JP3347980B2 - Circuit board and method of manufacturing the same - Google Patents

Circuit board and method of manufacturing the same

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Publication number
JP3347980B2
JP3347980B2 JP20060497A JP20060497A JP3347980B2 JP 3347980 B2 JP3347980 B2 JP 3347980B2 JP 20060497 A JP20060497 A JP 20060497A JP 20060497 A JP20060497 A JP 20060497A JP 3347980 B2 JP3347980 B2 JP 3347980B2
Authority
JP
Japan
Prior art keywords
circuit board
conductive
electrically connected
conductor foil
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP20060497A
Other languages
Japanese (ja)
Other versions
JPH1146064A (en
Inventor
洋 大平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaichi Electronics Co Ltd
Original Assignee
Yamaichi Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaichi Electronics Co Ltd filed Critical Yamaichi Electronics Co Ltd
Priority to JP20060497A priority Critical patent/JP3347980B2/en
Publication of JPH1146064A publication Critical patent/JPH1146064A/en
Application granted granted Critical
Publication of JP3347980B2 publication Critical patent/JP3347980B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は回路基板およびその
製造方法に係り、さらに詳しくは配線パターン層間を簡
略な導体配線部で接続した構成の低コスト型回路基板お
よび製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board and a method of manufacturing the same, and more particularly to a low-cost circuit board having a structure in which wiring pattern layers are connected by a simple conductor wiring portion, and a method of manufacturing the same.

【０００２】[0002]

【従来の技術】配線回路の高密度化やコンパクト化、も
しくは高機能化などの点から、両面配線型の回路基板
や、多層配線型の回路基板が広く実用に供されている。
そして、この種の回路基板は、一般的に、絶縁体層の両
面に銅箔を張り合わせてなる積層板を素材とし、また、
以下に示すような工程を経て製造されている。2. Description of the Related Art A circuit board of a double-sided wiring type and a circuit board of a multilayer wiring type are widely used in practical use in terms of higher density, compactness, and higher functionality of wiring circuits.
And this type of circuit board is generally made of a laminated board made by laminating copper foil on both sides of an insulator layer,
It is manufactured through the following steps.

【０００３】すなわち、前記銅箔張り積層板の所定箇所
（所定位置）に、たとえばNCドリリングマシンを用い
て、一つづつシリーズに貫通孔を穿設し、この穿設孔の
内壁面をメッキ法もしくは導電性ペーストの印刷埋め込
みで導電性化して、両面の銅箔間を電気的に接続する。
その後、前記両面の銅箔を、たとえばフォトエッチング
処理し、配線パターニングして両面型の回路基板を得て
いる。That is, through holes are drilled one by one at predetermined positions (predetermined positions) of the copper foil-clad laminate using, for example, an NC drilling machine, and the inner wall surfaces of the drilled holes are plated by a plating method. Alternatively, it is made conductive by printing and embedding a conductive paste to electrically connect the copper foils on both surfaces.
Thereafter, the copper foil on both sides is subjected to, for example, photoetching treatment and wiring patterning to obtain a double-sided circuit board.

【０００４】また、多層型の回路基板の場合は、 (a)前
記両面型の回路基板間にガラス・樹脂系プリプレグ層を
介在させ、あるいは (b)両面型の回路基板面にガラス・
樹脂系プリプレグ層を介して銅箔を積層し、これを積層
一体化することによって製造される。なお、銅箔を積層
する製造方法の場合は、銅箔のパターニングを要する。
さらに、この多層型回路基板の製造工程においては、配
線パターン間の接続は介在させるガラス・樹脂系プリプ
レグ層の所定位置に導電体を埋め込むビアホール接続、
もしくは多層化後に、前記ドリル加工で貫通孔を穿設
し、穿設孔内壁面をメッキ法や導電性ペーストによって
導電性化することで行われる。In the case of a multilayer circuit board, (a) a glass-resin prepreg layer is interposed between the double-sided circuit boards;
It is manufactured by laminating a copper foil via a resin-based prepreg layer and laminating and integrating this. In the case of a manufacturing method in which a copper foil is laminated, patterning of the copper foil is required.
Further, in the manufacturing process of this multilayer circuit board, the connection between the wiring patterns is via hole connection for embedding a conductor at a predetermined position of a glass-resin prepreg layer to be interposed,
Alternatively, after the multi-layering, the through hole is formed by the drilling, and the inner wall surface of the hole is made conductive by a plating method or a conductive paste.

【０００５】[0005]

【発明が解決しようとする課題】しかしながら、前記回
路基板は、工程の煩雑さなどに伴い比較的コスト高で、
また、製造工程における配線パターン層間の接続操作が
煩雑で、生産性なども劣るという問題がある。すなわ
ち、両面銅箔間の電気的な接続を行うに当たり、NCドリ
リングマシンで一つづつシリーズに貫通孔を穿設するた
め、貫通孔の穿設に多くの時間を必要とし、結果的に生
産性が低いという問題がある。特に、高密度配線化もし
くは配線の微細化が要求された印刷配線板では、穿設孔
の微小径とともに穿設箇所も増大しており、前記貫通孔
の穿設手段は、経済的，技術的に由々しい問題となって
いる。However, the circuit board is relatively expensive due to the complexity of the process and the like.
In addition, there is a problem that the connection operation between the wiring pattern layers in the manufacturing process is complicated, and the productivity and the like are poor. In other words, when making electrical connections between double-sided copper foils, drilling holes through the NC drilling machine one by one requires a lot of time to drill through holes, resulting in a high productivity. Is low. In particular, in a printed wiring board that requires high-density wiring or fine wiring, the number of holes to be drilled is increasing along with the minute diameter of the hole, and the means for drilling the through hole is economical and technical. It is a serious problem.

【０００６】本発明は上記事情に対処してなされたもの
で、高密度の配線が可能で、かつ製造プロセスも簡易な
ために低コスト得られる回路基板およびその製造方法の
提供を目的とする。The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a circuit board capable of high-density wiring and having a simple manufacturing process, which can be obtained at low cost, and a method of manufacturing the same.

【０００７】[0007]

【発明が解決しようとする課題】請求項１の発明は、導
電性突起を厚さ方向に貫通させることにより少なくとも
一方の面に電気的な被接続面が選択的に突出された突出
部を備え、前記突出部の表面は金属層で被覆された第１
の回路基板と、前記第１の回路基板の突出した被接続面
に対向する電気的な被接続面を有する第２の回路基板
と、前記両回路基板の被接合面間に介挿され、選択的に
両被接続面間を電気的に接続するするとともに、非電気
的な接合面間を絶縁的、かつ機械的に接合する異方性導
電性接着剤層とを有することを特徴とする。[SUMMARY OF THE INVENTION] The invention of claim 1, the electrically
At least by penetrating the conductive protrusion in the thickness direction
Projection where the electrically connected surface is selectively projected on one surface
A first portion, the surface of the protrusion being covered with a metal layer.
A circuit board, a second circuit board having an electrically connected surface facing the protruding connected surface of the first circuit board, and a second circuit board interposed between the joined surfaces of the two circuit boards, And an anisotropic conductive adhesive layer for electrically connecting the two connected surfaces and electrically and mechanically joining the non-electrical joining surfaces.

【０００８】請求項２の発明は、請求項１記載の回路基
板において、第１の回路基板の電気的な被接続面が、メ
ッキ層もしくは導電性樹脂で形成されている形成されて
いることを特徴とする。 According to a second aspect of the present invention, in the circuit board according to the first aspect, the electrically connected surface of the first circuit board is a female.
Formed by a stick layer or conductive resin
It is characterized by being.

【０００９】請求項３の発明は、第１の導電体箔の一主
面に難変形性かつ略円錐型の導電性バンブを形設する工
程と、前記導電性バンプ形設面に、導電性バンプの先端
部が貫挿可能な絶縁性シートを積層配置する工程と、前
記絶縁性シート上に第２の導電体箔を積層配置する工程
と、前記積層配置の両導電体箔の少なくとも一方の外側
に柔軟性板を介挿してプレス成型し、前記柔軟性板側で
導電性バンブに対接する領域の導電体箔を変形・突出さ
せた導電体箔張り基板を形成する工程と、前記導電体箔
張り基板の導電体箔をパターニング処理する工程とを有
することを特徴とする。 According to a third aspect of the present invention, there is provided the first conductive foil
Forming a hardly deformable and substantially conical conductive bump on the surface
And the tip of the conductive bump on the conductive bump forming surface.
A step of laminating and arranging insulating sheets through which parts can be inserted;
Laminating and placing a second conductor foil on the insulating sheet
Outside of at least one of the two conductor foils in the laminated arrangement
And press-molded with a flexible plate interposed, and the flexible plate side
The conductor foil in the area in contact with the conductive bump is deformed and protruded.
Forming a conductor-clad substrate coated with the conductor foil;
Patterning the conductive foil of the stretched substrate.
It is characterized by doing.

【００１０】請求項４の発明は、導電性突起を厚さ方向
に貫通させることにより少なくとも一方の面に電気的な
被接続面が選択的に突出された突出部を備え、前記突出
部の表面は金属層で被覆されたコア基板を製造する工程
と、前記コア基板の前記被接続面側に異方性導電性接着
剤層を積層・配置する工程と、前記異方性導電性接着剤
層上に、コア基板の電気的な被接続面に対応する電気的
な被接続面を突出させた回路基板を位置決め配置する工
程と、前記位置決め配置した積層体を加圧し、前記両被
接続面間に対応する異方性導電性接着剤層領域を選択的
に導電性化するとともに、接合一体化する工程とを有す
ることを特徴とする回路基板の製造方法である。 [0010] According to a fourth aspect of the present invention, the conductive protrusion is formed in the thickness direction.
Through at least one surface
The connection surface includes a protrusion that is selectively protruded.
Of manufacturing a core substrate whose surface is covered with a metal layer
And an anisotropic conductive adhesive on the connected surface side of the core substrate.
Laminating and arranging agent layers, and the anisotropic conductive adhesive
On the layer, an electrical connection corresponding to the electrically connected surface of the core substrate
For positioning and positioning a circuit board with a protruding connection surface
And pressurizing the positioned and arranged laminate to form
Selectable anisotropic conductive adhesive layer area corresponding to between connection surfaces
And a process of joining and integrating
A method for manufacturing a circuit board.

【００１１】請求項５の発明は、導電性突起を厚さ方向
に貫通させることにより少なくとも一方の面に電気的な
被接続面が選択的に突出された突出部を備え、前記突出
部の表面は金属層で被覆された第１の回路基板を製造す
る工程と、前記コア基板の前記被接続面側に異方性導電
性接着剤層を積層・配置する工程と、前記異方性導電性
接着剤層上に、コア基板の電気的な被接続面に対応する
電気的な被接続面を有する回路基板を位置決め配置する
工程と、前記位置決め配置した積層体を加圧し、前記両
被接続面間に対応する異方性導電性接着剤層領域を選択
的に導電性化するとともに、接合一体化する工程とを有
することを特徴とする回路基板の製造方法である。 [0011] According to a fifth aspect of the present invention, the conductive projection is formed in the thickness direction.
Through at least one surface
The connection surface includes a protrusion that is selectively protruded.
Manufacture a first circuit board whose surface is covered with a metal layer;
Anisotropically conductive on the connected surface side of the core substrate.
Laminating and arranging a conductive adhesive layer;
Corresponds to the electrically connected surface of the core substrate on the adhesive layer
Position and arrange a circuit board having an electrically connected surface
And pressing the laminated body that has been positioned and arranged.
Select the anisotropic conductive adhesive layer area between the connected surfaces
Process to make it electrically conductive and join and integrate
A method for manufacturing a circuit board.

【００１２】請求項６の発明は、請求項４項又は５項に
記載の回路基板の製造方法において、前記コア基板を製
造する工程が、第１の導電体箔の一主面に難変形性かつ
略円錐型の導電性バンブを形設する工程と、前記導電性
バンプ形設面に、導電性バンプの先端部が貫挿可能な絶
縁性シートを積層配置する工程と、前記絶縁性シート上
に第２の導電体箔を積層配置する工程と、前記積層配置
の両導電体箔の少なくとも一方の外側に柔軟性板を介挿
してプレス成型し、前記柔軟性板側で導電性バンブに対
接する領域の導電体箔を変形・突出させた導電体箔張り
基板を形成する工程と、前記導電体箔張り基板の導電体
箔をパターニング処理する工程とを有することを特徴と
する。 [0012] The invention of claim 6 is the invention according to claim 4 or 5.
The method for manufacturing a circuit board according to claim 1, wherein the core substrate is manufactured.
The first conductor foil is hardly deformable and
Forming a substantially conical conductive bump; and
The tip of the conductive bump can be inserted through the bump forming surface.
Stacking and arranging an edge sheet;
Laminating and arranging a second conductor foil on the substrate;
A flexible plate is inserted outside at least one of the conductor foils
And press-molding, and the flexible plate side
Conductor foil covering by deforming and projecting the conductor foil in the contact area
Forming a substrate, and a conductor of the conductor foil-clad substrate
Patterning a foil.
I do.

【００１３】上記の発明において、回路基板の絶縁体と
しては、たとえばエポキシ樹脂，ポリビニルブチラール
樹脂、フェノール樹脂、ニトリルラバー、ポリイミド樹
脂、フェノキシ樹脂、キシレン樹脂、アクリル樹脂、酢
酸ビニル樹脂、ビスマレイミドトリアジン樹脂、ポリア
ミド樹脂、ポリアミドイミド樹脂、ポリスルホン樹脂、
液晶ポリマー、ポリエーテルエーテルケトン樹脂、ポリ
エーテルイミド樹脂、ポリカーボネート樹脂、ホットメ
ルト接着剤などの１種もしくは２種以上の混合系、また
は、前記樹脂とガラスクロス、ガラスマット、合成繊維
や布などとを組み合わせたものが挙げられる。In the above invention, the insulator of the circuit board may be, for example, epoxy resin, polyvinyl butyral resin, phenol resin, nitrile rubber, polyimide resin, phenoxy resin, xylene resin, acrylic resin, vinyl acetate resin, bismaleimide triazine resin. , Polyamide resin, polyamideimide resin, polysulfone resin,
A liquid crystal polymer, a polyetheretherketone resin, a polyetherimide resin, a polycarbonate resin, a hot melt adhesive, or a mixture of two or more thereof, or a mixture of the resin and a glass cloth, a glass mat, a synthetic fiber, a cloth, or the like. Are combined.

【００１４】上記の発明において、回路基板の対向する
接合面間に介挿し、所要の電気的な接続を確保しながら
一方では、回路基板同士を機械的に接合一体化する異方
性導電性接着剤は、分散含有した導電性粒子が加圧・圧
着されたとき、導電性粒子の相互が接合・対接して電導
性を呈するもので、たとえばアニソルム（商品名，日立
化成KK）などの商品名で市販されている。In the above invention, anisotropic conductive bonding is provided between the opposing joint surfaces of the circuit board to secure the required electrical connection while mechanically joining the circuit boards together. When the conductive particles dispersed and contained are pressurized and pressed, the conductive particles join and come into contact with each other to exhibit electrical conductivity. For example, a product name such as Anisorm (trade name, Hitachi Chemical Co., Ltd.) It is commercially available at

【００１５】上記の発明において、導電体箔としては、
銅箔、アルミ箔、ニッケル箔、金箔、銀箔などが挙げら
れるが、一般的には銅箔がよい。また、要すれば、この
導電体箔導を押圧によって突出（突起）・変形させると
ともに、接続導体部を形成する難変形性の導電性バンブ
は、たとえば所要のマスクを介して硬化型のペーストを
印刷し、乾燥，硬化させて所望高さの突出（突起）を設
けるか、あるいは選択的なメッキによって所望高さの突
出（突起）を成長させることによって製造される。 な
お、前記突起の形状（たとえば円錐状，円筒状など）や
高さなどは、貫挿させる絶縁性シートの厚さや配線パタ
ーンの微細程度などによって適宜選択・設定される。ま
た、導電性バンプを貫挿させる絶縁性シートとしは、前
記絶縁体として例示した樹脂系シート類が挙げられる。In the above invention, the conductive foil may be:
Copper foil, aluminum foil, nickel foil, gold foil, silver foil and the like can be mentioned, but copper foil is generally preferable. Further, if necessary, the conductive foil conductor is caused to protrude (protrude) and deform by pressing, and the hardly deformable conductive bump forming the connection conductor portion is formed by, for example, applying a hardening type paste through a required mask. It is manufactured by printing, drying and curing to provide projections (projections) of a desired height, or by growing projections (projections) of a desired height by selective plating. The shape (for example, a conical shape or a cylindrical shape) and the height of the projection are appropriately selected and set according to the thickness of the insulating sheet to be inserted and the fineness of the wiring pattern. Examples of the insulating sheet through which the conductive bumps are inserted include resin sheets exemplified as the insulator.

【００１６】さらに、第１の回路基板の突出させた被接
続面（凸部）は、たとえばメッキによる導電体層の形
成、あるいは導電性ペーストなどによる形成でもよい。Further, the protruding connection surface (convex portion) of the first circuit board may be formed by, for example, forming a conductive layer by plating, or by using a conductive paste.

【００１７】製造方法の発明において、導電体箔の導電
性バンプ形設面に、導電性バンプの先端部が貫挿可能な
絶縁性シートおよび導電体箔を順次積層配置した後、両
導電体箔の少なくとも一方の外側に柔軟性板を介挿して
プレス成型する必要がある。すなわち、プレス成型の段
階で、難変形性の導電性バンブの圧接に対し、その圧接
面に対応した導電体箔領域が、選択的に突設・変形でき
るように、導電体箔の柔軟性を確保するために、突設・
変形させる側には柔軟性板を介挿する必要がある。な
お、柔軟性板を介挿しておけば、たとえばステンレス鋼
板などの当て板を外側に配置して、プレス成型しても支
障はない。In the invention of the manufacturing method, an insulating sheet and a conductor foil through which the tip of the conductive bump can be inserted are sequentially laminated on the conductive bump forming surface of the conductor foil. It is necessary to insert a flexible plate on at least one of the outsides and press-mold it. In other words, in the press molding stage, the flexibility of the conductive foil is increased so that the conductive foil region corresponding to the pressed surface can be selectively protruded and deformed when the conductive bump is hardly deformable. To secure,
It is necessary to insert a flexible plate on the side to be deformed. If a flexible plate is interposed, there is no problem even if a backing plate such as a stainless steel plate is arranged outside and press-molded.

【００１８】請求項１ないし請求項３の発明では、第１
の回路基板および第２の回路基板は、両基板が対向する
面の、少なくとも一方の電気的な被接続面が選択的に突
出しており、対応する被接続面間が優先的に加圧・圧着
された構成を採る。したがって、両回路基板の接合面間
に介挿されている異方性導電性接着剤層は、前記優先的
な加圧・圧着領域で導電性を呈し、対向する電気的な被
接続面同士を電気的に接合する。According to the first to third aspects of the present invention, the first
In the circuit board and the second circuit board, at least one of the electrically connected surfaces of the surfaces facing each other is selectively protruded, and the pressure between the corresponding connected surfaces is preferentially pressurized and crimped. The configuration is adopted. Therefore, the anisotropic conductive adhesive layer interposed between the joint surfaces of the two circuit boards exhibits conductivity in the preferential pressure / pressure bonding region, and connects the opposing electrically connected surfaces. Electrically join.

【００１９】一方、前記優先的な加圧・圧着領域以外の
領域では、非導電性（絶縁性）のまま、両回路基板の接
合一体化に寄与する。つまり、選択的な導電性化によっ
て、対向する被接続面同士を確実に電気的に接続しなが
ら、これらの電気的な接続を絶縁離隔して機械的な接合
一体化も容易に図られる。On the other hand, in a region other than the preferential pressure / compression bonding region, it contributes to joining and integration of both circuit boards while maintaining non-conductivity (insulation). In other words, by selectively making the conductive surfaces electrically connected to each other, the opposing connected surfaces are reliably electrically connected to each other, and these electric connections are insulated and separated from each other, so that mechanical joining and integration can be easily achieved.

【００２０】請求項４の発明では、上記回路基板の構成
に適する回路基板、換言すると少なくとも一方の電気的
な被接続面が選択的に突出し、被接合面に介挿された異
方性導電性接着剤層を選択的に、かつ優先的に加圧・圧
着領域を導電性化することができる回路基板が提供され
る。According to the fourth aspect of the present invention, a circuit board suitable for the configuration of the circuit board, in other words, at least one of the electrically connected surfaces selectively protrudes and the anisotropic conductive material inserted into the bonded surface. There is provided a circuit board capable of selectively and preferentially making an adhesive layer conductive in a pressure / compression bonding region.

【００２１】請求項５および請求項６の発明では、ビア
接続やスルホール接続の工程が簡略化されながら、高密
度配線型ないしは高密度実装型として、信頼性の高い回
路基板を、歩留まりよく、かつ低コストで提供できる。According to the fifth and sixth aspects of the present invention, a highly reliable circuit board of a high-density wiring type or a high-density mounting type is obtained with a high yield while simplifying the steps of via connection and through-hole connection. Can be provided at low cost.

【００２２】[0022]

【発明の実施の形態】以下図１、図２ (a)， (b)、図
３、図４および図５を参照して実施例を説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment will be described below with reference to FIGS. 1, 2 (a) and 2 (b), FIGS. 3, 4 and 5. FIG.

【００２３】図１は、第１の実施例に係る回路基板の要
部構成を示す断面図である。図１において、１は電気的
な被接続面1aが選択的に突出された第１の回路基板、２
は前記第１の回路基板１の被接続面1aに対向する電気的
な被接続面2aを有する第２の回路基板である。ここで、
両回路基板１，２は、いずれもガラス・エポキシ樹脂系
を絶縁体とした両面銅箔張り板を素材として形成された
ものである。また、第１の回路基板１の被接続面1aは、
絶縁体層1bを貫挿した導電性バンプ（銀粉末を導電剤と
して含有する導電性樹脂組成物製）1cの選択的な加圧作
用で変形・突出した銅箔部で形成されている。すなわ
ち、銅箔を変形・突出させた後、他の配線パターン1dな
どとともに、銅箔のパターニングを行ったものである。
なお、図中2bは第２の回路基板２の配線パターンであ
る。FIG. 1 is a cross-sectional view showing a main part of a circuit board according to the first embodiment. In FIG. 1, reference numeral 1 denotes a first circuit board from which an electrically connected surface 1a is selectively projected.
Is a second circuit board having an electrically connected surface 2a facing the connected surface 1a of the first circuit board 1. here,
Both circuit boards 1 and 2 are each formed using a double-sided copper foil-clad board made of glass-epoxy resin as an insulator. The connection surface 1a of the first circuit board 1 is
The conductive bump (formed of a conductive resin composition containing silver powder as a conductive agent) 1c penetrating the insulator layer 1b is formed of a copper foil portion that is deformed and protruded by a selective pressing action. That is, after the copper foil is deformed and protruded, the copper foil is patterned together with other wiring patterns 1d and the like.
2b is a wiring pattern of the second circuit board 2.

【００２４】さらに、３は前記両回路基板１，２の被接
合面間に介挿され、選択的に両被接続面1a，2a間を電気
的に接続（導電性化している）3aするするとともに、非
電気的な接合面間3bを絶縁的、かつ機械的に接合する異
方性導電性接着剤層である。次に、実施態様を模式的に
示を図２ (a)， (b)を参照して上記構成の回路基板の製
造例を説明する。Reference numeral 3 is interposed between the surfaces to be joined of the circuit boards 1 and 2 to selectively electrically connect (make conductive) 3a between the surfaces to be connected 1a and 2a. In addition, it is an anisotropic conductive adhesive layer for electrically and mechanically joining the non-electrical joining surfaces 3b. Next, an embodiment will be described schematically with reference to FIGS. 2A and 2B, and an example of manufacturing a circuit board having the above configuration will be described.

【００２５】第１の回路基板の作成 先ず、一主面にシルクスクリーン法によって、銀粉およ
びフェノール樹脂から成るペーストを、シルクスクリー
ン法によって選択的に印刷し、乾燥・硬化させて、底面
0.3mm径，高さ 200μm ±20μm 程度の円錐型バンブ1c
を形成した厚さ18μm の電解銅箔4aを用意する。その
他、厚さ18μm の電解銅箔4b、厚さ 0.1mm程度のガラス
・エポキシ樹脂系プリプレグシート1b、および厚さ 2mm
程度のシリコーンゴム板5a，5bをそれぞれ用意する。Preparation of First Circuit Board First, a paste made of silver powder and a phenol resin is selectively printed on one principal surface by a silk screen method, dried and cured, and then dried and cured.
Conical bump 1c with a diameter of 0.3mm and a height of 200μm ± 20μm
An 18 μm-thick electrolytic copper foil 4a formed with is prepared. In addition, 18μm thick electrolytic copper foil 4b, glass / epoxy resin prepreg sheet 1b about 0.1mm thick, and 2mm thick
The silicone rubber plates 5a and 5b of the order are prepared respectively.

【００２６】次いで、前記電解銅箔4a，4b、ガラス・エ
ポキシ樹脂系プリプレグシート1b、およびシリコーンゴ
ム板5a，5bを、図２ (a)に断面的に示すごとく、積層・
配置する。その後、シリコーンゴム板5a，5bの外側に、
厚さ 2mm程度のステンレス鋼板（図示省略）を配置して
プレス装置にセットし、加熱温度 160℃，圧力は4kPaの
樹脂圧を 1時間作用させてプレス成型する。このプレス
成型によって、図２ (b)に断面的に示すごとく、円錐型
バンブ1c先端部がプリプレグシート1bを貫挿し、かつ対
向する領域の電解銅箔4a，4bに接続するとともに、その
接続部領域が選択的に変形・突起化した銅張り積層板６
を作成した。Next, the electrolytic copper foils 4a, 4b, the glass-epoxy resin prepreg sheet 1b, and the silicone rubber plates 5a, 5b are laminated and laminated as shown in FIG.
Deploy. Then, outside the silicone rubber plates 5a and 5b,
A stainless steel plate (not shown) with a thickness of about 2 mm is placed and set in a press, and press molding is performed by applying a resin temperature of 160 ° C and a pressure of 4 kPa for 1 hour. By this press molding, as shown in cross section in FIG. 2 (b), the tip of the conical-shaped bump 1c penetrates the prepreg sheet 1b and connects to the electrolytic copper foils 4a and 4b in the opposing regions. Copper-clad laminate 6 whose area is selectively deformed and projected
It was created.

【００２７】冷却後、前記銅張り積層板６の電解銅箔4
a，4b面に、エッチングレジスト（商品名，UVエッチン
グレジストAS-400 太陽インキKK製）をパターン状にス
クリーン印刷法によって印刷し、露光・現像してエッチ
ングレジスト層を設ける。次いで、塩化第２銅浴を用い
て、露出している銅箔をエッチング除去し、さらに、エ
ッチングレジスト層を除去して第１の回路基板１を作成
する。After cooling, the electrolytic copper foil 4 of the copper-clad laminate 6
On the surfaces a and 4b, an etching resist (product name, UV etching resist AS-400 made by Taiyo Ink KK) is printed in a pattern by a screen printing method, and is exposed and developed to provide an etching resist layer. Next, using a cupric chloride bath, the exposed copper foil is removed by etching, and the etching resist layer is removed to form the first circuit board 1.

【００２８】第２の回路基板の作成 先ず、銅張り積層板として、両面銅箔張りガラス・エポ
キシ樹脂系積層板を用意し、前記銅箔張り積層板の銅箔
面に、それぞれエッチングレジスト（商品名，UVエッチ
ングレジストAS-400 太陽インキKK製）をパターン状に
スクリーン印刷法によって印刷し、露光・現像してエッ
チングレジスト層を設ける。次いで、塩化第２銅浴を用
いて、露出している銅箔エッチング除去し、さらに、エ
ッチングレジスト層を除去して、一主面に電気的な被接
続部2aを有する第２の回路基板２を作成した。Preparation of Second Circuit Board First, a double-sided copper-foiled glass / epoxy resin-based laminate was prepared as a copper-clad laminate, and an etching resist (product Name, UV etching resist AS-400 (manufactured by Taiyo Ink KK) is printed in a pattern by screen printing, exposed and developed to provide an etching resist layer. Then, the exposed copper foil is removed by etching using a cupric chloride bath, the etching resist layer is removed, and the second circuit board 2 having an electrically connected portion 2a on one main surface is removed. It was created.

【００２９】回路基板の製造 次に、前記第１の回路基板１、第２の回路基板２および
異方性導電性接着剤シートを用意し、第２の回路基板２
の電気的な被接続部2aに対し、第１の回路基板１の突起
化させた電気的な被接続部1aを位置合わせ・配置する。
この積層体の両主面側に当て板を配置してプレス装置に
セットし、加熱温度 160℃，圧力4kPaの樹脂圧で 1時間
作用させて両回路基板１，２を接合して回路基板を製造
した。Manufacturing of Circuit Board Next, the first circuit board 1, the second circuit board 2, and the anisotropic conductive adhesive sheet are prepared.
The electrically connected portion 1a, which is formed into a projection of the first circuit board 1, is positioned and arranged with respect to the electrically connected portion 2a.
Placing plates are placed on both main surfaces of the laminate and set in a pressing device. The circuit boards are joined by applying a heating temperature of 160 ° C. and a resin pressure of 4 kPa for 1 hour to join the circuit boards 1 and 2. Manufactured.

【００３０】上記プレス加工において、両回路基板１，
２の被接続面1a，2a間は、被接続面1aが接続に関与しな
い他の配線パターン1dよりも突出し、かつ対向する被接
続面2aに近接化している。したがって、両回路基板１，
２の接合面間に介挿された異方性導電性接着剤層３は、
選択的に両被接続面1a，2a間が強く圧接され、容易に導
電性化して電気的な接続を形成する一方、両回路基板
１，２の接合面間が離隔している領域（部分）、すなわ
ち電気的な接続を不要とする領域（部分）では、所要の
電気的な絶縁性を呈するとともに、機械的な接合に寄与
し、信頼性の高い回路基板が得られる。In the above press working, both circuit boards 1
Between the two connected surfaces 1a, 2a, the connected surface 1a protrudes more than the other wiring pattern 1d not involved in the connection and is close to the opposing connected surface 2a. Therefore, both circuit boards 1
2, the anisotropic conductive adhesive layer 3 interposed between the joining surfaces
A region (part) in which the connection surfaces 1a and 2a are selectively strongly pressed and easily made conductive to form an electrical connection while the bonding surfaces of the circuit boards 1 and 2 are separated. In other words, in a region (portion) where the electrical connection is not required, the circuit board exhibits the required electrical insulation and contributes to the mechanical joining, so that a highly reliable circuit board can be obtained.

【００３１】前記構成の回路基板において、第１の回路
基板１および第２の回路基板２間の被接続面1a，2aの接
続抵抗は平均10 mΩであり、また、この接続の信頼性を
評価するため、ホットオイルテストで（ 260℃のオイル
中に10秒浸漬，20℃のオイル中に20秒浸漬のサイクルを
1サイクルとして）、 100回行っても不良発生は認めら
れず、従来の銅メッキスルホール法による場合に比較し
て、導電（配線）パターン間の接続信頼性は同等以上で
あった。In the circuit board having the above structure, the connection resistance of the connection surfaces 1a and 2a between the first circuit board 1 and the second circuit board 2 is 10 mΩ on average, and the reliability of this connection is evaluated. In order to do this, a hot oil test was performed (a cycle of immersion in oil at 260 ° C for 10 seconds,
No failure was observed even after 100 cycles (as one cycle), and the connection reliability between the conductive (wiring) patterns was equal to or higher than that obtained by the conventional copper plating through-hole method.

【００３２】次ぎに、図３および図４を参照して、第２
の実施例に係る回路基板の構成を説明する。Next, referring to FIG. 3 and FIG.
The configuration of the circuit board according to the example will be described.

【００３３】回路基板の作成 先ず、一主面にシルクスクリーン法によって、銀粉およ
びフェノール樹脂から成るペーストを、シルクスクリー
ン法によって選択的に印刷し、乾燥・硬化させて、底面
0.3mm径，高さ 200μm ±20μm 程度の円錐型バンブ1c
を形成した厚さ18μm の電解銅箔4aを用意する。その
他、厚さ18μm の電解銅箔4b、厚さ 0.1程度のガラス・
エポキシ樹脂系プリプレグシート1b、および厚さ 2mm程
度のシリコーンゴム板5aをそれぞれ用意する。First, a paste composed of silver powder and a phenol resin is selectively printed on one principal surface by a silk screen method, dried and cured, and dried on a bottom surface.
Conical bump 1c with a diameter of 0.3mm and a height of 200μm ± 20μm
An 18 μm-thick electrolytic copper foil 4a formed with is prepared. In addition, 18μm thick electrolytic copper foil 4b, glass 0.1mm thick
An epoxy resin-based prepreg sheet 1b and a silicone rubber plate 5a having a thickness of about 2 mm are prepared.

【００３４】次いで、前記電解銅箔4a，4b、ガラス・エ
ポキシ樹脂系プリプレグシート1b、およびシリコーンゴ
ム板5aを、上記図２ (a)に準じた態様で積層・配置（シ
リコーンゴム板5bの配置を省略）する。その後、シリコ
ーンゴム板5a，電解銅箔4bの外側に、厚さ 2mm程度のス
テンレス鋼板を配置してプレス装置にセットし、加熱温
度 160℃，圧力は4kPaの樹脂圧を 1時間作用させてプレ
ス成型する。Next, the electrolytic copper foils 4a and 4b, the glass-epoxy resin prepreg sheet 1b, and the silicone rubber plate 5a are laminated and arranged in a manner similar to FIG. 2A (the arrangement of the silicone rubber plate 5b). Is omitted). After that, a stainless steel plate with a thickness of about 2 mm is placed outside the silicone rubber plate 5a and the electrolytic copper foil 4b and set in a pressing device. The resin is pressed at a heating temperature of 160 ° C and a resin pressure of 4kPa for 1 hour. Mold.

【００３５】このプレス成型によって、円錐型バンブ1c
先端部がプリプレグシート1bを貫挿し、かつ対向する領
域の電解銅箔4a，4bに接続する銅張り積層板を作成す
る。この場合、プリプレグシート1bを貫挿した円錐型バ
ンブ1cの先端部は、ステンレス鋼板（当て板）で進入が
抑制されるため、電解銅箔4bの変形・突出、すなわち電
解銅箔4bの選択的な突出がなくなり、一主面に平坦的な
電解銅箔4b面を、他主面に突起的な電解銅箔4aを有する
銅張り積層板となる。By this press molding, the conical bump 1c
A copper-clad laminate is prepared in which the leading end portion penetrates the prepreg sheet 1b and is connected to the electrolytic copper foils 4a and 4b in opposing regions. In this case, since the tip of the conical-shaped bump 1c penetrating the prepreg sheet 1b is restrained from entering by a stainless steel plate (contact plate), the deformation and protrusion of the electrolytic copper foil 4b, that is, the selective formation of the electrolytic copper foil 4b The copper clad laminate has a flat electrolytic copper foil 4b on one main surface and a protruding electrolytic copper foil 4a on the other main surface.

【００３６】冷却後、前記銅張り積層板の電解銅箔4a，
4b面に、エッチングレジスト（商品名，UVエッチングレ
ジストAS-400 太陽インキKK製）をパターン状にスクリ
ーン印刷法によって印刷し、露光・現像してエッチング
レジスト層を設ける。次いで、塩化第２銅浴を用いて、
露出している銅箔をエッチング除去し、さらに、エッチ
ングレジスト層を除去して、図３に要部構成を断面的に
示すような回路基板７（第１，第２の回路基板に相当…
7a，7b，7c）を作成する。After cooling, the electrolytic copper foils 4a,
On the 4b surface, an etching resist (product name, UV etching resist AS-400 made by Taiyo Ink KK) is printed in a pattern by screen printing, and is exposed and developed to provide an etching resist layer. Then, using a cupric chloride bath,
The exposed copper foil is removed by etching, the etching resist layer is removed, and the circuit board 7 (corresponding to the first and second circuit boards) whose main configuration is shown in cross section in FIG.
7a, 7b, 7c).

【００３７】次に、前記第１，第２の回路基板7a，7b，
7cおよび異方性導電性接着剤シートを用意し、各回路基
板7b，7cの電気的な被接続部7b′，7c′に対し、突起化
させた電気的な被接続部7a″，7b″，7c″を位置合わせ
・配置する。この積層体の両主面側に当て板を配置して
プレス装置にセットし、加熱温度 160℃，圧力4kPaの樹
脂圧で 1時間作用させて回路基板7a，7b，7cを接合し
て、図４に要部構成を断面的に示すような回路基板を製
造した。Next, the first and second circuit boards 7a, 7b,
7c and an anisotropic conductive adhesive sheet are prepared, and the electrically connected parts 7b 'and 7c' of each of the circuit boards 7b and 7c are formed into projecting electrical connected parts 7a "and 7b". , 7c ". Arrange the backing plates on both main surfaces of the laminate, set it on the press, and operate it for 1 hour at a heating temperature of 160 ° C and a resin pressure of 4kPa. , 7b, and 7c were joined to produce a circuit board whose main configuration is shown in cross section in FIG.

【００３８】上記プレス加工において、回路基板7a，7
b，7cの被接続面7a″，7b′間、7b″，7c′間、7c″，7
b′間は、接続に関与しない他の配線パターンよりも突
出し、かつ対向する被接続面間が近接化している。した
がって、回路基板7a，7b，7cの接合面間に介挿された異
方性導電性接着剤層３は、選択的に被接続面7a″−7
b′、7b″−7c′および7c″−7b′間が強く圧接され、
容易に導電性化して電気的な接続を形成する一方、回路
基板7a，7b，7cの接合面間が離隔している領域（部
分）、すなわち電気的な接続を不要とする領域（部分）
では、所要の電気的な絶縁性を呈するとともに、機械的
な接合に寄与し、信頼性の高い回路基板が得られる。In the press working, the circuit boards 7a, 7
b, 7c, between connected surfaces 7a "and 7b ', 7b" and 7c', 7c ", 7
The portion between b ′ protrudes from other wiring patterns not involved in the connection, and the opposing connected surfaces are close to each other. Therefore, the anisotropic conductive adhesive layer 3 interposed between the bonding surfaces of the circuit boards 7a, 7b, 7c selectively connects the connection surfaces 7a ″ -7.
b ′, 7b ″ −7c ′ and 7c ″ −7b ′ are strongly pressed,
A region (part) where the bonding surfaces of the circuit boards 7a, 7b, 7c are separated while the electrical connection is easily formed by conducting, that is, a region (part) where the electrical connection is unnecessary.
In this case, not only the required electrical insulation properties are exhibited, but also mechanical bonding is achieved, and a highly reliable circuit board can be obtained.

【００３９】前記構成の回路基板において、第１の回路
基板１および第２の回路基板２間の被接続面1a，2aの接
続抵抗は平均10 mΩであり、また、この接続の信頼性を
評価するため、ホットオイルテストで（ 260℃のオイル
中に10秒浸漬，20℃のオイル中に20秒浸漬のサイクルを
1サイクルとして）、 100回行っても不良発生は認めら
れず、従来の銅メッキスルホール法による場合に比較し
て、導電（配線）パターン間の接続信頼性は同等以上で
あった。In the circuit board having the above configuration, the connection resistance of the connection surfaces 1a and 2a between the first circuit board 1 and the second circuit board 2 is 10 mΩ on average, and the reliability of this connection is evaluated. In order to do this, a hot oil test was performed (a cycle of immersion in oil at 260 ° C for 10 seconds and immersion in oil at 20 ° C for 20 seconds).
No failure was observed even after 100 cycles (as one cycle), and the connection reliability between the conductive (wiring) patterns was equal to or higher than that obtained by the conventional copper plating through-hole method.

【００４０】図５は第３の実施例に係る回路基板の要部
構成を示す断面図である。図５において、１は電気的な
被接続面1aが選択的に突出された第１の回路基板、８は
前記第１の回路基板１の被接続面1aに対向する電気的な
被接続面8aを有するフレキシブルな第２の回路基板であ
る。ここで、回路基板１は、ガラス・エポキシ樹脂系を
絶縁体とした両面銅箔張り板を素材として形成されたス
ルホール型で、被接続面1aが絶縁体層1bを貫挿した導電
性バンプ（銀粉末を導電剤として含有する導電性樹脂組
成物製）1cの選択的な加圧作用で変形・突出した銅箔部
で形成されている。FIG. 5 is a sectional view showing the structure of a main part of a circuit board according to the third embodiment. In FIG. 5, reference numeral 1 denotes a first circuit board on which an electrically connected surface 1a is selectively projected, and 8 denotes an electrically connected surface 8a facing the connected surface 1a of the first circuit board 1. Is a flexible second circuit board. Here, the circuit board 1 is a through-hole type formed by using a double-sided copper foil-clad board made of glass-epoxy resin as an insulator, and the connected surface 1a has conductive bumps ( It is formed of a copper foil portion that is deformed and protruded by the selective pressing action of a conductive resin composition containing silver powder as a conductive agent) 1c.

【００４１】すなわち、銅箔を変形・突出させた後、他
の配線パターンなどとともに、銅箔のパターニングを行
ったものである。また、第２の回路基板８は、ポリイミ
ド樹脂フィルム8b面に被接続面8aを含む配線パターンが
設けられたものである。That is, after the copper foil is deformed and protruded, the copper foil is patterned together with other wiring patterns. The second circuit board 8 is provided with a wiring pattern including a surface 8a to be connected on a surface of a polyimide resin film 8b.

【００４２】さらに、３は前記回路基板１，８の被接合
面間に介挿され、選択的に両被接続面1a，8a間を電気的
に接続（導電性化している）3aするするとともに、非電
気的な接合面間3bを絶縁的、かつ機械的に接合する異方
性導電性接着剤層である。Further, numeral 3 is interposed between the surfaces to be joined of the circuit boards 1 and 8 to selectively electrically connect (conductivity) 3a between both surfaces 1a and 8a. And an anisotropic conductive adhesive layer for electrically and mechanically joining the non-electrical joining surfaces 3b.

【００４３】この構成の場合、いわゆるリジッド回路基
板とフレキシブル回路基板とは、信頼性の高い電気的、
機械的な接続・接合を形成するだけでなく、その電気
的、機械的な接続・接合も容易に行えるので、リジッド
−フレキシブル型回路基板の実用化に大きく寄与する。In the case of this configuration, a so-called rigid circuit board and a flexible circuit board are electrically connected to each other with high reliability.
Not only mechanical connection and joining can be formed, but also electrical and mechanical connection and joining can be easily performed, which greatly contributes to practical use of a rigid-flexible circuit board.

【００４４】上記各実施例において、第１の回路基板の
電気的な被接続面（凸部）をメッキ層もしくは導電性樹
脂層などで形成しても、同様な回路基板が得られる。In each of the above embodiments, a similar circuit board can be obtained even if the electrically connected surface (convex portion) of the first circuit board is formed of a plating layer or a conductive resin layer.

【００４５】なお、本発明は上記実施例に限定されるも
のでなく、本発明の趣旨を逸脱しない範囲で、いろいろ
の変形を採り得る。It should be noted that the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

【００４６】[0046]

【発明の効果】請求項１ないし請求項３の発明によれ
ば、回路基板同士の接合面間に介挿させた異方性導電性
接着剤層は、対向する面の電気的な被接続面が選択的に
突出し、対応する被接続面間が優先的に加圧・圧着さ
れ、この加圧・圧着領域で選択的に導電性を呈して、対
向する被接続面同士が電気的な接続を形成している。一
方、前記優先的な加圧・圧着領域以外の領域では、絶縁
性の異方性導電性接着剤層によって、回路基板同士が機
械的に接合・一体化している。According to the first to third aspects of the present invention, the anisotropic conductive adhesive layer interposed between the joining surfaces of the circuit boards has the opposite electrically connected surfaces. Are selectively protruded, and the corresponding connected surfaces are pressurized and crimped preferentially, and selectively exhibit conductivity in the pressurized and crimped region, and the opposing connected surfaces establish electrical connection. Has formed. On the other hand, in regions other than the preferential pressure / compression bonding region, the circuit boards are mechanically joined and integrated by the insulating anisotropic conductive adhesive layer.

【００４７】すなわち、対向する被接続面同士が確実
で、信頼性の高い電気的な接続を形成しながら、この電
気的な接続を確実に絶縁離隔し、かつ機械的強度の高い
接合一体化した回路基板が提供される。That is, while the opposing connected surfaces form a reliable and highly reliable electrical connection, the electrical connection is reliably insulated and separated and joined together with high mechanical strength. A circuit board is provided.

【００４８】請求項４の発明によれば、上記回路基板の
構成に適する回路基板を歩留まりよく提供できる。According to the fourth aspect of the present invention, a circuit board suitable for the configuration of the circuit board can be provided with a high yield.

【００４９】請求項５および請求項６の発明によれば、
層間接続の工程が簡略化されるだけでなく、信頼性の高
い高密度配線型ないしは高密度実装型の回路基板が、歩
留まりよく、かつ低コストで提供される。According to the fifth and sixth aspects of the present invention,
In addition to simplifying the interlayer connection process, a highly reliable high-density wiring type or high-density mounting type circuit board can be provided with high yield and low cost.

【図面の簡単な説明】[Brief description of the drawings]

【図１】第１の実施例に係る回路基板の要部構成を示す
断面図。FIG. 1 is a sectional view showing a configuration of a main part of a circuit board according to a first embodiment.

【図２】第１回路基板の製造態様を模式的に示すもの
で、 (a)は導電性バンプを形設した銅箔、絶縁性シート
および銅箔の積層を柔軟性板で挟むように積層・配置し
た状態を示す断面図、 (b)は加圧して一体化したときの
状態を示す断面図。FIGS. 2A and 2B schematically show a manufacturing mode of a first circuit board. FIG. 2A shows a laminate in which a laminate of a copper foil having conductive bumps formed thereon, an insulating sheet, and a copper foil is sandwiched between flexible boards. -A cross-sectional view showing a state in which they are arranged, and (b) is a cross-sectional view showing a state when they are integrated by applying pressure.

【図３】第２の実施例に係る回路基板の構成に使用する
回路基板の要部構成を示す断面図。FIG. 3 is a cross-sectional view illustrating a main configuration of a circuit board used for the configuration of the circuit board according to the second embodiment.

【図４】第２の実施例に係る回路基板の要部構成を示す
断面図。FIG. 4 is a sectional view showing a configuration of a main part of a circuit board according to a second embodiment.

【図５】第３の実施例に係る回路基板の要部構成を示す
断面図。FIG. 5 is a sectional view showing a configuration of a main part of a circuit board according to a third embodiment.

【符号の説明】[Explanation of symbols]

１……第１の回路基板 1a……電気的な被接続部 1b……絶縁性シート 1c……導電性バンプ ２……第２の回路基板 2a……電気的な被接続部 ３……異方性導電性接着剤層 3a……異方性導電性接着剤層の導電性化領域 4a，4b……銅箔 5a，5b……柔軟性板 ６……銅箔張り積層板 ７（7a，7b，7c）……第１、第２の回路基板（兼用） 7a″，7b″，7c″……電気的な被接続部（突起） ８……フレキシブルな回路基板 DESCRIPTION OF SYMBOLS 1 ... 1st circuit board 1a ... Electrical connection part 1b ... Insulating sheet 1c ... Conductive bump 2 ... 2nd circuit board 2a ... Electrical connection part 3 ... Different Anisotropic conductive adhesive layer 3a: conductive areas of anisotropic conductive adhesive layer 4a, 4b: copper foil 5a, 5b: flexible plate 6: copper foil-clad laminate 7 (7a, 7b, 7c)... First and second circuit boards (also used) 7a ″, 7b ″, 7c ″... Electrically connected parts (projections) 8....

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ Ｈ０５Ｋ 3/36 Ｈ０５Ｋ 3/36 Ｚ 3/40 3/40 Ｋ (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 3/46 H05K 3/36 H05K 1/11 H05K 3/40 ────────────────────────────────────────────────── ─── Continued on the front page (51) Int.Cl. 7 identification symbol FI H05K 3/36 H05K 3/36 Z 3/40 3/40 K (58) Field surveyed (Int.Cl. 7 , DB name) H05K 3/46 H05K 3/36 H05K 1/11 H05K 3/40

Claims (6)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】 導電性突起を厚さ方向に貫通させるこ
とにより少なくとも一方の面に電気的な被接続面が選択
的に突出された突出部を備え、前記突出部の表面は金属
層で被覆された第１の回路基板と、 前記第１の回路基板の突出した被接続面に対向する電気
的な被接続面を有する第２の回路基板と、 前記両回路基板の被接合面間に介挿され、選択的に両被
接続面間を電気的に接続するするとともに、非電気的な
接合面間を絶縁的、かつ機械的に接合する異方性導電性
接着剤層とを有することを特徴とする回路基板。1. A conductive projection may be penetrated in a thickness direction.
Selects an electrically connected surface on at least one surface by
A protruding portion, the surface of which is metal
A first circuit board covered with a layer, a second circuit board having an electrically connected face opposing a protruded connected face of the first circuit board, and a joined face of the two circuit boards An anisotropic conductive adhesive layer that is interposed therebetween and selectively electrically connects the two connected surfaces, and insulates and electrically mechanically bonds the non-electrically bonded surfaces. A circuit board, comprising: 【請求項２】 第１の回路基板の電気的な被接続面が、
メッキ層もしくは導電性樹脂で形成されている形成され
ていることを特徴とする請求項１記載の回路基板。2. An electric connection surface of a first circuit board,
2. The circuit board according to claim 1 , wherein the circuit board is formed of a plating layer or a conductive resin. 【請求項３】 第１の導電体箔の一主面に難変形性か
つ略円錐型の導電性バンブを形設する工程と、前記導電
性バンプ形設面に、導電性バンプの先端部が貫挿可能な
絶縁性シートを積層配置する工程と、前記絶縁性シート
上に第２の導電体箔を積層配置する工程と、前記積層配
置の両導電体箔の少なくとも一方の外側に柔軟性板を介
挿してプレス成型し、前記柔軟性板側で導電性バンブに
対接する領域の導電体箔を変形・突出させた導電体箔張
り基板を形成する工程と、前記導電体箔張り基板の導電
体箔をパターニング処理する工程とを有することを特徴
とする回路基板の製造方法。Wherein either hard-to-deform on one main surface of the first conductor foil
Forming a substantially conical conductive bump; laminating an insulating sheet through which the tip of the conductive bump can penetrate, on the conductive bump forming surface; Laminating and placing a second conductor foil on at least one of the two conductor foils in the laminated arrangement, press-molding by inserting a flexible plate outside at least one of the two conductor foils, and forming a conductive bump on the flexible plate side with the conductive bump. A method of manufacturing a circuit board, comprising: a step of forming a conductor foil-clad substrate in which a conductor foil in a contact area is deformed and protruded; and a step of patterning a conductor foil of the conductor foil-clad substrate. Method. 【請求項４】 導電性突起を厚さ方向に貫通させるこ
とにより少なくとも一方の面に電気的な被接続面が選択
的に突出された突出部を備え、前記突出部の表面は金属
層で被覆されたコア基板を製造する工程と、 前記コア基板の前記被接続面側に異方性導電性接着剤層
を積層・配置する工程と、 前記異方性導電性接着剤層上に、コア基板の電気的な被
接続面に対応する電気的な被接続面を突出させた回路基
板を位置決め配置する工程と、 前記位置決め配置した積層体を加圧し、前記両被接続面
間に対応する異方性導電性接着剤層領域を選択的に導電
性化するとともに、接合一体化する工程とを有すること
を特徴とする回路基板の製造方法。4. A conductive projection may be penetrated in a thickness direction.
Selects an electrically connected surface on at least one surface by
A protruding portion, the surface of which is metal
A step of manufacturing a core substrate covered with a layer, a step of laminating and arranging an anisotropic conductive adhesive layer on the connection surface side of the core substrate, Positioning and arranging a circuit board having an electrically connected surface corresponding to the electrically connected surface of the core substrate, and pressurizing the positioned and arranged laminate to correspond between the two connected surfaces. Selectively making the anisotropic conductive adhesive layer region conductive and bonding and integrating the same. 【請求項５】 導電性突起を厚さ方向に貫通させること
により少なくとも一方の面に電気的な被接続面が選択的
に突出された突出部を備え、前記突出部の表面は金属層
で被覆された第１の回路基板を製造する工程と、 前記コア基板の前記被接続面側に異方性導電性接着剤層
を積層・配置する工程と、 前記異方性導電性接着剤層上に、コア基板の電気的な被
接続面に対応する電気的な被接続面を有する回路基板を
位置決め配置する工程と、 前記位置決め配置した積層体を加圧し、前記両被接続面
間に対応する異方性導電性接着剤層領域を選択的に導電
性化するとともに、接合一体化する工程とを有すること
を特徴とする回路基板の製造方法。5. A conductive projection penetrating in a thickness direction.
Selects electrically connected surface on at least one side
A protruding portion protruding from the metal layer,
Manufacturing a first circuit board covered with: a step of laminating and arranging an anisotropic conductive adhesive layer on the connection side of the core substrate; and an anisotropic conductive adhesive layer. A step of positioning and arranging a circuit board having an electrically connected surface corresponding to the electrically connected surface of the core substrate; and pressing the positioned and positioned laminate to correspond between the two connected surfaces. Selectively making the anisotropic conductive adhesive layer region conductive and bonding and integrating the same. 【請求項６】 前記コア基板を製造する工程が、6. The step of manufacturing the core substrate, 第１の導電体箔の一主面に難変形性かつ略円錐型の導電A hardly deformable and substantially conical conductive material is provided on one main surface of the first conductive foil.
性バンブを形設する工程と、Forming a sex bump; 前記導電性バンプ形設面に、導電性バンプの先端部が貫The tip of the conductive bump penetrates the conductive bump forming surface.
挿可能な絶縁性シートを積層配置する工程と、A step of laminating and placing an insertable insulating sheet; 前記絶縁性シート上に第２の導電体箔を積層配置する工A step of laminating and arranging a second conductor foil on the insulating sheet
程と、About 前記積層配置の両導電体箔の少なくとも一方の外側に柔A flexible material is provided on at least one of the outer sides of the conductor foils in the laminated arrangement.
軟性板を介挿してプレス成型し、前記柔軟性板側で導電Press-molded with a flexible plate interposed, conductive on the flexible plate side
性バンブに対接する領域の導電体箔を変形・突出させたDeformed and protruded the conductor foil in the area in contact with the conductive bump
導電体箔張り基板を形成する工程と、A step of forming a conductor foil-clad substrate, 前記導電体箔張り基板の導電体箔をパターニング処理すPatterning the conductor foil of the conductor foil-clad substrate
る工程とを有することを特徴とする請求項４項又は５項6. The method according to claim 4, further comprising the steps of:
に記載の回路基板の製造方法。3. The method for manufacturing a circuit board according to 1.
JP20060497A 1997-07-25 1997-07-25 Circuit board and method of manufacturing the same Expired - Fee Related JP3347980B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20060497A JP3347980B2 (en) 1997-07-25 1997-07-25 Circuit board and method of manufacturing the same

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Application Number Priority Date Filing Date Title
JP20060497A JP3347980B2 (en) 1997-07-25 1997-07-25 Circuit board and method of manufacturing the same

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Publication Number Publication Date
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JP3347980B2 true JP3347980B2 (en) 2002-11-20

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ID=16427137

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003086907A (en) * 2001-06-29 2003-03-20 Tatsuta Electric Wire & Cable Co Ltd Shielded flexible printed wiring board
JP4045143B2 (en) * 2002-02-18 2008-02-13 テセラ・インターコネクト・マテリアルズ，インコーポレイテッド Manufacturing method of wiring film connecting member and manufacturing method of multilayer wiring board
CN100334929C (en) * 2002-05-21 2007-08-29 株式会社大和工业 Interlayer connection structure and its building method
JP4503578B2 (en) * 2006-11-13 2010-07-14 大日本印刷株式会社 Printed wiring board
JP2017003702A (en) * 2015-06-08 2017-01-05 日本放送協会 Double side wiring board, display and display device

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