JP3441945B2 - Printed wiring board and method of manufacturing the same - Google Patents
Printed wiring board and method of manufacturing the sameInfo
- Publication number
- JP3441945B2 JP3441945B2 JP33582397A JP33582397A JP3441945B2 JP 3441945 B2 JP3441945 B2 JP 3441945B2 JP 33582397 A JP33582397 A JP 33582397A JP 33582397 A JP33582397 A JP 33582397A JP 3441945 B2 JP3441945 B2 JP 3441945B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- resin
- wiring board
- printed wiring
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ＣＰＵ、メモリー
等の半導体素子、その他の抵抗器、コンデンサー等の電
子部品、チップ部品等を搭載するために用いられるイン
ナービアホールを有するプリント配線板およびその製造
方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board having an inner via hole used for mounting a semiconductor element such as a CPU and a memory, other electronic parts such as a resistor and a capacitor, a chip part, and the manufacture thereof. Regarding the method.
【０００２】[0002]
【従来の技術】最近、携帯用電子機器の一層の小型化と
薄型化のために、プリント配線基板は、半導体素子、抵
抗器、コンデンサー等のチップ部品等の集積度が非常に
高くなっており、そのためこれを実装するためのプリン
ト配線板も高密度化しなければならない。このような実
状に対処するために考え出されたのが多層プリント配線
板である。多層プリント配線板は、これを構成する複数
の基板（内層回路基板）に予め導体回路を形成してお
き、これらの基板を互いに接合することによって高集積
電子部品の実装を可能にするものである。2. Description of the Related Art Recently, in order to further reduce the size and thickness of portable electronic devices, printed circuit boards have a very high degree of integration of chip parts such as semiconductor elements, resistors and capacitors. Therefore, the printed wiring board for mounting this must also be densified. A multilayer printed wiring board has been devised to cope with such a situation. The multi-layer printed wiring board enables a highly integrated electronic component to be mounted by forming conductor circuits in advance on a plurality of boards (inner circuit boards) that compose the board and bonding these boards to each other. .
【０００３】このような多層プリント配線板では、各層
間の導体回路に電気的導通を行うことが必要となる。通
常は各層の電極間の電気的に導通させるためにスルーホ
ールを設けておりこの孔を通って電流が流れ、電気的な
接続が行われるようになっている。In such a multilayer printed wiring board, it is necessary to electrically connect the conductor circuits between the layers. Usually, a through hole is provided to electrically connect the electrodes of each layer, and a current flows through this hole to establish an electrical connection.
【０００４】このスルーホールの設け方としてはめっき
による方法、導電性ペーストによる方法等様々な方法が
提案され、実施されている。各方法についての一般的な
製造方法としては最初にＮＣドリルマシーン、レーザ貫
通孔加工機等により貫通孔加工を行い、その後貫通孔の
中にめっきをしたり、導電性ペーストを入れる等により
層間の導通を図る。Various methods such as a plating method and a conductive paste method have been proposed and implemented as the method of providing the through holes. As a general manufacturing method for each method, first, through holes are processed by an NC drill machine, a laser through hole processing machine, etc., and thereafter, plating is performed in the through holes, or a conductive paste is put between the layers to form an interlayer. Establish continuity.
【０００５】例えば特開平７ー１１５２７９に示される
多層基板とその製造方法では具体的にこの種のプリント
配線板の製造方法が開示されている。この方法は、絶縁
材料層にビアホール用の貫通孔を加工する工程、この貫
通孔に導電性粒子、液状樹脂および粉体硬化剤よりなる
導電性ペーストを充填する工程、導電性ペーストが充填
されたビアを有する絶縁材料層の両面を銅箔で挟み、熱
圧着する工程、前記銅箔を加工して内層用回路パターン
を形成し、両面板構成とする工程、さらにこの両面板の
両側あるいは片側に前記ビアホールを有する絶縁材料層
と前記銅箔を交互に熱圧着しかつ前記銅箔を加工して回
路パターンを形成し、多層構成とする工程の一連の工程
により多層のプリント配線板を形成するものである。For example, in the multilayer substrate and the manufacturing method thereof disclosed in JP-A-7-115279, a manufacturing method of a printed wiring board of this type is specifically disclosed. In this method, a step of processing a through hole for a via hole in an insulating material layer, a step of filling the through hole with a conductive paste composed of conductive particles, a liquid resin and a powder curing agent, and a conductive paste were filled. A process of sandwiching both sides of an insulating material layer having a via with copper foil and thermocompression-bonding, a process of forming the circuit pattern for the inner layer by processing the copper foil to form a double-sided board, and further on both sides or one side of this double-sided board Forming a multilayer printed wiring board by a series of steps of forming a circuit pattern by alternately thermocompressing the insulating material layer having the via hole and the copper foil and processing the copper foil to form a multilayer structure Is.
【０００６】さらに、最近は、プリント配線板には、電
気的性質とともに、機械的強度、特に高温での強度の要
求から、繊維強化した合成樹脂樹脂板、特に、アラミド
繊維等の強靭な繊維の織布・不織布にエポキシ樹脂など
を含浸してシート状にしたコンポジットが使用され、配
線基板の耐熱性の向上に寄与している。このような多層
の配線基板として、図２に、複数の基板（内層回路基
板）２・・・に、導電性ペーストによる導体１０でビア
ホール１０を設けて電極４、４間を接続した多層プリン
ト配線板の例を示している。Further, in recent years, a printed wiring board is required to have not only electric properties but also mechanical strength, particularly strength at high temperature, so that a fiber-reinforced synthetic resin resin board, particularly tough fiber such as aramid fiber is used. A woven / nonwoven fabric impregnated with epoxy resin is used in the form of a sheet composite, which contributes to the improvement of the heat resistance of the wiring board. As such a multilayer wiring board, a multilayer printed wiring board in which a plurality of boards (inner layer circuit boards) 2 ... An example of a plate is shown.
【０００７】[0007]
【発明が解決しようとする課題】然しながら、絶縁基板
が繊維の織布・不織布と含浸樹脂とのコンポジットのシ
ートであること、さらに、熱プレスの前においてはコン
ポジットシートが残留気孔を含む多孔質であることと関
連して、絶縁基板に、貫通孔を形成する際にその内壁に
欠陥を生じやすかった。上記コンポジットから成る絶縁
基材に貫通孔を加工する際に、加工方法が不適切である
と、プリント配線板のビアホールの貫通孔の内壁が粗く
なり、むしり、かじり等が発生するという問題があっ
た。これらの貫通孔の欠陥は、貫通孔に導電性ペースト
を充填した後に、熱プレスを行うと、ときには、流動的
になった導電性ペーストが、粗雑な貫通孔内壁に流れ込
んで、隣接するビアホールの導体と接触短絡したり、あ
るいはマイグレーションの原因となったり、埋め込むべ
き導電性ペーストが貫通孔から流出して少なくなり、硬
化後にはビアホール導体が層間電極と十分な電気的接続
がとれないといった課題が残されていた。However, the insulating substrate is a composite sheet of fiber woven / nonwoven fabric and impregnated resin, and the composite sheet is porous with residual pores before hot pressing. In connection with this, it was easy to cause a defect in the inner wall of the insulating substrate when forming the through hole. When processing the through hole in the insulating base material made of the above composite, if the processing method is inappropriate, there is a problem that the inner wall of the through hole of the via hole of the printed wiring board becomes rough and peeling or galling occurs. It was The defect of these through holes is that when the conductive paste is filled in the through holes and then hot pressing is performed, sometimes the conductive paste becomes fluid and flows into the rough inner wall of the through holes, and the adjacent via holes are There are problems such as contact short-circuit with the conductor, cause of migration, the amount of conductive paste to be embedded flows out from the through hole, and the via hole conductor cannot be sufficiently electrically connected to the interlayer electrode after curing. It was left.
【０００８】例えば、図３には、絶縁基板２に貫通孔３
をエキシマレーザで形成した後、導電性ペースト１を孔
３に充填し、次いで銅箔４で挟み込んで、熱プレスした
場合の状態を概念的に示しているが、エキシマレーザの
ような高エネルギの加工方法では、コンポジットの絶縁
基板２を構成する含浸樹脂が溶融する間もなく瞬時に分
解蒸発してしまうために加工された貫通孔の内壁が肌荒
く、むしれ、かじり等が内壁部に発生しその部分に導電
性のペーストが流れ込むために導電性ペーストの浸み込
み部１６が発生することになる。そのため、貫通孔内に
充填された導電性ペーストの充足が不十分で、接触不良
部１７が形成されるだけでなくビアホール間の耐マイグ
レーション性が著しく悪化するという課題があった。For example, in FIG. 3, the through hole 3 is formed in the insulating substrate 2.
Is formed by an excimer laser, the conductive paste 1 is filled in the holes 3, then sandwiched by the copper foils 4 and hot pressed, which is conceptually shown. In the processing method, since the impregnated resin forming the composite insulating substrate 2 is instantly decomposed and evaporated immediately before melting, the inner wall of the processed through-hole is rough, and peeling, galling, etc. occur on the inner wall portion. Since the conductive paste flows into the portion, the conductive paste infiltration part 16 is generated. Therefore, there is a problem that the conductive paste filled in the through holes is insufficiently filled, not only the poor contact portion 17 is formed, but also the migration resistance between the via holes is significantly deteriorated.
【０００９】また絶縁基材は、プリプレグとして多孔質
であるので、貫通孔の内壁に細孔が空隙としてむき出し
になるためそこに導電性ペーストが流れこみ、導電性ペ
ーストのしみこみ部１６が発生するという課題があっ
た。そして、多孔質の絶縁性基材としては、上述のよう
に、アラミド繊維やガラス繊維等の不織布にエポキシ樹
脂を含浸させたものが実用化されているが、その種の絶
縁基材は多孔性であるので、この導電性ペーストのしみ
こみ部の発生は、非常に避けがたい大きな解決課題とな
っていた。Further, since the insulating base material is porous as a prepreg, the pores are exposed as voids on the inner wall of the through hole, so that the conductive paste flows thereinto, and the infiltrated portion 16 of the conductive paste is generated. There was a problem. As a porous insulating base material, a non-woven fabric such as aramid fiber or glass fiber impregnated with an epoxy resin has been put into practical use as described above, but such an insulating base material is porous. Therefore, the generation of the infiltrated portion of the conductive paste has been a very unavoidable major problem to be solved.
【００１０】また、ビアホールの導電性ペーストの導体
１と絶縁基材２とは、熱膨張係数に相違があるために、
リフロー半田付け等の加熱工程で、加熱冷却による伸縮
の繰返しにより、電気的な接続が低下して回路基板とし
ての信頼性が劣化するという課題があった。Since the conductor 1 of the conductive paste for the via hole and the insulating base material 2 have different thermal expansion coefficients,
In a heating process such as reflow soldering, there has been a problem that electrical connection is reduced due to repeated expansion and contraction due to heating and cooling, and reliability as a circuit board is deteriorated.
【００１１】本発明は、このような絶縁基板が、樹脂含
浸繊維シートよりなるシートであること、さらに、熱プ
レスの前においてはコンポジットシートが残留気孔を含
む多孔質であることと関連した従来の課題を解決し、成
形後のビアホール用の貫通孔内壁の状態を良好にせし
め、ビアホールによる接続信頼性を高め、ビアホール接
続不良、マイグレーションによる絶縁破壊等を起こさな
いプリント配線板およびその製造方法を提供するもので
ある。The present invention is related to the fact that such an insulating substrate is a sheet made of a resin-impregnated fiber sheet, and that the composite sheet is porous including residual pores before hot pressing. A printed wiring board that solves the problems, improves the inner wall of the through-hole for the via hole after molding, improves the connection reliability by the via hole, and does not cause the connection failure of the via hole, the dielectric breakdown due to migration, etc., and the manufacturing method thereof. To do.
【００１２】[0012]
【課題を解決するための手段】本発明は、電極接続用の
ビアホールを備えたプリント配線板について、上記ビア
ホールは、樹脂含浸繊維シートよりなる絶縁用基材に形
成したビアホール用の貫通孔と、該貫通孔の内壁面に形
成した樹脂層と、該樹脂層を介して該貫通孔の内側に充
填した接続導体と、から成ることを特徴とする。The present invention relates to a printed wiring board having a via hole for connecting an electrode, wherein the via hole is a through hole for a via hole formed in an insulating substrate made of a resin-impregnated fiber sheet, It is characterized by comprising a resin layer formed on the inner wall surface of the through hole and a connection conductor filled inside the through hole via the resin layer.
【００１３】このようなプリント配線板おいては、ビア
ホール導体は、貫通孔に樹脂層を介装して充填形成され
るので、貫通孔の内壁に粗雑な凹みや細孔があってもこ
れらを樹脂層により予め封鎖して、樹脂層が形成する平
滑な孔内面に導体が充填されるので、ビアホール接続不
良、マイグレーションによる絶縁破壊等が有効に防止さ
れる。In such a printed wiring board, the via-hole conductor is formed by filling the through-hole with the resin layer interposed therebetween. Therefore, even if the inner wall of the through-hole has rough dents or pores, these are filled. Since the conductor is filled in advance with the resin layer and the inner surface of the smooth hole formed by the resin layer is filled with the conductor, poor connection of via holes, dielectric breakdown due to migration, etc. are effectively prevented.
【００１４】本発明のプリント配線板の製造方法は、樹
脂含浸繊維シートよりなる絶縁用基材に電極接続用のビ
アホールを備えたプリント配線板を製造する方法である
が、該絶縁用基材にビアホール用の貫通孔を形成し、該
貫通孔内面に樹脂層を被覆形成し、その後に該樹脂層を
介在したまま貫通孔内側に接続導体を形成することによ
り、上記ビアホールを形成することを特徴とするもので
ある。The method for producing a printed wiring board according to the present invention is a method for producing a printed wiring board having a via hole for electrode connection in an insulating substrate made of a resin-impregnated fiber sheet. The via hole is formed by forming a through hole for a via hole, coating and forming a resin layer on the inner surface of the through hole, and then forming a connection conductor inside the through hole while interposing the resin layer. It is what
【００１５】本発明の方法は、絶縁用基材にビアホール
用の貫通孔を形成し、その際に貫通孔の内壁に粗雑な凹
みや細孔があっても、次に形成する樹脂層によりこれら
を予め封鎖することができ、樹脂層の滑らかな内周面に
形成できるので、接続導体を充填形成させれば、緻密で
接続確実なビアホールが形成できる。According to the method of the present invention, a through hole for a via hole is formed in an insulating substrate, and even if there are rough dents or pores on the inner wall of the through hole, these are formed by a resin layer to be formed next. Since it can be sealed in advance and can be formed on the smooth inner peripheral surface of the resin layer, a dense and reliable connection via hole can be formed by filling and forming the connection conductor.
【００１６】[0016]
【発明の実施の形態】本発明のプリント配線板に具備す
るビアホール１０は、図１に示すように、絶縁用基材２
に形成された貫通孔３と接続導体１との間に樹脂層３０
が一体に介装されてなるものであ。本発明の第１の形態
は、絶縁用基材に貫通孔３を形成する過程で、樹脂含浸
繊維シートに含有の樹脂の加熱溶解成分を、樹脂層３０
に、利用するものである。即ち、樹脂含浸繊維シートに
含有される樹脂成分が加熱溶解した後に貫通孔内側に残
る樹脂皮膜の硬化体を樹脂層とするものである。BEST MODE FOR CARRYING OUT THE INVENTION A via hole 10 provided in a printed wiring board of the present invention has an insulating base material 2 as shown in FIG.
The resin layer 30 is provided between the through hole 3 and the connection conductor 1 formed in
Is integrally provided. 1st form of this invention WHEREIN: In the process of forming the through-hole 3 in the base material for insulation, the heat melt | dissolution component of the resin contained in the resin impregnated fiber sheet is made into the resin layer 30.
To be used. That is, the cured product of the resin film remaining inside the through hole after the resin component contained in the resin-impregnated fiber sheet is heated and melted is used as the resin layer.
【００１７】第２の形態は、上記樹脂層を、貫通孔形成
過程における樹脂含浸繊維シートの貫通孔３に樹脂液を
埋め込みその樹脂硬化体に貫通孔を穿孔して成る残部と
して形成するものである。In the second embodiment, the above-mentioned resin layer is formed as a remaining portion obtained by filling a resin liquid in the through holes 3 of the resin-impregnated fiber sheet in the process of forming the through holes and punching the through holes in the resin cured body. is there.
【００１８】第３の形態は、上記樹脂層３０を、貫通孔
形成過程におけるプリント配線板のビアホール用の貫通
孔に塗布した樹脂液の乾燥硬化膜とするものである。In the third embodiment, the resin layer 30 is a dry and cured film of a resin liquid applied to the through holes for via holes of the printed wiring board in the process of forming the through holes.
【００１９】第４の形態は、本発明のプリント配線板の
製造方法において、ビアホールは、貫通孔を該絶縁用基
材に加熱して形成し、この貫通孔形成の際に上記樹脂層
を絶縁用基材の加熱溶解成分により貫通孔内面に形成
し、その後に樹脂層内側に接続導体を形成することによ
りなされる。貫通孔とその後の樹脂層の加熱形成には、
レーザビーム照射が、小径に穿孔できるので利用され
る。特にレーザ照射は、ＣＯ2 ガスレーザ照射が好まし
い。A fourth aspect is the method for manufacturing a printed wiring board according to the present invention, wherein the via hole is formed by heating the through hole in the insulating base material, and insulating the resin layer when forming the through hole. It is formed by forming the inside of the through hole with the heat-dissolved component of the substrate for use and then forming the connection conductor inside the resin layer. To form the through hole and the subsequent resin layer by heating,
Laser beam irradiation is used because it can punch small holes. Particularly, the laser irradiation is preferably CO 2 gas laser irradiation.
【００２０】第５の形態は、本発明のプリント配線板の
製造方法が、絶縁用基板に貫通孔を形成した後に、該貫
通孔に別途、熱硬化性樹脂を充填し、その樹脂硬化体に
改めて小径の貫通孔を穿孔して上記樹脂層とするもので
ある。その後に樹脂層内側に接続導体を形成するのは上
記と同じである。A fifth aspect of the present invention is a method for manufacturing a printed wiring board according to the present invention, wherein after forming a through hole in an insulating substrate, the through hole is separately filled with a thermosetting resin, and the resin cured product is obtained. A small-diameter through hole is again punched to form the resin layer. After that, the connection conductor is formed inside the resin layer in the same manner as above.
【００２１】第６の形態は、上記貫通孔の形成後に、該
貫通孔内面に樹脂液を付着させて後乾燥硬化させて貫通
孔内周面に樹脂層を形成し、その後貫通孔に接続導体を
充填形成することを特徴とする。この方法においては、
より詳しくは、樹脂液を揮発溶媒で薄めた希薄樹脂液を
使用し、貫通孔形成後の絶縁用基板に希薄樹脂液を塗布
し、次いで乾燥硬化させて、貫通孔内周面に樹脂皮膜を
形成し、これを樹脂層に利用する。In the sixth mode, after the through hole is formed, a resin liquid is attached to the inner surface of the through hole and then dried and cured to form a resin layer on the inner peripheral surface of the through hole, and then the connecting conductor is formed in the through hole. Is formed by filling. In this way,
More specifically, a dilute resin liquid obtained by diluting the resin liquid with a volatile solvent is used, the dilute resin liquid is applied to the insulating substrate after the through holes are formed, and then dried and cured to form a resin film on the inner peripheral surface of the through holes. It is formed and used for the resin layer.
【００２２】本発明に使用される絶縁性基板２には、樹
脂含浸繊維シートが使用されるが、繊維シートの繊維に
は電気的特性と機械的強度に優れた材料から及び含浸樹
脂も電気的特性と機械的強度に優れた熱可塑性樹脂から
適宜選ばれる。好ましくは繊維として、ガラス繊維又は
アラミド繊維の織布・不織布を使用し、含浸樹脂として
エポキシ樹脂又はビスマレイミドトリアジン樹脂を使用
して、織布・不織布に樹脂液を含浸してシート状に成形
した複合材料が使用される。これには、ガラス繊維エポ
キシ樹脂コンポジット、ガラス繊維ビスマレイミドトリ
アジン樹脂コンポジット、アラミド繊維エポキシ樹脂コ
ンポジット、アラミド繊維ビスマレイミドトリアジン樹
脂コンポジットが例示できる。A resin-impregnated fiber sheet is used for the insulating substrate 2 used in the present invention. The fibers of the fiber sheet are made of a material excellent in electrical characteristics and mechanical strength, and the impregnated resin is also electrically conductive. It is appropriately selected from thermoplastic resins having excellent properties and mechanical strength. Preferably, a woven / nonwoven fabric of glass fiber or aramid fiber is used as the fiber, and an epoxy resin or a bismaleimide triazine resin is used as the impregnating resin, and the woven / nonwoven fabric is impregnated with a resin liquid to form a sheet. Composite materials are used. Examples thereof include glass fiber epoxy resin composites, glass fiber bismaleimide triazine resin composites, aramid fiber epoxy resin composites, and aramid fiber bismaleimide triazine resin composites.
【００２３】樹脂層３０は、電気的特性と機械的性質に
優れた熱硬化性樹脂が好ましく使用されるが、基板材料
と同様のエポキシ樹脂、ビスマレイミドトリアジン樹脂
が使用できる。上記樹脂層には、電気絶縁性のフィラー
が含有されているのが好ましい。このようなフィラーと
しては酸化アルミ（Ａｌ2 Ｏ3)、酸化マグネシウム（Ｍ
ｇＯ）、ＳｉＯ2 等の無機材料が好ましく利用され、フ
ィラーは電気絶縁体としてマイグレーションの防止等に
働くと同時に機械的強度に優れているのでペースト部の
補強材としても働く。また特に上記のフィラーは熱伝導
性も高いので半導体等で発生する熱量を速やかに逃がす
サーマルビアとしても働く。The resin layer 30 is preferably a thermosetting resin having excellent electrical and mechanical properties, but the same epoxy resin and bismaleimide triazine resin as the substrate material can be used. The resin layer preferably contains an electrically insulating filler. Such fillers include aluminum oxide (Al 2 O 3 ), magnesium oxide (M
Inorganic materials such as gO) and SiO 2 are preferably used, and the filler serves as an electrical insulator to prevent migration and the like, and at the same time, serves as a reinforcing material for the paste portion because it has excellent mechanical strength. Further, in particular, since the above-mentioned filler has high thermal conductivity, it also functions as a thermal via that quickly releases the amount of heat generated in a semiconductor or the like.
【００２４】接続導体１は、熱硬化型樹脂液と導体用粉
末（例えば、銅や銀などの金属粉末）との混合ペースト
の硬化体が使用され、このために、内周面に樹脂層を形
成した貫通孔内に、通常の方法によりペーストを充填し
て、加熱することにより硬化させて、導電性の接続導体
とされる。A hardened body of a mixed paste of a thermosetting resin liquid and a conductor powder (for example, a metal powder such as copper or silver) is used as the connecting conductor 1, and for this reason, a resin layer is formed on the inner peripheral surface. A paste is filled in the formed through-holes by a usual method, and the paste is filled with heat to be hardened to be a conductive connecting conductor.
【００２５】最初に以下に例示するプリント配線板の作
成方法について説明する。第４の実施形態について、絶
縁性基材２への貫通孔３の加工方法の一つの例としてＣ
Ｏ2 ガスレーザ照射装置を用いてレーザビームを絶縁基
材のビアホール１０の対応部位に照射加熱して厚み方向
に貫通した孔を形成する。この際に、貫通孔３の内周に
樹脂層３０が形成されるように制御される。この貫通孔
内壁部の樹脂層３０は、レーザ照射により絶縁性基材内
に発生した熱により対応部位の含浸樹脂が一旦溶融し加
工後の内壁部に固着し、凝固後にそのまま形成される。First, a method for producing a printed wiring board exemplified below will be described. Regarding the fourth embodiment, C is used as an example of a method of processing the through hole 3 in the insulating base material 2.
A laser beam is applied to the corresponding portion of the via hole 10 of the insulating base material by using an O 2 gas laser irradiating device and heated to form a hole penetrating in the thickness direction. At this time, the resin layer 30 is controlled to be formed on the inner circumference of the through hole 3. The resin layer 30 on the inner wall portion of the through hole is formed as it is after the solidification of the impregnated resin at the corresponding portion is once melted and fixed to the inner wall portion after processing due to the heat generated in the insulating base material by laser irradiation.
【００２６】この溶融樹脂層を設けるためには加熱加工
時に樹脂の溶融に適度な熱が発生するに好適な加工法と
また適切な加工条件設定が必要となる。ＣＯ2 レーザ照
射加工機に代えて、ＮＣドリルマシーンでは、回転数、
送り速度等を適切に設定して、孔貫通とともに、溶融樹
脂液が形成され、且つ孔内周に残留するように制御され
る。In order to provide this molten resin layer, a processing method suitable for generating an appropriate amount of heat for melting the resin at the time of heat processing and an appropriate setting of processing conditions are required. In place of the CO 2 laser irradiation processing machine, the rotation speed,
By appropriately setting the feed rate and the like, the molten resin liquid is formed and is controlled to remain on the inner circumference of the hole as the hole penetrates.
【００２７】しかしながらエキシマレーザ等の高エネル
ギーレーザによる加工方法や適切な条件設定がなされて
いないＣＯ2 ガスレーザ加工方法、ドリル加工方法では
樹脂が溶融せず昇華、熱分解や微粒蒸散してしまい、貫
通孔内壁部に所望の樹脂層を形成することはできないこ
とがある。特に、含浸樹脂繊維質シートは、多孔質であ
ったり、或いは繊維と樹脂とは熱的機械的性質が相違す
るのが普通であって熱的にも機械的にも均質材料でな
く、貫通孔加工の際の切削やレーザ加熱により、貫通孔
内周の含浸樹脂繊維質シートの含浸樹脂の部分や繊維の
部分が貫通孔内壁部にむき出しになったり、凹凸やむし
り、かじり等が発生してしまう。However, the resin is not melted by a processing method using a high energy laser such as an excimer laser, a CO 2 gas laser processing method or a drill processing method in which proper conditions are not set, and the resin is sublimated, pyrolyzed or evaporated into fine particles, and penetrates. It may not be possible to form a desired resin layer on the inner wall of the hole. In particular, the impregnated resin fibrous sheet is usually porous, or the fibers and the resin are different from each other in thermal and mechanical properties, and is not a homogeneous material both thermally and mechanically. Due to cutting or laser heating during processing, the impregnated resin part or fiber part of the impregnated resin fibrous sheet on the inner circumference of the through hole may be exposed on the inner wall part of the through hole, and unevenness, peeling, or galling may occur. I will end up.
【００２８】そこで、第５の形態のようにこのような溶
融樹脂液による樹脂層の形成が困難な加工法による場合
には、この加工法で一度所望の直径より大き目の直径の
貫通孔を形成し、仮に貫通孔内周面にむしり、かじりな
どが発生したとしても、貫通孔に別途、熱硬化性樹脂液
を充填して内壁内に埋め込み、その硬化後に再度、所望
の直径の貫通孔を開けることにより、貫通孔内壁に樹脂
層を形成することができる。このように充填硬化した樹
脂は比較的均質であり、内壁面を円滑に形成することが
できる。このため、この樹脂層用の樹脂には、レーザに
よる加工やドリル加工で孔成形性の良い樹脂が使用され
る。Therefore, in the case of a processing method in which it is difficult to form a resin layer with such a molten resin liquid as in the fifth embodiment, a through hole having a diameter larger than a desired diameter is once formed by this processing method. However, even if peeling or galling occurs on the inner peripheral surface of the through hole, the through hole is separately filled with a thermosetting resin liquid and embedded in the inner wall, and after the hardening, the through hole having a desired diameter is again formed. By opening, a resin layer can be formed on the inner wall of the through hole. The resin thus filled and cured is relatively homogeneous, and the inner wall surface can be formed smoothly. Therefore, as the resin for the resin layer, a resin having good hole formability by laser processing or drill processing is used.
【００２９】このような２回貫通孔加工する方法は、ド
リル加工法やその他、レーザ加工方法以外の加工方法も
同様に適用することができ、適切な材料、条件で加工を
行えば１回で内壁に樹脂層を設けるよりも信頼性の高い
ビアを形成することが可能となる。As the method of processing the through-hole twice as described above, the drilling method and other processing methods other than the laser processing method can be applied in the same manner. If the processing is performed with appropriate materials and conditions, the processing can be performed only once. This makes it possible to form a via having a higher reliability than providing a resin layer on the inner wall.
【００３０】本発明の方法は、第６の形態の如く貫通孔
の成形後に、貫通孔内壁に樹脂を塗布することにより樹
脂層を設けることもできる。この際に樹脂を塗布する方
法は様々な方法があるが、例えば貫通孔を成形した絶縁
基材を溶剤等で溶解させ樹脂液中に浸漬する方法、また
スプレーコーター等で樹脂溶液を吹き付け塗布し、その
後に乾燥硬化させて、皮膜化する方法等により貫通孔内
壁に樹脂層を形成することができる。In the method of the present invention, the resin layer can be provided by applying a resin to the inner wall of the through hole after forming the through hole as in the sixth embodiment. At this time, there are various methods of applying the resin, for example, a method of dissolving the insulating base material having the through holes formed therein by dissolving it in a solvent or the like, or a method of spraying the resin solution with a spray coater or the like. After that, the resin layer can be formed on the inner wall of the through hole by a method of drying and hardening to form a film.
【００３１】この塗布の際に、貫通孔内壁が詰まらない
ように樹脂溶液を希釈な濃度ないし低い粘度のコントロ
ールするのがよく、また塗布直後の樹脂溶液が未硬化状
態の間に圧縮空気等で貫通孔に詰まっている樹脂をある
程度吹き飛ばすのも効果的である。At the time of this coating, it is preferable to control the resin solution so as to have a dilute concentration or a low viscosity so that the inner wall of the through hole is not clogged. Further, while the resin solution immediately after coating is in an uncured state, it may be compressed air. It is also effective to blow off the resin clogged in the through holes to some extent.
【００３２】（実施例１）絶縁基材としてアラミド不織
布にエポキシ樹脂を含浸させて作ったコンポジットシー
トの絶縁性基材（厚み１００μｍ、５００×６００ｍ
ｍ）を用い、それに貫通孔内壁部に樹脂層を形成できる
ように適切な条件を設定して（穴開け条件；１００〜３
００穴／sec ）、ＣＯ2 レーザ加工機で直径１５０μｍ
の貫通孔を成形し、同時に樹脂層を形成することができ
た。次いで、導電材料に銅微粉末と樹脂主成分エポキシ
樹脂とを混練した導電性ペーストを充填しビアホールを
形成後、銅箔で両側を挟み真空熱プレスにより加熱加圧
成形し、銅箔に内層用パターンをエッチングで形成して
内層用プリント配線板を得た。Example 1 As an insulating base material, an insulating base material (thickness: 100 μm, 500 × 600 m) of a composite sheet made by impregnating an aramid nonwoven fabric with an epoxy resin.
m), and appropriate conditions are set so that a resin layer can be formed on the inner wall portion of the through hole (drilling condition; 100 to 3).
00 hole / sec), diameter of 150μm with CO 2 laser processing machine
It was possible to form the through hole and to form the resin layer at the same time. Then, the conductive material is filled with a conductive paste prepared by kneading fine copper powder and a resin-based epoxy resin to form a via hole, sandwiching both sides with a copper foil, and heat-pressing with a vacuum heat press to form an inner layer on the copper foil. A pattern was formed by etching to obtain an inner layer printed wiring board.
【００３３】外層用配線板として、上記の内層用プリン
ト配線板と同様にして、直径１５０μm の貫通孔をあけ
導電性を有したペーストを充填した絶縁基材を形成し、
これら外層用プリント配線板を上記の内層用基材の両側
に面接積層し、その外面を銅箔で挟んで、真空熱プレス
により加熱加圧成形を行い、外層用パターンをエッチン
グで形成して３層の試験用の多層プリント配線基板を得
た。As an outer layer wiring board, in the same manner as the inner layer printed wiring board described above, an insulating base material having a through hole having a diameter of 150 μm opened and a conductive paste filled therein is formed,
These outer layer printed wiring boards are laminated on both sides of the above-mentioned inner layer substrate by face-to-face lamination, the outer surface is sandwiched between copper foils, and heat and pressure molding is performed by a vacuum hot press to form an outer layer pattern by etching. A multilayer printed wiring board for layer testing was obtained.
【００３４】（実施例２）絶縁基材としてアラミド不織
布にエポキシ樹脂を含浸させて作った多孔質基材である
アラミドエポキシコンポジットを用い、それにＮＣドリ
ル貫通孔加工機で直径１５０μm の貫通孔をあけ導電性
ペーストを充填しビアホールを形成後、銅箔で両側を挟
み真空熱プレスにより加熱加圧成形し、内層用パターン
をエッチングで形成し内層用配線板を得る。(Example 2) An aramid epoxy composite, which is a porous base material made by impregnating an aramid nonwoven fabric with an epoxy resin, was used as an insulating base material, and a through hole having a diameter of 150 μm was formed in the NC drill through hole processing machine. After filling the conductive paste and forming via holes, the both sides are sandwiched by copper foils, and heat and pressure molding is performed by a vacuum heat press, and an inner layer pattern is formed by etching to obtain an inner layer wiring board.
【００３５】同様に、ＮＣドリル貫通孔加工機で直径１
５０μmの貫通孔をあけ導電性を有したペーストを充填
して外層用の絶縁基材を２枚形成し、これら外層用の配
線板を上記の内層用配線板の両側に面接して積層し、表
面を銅箔で挟みこみ真空熱プレスにより加熱加圧成形を
行い、外層用パターンをエッチングで形成し試験用の基
板を得た。Similarly, with an NC drill through hole processing machine, a diameter of 1
A 50 μm through hole is opened and a conductive paste is filled to form two insulating base materials for outer layers, and the wiring boards for outer layers are laminated on the both sides of the wiring board for inner layers by face-to-face lamination. The surface was sandwiched between copper foils, heated and pressed by a vacuum hot press, and an outer layer pattern was formed by etching to obtain a test substrate.
【００３６】（実施例３）絶縁基材としてアラミド不織
布にエポキシ樹脂を含浸させて作った多孔質基材を用
い、それにエキシマレーザ加工機で直径２００μm の貫
通孔をあけた後、エポキシ樹脂ペーストを貫通孔に充填
した。エポキシ樹脂の充填は半ねり状のエポキシ樹脂ペ
ーストをスキージで貫通孔に詰め込む等の方法により行
い、その後再度同じ位置に直径１５０μm の貫通孔をエ
キシマレーザで穿孔することにより貫通孔内壁に樹脂層
を有した所望の直径の貫通孔を得る。次に、導電性ペー
ストを充填しビアホールを形成後、銅箔で両側を挟み真
空熱プレスにより加熱加圧成形し、内層用パターンをエ
ッチングで形成し内層用配線板を得る。(Example 3) As an insulating base material, a porous base material made by impregnating an aramid non-woven fabric with epoxy resin was used, and a through hole having a diameter of 200 μm was formed by an excimer laser processing machine, and then an epoxy resin paste was applied. The through holes were filled. The epoxy resin is filled by filling the through hole with a semi-bent epoxy resin paste with a squeegee, and then another through hole with a diameter of 150 μm is punched at the same position with an excimer laser to form a resin layer on the inner wall of the through hole. A through hole having a desired diameter is obtained. Next, after filling a conductive paste and forming via holes, both sides are sandwiched by copper foils, and heat and pressure molding is performed by a vacuum heat press, and an inner layer pattern is formed by etching to obtain an inner layer wiring board.
【００３７】外層用として、上記の内層用配線板と同様
にして、エポキシ樹脂ペーストを貫通孔に充填し、再度
同じ位置に直径１５０μm の貫通孔をエキシマレーザで
穿孔することにより貫通孔壁に樹脂層を有した貫通孔を
設けた後、導電性ペーストを貫通孔に充填した外層用の
配線板を形成した。外層用の配線板２枚を内層用配線板
の両側に配し銅箔で挟みこみ真空熱プレスにより加熱加
圧成形を行い、外層用パターンをエッチングで形成し試
験用基板を得た。As for the outer layer, as in the case of the inner layer wiring board described above, the through hole is filled with an epoxy resin paste, and a through hole having a diameter of 150 μm is punched at the same position again by an excimer laser to form a resin on the through hole wall. After providing the through hole having the layer, the wiring board for the outer layer having the through hole filled with the conductive paste was formed. Two outer-layer wiring boards were placed on both sides of the inner-layer wiring board, sandwiched between copper foils, heated and pressed by a vacuum hot press, and an outer-layer pattern was formed by etching to obtain a test substrate.
【００３８】（実施例４）絶縁基材としてアラミド不織
布にエポキシ樹脂を含浸させて作った多孔質基材である
アラミドエポキシコンポジットを用い、それにエキシマ
レーザ加工機等で直径１８０μm の貫通孔をあけ、樹脂
溶液を貫通孔内壁部に塗布し樹脂層を形成し貫通孔を所
望の直径にした後、導電性ペーストを充填しビアを形成
後、銅箔で両側を挟み真空熱プレスにより加熱加圧成形
し、内層用パターンをエッチングで形成し内層用の配線
板を得る。Example 4 An aramid epoxy composite, which is a porous base material made by impregnating an aramid nonwoven fabric with an epoxy resin, was used as an insulating base material, and a through-hole having a diameter of 180 μm was made by using an excimer laser processing machine or the like. After applying the resin solution to the inner wall of the through hole to form a resin layer and making the through hole a desired diameter, fill the conductive paste and form vias, sandwich both sides with copper foil, and heat and press mold with a vacuum heat press. Then, the inner layer pattern is formed by etching to obtain the inner layer wiring board.
【００３９】同様にして、外層用の配線板を得るため
に、エキシマレーザ加工機等で直径１８０μm の貫通孔
をあけ、樹脂溶液を塗布することにより貫通孔内壁部に
樹脂層を形成し貫通孔を所望の直径にした後、貫通孔に
導電性ペーストを充填した絶縁基材を形成し、両側に配
し銅箔で挟みこみ真空熱プレスにより加熱加圧成形を行
い、外層用パターンをエッチングで形成し試験用の多層
配線基板を得た。Similarly, in order to obtain a wiring board for the outer layer, a through hole having a diameter of 180 μm is opened by an excimer laser processing machine or the like, and a resin solution is applied to form a resin layer on the inner wall portion of the through hole. After forming the desired diameter, form an insulating base material filled with conductive paste in the through holes, place it on both sides, sandwich with copper foil, heat and press mold with a vacuum hot press, and etch the outer layer pattern by etching. A multilayer wiring board for forming and testing was obtained.
【００４０】（実施例５）貫通孔内壁部に樹脂層を形成
するために埋め込む樹脂としてフィラー入りのものを用
いた他は実施例３と全く同様に試験用基板を作成した。
フィラー材料としては無機物系の絶縁材料を樹脂材料に
混合して使用した。また、フィラー材料を適切に選定し
含有量を調整することにより、熱膨張係数を導電性ペー
ストとほぼ同じ値にしてある。Example 5 A test substrate was prepared in exactly the same manner as in Example 3 except that a resin containing a filler was used as a resin to be embedded to form a resin layer on the inner wall of the through hole.
An inorganic insulating material was mixed with a resin material and used as the filler material. Further, the coefficient of thermal expansion is made to be almost the same as that of the conductive paste by appropriately selecting the filler material and adjusting the content.
【００４１】（実施例６）貫通孔内壁部に樹脂層を形成
するために埋め込む樹脂としてフィラー入りのものを用
いた他は実施例４と全く同様に評価用基板を作成した。
フィラー材料としては無機物系の絶縁材料を樹脂材料に
混合して使用した。また、フィラー材料を適切に選定し
含有量を調整することにより、熱膨張係数を導電性ペー
ストとほぼ同じ値にしてある。Example 6 An evaluation substrate was prepared in exactly the same manner as in Example 4 except that a resin containing a filler was used as a resin to be embedded to form a resin layer on the inner wall of the through hole.
An inorganic insulating material was mixed with a resin material and used as the filler material. Further, the coefficient of thermal expansion is made to be almost the same as that of the conductive paste by appropriately selecting the filler material and adjusting the content.
【００４２】（比較例）比較例用として、アラミド不織
布にエポキシ樹脂を含浸させて作った多孔質基材エキシ
マレーザ加工機で直径１５０μm の貫通孔をあけ導電性
ペーストを充填しビアを形成後、銅箔で両側を挟み真空
熱プレスにより加熱加圧成形し、内層用パターンをエッ
チングで形成し内層用板を得、さらに同様に外層用板と
を得た。(Comparative Example) As a comparative example, a porous base material excimer laser machine made by impregnating an aramid nonwoven fabric with an epoxy resin was used to form a via hole by forming a through hole having a diameter of 150 μm and filling with a conductive paste. Both sides were sandwiched between copper foils, and heat and pressure molding was performed by a vacuum hot press, an inner layer pattern was formed by etching to obtain an inner layer plate, and similarly, an outer layer plate was obtained.
【００４３】内層用板と外層用板との間で、プレスによ
り加熱加圧成形を行い、外層用パターンをエッチングで
形成し比較例の試験基板を得た。Between the inner layer plate and the outer layer plate, heat press molding was performed by a press, and the outer layer pattern was formed by etching to obtain a test substrate of a comparative example.
【００４４】本実施例および比較例にて作成した試験用
基板を用いてビアホールと電気的な接続の信頼性および
ビア間の耐マイグレーション性（絶縁性）を評価した。
本発明のプリント配線板によって作成されるビアの電気
的な接続信頼性の評価方法は次のように行う。Using the test substrates prepared in this example and the comparative example, the reliability of the electrical connection with the via hole and the migration resistance (insulating property) between the vias were evaluated.
The method for evaluating the electrical connection reliability of vias formed by the printed wiring board of the present invention is performed as follows.
【００４５】（１）ビアホール接続抵抗
ビアの接続抵抗の評価方法はビア接続が直列に５００個
のチェーン配線を接続した抵抗測定により行う。ビア５
００個分の接続抵抗と配線抵抗の総和分を４端子測定法
で求め、試験前後のビア抵抗値の変化量を求めるもので
ある。信頼性試験として温度サイクル試験および半田デ
ィップ（はんだ浸漬）試験、オイルディップ（油浸）試
験を行った。(1) Via-hole connection resistance The method of evaluating the connection resistance of vias is performed by measuring the resistance in which 500 chain wirings are connected in series. Beer 5
The total of 00 connection resistances and wiring resistances is obtained by the 4-terminal measurement method, and the amount of change in via resistance value before and after the test is obtained. As a reliability test, a temperature cycle test, a solder dip (solder dip) test, and an oil dip (oil dip) test were performed.
【００４６】温度サイクル試験は気相中にてー５５℃で
３０分放置し、後＋１２５℃で３０分放置を繰り返し１
０００回実施したとき、ビア接続抵抗の変化量で比較す
る。はんだディップ試験は、２３０℃に溶解したはんだ
槽に１０秒間漬けた後同様にビア接続抵抗の変化量を測
定、比較する。In the temperature cycle test, the sample was left in the gas phase at −55 ° C. for 30 minutes and then left at + 125 ° C. for 30 minutes.
When it is performed 000 times, the change amount of the via connection resistance is compared. In the solder dip test, the amount of change in via connection resistance is measured and compared in the same manner after being immersed in a solder bath melted at 230 ° C. for 10 seconds.
【００４７】オイルディップ試験はオイルによる液相中
の温度サイクル試験である。試験基板を高温２６０℃に
加熱したオイル中に１０秒間漬け、室温で１０秒間保持
し、さらに２０℃のオイル中に１０秒間漬ける。評価は
この温度サイクルを２００回繰り返した後に行う。その
時、高温側、低温側それぞれの漬けている時の抵抗を測
定し２００回の間断線がないことを確認し、２００回後
の抵抗値変化量を測定し比較する。The oil dip test is a temperature cycle test in a liquid phase with oil. The test substrate is immersed in oil heated to a high temperature of 260 ° C. for 10 seconds, kept at room temperature for 10 seconds, and further immersed in oil of 20 ° C. for 10 seconds. The evaluation is performed after repeating this temperature cycle 200 times. At that time, the resistance at the time of soaking on each of the high temperature side and the low temperature side was measured, and it was confirmed that there was no disconnection for 200 times, and the resistance change amount after 200 times was measured and compared.
【００４８】（２）耐マイグレーション性試験
電気的に接続されている５００ビアのチェーン配線を設
け、そのすぐ隣に一定の間隔をおいて、電気的に接続さ
れている５００ビアのチェーン配線を設ける。それぞれ
のチェーン配線は接続されていない。これらのそれぞれ
の配線チェーンに＋３５Ｖの電位差を与え６０℃９５％
の湿熱中に１０００時間放置した後のそれぞれのチェー
ン配線間の抵抗値を比較測定した。これらの電気的な接
続信頼性および耐マイグレーション性の評価結果を表１
に示す。(2) Migration resistance test A chain wiring of 500 vias electrically connected is provided, and a chain wiring of 500 vias electrically connected is provided immediately adjacent to the chain wiring. . Each chain wiring is not connected. A potential difference of + 35V is applied to each of these wiring chains at 60 ° C and 95%
After being left for 1000 hours in the moist heat, the resistance values between the respective chain wirings were comparatively measured. Table 1 shows the evaluation results of these electrical connection reliability and migration resistance.
Shown in.
【００４９】[0049]
【表１】 [Table 1]
【００５０】表１に示すように本実施例のプリント配線
板は比較例のプリント配線板に比べて接続抵抗値の変化
量が小さいのが分かる。また耐マイグレーション性も良
好なことが分かる。特に貫通孔内壁の樹脂層にフィラー
を混合したものは電気的な接続信頼性が向上し絶縁抵抗
値が高く耐マイグレーション性が向上しているのが分か
る。本発明のプリント配線板では、貫通孔の内壁に樹脂
層を形成することによりビアホール貫通孔内壁の状態を
良好円滑にせしめ、ビアホールによる接続信頼性を高
め、ビアホール接続不良、マイグレーションによる絶縁
破壊等を起こさないようにすることができる。As shown in Table 1, it can be seen that the printed wiring board of the present embodiment has a smaller amount of change in connection resistance value than the printed wiring board of the comparative example. Further, it can be seen that the migration resistance is also good. In particular, it can be seen that the resin mixture of the resin layer on the inner wall of the through hole has improved electrical connection reliability, high insulation resistance, and improved migration resistance. In the printed wiring board of the present invention, by forming a resin layer on the inner wall of the through hole, the state of the inner wall of the via hole through hole can be made smooth smoothly, the connection reliability by the via hole can be improved, the via hole connection failure, the dielectric breakdown due to migration, etc. You can prevent it from happening.
【００５１】[0051]
【発明の効果】以上のように本発明のプリント配線板お
よび製造方法は貫通孔の内壁に樹脂層を形成することに
より多孔質基材を用いた場合でも、ビアホール貫通孔内
壁の状態を良好にせしめ、導電性ペーストを貫通孔内部
に確実に充填でき、ビアホールによる接続信頼性を高
め、ビアホール接続不良、マイグレーションによる絶縁
破壊等を起こさないようにすることができ、品質を大幅
に向上させることができる。As described above, according to the printed wiring board and the manufacturing method of the present invention, by forming the resin layer on the inner wall of the through hole, the state of the inner wall of the via hole can be improved even when the porous substrate is used. At the very least, it is possible to reliably fill the inside of the through-hole with the conductive paste, improve the connection reliability by the via hole, prevent the via hole connection failure, insulation breakdown due to migration, etc., and significantly improve the quality. it can.
【図１】本発明の実施例のプリント配線板を説明するた
めの部分縦断面図である。FIG. 1 is a partial vertical cross-sectional view for explaining a printed wiring board according to an embodiment of the present invention.
【図２】多層ブリント配線基板の部分縦断面図である。FIG. 2 is a partial vertical cross-sectional view of a multilayer printed wiring board.
【図３】従来のプリント配線板を説明するための部分縦
断面図である。FIG. 3 is a partial vertical cross-sectional view for explaining a conventional printed wiring board.
１ ビアホール １０ 貫通孔 ２ 絶縁基材 ３ 樹脂層 ４ 銅箔 ５ 導電ペースト ６ 導電ペーストしみこみ部 1 beer hall 10 through holes 2 Insulating base material 3 resin layers 4 copper foil 5 Conductive paste 6 Conductive paste soaked part
フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ Ｈ０５Ｋ 3/46 Ｈ０５Ｋ 3/46 Ｘ (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 1/11 H05K 3/00 H05K 3/40 H05K 3/46 Front page continuation (51) Int.Cl. 7 identification code FI H05K 3/46 H05K 3/46 X (58) Fields investigated (Int.Cl. 7 , DB name) H05K 1/11 H05K 3/00 H05K 3 / 40 H05K 3/46
Claims (5)
に電極接続用ビアホールを備えたプリント配線基板の製
造方法において、 該絶縁用基材にビアホール用の貫通孔を前記樹脂含浸繊
維シートの含浸樹脂が溶融する加工条件に設定されたレ
ーザ若しくはドリルにより形成すると共に、該絶縁用基
材の加熱溶解成分により貫通孔内面に樹脂層を被覆形成
し、 その後に、該樹脂層を介在したまま貫通孔内側に接続導
体を形成することによりビアホールを形成することを特
徴とするプリント配線基板の製造方法。1. A method for manufacturing a printed wiring board, comprising an insulating base material made of a resin-impregnated fiber sheet and having via holes for electrode connection, wherein a through hole for a via hole is provided in the insulating base material.
If the processing conditions are set so that the impregnated resin of the fiber sheet melts,
Laser or drill, and the insulating base
A printed wiring board characterized in that a via hole is formed by forming a resin layer on the inner surface of the through hole by heating and melting components of the material , and then forming a connection conductor inside the through hole with the resin layer interposed. Manufacturing method.
た後に、該貫通孔に導電性ペーストを充填してビアホー
ルを形成し、銅箔で前記ビアホールの両面を挟んで加熱
加圧成形し、前記銅箔をエッチングして配線パターン成
形することを特徴とする請求項１に記載の製造方法。2. A resin layer as described above is formed on the inner surface of the through hole.
After that, fill the through holes with a conductive paste and fill the via holes.
And then heat both sides of the via hole with copper foil.
Press molding and etching the copper foil to form a wiring pattern.
The process according to claim 1, characterized in that the shape.
を含有することを特徴とする請求項１又は２に記載の製
造方法。3. The manufacturing method according to claim 1, wherein the resin layer contains an electrically insulating filler.
ーザ加熱法を用いることを特徴とする請求項１に記載の
製造方法。4. The manufacturing method according to claim 1, wherein a CO 2 laser heating method is used in the process of forming the through hole.
又はアラミド繊維と、エポキシ樹脂又はビスマレイミド
トリアジン樹脂と、から成るコンポジットである請求項
１ないし４いずれかに記載の製造方法。5. The method according to claim 1, wherein the resin-impregnated fiber sheet is a composite of glass fiber or aramid fiber and epoxy resin or bismaleimide triazine resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33582397A JP3441945B2 (en) | 1997-12-05 | 1997-12-05 | Printed wiring board and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33582397A JP3441945B2 (en) | 1997-12-05 | 1997-12-05 | Printed wiring board and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11177199A JPH11177199A (en) | 1999-07-02 |
| JP3441945B2 true JP3441945B2 (en) | 2003-09-02 |
Family
ID=18292812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33582397A Expired - Fee Related JP3441945B2 (en) | 1997-12-05 | 1997-12-05 | Printed wiring board and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3441945B2 (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002100850A (en) * | 2000-09-21 | 2002-04-05 | Ibiden Co Ltd | Method of manufacturing wiring board |
| JP2002299784A (en) * | 2001-03-29 | 2002-10-11 | Matsushita Electric Ind Co Ltd | Connection structure of substrate, and manufacturing method thereof |
| JP2002329974A (en) * | 2001-05-01 | 2002-11-15 | Nitto Denko Corp | Wiring board and method of manufacturing the same |
| JP5017750B2 (en) * | 2001-06-04 | 2012-09-05 | 日立化成工業株式会社 | CONNECTION BOARD, MULTILAYER WIRING BOARD USING THE CONNECTION BOARD, MANUFACTURING METHOD OF CONNECTION BOARD AND MULTILAYER WIRING BOARD MANUFACTURING METHOD USING THE METHOD |
| WO2003009660A1 (en) * | 2001-07-18 | 2003-01-30 | Matsushita Electric Industrial Co., Ltd. | Method and material for manufacturing circuit-formed substrate |
| US20080164057A1 (en) | 2003-07-30 | 2008-07-10 | Hiroyuki Mori | Printed Wiring Board And Method Of Manufacturing Same |
| US7488895B2 (en) | 2003-09-29 | 2009-02-10 | Panasonic Corporation | Method for manufacturing component built-in module, and component built-in module |
| JP2006237241A (en) * | 2005-02-24 | 2006-09-07 | Kyocera Corp | Printed circuit board and manufacturing method thereof |
| JP2007115840A (en) * | 2005-10-19 | 2007-05-10 | Kyocera Corp | Wiring board and manufacturing method thereof |
| JP5056489B2 (en) * | 2008-03-07 | 2012-10-24 | 日立化成工業株式会社 | Insulation reliability evaluation structure of printed circuit board interlayer connection circuit and its insulation reliability evaluation test method |
| JP5106206B2 (en) * | 2008-03-28 | 2012-12-26 | 京セラＳｌｃテクノロジー株式会社 | Insulating sheet punching method and wiring board manufacturing method |
| JP6003194B2 (en) * | 2012-04-27 | 2016-10-05 | セイコーエプソン株式会社 | Base substrate, electronic device, and method of manufacturing base substrate |
-
1997
- 1997-12-05 JP JP33582397A patent/JP3441945B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11177199A (en) | 1999-07-02 |
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