなが
ら５〜３０Ｋｇ／ｃｍ2で加圧して固定する。A dry film 12 as shown in FIG.
The anisotropic conductive adhesive laminate 11 having the protective film 15 formed thereon is arranged on the electrode terminals of the liquid crystal panel 13, and the anisotropic conductive adhesive laminate 11 is heated to 60 to 100 ° C. Pressurize at 30 Kg / cm 2 and fix.
【００５５】そして、ドライフィルム１２から保護フィ
ルム１５を剥がし、液晶パネル１３とＴＡＢフィルム５
とを位置合わせした後、ドライフィルム１２を１５５〜
１９０℃に加熱しながら２５〜４５Ｋｇ／ｃｍ2で加圧
して電気的に接続する。Then, the protective film 15 is peeled off from the dry film 12, and the liquid crystal panel 13 and the TAB film 5 are removed.
After aligning the
While heating at 190 ° C., pressure is applied at 25 to 45 kg / cm 2 to electrically connect.
【００５６】次に、液晶パネル１３と電気的に接続され
たＴＡＢフィルム５と、上述した製造方法によって得ら
れる回路基板６とを、回路基板６に形成された粘着層３
を介して接着固定する。回路基板６に形成された粘着層
３は、回路基板６上に配置されたセラミックコンデンサ
ーなどの電子部品、切り欠きおよびビス穴などを避けて
形成されている。Next, the TAB film 5 electrically connected to the liquid crystal panel 13 and the circuit board 6 obtained by the above-described manufacturing method are attached to the adhesive layer 3 formed on the circuit board 6.
Adhesively fixed through. The adhesive layer 3 formed on the circuit board 6 is formed so as to avoid electronic parts such as ceramic capacitors arranged on the circuit board 6, notches and screw holes.
【００５７】そして、予めＴＡＢフィルム５に設けてお
いたスリットを利用し、半田付けを行って電気的接続を
行うことにより、液晶表示装置を得る。Then, the liquid crystal display device is obtained by utilizing the slits provided in the TAB film 5 in advance and performing soldering for electrical connection.
【００５８】本発明の液晶表示装置の製造方法における
第２の方法は、まずＬＳＩ１４を搭載した複数のＴＡＢ
フィルム５と液晶パネル１３とを、異方性導電接着剤積
層体１１を液晶パネル１３の電極端子上に配置し、異方
性導電接着剤積層体１１を６０〜１００℃に加熱しなが
ら５〜３０Ｋｇ／ｃｍ2で加圧することによって固定す
る。The second method in the method of manufacturing a liquid crystal display device of the present invention is to firstly provide a plurality of TABs each having the LSI 14 mounted thereon.
The film 5 and the liquid crystal panel 13 are placed on the electrode terminals of the liquid crystal panel 13 with the anisotropic conductive adhesive laminate 11, and the anisotropic conductive adhesive laminate 11 is heated to 60 to 100 ° C. Fix by pressing at 30 Kg / cm 2 .
【００５９】そして、異方性導電接着剤積層体１１のド
ライフィルム１２から保護フィルム１５を剥がし、液晶
パネル１３とＴＡＢフィルム５とを位置合わせした後、
ドライフィルム１２を１５５〜１９０℃に加熱しながら
２５〜４５Ｋｇ／ｃｍ2で加圧して電気的に接続する。Then, after the protective film 15 is peeled off from the dry film 12 of the anisotropic conductive adhesive laminate 11 and the liquid crystal panel 13 and the TAB film 5 are aligned with each other,
The dry film 12 is heated to 155 to 190 ° C. and pressurized at 25 to 45 Kg / cm 2 to be electrically connected.
【００６０】次に、ＴＡＢフィルム５と回路基板６の接
続を行うのであるが、回路基板６には、上述した製造方
法によって得られる回路基板６を用いる。回路基板６に
形成された粘着層３は、回路基板６上に配置されたセラ
ミックコンデンサーなどの電子部品、切り欠きおよびビ
ス穴などを避けて形成されている。Next, the TAB film 5 and the circuit board 6 are connected. As the circuit board 6, the circuit board 6 obtained by the above-described manufacturing method is used. The adhesive layer 3 formed on the circuit board 6 is formed so as to avoid electronic parts such as ceramic capacitors arranged on the circuit board 6, notches and screw holes.
【００６１】この回路基板６の電極端子８上に、異方性
導電接着剤積層体１１をドライフィルム１２のタック性
を利用して配置し、６０〜１００℃に加熱しながら５〜
３０Ｋｇ／ｃｍ2で加圧して固定する。An anisotropic conductive adhesive laminate 11 is placed on the electrode terminals 8 of the circuit board 6 by utilizing the tackiness of the dry film 12, and heated to 60 to 100 ° C. for 5 to 5.
Pressurize at 30 Kg / cm 2 and fix.
【００６２】そして、ドライフィルム１２を覆っている
保護フィルム１５を剥がした後、液晶パネル１３と回路
基板６とを位置合わせし、複数のＴＡＢフィルム５の電
極端子と回路基板６の電極端子８とを重ね合わせた状態
にして、ＴＡＢフィルム５を押さえることにより、ＴＡ
Ｂフィルム５と回路基板６とを粘着層３を介して接着固
定する。Then, after removing the protective film 15 covering the dry film 12, the liquid crystal panel 13 and the circuit board 6 are aligned with each other, and the electrode terminals of the plurality of TAB films 5 and the electrode terminals 8 of the circuit board 6 are connected. And then press the TAB film 5 to
The B film 5 and the circuit board 6 are bonded and fixed via the adhesive layer 3.
【００６３】そして、回路基板６の電極端子８とＴＡＢ
フィルム５の電極端子とを、ドライフィルム１２を１５
５〜２２５℃に加熱しながら２５〜４５Ｋｇ／ｃｍ2で
加圧し、電気的接続を行うことによって液晶表示装置を
得る。The electrode terminal 8 of the circuit board 6 and the TAB
The film 5 electrode terminals and the dry film 12 15
A liquid crystal display device is obtained by heating at 5 to 225 ° C. and pressurizing at 25 to 45 Kg / cm 2 for electrical connection.
【００６４】本発明の液晶表示装置の製造方法における
第３の方法は、まずＬＳＩ１４を搭載した複数のＴＡＢ
フィルム５と液晶パネル１３とを、異方性導電接着剤積
層体１１を液晶パネル１３の電極端子上に配置し、異方
性導電接着剤積層体１１を６０〜１００℃に加熱しなが
ら５〜３０Ｋｇ／ｃｍ2で加圧することによって固定す
る。The third method in the method of manufacturing a liquid crystal display device according to the present invention is as follows.
The film 5 and the liquid crystal panel 13 are placed on the electrode terminals of the liquid crystal panel 13 with the anisotropic conductive adhesive laminate 11, and the anisotropic conductive adhesive laminate 11 is heated to 60 to 100 ° C. Fix by pressing at 30 Kg / cm 2 .
【００６５】そして、ドライフィルム１２から保護フィ
ルム１５を剥がし、液晶パネル１３とＴＡＢフィルム５
とを位置合わせした後、ドライフィルム１２を１５５〜
１９０℃に加熱しながら２５〜４５Ｋｇ／ｃｍ2で加圧
して電気的に接続する。Then, the protective film 15 is peeled off from the dry film 12, and the liquid crystal panel 13 and the TAB film 5 are removed.
After aligning the
While heating at 190 ° C., pressure is applied at 25 to 45 kg / cm 2 to electrically connect.
【００６６】次に、ＴＡＢフィルム５と回路基板６の接
続を行うのであるが、回路基板６には、以下に示すよう
な製造方法によって得られる回路基板６を用いる。Next, the TAB film 5 and the circuit board 6 are connected. As the circuit board 6, the circuit board 6 obtained by the following manufacturing method is used.
【００６７】図１３に示すように、連結回路基板７は、
電極端子８が形成された複数枚の回路基板６と、これら
を連結する連結基板９とから構成されている。また、こ
の回路基板６と連結基板９との境界には、分割用のＶ溝
１０が形成されている。この連結回路基板７は、その材
質がガラエポ材料であり、クリーム半田塗布、各種部品
のマウント、リフロー、検査の工程などは公知の技術を
使用して製造されたものを使用することができる。As shown in FIG. 13, the connection circuit board 7 is
It is composed of a plurality of circuit boards 6 on which electrode terminals 8 are formed and a connecting board 9 for connecting these. In addition, a V groove 10 for division is formed at the boundary between the circuit board 6 and the connection board 9. The connection circuit board 7 is made of a glass epoxy material, and the solder paste application, the mounting of various components, the reflow process, the inspection process, and the like can be those manufactured using known techniques.
【００６８】まず、連結回路基板７上に、異方性導電接
着剤積層体１１を、ドライフィルム１２面を回路基板６
側にし、ドライフィルム１２のタック性を利用して回路
基板６毎に貼り付ける。First, the anisotropic conductive adhesive laminate 11 is placed on the connection circuit board 7, and the surface of the dry film 12 is placed on the circuit board 6.
And the dry film 12 is attached to each circuit board 6 by using the tackiness of the dry film 12.
【００６９】そして、異方性導電接着剤積層体１１を６
０〜１００℃に加熱しながら５〜３０Ｋｇ／ｃｍ2で加
圧し、ドライフィルム１２と回路基板６との密着力を高
めて固定する。Then, the anisotropic conductive adhesive laminate 11 was replaced with 6
While being heated to 0 to 100 ° C., pressure is applied at 5 to 30 Kg / cm 2 to increase the adhesion between the dry film 12 and the circuit board 6 and fix it.
【００７０】次に、本発明の粘着層積層体１において、
第２の剥離紙４から第１の剥離紙２と粘着層３とを一緒
に剥がすことにより、第１の剥離紙２に複数の粘着層３
が接着した状態の粘着層３付き第１の剥離紙２が得られ
る。この粘着層３付き第１の剥離紙２を、粘着層３を回
路基板６側にした状態で、複数本の異方性導電接着剤積
層体１１と交差するように、連結回路基板７の電子部品
搭載部、切り欠き部およびビス穴などを避けて位置合わ
せを行い、粘着層３を押さえつけて連結回路基板７の所
定の位置に貼り付ける。Next, in the adhesive layer laminate 1 of the present invention,
By peeling the first release paper 2 and the adhesive layer 3 together from the second release paper 4, the plurality of adhesive layers 3 are attached to the first release paper 2.
The first release paper 2 with the adhesive layer 3 in a state of being adhered is obtained. The first release paper 2 with the adhesive layer 3 is attached to the electronic circuit of the connection circuit board 7 so as to intersect the anisotropic conductive adhesive laminate 11 with the adhesive layer 3 on the circuit board 6 side. Positioning is performed while avoiding the component mounting portion, the notch portion, the screw hole, and the like, and the adhesive layer 3 is pressed and attached to a predetermined position of the connection circuit board 7.
【００７１】これと同様にして、粘着層３付き第１の剥
離紙２を複数枚、連結回路基板７の所定の位置に貼り付
ける。この状態を図１４および図１５に示す。In the same manner, a plurality of the first release papers 2 with the adhesive layer 3 are attached to the predetermined positions of the connection circuit board 7. This state is shown in FIGS. 14 and 15.
【００７２】そして、回路基板６を連結した連結基板９
から、Ｖ溝１０の箇所でブレイキングするとともに、ド
ライフィルム１２から保護フィルム１５を、粘着層３か
ら第１の剥離紙２をそれぞれ剥離し、図１６に示すよう
な、粘着層３およびドライフィルム１２が露出した回路
基板６を得る。A connection board 9 in which the circuit boards 6 are connected
, The protective film 15 is peeled off from the dry film 12, the first release paper 2 is peeled off from the adhesive layer 3, and the adhesive layer 3 and the dry film 12 as shown in FIG. A circuit board 6 having exposed parts is obtained.
【００７３】次に、液晶パネル１３と回路基板６とを位
置合わせし、複数のＴＡＢフィルム５の電極端子と回路
基板６の電極端子８とを重ね合わせた状態にして、ＴＡ
Ｂフィルム５を押さえることにより、ＴＡＢフィルム５
と回路基板６とを粘着層３を介して接着固定する。Next, the liquid crystal panel 13 and the circuit board 6 are aligned with each other, and the electrode terminals of the plurality of TAB films 5 and the electrode terminals 8 of the circuit board 6 are overlapped with each other.
By pressing B film 5, TAB film 5
And the circuit board 6 are adhered and fixed via the adhesive layer 3.
【００７４】そして、回路基板６の電極端子８とＴＡＢ
フィルム５の電極端子とを、ドライフィルム１２を１５
５〜２２５℃に加熱しながら２５〜４５Ｋｇ／ｃｍ2で
加圧し、電気的接続を行うことによって液晶表示装置を
得る。Then, the electrode terminals 8 of the circuit board 6 and the TAB
The film 5 electrode terminals and the dry film 12 15
A liquid crystal display device is obtained by heating at 5 to 225 ° C. and pressurizing at 25 to 45 Kg / cm 2 for electrical connection.
【００７５】[0075]
【発明の効果】以上の説明のように、本発明の液晶表示
装置の製造方法によれば、各長辺同士を互いに平行にし
て横並びに配された複数の回路基板における各隣接間に
隙間を設け、かつこれら複数の各回路基板の両短辺と連
結基板とがそれぞれＶ溝を介して連なって成る連結回路
基板に対して、長方形の第１の剥離紙上に細長形状の粘
着層を各回路基板の間隔に対応して複数設け、かつ該第
１の剥離紙の短手方向と該粘着層の長手方向とが略平行
に形成されている粘着層積層体を用いて、前記粘着層が
回路基板側になるようにした状態で前記第１の剥離紙が
複数連なる該回路基板に跨がってかつ粘着層が部品搭載
部を避けるようにして、各粘着層を所定位置に形成する
工程と、該粘着層付き連結回路基板を、各回路基板毎に
ブレイキングして分割する工程と、該粘着層付き回路基
板と、前記少なくとも電極を有するフィルムとを、それ
ぞれの電極端子にて電気的に接続する工程とを有するこ
とにより、容易に液晶表示装置の表示窓枠を狭くするこ
とができるとともに、電気的接続の信頼性を高めること
が可能となる。As described above, according to the method of manufacturing a liquid crystal display device of the present invention, the long sides are made parallel to each other.
Between adjacent parts of multiple circuit boards arranged side by side
Make a gap and connect to both short sides of each of these circuit boards.
For the connection circuit board and the formation substrate is made by continuous through the V grooves each, elongated shape first release paper rectangle viscosity
A plurality of adhesive layers are provided corresponding to the intervals between the circuit boards, and
The short side direction of the release paper of No. 1 and the longitudinal direction of the adhesive layer are substantially parallel
Using the adhesive layer laminate formed in
The adhesive layer is mounted on the circuit board in which a plurality of the first release papers are arranged in a line on the circuit board side and the adhesive layer is mounted on the circuit board.
Form each adhesive layer in place, avoiding parts
A step, the connecting circuit board with the adhesive layer, and the step of dividing by breaking each circuit board, and the circuit board with the adhesive layer, and said film having at least electrodes, electrically at the respective electrode terminals By including the step of connecting to, it is possible to easily narrow the display window frame of the liquid crystal display device and improve the reliability of electrical connection.
【００７６】また、本発明の液晶表示装置の製造方法に
よれば、各長辺同士を互いに平行にして横並びに配され
た複数の回路基板における各隣接間に隙間を設け、かつ
これら複数の各回路基板の両短辺と連結基板とがそれぞ
れＶ溝を介して連なって成る連結回路基板に対して、長
方形の第１の剥離紙上に細長形状の粘着層を各回路基板
の間隔に対応して複数設け、かつ該第１の剥離紙の短手
方向と該粘着層の長手方向とが略平行に形成されている
粘着層積層体を用いて、前記粘着層が回路基板側になる
ようにした状態で前記第１の剥離紙が複数連なる該回路
基板に跨がってかつ粘着層が部品搭載部を避けるように
して、各粘着層を所定位置に形成する工程と、該粘着層
付き連結回路基板を、各回路基板毎に分割する工程と、
該粘着層付き回路基板に異方性導電接着剤層を形成する
工程と、該粘着層および該異方性導電接着剤層付き回路
基板と、前記少なくとも電極を有するフィルムとを、該
粘着層を介して接着固定する工程と、該回路基板と、該
少なくとも電極を有するフィルムとを、該異方性導電接
着剤層を加圧加熱して電気的に接続する工程とを有する
ことにより、容易に液晶表示装置の表示窓枠を狭くする
ことができるとともに、電気的接続の信頼性を高めるこ
とが可能となる。According to the method of manufacturing a liquid crystal display device of the present invention, the long sides are arranged side by side in parallel with each other.
A space is provided between each adjacent circuit board, and
Both short sides of each of these plurality of circuit boards and the connecting board are respectively
Re for the connecting circuit board comprising continuous through the V grooves, the length
Each of the circuit boards has an elongated adhesive layer on the first rectangular release paper.
A plurality of short sheets of the first release paper are provided corresponding to the intervals of
Direction and the longitudinal direction of the adhesive layer are formed substantially parallel to each other
Using the adhesive layer laminate, the adhesive layer is on the circuit board side
In this state, the first release paper straddles the circuit board having a plurality of lines and the adhesive layer avoids the component mounting portion.
To, and forming a respective adhesive layer to a predetermined position, a step of dividing the connection circuit board with the adhesive layer, each circuit board,
A step of forming an anisotropic conductive adhesive layer on the circuit board with the adhesive layer, the adhesive layer and the circuit board with the anisotropic conductive adhesive layer, the film having at least the electrode, the adhesive layer By facilitating the steps of adhering and fixing via adhesive, and the step of electrically connecting the circuit board and the film having at least the electrode by heating the anisotropic conductive adhesive layer under pressure, The display window frame of the liquid crystal display device can be narrowed and the reliability of electrical connection can be improved.
【００７７】また、本発明の液晶表示装置の製造方法に
よれば、各長辺同士を互いに平行にして横並びに配され
た複数の回路基板における各隣接間に隙間を設け、かつ
これら複数の各回路基板の両短辺と連結基板とがそれぞ
れＶ溝を介して連なって成る連結回路基板に、異方性導
電接着剤層を形成する工程と、該異方性導電接着剤層付
き連結回路基板に対して、長方形の第１の剥離紙上に細
長形状の粘着層を各回路基板の間隔に対応して複数設
け、かつ該第１の剥離紙の短手方向と該粘着層の長手方
向とが略平行に形成されている粘着層積層体を用いて、
前記粘着層が回路基板側になるようにした状態で前記第
１の剥離紙が複数連なる該回路基板に跨がってかつ粘着
層が部品搭載部を避けるようにして、各粘着層を所定位
置に形成する工程と、該異方性導電接着剤層および該粘
着層付き連結回路基板を、各回路基板毎に分割する工程
と、該異方性導電接着剤層および該粘着層付き回路基板
と、前記少なくとも電極を有するフィルムとを、該粘着
層を介して接着固定する工程と、該回路基板と、該少な
くとも電極を有するフィルムとを、該異方性導電接着剤
層を加圧加熱して電気的に接続する工程とを有すること
により、異方性導電接着剤層および粘着層を効率良く形
成することが可能となる。また、容易に液晶表示装置の
表示窓枠を狭くすることができるとともに、電気的接続
の信頼性を高めることが可能となる。According to the method of manufacturing a liquid crystal display device of the present invention, the long sides are arranged side by side in parallel with each other.
A space is provided between each adjacent circuit board, and
Both short sides of each of these plurality of circuit boards and the connecting board are respectively
Re the connection circuit board comprising continuous through the V-groove, and forming an anisotropic conductive adhesive layer, for to the anisotropic conductive adhesive layer-provided connecting circuit board, paper first release rectangle Fine
Multiple long-shaped adhesive layers are provided corresponding to the intervals between the circuit boards.
And the lateral direction of the first release paper and the longitudinal direction of the adhesive layer
Using an adhesive layer laminate in which the direction is formed substantially parallel to each other,
With the adhesive layer on the circuit board side,
Adhesion across and across the circuit board consisting of multiple release papers
Align each adhesive layer in place so that the layer avoids the component mounting area.
Process and, said anisotropic conductive adhesive layer and the adhesive layer-provided connecting circuit board, a step of dividing each circuit board, the anisotropic conductive adhesive layer and the adhesive layer with the circuit board to form the location And a step of adhering and fixing the film having at least the electrode via the adhesive layer, the circuit board, and the film having at least the electrode by heating the anisotropic conductive adhesive layer under pressure. And a step of electrically connecting the anisotropic conductive adhesive layer and the pressure-sensitive adhesive layer can be efficiently formed. In addition, the display window frame of the liquid crystal display device can be easily narrowed, and the reliability of electrical connection can be improved.
【図１】本発明の粘着層積層体に係わる第１の例を示す
平面図である。FIG. 1 is a plan view showing a first example of an adhesive layer laminate of the present invention.
【図２】図１のＸ−Ｘ線における断面図である。FIG. 2 is a cross-sectional view taken along line XX of FIG.
【図３】本発明の粘着層積層体に係わる第２の例を示す
平面図である。FIG. 3 is a plan view showing a second example relating to the adhesive layer laminate of the present invention.
【図４】本発明の粘着層積層体に係わる第３の例を示す
平面図である。FIG. 4 is a plan view showing a third example relating to the adhesive layer laminate of the present invention.
【図５】本発明に係わる粘着層積層体を液晶表示装置の
組み立てに用いた場合の各構成部品の接続関係を示す説
明図である。FIG. 5 is an explanatory diagram showing a connection relationship of each component when the pressure-sensitive adhesive layer laminate according to the present invention is used for assembling a liquid crystal display device.
【図６】本発明の回路基板の製造方法に係わる粘着層形
成前の連結回路基板を示す平面図である。FIG. 6 is a plan view showing a connection circuit board before forming an adhesive layer according to the method for manufacturing a circuit board of the present invention.
【図７】本発明の回路基板の製造方法に係わる粘着層お
よび第１の剥離紙付き連結回路基板を示す平面図であ
る。FIG. 7 is a plan view showing an adhesive layer and a first connection circuit board with release paper according to the method for manufacturing a circuit board of the present invention.
【図８】本発明の回路基板の製造方法に係わる粘着層形
成後の連結回路基板を示す平面図である。FIG. 8 is a plan view showing a connection circuit board after forming an adhesive layer according to the method for manufacturing a circuit board of the present invention.
【図９】本発明の回路基板の製造方法によって得られる
回路基板を示す平面図である。FIG. 9 is a plan view showing a circuit board obtained by the method for manufacturing a circuit board of the present invention.
【図１０】本発明に係わる液晶表示装置の平面図であ
る。FIG. 10 is a plan view of a liquid crystal display device according to the present invention.
【図１１】図１０のＹ−Ｙ線における断面図である。11 is a cross-sectional view taken along the line YY of FIG.
【図１２】異方性導電接着剤積層体の断面図である。FIG. 12 is a cross-sectional view of an anisotropic conductive adhesive laminate.
【図１３】本発明の液晶表示装置の製造方法に係わる異
方性導電接着剤層形成後の連結回路基板を示す平面図で
ある。FIG. 13 is a plan view showing a connection circuit board after formation of an anisotropic conductive adhesive layer according to the method of manufacturing a liquid crystal display device of the present invention.
【図１４】本発明の液晶表示装置の製造方法に係わる異
方性導電接着剤層、粘着層および第１の剥離紙付き連結
回路基板を示す平面図である。FIG. 14 is a plan view showing an anisotropic conductive adhesive layer, an adhesive layer, and a first connection circuit board with release paper according to the method of manufacturing a liquid crystal display device of the present invention.
【図１５】図１４のＺ−Ｚ線における断面図である。15 is a sectional view taken along line ZZ in FIG.
【図１６】本発明の液晶表示装置の製造方法に係わる異
方性導電接着剤層および粘着層付き回路基板を示す平面
図である。FIG. 16 is a plan view showing a circuit board with an anisotropic conductive adhesive layer and an adhesive layer according to the method for manufacturing a liquid crystal display device of the present invention.
１ 粘着層積層体
２ 第１の剥離紙
３ 粘着層
４ 第２の剥離紙
５ ＴＡＢフィルム（少なくとも電極を有するフィル
ム）
６ 回路基板
７ 連結回路基板
８ 電極端子
９ 連結基板
１０ Ｖ溝
１１ 異方性導電接着剤積層体
１２ ドライフィルム（異方性導電接着剤層）
１３ 液晶パネル
１４ ＬＳＩ
１５ 保護フィルム1 Adhesive Layer Laminate 2 First Release Paper 3 Adhesive Layer 4 Second Release Paper 5 TAB Film (Film Having At least Electrodes) 6 Circuit Board 7 Connection Circuit Board 8 Electrode Terminal 9 Connection Board 10 V Groove 11 Anisotropy Conductive adhesive laminate 12 Dry film (anisotropic conductive adhesive layer) 13 Liquid crystal panel 14 LSI 15 Protective film
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ Ｈ０５Ｋ 1/14 Ｈ０５Ｋ 1/14 Ｈ (56)参考文献 特開 平４−183767（ＪＰ，Ａ) 特開 平７−57802（ＪＰ，Ａ) 特開 平７−72493（ＪＰ，Ａ) 特開 平５−88196（ＪＰ，Ａ) 特開 平６−164115（ＪＰ，Ａ) 特開 平３−98020（ＪＰ，Ａ) 特開 平５−333358（ＪＰ，Ａ) 実開 昭60−41928（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) G02F 1/1345 ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 7 Identification symbol FI H05K 1/14 H05K 1/14 H (56) Reference JP-A-4-183767 (JP, A) JP-A-7-57802 ( JP, A) JP 7-72493 (JP, A) JP 5-88196 (JP, A) JP 6-164115 (JP, A) JP 3-98020 (JP, A) JP Hei 5-333358 (JP, A) Actual development Sho 60-41928 (JP, U) (58) Fields investigated (Int.Cl. 7 , DB name) G02F 1/1345
Claims (3)
電極を有するフィルムと、部品搭載部を有する細長の回
路基板とを、電気的に接続する液晶表示装置の製造方法
であって、各長辺同士を互いに平行にして横並びに配された複数の
回路基板における各隣接間に隙間を設け、かつこれら複
数の各回路基板の両短辺と連結基板とがそれぞれＶ溝を
介して連なって成る 連結回路基板に対して、長方形の第
１の剥離紙上に細長形状の粘着層を各回路基板の間隔に
対応して複数設け、かつ該第１の剥離紙の短手方向と該
粘着層の長手方向とが略平行に形成されている粘着層積
層体を用いて、前記粘着層が回路基板側になるようにし
た状態で前記第１の剥離紙が複数連なる該回路基板に跨
がってかつ粘着層が部品搭載部を避けるようにして、各
粘着層を所定位置に形成する工程と、 該粘着層付き連結回路基板を、各回路基板毎にブレイキ
ングして分割する工程と、 該粘着層付き回路基板と、前記少なくとも電極を有する
フィルムとを、それぞれの電極端子にて電気的に接続す
る工程とを有することを特徴とする液晶表示装置の製造
方法。1. A method of manufacturing a liquid crystal display device, comprising electrically connecting a film having at least a plurality of electrodes connected to a liquid crystal panel and an elongated circuit board having a component mounting portion. , The long sides are parallel to each other.
There should be a gap between each adjacent part on the circuit board, and
On both sides of each of the plurality of circuit boards and the connecting board respectively have V grooves.
For the connecting circuit board comprising continuous through a rectangular first
Elongate the adhesive layer on the release paper at the interval of each circuit board.
Correspondingly, a plurality of them are provided, and in the lateral direction of the first release paper and
Adhesive layer product in which the longitudinal direction of the adhesive layer is formed substantially parallel
Use a layered body so that the adhesive layer is on the circuit board side.
In a state where the first release paper extends over the circuit board having a plurality of lines and the adhesive layer avoids the component mounting portion.
Forming an adhesive layer on a predetermined position, the connecting circuit board with the adhesive layer, and the step of dividing by breaking each circuit board, and the circuit board with the adhesive layer, and said film having at least electrodes, method of manufacturing a liquid crystal display device characterized by a step of electrically connecting at respective electrode terminals.
電極を有するフィルムと、部品搭載部を有する細長の回
路基板とを、電気的に接続する液晶表示装置の製造方法
であって、各長辺同士を互いに平行にして横並びに配された複数の
回路基板における各隣接間に隙間を設け、かつこれら複
数の各回路基板の両短辺と連結基板とがそれぞれＶ溝を
介して連なって成る 連結回路基板に対して、長方形の第
１の剥離紙上に細長形状の粘着層を各回路基板の間隔に
対応して複数設け、かつ該第１の剥離紙の短手方向と該
粘着層の長手方向とが略平行に形成されている粘着層積
層体を用いて、前記粘着層が回路基板側になるようにし
た状態で前記第１の剥離紙が複数連なる該回路基板に跨
がってかつ粘着層が部品搭載部を避けるようにして、各
粘着層を所定位置に形成する工程と、 該粘着層付き連結回路基板を、各回路基板毎に分割する
工程と、 該粘着層付き回路基板に異方性導電接着剤層を形成する
工程と、該粘着層および該異方性導電接着剤層付き回路
基板と、前記少なくとも電極を有するフィルムとを、該
粘着層を介して接着固定する工程と、 該回路基板と、該少なくとも電極を有するフィルムと
を、該異方性導電接着剤層を加圧加熱して電気的に接続
する工程とを有することを特徴とする液晶表示装置の製
造方法。2. A method of manufacturing a liquid crystal display device, wherein a film having at least a plurality of electrodes connected to a liquid crystal panel and an elongated circuit board having a component mounting portion are electrically connected. , The long sides are parallel to each other.
There should be a gap between each adjacent part on the circuit board, and
On both sides of each of the plurality of circuit boards and the connecting board respectively have V grooves.
For the connecting circuit board comprising continuous through a rectangular first
Elongate the adhesive layer on the release paper at the interval of each circuit board.
Correspondingly, a plurality of them are provided, and in the lateral direction of the first release paper and
Adhesive layer product in which the longitudinal direction of the adhesive layer is formed substantially parallel
Use a layered body so that the adhesive layer is on the circuit board side.
In a state where the first release paper extends over the circuit board having a plurality of lines and the adhesive layer avoids the component mounting portion.
Forming an adhesive layer on a predetermined position, the connecting circuit board with the adhesive layer, and the step of dividing each circuit board, a step of forming an anisotropic conductive adhesive layer on the circuit board with the adhesive layer, A step of adhering and fixing the pressure-sensitive adhesive layer and the circuit board with the anisotropic conductive adhesive layer, and the film having at least the electrode through the pressure-sensitive adhesive layer; the circuit board; and a film having the at least electrode. And a step of heating the anisotropic conductive adhesive layer under pressure so as to electrically connect the anisotropic conductive adhesive layer, and a method for manufacturing a liquid crystal display device.
電極を有するフィルムと、部品搭載部を有する細長の回
路基板とを、電気的に接続する液晶表示装置の製造方法
であって、各長辺同士を互いに平行にして横並びに配された複数の
回路基板における各隣接間に隙間を設け、かつこれら複
数の各回路基板の両短辺と連結基板とがそれぞれＶ溝を
介して連なって成る 連結回路基板に、異方性導電接着剤
層を形成する工程と、 該異方性導電接着剤層付き連結回路基板に対して、長方
形の第１の剥離紙上に細長形状の粘着層を各回路基板の
間隔に対応して複数設け、かつ該第１の剥離紙の短手方
向と該粘着層の長手方向とが略平行に形成されている粘
着層積層体を用いて、前記粘着層が回路基板側になるよ
うにした状態で前記第１の剥離紙が複数連なる該回路基
板に跨がってかつ粘着層が部品搭載部を避けるようにし
て、各粘着層を所定位置に形成する工程と、 該異方性導電接着剤層および該粘着層付き連結回路基板
を、各回路基板毎に分割する工程と、 該異方性導電接着剤層および該粘着層付き回路基板と、
前記少なくとも電極を有するフィルムとを、該粘着層を
介して接着固定する工程と、 該回路基板と、該少なくとも電極を有するフィルムと
を、該異方性導電接着剤層を加圧加熱して電気的に接続
する工程とを有することを特徴とする液晶表示装置の製
造方法。3. A method of manufacturing a liquid crystal display device, wherein a film having at least a plurality of electrodes connected to a liquid crystal panel and an elongated circuit board having a component mounting portion are electrically connected. , The long sides are parallel to each other.
There should be a gap between each adjacent part on the circuit board, and
On both sides of each of the plurality of circuit boards and the connecting board respectively have V grooves.
The connection circuit board comprising continuous through the steps of forming an anisotropic conductive adhesive layer, for to the anisotropic conductive adhesive layer-provided connecting circuit board, rectangular
A strip-shaped adhesive layer on the first release paper
Providing a plurality corresponding to the intervals, and the short side of the first release paper
Direction and the longitudinal direction of the adhesive layer are substantially parallel to each other.
Using the adhesive layer laminate, the adhesive layer will be on the circuit board side.
In such a state, the first release paper straddles the circuit board having a plurality of lines and the adhesive layer avoids the component mounting portion.
Te, the adhesive layer and the step of forming a predetermined position, a step of dividing the anisotropic conductive adhesive layer and the adhesive layer-provided connecting circuit board, each circuit board, the anisotropic conductive adhesive layer And the circuit board with the adhesive layer,
The step of adhering and fixing the film having at least the electrode via the adhesive layer, the circuit board and the film having at least the electrode are electrically heated by pressurizing and heating the anisotropic conductive adhesive layer. And a step of electrically connecting the liquid crystal display device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001265191A JP3488218B2 (en) | 1995-11-17 | 2001-09-03 | Manufacturing method of liquid crystal display device |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7-299806 | 1995-11-17 | ||
| JP29980695 | 1995-11-17 | ||
| JP2001265191A JP3488218B2 (en) | 1995-11-17 | 2001-09-03 | Manufacturing method of liquid crystal display device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8039779A Division JPH09197427A (en) | 1995-11-17 | 1996-02-27 | Production of adhesive layer laminated body and circuit board, liquid crystal display device and its production |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002139742A JP2002139742A (en) | 2002-05-17 |
| JP3488218B2 true JP3488218B2 (en) | 2004-01-19 |
Family
ID=26562082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001265191A Expired - Fee Related JP3488218B2 (en) | 1995-11-17 | 2001-09-03 | Manufacturing method of liquid crystal display device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3488218B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100997000B1 (en) | 2006-08-29 | 2010-11-25 | 히다치 가세고교 가부시끼가이샤 | Anisotropic conductive tape and method of manufacturing it, connected structure and method of connecting circuit member by use of the tape |
| JP5782013B2 (en) * | 2012-11-15 | 2015-09-24 | 日本メクトロン株式会社 | Flexible printed circuit board bonding method |
-
2001
- 2001-09-03 JP JP2001265191A patent/JP3488218B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002139742A (en) | 2002-05-17 |
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