JP3429074B2 - Substrate rotation processing equipment - Google Patents
Substrate rotation processing equipmentInfo
- Publication number
- JP3429074B2 JP3429074B2 JP18651994A JP18651994A JP3429074B2 JP 3429074 B2 JP3429074 B2 JP 3429074B2 JP 18651994 A JP18651994 A JP 18651994A JP 18651994 A JP18651994 A JP 18651994A JP 3429074 B2 JP3429074 B2 JP 3429074B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- processing chamber
- rotation
- processing
- closing member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、液晶表示器用ガラス基
板、フォトマスク用のガラス基板、光ディスク用の基
板、半導体ウエハ等の基板に、純水などの洗浄液を供給
しつつ基板を回転させて基板の洗浄処理を施したり、あ
るいは現像液を供給して基板表面の現像処理をした後に
基板を回転させて基板表面から現像液を振り切ったり、
また基板を回転させて基板表面の液を振り切り乾燥させ
たりする際に用いられる基板回転処理装置に関する。The present invention relates to a glass substrate for a liquid crystal display, a glass substrate for a photomask, a substrate for an optical disk, a substrate such as a semiconductor wafer, and the like, while rotating the substrate while supplying a cleaning liquid such as pure water. Performing substrate cleaning processing, or supplying a developing solution to develop the substrate surface and then rotating the substrate to shake off the developing solution from the substrate surface,
The present invention also relates to a substrate rotation processing device used when the substrate is rotated to shake off the liquid on the surface of the substrate for drying.
【０００２】[0002]
【従来の技術】従来、この種の基板回転処理装置として
は、回転支持台に支持された基板を回転させることによ
って、基板表面に供給した処理液を遠心力で基板表面に
拡散流動させるものや、基板表面に供給した処理液を遠
心力で基板表面から液切りして乾燥させるものが知られ
ている。回転支持台の周りには回転処理時に基板表面か
ら排出される処理液の飛散を防止するための側壁が設け
られ、この側壁内部に基板を回転処理するための処理室
が形成されている。処理室の上部構成は、その上部を完
全に閉塞したクローズタイプと、上部全面を開放したオ
ープンタイプとの２種類に大別される。クローズタイプ
の場合には基板の回転処理中に基板から飛散した処理液
のミストが処理室内部に充満するので、飛散したミスト
が基板に再付着して基板が汚染されるといった問題があ
る。2. Description of the Related Art Conventionally, as a substrate rotation processing apparatus of this type, by rotating a substrate supported by a rotation support, a processing liquid supplied to the substrate surface is diffused and flowed to the substrate surface by centrifugal force. It is known that the processing liquid supplied to the substrate surface is drained from the substrate surface by centrifugal force and dried. A side wall is provided around the rotation support base to prevent the processing liquid discharged from the substrate surface during the rotation processing from scattering, and a processing chamber for rotating the substrate is formed inside the side wall. The upper part of the processing chamber is roughly classified into a closed type in which the upper part is completely closed and an open type in which the entire upper part is open. In the case of the closed type, since the mist of the processing liquid scattered from the substrate fills the inside of the processing chamber during the rotation processing of the substrate, there is a problem that the scattered mist reattaches to the substrate and contaminates the substrate.
【０００３】一方、オープンタイプの基板回転処理装置
は、一般的にクリーンルーム内に設置されている空調設
備から供給される清浄空気のダウンフローを、開放され
た処理室上部から処理室内へ積極的に取り入れることに
より、基板から飛散した処理液のミストを処理室下方へ
押しやり、処理室下部に設けられた排気口から処理液の
ミストを排出して、常に処理室内部の清浄度を維持して
いる。On the other hand, the open type substrate rotation processing apparatus positively downflows clean air supplied from an air conditioner installed in a clean room from the open upper part of the processing room to the processing room. By taking in, the mist of the processing liquid scattered from the substrate is pushed downward in the processing chamber, and the mist of the processing liquid is discharged from the exhaust port provided in the lower part of the processing chamber to always maintain the cleanliness inside the processing chamber. There is.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上述し
たオープンタイプの基板回転処理装置には次のような問
題点がある。すなわち、オープンタイプの場合には処理
室上部が大きく開放されているので、基板回転時、何ら
かの原因により基板が破損すると、その破損した基板の
破片が処理室上部の開口部から処理室外に飛散するとい
う問題がある。However, the above-mentioned open type substrate rotation processing apparatus has the following problems. That is, in the case of the open type, since the upper part of the processing chamber is largely open, when the substrate is damaged due to some cause during substrate rotation, the broken pieces of the substrate scatter out of the processing chamber through the opening in the upper part of the processing chamber. There is a problem.
【０００５】本発明は、このような事情に鑑みてなされ
たものであって、処理室内の清浄度を維持することがで
き、しかも万一基板が破損しても破損した破片が処理室
外に飛散することがない基板回転処理装置を提供するこ
とにある。The present invention has been made in view of the above circumstances, and it is possible to maintain the cleanliness of the processing chamber, and even if the substrate is damaged, the broken pieces are scattered outside the processing chamber. It is to provide a substrate rotation processing apparatus that does not do so.
【０００６】[0006]
【課題を解決するための手段】本発明は、上記目的を達
成するために次のような構成をとる。すなわち、請求項
１に記載の基板回転処理装置は、基板を回転させながら
前記基板に所定の処理を施す基板回転処理装置におい
て、前記基板を支持した状態で回転させる回転支持台
と、前記回転支持台の周囲を囲んで上部に開口部が形成
されるように配置され、その内部に処理室を形成する側
壁と、前記側壁の開口部を覆い、かつ、前記処理室外の
上部空間と前記処理室内とを連通する通気孔が形成され
た閉塞部材と、を備え、前記閉塞部材は、前記通気孔が
それぞれに形成され、かつ、上下に離間して配備された
複数枚の板材で構成されているものである。The present invention has the following constitution in order to achieve the above object. That is, the substrate rotation processing apparatus according to claim 1, wherein in the substrate rotation processing apparatus that performs a predetermined process on the substrate while rotating the substrate, a rotation support base that rotates the substrate while supporting the substrate, and the rotation support. A side wall that surrounds the periphery of the pedestal and is formed so that an opening is formed in an upper portion thereof and forms a processing chamber therein, and the opening of the side wall is covered with the upper space outside the processing chamber and the processing chamber And a closing member having a ventilation hole formed therein, the closing member including the ventilation hole.
Formed on each and separated vertically
It is composed of a plurality of plates .
【０００７】また、請求項２に記載の基板回転処理装置
は、請求項１に記載の装置において、前記閉塞部材を構
成する複数枚の板材のうち、少なくとも１枚の板材が水
平面内で移動可能に構成されているものである。A substrate rotation processing apparatus according to a second aspect is the apparatus according to the first aspect, wherein the closing member is constructed.
At least one plate out of the plurality of plates to be formed is water.
It is configured to be movable in a plane .
【０００８】[0008]
【０００９】[0009]
【作用】請求項１の発明の作用は次のとおりである。回
転支持台によって基板が回転処理される際に、側壁の開
口部を覆うように配置された閉塞部材の通気孔から清浄
空気のダウンフローが処理室内へ取り入れられているの
で、基板から飛散した処理液のミストが処理室内に充満
することがない。また、何らかの原因で基板が破損して
も、破損した基板の破片は側壁や閉塞部材に受け止めら
れるので、基板の破片が処理室外に飛び出すことがな
い。The operation of the invention of claim 1 is as follows. When the substrate is rotated by the rotation support, downflow of clean air is introduced into the processing chamber from the ventilation hole of the closing member arranged so as to cover the opening of the side wall, so that the processing scattered from the substrate is performed. The mist of the liquid does not fill the processing chamber. Further, even if the substrate is broken for some reason, the broken pieces of the substrate are received by the side wall and the closing member, so that the broken pieces of the substrate do not jump out of the processing chamber.
【００１０】上下に離間して配備された閉塞部材の各板
材の通気孔を介して、清浄空気が処理室内へ取り込まれ
る。また、何らかの原因で基板が破損してもその破片の
大半は下段の板材で受け止められる。破片の一部が下段
の板材の通気孔を通過しても、その破片は上段の板材で
受け止められる。[0010] through the vent holes of the plate of the closure member which is deployed at a distance from each other in up and down, clean air is taken into the processing chamber. Further, even if the substrate is damaged for some reason, most of the fragments are received by the lower plate material. Even if some of the fragments pass through the ventilation holes of the lower plate material, the fragments are received by the upper plate material.
【００１１】また、請求項２の発明によれば、複数枚の
板材のうち、少なくとも１枚の板材を水平面内で変位さ
せることにより、各板材の通気孔の平面視での重なり面
積が調整される。この重なり面積が最大のとき、処理室
内へのダウンフローの取り込み量は最大になり、重なり
面積が最小のとき、処理室内へのダウンフローの取り込
み量は最小になる。したがって、通気孔の重なり面積を
適宜に調整することにより、処理室内の清浄度を維持す
るのに必要な最小限度の清浄空気量が確保され、しか
も、上下の板材の各通気孔の一部が平面視で互いにふさ
ぐような位置関係になることにより、破片の一部が下段
の板材の通気孔を通過しても上段の板材で確実に受け止
められる。Further, according to the second aspect of the present invention, by displacing at least one plate member of the plurality of plate members in a horizontal plane, the overlapping area in plan view of the vent holes of each plate member is adjusted. It When the overlapping area is maximum, the amount of downflow taken into the processing chamber is maximum, and when the overlapping area is smallest, the amount of downflow taken into the processing chamber is minimum. Therefore, by appropriately adjusting the overlapping area of the ventilation holes, the minimum amount of clean air required to maintain the cleanliness of the processing chamber is secured, and moreover, some of the ventilation holes of the upper and lower plate materials are Due to the positional relationship of blocking each other in a plan view, even if some of the fragments pass through the ventilation holes of the lower plate member, they can be reliably received by the upper plate member.
【００１２】[0012]
【実施例】以下、図面を参照して本発明の実施例を説明
する。なお、以下では回転式基板現像装置を例に挙げて
説明する。
＜参考例＞
図１は本発明の参考例に係る回転式基板現像装置の縦断
面図、図２はその一部切り欠き平面図である。Embodiments of the present invention will be described below with reference to the drawings. In the following, a rotary substrate developing device will be described as an example. Reference Example FIG. 1 is a vertical sectional view of a rotary substrate developing apparatus according to a reference example of the present invention, and FIG. 2 is a partially cutaway plan view thereof.
【００１３】図中、符号１は回転支持台であり、基板Ｗ
をほぼ水平な姿勢で吸着保持する。この回転支持台１
は、回転軸２を介してモータ３によって回転駆動され
る。また、回転支持台１の周囲には、処理液の回収およ
び処理液の飛散を防止する飛散防止カップ４と筒部材１
４とが上下に連設配備されている。飛散防止カップ４お
よび筒部材１４は、本発明における側壁に相当し、その
内部に基板Ｗを回転処理するための処理室Ｒが形成され
ている。In the figure, reference numeral 1 is a rotary support, and a substrate W
Is held in a substantially horizontal position by suction. This rotating support 1
Is driven to rotate by a motor 3 via a rotary shaft 2. Further, around the rotation support base 1, a scattering prevention cup 4 and a cylindrical member 1 for preventing the recovery of the processing liquid and the scattering of the processing liquid.
4 and 4 are arranged one above the other. The shatterproof cup 4 and the tubular member 14 correspond to the side wall in the present invention, and a processing chamber R for rotating the substrate W is formed therein.
【００１４】飛散防止カップ４は、上カップ５と、円形
整流部材６と、下カップ７とから構成されている。上カ
ップ５は、上部に開口部５ａと、基板Ｗの回転による処
理液の飛散を下方へ案内する傾斜面５ｂとを有する。上
カップ５の下端は下カップ７の上端の段差部に嵌合され
ている。The shatterproof cup 4 comprises an upper cup 5, a circular flow regulating member 6 and a lower cup 7. The upper cup 5 has an opening 5a at the top and an inclined surface 5b that guides the scattering of the processing liquid due to the rotation of the substrate W downward. The lower end of the upper cup 5 is fitted in the stepped portion at the upper end of the lower cup 7.
【００１５】円形整流部材６は、回転支持台１の下方に
位置するように下カップ７の内周壁７ａの上端部に嵌合
されている。上カップ５の開口部５ａから流入して基板
Ｗの端縁近傍を流下した清浄空気のダウンフローＤは、
円形整流部材６の傾斜面６ａに沿って下カップ７に案内
される。回転処理中に基板Ｗの表面から飛散した現像液
のミストは、このダウンフローＤに乗って下カップ７へ
送られる。The circular straightening member 6 is fitted to the upper end portion of the inner peripheral wall 7a of the lower cup 7 so as to be located below the rotary support 1. The downflow D of clean air that has flowed in through the opening 5a of the upper cup 5 and has flowed down near the edge of the substrate W is
The circular rectifying member 6 is guided by the lower cup 7 along the inclined surface 6a. The mist of the developing solution scattered from the surface of the substrate W during the rotation process is sent to the lower cup 7 along the downflow D.
【００１６】下カップ７は、外周壁７ｂの下部に内接す
るリング状の廃液ゾーン８と、この廃液ゾーン８の内側
に形成したリング状の排気ゾーン９とを有する。廃液ゾ
ーン８の底部には廃液口１０が配設されている。この廃
液口１０を介して、使用済みの現像液が廃液タンク１１
に回収される。排気ゾーン９の底部には排気口１２が配
設されている。この排気口１２が排気ポンプ１３に接続
されることにより、処理室Ｒ内が強制排気されるように
なっている。The lower cup 7 has a ring-shaped waste liquid zone 8 inscribed in the lower portion of the outer peripheral wall 7b, and a ring-shaped exhaust zone 9 formed inside the waste liquid zone 8. A waste liquid port 10 is provided at the bottom of the waste liquid zone 8. Through the waste liquid port 10, the used developing solution is used to store the used developer liquid in the waste liquid tank 11.
Will be collected. An exhaust port 12 is provided at the bottom of the exhaust zone 9. By connecting the exhaust port 12 to the exhaust pump 13, the inside of the processing chamber R is forcibly exhausted.
【００１７】上述した筒部材１４は、上カップ５の上部
から上方に向かって、開口部５ａの周囲を囲むように配
設されている。この筒部材１４の側面に開口部１４ａが
形成されている。基板Ｗの表面に向けて現像液を供給す
るノズル１５が開口部１４ａから処理室Ｒ内へ挿入した
状態で配設されている。The above-mentioned tubular member 14 is arranged so as to surround the periphery of the opening 5a from the upper portion of the upper cup 5 upward. An opening 14a is formed on the side surface of the tubular member 14. A nozzle 15 for supplying the developing solution toward the surface of the substrate W is arranged in a state of being inserted into the processing chamber R through the opening 14a.
【００１８】筒部材１４の上部開口部１４ｂに、ダウン
フローＤの取り込みと、基板Ｗが破損した場合にその破
片の飛散防止とを図るための閉塞部材２０が着脱自在に
設けられている。この閉塞部材２０には、図２に示すよ
うに、本装置が設置されるクリーンルーム内の空調設備
から供給された清浄空気のダウンフローＤを処理室Ｒ内
へ取り入れるために、小径の多数の通気孔２０ａが形成
されている。The upper opening 14b of the tubular member 14 is detachably provided with a closing member 20 for taking in the downflow D and preventing scattering of fragments when the substrate W is damaged. As shown in FIG. 2, the closing member 20 has a large number of small-diameter passages so that the downflow D of the clean air supplied from the air conditioning equipment in the clean room in which the present apparatus is installed is introduced into the processing chamber R. Pores 20a are formed.
【００１９】つぎに、参考例装置の動作を説明する。ま
ず、筒部材１４から閉塞部材２０を取り外し、ノズル１
５を筒部材１４から退避させた状態で、フォトレジスト
膜が表面に形成された基板Ｗが図示しない基板搬送機構
によって回転支持台１上に搬送される。基板搬送機構が
処理室Ｒから退避した後、閉塞部材２０を筒部材１４の
上部に取り付ける。続いてノズル１５の先端吐出口が基
板Ｗの略回転中心に位置するように、ノズル１５を開口
部１４ａから処理室Ｒ内へ挿入する。そして、モータ３
を回転駆動することによって回転支持台１とともに基板
Ｗを回転させるとともに、ノズル１５から現像液を基板
Ｗの表面に向けて供給する。Next, the operation of the reference example apparatus will be described. First, the blocking member 20 is removed from the tubular member 14, and the nozzle 1
In a state in which 5 is retracted from the cylindrical member 14, the substrate W having the photoresist film formed on its surface is transferred onto the rotary support 1 by a substrate transfer mechanism (not shown). After the substrate transfer mechanism is retracted from the processing chamber R, the closing member 20 is attached to the upper part of the tubular member 14. Subsequently, the nozzle 15 is inserted into the processing chamber R through the opening 14a so that the tip discharge port of the nozzle 15 is located at the substantially rotation center of the substrate W. And the motor 3
The substrate W is rotated together with the rotation support base 1 by rotating and rotating, and the developing solution is supplied from the nozzle 15 toward the surface of the substrate W.
【００２０】所定時間経過して現像処理が終了すると、
基板Ｗを高速回転させ、その遠心力で基板Ｗの表面から
現像液を振り切る。この際、基板Ｗから飛散して処理室
Ｒの内部に漂う現像液のミストは、閉塞部材２０の多数
の通気孔２０ａから取り入れられた清浄空気のダウンフ
ローＤによって、処理室Ｒの下方へ押しやられ、排気口
１２に吸引されて排出される。When the development process is completed after a predetermined time has passed,
The substrate W is rotated at high speed, and the developing solution is shaken off from the surface of the substrate W by the centrifugal force. At this time, the mist of the developer scattered from the substrate W and drifting inside the processing chamber R is pushed downward in the processing chamber R by the downflow D of the clean air taken in from the many vent holes 20 a of the closing member 20. It is burned, sucked into the exhaust port 12, and discharged.
【００２１】以上のように、処理室Ｒ内は常に清浄に保
たれるので、現像液のミストによって基板Ｗが汚れるこ
とがない。また、回転処理時、何らかの原因で基板Ｗが
破損した場合、その破損した破片は四方に飛散する。側
方に飛散した破片は筒部材１４の内壁で受け止められ、
また、上方へ飛散した破片は閉塞部材２０によって受け
止められるので、飛散した破片が処理室Ｒの外へ飛び散
ることがない。As described above, since the inside of the processing chamber R is always kept clean, the substrate W is not contaminated by the mist of the developing solution. Further, when the substrate W is damaged for some reason during the rotation processing, the damaged fragments are scattered in all directions. The fragments scattered to the side are received by the inner wall of the tubular member 14,
Further, since the shards scattered upward are received by the closing member 20, the shards scattered are not scattered outside the processing chamber R.
【００２２】ところで、閉塞部材２０に形成した通気孔
２０ａは飛散した破片の通路ともなり得る。したがっ
て、通気孔２０ａの開口面積は、処理室Ｒ内の清浄度を
維持するのに必要な量の清浄空気のダウンフローを取り
込むことができるという条件の下で、できるだけ小さく
するのが好ましい。そこで、処理室Ｒ内の清浄度を維持
するのに必要な通気口２０ａの開口面積を求めるため
に、つぎのような実験を行った。By the way, the ventilation hole 20a formed in the closing member 20 can also serve as a passage for scattered fragments. Therefore, it is preferable that the opening area of the vent hole 20a be as small as possible under the condition that the amount of downflow of the clean air required to maintain the cleanliness in the processing chamber R can be taken in. Therefore, in order to obtain the opening area of the ventilation port 20a required to maintain the cleanliness inside the processing chamber R, the following experiment was conducted.
【００２３】＜条件＞基板Ｗとしては、下記の２種類の
大きさの矩形状ガラス基板を用いた。
Ｗ1 ：300 ×350 ×1.1 ｍｍ
Ｗ2 ：380 ×480 ×1.1 ｍｍ
基板Ｗの回転数として、2000rpm （回転数Ｎ1 ）、2500
rpm （回転数Ｎ2 ）の２条件を設定した。閉塞部材２０
の外径は 600ｍｍであり、これに孔径50ｍｍの通気孔２
０ａを８５個均一に形成した。処理室Ｒの内部を約 4Nm
3 ／分で強制排気した。<Conditions> As the substrate W, a rectangular glass substrate having the following two sizes is used. W 1 : 300 × 350 × 1.1 mm W 2 : 380 × 480 × 1.1 mm As the rotation speed of the substrate W, 2000 rpm (rotation speed N 1 ), 2500
Two conditions of rpm (rotation speed N 2 ) were set. Closure member 20
Has an outer diameter of 600 mm, and a ventilation hole 2 with a hole diameter of 50 mm.
85 pieces of 0a were uniformly formed. About 4 Nm inside the processing chamber R
Forced exhaust at 3 / min.
【００２４】以上の条件で、上記のように処理室Ｒ内に
清浄空気のダウンフローを取り入れつつ、基板Ｗを回転
処理した場合に基板Ｗから飛散して処理室内部に漂う0.
5 μｍ以上の大きさを有する浮遊ミストの個数が、閉塞
部材２０の総開口面積（通気孔２０ａの個数）を変えた
場合にどのように変動するかを測定した。その結果を図
３のグラフに示す。Under the above conditions, while the downflow of clean air is introduced into the processing chamber R as described above, when the substrate W is rotated, it scatters from the substrate W and drifts inside the processing chamber.
It was measured how the number of floating mists having a size of 5 μm or more fluctuates when the total opening area of the blocking member 20 (the number of ventilation holes 20a) is changed. The results are shown in the graph of FIG.
【００２５】図中に実線で表したものは、基板Ｗ1 を回
転数Ｎ1 で回転処理した場合の浮遊ミストの個数、図中
に破線で表したものは、基板Ｗ2 を回転数Ｎ1 で回転処
理した場合の浮遊ミストの個数、図中に鎖線で表したも
のは、基板Ｗ1 を回転数Ｎ2で回転処理した場合の浮遊
ミストの個数をそれぞれ示す。The solid line in the drawing indicates the number of floating mists when the substrate W 1 is rotated at the rotation speed N 1 , and the broken line in the drawing indicates the substrate W 2 at the rotation speed N 1. The number of floating mists when the substrate W 1 is subjected to the rotation treatment, and the one indicated by a chain line in the figure shows the number of the floating mists when the substrate W 1 is subjected to the rotation treatment at the rotation number N 2 .
【００２６】図３より明らかなように、回転数が2000rp
m であれば基板面積と同程度の総開口面積があれば、0.
5 μm 以上のミストを１個以下にすることができ、処理
室内部の清浄度を保つことができる。また、回転数が25
00rpm であれば基板面積の２倍程度の総開口面積があれ
ば、0.5 μm 以上のパーティクルを１個以下にすること
ができ、処理室内部の清浄度を保つことができる。As is apparent from FIG. 3, the rotation speed is 2000 rp.
If the total opening area is about the same as the substrate area for m, then 0.
The number of mist particles of 5 μm or more can be reduced to 1 or less, and the cleanliness inside the processing chamber can be maintained. Also, the rotation speed is 25
At 00 rpm, if the total opening area is about twice the substrate area, the number of particles of 0.5 μm or more can be reduced to 1 or less, and the cleanliness inside the processing chamber can be maintained.
【００２７】＜第１実施例＞第１実
施例の回転式基板現像装置は、閉塞部材として、
それぞれに通気孔が形成された上下２枚の板材を用いた
ものである。以下、図４および図５を参照して具体的に
説明する。The rotary substrate developing apparatus <first actual施例> first real施例as closing member,
Two upper and lower plate members each having a ventilation hole are used. Hereinafter, a specific description will be given with reference to FIGS. 4 and 5.
【００２８】この回転式基板現像装置は、参考例の円形
状の筒部材１４にかえて矩形状の筒部材１４’を備え、
この筒部材１４’の開口部１４’ｂを覆うように閉塞部
材３０が配置されている。この閉塞部材３０は、上板材
３１と下板材３２とで上下２段に構成されており、各板
材３１，３２それぞれに、ダウンフローＤを取り入れる
ための通気孔が形成されている。This rotary substrate developing apparatus is provided with a rectangular tubular member 14 'instead of the circular tubular member 14 of the reference example,
The closing member 30 is arranged so as to cover the opening 14'b of the tubular member 14 '. The closing member 30 is composed of an upper plate member 31 and a lower plate member 32 in two upper and lower stages, and each plate member 31, 32 is provided with a vent hole for taking in the downflow D.
【００２９】上板材３１には、図５に示すように、略中
央部に円形状の大径の通気孔３１ａが形成されている。
また、下板材３２には、四隅それぞれに扇状の通気孔３
２ａが形成されている。各板材３１，３２は、所定間隔
ｔをとって平行に、かつ各通気孔３１ａ，３２ａの一部
が重なるように配置されている。すなわち、真上から見
て、図５に示す斜線部のみが開口するように各板材３
１，３２が配置されている。なお、通気孔３１ａは、上
記した基板サイズや回転速度に応じてダウンフローＤを
取り入れるために必要な開口面積に設定されている。ま
た、通気孔３２ａの全開口面積も通気孔３１ａと略同じ
開口面積に設定されている。As shown in FIG. 5, the upper plate member 31 is provided with a circular large-diameter vent hole 31a at a substantially central portion thereof.
In addition, the lower plate member 32 has a fan-shaped vent hole 3 at each of the four corners.
2a is formed. The plate members 31 and 32 are arranged in parallel with each other at a predetermined interval t so that the vent holes 31a and 32a partially overlap each other. That is, when viewed from directly above, each plate member 3 is opened so that only the hatched portion shown in FIG.
1, 32 are arranged. The vent hole 31a is set to have an opening area necessary for taking in the downflow D according to the substrate size and the rotation speed described above. Further, the total opening area of the ventilation holes 32a is also set to be substantially the same as that of the ventilation holes 31a.
【００３０】なお、各通気孔３１ａ，３２ａの一部が重
なるように配置されているが、各板材３１，３２の間隔
を適宜距離だけ離しているので、ダウンフローＤを取り
入れることに対して障害とならない。そのうえ、基板Ｗ
の破片の飛散を防止する効果を高めることができる。例
えば、上板材３１の全面積に対して通気孔３１ａの開口
率を50％とし、下板材３２の全面積に対して通気孔３２
ａの開口率50％とした場合、各板材３１，３２を重ね合
わせることにより、図５に示す斜線部の開口率は10％以
下となり飛散防止効果を大きく向上することができる。Although the vent holes 31a and 32a are arranged so as to partially overlap with each other, the plate members 31 and 32 are separated from each other by an appropriate distance, which is an obstacle to the introduction of the downflow D. It does not become. Besides, the substrate W
It is possible to enhance the effect of preventing the scattering of debris. For example, the opening ratio of the ventilation holes 31a is 50% with respect to the entire area of the upper plate member 31, and the ventilation holes 32a with respect to the entire area of the lower plate member 32.
When the aperture ratio of a is 50%, by overlapping the plate members 31 and 32, the aperture ratio of the shaded portion shown in FIG. 5 is 10% or less, and the scattering prevention effect can be greatly improved.
【００３１】以上のように、上下２段に各板材３１，３
２を構成することで、基板Ｗが破損した場合に、その基
板Ｗの破片の大半はまず下板材３２で受け止められ、下
板材３２の通気孔３２ａを通過した破片は上板材３１で
受け止められるので、基板Ｗの破片の処理室外への飛散
防止効果が高められる。また、真上から見て、図５に示
す斜線部が開口しているので、開口部から処理室内を覗
き込みつつ行う、ノズル１５の先端を基板Ｗの回転中心
付近に一致させるための調整作業や、現像液の吐出状態
の確認や現像が正常に行われているかを確認する作業な
どを容易に行うことができる。As described above, the plate members 31 and 3 are vertically arranged in two stages.
With the configuration of 2, when the substrate W is damaged, most of the fragments of the substrate W are first received by the lower plate member 32, and the fragments passing through the ventilation holes 32a of the lower plate member 32 are received by the upper plate member 31. The effect of preventing the fragments of the substrate W from scattering outside the processing chamber is enhanced. Further, when viewed from directly above, the hatched portion shown in FIG. 5 is open, so adjustment work is performed while looking into the processing chamber through the opening to match the tip of the nozzle 15 with the vicinity of the rotation center of the substrate W. Also, it is possible to easily perform the work such as checking the discharge state of the developing solution and checking whether the developing is normally performed.
【００３２】＜第２実施例＞第２実
施例の回転式基板現像装置は、閉塞部材として、
それぞれに通気孔が形成された上下２枚の板材を用いる
とともに、一方の板材を水平面内で変位可能に構成して
いる。以下、図６および図７を参照して具体的に説明す
る。[0032] <second actual施例> rotary substrate developing apparatus of the second real施例as closing member,
Two upper and lower plate members each having a vent hole are used, and one plate member is configured to be displaceable in a horizontal plane. Hereinafter, a specific description will be given with reference to FIGS. 6 and 7.
【００３３】この回転式基板現像装置は、第１実施例の
装置と同様の矩形状の筒部材１４’を備え、この筒部材
１４’の開口部１４’ｂを覆うように閉塞部材４０が配
置されている。この閉塞部材４０も、上板材４１と下板
材４２とで上下２段に構成されており、各板材４１，４
２それぞれに、ダウンフローＤを取り入れるための通気
孔が形成されている。[0033] The rotary substrate developing apparatus 'includes a the tubular member 14' first real施例apparatus similar rectangular tubular member 14 is closing member 40 so as to cover the opening 14'b of It is arranged. The closing member 40 is also composed of an upper plate member 41 and a lower plate member 42 in two upper and lower stages.
Vents for taking in the downflow D are formed in each of the two.
【００３４】上板材４１には、図７に示すように、複数
個のスリット状の通気孔４１ａが形成されている。ま
た、下板材４２にも、上板材４１と同様の複数個のスリ
ット状の通気孔４２ａが形成されている。なお、各通気
孔４１ａ，４２ａそれぞれの全開口面積は、第２実施例
と同様に、基板サイズや回転速度に応じてダウンフロー
Ｄを取り入れるために必要な開口面積に設定されてい
る。As shown in FIG. 7, the upper plate member 41 is provided with a plurality of slit-shaped ventilation holes 41a. Further, the lower plate member 42 is also formed with a plurality of slit-shaped ventilation holes 42a similar to the upper plate member 41. The total opening area of each of the ventilation holes 41a, 42a is set to the opening area required for introducing the downflow D according to the substrate size and the rotation speed, as in the second embodiment.
【００３５】上板材４１の対向する両側面に一対のガイ
ド孔４１ｂが開口されている。この一対のガイド孔４１
ｂにわたって上記した下板材４２が挿入され、上板材４
１に対して下板材４２を水平方向に変位できるようにな
っている。なお、各板材４１，４２の間隔ｔも、第２実
施例と同様に、ダウンフローの取り入れに障害とならな
い適宜距離だけ離して設定されている。A pair of guide holes 41b are formed in the opposite side surfaces of the upper plate member 41. This pair of guide holes 41
The above-mentioned lower plate member 42 is inserted over b, and the upper plate member 4
The lower plate member 42 can be displaced in the horizontal direction with respect to 1. The distance t between the plate members 41 and 42 is also set to be an appropriate distance apart from the one that does not hinder the intake of downflow, as in the second embodiment.
【００３６】以上のように、上下２段に各板材４１，４
２を構成して上板材４１に対して下板材４２を水平方向
に変位可能に構成されているので、各通気孔４１ａ，４
２ａが平面視で完全に一致するように下板材４２を変位
させれば、処理室内へのダウンフローＤの取り込み量が
最大になる。一方、各通気孔４１ａ，４２ａが平面視で
重ならないように下板材４２を変位させれば、処理室内
へのダウンフローＤの取り込み量が最小になる。したが
って、ダウンフローＤを取り込んで処理室内の清浄度を
維持できる程度に、下板４２を水平変位させて通気孔４
１ａ，４２ａの一部が重なるように設定される。これに
より、ダウンフローＤの取り込みによる処理室内の清浄
度の維持と、基板Ｗの破片の処理室外への飛散防止とを
共に有効に達成することができる。As described above, the plate members 41 and 4 are vertically arranged in two stages.
2, the lower plate member 42 can be displaced in the horizontal direction with respect to the upper plate member 41.
By displacing the lower plate member 42 so that 2a are completely aligned in plan view, the amount of downflow D taken into the processing chamber is maximized. On the other hand, if the lower plate member 42 is displaced so that the vent holes 41a and 42a do not overlap each other in plan view, the amount of downflow D taken into the processing chamber is minimized. Therefore, the lower plate 42 is horizontally displaced to such an extent that the downflow D can be taken in and the cleanliness inside the processing chamber can be maintained.
It is set so that a part of 1a and 42a overlap. As a result, it is possible to effectively achieve both the maintenance of cleanliness inside the processing chamber by taking in the downflow D and the prevention of scattering of the fragments of the substrate W to the outside of the processing chamber.
【００３７】なお、上記した第１，第２実施例では、現
像処理を行う回転式基板現像装置を例に挙げて説明した
が、本発明はこれに限らず、基板を回転処理する種々の
装置に適用することができる。In the above first and second embodiments , the rotary type substrate developing device for performing the developing process has been described as an example, but the present invention is not limited to this, and various devices for performing the rotating process on the substrate. Can be applied to.
【００３８】また、上記した第１，第２実施例では、筒
部材１４，１４’の上部に閉塞部材を配置したが、本発
明はこれに限らず、筒部材を備えていない装置に本発明
を適用する場合には、飛散防止カップ４の開放された上
部に閉塞部材を配置して、基板Ｗの破片が処理室外に飛
散することを防止してもよい。Further, in the above-mentioned first and second embodiments, the closing member is arranged above the tubular members 14 and 14 ', but the present invention is not limited to this, and the present invention can be applied to an apparatus having no tubular member. In the case of applying the above, a blocking member may be arranged on the open upper portion of the scattering prevention cup 4 to prevent the fragments of the substrate W from scattering outside the processing chamber.
【００３９】また、上記実施例においては、板状の部材
に貫通孔が形成されたものを閉塞部材として使用した
が、本発明はこれに限らず、例えばメッシュ状の板材を
使用することも可能である。Further, in the above-mentioned embodiment, the plate-shaped member having the through holes formed therein is used as the closing member, but the present invention is not limited to this, and a mesh-shaped plate member can also be used. Is.
【００４０】[0040]
【発明の効果】以上の説明から明らかなように、請求項
１に記載の発明によれば、基板が回転処理される際に、
閉塞部材の通気孔から処理室内へ清浄空気のダウンフロ
ーが取り入れられるので、基板から飛散した処理液のミ
ストで処理室内が充満することがなく、処理室内部はつ
ねに清浄に保たれる。また、何らかの原因で基板が破損
しても、飛散した破片は側壁や閉塞部材に受け止められ
るので、破片が処理室外へ飛散することもない。As is apparent from the above description, according to the invention described in claim 1, when the substrate is rotated,
Since the downflow of clean air is introduced into the processing chamber through the ventilation hole of the closing member, the processing chamber is not filled with mist of the processing liquid scattered from the substrate, and the inside of the processing chamber is always kept clean. Further, even if the substrate is damaged for some reason, the scattered fragments are received by the side wall and the closing member, so that the fragments are not scattered outside the processing chamber.
【００４１】通気孔が形成された複数枚の板材を上下に
離間配備して閉塞部材が構成されているので、処理室内
へのダウンフローの取り込みが可能で、しかも、基板の
破片が処理室外へ飛散するのを一層効果的に防止するこ
とができる。The communication because pores closure member spaced deploying a plurality of plate members which are formed vertically and is configured, allows incorporation of down flow to a processing chamber, moreover, pieces of the substrate to the processing outdoor It is possible to more effectively prevent scattering.
【００４２】また、請求項２の発明によれば、通気孔が
形成された複数枚の板材のうち、少なくとも１枚の板材
を水平変位可能に構成しているので、処理室の清浄度を
維持するのに必要なダウンフローの取り込み量の調整が
可能であり、上下板材の通気孔の重なりを最小限度にす
ることにより、基板の破片が処理室外へ飛散するのをさ
らに効果的に防止することができる。Further, according to the second aspect of the present invention, at least one of the plurality of plate members having the ventilation holes is configured to be horizontally displaceable, so that the cleanliness of the processing chamber is maintained. It is possible to adjust the amount of downflow that is necessary to prevent this, and by minimizing the overlap of the vent holes in the upper and lower plate materials, it is possible to more effectively prevent the fragments of the substrate from scattering outside the processing chamber. You can
【図１】本発明の参考例に係る回転式基板現像装置の縦
断面図である。FIG. 1 is a vertical sectional view of a rotary substrate developing apparatus according to a reference example of the present invention.
【図２】参考例の一部切り欠き平面図である。FIG. 2 is a partially cutaway plan view of a reference example.
【図３】開口面積によるミスト数の変動を示したグラフ
である。FIG. 3 is a graph showing a change in the number of mists depending on the opening area.
【図４】図５におけるＡ−Ａ矢視断面図である。4 is a cross-sectional view taken along the line AA in FIG.
【図５】第１実施例の一部切り欠き平面図である。5 is a plan view partially sectioned of a first real施例.
【図６】第２実施例の要部を示す縦断面図である。6 is a longitudinal sectional view showing an essential part of the second actual施例.
【図７】第２実施例の一部切り欠き平面図である。7 is a plan view partially broken away of the second actual施例.
１ … 回転支持台 ４ … 飛散防止カップ １４ … 筒部材 １５ … ノズル ２０，３０，４０ … 閉塞部材 ２０ａ … 通気孔 ３１，４１ … 上板材 ３１ａ，４１ａ … 通気孔 ３２，４２ … 下板材 ３２ａ，４２ａ … 通気孔 Ｒ…処理室 Ｄ … ダウンフロー Ｗ … 基板 1 ... Rotation support 4… Shatterproof cup 14 ... Cylindrical member 15 ... Nozzle 20, 30, 40 ... Closure member 20a ... Vent hole 31, 41 ... Upper plate material 31a, 41a ... Vent hole 32, 42 ... Lower plate material 32a, 42a ... Vent hole R ... Processing room D ... Downflow W ... Substrate
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平６−126264（ＪＰ，Ａ) 実開 平２−132933（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/304 H01L 21/68 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-6-126264 (JP, A) Fukuihei 2-132933 (JP, U) (58) Fields investigated (Int.Cl. 7 , DB name) H01L 21/304 H01L 21/68
Claims (2)
処理を施す基板回転処理装置において、 前記基板を支持した状態で回転させる回転支持台と、 前記回転支持台の周囲を囲んで上部に開口部が形成され
るように配置され、その内部に処理室を形成する側壁
と、 前記側壁の開口部を覆い、かつ、前記処理室外の上部空
間と前記処理室内とを連通する通気孔が形成された閉塞
部材と、 を備え、 前記閉塞部材は、前記通気孔がそれぞれに形成され、か
つ、上下に離間して配備された複数枚の板材で構成され
ている ことを特徴とする基板回転処理装置。1. A substrate rotation processing apparatus for performing a predetermined process on a substrate while rotating the substrate, a rotation support base for rotating the substrate while supporting the substrate, and an opening at an upper part surrounding the periphery of the rotation support base. A side wall that is disposed so as to form a processing chamber and that forms a processing chamber therein, and a vent hole that covers the opening of the side wall and that connects the upper space outside the processing chamber and the processing chamber. a closing member, wherein the closing member, the vent hole is formed in each or
One is composed of multiple plates that are vertically spaced apart.
The substrate rotation processing device is characterized in that
も１枚の板材は水平面内で移動可能に構成されている 基
板回転処理装置。2. The apparatus according to claim 1, wherein at least one of a plurality of plate materials that constitutes the closing member.
Also, a single plate member is configured to be movable in a horizontal plane .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18651994A JP3429074B2 (en) | 1994-07-14 | 1994-07-14 | Substrate rotation processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18651994A JP3429074B2 (en) | 1994-07-14 | 1994-07-14 | Substrate rotation processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0831790A JPH0831790A (en) | 1996-02-02 |
| JP3429074B2 true JP3429074B2 (en) | 2003-07-22 |
Family
ID=16189924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18651994A Expired - Fee Related JP3429074B2 (en) | 1994-07-14 | 1994-07-14 | Substrate rotation processing equipment |
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| Country | Link |
|---|---|
| JP (1) | JP3429074B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006114884A (en) * | 2004-09-17 | 2006-04-27 | Ebara Corp | Substrate cleaning processing apparatus and substrate processing unit |
-
1994
- 1994-07-14 JP JP18651994A patent/JP3429074B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0831790A (en) | 1996-02-02 |
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