JP3470041B2 - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JP3470041B2 JP3470041B2 JP11821698A JP11821698A JP3470041B2 JP 3470041 B2 JP3470041 B2 JP 3470041B2 JP 11821698 A JP11821698 A JP 11821698A JP 11821698 A JP11821698 A JP 11821698A JP 3470041 B2 JP3470041 B2 JP 3470041B2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- wiring board
- integrated circuit
- lead
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【発明の詳細な説明】Detailed Description of the Invention
【０００１】[0001]
【発明の属する技術分野】本発明は、 半導体素子が収容
搭載される半導体素子収納用パッケージや、半導体素子
の他にコンデンサや抵抗体等の各種電子部品が搭載され
る混成集積回路基板等に適用される配線基板をヒートシ
ンクに取着し、該配線基板をヒートシンク周縁部に形成
された枠体と蓋体とから成る容器中に封入した混成集積
回路装置に関するもので、特に放熱性と高い接続信頼性
が要求される車載用電子制御装置に適用される高密度化
された小型の混成集積回路装置として好適なものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is applied to a semiconductor element accommodating package in which semiconductor elements are accommodated and mounted, a hybrid integrated circuit board in which various electronic components such as capacitors and resistors are mounted in addition to semiconductor elements. The present invention relates to a hybrid integrated circuit device in which a wiring board to be mounted is attached to a heat sink, and the wiring board is enclosed in a container composed of a frame body and a lid body formed in the peripheral portion of the heat sink. The present invention is suitable as a high-density, small-sized hybrid integrated circuit device applied to a vehicle-mounted electronic control device that requires high performance.
【０００２】[0002]
【従来の技術】従来より、混成集積回路装置は、半導体
素子収納用パッケージや複数の各種電子部品を搭載した
混成集積回路基板等から成る配線基板を、適宜、容器に
封入することにより構成されていた。2. Description of the Related Art Conventionally, a hybrid integrated circuit device is constructed by appropriately enclosing a wiring board, which is a package for storing semiconductor elements, a hybrid integrated circuit board on which a plurality of various electronic components are mounted, etc., in a container. It was
【０００３】かかる混成集積回路装置は、例えば、半導
体素子や各種電子部品から発生する熱を効率良く外部に
放熱するために、図５に一例を示すように、半導体素子
や各種電子部品を搭載（不図示）した配線基板２１の一
面にヒートシンク２２が取着されており、該ヒートシン
ク２２の周縁部に前記配線基板２１を囲むように接続端
子２３を一部埋設する等により支持した樹脂製枠体２４
が固着され、該樹脂製枠体２４の開口部を塞いで内部空
間を気密に保つために蓋体（不図示）が接合され、配線
基板２１が封入されて構成されている。In such a hybrid integrated circuit device, for example, in order to efficiently dissipate heat generated from semiconductor elements and various electronic components to the outside, semiconductor elements and various electronic components are mounted as shown in FIG. A heat sink 22 is attached to one surface of a wiring board 21 (not shown), and a resin frame body supported by partially burying a connection terminal 23 so as to surround the wiring board 21 in the peripheral portion of the heat sink 22. 24
Is fixed, a lid (not shown) is joined to close the opening of the resin frame 24 to keep the internal space airtight, and the wiring board 21 is sealed.
【０００４】前記配線基板２１は、配線基板２１の内部
配線回路に接続した導出端子を構成するボンディングパ
ッド２５、例えば、前記導出端子表面にＮｉメッキを施
し、その上にＡｕメッキを被覆したものや、更に、前記
Ａｕメッキ被覆層上に４２アロイやアルミニウム等から
成るパッドを半田等で接合したものと、樹脂製枠体２４
に支持された外部配線回路と接続するための接続端子２
３の一端とが、具体的には、直径が１００〜３００μｍ
程度のアルミニウム線材等から成るボンディングワイヤ
２６で電気的に接続されている。The wiring board 21 is a bonding pad 25 constituting a lead-out terminal connected to the internal wiring circuit of the wiring board 21, for example, a surface of the lead-out terminal which is plated with Ni and which is then coated with Au. Further, a pad made of 42 alloy, aluminum or the like is joined on the Au plated coating layer with solder or the like, and a resin frame 24
Connection terminal 2 for connecting to an external wiring circuit supported by
Specifically, one end of 3 has a diameter of 100 to 300 μm.
It is electrically connected by a bonding wire 26 made of aluminum wire or the like.
【０００５】ところが、前記従来の混成集積回路装置２
７では、稼働中の雰囲気温度の変化や混成集積回路装置
２７自体の発熱による温度変化等で、前記樹脂製枠体２
４が熱変形を起こし、例えば、配線基板２１の絶縁基体
として代表されるアルミナ（Ａｌ2 Ｏ3 ）はその熱膨張
率が７×１０-6／℃であり、一方、ヒートシンク２２と
して代表されるアルミニウム材では２５×１０-6／℃で
あり、更に、樹脂製枠体２４として代表される強化用繊
維を混入したＰＢＴ樹脂複合材の熱膨張率は５０×１０
-6／℃とそれぞれ大きく異なっており、従って、前記樹
脂製枠体の伸縮は配線基板のそれより極めて大きくな
り、前記ボンディングワイヤには大きな歪みが発生する
ことになる。However, the conventional hybrid integrated circuit device 2 described above is used.
In No. 7, due to a change in ambient temperature during operation, a temperature change due to heat generation of the hybrid integrated circuit device 27 itself, and the like, the resin frame 2
4 causes thermal deformation, and for example, alumina (Al 2 O 3 ) typified by the insulating substrate of the wiring board 21 has a coefficient of thermal expansion of 7 × 10 −6 / ° C., while typified by the heat sink 22. The aluminum material has a thermal expansion coefficient of 25 × 10 −6 / ° C., and the thermal expansion coefficient of the PBT resin composite material mixed with the reinforcing fibers typified by the resin frame 24 is 50 × 10 6.
-6 / ° C., respectively, so that the expansion and contraction of the resin frame body becomes much larger than that of the wiring board, and a large strain is generated in the bonding wire.
【０００６】その結果、前記歪みが繰り返し負荷される
環境下では、樹脂製枠体２４に支持された接続端子２３
と配線基板２１のボンディングパッド２５とを接続する
ボンディングワイヤ２６が断線したり、その接続部より
剥離したりする等の恐れがあった。As a result, under the environment where the strain is repeatedly applied, the connection terminal 23 supported by the resin frame 24 is provided.
There is a risk that the bonding wire 26 connecting the wiring pad 21 and the bonding pad 25 of the wiring board 21 may be broken or peeled off from the connecting portion.
【０００７】従って、特に、稼働雰囲気が高温に成り易
く、温度変化が激しい環境下に曝される車載用電子制御
装置に適用される混成集積回路装置としては、高い接続
信頼性を確保することが非常に困難であるという問題が
あった。Therefore, in particular, as a hybrid integrated circuit device applied to an on-vehicle electronic control device which is exposed to an environment in which the operating atmosphere is likely to reach a high temperature and whose temperature changes drastically, it is possible to secure high connection reliability. There was the problem of being very difficult.
【０００８】そこで、前記樹脂製枠体の熱変形を抑制し
てかかる問題を解消するために、配線基板を囲む樹脂製
枠体が、所定方向に配向した強化用繊維と、該強化用繊
維の配向方向を変更するためのじゃま板とを備えて構成
された混成集積回路装置が提案されている（特開平１−
３９０４９号公報参照）。Therefore, in order to suppress such a problem by suppressing thermal deformation of the resin frame body, the resin frame body surrounding the wiring board has reinforcing fibers oriented in a predetermined direction, and There has been proposed a hybrid integrated circuit device which is provided with a baffle for changing the orientation direction (Japanese Patent Laid-Open No. HEI1-
39049).
【０００９】[0009]
【発明が解決しようとする課題】前記提案のように強化
用繊維が混入され、更に、強化用繊維の配向方向を変更
するためのじゃま板が埋設された樹脂製枠体を用いるも
のでは、前記じゃま板付近だけや、あるいは混成集積回
路装置内に封入された配線基板の外形形状が対角線でそ
の長さが６０ｍｍ未満の比較的、小型のものでは十分に
熱変形を抑制することが可能であるか、あるいはさほど
問題とはならない。As described above, in the case of using the resin frame body in which the reinforcing fibers are mixed and further the baffle plate for changing the orientation direction of the reinforcing fibers is embedded, It is possible to sufficiently suppress thermal deformation only in the vicinity of the baffle plate or in a relatively small-sized one in which the outer shape of the wiring board enclosed in the hybrid integrated circuit device is diagonal and its length is less than 60 mm. Or, it doesn't really matter.
【００１０】しかしながら、配線基板の外形形状が対角
線でその長さが６０ｍｍ以上となると、ボンディングワ
イヤの破断あるいは接続部からの剥離の原因となる樹脂
製枠体に支持された接続端子部の変位は、ヒートシンク
自体のかなり大きな熱膨張と相まって樹脂製枠体全体の
伸縮に起因することから、根本的な解決策とはならず、
前記導出端子と接続端子の電気的な接続信頼性が得られ
ず、その上、ボンディングワイヤで接続するために配線
基板に設けた導出端子部が占める表面積は、該導出端子
部を含む配線基板面の表面積の１０％にも及び、配線基
板の小型高密度化という点で制約を受けるという課題が
あった。However, when the outer shape of the wiring board is a diagonal line and the length thereof is 60 mm or more, the displacement of the connection terminal portion supported by the resin frame body which causes breakage of the bonding wire or separation from the connection portion occurs. Since it is caused by the expansion and contraction of the entire resin frame together with the considerably large thermal expansion of the heat sink itself, it is not a fundamental solution,
The electrical connection reliability between the lead-out terminal and the connection terminal is not obtained, and moreover, the surface area occupied by the lead-out terminal portion provided on the wiring board for connecting with the bonding wire is the surface of the wiring board including the lead-out terminal portion. The surface area of the wiring board is as large as 10%, and there is a problem that the wiring board is limited in size and density.
【００１１】[0011]
【発明の目的】本発明は、前記課題に鑑み成されたもの
で、その目的は、対角線でその長さが６０ｍｍ以上の外
形形状を有する配線基板を封入した混成集積回路装置と
して、稼働雰囲気が高温に成り易く、温度変化が激しい
状況が繰り返し長期間に及ぶような車載環境下でも、配
線基板の導出端子と外部配線回路とを接続するための接
続端子との接続信頼性に何ら影響を及ぼさず、その上、
高い放熱性を有する車載用電子制御装置に好適な混成集
積回路装置を提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and an object thereof is to provide a hybrid integrated circuit device in which a wiring board having an outer shape with a diagonal length of 60 mm or more is enclosed, and an operating atmosphere is Even in an in-vehicle environment where the temperature easily changes and the temperature changes repeatedly for a long period of time, there is no effect on the connection reliability between the lead-out terminal of the wiring board and the connection terminal for connecting the external wiring circuit. No, on top of that,
An object of the present invention is to provide a hybrid integrated circuit device having a high heat dissipation property and suitable for an on-vehicle electronic control device.
【００１２】[0012]
【課題を解決するための手段】本発明者等は、前記課題
を解決するために鋭意検討した結果、配線基板の内部配
線と接続した導出端子とヒートシンクの表面に絶縁体を
介して設けた外部配線回路に接続する接続端子とを、ボ
ンディングワイヤを用いずに電気的に接続する等の手段
を種々検討した結果、配線基板の導出端子をヒートシン
クとの取着面側に設けると共に、該導出端子の位置と対
応させて外部配線回路に接続する接続端子をヒートシン
ク表面に設け、配線基板をヒートシンクに取着一体化す
ると同時に、直接、前記導出端子と接続端子とを電気的
に接続できれば、配線基板と枠体、及びヒートシンクと
の熱膨張差の影響を低減でき、配線基板も小型高密度化
できることを知見し、本発明に至った。Means for Solving the Problems The inventors of the present invention have made earnest studies to solve the above-mentioned problems, and as a result, derived terminals connected to internal wiring of a wiring board and an external device provided on the surface of a heat sink via an insulator. As a result of various studies on means for electrically connecting a connection terminal to be connected to a wiring circuit without using a bonding wire, the lead-out terminal of the wiring board is provided on the attachment surface side of the heat sink and the lead-out terminal is provided. If a connection terminal for connecting to an external wiring circuit is provided on the heat sink surface in correspondence with the position of, and the wiring board is attached to and integrated with the heat sink and at the same time the lead-out terminal and the connection terminal can be directly electrically connected, the wiring board. The inventors have found that the influence of the difference in thermal expansion between the frame body and the heat sink can be reduced, and the wiring board can be made compact and high density, and the present invention has been accomplished.
【００１３】即ち、本発明の混成集積回路装置は、ヒー
トシンクに取着した対角線が６０ｍｍ以上の長さを有す
る配線基板の導出端子が、配線基板のヒートシンクとの
取着面側の中央部で、直径３０ｍｍの円内に配設され、
該導出端子をヒートシンク表面に絶縁体を介して形成し
た外部配線回路接続用の接続端子に、直接、電気的に接
続されると共に、前記ヒートシンクの周縁部に形成した
枠体の開口部を蓋体で封着したことを特徴とするもので
ある。That is, in the hybrid integrated circuit device of the present invention, the lead-out terminal of the wiring board having a diagonal length of 60 mm or more attached to the heat sink has a central portion on the attachment surface side of the wiring board to the heat sink. Placed in a circle with a diameter of 30 mm,
The lead-out terminal is directly and electrically connected to a connection terminal for connecting an external wiring circuit formed on the surface of the heat sink via an insulator, and the opening of the frame formed on the peripheral edge of the heat sink is covered. It is characterized by being sealed in.
【００１４】特に、本発明の混成集積回路装置では、前
記導出端子が、配線基板のヒートシンクとの取着面側に
ろう接等により接合した接続ピンで構成され、かつヒー
トシンク側に設けた前記外部配線回路接続用の接続端子
が、前記接続ピンを挿嵌して電気的に接続されるコネク
タであることが最も望ましいものである。In particular, in the hybrid integrated circuit device of the present invention, the lead-out terminal is composed of a connection pin joined to the heat sink attachment surface side of the wiring board by brazing or the like, and the external terminal provided on the heat sink side. It is most desirable that the connection terminal for connecting the wiring circuit is a connector into which the connection pin is inserted and electrically connected.
【００１５】[0015]
【作用】本発明の混成集積回路装置によれば、対角線が
６０ｍｍ以上の長さの外形形状を有する配線基板の導出
端子を配線基板のヒートシンクとの取着面側の中央部
に、直径３０ｍｍの範囲内に配設し、該導出端子をヒー
トシンク表面に絶縁体を介して形成した外部配線回路接
続用の接続端子に、直接、電気的に接続したことから、
前記導出端子と接続端子間の熱膨張差による変位差が、
極めて小さく成ると共に、配線基板の導出端子をヒート
シンクとの取着面側に設けることから、従来、配線基板
に設けていたボンディングワイヤを接続するための導出
端子部が不要となる。According to the hybrid integrated circuit device of the present invention, the lead-out terminal of the wiring board having an outer shape with a diagonal length of 60 mm or more has a diameter of 30 mm at the central portion on the attachment surface side of the wiring board to the heat sink. Since it is arranged within the range and the lead-out terminal is directly and electrically connected to the connection terminal for external wiring circuit connection formed on the heat sink surface through the insulator,
The displacement difference due to the difference in thermal expansion between the lead-out terminal and the connection terminal is
In addition to being extremely small, since the lead-out terminal of the wiring board is provided on the attachment surface side of the heat sink, the lead-out terminal portion for connecting the bonding wire, which has been conventionally provided on the wiring board, is unnecessary.
【００１６】従って、稼働雰囲気が高温になり、温度変
化が激しい車載環境においても、前記配線基板の導出端
子と外部配線回路に接続する接続端子との接続部は、配
線基板と枠体、又はヒートシンクとの熱膨張あるいは熱
収縮の差による影響をほとんど受けず、前述のような雰
囲気下において長期間稼働させても接続部より剥離した
りすることがなく電気的断線が回避され、高い接続信頼
性が得られると共に、配線基板の小型高密度化が実現で
き、車載用電子制御装置に好適な高密度化された小型の
混成集積回路装置が得られることになる。Therefore, even in an in-vehicle environment where the operating atmosphere becomes hot and the temperature changes drastically, the connecting portion between the lead-out terminal of the wiring board and the connecting terminal for connecting to the external wiring circuit is the wiring board and the frame or the heat sink. Almost unaffected by the difference in thermal expansion or contraction with the above, even if it is operated for a long time in the above-mentioned atmosphere, it does not peel off from the connection part, electrical disconnection is avoided, and high connection reliability In addition, the wiring board can be made compact and high-density, and a high-density small hybrid integrated circuit device suitable for an on-vehicle electronic control device can be obtained.
【００１７】[0017]
【発明の実施の形態】以下、本発明の混成集積回路装置
を図面に基づき詳細に説明する。BEST MODE FOR CARRYING OUT THE INVENTION A hybrid integrated circuit device of the present invention will be described below in detail with reference to the drawings.
【００１８】図１は、本発明の混成集積回路装置の断面
図であり、図２は、図１の配線基板をヒートシンクとの
取着面側から見た平面図である。FIG. 1 is a cross-sectional view of the hybrid integrated circuit device of the present invention, and FIG. 2 is a plan view of the wiring board of FIG. 1 as viewed from the attachment surface side with a heat sink.
【００１９】図１及び図２において、１は、ヒートシン
ク２に取着した配線基板３と、ヒートシンク２の周縁部
に設けた配線基板３を囲む枠体４と、枠体４と配線基板
３の収納空間の開口部を塞ぐ蓋体５と、ヒートシンク２
に設けた外部配線回路接続用の接続端子６が配線基板３
の内部配線回路に接続した導出端子７に直接、電気的に
接続された混成集積回路装置である。In FIGS. 1 and 2, reference numeral 1 denotes a wiring board 3 attached to the heat sink 2, a frame body 4 surrounding the wiring board 3 provided on the periphery of the heat sink 2, a frame body 4 and the wiring board 3. A lid 5 for closing the opening of the storage space and a heat sink 2
The connection terminal 6 for connecting the external wiring circuit provided on the wiring board 3
Is a hybrid integrated circuit device electrically connected directly to the lead-out terminal 7 connected to the internal wiring circuit.
【００２０】本発明の配線基板３は、対角線８が６０ｍ
ｍ以上の長さを有する外形形状を成すものであり、配線
基板３のヒートシンク２との取着面側には、導出端子７
がその中央部に直径３０ｍｍの円９内に配設されてお
り、他方、ヒートシンク２の表面には、絶縁体１０を介
して外部配線回路接続用の接続端子６が形成されてお
り、配線基板３をヒートシンク２とを接着剤１３を介し
て取着する際に、前記導出端子７と接続端子６が導電性
樹脂１４で電気的に接続され、外部配線回路接続用の接
続端子６は、ヒートシンク２の側面に引き出されてい
る。In the wiring board 3 of the present invention, the diagonal line 8 is 60 m.
The lead terminal 7 has an outer shape having a length of m or more, and is provided on the side of the surface of the wiring board 3 where the heat sink 2 is attached.
Is arranged in a circle 9 having a diameter of 30 mm at the center thereof, and on the other hand, a connection terminal 6 for connecting an external wiring circuit is formed on the surface of the heat sink 2 via an insulator 10. When attaching 3 to the heat sink 2 via the adhesive 13, the lead-out terminal 7 and the connecting terminal 6 are electrically connected by the conductive resin 14, and the connecting terminal 6 for external wiring circuit connection is the heat sink. It is pulled out to the side of 2.
【００２１】又、図３は、本発明の混成集積回路装置の
より望ましい形態を示す要部を拡大した断面図であり、
配線基板３のヒートシンク２への取着面側に設けた導出
端子が接続ピン１１で構成され、ヒートシンク２の表面
には、絶縁体１０で電気的に絶縁されたコネクタ１２が
形成されており、接続ピン１１をコネクタ１２に挿嵌し
て電気的に接続され、図２と同様にコネクタ１２は、外
部配線回路と電気的に接続するためにヒートシンク２の
側面に配線により引き出されている。FIG. 3 is an enlarged cross-sectional view of a main part showing a more preferable form of the hybrid integrated circuit device of the present invention.
The lead-out terminal provided on the attachment surface side of the wiring board 3 to the heat sink 2 is composed of the connection pin 11, and the connector 12 electrically insulated by the insulator 10 is formed on the surface of the heat sink 2. The connection pin 11 is inserted into the connector 12 to be electrically connected, and the connector 12 is drawn out to the side surface of the heat sink 2 by wiring in order to electrically connect to the external wiring circuit as in the case of FIG.
【００２２】本発明の混成集積回路装置における配線基
板３の対角線８の長さが６０ｍｍ未満では、前記熱膨張
あるいは熱収縮の差による熱変形はかなり小さなもので
あり、接続信頼性を損なうものではないが、前記対角線
８の長さが６０ｍｍ以上となると、混成集積回路装置１
を構成するヒートシンク２及び配線基板３、枠体４の間
の熱膨張あるいは熱収縮の差の影響は無視し得なくな
る。When the length of the diagonal line 8 of the wiring board 3 in the hybrid integrated circuit device of the present invention is less than 60 mm, the thermal deformation due to the difference in the thermal expansion or the thermal contraction is considerably small and the connection reliability is not impaired. However, if the length of the diagonal line 8 is 60 mm or more, the hybrid integrated circuit device 1
The influence of the difference in thermal expansion or thermal contraction between the heat sink 2, the wiring board 3, and the frame body 4 that constitute the above cannot be ignored.
【００２３】従って、混成集積回路装置１に封入される
配線基板３の内部配線に接続した複数の導出端子７を、
配線基板３のヒートシンク２との取着面側の中央部以外
に設けたり、あるいは、導出端子７の配設範囲を前記中
央部の直径３０ｍｍの円外に設けたり、直径３０ｍｍの
円をはみ出したり、越えたりすると、前記中央部より最
外周部に位置する導出端子には極めて大きな熱膨張ある
いは熱収縮の差による歪みが作用し、車載環境の如く極
めて厳しい使用環境下では、短時間で接続信頼性がなく
なり、車載用電子制御装置には不適当となる。Therefore, the plurality of lead-out terminals 7 connected to the internal wiring of the wiring board 3 enclosed in the hybrid integrated circuit device 1 are
The wiring board 3 may be provided at a portion other than the central portion on the side where the heat sink 2 is attached to the heat sink 2, or the arrangement range of the lead-out terminals 7 may be provided outside the circle having a diameter of 30 mm at the central portion, or a circle having a diameter of 30 mm may be projected. If it exceeds, distortion will occur due to extremely large thermal expansion or thermal contraction at the lead-out terminals located at the outermost periphery from the central part, and connection reliability will be reduced in a short time under extremely severe operating environments such as in-vehicle environments. It becomes unsuitable for in-vehicle electronic control devices.
【００２４】本発明の混成集積回路装置において、適用
されるヒートシンクとしては、特に限定されるものでは
ないが、熱膨張率が２３×１０-6／℃であるアルミニウ
ム（Ａｌ）や同じく１７×１０-6／℃である銅（Ｃｕ）
等の金属製、あるいは熱膨張率が５×１０-6／℃である
窒化アルミニウム（ＡｌＮ）や同じく４×１０-6／℃で
ある炭化珪素（ＳｉＣ）等のセラミック製等が挙げられ
る。In the hybrid integrated circuit device of the present invention, the heat sink to be applied is not particularly limited, but aluminum (Al) having a coefficient of thermal expansion of 23 × 10 −6 / ° C. and 17 × 10 7 are also used. -6 / ° C copper (Cu)
And the like, or aluminum nitride (AlN) having a thermal expansion coefficient of 5 × 10 −6 / ° C. and ceramics such as silicon carbide (SiC) having a thermal expansion coefficient of 4 × 10 −6 / ° C., and the like.
【００２５】かかるヒートシンクは、金属製ではダイキ
ャスト等の鋳造方法で成形され、セラミック製では押出
成形法等で製造され、通常、冷却効果を高めるためにフ
ィンが形成されているが、それ以外に、表面に微小な突
起を形成し、それを核として冷却媒体を沸騰させて冷却
効果を高めたものや、ヒートシンク中にヒートパイプを
形成して強制冷却する構造も可能である。Such a heat sink is made of metal by a casting method such as die casting and is made of a ceramic by an extrusion molding method. Usually, fins are formed to enhance the cooling effect. It is also possible to use a structure in which minute projections are formed on the surface and the cooling medium is boiled with the projections as nuclei to enhance the cooling effect, or a structure in which a heat pipe is formed in the heat sink for forced cooling.
【００２６】一方、本発明の混成集積回路装置に適用さ
れる配線基板としては、半導体素子が収容搭載される半
導体素子収納用パッケージや、半導体素子の他にコンデ
ンサや抵抗体等の各種電子部品が搭載される混成集積回
路基板等に用いられるアルミナ（Ａｌ2 Ｏ3 ）を主成分
とする絶縁基体から成るものは勿論、窒化アルミニウム
（ＡｌＮ）や窒化珪素（Ｓｉ3 Ｎ4 ）、ムライト（３Ａ
ｌ2 Ｏ3 ・２ＳｉＯ2）、ガラスセラミックス等を主成
分とする各種絶縁基体に適用可能である。On the other hand, as a wiring board applied to the hybrid integrated circuit device of the present invention, a semiconductor element housing package in which a semiconductor element is housed and mounted, and various electronic parts such as a capacitor and a resistor in addition to the semiconductor element are used. Not only those made of an insulating base material containing alumina (Al 2 O 3 ) as a main component used for a hybrid integrated circuit board to be mounted, but also aluminum nitride (AlN), silicon nitride (Si 3 N 4 ) and mullite (3A).
The present invention can be applied to various insulating substrates mainly composed of 1 2 O 3 · 2SiO 2 ) and glass ceramics.
【００２７】又、前記配線基板の導出端子は、該配線基
板に設けたスルーホールの表面露出部、あるいは表面配
線パターンに設けたメタライズパッド部にニッケル（Ｎ
ｉ）や金（Ａｕ）、銅（Ｃｕ）のメッキを被覆したも
の、又は、銀（Ａｇ）や金（Ａｕ）のペーストを塗布し
たもの等が適用可能であり、稼働環境下においても確実
に接続されて電気的な接続信頼性という点からは、ピン
を接続固着して後述するコネクタに挿嵌するものが最も
好ましい。Further, the lead-out terminal of the wiring board is made of nickel (N) on the surface exposed portion of the through hole provided on the wiring board or the metallized pad portion provided on the surface wiring pattern.
i), gold (Au), copper (Cu) plating, or silver (Ag) or gold (Au) paste can be applied. From the viewpoint of connection and electrical connection reliability, it is most preferable that the pins are fixedly connected and inserted into the connector described later.
【００２８】又、前記導出端子は、複数個が３０ｍｍの
円内に形成されるが、配線基板とヒートシンクの寸法公
差、及び実装配線基板の質量による接着剤である導電性
樹脂の変形を考慮すると、各導出端子相互の間隔は、１
ｍｍ以上離して３０ｍｍの円内に収まるように配設する
ことがより望ましいものである。A plurality of the lead-out terminals are formed within a circle of 30 mm, but considering the dimensional tolerances of the wiring board and the heat sink and the deformation of the conductive resin as the adhesive due to the mass of the mounting wiring board. , The distance between each lead-out terminal is 1
It is more desirable to arrange them so that they are separated by not less than mm and fit within a circle of 30 mm.
【００２９】次に、前記ヒートシンク側に設けた接続端
子は、例えば、銅又は銅を主成分とする公知の合金の表
面にニッケル（Ｎｉ）のメッキを被覆したものが一般的
に適用されるが、前述のように接続信頼性を考慮すると
前記接続ピンを挿嵌するコネクタであることが望まし
く、更に、絶縁体がヒートシンクを貫通してヒートシン
クの裏面に接続端子と電気的に接続したピンを配列した
ものも可能である。Next, the connection terminal provided on the heat sink side is generally made of, for example, copper or a known alloy containing copper as a main component, the surface of which is plated with nickel (Ni). As described above, in consideration of connection reliability, it is desirable that the connector is a connector into which the connection pin is inserted, and further, an insulator penetrates the heat sink and the pins electrically connected to the connection terminals are arranged on the back surface of the heat sink. What you have done is also possible.
【００３０】又、本発明において、枠体の材質は特に限
定されるものではなく、その熱膨張率が２５×１０-6／
℃以下であればいずれも適用可能であるが、強化繊維を
混合した樹脂複合材は勿論、枠体を単体で構成する場合
には、アルミニウム（Ａｌ）や銅（Ｃｕ）等の金属、あ
るいは窒化アルミニウム（ＡｌＮ）や炭化珪素（Ｓｉ
Ｃ）、アルミナ（Ａｌ2 Ｏ3 ）等のセラミック等が挙げ
られる。Further, in the present invention, the material of the frame is not particularly limited, and its thermal expansion coefficient is 25 × 10 -6 /
Any of them can be applied as long as the temperature is not higher than ℃, but when the frame body is composed of a single material such as a resin composite material in which reinforcing fibers are mixed, a metal such as aluminum (Al) or copper (Cu), or nitriding Aluminum (AlN) and silicon carbide (Si
C), ceramics such as alumina (Al 2 O 3 ) and the like.
【００３１】又、前記枠体を複数の材質の部材で構成す
る場合には、前記材料と熱膨張率は２５×１０-6／℃以
上、１００×１０-6／℃にも及ぶ公知のＰＰＳ樹脂やＰ
ＢＴ樹脂等や、該樹脂に強化用としてガラス繊維を添加
混合したりした複合材等を組み合わせて熱膨張率を調節
して用いること等も可能である。When the frame body is made of a plurality of materials, the material and the coefficient of thermal expansion are 25 × 10 −6 / ° C. or more, and 100 × 10 −6 / ° C. or more known PPS. Resin or P
It is also possible to use a BT resin or the like, or a composite material in which glass fibers are added and mixed for reinforcement, etc., in combination to adjust the coefficient of thermal expansion.
【００３２】特に、経済性と放熱性を考慮した場合、枠
体としてはヒートシンクと一体で形成することが望まし
く、この場合には、例えば、枠体及びヒートシンクの材
質はアルミニウム合金が最適となるが、個別に作製して
周知の接着剤やネジ等により固着しても良く、枠体４自
体はヒートシンク２と接合可能でその強度及び気密性を
損なわなければ、軽量化と強度確保のためにリブ構造
や、放熱性のためにフィンを設けた構造、あるいは金属
線等で補強した樹脂で構成する等、その形状形態を限定
するものではない。Particularly, in consideration of economy and heat dissipation, it is desirable that the frame is integrally formed with the heat sink. In this case, for example, aluminum alloy is most suitable as the material of the frame and the heat sink. , May be individually manufactured and fixed by a well-known adhesive, screw, or the like, and the frame body 4 itself can be joined to the heat sink 2 and if strength and airtightness are not impaired, ribs are provided for weight saving and strength securing. The shape and form are not limited, such as a structure, a structure in which fins are provided for heat dissipation, or a resin reinforced with a metal wire or the like.
【００３３】又、前記樹脂製枠体の開口部を塞ぐ蓋体に
は、内部を気密に封入するために公知のＰＰＳ樹脂やＰ
ＢＴ樹脂、あるいはアルミニウム合金等の金属が適用で
きる他、車載環境を考慮すると高温時に内圧が高くなる
ために、内部の気体は出入り可能だが、水分の侵入を防
ぐことが可能なゴアテックス等の素材を用いたブリーザ
ーを取着することも可能である。The lid for closing the opening of the resin frame is a known PPS resin or P for airtightly sealing the inside.
BT resin or metal such as aluminum alloy can be applied. In consideration of the vehicle environment, the internal pressure becomes high at high temperature, so the gas inside can go in and out, but the material such as GORE-TEX that can prevent the ingress of water. It is also possible to attach a breather using.
【００３４】次いで、前記導出端子と接続端子との導電
性接着剤としては、銀や金のペーストの他、樹脂製の各
種導電性接着剤が用いられ、前記配線基板とヒートシン
クとの接着剤は、シリコーン系の接着剤が一般的だが、
硬化阻害の恐れがない場合には、前記導電性接着剤の補
強を図るため、接続端子部のみエポキシ系やポリイミド
系の樹脂を用いることが可能となる。Next, as the conductive adhesive between the lead-out terminal and the connecting terminal, various conductive adhesives made of resin are used in addition to the paste of silver or gold, and the adhesive between the wiring board and the heat sink is used. , Silicone adhesives are common,
If there is no risk of curing inhibition, it is possible to use epoxy-based or polyimide-based resin only for the connection terminal portion in order to reinforce the conductive adhesive.
【００３５】更に、ヒートシンクに設ける接続端子を絶
縁する絶縁体としては、強化繊維を混合した樹脂複合材
が一般的であるが、樹脂単体あるいは碍子等を用いても
良い。Further, as the insulator for insulating the connection terminals provided on the heat sink, a resin composite material mixed with reinforcing fibers is generally used, but a resin alone or an insulator may be used.
【００３６】図４は、本発明の混成集積回路装置の一実
施例において、前述したようにヒートシンク２に設けた
外部配線回路接続用の接続端子６を、ヒートシンク２の
側面ではなく底面に引き出したもので、絶縁体１０は、
ヒートシンク２を貫通して露出した状態を示すものであ
り、本発明では、更に、前記側面と底面とを組み合わせ
て接続端子６を電気的に引き出しても何ら問題はない。
尚、図中の他の符号は、図１と同一内容であり、説明を
省略する。In FIG. 4, in one embodiment of the hybrid integrated circuit device of the present invention, the connection terminal 6 for connecting the external wiring circuit provided on the heat sink 2 as described above is drawn out not to the side surface but to the bottom surface. Insulator 10 is
It shows a state where the heat sink 2 is penetrated and exposed. In the present invention, there is no problem even if the connection terminal 6 is electrically drawn out by combining the side surface and the bottom surface.
The other reference numerals in the figure have the same contents as those in FIG.
【００３７】[0037]
【実施例】次に、本発明の混成集積回路装置を以下に詳
述するようにして評価した。EXAMPLES Next, the hybrid integrated circuit device of the present invention was evaluated as described in detail below.
【００３８】先ず、配線基板の絶縁基体を作製するに際
し、Ａｌ2 Ｏ3 、ＳｉＯ2 、ＭｇＯ、ＣａＯ等の原料粉
末に公知の有機バインダーと可塑剤、溶剤を適量添加し
て混合し、泥漿を調製した後、該泥漿を周知のドクター
ブレード法やカレンダーロール法等のテープ成形技術に
より厚さ約３００μｍのセラミックグリーンシートを成
形する。First, when manufacturing an insulating substrate for a wiring board, a known organic binder, a plasticizer, and a solvent are added in appropriate amounts to raw material powders such as Al 2 O 3 , SiO 2 , MgO, and CaO, and the mixture is mixed. After the preparation, the slurry is molded into a ceramic green sheet having a thickness of about 300 μm by a well-known tape molding technique such as a doctor blade method or a calendar roll method.
【００３９】次いで、前記セラミックグリーンシートの
所定位置に打ち抜き加工を施してスルーホールを形成し
た。Then, a punching process was performed at a predetermined position of the ceramic green sheet to form a through hole.
【００４０】その後、Ｗ、Ｍｏ等の高融点金属を主成分
とする粉末に、アルミナ粉末を適量添加し、公知の有機
バインダーと可塑剤、溶剤を添加混合して調製した金属
ペーストを、前記セラミックグリーンシートに所望のパ
ターンでスクリーン印刷すると共に、スルーホール部分
にも、前記スクリーン印刷あるいは圧力充填法により前
記金属ペーストを充填した。Thereafter, an appropriate amount of alumina powder is added to a powder containing a high melting point metal such as W or Mo, and a known organic binder, a plasticizer, and a solvent are added and mixed to prepare a metal paste. The green sheet was screen-printed in a desired pattern, and the through holes were also filled with the metal paste by the screen printing or pressure filling method.
【００４１】次に、前記グリーンシートを６枚積層し、
これを水素（Ｈ2 ）と窒素（Ｎ2 ）の混合ガスから成る
還元性雰囲気中、約１６００℃の温度で焼成一体化した
後、絶縁基体の表層に設けた配線パターンに金、銅等の
めっきを施し、その上に銅ペーストを印刷塗布して約１
０００℃の温度で焼成し、６層から成る厚さ約１．５ｍ
ｍ、縦４０〜１００ｍｍ、横４０〜１００ｍｍで、全導
出端子を囲む円の直径が１６〜３６ｍｍであり、前記円
の中心を配線基板の中心から順次、離した各種配線基板
を作製した。Next, six green sheets are laminated,
This is baked and integrated at a temperature of about 1600 ° C. in a reducing atmosphere consisting of a mixed gas of hydrogen (H 2 ) and nitrogen (N 2 ), and then gold, copper or the like is formed on the wiring pattern provided on the surface layer of the insulating substrate. Approximately 1 after applying plating and printing and applying copper paste on it
Calcination at a temperature of 000 ℃, 6 layers thick about 1.5m
m, length 40 to 100 mm, width 40 to 100 mm, the diameter of the circle surrounding all the lead terminals was 16 to 36 mm, and various wiring boards were produced in which the center of the circle was sequentially separated from the center of the wiring board.
【００４２】一方、ヒートシンクとしては、熱膨張率が
２３×１０-6／℃であるダイキャスト用アルミニウム合
金を用い、所定の形状にダイキャスト法により成形し、
配線基板の導出端子と対応する位置に組み込んだ樹脂か
ら成る絶縁体の所定位置に銀ペーストをディスペンサで
供給して接続端子を形成し、該接続端子には導電性樹脂
を介して前記導出端子を、又、配線基板を取着するヒー
トシンクの他の面には、熱硬化性のシリコーン系接着剤
を塗布して位置合わせし、配線基板を圧着接合した。On the other hand, as the heat sink, an aluminum alloy for die casting having a coefficient of thermal expansion of 23 × 10 −6 / ° C. is used, which is formed into a predetermined shape by the die casting method,
A silver paste is supplied by a dispenser to a predetermined position of an insulator made of resin incorporated in a position corresponding to the lead-out terminal of the wiring board to form a connection terminal, and the lead-out terminal is formed on the connection terminal through a conductive resin. Further, a thermosetting silicone adhesive was applied to the other surface of the heat sink to which the wiring board is attached for alignment, and the wiring board was pressure-bonded.
【００４３】次いで、前記ヒートシンクと枠体で構成さ
れる配線基板収納用空間の開口部に、板金加工により作
製したアルミニウム合金製の蓋体を接着剤で取り付け、
評価用の混成集積回路装置とした。Next, a lid made of an aluminum alloy produced by sheet metal working is attached to the opening of the wiring board housing space composed of the heat sink and the frame with an adhesive,
A hybrid integrated circuit device for evaluation was used.
【００４４】又、図５に示すような従来のヒートシンク
に取着された配線基板のボンディングパッドと枠体で支
持された接続端子とを直径３００μｍのアルミニウム線
で接続したものを比較例とした。A comparative example is shown in which a bonding pad of a wiring board attached to a conventional heat sink as shown in FIG. 5 and a connection terminal supported by a frame are connected by an aluminum wire having a diameter of 300 μm.
【００４５】かくして得られた評価用の混成集積回路装
置を用いて、温度範囲が−４０℃〜１２５℃で、１サイ
クル１時間の気槽温度サイクル試験を行い、５００、１
０００、１５００、２０００、２５００、３０００サイ
クルでの接続状態を、電気的導通の有無で測定して接続
信頼性を評価した。Using the thus obtained hybrid integrated circuit device for evaluation, a gas tank temperature cycle test was conducted at a temperature range of −40 ° C. to 125 ° C. for 1 cycle and 1 hour, and 500, 1
The connection state in 000, 1500, 2000, 2500, 3000 cycles was measured with or without electrical continuity to evaluate the connection reliability.
【００４６】尚、導出端子を囲む円の位置は、配線基板
の中心からの該円の中心の距離で示した。The position of the circle surrounding the lead-out terminal is indicated by the distance from the center of the wiring board to the center of the circle.
【００４７】[0047]
【表１】 [Table 1]
【００４８】以上の結果、比較例の試料番号２５では、
２５００サイクルで導通不良となっており、樹脂製枠体
の接続端子側で接合部からボンディングワイヤが断線し
ていた。As a result of the above, in the sample No. 25 of the comparative example,
Conduction failure occurred after 2500 cycles, and the bonding wire was broken from the joint on the connection terminal side of the resin frame body.
【００４９】又、本発明の請求範囲外である試料番号
１、１４、１５、１６、１８、１９、２１、２２では、
いずれも３０００サイクルまでで導通不良となってお
り、接続端子と導電性接着剤との界面で断線したもので
あった。Further, in the sample numbers 1, 14, 15, 16, 18, 19, 21, 22 which are outside the scope of the present invention,
All had poor continuity up to 3000 cycles and were broken at the interface between the connection terminal and the conductive adhesive.
【００５０】それらに対して、本発明ではいずれの混成
集積回路装置でも、３０００サイクルにおいても電気的
導通を有することが確認できた。On the contrary, in the present invention, it was confirmed that any of the hybrid integrated circuit devices had electrical continuity even after 3000 cycles.
【００５１】尚、本発明は前述の実施例に限定されるも
のではなく、本発明の要旨を逸脱しない範囲であれば種
々の変更が可能である。The present invention is not limited to the above-mentioned embodiments, but various modifications can be made without departing from the gist of the present invention.
【００５２】[0052]
【発明の効果】叙上の如く、本発明の混成集積回路装置
によれば、ヒートシンクに取着した対角線が６０ｍｍ以
上の長さを有する配線基板の導出端子を、配線基板のヒ
ートシンクとの取着面側の中央部で、直径３０ｍｍの円
内に配設し、該導出端子をヒートシンク表面に絶縁体を
介して形成した外部配線回路接続用の接続端子に、直
接、電気的に接続して形成したことから、稼働雰囲気が
高温に成り易く、温度変化が激しい使用条件下でも、前
記導出端子と接続端子間の熱膨張あるいは熱収縮による
変位差は極めて小さく成ると共に、配線基板の導出端子
をヒートシンクとの取着面側に設けることから、従来、
配線基板に設けていたボンディングワイヤを接続するた
めの導出端子部が不要となる。As described above, according to the hybrid integrated circuit device of the present invention, the lead-out terminal of the wiring board having the diagonal line of 60 mm or more attached to the heat sink is attached to the heat sink of the wiring board. Formed by directly and electrically connecting the lead-out terminals to a connection terminal for external wiring circuit connection, which is arranged in a circle with a diameter of 30 mm in the central portion on the surface side and formed on the heat sink surface via an insulator. Therefore, even if the operating atmosphere is apt to reach a high temperature and the temperature changes drastically, the displacement difference due to thermal expansion or contraction between the lead-out terminal and the connection terminal becomes extremely small, and the lead-out terminal of the wiring board is heat-sinked. Since it is provided on the attachment surface side with
The lead-out terminal portion for connecting the bonding wire provided on the wiring board becomes unnecessary.
【００５３】従って、前記のような厳しい雰囲気下にお
いて長期間稼働しても、前記配線基板の導出端子と外部
配線回路に接続する接続端子との接続部は、配線基板と
枠体、又はヒートシンクとの熱膨張あるいは熱収縮の差
による影響をほとんど受けず、該接続部が剥離するとい
う電気的断線が回避され、高い接続信頼性が得られると
共に、小型高密度化を実現した混成集積回路装置が得ら
れる。Therefore, even if it is operated for a long time in the severe atmosphere as described above, the connection portion between the lead-out terminal of the wiring board and the connection terminal for connecting to the external wiring circuit is the wiring board and the frame or the heat sink. A hybrid integrated circuit device that is hardly affected by the difference in thermal expansion or thermal contraction, avoids an electrical disconnection in which the connection portion is peeled off, achieves high connection reliability, and realizes small size and high density. can get.
【図１】本発明の混成集積回路装置の一実施例を示す断
面図である。FIG. 1 is a sectional view showing an embodiment of a hybrid integrated circuit device of the present invention.
【図２】本発明の混成集積回路装置に封入される配線基
板をヒートシンクとの取着面側から見た平面図である。FIG. 2 is a plan view of a wiring board enclosed in the hybrid integrated circuit device of the present invention as viewed from the attachment surface side with a heat sink.
【図３】本発明の混成集積回路装置のより望ましい形態
を示す要部を拡大した断面図である。FIG. 3 is an enlarged sectional view of an essential part showing a more preferable form of the hybrid integrated circuit device of the present invention.
【図４】本発明の混成集積回路装置の他の実施例を示す
断面図である。FIG. 4 is a sectional view showing another embodiment of the hybrid integrated circuit device of the present invention.
【図５】従来の混成集積回路装置の断面を含む斜視図で
ある。FIG. 5 is a perspective view including a cross section of a conventional hybrid integrated circuit device.
１ 混成集積回路装置 ２ ヒートシンク ３ 配線基板 ４ 枠体 ５ 蓋体 ６ 外部配線回路接続用の接続端子 ７ 導出端子 ８ 対角線 ９ 直径３０ｍｍの円 １０ 絶縁体 １１ 接続ピン １２ コネクタ 1 Hybrid integrated circuit device 2 heat sink 3 wiring board 4 frame 5 Lid 6 Connection terminal for external wiring circuit connection 7 Derivation terminal 8 diagonal 9 Circle with a diameter of 30 mm 10 insulator 11 connection pins 12 connectors
フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 23/34 - 23/367 H05K 7/20 Front page continuation (58) Fields surveyed (Int.Cl. 7 , DB name) H01L 23/34-23/367 H05K 7/20
Claims (2)
以上の長さを有する配線基板の導出端子と、ヒートシン
クに設けた接続端子とを電気的に接続し、該ヒートシン
クの周縁部に形成した枠体の開口部を蓋体で封着した混
成集積回路装置であって、前記導出端子が配線基板のヒ
ートシンクとの取着面側の中央部で、直径３０ｍｍの円
内に配設され、該導出端子をヒートシンク表面に絶縁体
を介して形成された外部配線回路接続用の接続端子に、
直接、電気的に接続したことを特徴とする構成集積回路
装置。1. A diagonal line attached to a heat sink has a length of 60 mm.
A hybrid integrated circuit in which the lead-out terminal of the wiring board having the above length and the connection terminal provided on the heat sink are electrically connected, and the opening of the frame formed in the peripheral portion of the heat sink is sealed with the lid. An external device in which the lead-out terminal is arranged in a circle having a diameter of 30 mm at a central portion on the attachment surface side of the wiring board with respect to the heat sink, and the lead-out terminal is formed on the heat sink surface via an insulator. For connection terminals for wiring circuit connection,
A configuration integrated circuit device characterized by being directly and electrically connected.
端子が接続ピンのコネクタであることを特徴とする請求
項１に記載の混成集積回路装置。2. The hybrid integrated circuit device according to claim 1, wherein the lead-out terminal is a connection pin, and the connection terminal is a connector of the connection pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11821698A JP3470041B2 (en) | 1998-04-28 | 1998-04-28 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11821698A JP3470041B2 (en) | 1998-04-28 | 1998-04-28 | Hybrid integrated circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11312768A JPH11312768A (en) | 1999-11-09 |
| JP3470041B2 true JP3470041B2 (en) | 2003-11-25 |
Family
ID=14731099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11821698A Expired - Fee Related JP3470041B2 (en) | 1998-04-28 | 1998-04-28 | Hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3470041B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016067383A1 (en) * | 2014-10-29 | 2016-05-06 | 新電元工業株式会社 | Heat-dissipating structure |
-
1998
- 1998-04-28 JP JP11821698A patent/JP3470041B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11312768A (en) | 1999-11-09 |
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