JP3437730B2 - Substrate processing equipment - Google Patents
Substrate processing equipmentInfo
- Publication number
- JP3437730B2 JP3437730B2 JP32843196A JP32843196A JP3437730B2 JP 3437730 B2 JP3437730 B2 JP 3437730B2 JP 32843196 A JP32843196 A JP 32843196A JP 32843196 A JP32843196 A JP 32843196A JP 3437730 B2 JP3437730 B2 JP 3437730B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- holding
- holding surface
- processing apparatus
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、半導体基板や液
晶ディスプレイなどの製造に用いられるガラス基板など
（以下、「基板」という。）を製造する際に、複数の処
理部を用いて基板に処理を施す基板処理装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to processing a substrate using a plurality of processing units when manufacturing a glass substrate or the like (hereinafter referred to as "substrate") used for manufacturing a semiconductor substrate or a liquid crystal display. The present invention relates to a substrate processing apparatus for performing
【０００２】[0002]
【従来の技術】複数の処理部において基板を処理する基
板処理装置の例として、基板の表面にエッチングやレジ
スト膜剥離などの薬液処理を行う基板処理装置がある。
このような基板処理装置では多槽型基板処理装置とし
て、薬液を貯留した薬液槽と純水を貯留した純水洗浄槽
とを備え、基板を薬液槽、純水洗浄槽に順次、浸漬させ
て基板に対して処理を施すものがある（以下、薬液槽
や、純水洗浄槽を単に「薬液・純水洗浄槽」とい
う。）。また、このような基板処理装置では最終の純水
洗浄処理が完了した基板に乾燥処理を施す乾燥室も備え
ている。2. Description of the Related Art As an example of a substrate processing apparatus that processes a substrate in a plurality of processing sections, there is a substrate processing apparatus that performs chemical treatment such as etching or resist film peeling on the surface of the substrate.
In such a substrate processing apparatus, a multi-tank type substrate processing apparatus is provided with a chemical solution tank storing a chemical solution and a pure water cleaning tank storing pure water, and the substrate is sequentially immersed in the chemical solution tank and the pure water cleaning tank. Some substrates are processed (hereinafter, the chemical solution tank and the pure water cleaning tank are simply referred to as "chemical solution / pure water cleaning tank"). Further, such a substrate processing apparatus also includes a drying chamber for performing a drying process on the substrate that has been subjected to the final pure water cleaning process.
【０００３】一方、基板処理装置の中には単槽型基板処
理装置として、１つの薬液・純水洗浄槽に薬液、純水を
順次、交互に供給して薬液・純水洗浄槽内の薬液と純水
とを順次、交互に置換することで基板を空気に触れさせ
ることなく薬液処理、純水洗浄処理を行うものもある。
また、このような基板処理装置では最終の純水洗浄が完
了した基板に乾燥処理を施す乾燥室を備えるものや、前
記１つの薬液・純水洗浄槽にて乾燥処理まで行うものも
ある（以下、薬液処理や、純水洗浄処理、そして、乾燥
処理を単に「処理」という。）。On the other hand, among the substrate processing apparatuses, as a single tank type substrate processing apparatus, the chemical solution and the pure water are sequentially and alternately supplied to one chemical solution / pure water cleaning tank to sequentially and alternately supply the chemical solution in the chemical solution / pure water cleaning tank. There is also a method in which the chemical solution treatment and the pure water cleaning treatment are carried out without exposing the substrate to the air by sequentially and alternately substituting pure water with pure water.
In addition, such a substrate processing apparatus may be provided with a drying chamber for performing a drying process on the substrate that has been subjected to final deionized water cleaning, or may be subjected to a drying process in the one chemical liquid / deionized water cleaning tank (hereinafter referred to as "drying process"). , Chemical solution treatment, pure water cleaning treatment, and drying treatment are simply referred to as "treatment".)
【０００４】以上のような基板処理装置では、処理槽や
乾燥室などに基板を搬送する搬送ロボットを有している
が、搬送ロボットの基板を保持する保持部には処理後の
基板を保持する度に基板に付着している薬液や純水が付
着することとなる。しかし、基板は僅かな汚染に対して
も品質として大きな影響を受けるものであるため、搬送
ロボットの保持部には基板を汚染しないようにする様々
な工夫が必要となる。The substrate processing apparatus as described above has a transfer robot for transferring the substrate to a processing tank or a drying chamber. The substrate holding unit of the transfer robot holds the processed substrate. Each time, the chemical liquid or pure water attached to the substrate is attached. However, even if the substrate is slightly contaminated, the quality of the substrate is greatly affected. Therefore, the holding portion of the transfer robot needs various measures to prevent the substrate from being contaminated.
【０００５】そこで、基板処理装置に保持部を洗浄した
り乾燥したりする機構を設け、常に洗浄や乾燥を行った
保持部を用いて基板を保持し、搬送を行うようにしてい
る。Therefore, the substrate processing apparatus is provided with a mechanism for cleaning and drying the holding part, and the holding part that has been cleaned and dried is always used to hold the substrate and carry it.
【０００６】[0006]
【発明が解決しようとする課題】しかし、基板処理装置
に保持部を洗浄したり乾燥したりする機構を設けたので
は基板処理装置全体が大きくなってしまうと共に装置自
体も複雑なものとなってしまう。また、基板を保持する
度に保持部を洗浄していたのではスループットが低減し
てしまうこととなる。However, if the substrate processing apparatus is provided with a mechanism for cleaning and drying the holding portion, the entire substrate processing apparatus becomes large and the apparatus itself becomes complicated. I will end up. Further, if the holding unit is cleaned every time the substrate is held, the throughput will be reduced.
【０００７】そこで、この発明は、上記課題に鑑みなさ
れたもので、搬送ロボットの保持部の洗浄および乾燥を
不要とするととにより、基板処理装置の機構を複雑なも
のとすることなく、装置の小型化およびスループットの
向上を図ることができる基板処理装置を提供することを
目的とする。Therefore, the present invention has been made in view of the above-mentioned problems, and by eliminating the need for cleaning and drying the holding portion of the transfer robot, the mechanism of the substrate processing apparatus is not complicated and the apparatus An object of the present invention is to provide a substrate processing apparatus which can be downsized and whose throughput can be improved.
【０００８】[0008]
【課題を解決するための手段】請求項１の発明は、基板
に所定の一連の処理を施す基板処理装置であって、前記
基板に薬液処理を施す薬液処理部と、前記基板に純水洗
浄処理を施す純水洗浄処理部と、前記基板に乾燥処理を
施す乾燥処理部とを含む複数の処理部と、前記複数の処
理部の間において前記基板を搬送する第１および第２の
搬送手段とを備え、前記第１および第２の搬送手段のそ
れぞれは、前記基板に接触して保持する複数の保持面群
を有する保持部と、受け取る前記基板の処理段階に応じ
て前記複数の保持面群を切り替える切換手段とを有し、
前記複数の処理部のそれぞれが、前記保持面群と前記基
板の受渡を行う受渡手段を有し、前記複数の保持面群
は、それぞれ特定の表面状態の基板のみを保持し、薬液
処理後の前記基板は、前記第１搬送手段が有する前記保
持面群で受け取り、純水洗浄処理後の前記基板は、前記
第２搬送手段が有する前記保持面群で受け取る。According to a first aspect of the present invention, there is provided a substrate processing apparatus for subjecting a substrate to a predetermined series of treatments, which comprises a liquid chemical treating section for subjecting the substrate to a liquid chemical treatment, and washing the substrate with pure water.
A pure water cleaning processing unit that performs a cleaning process and a drying process on the substrate
A plurality of processing units including a drying unit for applying, and first and second convey means for conveying the substrate between the plurality of processing units, its said first and second conveying means
Each of them is a group of holding surfaces that contact and hold the substrate.
With a holding part, and depending on the processing stage of the substrate to be received
And a switching means for switching the plurality of holding surface groups,
Each of the plurality of processing units has a delivery unit that delivers the holding surface group and the substrate, and the plurality of holding surface groups
Holds only the substrate with a specific surface state,
The processed substrate is stored in the first transfer means.
The substrate after being received by the holding surface group and subjected to the pure water cleaning treatment is
It is received by the holding surface group included in the second conveying means .
【０００９】請求項２の発明は、請求項１記載の基板処
理装置であって、前記第１の搬送手段は、前記薬液処理
後の基板のみを保持する第１保持面群と、乾燥状態の基
板のみを保持する第２保持面群と、を備え、前記第２の
搬送手段は、前記純水洗浄処理後の基板のみを保持する
第３保持面群と、乾燥状態の基板のみを保持する第４保
持面群と、を備える。According to a second aspect of the present invention, there is provided the substrate processing apparatus according to the first aspect , wherein the first transfer means is the chemical liquid processing.
A first holding surface group that holds only the rear substrate and a dry substrate
A second holding surface group for holding only the plate, and the second holding surface group
The transfer means holds only the substrate after the pure water cleaning process.
The third holding surface group and the fourth holding surface that holds only the substrate in a dry state.
And a holding surface group .
【００１０】請求項３の発明は、請求項２記載の基板処
理装置であって、前記薬液処理部の前記受渡手段は、前
記第１保持面群のみに薬液処理後の前記基板を渡し、前
記純水洗浄処理部の前記受渡手段は、前記第３保持面群
のみに純水洗浄処理後の前記基板を渡し、前記乾燥処理
部の前記受渡手段は、前記第４保持面群のみに乾燥状態
の前記基板を渡す。A third aspect of the present invention is the substrate processing apparatus according to the second aspect , wherein the delivery means of the chemical liquid processing section is a front
The substrate after the chemical treatment is passed only to the first holding surface group,
The delivery means of the pure water cleaning processing unit is the third holding surface group.
Deliver the substrate after pure water cleaning treatment to
Part of the delivery means is in a dry state only on the fourth holding surface group.
Pass the substrate of .
【００１１】請求項４の発明は、請求項１ないし３のい
ずれかに記載の基板処理装置であって、前記薬液処理部
と前記純水洗浄処理部と前記乾燥処理部とが所定の方向
に配列され、前記第１および第２の搬送手段が、互いに
平行に配置された直線状の案内手段により案内されるこ
とにより前記所定の方向に前記基板を搬送する。The invention of claim 4 is the same as claims 1 to 3.
The substrate processing apparatus according to any one of the above, wherein the chemical liquid processing unit
And the deionized water cleaning processing section and the drying processing section are arranged in a predetermined direction, and the first and second conveying means are mutually arranged.
Guided by linear guide means arranged in parallel.
The substrate is conveyed in the predetermined direction by .
【００１２】請求項５の発明は、請求項４記載の基板処
理装置であって、前記所定の方向が水平方向を向いてお
り、前記第１および第２の搬送手段の前記案内手段が互
いに上下に平行に配置されている。According to a fifth aspect of the present invention, in the substrate processing apparatus according to the fourth aspect, the predetermined direction is a horizontal direction, and the guide means of the first and second transfer means are arranged above and below each other. Are arranged in parallel with.
【００１３】請求項６の発明は、請求項４記載の基板処
理装置であって、前記所定の方向が水平方向を向いてお
り、前記第１および第２の搬送手段の前記案内手段が互
いに段違平行に配置されている。According to a sixth aspect of the present invention, in the substrate processing apparatus according to the fourth aspect, the predetermined direction is a horizontal direction, and the guiding means of the first and second conveying means are arranged in a stepwise manner. They are arranged in parallel.
【００１４】請求項７の発明は、請求項４記載の基板処
理装置であって、前記所定の方向が水平方向を向いてお
り、前記第１および第２の搬送手段の前記案内手段の間
に前記複数の処理部が配置されている。According to a seventh aspect of the present invention, in the substrate processing apparatus according to the fourth aspect, the predetermined direction is a horizontal direction, and between the guide means of the first and second transfer means. The plurality of processing units are arranged.
【００１５】請求項８の発明は、請求項１ないし７のい
ずれかに記載の基板処理装置であって、前記受渡手段
が、前記基板を昇降させる昇降手段である。An eighth aspect of the present invention is the substrate processing apparatus according to any one of the first to seventh aspects, wherein the delivery means is an elevating means for elevating and lowering the substrate.
【００１６】請求項９の発明は、請求項１ないし８のい
ずれかに記載の基板処理装置であって、前記保持部が、
水平方向を向く互いに平行な１対の回転軸と、前記１対
の回転軸のそれぞれに沿って取り付けられ、表裏各面が
保持面となっている１対の保持板とを有し、前記１対の
保持板のそれぞれの一保持面が対をなすことにより前記
複数の保持面群の一保持面群となっており、前記基板の
外縁部が前記一保持面群に当接して前記基板の主面の法
線が前記１対の回転軸とほぼ同じ方向を向くように前記
基板が保持され、前記切替手段が、前記１対の保持板を
前記１対の回転軸を中心としてそれぞれ回転させる手段
である。An invention according to claim 9 is the substrate processing apparatus according to any one of claims 1 to 8, wherein the holding portion is
A pair of rotation axes parallel to each other, which are parallel to each other,
It is attached along each of the rotation axes of
And a pair of holding plates serving as holding surfaces,
The respective holding surfaces of the holding plates are paired to form
It is one holding surface group of a plurality of holding surface groups,
The outer edge portion is in contact with the one holding surface group and the
The lines are oriented so that they are oriented in substantially the same direction as the pair of rotation axes.
The substrate is held, and the switching means holds the pair of holding plates.
Means for respectively rotating about the pair of rotation axes
Is .
【００１７】請求項１０の発明は、基板に所定の一連の
処理を施す基板処理装置であって、前記基板に薬液処理
を施す薬液処理部と、前記基板に純水洗浄処理を施す純
水洗浄処理部と、前記基板に乾燥処理を施す乾燥処理部
とを含む複数の処理部と、前記複数の処理部の間におい
て前記基板を搬送する第１および第２の搬送手段と、を
備え、前記第１の搬送手段は、前記基板に接触して保持
する３対以上の保持面群を有する保持部と、前記３対以
上の保持面群を切り替える切換手段と、を備え、前記第
２の搬送手段は、前記基板に接触して保持する１対以上
の保持面群を有する保持部と、前記１対以上の保持面群
を切り替える切換手段と、を備え、前記複数の処理部の
それぞれは、前記保持面群と前記基板の受渡を行う受渡
手段を備え、前記３対以上の保持面群と前記１対以上の
保持面群とは、それぞれ特定の表面状態の基板のみを保
持し、薬液処理後の前記基板は、前記第１の搬送手段に
備える前記保持面群のみで受け取られ、乾燥処理後の前
記基板は、前記第２の搬送手段に備える前記保持面群の
みで受け取られる。According to a tenth aspect of the present invention, a substrate is provided with a predetermined series of
A substrate processing apparatus for performing processing, wherein the substrate is treated with a chemical solution.
The chemical liquid processing part that performs the cleaning process and the pure water cleaning process that cleans the substrate.
Water cleaning processing section and drying processing section that performs drying processing on the substrate
And a plurality of processing units including
First and second transporting means for transporting the substrate by
And the first transfer means is held in contact with the substrate.
A holding portion having three or more pairs of holding surfaces,
Switching means for switching the upper holding surface group, and
The second transfer means is a pair or more for holding and holding the substrate.
Holding part having a holding surface group, and one or more pairs of holding surface groups
Switching means for switching between the plurality of processing units.
Each is a transfer that transfers the holding surface group and the substrate.
Means for holding the three or more pairs of holding surface groups and the one or more pairs of holding surface groups.
The holding surface group holds only the substrate with a specific surface condition.
The substrate after being held and treated with the chemical solution is transferred to the first transfer means.
Before being received only by the holding surface group provided and after the drying process.
The substrate is one of the holding surface groups provided in the second transporting means.
Received only by yourself .
【００１８】[0018]
【００１９】[0019]
＜１． 第１の実施の形態＞
＜１．１ 全体構成＞図１はこの発明の一の実施の形態
である基板処理装置１を示す斜視図である。また、図２
は基板処理装置１を（＋Ｘ）方向から（−Ｘ）方向を向
いて見たときの各構成要素の配置の概略を示した図であ
る。<1. First Embodiment><1.1 Overall Configuration> FIG. 1 is a perspective view showing a substrate processing apparatus 1 according to an embodiment of the present invention. Also, FIG.
FIG. 3 is a diagram schematically showing the arrangement of each component when the substrate processing apparatus 1 is viewed from the (+ X) direction toward the (−X) direction.
【００２０】この基板処理装置１は複数枚の基板Ｗ（以
下、単に「基板Ｗ」という。）を一括して処理する装置
であり、この装置は図１に示すようにカセットＣにセッ
トされた基板Ｗを装置外部との間で受け渡しする搬出入
部２、搬出入部２に搬入された基板Ｗを受け取って搬送
する搬送部３、搬送部３から基板Ｗを受け取って所定の
一連の処理を施す処理ユニット４から構成されている。The substrate processing apparatus 1 is an apparatus for collectively processing a plurality of substrates W (hereinafter simply referred to as "substrate W"), and this apparatus is set in a cassette C as shown in FIG. A loading / unloading section 2 for transferring the substrate W to and from the outside of the apparatus, a transporting section 3 for receiving and transporting the substrate W loaded in the loading / unloading section 2, a process for receiving the substrate W from the transporting section 3 and performing a predetermined series of processes It is composed of a unit 4.
【００２１】搬出入部２は、搬入された（あるいは搬出
直前の）基板ＷをカセットＣにセットして一時的にＹ方
向に並べて載置しておくカセット台２１、Ｙ方向に移動
するとともにＺ方向に昇降可能とされ、また、Ｚ軸に平
行な軸を中心に回転可能となっている移載ロボット２
２、移載ロボット２２により載置されたカセットＣから
基板Ｗを下方より突き上げて搬送部３に渡す突上部２
３、および、空のカセットＣを洗浄するカセット洗浄部
２４から構成される。The carry-in / carry-out unit 2 sets the carried-in (or just before carry-out) substrates W in a cassette C and temporarily places them side by side in the Y direction. The cassette base 21 moves in the Y direction and moves in the Z direction. The transfer robot 2 that can be moved up and down and is rotatable about an axis parallel to the Z axis.
2. The protrusion 2 that pushes up the substrate W from the lower side of the cassette C placed by the transfer robot 22 and transfers it to the transfer unit 3.
3 and a cassette cleaning unit 24 for cleaning an empty cassette C.
【００２２】搬送部３は、Ｘ方向にのみ移動可能であ
り、突上部２３から受け取った基板Ｗを処理ユニット４
に渡し、所定の処理が完了した基板を突上部２３に返却
する第１搬送ロボット３ａおよび第２搬送ロボット３ｂ
から構成され、第２搬送ロボット３ｂは第１搬送ロボッ
トの３ａの直上位置に配置されている。The transfer unit 3 is movable only in the X direction, and receives the substrate W received from the protrusion 23 in the processing unit 4.
To the first transfer robot 3a and the second transfer robot 3b for returning the substrate on which the predetermined processing is completed to the protrusion 23.
The second transfer robot 3b is arranged at a position directly above the first transfer robot 3a.
【００２３】第１および第２搬送ロボットは３ａ、３ｂ
は、それぞれＹ方向に伸びる保持板３１を１対ずつ有し
ており、１対の保持板３１に挟まれるようにして起立姿
勢の複数の基板をＹ方向に並べて保持するようになって
いる。また、これらの１対の保持板３１はそれぞれＹ方
向に伸びる軸３３に取り付けられており（図２参照）、
これらの軸を中心として回転するようになっている。The first and second transfer robots 3a and 3b
Has a pair of holding plates 31 extending in the Y direction, respectively, and holds a plurality of substrates in an upright posture side by side so as to be sandwiched between the pair of holding plates 31. The pair of holding plates 31 are attached to shafts 33 extending in the Y direction (see FIG. 2).
It is designed to rotate around these axes.
【００２４】図３(a)および(b)は基板Ｗを保持した状態
の保持板３１の様子を（＋Ｙ）方向から（−Ｙ）方向を
向いて見たときの側面図である。２つの保持板３１は矢
印Ｒ１に示すように軸３３を中心に互いに反対方向に同
じ回転角だけ回転するようになっており、それぞれの保
持板３１の表裏両面である保持面３１ａ、３１ｂは対と
なって基板Ｗを保持するようになっている。すなわち、
図３(a)に示すように基板Ｗが保持されるときに一方の
保持板３１が基板Ｗに対して保持面３１ａを向けている
ときは常に他方の保持板３１も保持面３１ａを基板Ｗに
向けており、図３(b)に示すように一方の保持板３１が
基板Ｗに対して保持面３１ｂを向けているときは常に他
方の保持板３１も保持面３１ｂを基板Ｗに向けるように
なっている。これにより、例えば、図３(a)に示すよう
に乾燥した基板Ｗ１は１対の保持面３１ａを用いて保持
し、図３(b)に示すように薬液が付着した基板Ｗ２は１
対の保持面３１ｂを用いて保持するようにすると、基板
Ｗへの不要な液を付着を考慮することなく１対の保持板
３１を用いて２つの表面状態の基板Ｗ１、Ｗ２を保持す
ることが可能となる。3 (a) and 3 (b) are side views of the holding plate 31 holding the substrate W as seen from the (+ Y) direction to the (-Y) direction. As shown by the arrow R1, the two holding plates 31 rotate about the shaft 33 in opposite directions by the same rotation angle, and the holding surfaces 31a and 31b, which are the front and back surfaces of the respective holding plates 31, are opposite to each other. Thus, the substrate W is held. That is,
As shown in FIG. 3A, when one of the holding plates 31 faces the substrate W when holding the substrate W, the other holding plate 31 also always holds the holding surface 31a. When one holding plate 31 faces the holding surface 31b with respect to the substrate W as shown in FIG. 3B, the other holding plate 31 also always holds the holding surface 31b toward the substrate W. It has become. Thereby, for example, the dried substrate W1 is held by using the pair of holding surfaces 31a as shown in FIG. 3A, and the substrate W2 to which the chemical solution is attached is 1 as shown in FIG. 3B.
When the pair of holding surfaces 31b is used for holding, the pair of holding plates 31 is used to hold the two substrates W1 and W2 in the two surface states without considering the adhesion of unnecessary liquid to the substrate W. Is possible.
【００２５】なお、各保持板３１の表裏両面である２つ
の保持面３１ａ、３１ｂには基板Ｗをその主面の法線が
Ｙ方向を向いて保持されるように複数の溝ＧがＹ方向に
垂直な方向に形成されており、２つの保持板３１がＹ−
Ｚ面に平行な状態で基板Ｗをその間に配置し、その後両
保持板３１を回転させて基板Ｗを挟み込むようにして保
持するようになっている。The two holding surfaces 31a and 31b, which are the front and back surfaces of each holding plate 31, are provided with a plurality of grooves G in the Y direction so that the substrate W is held so that the normal to the principal surface of the holding plate 31 faces the Y direction. Is formed in a direction perpendicular to the
The substrate W is arranged in the state parallel to the Z plane, and then both holding plates 31 are rotated to sandwich and hold the substrate W.
【００２６】第１および第２搬送ロボット３ａ、３ｂの
各保持板３１は軸３３を介してＸ方向に伸びる直動手段
３２（駆動源と案内手段とを兼ね備えたもの）によりＸ
方向に移動するようになっている（図１、図２参照）。
したがって、突上部２３において突き上げられた基板Ｗ
は第１および第２搬送ロボット３ａ、３ｂにより保持さ
れて処理ユニット４上をＸ方向に搬送されることとな
る。Each holding plate 31 of the first and second transfer robots 3a and 3b is moved by a linear movement means 32 (having both a drive source and a guide means) extending in the X direction via a shaft 33 to X.
It is designed to move in the direction (see FIGS. 1 and 2).
Therefore, the substrate W pushed up at the protrusion 23
Will be held by the first and second transfer robots 3a and 3b and will be transferred on the processing unit 4 in the X direction.
【００２７】処理ユニット４は、基板Ｗに薬液処理を施
す薬液処理部４ａ、基板Ｗに純水洗浄処理を施す純水洗
浄処理部４ｂ、薬液・純水処理部４ｃ、および、基板Ｗ
に乾燥処理を施す乾燥処理部４ｄ（以下、これらを総称
して「処理部」という。）から構成されている。また、
これらの処理部はＸ方向に並んで配置されており、この
上を第１および第２搬送ロボット３ａ、３ｂの保持板３
１が移動するようになっている。The processing unit 4 includes a chemical liquid processing section 4a for performing chemical processing on the substrate W, a pure water cleaning processing section 4b for performing pure water cleaning processing on the substrate W, a chemical / pure water processing section 4c, and the substrate W.
It is composed of a drying processing section 4d (hereinafter collectively referred to as "processing section") for performing a drying process on the. Also,
These processing units are arranged side by side in the X direction, and the holding plates 3 of the first and second transfer robots 3a and 3b are arranged on the processing units.
1 is moving.
【００２８】薬液処理部４ａは薬液を貯留する薬液槽４
３ａを有し、薬液槽４３ａは図２に示すように薬液を供
給する処理液供給部４４に接続されている。また、薬液
槽４３ａからあふれ出した薬液は排出部４５から排出さ
れ図示しない温度調節手段、濾過手段を通じて再び処理
液供給部４４を通じて薬液槽４３ａに循環される。この
薬液槽４３ａでは温度調節手段が設けられてかつ薬液を
循環させていることから、比較的高温度、高濃度の薬液
による薬液処理が行われる。The chemical liquid processing section 4a is a chemical liquid tank 4 for storing the chemical liquid.
3a, and the chemical liquid tank 43a is connected to the processing liquid supply unit 44 for supplying the chemical liquid as shown in FIG. Further, the chemical liquid overflowing from the chemical liquid tank 43a is discharged from the discharge portion 45 and circulated to the chemical liquid tank 43a again through the treatment liquid supply portion 44 through the temperature adjusting means and the filtering means (not shown). Since the chemical solution tank 43a is provided with a temperature adjusting means and circulates the chemical solution, the chemical solution is treated with the chemical solution of relatively high temperature and high concentration.
【００２９】純水洗浄処理部４ｂは純水洗浄槽４３ｂを
有する。純水洗浄槽４３ｂは下部から純水が供給され上
部から純水があふれ出すようになっており、薬液槽４３
ａで薬液処理が施された後の基板Ｗが持ち込まれたと
き、該基板Ｗに付着した薬液を純水で洗い流して除去す
る。The pure water cleaning processing section 4b has a pure water cleaning tank 43b. The pure water cleaning tank 43b is designed so that pure water is supplied from the lower part and pure water overflows from the upper part.
When the substrate W that has been subjected to the chemical liquid treatment in a is brought in, the chemical liquid adhering to the substrate W is washed away with pure water and removed.
【００３０】薬液・純水洗浄処理部４ｃは１つの薬液・
純水洗浄槽４３ｃを有する。薬液・純水洗浄槽４３ｃの
下部からは薬液、純水がそれぞれ順次、交互に所定時間
供給される。これによって、薬液・純水洗浄槽４３ｃ内
は薬液、純水に交互に置き換わる。よって、純水洗浄槽
４３ｂにて純水洗浄処理が施された後、この薬液・純水
洗浄槽４３ｃに浸漬された基板Ｗは空気に触れることな
く薬液処理、純水洗浄処理を施される。The chemical / pure water cleaning processing section 4c is a single chemical /
It has a pure water cleaning tank 43c. From the lower part of the chemical / pure water cleaning tank 43c, the chemical and pure water are sequentially and alternately supplied for a predetermined time. As a result, the inside of the chemical / pure water cleaning tank 43c is alternately replaced with the chemical and pure water. Therefore, after the pure water cleaning treatment is performed in the pure water cleaning treatment tank 43b, the substrate W immersed in the chemical / pure water cleaning treatment tank 43c is subjected to the chemical treatment and the pure water cleaning treatment without touching the air. .
【００３１】この薬液・純水洗浄槽４３ｃでは薬液と純
水とが交互に置換されることから薬液槽４３ａで用いら
れる薬液に比べて低温度、低濃度の薬液による薬液処理
が行われる。なお、乾燥処理部４ｄについては乾燥処理
が行われる乾燥室４３ｄが設けられている。Since the chemical liquid and the pure water are alternately replaced in the chemical liquid / pure water cleaning tank 43c, the chemical liquid is treated with a chemical liquid having a lower temperature and a lower concentration than the chemical liquid used in the chemical liquid tank 43a. A drying chamber 43d in which the drying process is performed is provided for the drying processing unit 4d.
【００３２】また、薬液槽４３ａ、純水洗浄槽４３ｂ、
薬液・純水洗浄槽４３ｃはそれぞれ基板Ｗを保持する保
持台４１と保持台４１を上下に昇降させる昇降手段４２
を有している。乾燥処理部４ｄも形態は異なるが、乾燥
室４３ｄから基板Ｗを出し入れする昇降手段および保持
台を有している（図示省略）。これにより、各処理部と
第１および第２搬送ロボット３ａ、３ｂとは基板Ｗの受
け渡しが可能とされており、基板Ｗに薬液処理、純水洗
浄処理、および、乾燥処理を施すことができるようにな
っている。Further, a chemical solution tank 43a, a pure water cleaning tank 43b,
The chemical / deionized water cleaning tank 43 c is provided with a holding table 41 for holding the substrate W and a lifting means 42 for vertically moving the holding table 41.
have. Although the dry processing unit 4d also has a different form, it has an elevating means for holding the substrate W in and out of the drying chamber 43d and a holding table (not shown). As a result, each processing unit and the first and second transfer robots 3a and 3b can transfer the substrate W, and the substrate W can be subjected to the chemical treatment, the pure water cleaning treatment, and the drying treatment. It is like this.
【００３３】＜１．２ 動作＞次に、この基板処理装置
１の動作について図１および図４を用いて説明する。<1.2 Operation> Next, the operation of the substrate processing apparatus 1 will be described with reference to FIGS. 1 and 4.
【００３４】まず、図１に示すように基板Ｗはカセット
Ｃにセットされた状態で装置外部から搬送車などの手段
により搬送されてカセット台２１上に載置される。カセ
ット台２１に載置されたカセットは移載ロボット２２に
より突上部２３に載置される。なお、突上部２３にはカ
セットＣが同時に２つ載置可能になっており、ここで、
カセットＣがＺ方向を向く軸を中心として９０度回転さ
れた後、２つのカセットＣ内部の基板Ｗが同時に上方へ
と突き上げ取り出される。空になったカセットＣは、再
び移載ロボット２２に把持されてカセット洗浄部２４へ
と格納され、基板Ｗに所定の一連の処理が施されている
間に洗浄処理が施される。First, as shown in FIG. 1, the substrate W set in the cassette C is transferred from the outside of the apparatus by means such as a transfer vehicle and placed on the cassette table 21. The cassette placed on the cassette table 21 is placed on the protrusion 23 by the transfer robot 22. It should be noted that two cassettes C can be placed on the protrusion 23 at the same time.
After the cassette C is rotated 90 degrees about the axis facing the Z direction, the substrates W in the two cassettes C are simultaneously pushed up and taken out. The emptied cassette C is again gripped by the transfer robot 22 and stored in the cassette cleaning unit 24, and the cleaning process is performed while the substrate W is subjected to a predetermined series of processes.
【００３５】突上部２３により突き上げられた基板Ｗは
図４に示すように第１搬送ロボット３ａに保持されなが
ら矢印Ｐ１１に示すように薬液処理部４ａへと搬送され
る。なお、このとき基板Ｗは第１搬送ロボット３ａの保
持板３１の１対の保持面３１ａ（図３(a)参照）により
保持される。The substrate W pushed up by the protrusion 23 is carried to the chemical solution processing section 4a as shown by an arrow P11 while being held by the first transfer robot 3a as shown in FIG. At this time, the substrate W is held by the pair of holding surfaces 31a (see FIG. 3A) of the holding plate 31 of the first transfer robot 3a.
【００３６】薬液処理部４ａへと搬送された基板Ｗは第
１搬送ロボット３ａから保持台４１へと受け渡しされ、
昇降手段４２により薬液槽４３ａ内部の薬液に浸漬され
る。ここで基板Ｗには薬液処理が施され、その後、昇降
手段４２により取り出される。The substrate W transferred to the chemical treatment unit 4a is transferred from the first transfer robot 3a to the holding table 41,
It is immersed in the chemical liquid inside the chemical liquid tank 43a by the elevating means 42. Here, the substrate W is subjected to the chemical treatment, and then taken out by the elevating means 42.
【００３７】薬液槽４３ａから取り出された基板Ｗは保
持台４１から第１搬送ロボット３ａへと再び渡される。
このとき、第１搬送ロボット３ａは保持板３１の１対の
保持面３１ｂ（図３(b)参照）にて受け取る。したがっ
て、保持面３１ｂには基板Ｗに付着している薬液が付着
するが保持面３１ａには付着することはない。The substrate W taken out of the chemical liquid tank 43a is transferred again from the holding table 41 to the first transfer robot 3a.
At this time, the first transfer robot 3a receives the pair of holding surfaces 31b of the holding plate 31 (see FIG. 3B). Therefore, the chemical liquid adhering to the substrate W adheres to the holding surface 31b, but does not adhere to the holding surface 31a.
【００３８】薬液処理部４ａから基板Ｗを受け取った第
１搬送ロボット３ａは、次に、矢印Ｐ１２に示すように
純水洗浄処理部４ｂへと基板Ｗを搬送し、薬液処理部４
ａと同様、基板Ｗを保持台４１に渡す。そして第１搬送
ロボット３ａは次の処理されるべき基板Ｗを受け取るた
めに矢印Ｐ１４に示すように再び突上部２３へと移動す
る。純水洗浄処理部４ｂは受け取った基板Ｗに純水洗浄
処理を施し、基板Ｗに付着した薬液を洗い流す。そし
て、第２搬送ロボットへ３ｂへと基板Ｗを渡す。このと
き、第２搬送ロボット３ｂは保持面３１ａにて基板Ｗを
受け取り、該保持面３１ａには純水が付着する。The first transfer robot 3a having received the substrate W from the chemical treatment unit 4a then conveys the substrate W to the pure water cleaning treatment unit 4b as indicated by an arrow P12, and the chemical treatment unit 4a.
Similar to a, the substrate W is transferred to the holding table 41. Then, the first transfer robot 3a moves again to the protrusion 23 in order to receive the next substrate W to be processed as shown by an arrow P14. The pure water cleaning processing unit 4b performs a pure water cleaning process on the received substrate W to wash away the chemical liquid adhering to the substrate W. Then, the substrate W is transferred to the second transfer robot 3b. At this time, the second transfer robot 3b receives the substrate W on the holding surface 31a, and pure water adheres to the holding surface 31a.
【００３９】純水洗浄処理部４ｂから基板Ｗを受け取っ
た第２搬送ロボット３ｂは矢印Ｐ１３に示すように薬液
・純水洗浄処理部４ｃに基板Ｗを渡す。The second transfer robot 3b having received the substrate W from the pure water cleaning processing unit 4b transfers the substrate W to the chemical / pure water cleaning processing unit 4c as indicated by an arrow P13.
【００４０】以上のように第１搬送ロボット３ａでは、
保持板３１の１対の保持面３１ａは基板処理装置１へ搬
入された直後の基板Ｗを保持するためにのみ用いられ、
１対の保持面３１ｂは薬液処理部４ａでの薬液処理後の
基板Ｗを受け取るためにのみ用いられている。したがっ
て、保持面３１ａには液が付着することはなく、保持面
３１ｂには薬液のみが付着することとなる。As described above, in the first transfer robot 3a,
The pair of holding surfaces 31 a of the holding plate 31 is used only for holding the substrate W immediately after being loaded into the substrate processing apparatus 1,
The pair of holding surfaces 31b is used only for receiving the substrate W after the chemical liquid processing in the chemical liquid processing portion 4a. Therefore, the liquid does not adhere to the holding surface 31a, and only the chemical liquid adheres to the holding surface 31b.
【００４１】基板Ｗを第２搬送ロボット３ｂから受け取
った薬液・純水洗浄処理部４ｃは基板Ｗを昇降させてさ
らに他の薬液処理および純水洗浄処理を基板Ｗに施し、
この基板Ｗを第２搬送ロボット３ｂに渡す。このとき、
第２搬送ロボット３ｂは２つの保持板３１の１対の保持
面３１ａを用いて基板Ｗを保持する。このとき保持面３
１ａは純水洗浄処理部４ｂから渡された基板Ｗに接触し
ているので純水が付着しているが、薬液・純水洗浄処理
部４ｃから渡される基板Ｗも純水が付着しているので問
題はない。Upon receiving the substrate W from the second transfer robot 3b, the chemical / pure water cleaning unit 4c moves the substrate W up and down to perform another chemical liquid process and pure water cleaning process on the substrate W.
The substrate W is transferred to the second transfer robot 3b. At this time,
The second transfer robot 3b holds the substrate W by using the pair of holding surfaces 31a of the two holding plates 31. At this time, the holding surface 3
Since 1a is in contact with the substrate W transferred from the pure water cleaning processing unit 4b, pure water is adhered thereto, but pure water is also adhered to the substrate W transferred from the chemical / pure water cleaning processing unit 4c. So there is no problem.
【００４２】第２搬送ロボット３ｂは薬液・純水洗浄処
理部４ｃから受け取った基板Ｗを矢印Ｐ１５に示すよう
に乾燥処理部４ｄの上方へと搬送する。ここで、乾燥処
理部４ｄの保持台が基板Ｗを受け取って乾燥処理を施
し、乾燥した基板Ｗを再び第２搬送ロボット３ｂに渡
す。このとき、第２搬送ロボット３ｂは保持板３１の１
対の保持面３１ｂを用いて基板Ｗを受け取る。すなわ
ち、第２搬送ロボット３ｂにおいては保持面３１ａは純
水洗浄処理部４ｂ、薬液・純水洗浄処理部４ｃにて純水
洗浄処理が施された後の純水が付着した基板Ｗを保持す
るためにのみ用いられ、保持面３１ｂは乾燥処理が施さ
れた後の乾燥した基板Ｗを保持するためにのみ用いられ
ることとなる。なお、基板Ｗを乾燥処理部４ｄから受け
取った第２搬送ロボット３ｂは矢印Ｐ１６に示すように
突上部２３へと基板Ｗを搬送して突上部２３に基板Ｗを
返却する。そして、次の基板を受け取るために矢印Ｐ１
７に示すように純水洗浄処理部４ｂへと移動する。The second transfer robot 3b transfers the substrate W received from the chemical / pure water cleaning processing section 4c to above the drying processing section 4d as shown by an arrow P15. Here, the holder of the drying processing unit 4d receives the substrate W, performs the drying process, and transfers the dried substrate W to the second transfer robot 3b again. At this time, the second transfer robot 3b moves the holding plate 31
The substrate W is received using the pair of holding surfaces 31b. That is, in the second transfer robot 3b, the holding surface 31a holds the substrate W to which the pure water has been attached after the pure water cleaning processing unit 4b and the pure water cleaning processing unit 4c perform the pure water cleaning processing. The holding surface 31b is used only for holding the dried substrate W after the drying process. The second transfer robot 3b, which has received the substrate W from the drying processing unit 4d, transfers the substrate W to the protrusion 23 and returns the substrate W to the protrusion 23 as indicated by an arrow P16. Then, the arrow P1 is received to receive the next substrate.
As shown in FIG. 7, it moves to the pure water cleaning processing unit 4b.
【００４３】突上部２３ではカセット洗浄部２４にて洗
浄されたカセットＣが移載ロボット２２を用いて配置さ
れ、処理後の基板Ｗがこの中に格納される（図１参
照）。そして、処理が施された基板Ｗがセットされたカ
セットＣはカセット台２１に載置されて装置外部へと搬
出されていく。At the projecting portion 23, the cassette C cleaned by the cassette cleaning unit 24 is arranged by using the transfer robot 22, and the processed substrate W is stored therein (see FIG. 1). Then, the cassette C on which the processed substrate W is set is placed on the cassette table 21 and carried out to the outside of the apparatus.
【００４４】＜１．３ 効果＞以上、第１の実施の形態
における基板処理装置１の構成および動作について説明
してきたが、この基板処理装置１はこのように第１およ
び第２搬送ロボット３ａ、３ｂを有し、かつ、各搬送ロ
ボットは基板Ｗを保持する保持面の対を２つ有している
ので、これらの保持面３１ａ、３１ｂを使い分けること
により、各保持面は特定の表面状態の基板Ｗのみを保持
することができる。その結果、保持板３１自体に洗浄や
乾燥を施すことなく、基板Ｗに悪影響を与える液や汚染
物質の付着を防止することができる。また、これによ
り、装置の小型化およびスループットの向上を図ること
ができる。<1.3 Effects> The configuration and operation of the substrate processing apparatus 1 according to the first embodiment have been described above, but the substrate processing apparatus 1 is thus configured so that the first and second transfer robots 3a, 3b and each transfer robot has two pairs of holding surfaces for holding the substrate W. Therefore, by properly using these holding surfaces 31a and 31b, each holding surface has a specific surface state. Only the substrate W can be held. As a result, it is possible to prevent the liquid or contaminants that adversely affect the substrate W from adhering without cleaning or drying the holding plate 31 itself. Further, this makes it possible to reduce the size of the device and improve the throughput.
【００４５】さらに、この基板処理装置１では第１およ
び第２搬送ロボット３ａ、３ｂが上下に配置されている
ので、装置の占有床面積の低減も図ることができる。ま
た、この基板処理装置１では、各処理部がＸ方向に配列
されており、直動手段３２や昇降手段４２は１軸の移動
機構であるので、基板Ｗの受渡の際の位置決めを正確に
行うことができ、迅速で信頼性の高い受渡を容易に実現
することができる。Further, in the substrate processing apparatus 1, since the first and second transfer robots 3a and 3b are arranged vertically, the floor area occupied by the apparatus can be reduced. Further, in this substrate processing apparatus 1, since the respective processing units are arranged in the X direction and the linear moving means 32 and the elevating means 42 are uniaxial moving mechanisms, the positioning at the time of delivering the substrate W is accurately performed. It can be carried out, and quick and reliable delivery can be easily realized.
【００４６】＜１．４ 搬送ロボットの配置変形例＞図
５はこの発明の第１の実施の形態である基板処理装置１
において第２搬送ロボット３ｂの配置が変更されたもの
（図中符号３ｃ）を示す図であり、第１の実施の形態に
おける図２に相当する図である。<1.4 Modification of Arrangement of Transfer Robot> FIG. 5 shows a substrate processing apparatus 1 according to the first embodiment of the present invention.
FIG. 3 is a view showing a modified arrangement (reference numeral 3c in the drawing) of the second transfer robot 3b in FIG. 3 and is a view corresponding to FIG. 2 in the first embodiment.
【００４７】この第２搬送ロボット３ｃは図２に示され
る第２搬送ロボット３ｂと異なり、直動手段３２が第１
搬送ロボット３ａの直動手段３２に対して側方上方に平
行に（段違平行に）に配置されている。したがって、第
２搬送ロボット３ｃの保持板３１が取り付けられた軸３
３は第１搬送ロボット３ａのものよりも長いものとなっ
ている。The second transfer robot 3c is different from the second transfer robot 3b shown in FIG.
The transfer robot 3a is arranged in parallel to the linear movement means 32 of the transfer robot 3a (in parallel to the step). Therefore, the shaft 3 to which the holding plate 31 of the second transfer robot 3c is attached
3 is longer than that of the first transfer robot 3a.
【００４８】このように、第１および第２搬送ロボット
３ａ、３ｃを段違い平行に配置することにより、両搬送
ロボットの保持板３１の上下方向の距離を第１の実施の
形態の基板処理装置１に比べて小さくすることができ
る。また、各処理部に設けられている昇降手段４２ｓは
第１の実施の形態のものに比べて低く押さえることがで
きる。その結果、この基板処理装置は第１の実施の形態
の基板処理装置１に比べて高さ方向に対して低く押さえ
られている。これにより、搬送ロボットを２つ有するた
めに装置全高が高くなるという問題が克服されている。
また、基板Ｗの高さ方向の搬送経路も短く押さえられる
こととなり、スループットも向上される。In this way, by arranging the first and second transfer robots 3a and 3c in parallel in different steps, the vertical distance between the holding plates 31 of both transfer robots is set to the substrate processing apparatus 1 of the first embodiment. It can be smaller than. Further, the elevating means 42s provided in each processing unit can be held lower than that of the first embodiment. As a result, this substrate processing apparatus is held lower in the height direction than the substrate processing apparatus 1 of the first embodiment. This overcomes the problem that the total height of the apparatus is high due to having two transfer robots.
Further, the transport path in the height direction of the substrate W is also suppressed to be short, and the throughput is also improved.
【００４９】さらに、第１の実施の形態では搬送ロボッ
トは２つであるが、これは説明の便宜上２つのものを示
したに過ぎず、もちろん３つ以上であってもよい。この
場合、特定の種類の処理部から取り出される特定の表面
状態の基板を受け取る搬送ロボットを特定のものに決め
ておけば（２つ以上であってもよい）、基板Ｗを保持す
る部位の洗浄・乾燥を不要とすることが可能であり、上
記効果を得るようにすることができる。なお、処理内容
によっては任意の搬送ロボットが受け取るようにしても
よい。このような場合であっても搬送ロボットが多いほ
どスループットの向上を図ることができる。Further, in the first embodiment, the number of transfer robots is two, but this is merely two for the sake of convenience of explanation, and of course, it may be three or more. In this case, if a transfer robot that receives a substrate having a specific surface state taken out from a processing unit of a specific type is determined to be a specific one (there may be two or more), cleaning of a portion holding the substrate W is performed. -It is possible to eliminate the need for drying and obtain the above effect. Depending on the processing content, an arbitrary transfer robot may receive it. Even in such a case, the throughput can be improved as the number of transfer robots increases.
【００５０】＜１．５ 処理ユニットの変形例＞図６は
第１の実施の形態に示す基板処理装置１の処理ユニット
４の構成を変形した例を示す動作図である。この変形例
では、処理ユニット４は薬液処理のみを行う薬液処理部
４ｅ、純水洗浄処理のみを行う純水洗浄処理部４ｆ、お
よび、乾燥処理を行う乾燥処理部４ｄから構成されてい
る。薬液処理部４ｅは第１の実施の形態と同様、薬液槽
を有している。また、純水洗浄処理部４ｆも純水のみが
供給されて貯留されている洗浄槽を有している。なお、
搬出入部２および搬送部３については第１の実施の形態
と同様である。<1.5 Modified Example of Processing Unit> FIG. 6 is an operation diagram showing a modified example of the configuration of the processing unit 4 of the substrate processing apparatus 1 according to the first embodiment. In this modification, the processing unit 4 is composed of a chemical solution processing section 4e that performs only chemical solution processing, a pure water cleaning processing section 4f that performs only pure water cleaning processing, and a drying processing section 4d that performs drying processing. The chemical liquid processing unit 4e has a chemical liquid tank as in the first embodiment. Further, the pure water cleaning processing section 4f also has a cleaning tank in which only pure water is supplied and stored. In addition,
The carry-in / carry-out unit 2 and the carrying unit 3 are the same as those in the first embodiment.
【００５１】この基板処理装置では、第１搬送ロボット
３ａが保持板３１の１対の保持面３１ａを用いて突上部
２３から基板Ｗを受け取り、矢印Ｐ２１に示すように搬
送して薬液処理部４ｅに基板Ｗを渡す。基板Ｗは薬液処
理部４ｅの薬液槽にて浸漬されて処理された後再び第１
搬送ロボット３ａに基板Ｗを渡すが、このとき第１搬送
ロボット３ａは１対の保持面３１ｂを用いて基板Ｗを保
持する。第１搬送ロボット３ａは基板Ｗを矢印Ｐ２２に
示すように搬送して純水洗浄処理部４ｆに渡し、次の基
板を受け取りに矢印Ｐ２３に示すように再び突上部２３
へと移動する。In this substrate processing apparatus, the first transfer robot 3a receives the substrate W from the protrusion 23 using the pair of holding surfaces 31a of the holding plate 31, and transfers the substrate W as shown by an arrow P21 to carry out the chemical treatment section 4e. Pass the substrate W to. The substrate W is dipped and processed in the chemical solution tank of the chemical solution processing unit 4e, and then the first
The substrate W is transferred to the transfer robot 3a, but at this time, the first transfer robot 3a holds the substrate W by using the pair of holding surfaces 31b. The first transfer robot 3a transfers the substrate W to the pure water cleaning processing unit 4f as shown by an arrow P22, and receives the next substrate again as shown by an arrow P23 so as to receive the protrusion 23 again.
Move to.
【００５２】第２搬送ロボット３ｂは、純水洗浄処理が
施された基板Ｗを純水洗浄処理部４ｆから保持板３１の
１対の保持面３１ａを用いて受け取り、矢印Ｐ２４に示
すように搬送して乾燥処理部４ｄに渡す。乾燥処理が施
された基板Ｗは再び第２搬送ロボット３ｂに渡され、矢
印Ｐ２５に示すように突上部２３へと搬送される。この
とき、第２搬送ロボット３ｂは１対の保持面３１ｂを用
いて基板Ｗを搬送する。そして、突上部２３に基板Ｗを
渡すと次の基板を受け取るために純水洗浄処理部４ｆへ
と矢印Ｐ２６に示すように移動する。The second transfer robot 3b receives the substrate W, which has been subjected to the pure water cleaning process, from the pure water cleaning processing section 4f using the pair of holding surfaces 31a of the holding plate 31, and transfers the substrate W as shown by an arrow P24. And pass it to the drying processing section 4d. The dried substrate W is transferred to the second transfer robot 3b again, and is transferred to the protrusion 23 as indicated by an arrow P25. At this time, the second transfer robot 3b transfers the substrate W using the pair of holding surfaces 31b. When the substrate W is transferred to the protrusion 23, the substrate W is moved to the pure water cleaning processing section 4f to receive the next substrate as shown by an arrow P26.
【００５３】このように、この変形例では、第１搬送ロ
ボット３ａの１対の保持板３１の１対の保持面３１ａは
未処理の基板Ｗを搬送するために用いられ、１対の保持
面３１ｂは薬液処理後の基板Ｗを搬送するために用いら
れている。また、第２搬送ロボット３ｂの１対の保持板
３１の１対の保持面３１ａは純水洗浄処理後の基板Ｗを
搬送するために用いられ、１対の保持面３１ｂは乾燥処
理後の基板Ｗを搬送するために用いられている。As described above, in this modification, the pair of holding surfaces 31a of the pair of holding plates 31 of the first transfer robot 3a are used to transfer the unprocessed substrate W, and the pair of holding surfaces 31a. 31b is used to convey the substrate W after the chemical solution treatment. In addition, the pair of holding surfaces 31a of the pair of holding plates 31 of the second transfer robot 3b is used to transfer the substrate W after the pure water cleaning process, and the pair of holding surfaces 31b is the substrate after the drying process. It is used to convey W.
【００５４】＜２． 第２の実施の形態＞図７はこの発
明の第２の実施の形態である基板処理装置を第１の実施
の形態における図２と同様（＋Ｘ）方向から（−Ｘ）方
向を向いて見た図であり、図２と同様の構成要素のみ図
示している。また、図８は第１搬送ロボット３ｄにおい
て第１の実施の形態における保持板３１に代えて取り付
けられている保持体３４を示す図であり、図９は第２搬
送ロボット３ｅに同様に取り付けられている保持アーム
３５を示す図である。さらに、図１０はこの基板処理装
置の動作を示す図である。<2. Second Preferred Embodiment> FIG. 7 shows a substrate processing apparatus according to a second preferred embodiment of the present invention as viewed from the (+ X) direction toward the (-X) direction as in the first preferred embodiment shown in FIG. 2 is a diagram showing only the same components as those in FIG. Further, FIG. 8 is a diagram showing a holder 34 attached in place of the holding plate 31 in the first transfer robot 3d in the first embodiment, and FIG. 9 is similarly attached to the second transfer robot 3e. It is a figure which shows the holding arm 35 which is doing. Further, FIG. 10 is a diagram showing the operation of this substrate processing apparatus.
【００５５】図７に示すように、第１搬送ロボット３ｄ
は第１の実施の形態における２つの保持板３１に代えて
Ｙ方向に伸びる２つの正三角柱の保持体３４となってい
る。すなわち、保持板３１では表裏２面である保持面３
１ａ、３１ｂが基板Ｗの表面状態に応じて切り替えられ
たが、この実施の形態では三角柱の３つの側面である保
持面３４ａ、３４ｂ、３４ｃがその役割を果たすように
なっている。この保持体３４を（＋Ｙ）方向から（−
Ｙ）方向を向いて見た状態を示したものが図８である。
２つの保持体３４のそれぞれの３つの保持面は第１の実
施の形態と同様に軸３３を中心に矢印Ｒ２の方向に回転
して対となって切り替えられるようになっており、それ
ぞれの保持面には基板Ｗを起立姿勢にて保持できるよう
に複数の溝Ｇが形成されている。As shown in FIG. 7, the first transfer robot 3d
In place of the two holding plates 31 in the first embodiment, the two are holding bodies 34 of two equilateral triangular prisms extending in the Y direction. That is, in the holding plate 31, the holding surface 3 which is the front and back surfaces 2
Although 1a and 31b are switched according to the surface state of the substrate W, the holding surfaces 34a, 34b and 34c, which are the three side surfaces of the triangular prism, play the role in this embodiment. This holder 34 is moved from the (+ Y) direction to (-
FIG. 8 shows a state as viewed in the Y) direction.
Each of the three holding surfaces of the two holding bodies 34 is configured to rotate around the shaft 33 in the direction of the arrow R2 to be switched as a pair, similarly to the first embodiment, and each holding surface is retained. A plurality of grooves G are formed on the surface so that the substrate W can be held in an upright posture.
【００５６】また、第２搬送ロボット３ｅは処理ユニッ
ト４を挟んで第１搬送ロボット３ｄと対向して設けられ
ており、各処理部の昇降手段４２ｓの上方を通って伸び
る１対の軸３３のそれぞれに保持アーム３５が取り付け
られたものとなっている。この保持アーム３５を（−
Ｙ）方向から（＋Ｙ）方向を向いて見た状態を示したも
のが図９であり、保持アーム３５が矢印Ｒ３に示すよう
に開閉することにより、基板Ｗを抱え込んで保持するよ
うになっている。The second transfer robot 3e is provided so as to face the first transfer robot 3d with the processing unit 4 interposed therebetween, and a pair of shafts 33 extending above the elevating means 42s of each processing section extends. A holding arm 35 is attached to each of them. This holding arm 35 (-
FIG. 9 shows a state of looking from the (Y) direction to the (+ Y) direction, and the holding arm 35 opens and closes as shown by an arrow R3 to hold and hold the substrate W. There is.
【００５７】この基板処理装置の処理ユニット４は図１
０に示すように、第１薬液処理部４ｇ、第１純水洗浄処
理部４ｈ、第２薬液処理部４ｉ、第２純水洗浄処理部４
ｊ、および、乾燥処理部４ｄがこの順で（−Ｘ）方向か
ら（＋Ｘ）方向に向かって配置されており、各薬液処理
部および各純水洗浄処理部には薬液や純水が貯留されて
いる。なお、第１および第２薬液処理部４ｇ、４ｉに貯
留されている薬液は同種または混合しても問題を生じな
い（有害ガスを発生しないなど）ものとなっている。ま
た、他の構成要素は第１の実施の形態と同様である。The processing unit 4 of this substrate processing apparatus is shown in FIG.
As shown in 0, the first chemical liquid processing unit 4g, the first pure water cleaning processing unit 4h, the second chemical liquid processing unit 4i, and the second pure water cleaning processing unit 4
j and the drying processing unit 4d are arranged in this order from the (−X) direction to the (+ X) direction, and the chemical liquid and pure water are stored in each chemical liquid processing unit and each pure water cleaning processing unit. ing. The chemical liquids stored in the first and second chemical liquid processing units 4g and 4i are of the same kind or mixed with each other without causing a problem (such as generating no harmful gas). Moreover, other components are the same as those in the first embodiment.
【００５８】以下、この基板処理装置の動作を図１０を
用いて説明する。The operation of this substrate processing apparatus will be described below with reference to FIG.
【００５９】まず、第１搬送ロボット３ｄは１対の保持
面３４ａを用いて突上部２３から基板Ｗを受け取って矢
印Ｐ３１に示すように搬送して第１薬液処理部４ｇに渡
す。そして、矢印Ｐ３２、Ｐ３３、Ｐ３４、Ｐ３５に示
すように順に、第１薬液処理部４ｇから１対の保持面３
４ｂを用いて基板Ｗを受け取り第１純水洗浄処理部４ｈ
に渡し、第１純水洗浄処理部４ｈから１対の保持面３４
ｃを用いて基板Ｗを受け取り第２薬液処理部４ｉに渡
し、第２薬液処理部４ｉから１対の保持面３４ｂを用い
て基板Ｗを受け取り第２純水洗浄処理部４ｊに渡し、第
２純水洗浄処理部４ｊから１対の保持面３４ｃを用いて
基板Ｗを受け取り乾燥処理部４ｄに渡す。その後、矢印
Ｐ３６に示すように第１薬液処理部４ｇへと戻る。First, the first transfer robot 3d receives the substrate W from the protrusion 23 using the pair of holding surfaces 34a, transfers the substrate W as shown by an arrow P31, and transfers it to the first chemical liquid processing section 4g. Then, as shown by arrows P32, P33, P34, and P35, the pair of holding surfaces 3 are sequentially arranged from the first chemical liquid processing portion 4g.
The first pure water cleaning processing unit 4h receives the substrate W by using 4b.
And a pair of holding surfaces 34 from the first pure water cleaning processing section 4h.
The substrate W is received using c and is transferred to the second chemical liquid processing unit 4i, the substrate W is received from the second chemical liquid processing unit 4i using the pair of holding surfaces 34b, and is transferred to the second pure water cleaning processing unit 4j. The substrate W is received from the pure water cleaning processing unit 4j using the pair of holding surfaces 34c and passed to the drying processing unit 4d. After that, the process returns to the first chemical liquid processing unit 4g as shown by the arrow P36.
【００６０】一方、第２搬送ロボット３ｅは、乾燥処理
部４ｄから基板Ｗを受け取って矢印Ｐ３７に示すように
搬送して突上部２３に渡し、矢印Ｐ３８に示すように元
の位置に戻る。On the other hand, the second transfer robot 3e receives the substrate W from the drying processing section 4d, transfers it to the projecting portion 23 as shown by an arrow P37, and returns it to its original position as shown by an arrow P38.
【００６１】このような動作を行うことにより、保持体
３４の保持面３４ａは未処理の基板Ｗのみと接触し、保
持面３４ｂは薬液が付着した基板Ｗのみと接触し、保持
面３４ｃは純水が付着した基板Ｗのみと接触することと
なる。また、第１および第２薬液処理部４ｇ、４ｉの薬
液は同種または混合可能なものであるので、これらの処
理部から保持面３４ｂを用いて基板Ｗを受け取るように
しても問題は生じない。したがって、第１の実施の形態
と同様、保持体３４や保持アーム３５の洗浄や乾燥を不
要とし、装置の小型化やスループットの向上を図ること
ができる。By carrying out such an operation, the holding surface 34a of the holding body 34 comes into contact only with the unprocessed substrate W, the holding surface 34b comes into contact only with the substrate W to which the chemical solution is attached, and the holding surface 34c is pure. Only the substrate W to which water adheres will come into contact. Further, since the chemicals of the first and second chemical liquid processing sections 4g and 4i are of the same kind or can be mixed, there is no problem even if the holding surface 34b is used to receive the substrate W from these processing sections. Therefore, similarly to the first embodiment, it is not necessary to wash and dry the holding body 34 and the holding arm 35, and the device can be downsized and the throughput can be improved.
【００６２】また、この実施の形態では第１および第２
搬送ロボット３ｄ、３ｅは十分離れて配置することがで
きるので、各搬送ロボットの配置を容易に決定すること
ができ、かつ、保持体３４と保持アーム３５とに保持さ
れる基板Ｗの距離を小さくすることができ、装置全高を
低く押さえたり短い上下移動によるスループットの向上
を図ることができる。In this embodiment, the first and second
Since the transfer robots 3d and 3e can be arranged at a sufficient distance from each other, the position of each transfer robot can be easily determined, and the distance between the substrate W held by the holding body 34 and the holding arm 35 can be reduced. Therefore, the overall height of the device can be kept low and the throughput can be improved by a short vertical movement.
【００６３】＜３． 第３の実施の形態＞図１１はこの
発明の第３の実施の形態である基板処理装置の保持体３
６を示す図であり、図１２は動作を示す図である。<3. Third Embodiment> FIG. 11 shows a holder 3 of a substrate processing apparatus according to a third embodiment of the present invention.
6 is a diagram showing 6 and FIG. 12 is a diagram showing an operation.
【００６４】この基板処理装置では、第１の実施の形態
の基板処理装置１と比べて、第１搬送ロボット３ｆが保
持板３１に代えて図１１に示すような底面が正方形の角
柱をした保持体３６を有している点で相違し、また、処
理ユニット４も第２の実施の形態と同様の形態となって
いる。ただし、第１および第２薬液処理部４ｇ、４ｉに
貯留されている薬液は例えば酸とアルカリ等互いに混合
してはならないものである。In this substrate processing apparatus, as compared with the substrate processing apparatus 1 of the first embodiment, the first transfer robot 3f is replaced with a holding plate 31 and is held by a square prism having a square bottom surface as shown in FIG. It is different in that it has a body 36, and the processing unit 4 has the same form as that of the second embodiment. However, the chemical liquids stored in the first and second chemical liquid processing portions 4g, 4i must not be mixed with each other such as acid and alkali.
【００６５】図１１に示すように保持体３６が四角柱で
あるので、第２の実施の形態における保持体３４に対し
てさらに１対の保持面を多く有している。すなわち、各
保持体３６は保持面３６ａ，３６ｂ、３６ｃ、３６ｄの
４つの保持面を有しており、両保持体３６が矢印Ｒ４に
示すように軸３３を中心として反対方向に回転すること
により、両保持体３６の対応する保持面が対をなして基
板Ｗを保持するようになっている。したがって、４つの
異なる表面状態の基板Ｗを保持することができるように
なっている。As shown in FIG. 11, since the holder 36 is a quadrangular prism, it has more pairs of holding surfaces than the holder 34 in the second embodiment. That is, each holding body 36 has four holding surfaces 36a, 36b, 36c, 36d, and both holding bodies 36 rotate in opposite directions about the shaft 33 as shown by an arrow R4. Corresponding holding surfaces of both holding members 36 form a pair to hold the substrate W. Therefore, the substrates W having four different surface states can be held.
【００６６】また、第２搬送ロボット３ｂは第１の実施
の形態と同様に２つの保持面３１ａ、３１ｂを有する保
持板３１を１対有している。Further, the second transfer robot 3b has a pair of holding plates 31 having two holding surfaces 31a and 31b as in the first embodiment.
【００６７】このような第１および第２搬送ロボット３
ｆ、３ｂを備えたこの基板処理装置の動作は図１２に示
すように、まず、突上部２３から第１搬送ロボット３ｆ
が１対の保持面３６ａを用いて基板Ｗを受け取り、矢印
Ｐ４１に示すように搬送して第１薬液処理部４ｇに渡
す。以下、順に矢印Ｐ４２、Ｐ４３、Ｐ４４に示すよう
に第１薬液処理部４ｇから第１純水洗浄処理部４ｈへ保
持面３６ｂを用いて搬送し、第１純水洗浄処理部４ｈか
ら第２薬液処理部４ｉへ保持面３６ｃを用いて搬送し、
第２薬液処理部４ｉから第２純水洗浄処理部４ｊへ保持
面３６ｄを用いて搬送する。その後、次の基板を受け取
るために矢印Ｐ４５に示すように突上部２３へと移動す
る。Such first and second transfer robots 3
As shown in FIG. 12, the operation of the substrate processing apparatus provided with f and 3b is as follows.
Receives the substrate W using the pair of holding surfaces 36a, conveys it as shown by an arrow P41, and transfers it to the first chemical liquid processing section 4g. Hereinafter, as indicated by arrows P42, P43, and P44, the first chemical solution treatment unit 4g is conveyed to the first pure water cleaning treatment section 4h using the holding surface 36b, and the first pure water cleaning treatment section 4h is used to convey the second chemical solution. It is conveyed to the processing section 4i using the holding surface 36c,
It is conveyed from the second chemical liquid processing unit 4i to the second pure water cleaning processing unit 4j using the holding surface 36d. After that, in order to receive the next substrate, it moves to the protrusion 23 as shown by an arrow P45.
【００６８】次に、第２搬送ロボット３ｂは矢印Ｐ４
６、Ｐ４７に示すように第２純水洗浄処理部４ｊから乾
燥処理部４ｄへ保持面３１ａを用いて基板Ｗを搬送し、
乾燥処理部４ｄから突上部２３へと保持面３１ｂを用い
て搬送する。その後、次の基板を受け取るために矢印Ｐ
４８に示すように第２純水洗浄処理部４ｊへと移動す
る。Next, the second transfer robot 3b moves to the arrow P4.
6, the substrate W is transported from the second pure water cleaning processing section 4j to the drying processing section 4d using the holding surface 31a as shown in P47,
It is conveyed from the drying processing section 4d to the protrusion 23 using the holding surface 31b. Then, to receive the next substrate, arrow P
As indicated by 48, the second pure water cleaning processing unit 4j is moved to.
【００６９】以上のような搬送動作により、各処理部か
らの基板Ｗの受け取りは第１および第２搬送ロボット３
ｆ、３ｂの異なった保持面で行われるので、たとえ第１
および第２薬液処理部４ｇ、４ｉに貯留されている薬液
が混ざってはならないものであっても保持体３６や保持
板３１の洗浄などを行うことなく基板Ｗを安全に取り扱
うことができる。もちろん、第１の実施の形態と同様、
装置の小型化やスループットの向上も図ることができ
る。With the above-described transfer operation, the first and second transfer robots 3 can receive the substrate W from each processing section.
Since it is performed on different holding surfaces of f and 3b,
Also, the substrate W can be safely handled without cleaning the holding body 36 or the holding plate 31 even if the chemical liquids stored in the second chemical liquid processing units 4g and 4i should not be mixed. Of course, as in the first embodiment,
It is possible to reduce the size of the device and improve the throughput.
【００７０】＜４． 変形例＞以上この発明の実施の形
態について説明してきたが、この発明は上記実施の形態
に限定されるものではない。<4. Modifications> Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments.
【００７１】例えば、上記実施の形態では搬送ロボット
が２つであったが、既述のように３つ以上であってもよ
い。また、処理ユニット４の処理部の数も上記実施の形
態に限定されるものではない。これらは処理内容に応じ
て適宜決定されるものである。For example, although the number of transfer robots is two in the above embodiment, it may be three or more as described above. Further, the number of processing units of the processing unit 4 is not limited to the above embodiment. These are appropriately determined according to the processing content.
【００７２】また、搬送ロボットの保持板３１や保持体
３４、３６も上記実施の形態に限定されるものではな
く、複数の表面状態の基板を搬送できるのであれば、ど
のような形態であってもよい。例えば、保持体として正
六角柱状のものを用い、１対の保持体間の間隔を変更可
能とすると共に、６つの側面を切り替えて保持するよう
にしてもよい。なお、１対の保持体間の間隔を変更可能
とするのは、基板の下方に保持体を移動させるために両
保持体間の間隔を基板の直径より大きくするためであ
る。Further, the holding plate 31 and the holding bodies 34, 36 of the transfer robot are not limited to those in the above-mentioned embodiment, and may be in any form as long as they can transfer substrates having a plurality of surface states. Good. For example, a regular hexagonal column-shaped holder may be used, the distance between the pair of holders may be changed, and the six side surfaces may be switched and held. The distance between the pair of holding bodies can be changed because the distance between the holding bodies is made larger than the diameter of the substrate in order to move the holding bodies below the substrate.
【００７３】また、基板Ｗの処理が完了する前に次の基
板の処理を開始するようにしてももちろんよい。Of course, the processing of the next substrate may be started before the processing of the substrate W is completed.
【００７４】また、保持板３１や保持体３４、３６など
の保持面を有する搬送ロボットにおいて、可能であれば
異なった表面状態の基板Ｗを同一の保持面で保持するよ
うにしてもよいし、異なった保持面において同じ表面状
態の基板Ｗを保持するようにしてもよい。Further, in the transfer robot having the holding surfaces such as the holding plate 31 and the holding bodies 34, 36, the substrates W having different surface states may be held by the same holding surface if possible. The substrates W having the same surface state may be held on different holding surfaces.
【００７５】その他、処理内容や搬送ロボットへの基板
Ｗの受け渡しなどについても適宜変更が可能である。In addition, the processing contents and the transfer of the substrate W to the transfer robot can be appropriately changed.
【００７６】[0076]
【発明の効果】以上説明したように、請求項１，１０記
載の発明では、複数の搬送手段のそれぞれが、複数の処
理部のうちあらかじめ割り当てられた一部の処理部の受
渡手段からのみ基板を受け取るので、各搬送手段は所定
の処理を終えた特定の表面状態の基板のみを搬送するこ
とができる。これにより、各搬送手段の基板を保持する
保持部を洗浄したり乾燥したりする必要をなくすことが
でき、基板処理装置の小型化やスループットの向上を図
ることができる。また、保持面群を切り替えて基板を保
持するので、異なる表面状態の基板を汚染することなく
１つの搬送手段にて容易に保持することができる。 As described above, in the inventions according to claims 1 and 10 , each of the plurality of transfer means transfers the substrate only from the delivery means of a part of the plurality of processing parts which is assigned in advance. Thus, each of the transfer means can transfer only the substrate having a specific surface state after the predetermined processing. As a result, it is possible to eliminate the need for cleaning and drying the holding unit of each transfer unit that holds the substrate, and it is possible to reduce the size of the substrate processing apparatus and improve the throughput. Also, switch the holding surface group to hold the substrate.
Since it holds, it does not contaminate substrates with different surface conditions
It can be easily held by one carrying means.
【００７７】請求項３記載の発明では、各処理部の受渡
手段は特定の一の搬送手段のみに基板を渡すので、各搬
送手段は所定の処理を終えた特定の表面状態の基板のみ
を搬送することとなる。これにより、請求項１記載の発
明と同様、各搬送手段の基板を保持する保持部を洗浄し
たり乾燥したりする必要をなくすことができ、基板処理
装置の小型化やスループットの向上を図ることができ
る。According to the third aspect of the present invention, since the transfer means of each processing section transfers the substrate to only one specific transfer means, each transfer means transfers only the substrate having the specific surface condition after the predetermined processing. Will be done. As a result, as in the first aspect of the present invention, it is possible to eliminate the need for cleaning and drying the holders for holding the substrates of the respective transfer means, and to reduce the size of the substrate processing apparatus and improve the throughput. You can
【００７８】請求項４記載の発明では、複数の処理部が
所定の方向に配列されており、複数の搬送手段が基板を
所定の方向に搬送するので、簡易な構造にて基板を各処
理部へと搬送することができる。In a fourth aspect of the present invention, a plurality of processing sections are arranged in a predetermined direction, and a plurality of transfer means transfers the substrate.
Since the substrate is transported in the predetermined direction, the substrate can be transported to each processing unit with a simple structure.
【００７９】[0079]
【００８０】請求項５記載の発明では、第１および第２
の搬送手段の案内手段が上下に平行に配置されているの
で、基板処理装置が占める床面積を小さく押さえること
ができる。According to the invention of claim 5, the first and second aspects are provided.
Since the guide means of the transfer means are arranged vertically in parallel, the floor area occupied by the substrate processing apparatus can be kept small.
【００８１】請求項６記載の発明では、第１および第２
の搬送手段の案内手段が段違平行に配置されているの
で、第１の搬送手段に保持される基板と第２の搬送手段
に保持される基板との上下方向の距離を小さくすること
ができ、基板処理装置の全高を低く押さえることができ
ると共に、各処理部から基板を受け取るために基板を移
動しなければならない距離を短くすることができ、スル
ープットの向上を図ることができる。According to the invention of claim 6, the first and second aspects are provided.
Since the guide means of the second transfer means are arranged in parallel in different steps, the vertical distance between the substrate held by the first transfer means and the substrate held by the second transfer means can be reduced. The overall height of the substrate processing apparatus can be kept low, and the distance that the substrate must be moved in order to receive the substrate from each processing unit can be shortened, so that the throughput can be improved.
【００８２】請求項７記載の発明では、第１および第２
の搬送手段の案内手段の間に複数の処理部が配置されて
いるので、請求項６記載の発明の効果に加えて各搬送手
段の配置の設計を容易に行うことができる。According to the invention of claim 7, the first and second aspects are provided.
Since a plurality of processing parts are arranged between the guide means of the conveying means, the arrangement of each conveying means can be easily designed in addition to the effect of the invention described in claim 6.
【００８３】請求項８記載の発明では、受渡手段が基板
を昇降させる昇降手段であるので、基板の受渡における
基板の位置決めを正確に行うことができる。According to the eighth aspect of the invention, since the delivery means is the elevating means for raising and lowering the substrate, the substrate can be accurately positioned when delivering the substrate.
【００８４】[0084]
【００８５】請求項９記載の発明では、１対の保持板の
表裏面である保持面を切り替えて基板を保持するので、
２つの表面状態の基板を汚染することなく容易に保持す
ることができる。In the invention according to claim 9 , since the holding surfaces, which are the front and back surfaces of the pair of holding plates, are switched to hold the substrate,
The two surface states of the substrate can be easily held without contamination.
【００８６】[0086]
【図１】この発明の第１の実施の形態における基板処理
装置全体の斜視図である。FIG. 1 is a perspective view of an entire substrate processing apparatus according to a first embodiment of the present invention.
【図２】図１に示す基板処理装置の構成を示す側面図で
ある。FIG. 2 is a side view showing the configuration of the substrate processing apparatus shown in FIG.
【図３】保持板を示す側面図である。FIG. 3 is a side view showing a holding plate.
【図４】図１に示す基板処理装置の動作を示す図であ
る。FIG. 4 is a diagram showing an operation of the substrate processing apparatus shown in FIG.
【図５】図１に示す基板処理装置の一の変形例を示す側
面図である。5 is a side view showing a modification of the substrate processing apparatus shown in FIG.
【図６】図１に示す基板処理装置の他の変形例の動作を
示す図である。6 is a diagram showing an operation of another modification of the substrate processing apparatus shown in FIG.
【図７】この発明の第２の実施の形態における基板処理
装置の構成を示す側面図である。FIG. 7 is a side view showing a configuration of a substrate processing apparatus according to a second embodiment of the present invention.
【図８】保持体を示す側面図である。FIG. 8 is a side view showing a holding body.
【図９】保持アームを示す側面図である。FIG. 9 is a side view showing a holding arm.
【図１０】図７に示す基板処理装置の動作を示す図であ
る。10 is a diagram showing an operation of the substrate processing apparatus shown in FIG.
【図１１】保持体を示す側面図である。FIG. 11 is a side view showing a holding body.
【図１２】この発明の第３の実施の形態における基板処
理装置の動作を示す図である。FIG. 12 is a diagram showing an operation of the substrate processing apparatus according to the third embodiment of the present invention.
１ 基板処理装置 ３ａ、３ｄ、３ｆ 第１搬送ロボット ３ｂ、３ｃ、３ｅ 第２搬送ロボット ４ 処理ユニット ４ａ 薬液処理部 ４ｂ 純水洗浄処理部 ４ｃ 薬液・純水洗浄処理部 ４ｄ 乾燥処理部 ４ｅ 薬液処理部 ４ｆ 純水洗浄処理部 ３１ 保持板 ３１ａ、３１ｂ 保持面 ３２ 直動手段 ３３ 軸 ３４ 保持体 ３４ａ、３４ｂ、３４ｃ 保持面 ３６ 保持体 ３６ａ、３６ｂ、３６ｃ、３６ｄ 保持面 ４１ 保持台 ４２ 昇降手段 Ｇ 溝 Ｒ１、Ｒ２、Ｒ３ 矢印 Ｗ 基板 1 Substrate processing equipment 3a, 3d, 3f First transfer robot 3b, 3c, 3e Second transfer robot 4 processing units 4a Chemical processing part 4b Pure water cleaning unit 4c Chemical / pure water cleaning processing section 4d Drying processing section 4e Chemical processing unit 4f Pure water cleaning processing section 31 holding plate 31a, 31b holding surface 32 Direct-acting means 33 axes 34 holder 34a, 34b, 34c Holding surface 36 Holder 36a, 36b, 36c, 36d Holding surface 41 holding table 42 Lifting means G groove R1, R2, R3 arrows W board
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/304 H01L 21/027 ─────────────────────────────────────────────────── ─── Continuation of front page (58) Fields surveyed (Int.Cl. 7 , DB name) H01L 21/304 H01L 21/027
Claims (10)
装置であって、 前記基板に薬液処理を施す薬液処理部と、前記基板に純
水洗浄処理を施す純水洗浄処理部と、前記基板に乾燥処
理を施す乾燥処理部とを含む複数の処理部と、 前記複数の処理部の間において前記基板を搬送する第１
および第２の搬送手段と、を備え、前記第１および第２の搬送手段のそれぞれが、 前記基板に接触して保持する複数の保持面群を有する保
持部と、 受け取る前記基板の処理段階に応じて前記複数の保持面
群を切り替える切換手段と、を有し、 前記複数の処理部のそれぞれが、前記保持面群 と前記基板の受渡を行う受渡手段を有し、前記複数の保持面群は、それぞれ特定の表面状態の基板
のみを保持し、 薬液処理後の前記基板は、前記第１搬送手段が有する前
記保持面群で受け取られ、 純水洗浄処理後の前記基板は、前記第２搬送手段が有す
る前記保持面群で受け取られる ことを特徴とする基板処
理装置。1. A substrate processing apparatus for performing a predetermined series of processing on a substrate, comprising: a chemical liquid processing unit for performing chemical liquid processing on the substrate;
A pure water cleaning processing unit that performs a water cleaning process and a drying process on the substrate.
A plurality of processing units including a drying processing unit that performs processing, and a first transporting unit that transfers the substrate between the plurality of processing units .
And a second conveying means, provided with, each of the first and second transport means, holding with a plurality of holding surface group which holds in contact with the substrate
A holding part and the plurality of holding surfaces depending on the processing stage of the substrate to be received.
Switching means for switching groups, each of the plurality of processing units has a delivery means for delivering the holding surface group and the substrate , and each of the plurality of holding surface groups has a specific surface state. Board of
Only the substrate is held, and the substrate after the chemical solution treatment is not included in the first transfer means.
The substrate, which has been received by the holding surface group and has been subjected to the pure water cleaning treatment, has the second transfer means
The substrate processing apparatus is received by the holding surface group .
え、 前記第２の搬送手段は、 前記純水洗浄処理後の基板のみを保持する第３保持面群
と、 乾燥状態の基板のみを保持する第４保持面群と、を備え
る ことを特徴とする基板処理装置。2. The substrate processing apparatus according to claim 1, wherein the first transporting unit holds only a first holding surface group that holds only the substrate after the chemical treatment and a substrate that is in a dry state. With a second holding surface group
For example, the second conveying means, third holding surface group which holds only the substrate after the pure water cleaning process
And a fourth holding surface group that holds only the dried substrate.
A substrate processing apparatus, characterized in that that.
みに薬液処理後の前記基板を渡し、 前記純水洗浄処理部の前記受渡手段は、前記第３保持面
群のみに純水洗浄処理後の前記基板を渡し、 前記乾燥処理部の前記受渡手段は、前記第４保持面群の
みに乾燥状態の前記基板を渡す ことを特徴とする基板処
理装置。3. The substrate processing apparatus according to claim 2 , wherein the delivery means of the chemical liquid processing unit is one of the first holding surface group.
The substrate after the chemical treatment, and the delivery means of the pure water cleaning unit is the third holding surface.
The substrate after the pure water cleaning process is delivered only to the group, and the delivery means of the drying processing unit is configured to operate the substrate of the fourth holding surface group.
The substrate processing apparatus is characterized in that the substrate in a dry state is handed over .
板処理装置であって、 前記薬液処理部と前記純水洗浄処理部と前記乾燥処理部
とが 所定の方向に配列され、前記第１および第２の搬送手段が、互いに平行に配置さ
れた直線状の案内手段により案内されることにより前記
所定の方向に前記基板を搬送する ことを特徴とする基板
処理装置。4. The group according to any one of claims 1 to 3.
A plate processing apparatus, wherein the chemical solution processing section, the pure water cleaning processing section, and the drying processing section
And are arranged in a predetermined direction, and the first and second conveying means are arranged in parallel with each other.
By being guided by the linear guide means
A substrate processing apparatus, which conveys the substrate in a predetermined direction .
上下に平行に配置されていることを特徴とする基板処理
装置。5. The substrate processing apparatus according to claim 4, wherein the predetermined direction is a horizontal direction, and the guide means of the first and second transfer means are arranged in parallel with each other in a vertical direction. A substrate processing apparatus characterized in that.
段違平行に配置されていることを特徴とする基板処理装
置。6. The substrate processing apparatus according to claim 4, wherein the predetermined direction is a horizontal direction, and the guide means of the first and second transfer means are arranged in parallel to each other. A substrate processing apparatus characterized in that.
記複数の処理部が配置されていることを特徴とする基板
処理装置。7. The substrate processing apparatus according to claim 4, wherein the predetermined direction is a horizontal direction, and the plurality of processing units are provided between the guide means of the first and second transfer means. A substrate processing apparatus, wherein:
板処理装置であって、 前記受渡手段が、前記基板を昇降させる昇降手段である
ことを特徴とする基板処理装置。8. The substrate processing apparatus according to claim 1 , wherein the delivery unit is an elevating unit that elevates and lowers the substrate.
板処理装置であって、前記保持部が、 水平方向を向く互いに平行な１対の回転軸と、 前記１対の回転軸のそれぞれに沿って取り付けられ、表
裏各面が保持面となっている１対の保持板と、を有し、 前記１対の保持板のそれぞれの一保持面が対をなすこと
により前記複数の保持面群の一保持面群となっており、 前記基板の外縁部が前記一保持面群に当接して前記基板
の主面の法線が前記１対の回転軸とほぼ同じ方向を向く
ように前記基板が保持され、 前記切換手段が、前記１対の保持板を前記１対の回転軸
を中心としてそれぞれ回転させる手段である ことを特徴
とする基板処理装置。9. The substrate processing apparatus according to claim 1 , wherein the holding unit includes a pair of rotating shafts that are parallel to each other and that face in a horizontal direction, and the pair of rotating shafts. Mounted along the table
And a pair of holding plates each having a back surface serving as a holding surface, and each holding surface of the pair of holding plates forms a pair.
Is a holding surface group of the plurality of holding surface groups, and the outer edge portion of the substrate is in contact with the one holding surface group to
The normal line of the main surface of is oriented in the same direction as the pair of rotation axes
The substrate is held as described above, and the switching means causes the pair of holding plates to move to the pair of rotation shafts.
A substrate processing apparatus, characterized in that it is a means for rotating each of them around a center .
理装置であって、 前記基板に薬液処理を施す薬液処理部と、前記基板に純
水洗浄処理を施す純水洗浄処理部と、前記基板に乾燥処
理を施す乾燥処理部とを含む複数の処理部と、 前記複数の処理部の間において前記基板を搬送する第１
および第２の搬送手段と、を備え、 前記第１の搬送手段は、 前記基板に接触して保持する３対以上の保持面群を有す
る保持部と、 前記３対以上の保持面群を切り替える切換手段と、を備
え、 前記第２の搬送手段は、 前記基板に接触して保持する１対以上の保持面群を有す
る保持部と、 前記１対以上の保持面群を切り替える切換手段と、を備
え、 前記複数の処理部のそれぞれは、 前記保持面群と前記基板の受渡を行う受渡手段を備え、 前記３対以上の保持面群と前記１対以上の保持面群と
は、それぞれ特定の表面状態の基板のみを保持し、 薬液処理後の前記基板は、前記第１の搬送手段に備える
前記保持面群のみで受け取られ、 乾燥処理後の前記基板は、前記第２の搬送手段に備える
前記保持面群のみで受け取られる ことを特徴とする基板
処理装置。10. A substrate treatment for subjecting a substrate to a predetermined series of treatments.
A management apparatus, and chemical treatment unit for performing the chemical treatment to the substrate, pure the substrate
A pure water cleaning processing unit that performs a water cleaning process and a drying process on the substrate.
A plurality of processing units including a drying processing unit for performing processing, and a first transporting unit between the plurality of processing units.
And a second transfer means, wherein the first transfer means has three or more pairs of holding surface groups for contacting and holding the substrate.
And a switching means for switching the three or more pairs of holding surface groups.
For example, the second conveying means, having a one or more pairs of holding surface group which holds in contact with the substrate
And a switching means for switching the one or more pairs of holding surface groups.
For example, each of the plurality of processing units, comprising a delivery means for performing transfer of the substrate and the holding surface group, the 3 or more pairs of holding surface group and said one or more pairs of the holding surface group
Respectively hold only the substrate having a specific surface state, and the substrate after the chemical treatment is provided in the first transfer means.
The substrate that has been received only by the holding surface group and that has undergone the drying process is provided in the second transfer unit.
A substrate processing apparatus, wherein the substrate processing apparatus is received only by the holding surface group .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32843196A JP3437730B2 (en) | 1996-12-09 | 1996-12-09 | Substrate processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32843196A JP3437730B2 (en) | 1996-12-09 | 1996-12-09 | Substrate processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10172939A JPH10172939A (en) | 1998-06-26 |
| JP3437730B2 true JP3437730B2 (en) | 2003-08-18 |
Family
ID=18210194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32843196A Expired - Fee Related JP3437730B2 (en) | 1996-12-09 | 1996-12-09 | Substrate processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3437730B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4197103B2 (en) * | 2002-04-15 | 2008-12-17 | 株式会社荏原製作所 | Polishing equipment |
| JP3978393B2 (en) | 2002-12-02 | 2007-09-19 | 株式会社カイジョー | Substrate processing equipment |
| JP5875901B2 (en) * | 2012-03-09 | 2016-03-02 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing equipment |
-
1996
- 1996-12-09 JP JP32843196A patent/JP3437730B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10172939A (en) | 1998-06-26 |
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