JP3417028B2 - Component mounting apparatus and method - Google Patents
Component mounting apparatus and methodInfo
- Publication number
- JP3417028B2 JP3417028B2 JP33635093A JP33635093A JP3417028B2 JP 3417028 B2 JP3417028 B2 JP 3417028B2 JP 33635093 A JP33635093 A JP 33635093A JP 33635093 A JP33635093 A JP 33635093A JP 3417028 B2 JP3417028 B2 JP 3417028B2
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- component
- circuit board
- base
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、ICなどの電子部品を
回路基板などに高精度に位置決め装着する実装装置及び
その方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting apparatus and method for mounting electronic parts such as ICs on a circuit board with high accuracy.
【0002】[0002]
【従来の技術】以下、従来の電子部品の実装装置及びそ
の方法について図面を参照しながら説明する。図4は従
来の部品の実装装置の実装部における部品の位置規制の
説明図であり、図5は同実装部における部品規正部の拡
大説明図である。2. Description of the Related Art A conventional electronic component mounting apparatus and method will be described below with reference to the drawings. FIG. 4 is an explanatory diagram of the position regulation of the component in the mounting portion of the conventional component mounting apparatus, and FIG. 5 is an enlarged explanatory diagram of the component regulating portion in the mounting portion.
【0003】図4,図5に示すように従来の部品の実装
装置における実装部は、部品規正爪17を備えた部品規
正部15と、認識手段16と、部品装着部18とからな
り、電子部品5を回路基板4に実装する。As shown in FIGS. 4 and 5, the mounting portion in the conventional component mounting apparatus is composed of a component regulating portion 15 having a component regulating claw 17, a recognizing means 16 and a component mounting portion 18. The component 5 is mounted on the circuit board 4.
【0004】以下、従来の部品の実装装置における実装
部の動作を説明する。実装部に供給された電子部品5は
部品規正部15において、部品規正爪17によって個別
に規正される。このとき、回路基板4と電子部品5との
相対位置量を考慮して、電子部品5のX,Y方向およ
び、回路基板4の表面方向と電子部品5のX,Y方向と
の角度であるθX,θYを調節して、電子部品5を規正す
る。その後、さらに回路基板4に電子部品5を高精度に
装着するために、規正された電子部品5を吸着ノズルま
たは装着ヘッド等によって吸着、把持しつつ、部品認識
カメラ等の認識手段16によって、回路基板4上の装着
すべき位置に対して、回路基板4と電子部品5との相対
位置量を精密に計算する。そして、相対位置量の変化量
に応じて電子部品5のX,Y方向および、回路基板4の
表面方向と電子部品5のX,Y方向との角度である
θX,θYをさらに調節して、電子部品5を適正位置に位
置規正し、回路基板4に電子部品5を装着する。The operation of the mounting unit in the conventional component mounting apparatus will be described below. The electronic components 5 supplied to the mounting unit are individually regulated by the component regulating claws 17 in the component regulating unit 15. At this time, in consideration of the relative position amount between the circuit board 4 and the electronic component 5, it is the X and Y directions of the electronic component 5 and the angle between the surface direction of the circuit board 4 and the X and Y directions of the electronic component 5. The electronic components 5 are regulated by adjusting θ X and θ Y. After that, in order to further mount the electronic component 5 on the circuit board 4 with high accuracy, the regulated electronic component 5 is sucked and gripped by a suction nozzle or a mounting head, and the circuit is detected by the recognition means 16 such as a component recognition camera. The relative position amount between the circuit board 4 and the electronic component 5 is precisely calculated with respect to the position on the board 4 to be mounted. Then, θ X and θ Y , which are the X and Y directions of the electronic component 5 and the angles between the surface direction of the circuit board 4 and the X and Y directions of the electronic component 5, are further adjusted according to the amount of change in the relative position amount. Then, the electronic component 5 is adjusted to a proper position, and the electronic component 5 is mounted on the circuit board 4.
【0005】[0005]
【発明が解決しようとする課題】しかしながら上記従来
の部品の実装装置における実装部では、回路基板4に装
着する電子部品5の機種が切り替わった場合や、部品規
正爪17が破損して交換が必要になった場合等に、この
部品規正爪17を交換する際に、位置規正させる電子部
品のX,Y方向および、θX,θYを調節して、電子部品
5の位置が適正な状態になるまで、何度も部品規正爪1
7の取付状態を調整する必要があり、標準の部品規正爪
17では対応不可能な多品種の電子部品5、特に異形部
品の位置規正に対応することが困難であるという問題点
を有していた。However, in the mounting portion of the conventional component mounting apparatus described above, replacement is required when the model of the electronic component 5 mounted on the circuit board 4 is switched or when the component regulating claw 17 is damaged. When this component regulating claw 17 is replaced, the X and Y directions and θ X and θ Y of the electronic component to be regulated are adjusted so that the position of the electronic component 5 becomes proper. Until it becomes a part
It is necessary to adjust the mounting state of No. 7 and it is difficult to cope with the positional regulation of various kinds of electronic components 5, especially irregular-shaped components, which the standard component regulating pawl 17 cannot cope with. It was
【0006】また、吸着ノズルに吸着された電子部品5
の被装着面と回路基板4の被装着面とが高精度に平行に
保たれていない場合、図6に示すとおり装着開始ととも
に電子部品5と回路基板4との接触次第によっては装着
位置精度の劣化を招く場合があった。Also, the electronic component 5 sucked by the suction nozzle
If the mounted surface of the circuit board 4 and the mounted surface of the circuit board 4 are not kept parallel to each other with high accuracy, the mounting position accuracy may be changed depending on the contact between the electronic component 5 and the circuit board 4 as the mounting starts as shown in FIG. It may cause deterioration.
【0007】たとえ、吸着ノズルに吸着された電子部品
5の被装着面を平行に保つために、吸着ノズル部分に平
行度調整機構を設けた場合でも、装着位置の調整は電子
部品5を加圧する加圧ヘッドの揺動中心点を移動させて
調整するので、揺動中心点Aが回路基板4上における電
子部品5の装着中心点の垂直上方に高精度には位置しな
かった。このことは、電子部品5を回路基板4に装着す
る際に、装着位置のズレを生じさせ、装着位置精度の劣
化の要因であった。Even if a parallelism adjusting mechanism is provided in the suction nozzle portion in order to keep the mounting surfaces of the electronic components 5 sucked by the suction nozzles parallel, the adjustment of the mounting position presses the electronic components 5. Since the swing center point of the pressure head is moved and adjusted, the swing center point A is not positioned accurately above the mounting center point of the electronic component 5 on the circuit board 4 vertically. This causes a displacement of the mounting position when mounting the electronic component 5 on the circuit board 4, and is a factor of deterioration of the mounting position accuracy.
【0008】さらに、図7に示すように、電子部品5を
吸着した装着ヘッド部の装着ヘッド部中心点Cと加圧ヘ
ッドの揺動中心点Aとを結ぶ直線が、回路基板4上にお
ける電子部品5の装着中心点Bの垂直上方に高精度に位
置しない場合は、装着位置精度の劣化を一層大きくす
る。Further, as shown in FIG. 7, a straight line connecting the mounting head portion center point C of the mounting head portion on which the electronic component 5 is sucked and the swinging center point A of the pressure head is an electron on the circuit board 4. When the component 5 is not positioned vertically above the mounting center point B with high accuracy, the deterioration of the mounting position accuracy is further increased.
【0009】このような結果、平行度調整と電子部品5
のX,Y方向および、θX,θYの位置規正の他、装着位
置の調整を繰り返し行わなければ装着位置精度を高精度
に確保することができず、特に、平行度調整の精度が1
μm以下、電子部品5のX,Y方向および、θX,θYの
位置精度が数μm以下に装着位置精度を設定する場合
は、装着位置精度の調整が非常に複雑であり、調整が不
可能になる、あるいは調整に多大な時間を要するという
問題点をも有していた。As a result, the parallelism adjustment and the electronic component 5 are performed.
In addition to the X, Y-direction and θ X , θ Y position regulation, the mounting position accuracy cannot be ensured with high accuracy unless the mounting position is repeatedly adjusted.
When the mounting position accuracy is set to be less than μm and the positional accuracy of the electronic components 5 in the X and Y directions and θ X and θ Y is several μm or less, the adjustment of the mounting position accuracy is very complicated, and the adjustment is not possible. There is also a problem that it becomes possible or that adjustment takes a lot of time.
【0010】本発明は上記問題点を解決するもので、各
種の形状の電子部品5を容易に位置規正するとともに、
装着位置精度の高精度な調整を容易に行うことができる
部品の実装装置及びその方法を提供することを目的とし
ている。The present invention solves the above-mentioned problems, and easily positions the electronic components 5 of various shapes, and
An object of the present invention is to provide a component mounting apparatus and a component mounting method capable of easily performing highly accurate adjustment of the mounting position accuracy.
【0011】[0011]
【課題を解決するための手段】上記目的を達成するため
に本発明の部品の実装装置では、部品を回路基板に実装
する部品実装手段を備えた実装部と、前記実装部を制御
する制御部とからなり、前記実装部は加圧ヘッドによっ
て部品を回路基板に装着する装着ヘッド部と、前記装着
ヘッド部を支点として加圧ヘッドの位置調整を行う揺動
ステージと、装着する部品と回路基板とを設置し、前記
装着ヘッド部の下方で移動する移動ステージとを有して
おり、前記移動ステージは移動基盤の上に第1の基盤
を、前記第1の基盤の上に第2の基盤を備え、かつ前記
第1の基盤は部品の外形よりも大きい外形を持つ第1の
凹部と回路基板の外形よりも大きい外形を持つ第2の凹
部を備え、前記第2の基盤は部品の外形よりも大きい外
形を持つ第1の開孔部と回路基板の外形よりも大きい外
形を持つ第2の開孔部を備えており、さらに前記第1の
基盤の第1,第2の凹部と前記第2の基盤の第1,第2
の開孔部とが対応するように、前記第2の基盤を前記第
1の基盤上でスライドさせる手段を有した構成である。In order to achieve the above object, in a component mounting apparatus of the present invention, a mounting section having a component mounting means for mounting a component on a circuit board, and a control section for controlling the mounting section. The mounting unit includes a mounting head unit that mounts a component on a circuit board by a pressure head, a swing stage that adjusts the position of the pressure head with the mounting head unit as a fulcrum, and a component and a circuit board that are mounted. And a moving stage that moves below the mounting head portion, the moving stage having a first base on a moving base and a second base on the first base. And the first substrate has a first recess having an outer shape larger than the outer shape of the component and a second recess having an outer shape larger than the outer shape of the circuit board, and the second substrate has the outer shape of the component. First aperture with a larger profile than And it includes a second opening having a larger outer shape than the outer shape of the circuit board, a first further of the first base, first the second recess the second base, the second
The structure has means for sliding the second base on the first base so as to correspond to the openings of the first base.
【0012】[0012]
【作用】上記構成により本発明の部品の実装装置は、第
2の基盤をスライドさせて、第1の基盤の第1,第2の
凹部と第2の基盤の第1,第2の開孔部とによって、電
子部品と回路基板とを挟み込み、位置規正するので、部
品を位置規正する際、部品規正爪の取付状態を調整する
手間が無く、容易に部品を位置規正することができるも
のである。In the component mounting apparatus of the present invention having the above structure, the second base is slid to form the first and second recesses of the first base and the first and second openings of the second base. Since the electronic parts and the circuit board are sandwiched between the parts and the position is regulated, the position of the parts can be easily regulated without the trouble of adjusting the mounting state of the component regulating claws when the positions of the components are regulated. is there.
【0013】このとき、同一平面上に形成した第1の基
盤の凹部に電子部品と回路基板とを設置するので、電子
部品のX,Y方向および、θX,θYの適正位置は第1の
基盤の第1,第2の凹部と第2の基盤の第1,第2の開
孔部のX,Y方向および、θ X,θYを予め電子部品の
X,Y方向および、θX,θYの適正位置に合うように作
成しておけば、電子部品の回路基板への装着位置精度を
より高度にすることができる。At this time, the first substrate formed on the same plane
Since electronic parts and circuit boards are installed in the recesses of the board,
X and Y directions of parts and θX, ΘYProper position of the first
The first and second recesses of the base and the first and second openings of the second base
X and Y direction of the hole and θ X, ΘYOf electronic parts in advance
X, Y direction and θX, ΘYTo match the proper position of
If this is done, the mounting accuracy of the electronic components on the circuit board will be improved.
Can be more advanced.
【0014】また、回路基板に装着する電子部品の機種
の切り替えに対しては、多品種の電子部品、異形部品に
適合する凹部あるいは開孔部を予め作成した第1の基
盤、第2の基盤を容易しておけばよく、電子部品の位置
規正が非常に容易である。Further, in order to switch the model of the electronic component mounted on the circuit board, the first substrate and the second substrate in which a concave portion or an opening portion suitable for various kinds of electronic components and odd-shaped components are prepared in advance. The position of the electronic components can be adjusted very easily.
【0015】さらに、電子部品の装着位置の調整を装着
ヘッド部中心点を支点として、揺動ステージにおいて加
圧ヘッドの揺動中心点を調整しながら行うので、装着ヘ
ッド部中心点と揺動中心点とを結ぶ直線を垂直にすれ
ば、必然的に揺動中心点と電子部品の装着中心点とを結
ぶ直線も垂直になり、装着位置の調整を容易にし、かつ
高精度に行うことができるものである。Further, since the mounting position of the electronic component is adjusted while adjusting the swing center point of the pressure head on the swing stage with the mount head center point as a fulcrum, the mount head center point and the swing center are adjusted. If the straight line connecting the points is made vertical, the straight line connecting the swing center point and the mounting center point of the electronic component will also be vertical, and the mounting position can be adjusted easily and highly accurately. It is a thing.
【0016】[0016]
【実施例】以下、本発明の一実施例について図面を参照
しながら説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.
【0017】図1は本発明の部品の実装装置の実装部に
おける移動ステージの拡大図であり、図2は同実装装着
の概略図であり、図3は同実装装着における実装部の拡
大図である。FIG. 1 is an enlarged view of a moving stage in a mounting portion of a component mounting apparatus of the present invention, FIG. 2 is a schematic view of the mounting mounting, and FIG. 3 is an enlarged view of the mounting portion in the mounting mounting. is there.
【0018】図1,図2,図3に示すように本発明にお
ける部品の実装装置は、基台11の上に設置され、電子
部品5を回路基板4に実装する部品実装手段を備えた実
装部13と、実装部13を制御する制御部12とからな
り、実装部13は加圧ヘッド15によって部品を回路基
板4に装着する吸着ノズル14を備えた装着ヘッド部1
6と、装着ヘッド部16の中心点を支点として加圧ヘッ
ドの位置調整を行う揺動ステージ9と、装着する電子部
品5と回路基板4とを設置し、装着ヘッド部16の下方
でモーターによって移動する移動ステージ7とを有して
いる。移動ステージ7は移動基盤17の上に下プレート
2を、下プレート2の上に上プレート3を備え、かつ下
プレート2は電子部品5の外形よりも大きい外形を持つ
第1の凹部21と回路基板4の外形よりも大きい外形を
持つ第2の凹部22を、上プレート3は電子部品5の外
形よりも大きい外形を持つ第1の開孔部19と回路基板
4の外形よりも大きい外形を持つ第2の開孔部20を備
えており、さらに下プレート2の第1,第2の凹部2
1,22と上プレート3の第1,第2の開孔部19,2
0とが対応するように、上プレート3を下プレート2上
でプレート駆動手段1と復帰バネとによってスライドさ
せる構成である。As shown in FIGS. 1, 2 and 3, the component mounting apparatus according to the present invention is mounted on a base 11 and has a component mounting means for mounting an electronic component 5 on a circuit board 4. The mounting head unit 1 includes a unit 13 and a control unit 12 that controls the mounting unit 13. The mounting unit 13 includes a suction nozzle 14 that mounts a component on the circuit board 4 by a pressure head 15.
6, the swing stage 9 for adjusting the position of the pressure head with the center point of the mounting head portion 16 as a fulcrum, the electronic component 5 to be mounted and the circuit board 4, and the motor is installed below the mounting head portion 16. It has a moving stage 7 that moves. The moving stage 7 includes a lower plate 2 on a moving base 17, an upper plate 3 on the lower plate 2, and the lower plate 2 has a first concave portion 21 having an outer shape larger than that of the electronic component 5 and a circuit. The second recess 22 having an outer shape larger than the outer shape of the board 4, the upper plate 3 has an outer shape larger than the outer shape of the electronic component 5, and the outer shape larger than the outer shape of the circuit board 4. The second opening portion 20 having the second opening portion 20 is provided, and the first and second recesses 2 of the lower plate 2 are further provided
1, 22 and the first and second openings 19, 2 of the upper plate 3
The upper plate 3 is slid on the lower plate 2 by the plate driving means 1 and the return spring so that 0 corresponds to each other.
【0019】以下、本発明の部品の実装装置の動作につ
いて説明する。上プレート3と下プレート2により形成
される電子部品5の規正位置に電子部品5を供給した
後、プレート駆動手段1により上プレート3を駆動し、
下プレート2と上プレート3で電子部品5を規正する。
次に、吸着ノズル14によってこの電子部品5を吸着
し、上方に退避する。そして上プレート3と下プレート
2により形成される回路基板の規正位置に回路基板4を
供給した後、プレート駆動手段1により上プレート3を
駆動し、下プレート2と上プレート3で回路基板4を規
正する。つぎに移動モータにより、吸着した電子部品5
が回路基板4の装着位置上方に対向位置する状態に移動
ステージ7を移動させ、加圧ヘッド15によって吸着ノ
ズル14を下降させて電子部品5を回路基板4に圧接
し、装着を完了する。また、本実施例においては、移動
ステージ7の移動方向は1方向であるようになっている
が、これは予め下プレート2と上プレート3に設けられ
ている回路基板4と電子部品5の規正部同士の相対位置
が、1方向のみの位置合わせで好適であるように設定さ
れているからであり、移動ステージ7が2方向に移動可
能であっても良い。The operation of the component mounting apparatus of the present invention will be described below. After the electronic component 5 is supplied to the regulated position of the electronic component 5 formed by the upper plate 3 and the lower plate 2, the plate driving means 1 drives the upper plate 3,
The electronic component 5 is set by the lower plate 2 and the upper plate 3.
Then, the suction nozzle 14 sucks the electronic component 5 and retracts it upward. Then, after supplying the circuit board 4 to the regulated position of the circuit board formed by the upper plate 3 and the lower plate 2, the upper plate 3 is driven by the plate driving means 1 and the circuit board 4 is moved by the lower plate 2 and the upper plate 3. Rectify. Next, the electronic component 5 sucked by the moving motor
Moves the moving stage 7 to the position above the mounting position of the circuit board 4 and lowers the suction nozzle 14 by the pressure head 15 to press the electronic component 5 to the circuit board 4 and complete the mounting. Further, in the present embodiment, the moving direction of the moving stage 7 is set to one direction, which is the setting of the circuit board 4 and the electronic component 5 provided on the lower plate 2 and the upper plate 3 in advance. This is because the relative positions of the parts are set to be suitable for alignment in only one direction, and the moving stage 7 may be movable in two directions.
【0020】特に、下プレート2と上プレート3は、フ
ォトプロセスによりエッチング形成されるので、回路基
板4と電子部品5の規正部同士の相対位置が、1方向の
みの位置合わせで好適であるように設定することも非常
に簡単であり、また高精度にプレートを加工することも
できるので、回路基板4に装着する電子部品5の機種が
切り替わった場合でも、この上プレート3、下プレート
2を交換することにより、容易に電子部品の位置を好適
な状態に保つことができる。この結果、移動基盤17を
用いる必要もなく、移動基盤17では対応不可能であっ
た多品種の電子部品5、特に異形部品の位置規正にも対
応することが可能である。In particular, since the lower plate 2 and the upper plate 3 are formed by etching by a photo process, the relative positions of the regulation portions of the circuit board 4 and the electronic component 5 are suitable for alignment in only one direction. It is also very easy to set to, and the plate can be processed with high accuracy, so even if the model of the electronic component 5 mounted on the circuit board 4 is switched, the upper plate 3 and the lower plate 2 can be By exchanging, the position of the electronic component can be easily maintained in a suitable state. As a result, it is not necessary to use the moving board 17, and it is possible to deal with the position regulation of various kinds of electronic parts 5, especially the odd-shaped parts, which the moving board 17 cannot cope with.
【0021】また、揺動ステージ9は加圧ヘッド15の
揺動中心点を自由に移動させることができるので、電子
部品5の装着平面と回路基板4の装着平面との平行度を
電子部品5のX,Y方向およびθX,θYの位置決めとは
無関係に独立して調整することができる。Further, since the swing stage 9 can freely move the swing center point of the pressure head 15, the parallelism between the mounting plane of the electronic component 5 and the mounting plane of the circuit board 4 is determined by the electronic component 5. Can be adjusted independently of the X and Y directions and the positioning of θ X and θ Y.
【0022】さらに、電子部品5の装着時の際、装着ヘ
ッド部16における吸着ノズル14により吸着された電
子部品5の法線方向と同方向に吸着ノズル14を移動さ
せて、回路基板4に電子部品5を圧接装着することによ
り吸着ノズル14の上下動による装着位置の位置ずれを
皆無とすることが可能となった。Further, when the electronic component 5 is mounted, the suction nozzle 14 is moved in the same direction as the normal line direction of the electronic component 5 sucked by the suction nozzle 14 in the mounting head portion 16 so that the electronic components are transferred to the circuit board 4. By mounting the component 5 under pressure, it is possible to eliminate the displacement of the mounting position due to the vertical movement of the suction nozzle 14.
【0023】これにより、平行度調整と電子部品5の
X,Y方向およびθX,θYの位置決めの他、装着位置の
調整を非常に簡素化することができる。Thus, the adjustment of the parallelism and the positioning of the electronic component 5 in the X and Y directions and θ X and θ Y as well as the adjustment of the mounting position can be greatly simplified.
【0024】[0024]
【発明の効果】このように本発明によれば、次の効果を
奏することができるものである。As described above, according to the present invention, the following effects can be obtained.
【0025】すなわち、第2の基盤をスライドさせて、
第1の基盤の第1,第2の凹部と第2の基盤の第1,第
2の開孔部とによって、電子部品と回路基板とを挟み込
み、位置規正するので、部品を位置規正する際、部品規
正爪の取付状態を調整する手間が無く、容易に部品を位
置規正することができる。That is, by sliding the second base,
When the electronic component and the circuit board are sandwiched by the first and second recesses of the first board and the first and second openings of the second board to perform position adjustment, the position of the part is adjusted. The position of the parts can be easily adjusted without the trouble of adjusting the mounting state of the parts setting claws.
【0026】このとき、同一平面上に形成した第1の基
盤の凹部に電子部品と回路基板とを設置するので、電子
部品のX,Y方向およびθX,θYの適正位置は第1の基
盤の第1,第2の凹部と第2の基盤の第1,第2の開孔
部のX,Y方向およびθX,θYを予め電子部品のX,Y
方向およびθX,θYの適正位置に合うように作成してお
けば、電子部品の回路基板への装着位置精度をより高度
にすることができる。At this time, since the electronic component and the circuit board are installed in the concave portion of the first substrate formed on the same plane, the proper positions of the electronic component in the X and Y directions and θ X and θ Y are the first. The X and Y directions and θ X and θ Y of the first and second concave portions of the board and the first and second opening portions of the second board are previously defined as X and Y of the electronic component.
If it is created so as to match the direction and the proper positions of θ X and θ Y, the accuracy of the mounting position of the electronic component on the circuit board can be made higher.
【0027】また、回路基板に装着する電子部品の機種
の切り替えに対しては、多品種の電子部品、異形部品に
適合する凹部あるいは開孔部を予め作成した第1の基
盤、第2の基盤を用意しておけばよく、電子部品の位置
規正が非常に容易である。Further, in order to switch the model of the electronic component mounted on the circuit board, the first substrate and the second substrate in which a concave portion or an opening portion suitable for various kinds of electronic components and odd-shaped components are prepared in advance. It is only necessary to prepare, and it is very easy to position the electronic components.
【0028】さらに、電子部品の装着位置の調整を装着
ヘッド部中心点を支点として、揺動ステージにおいて加
圧ヘッドの揺動中心点を調整しながら行うので、装着ヘ
ッド部中心点と揺動中心点とを結ぶ直線を垂直にすれ
ば、必然的に揺動中心点と電子部品の装着中心点とを結
ぶ直線も垂直になり、装着位置の調整を容易にし、かつ
高精度に行うことができるものである。Furthermore, since the mounting position of the electronic component is adjusted while adjusting the swing center point of the pressure head on the swing stage with the mount head center point as a fulcrum, the mount head center point and swing center are adjusted. If the straight line connecting the points is made vertical, the straight line connecting the swing center point and the mounting center point of the electronic component will also be vertical, and the mounting position can be adjusted easily and highly accurately. It is a thing.
【0029】また、第2の基盤の第1,第2の凹部を第
1,第2の開孔部に変えても同様の効果を得ることがで
きる。Also, the same effect can be obtained by changing the first and second recesses of the second base to the first and second openings.
【0030】したがって、本発明は各種の形状の電子部
品を容易に位置規正するとともに、装着位置精度の高精
度な調整を容易に行うことができる部品の実装装置及び
その方法を提供することができるものである。Therefore, the present invention can provide a component mounting apparatus and method for easily positioning the electronic components of various shapes and easily adjusting the mounting position with high precision. It is a thing.
【図1】本発明の部品の実装装置の実装部における移動
ステージの斜視図FIG. 1 is a perspective view of a moving stage in a mounting portion of a component mounting apparatus of the present invention.
【図2】同実装装置の斜視図FIG. 2 is a perspective view of the mounting apparatus.
【図3】同実装装置における実装部の斜視図FIG. 3 is a perspective view of a mounting unit in the mounting apparatus.
【図4】従来の部品の実装装置における部品装着方法を
示す斜視図FIG. 4 is a perspective view showing a component mounting method in a conventional component mounting apparatus.
【図5】同実装装置における部品規正爪の斜視図FIG. 5 is a perspective view of a component regulating claw in the mounting apparatus.
【図6】同実装装置における部品装着方法の原理を示す
正面図FIG. 6 is a front view showing the principle of a component mounting method in the mounting apparatus.
【図7】同原理を示す正面図FIG. 7 is a front view showing the same principle.
1 プレート駆動手段 2 下プレート 3 上プレート 4 回路基板 5 電子部品 6 復帰バネ 7 移動ステージ 17 移動基盤 19 第1開孔部 20 第2開孔部 21 第1凹部 22 第2凹部 1 Plate drive means 2 Lower plate 3 upper plate 4 circuit board 5 electronic components 6 Return spring 7 moving stages 17 Mobile platform 19 First opening 20 Second hole 21 first recess 22 Second recess
フロントページの続き (56)参考文献 特開 平5−13991(JP,A) 特開 昭62−191149(JP,A) 特開 昭56−160098(JP,A) 特開 平3−202232(JP,A) 実開 平2−116800(JP,U) 実開 昭57−22274(JP,U) (58)調査した分野(Int.Cl.7,DB名) H05K 13/00 - 13/04 Continuation of the front page (56) Reference JP-A-5-13991 (JP, A) JP-A-62-191149 (JP, A) JP-A-56-160098 (JP, A) JP-A-3-202232 (JP , A) Furukai Hira 2-116800 (JP, U) Furukai Sho-22-22274 (JP, U) (58) Fields investigated (Int.Cl. 7 , DB name) H05K 13/00-13/04
Claims (4)
を備えた実装部と、前記実装部を制御する制御部とから
なり、前記実装部は加圧ヘッドによって部品を回路基板
に装着する装着ヘッド部と、前記装着ヘッド部を支点と
して加圧ヘッドの位置調整を行う揺動ステージと、装着
する部品と回路基板とを設置し、前記装着ヘッド部の下
方で移動する移動ステージとを有しており、前記移動ス
テージは移動基盤の上に第1の基盤を、前記第1の基盤
の上に第2の基盤を備え、かつ前記第1の基盤は部品の
外形よりも大きい外形を持つ第1の凹部と回路基板の外
形よりも大きい外形を持つ第2の凹部を、前記第2の基
盤は部品の外形よりも大きい外形を持つ第1の開孔部と
回路基板の外形よりも大きい外形を持つ第2の開孔部を
夫々備えており、さらに前記第1の基盤の第1,第2の
凹部と前記第2の基盤の第1,第2の開孔部とが対応す
るように、前記第2の基盤を前記第1の基盤上でスライ
ドさせる手段を有した部品の実装装置。1. A mounting unit including a component mounting means for mounting a component on a circuit board, and a control unit for controlling the mounting unit, wherein the mounting unit mounts the component on the circuit board by a pressure head. It has a head part, a swinging stage for adjusting the position of the pressure head with the mounting head part as a fulcrum, and a moving stage on which parts to be mounted and a circuit board are installed and which moves below the mounting head part. The moving stage includes a first base on a moving base and a second base on the first base, and the first base has a contour larger than a contour of a component. A second recess having an outer shape larger than that of the first recess and the circuit board; and a second opening having a second outer surface having an outer shape larger than that of the component and an outer shape larger than the outer shape of the circuit board. Each having a second aperture with a In addition, the second base is placed on the first base so that the first and second recesses of the first base and the first and second openings of the second base correspond to each other. A device for mounting a component having means for sliding.
の基盤に代えて第1の開孔部と第2の開孔部とを有した
第1の基盤を備えた請求項1記載の部品の実装装置。2. A first unit having a first recess and a second recess.
The component mounting apparatus according to claim 1, further comprising a first board having a first opening and a second opening instead of the board.
盤と第2の基盤を備えた請求項1または請求項2記載の
部品の実装装置。3. The component mounting apparatus according to claim 1, further comprising a first substrate and a second substrate created by a photo process.
部とを介して、第1の基盤の第1の凹部と第2の凹部と
に部品と回路基板とを設置する第1工程と、前記第2の
基盤をスライドさせて、前記第1の基盤の第1,第2の
凹部と前記第2の基盤の第1,第2の開孔部とによっ
て、部品と回路基板とを挟み込み、位置規正する第2工
程と、位置規正した部品を装着ヘッド部によって吸着
し、前記第1の基盤の第1の凹部から部品を取り出す第
3工程と、部品を吸着した前記装着ヘッド部の下方に回
路基板への部品装着位置が適合するように、移動ステー
ジを移動させる第4工程と、部品を吸着した前記装着ヘ
ッド部によって、回路基板の部品装着位置に部品を装着
する第5工程とを有した部品の実装方法。4. A component and a circuit board are placed in the first recess and the second recess of the first board through the first opening and the second opening of the second board. By the first step of installing and by sliding the second base, the parts are formed by the first and second recesses of the first base and the first and second openings of the second base. And the circuit board are sandwiched and the position is adjusted, a second step is performed, the position-adjusted component is adsorbed by the mounting head portion, and the third step is to take out the component from the first concave portion of the first substrate, and the component is adsorbed. A fourth step of moving the moving stage so that the component mounting position on the circuit board fits under the mounting head part, and the mounting head part that picks up the component mounts the component at the component mounting position on the circuit board. And a fifth step of mounting the component.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33635093A JP3417028B2 (en) | 1993-12-28 | 1993-12-28 | Component mounting apparatus and method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33635093A JP3417028B2 (en) | 1993-12-28 | 1993-12-28 | Component mounting apparatus and method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07202498A JPH07202498A (en) | 1995-08-04 |
JP3417028B2 true JP3417028B2 (en) | 2003-06-16 |
Family
ID=18298221
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP33635093A Expired - Fee Related JP3417028B2 (en) | 1993-12-28 | 1993-12-28 | Component mounting apparatus and method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3417028B2 (en) |
-
1993
- 1993-12-28 JP JP33635093A patent/JP3417028B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH07202498A (en) | 1995-08-04 |
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