JP3344414B2 - Display using light emitting diode - Google Patents
Display using light emitting diodeInfo
- Publication number
- JP3344414B2 JP3344414B2 JP2000215236A JP2000215236A JP3344414B2 JP 3344414 B2 JP3344414 B2 JP 3344414B2 JP 2000215236 A JP2000215236 A JP 2000215236A JP 2000215236 A JP2000215236 A JP 2000215236A JP 3344414 B2 JP3344414 B2 JP 3344414B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- resin
- cup
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Landscapes
- Led Device Packages (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は発光ダイオード（以
下ＬＥＤという。）を用いたディスプレイに係り、特に
発光チップの発光波長を異なる波長に変換する、または
発光チップの発光を一部吸収するＬＥＤのディスプレイ
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a display using a light emitting diode (hereinafter, referred to as an LED), and more particularly to an LED for converting the light emission wavelength of a light emitting chip to a different wavelength or partially absorbing the light emitted from the light emitting chip . Display .
【０００２】[0002]
【従来の技術】図２は従来のＬＥＤの一構造を示す模式
断面図であり、１は化合物半導体よりなる発光チップ、
２はリードフレーム、３は発光チップの発光を発光観測
面側に反射させる目的で設けられたカップ、４は発光素
子全体を封止する樹脂である。通常、樹脂４は発光チッ
プの発光を空気中に効率よく放出する目的で透明度の高
い樹脂が選択されるが、他にその発光チップの発光色を
変換する目的で、あるいは色を補正する目的で、その樹
脂４の中に発光チップの発光を他の波長に変換する蛍光
物質、または発光波長を一部吸収するフィルター物質等
の波長変換材料５が混入される場合がある。この場合、
波長変換材料５は樹脂４に均一に分散するように混入さ
れるのが通常である。2. Description of the Related Art FIG. 2 is a schematic sectional view showing one structure of a conventional LED, wherein 1 is a light emitting chip made of a compound semiconductor,
Reference numeral 2 denotes a lead frame, 3 denotes a cup provided for reflecting light emitted from the light emitting chip toward the light emission observation surface, and 4 denotes a resin for sealing the entire light emitting element. Usually, a resin having high transparency is selected as the resin 4 for the purpose of efficiently emitting the light emitted from the light emitting chip into the air. However, for the purpose of converting the emission color of the light emitting chip or correcting the color. In some cases, a wavelength conversion material 5 such as a fluorescent substance that converts the light emitted from the light emitting chip to another wavelength or a filter substance that partially absorbs the emission wavelength is mixed in the resin 4. in this case,
Usually, the wavelength conversion material 5 is mixed so as to be uniformly dispersed in the resin 4.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上記の
目的で波長変換材料５を樹脂４中に均一に分散させる
と、この図に示すように、波長変換された光、または不
要な波長がカットされた光は樹脂４中で四方八方に散乱
してしまい、集光が悪くなるという問題がある。図２の
矢印は発光チップの光が波長変換材料５にあたり、波長
変換された光が散乱する様子を模式的に示した図であ
る。つまり、波長変換された光が散乱されることによ
り、発光観測面側の光量が減少して輝度が低くなるので
ある。However, if the wavelength conversion material 5 is uniformly dispersed in the resin 4 for the above-mentioned purpose, the wavelength-converted light or unnecessary wavelength is cut as shown in FIG. The collected light is scattered in all directions in the resin 4, and there is a problem that light collection is deteriorated. The arrow in FIG. 2 is a diagram schematically illustrating a state in which light from the light emitting chip hits the wavelength conversion material 5 and the wavelength-converted light is scattered. That is, when the wavelength-converted light is scattered, the amount of light on the emission observation surface side decreases, and the luminance decreases.
【０００４】また、波長変換材料５を蛍光物質に限定し
た場合、新たな問題点として、異なる発光色のＬＥＤを
接近して設置した際に、他のＬＥＤ発光による蛍光物質
のよけいな発光の問題がある。例えば、青色発光チップ
で緑色発光が得られる蛍光物質を含む緑色ＬＥＤと、単
なる青色発光チップのみからなる青色ＬＥＤとを同一平
面上に水平に近接して並べた場合、緑色ＬＥＤを消灯し
て、青色ＬＥＤを点灯すると、青色ＬＥＤから洩れ出る
光、つまり散乱する光により、緑色ＬＥＤの蛍光物質が
励起され、消灯した緑色ＬＥＤがあたかも点灯したよう
な状態となり、両ＬＥＤの混色が発生する。When the wavelength conversion material 5 is limited to a fluorescent substance, a new problem is that when LEDs of different luminescent colors are installed close to each other, another problem arises in that the fluorescent substance emits light when other LEDs emit light. There is. For example, when a green LED containing a fluorescent substance that emits green light with a blue light emitting chip and a blue LED consisting of only a blue light emitting chip are arranged horizontally close to each other on the same plane, the green LED is turned off, When the blue LED is turned on, the light leaking from the blue LED, that is, the scattered light excites the fluorescent substance of the green LED, and the turned-off green LED becomes as if it were turned on, and the two LEDs are mixed.
【０００５】従って本発明の目的とするところは、ＬＥ
Ｄの樹脂に波長変換材料を含有させて発光チップの波長
変換を行う際、まず変換された発光の集光をよくしてＬ
ＥＤの輝度を高めることを目的とし、また蛍光物質を使
用した際、波長の異なるＬＥＤを近接して設置しても混
色の起こらないＬＥＤのディスプレイを提供することを
もう一つの目的とする。Accordingly, an object of the present invention is to provide an LE
When wavelength conversion of a light emitting chip is performed by incorporating a wavelength conversion material into the resin D, first, the converted light emission is concentrated and L
It is another object of the present invention to increase the luminance of an ED, and to provide an LED display that does not cause color mixing even when LEDs having different wavelengths are arranged close to each other when a fluorescent substance is used.
【０００６】[0006]
【課題を解決するための手段】本発明のディスプレイ
は、カップ３に装着されている発光チップ１の発光色
を、波長変換材料５で変えて外部に放射するＬＥＤを備
える。さらにディスプレイは、同一平面上に接近して配
設している第１のＬＥＤと第２のＬＥＤを備え、ＬＥＤ
は、発光チップの発光を発光観測面側に反射するカップ
の底部に発光チップを載置している発光素子の全体を樹
脂で封止している。樹脂はカップ内部に充填している第
一の樹脂と、第一の樹脂を包囲する第二の樹脂とからな
る。第一の樹脂には発光チップの発光波長を一部吸収す
るフィルター物質が含有されている。第二の樹脂は発光
チップの発光波長を一部吸収するフィルター物質が含有
されていない。さらに、発光ダイオードは、カップの底
部に配設された発光チップと、カップの縁の水平面より
も低く発光チップを封止する第一の樹脂と、カップの縁
の水平面よりも低い第一の樹脂を包囲する第二の樹脂と
を有する。発光チップは青色発光チップであり、青色発
光チップの発光波長を、それよりも長波長の光に変換す
る蛍光物質を第一の樹脂に含有させていると共に第二の
樹脂は、第一の樹脂の材料と同一の材料であって青色発
光チップの発光波長をそれよりも長波長の光に変換する
蛍光物質を含有していない。A display according to the present invention.
Is equipped with an LED that changes the emission color of the light emitting chip 1 mounted on the cup 3 with the wavelength conversion material 5 and emits the light to the outside.
I can. In addition, the displays are closely spaced on the same plane.
Comprising a first LED and a second LED provided,
In the Japanese Patent Application Laid-Open No. H11-115, the entire light-emitting element on which the light-emitting chip is mounted is sealed with resin at the bottom of a cup that reflects light emitted from the light-emitting chip toward the light emission observation surface. The resin is composed of a first resin filling the inside of the cup and a second resin surrounding the first resin. The first resin contains a filter substance that partially absorbs the emission wavelength of the light emitting chip. The second resin does not contain a filter substance that partially absorbs the emission wavelength of the light emitting chip. In addition, light emission diode, a light emitting chip disposed on the bottom of the cup, a first resin for sealing the lower light-emitting chip from the edge horizontal plane of the cup, the first lower than the edge horizontal plane of the cup And a second resin surrounding the resin. The light-emitting chip is a blue light-emitting chip, the first resin contains a fluorescent substance that converts the emission wavelength of the blue light-emitting chip into light of a longer wavelength, and the second resin is a first resin. And does not contain a fluorescent substance that converts the emission wavelength of the blue light-emitting chip into light having a longer wavelength than that of the blue light-emitting chip.
【０００７】本発明のＬＥＤは、発光チップ、第一の樹
脂 、第二の樹脂の屈折率を順に小さくすることができ
る。 In the LED of the present invention, the refractive indices of the light emitting chip, the first resin, and the second resin can be sequentially reduced.
You.
【０００８】[0008]
【作用】本発明のディスプレイのＬＥＤは、発光チップ
の発光色を変換してカップの外部に放射する。発光色の
変換された光は四方八方に散乱されるが、散乱した光の
ほとんどは、カップの内面で反射されて、発光観測面側
に集光される。つまり本発明のＬＥＤは、発光チップを
固定し、かつ、波長変換材料を充填しているカップで、
発光色の変換された光を、内面で反射して集光できるの
で、変換光の集光効率を格段に向上できる。 The LED of the display according to the present invention converts the emission color of the light emitting chip and emits the light outside the cup. The light whose emission color has been converted is scattered in all directions, but most of the scattered light is reflected by the inner surface of the cup and collected on the emission observation surface side. That is, the LED of the present invention is a cup that fixes the light emitting chip and is filled with the wavelength conversion material.
Since the light whose emission color has been converted can be reflected by the inner surface and collected, the light collection efficiency of the converted light can be significantly improved.
【０００９】さらに、蛍光物質を含む第一の樹脂をカッ
プの縁部の水平面よりも低くなるように充填しているの
で、外部から入射する光がカップの縁で遮られ、蛍光物
質にまで到達しないことにより、ＬＥＤ間の混色を防止
することができる。簡単にいうと、カップのさを深くし
て蛍光物質を含む第一の樹脂がカップからはみ出さない
ようにすることにより、蛍光物質の励起源を発光チップ
の発光波長のみに制限できる。Further, since the first resin containing the fluorescent substance is filled so as to be lower than the horizontal plane at the edge of the cup, light incident from the outside is blocked by the edge of the cup and reaches the fluorescent substance. By not doing so, color mixing between the LEDs can be prevented. In short, the excitation source of the fluorescent substance can be limited to only the emission wavelength of the light emitting chip by making the cup deep so that the first resin containing the fluorescent substance does not protrude from the cup.
【００１０】[0010]
【発明の実施の形態】図１は本願の一実施例のＬＥＤの
構造を示す模式断面図であり、図２と同様に、カップ３
を有するリードフレーム２上に化合物半導体よりなる発
光チップ１を載置した発光素子全体を、樹脂で封止した
構造としている。しかし、図２と異なるところは、カッ
プ３内部に第一の樹脂１１を充填し、その全体を、発光
素子全体を封止する樹脂である第二の樹脂１２で包囲し
ていることである。カップに充填される第一の樹脂１１
には、発光チップの発光波長を他の波長に変換、または
一部吸収して変換する波長変換材料５が含有されてい
る。FIG. 1 is a schematic sectional view showing the structure of an LED according to an embodiment of the present invention. As shown in FIG.
The entire light emitting element in which the light emitting chip 1 made of a compound semiconductor is mounted on the lead frame 2 having the above structure is sealed with resin. However, the difference from FIG. 2 is that the inside of the cup 3 is filled with the first resin 11 and the whole is surrounded by the second resin 12 which is the resin for sealing the entire light emitting element. First resin 11 filled in cup
Contains a wavelength conversion material 5 that converts the emission wavelength of the light emitting chip to another wavelength, or partially absorbs and converts the light.
【００１１】本発明のＬＥＤにおいて、第一の樹脂１１
と第二の樹脂１２の材料は同一材料で、例えば両方とも
エポキシ樹脂で構成し、第一の樹脂１１にのみ蛍光物質
５を含有させればよい。さらに、第二の樹脂１２の材料
は図２の樹脂４と同一でもよいことはいうまでもない。
また、波長変換材料５は蛍光物質であれば蛍光染料、蛍
光顔料、蛍光体等、発光チップの発光波長を他の波長に
変換できる材料であればどのようなものを使用してもよ
く、またフィルター物質であれば発光チップの発光の不
要な波長を吸収し、色純度をよくする材料が選択され、
通常発光チップの発光色と同一色を有する無機、有機の
フィルター顔料が使用される。In the LED of the present invention, the first resin 11
The material of the second resin 12 and the second resin 12 may be the same material, for example, both may be made of epoxy resin, and only the first resin 11 may contain the fluorescent substance 5. Further, it goes without saying that the material of the second resin 12 may be the same as the resin 4 of FIG.
Further, the wavelength conversion material 5 may be any material as long as it can convert the emission wavelength of the light emitting chip to another wavelength, such as a fluorescent dye, a fluorescent pigment, or a fluorescent substance, as long as it is a fluorescent substance. If it is a filter substance, a material that absorbs unnecessary wavelength of light emission of the light emitting chip and improves color purity is selected,
Usually, an inorganic or organic filter pigment having the same color as the light emission color of the light emitting chip is used.
【００１２】このような構造のＬＥＤを製造するには、
例えばＬＥＤ製造工程において、通常カップ３の空気を
追い出す目的で、予め発光チップ１を載置したカップ内
部を樹脂でプレディップするのであるが、プレディップ
する際に第一の樹脂１１に波長変換材料５を含有させて
おき、波長変換材料５を含む第一の樹脂１１が硬化した
後、第二の樹脂１２で封止することにより得ることがで
きる。また予め波長変換材料５を含む第一の樹脂１１を
カップ３内部に注入してもよい。このようにして、波長
変換材料５を含む第一の樹脂１１をカップ３の内部に充
填し、第一の樹脂１１で波長変換された光のほとんどが
カップ３の反射鏡内に戻り、発光観測面に反射すること
によりＬＥＤの集光が格段に向上する。To manufacture an LED having such a structure,
For example, in the LED manufacturing process, the inside of the cup on which the light emitting chip 1 is mounted is pre-dipped with a resin in order to expel air from the cup 3 normally. 5, the first resin 11 containing the wavelength conversion material 5 is cured, and then sealed with the second resin 12. Alternatively, the first resin 11 containing the wavelength conversion material 5 may be injected into the cup 3 in advance. In this way, the first resin 11 containing the wavelength conversion material 5 is filled into the inside of the cup 3, and most of the light whose wavelength has been converted by the first resin 11 returns to the inside of the reflecting mirror of the cup 3, and the light emission observation is performed. The reflection on the surface significantly improves the light collection of the LED.
【００１３】また第一の樹脂１１と、第二の樹脂１２と
を異なる材料とし、第一の樹脂１１、第二の樹脂１２の
屈折率を順に小さくして空気の屈折率１に近くなるよう
に設定することにより波長変換された光の外部量子効率
が向上する。なおこの場合、第一の樹脂１１の材料に
は、発光チップ１の屈折率よりも小さい材料を選定する
ことは言うまでもない。The first resin 11 and the second resin 12 are made of different materials, and the refractive indices of the first resin 11 and the second resin 12 are reduced in order so that the refractive index of the first resin 11 and the second resin 12 become close to the refractive index 1 of air. By setting to, the external quantum efficiency of the wavelength-converted light is improved. In this case, it goes without saying that a material smaller than the refractive index of the light emitting chip 1 is selected as the material of the first resin 11.
【００１４】図３、および図４は本発明の他の実施例に
係るＬＥＤのカップ３の部分を拡大して示す模式断面図
であり、図３は第一の樹脂１１の表面が凸状になって硬
化してカップ３に充填された状態、図４は逆に凹状とな
って硬化して充填された状態を示している。いずれの状
態においても、波長変換材料５を蛍光物質とした場合、
その蛍光物質を含む第一の樹脂１１がカップ３の縁部の
水平面よりも低くなるように充填されており、カップ３
からはみ出していないので、カップ３の縁部により蛍光
物質を励起する外部光を遮断でき、ＬＥＤの混色を防止
することができる。FIGS. 3 and 4 are enlarged cross-sectional views schematically showing a portion of the cup 3 of the LED according to another embodiment of the present invention. FIG. FIG. 4 shows a state in which the resin is cured and filled into the cup 3, and FIG. In any state, when the wavelength conversion material 5 is a fluorescent substance,
The first resin 11 containing the fluorescent substance is filled so as to be lower than the horizontal surface at the edge of the cup 3.
Since the light does not protrude, external light that excites the fluorescent substance can be blocked by the edge of the cup 3, and color mixing of the LEDs can be prevented.
【００１５】[0015]
【発明の効果】本発明のディスプレイのＬＥＤは、カッ
プ内部に波長変換材料をプレディップして発光チップを
被覆しているため、変換光がカップ内部で反射して集光
されるため、輝度は倍以上に向上する。また、波長変換
材料をカップ内に充填して波長変換を行う場合、カップ
深さを深くして、波長変換材料がカップからはみ出さな
いようにすることにより、ＬＥＤ間の混色が発生せず、
ＬＥＤで平面ディスプレイを実現した際には、非常に解
像度のよい画像を得ることができる。According to the LED of the display of the present invention, since the wavelength conversion material is pre-dip inside the cup to cover the light emitting chip, the converted light is reflected and condensed inside the cup. More than doubled. In addition, when wavelength conversion material is filled in a cup to perform wavelength conversion, by increasing the cup depth so that the wavelength conversion material does not protrude from the cup, color mixing between LEDs does not occur ,
When a flat panel display is realized by the LED, an image with a very high resolution can be obtained.
【図１】本発明の実施例のＬＥＤの構造を示す模式断面
図FIG. 1 is a schematic sectional view showing the structure of an LED according to an embodiment of the present invention.
【図２】従来のＬＥＤの構造を示す模式断面図FIG. 2 is a schematic sectional view showing the structure of a conventional LED.
【図３】本発明の他の実施例に係るＬＥＤのカップの部
分を拡大して示す模式断面図FIG. 3 is an enlarged schematic cross-sectional view illustrating a cup portion of an LED according to another embodiment of the present invention.
【図４】本発明の他の実施例に係るＬＥＤのカップの部
分を拡大して示す模式断面図FIG. 4 is an enlarged schematic cross-sectional view showing a cup portion of an LED according to another embodiment of the present invention.
１・・・発光チップ ２・・・リードフレーム ４・・・樹脂 ３・・・カップ ５・・・波長変換材料 ６・・・ワイヤー １１・・・第一の樹脂 １２・・・第二の樹脂 DESCRIPTION OF SYMBOLS 1 ... Light emitting chip 2 ... Lead frame 4 ... Resin 3 ... Cup 5 ... Wavelength conversion material 6 ... Wire 11 ... First resin 12 ... Second resin
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平４−10673（ＪＰ，Ａ) 特開 平５−152609（ＪＰ，Ａ) 特開 昭62−22491（ＪＰ，Ａ) 実開 昭49−74174（ＪＰ，Ｕ) 実開 平５−63068（ＪＰ，Ｕ) 実公 昭52−45181（ＪＰ，Ｙ１) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 33/00 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-4-10673 (JP, A) JP-A-5-152609 (JP, A) JP-A-62-222491 (JP, A) 74174 (JP, U) Japanese Utility Model Hei 5-63068 (JP, U) Japanese Utility Model Publication No. 52-45181 (JP, Y1) (58) Fields investigated (Int. Cl. 7 , DB name)
Claims (2)
素子全体を封止樹脂で封止してなる発光ダイオードを用
いた平面ディスプレイにおいて、 発光ダイオードの封止樹脂が、カップ内部に充填された
第一の樹脂部と、第一の樹脂部を包囲する第二の樹脂部
とを備え、 第一の樹脂部が、前記発光チップからの可視光をそれよ
りも長波長の可視光に変換する蛍光物質を含み、かつ、
第一の樹脂部をカップの縁部の水平面よりも低く配置し
ている第１の発光ダイオードと、前記蛍光物質を励起可
能な可視光を発光する発光チップを有する第２の発光ダ
イオードとを、同一平面上に接近して配置してなること
を特徴とする発光ダイオードを用いたディスプレイ。In a flat display using a light emitting diode in which a light emitting chip provided in a cup is entirely sealed with a sealing resin, the sealing resin of the light emitting diode is filled in the cup. A first resin portion, and a second resin portion surrounding the first resin portion, wherein the first resin portion converts visible light from the light emitting chip into visible light having a longer wavelength. Contains a fluorescent substance, and
A first light emitting diode that is low rather placed the horizontal plane of the rim of the cup a first resin portion, and a second light emitting diode having a light emitting chip that emits excitable visible light the fluorescent substance A display using a light emitting diode, wherein the display is arranged close to the same plane.
素子全体を封止樹脂で封止してなる発光ダイオードを用
いたディスプレイにおいて、 発光ダイオードの封止樹脂が、カップ内部に充填された
第一の樹脂部と、第一の樹脂部を包囲する第二の樹脂部
とを備え、 第一の樹脂部が、前記発光チップからの青色光をそれよ
りも長波長の可視光に変換する蛍光物質を含み、かつ、
この第一の樹脂部をカップの縁部の水平面よりも低く配
置している第１の発光ダイオードと、青色光を発光する
発光チップを有する第２の発光ダイオードとを、同一平
面上に接近して配置してなることを特徴とする発光ダイ
オードを用いたディスプレイ。2. A display using a light-emitting diode in which a light-emitting element having a light-emitting chip provided in a cup is sealed with a sealing resin, wherein the sealing resin for the light-emitting diode is filled inside the cup. A first resin portion and a second resin portion surrounding the first resin portion, wherein the first resin portion converts blue light from the light emitting chip into visible light having a longer wavelength than the blue light. Contains substances, and
A first light emitting diode that is low rather placed the horizontal plane of the edge of the first resin portion cup, a second light emitting diode having a light emitting chip that emits blue light, close to the same plane A display using a light-emitting diode, wherein the display is arranged in a manner arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000215236A JP3344414B2 (en) | 1993-09-28 | 2000-07-14 | Display using light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000215236A JP3344414B2 (en) | 1993-09-28 | 2000-07-14 | Display using light emitting diode |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14315897A Division JP3327170B2 (en) | 1997-05-17 | 1997-05-17 | Light emitting diode manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001044514A JP2001044514A (en) | 2001-02-16 |
| JP3344414B2 true JP3344414B2 (en) | 2002-11-11 |
Family
ID=18710684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000215236A Expired - Lifetime JP3344414B2 (en) | 1993-09-28 | 2000-07-14 | Display using light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3344414B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007273562A (en) | 2006-03-30 | 2007-10-18 | Toshiba Corp | Semiconductor light-emitting device |
-
2000
- 2000-07-14 JP JP2000215236A patent/JP3344414B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001044514A (en) | 2001-02-16 |
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