JP3309079B2 - Film forming apparatus and film forming method - Google Patents
Film forming apparatus and film forming methodInfo
- Publication number
- JP3309079B2 JP3309079B2 JP02454699A JP2454699A JP3309079B2 JP 3309079 B2 JP3309079 B2 JP 3309079B2 JP 02454699 A JP02454699 A JP 02454699A JP 2454699 A JP2454699 A JP 2454699A JP 3309079 B2 JP3309079 B2 JP 3309079B2
- Authority
- JP
- Japan
- Prior art keywords
- coating
- workpiece
- film
- coating liquid
- dried
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明はガラス板や半導体ウ
ェハー等の表面に各種被膜を形成する方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming various coatings on the surface of a glass plate, a semiconductor wafer or the like.
【０００２】[0002]
【従来の技術】液晶基板として用いるガラス板にはガラ
ス中のナトリウムが液晶に悪影響を及ぼすのを防止した
り、ガラス板の屈折率を調整するため、ガラス板表面に
所定の性質を有する被膜を形成している。斯かる被膜を
形成するには、被処理物の表面に被膜形成用の塗布液を
滴下し、これをスピンナーによって均一に拡げ、次いで
加熱することで被膜とするようにしている。2. Description of the Related Art A glass plate used as a liquid crystal substrate is provided with a coating having predetermined properties on the surface of the glass plate in order to prevent sodium in the glass from adversely affecting the liquid crystal and to adjust the refractive index of the glass plate. Has formed. In order to form such a film, a coating solution for forming a film is dropped on the surface of the object to be processed, spread uniformly by a spinner, and then heated to form a film.
【０００３】上述した従来の装置において、スピンナー
によって被膜形成用の液体を被処理物表面に塗布する場
合、被処理物の外端部まで拡がった塗布液の一部が被処
理物の裏面まで廻り込んでそのまま固まってしまう。In the above-mentioned conventional apparatus, when a liquid for forming a film is applied to the surface of a workpiece by a spinner, a part of the coating liquid that has spread to the outer end of the workpiece flows to the back surface of the workpiece. And it hardens as it is.
【０００４】斯かる不利を解消するため、従来にあって
はスピンナー装置と同一箇所において、被処理物の裏面
に洗浄液を吹き付け、裏面まで廻り込んだ塗布液を除去
するようにしている。In order to solve such disadvantages, conventionally, a cleaning liquid is sprayed on the back surface of the object to be processed at the same place as the spinner device to remove the coating liquid which has reached the back surface.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、被処理
物の裏面を洗浄液によって裏面に廻り込んだ塗布液を除
去しても、またすぐに表面側から塗布液が廻り込んでし
まう。逆に、表面側の塗布液を完全に乾燥させ塗布液が
廻り込まないようにしてから洗浄すると、洗浄に極めて
長時間を要することになる。また、被処理物の表面に塗
布した塗布液を全く乾燥させない状態で搬送すると、表
面に塗布した塗布液が搬送の振動で波打ったり、塗布液
が落下することになる。However, even if the coating liquid that has flowed into the rear surface of the object to be processed is removed by the cleaning liquid, the coating liquid immediately flows from the front surface side. Conversely, if the coating solution on the front side is completely dried to prevent the coating solution from flowing in, and then washed, an extremely long time is required for washing. In addition, if the coating liquid applied to the surface of the workpiece is transported without being dried at all, the coating liquid applied to the surface will be wavy by the transport vibration or the coating liquid will drop.
【０００６】[0006]
【０００７】[0007]
【課題を解決するための手段】 また、請求項１に係る被
膜形成装置は、ガラス基板や半導体ウェハー等の被処理
物表面に被膜を形成する装置において、この装置は被処
理物の搬送ラインに沿って、上流側から下流側に向かっ
て、被膜となる液体を被処理物表面に均一に拡げる塗布
装置、被処理物表面に塗布した塗布液をある程度乾燥さ
せる減圧乾燥装置、被処理物の表面から廻り込んで付着
し、ある程度乾燥せしめられた余分な塗布液を除去する
洗浄装置及び加熱装置を順次配置した。 According to a first aspect of the present invention, there is provided a film forming apparatus for forming a film on a surface of an object to be processed such as a glass substrate or a semiconductor wafer. Along the way from the upstream side to the downstream side, a coating device that spreads the liquid to be a film uniformly on the surface of the workpiece, a vacuum drying device that dries the coating liquid applied to the surface of the workpiece to some extent, and the surface of the workpiece. A cleaning device and a heating device for removing an excess coating solution that has been wrapped around and adhered and dried to some extent were sequentially arranged.
【０００８】[0008]
【０００９】また、請求項２に係る被膜形成装置は、ガ
ラス板や半導体ウェハー等の被処理物の搬送ラインに沿
って、上流側から下流側に向かって、塗布装置、減圧乾
燥装置、洗浄装置及び加熱装置を配置した被膜形成ライ
ンによる被膜形成方法であって、この被膜形成方法は、
塗布装置にて表面に塗布液が塗布された被処理物を減圧
乾燥装置に送り込み、この減圧乾燥装置において、被処
理物表面に塗布された塗布液をある程度乾燥せしめ、次
いでこのある程度塗布液が乾燥せしめられた被処理物を
洗浄装置に送り込み、被処理物の表面から廻り込んで付
着し、ある程度乾燥せしめられた余分な塗布液を除去
し、次いで被処理物を加熱装置まで搬送して塗布液を被
膜に形成するようにした。According to a second aspect of the present invention, there is provided a coating apparatus, a coating apparatus, a reduced-pressure drying apparatus, and a cleaning apparatus, which are arranged from the upstream side to the downstream side along a transfer line of a workpiece such as a glass plate or a semiconductor wafer. And a film forming method by a film forming line in which a heating device is disposed,
The object to be treated, whose surface is coated with the coating liquid by the coating device, is sent to a reduced-pressure drying device, where the coating liquid applied to the surface of the object to be dried is dried to a certain extent, and then the coating liquid is dried to a certain extent. The treated object is sent to the cleaning device, and wrapped around from the surface of the object to be removed, and the excess coating liquid that has been dried to some extent is removed. Was formed on the film.
【００１０】[0010]
【発明の実施の形態】以下に本発明の実施の形態を添付
図面に基づいて説明する。ここで、図１は本発明方法の
実施に用いる被膜形成装置の平面図、図２は図１のＡ−
Ａ線断面図である。Embodiments of the present invention will be described below with reference to the accompanying drawings. Here, FIG. 1 is a plan view of a film forming apparatus used for carrying out the method of the present invention, and FIG.
FIG. 3 is a sectional view taken along line A.
【００１１】被膜形成装置はガラス板や半導体ウェハー
等の被処理物Ｗの搬送ラインの一部を構成し、被処理物
Ｗの投入部１の下流側に塗布用スピンナー２を配置し、
この塗布用スピンナー２の下流側に減圧乾燥装置３を配
置し、この減圧乾燥装置３の下流側に被処理物Ｗの裏面
洗浄用スピンナー４を配置し、更に裏面洗浄用スピンナ
ー４の下流側にホットプレート５を配置し、投入部１か
らホットプレート５に至るまでは搬送装置６によって被
処理物Ｗを搬送し、ホットプレート５の部分においては
搬送装置７によって被処理物Ｗを搬送するようにしてい
る。The film forming apparatus constitutes a part of a transfer line for a workpiece W such as a glass plate or a semiconductor wafer, and a coating spinner 2 is arranged downstream of the loading section 1 of the workpiece W.
A vacuum drying device 3 is arranged downstream of the coating spinner 2, a spinner 4 for cleaning the back surface of the workpiece W is arranged downstream of the vacuum drying device 3, and further downstream of the spinner 4 for cleaning the back surface. The hot plate 5 is arranged, and the workpiece W is transported by the transport device 6 from the charging section 1 to the hot plate 5, and the workpiece W is transported by the transport device 7 in the portion of the hot plate 5. ing.
【００１２】また、前記塗布用スピンナー２はカップ状
をなすケーシング２０の中央に筒部２１を設け、この筒
部２１に下方からモータによって回転せしめられるチャ
ック２２を挿入し、このチャック２２の上方にはチャッ
ク２２に吸着保持された被処理物Ｗの表面に被膜形成用
の液体を滴下するノズル２３を臨ませている。The coating spinner 2 is provided with a cylindrical portion 21 in the center of a cup-shaped casing 20, and a chuck 22 rotated by a motor from below is inserted into the cylindrical portion 21. The nozzle 23 faces a nozzle 23 for dropping a liquid for forming a film on the surface of the workpiece W sucked and held by the chuck 22.
【００１３】また、前記洗浄用スピンナー４はケーシン
グ４０の中央にチャック４２を挿入する筒部４１を設け
るとともに、この筒部４１の上部に洗浄液噴出ノズル４
３を対向して一対設けている。The cleaning spinner 4 has a cylindrical portion 41 in which a chuck 42 is inserted at the center of a casing 40, and a cleaning liquid jet nozzle 4 is provided above the cylindrical portion 41.
3 are provided in opposition to each other.
【００１４】一方、ホットプレート５は搬送方向に沿っ
て３台配置され、各ホットプレート５は搬送方向と直交
する方向に３分割され、各分割体５０…間に隙間５１を
形成し、この隙間５１に薄板状バー５２を臨ませ、この
薄板状バー５２をガイドロッド５３に沿って移動するシ
リンダユニット５４に取り付けている。On the other hand, three hot plates 5 are arranged along the transport direction, and each hot plate 5 is divided into three in a direction orthogonal to the transport direction, and a gap 51 is formed between the divided bodies 50. The thin bar 52 faces the 51, and the thin bar 52 is attached to a cylinder unit 54 that moves along a guide rod 53.
【００１５】而してシリンダユニット５４に伸長動をな
さしめることで薄板状バー５２の上端がホットプレート
５の隙間５１から突出してホットプレート５上の被処理
物Ｗを持ち上げ、この状態でガイドロッド５３に沿って
シリンダユニット５４とともに薄板状バー５２を下流側
へ移動し、次いでシリンダユニット５４を圧縮し薄板状
バー５２の上端をホットプレート５上面より下げること
で、被処理物Ｗを下流側のホットプレート５に移し換え
る。このようなクランク動を繰り返すことで順次下流側
のホットプレートに移し換える。When the cylinder unit 54 is extended, the upper end of the thin plate bar 52 protrudes from the gap 51 of the hot plate 5 and lifts the workpiece W on the hot plate 5. The thin plate bar 52 is moved to the downstream side together with the cylinder unit 54 along 53, and then the cylinder unit 54 is compressed to lower the upper end of the thin plate bar 52 from the upper surface of the hot plate 5 so that the workpiece W is moved to the downstream side. Transfer to hot plate 5. By repeating such a crank movement, the hot plate is sequentially transferred to the downstream hot plate.
【００１６】更に前記搬送装置６は被膜形成装置の一側
に沿ってレール６０を設けこのレール６０に夫々独立し
て動作し得る移動体６１…を係合し、この移動体６１か
ら被膜形成装置の上方に昇降自在な水平バー６２を延出
し、この水平バー６２に支持爪６３を取り付けている。Further, the transporting device 6 has rails 60 along one side of the film forming apparatus, and engages moving members 61 operable independently of each other with the rails 60. A horizontal bar 62 that can move up and down is extended above the horizontal bar 62, and a supporting claw 63 is attached to the horizontal bar 62.
【００１７】以上において被処理物Ｗの表面に被膜を形
成する方法を以下に述べる。先ず投入部１まで搬送され
てきた被処理物Ｗを搬送装置６を用いて塗布用スピンナ
ー２のチャック２２上に移載する。この場合、被処理物
はその前後端下面を一対の水平バー６２，６２の支持爪
６３にて係止された状態で移される。A method for forming a film on the surface of the workpiece W will be described below. First, the workpiece W transported to the loading section 1 is transferred onto the chuck 22 of the coating spinner 2 using the transport device 6. In this case, the object to be processed is moved with its front and rear end lower surfaces locked by the support claws 63 of the pair of horizontal bars 62, 62.
【００１８】この後ノズル２３からチャック２２上に保
持されている被処理物２表面の中央に被膜形成用の塗布
液を滴下し、チャックを回転せしめることで被処理物Ｗ
表面に塗布液を均一に拡げる。この時、被処理物Ｗの外
端部下面には被膜形成用の液体の一部が廻り込んでいる
がそのまま減圧乾燥装置３に搬送してある程度まで乾燥
せしめる。Thereafter, a coating liquid for forming a film is dropped from the nozzle 23 to the center of the surface of the workpiece 2 held on the chuck 22, and the chuck W is rotated by rotating the chuck.
Spread the coating liquid evenly on the surface. At this time, a part of the liquid for forming a film is wrapped around the lower surface of the outer end portion of the object to be processed W, but is conveyed to the reduced pressure drying device 3 as it is to be dried to some extent.
【００１９】次いで搬送装置６によって被処理物を洗浄
用スピンナー４のチャック４２上に移載し、チャック４
２で吸着した状態で被処理物Ｗを高速回転せしめるとと
もに下面にノズル４３から洗浄液を噴出し、下面に廻り
込んである程度固まった塗布液を洗い落とす。Next, the object to be processed is transferred onto the chuck 42 of the cleaning spinner 4 by the transfer device 6,
The workpiece W is rotated at a high speed in the state of being adsorbed in step 2, and the cleaning liquid is jetted from the nozzle 43 to the lower surface, and the coating liquid that has spilled to the lower surface and hardened to some extent is washed away.
【００２０】この後、被処理物Ｗをホットプレート５上
に送りだし、加熱によって被処理物Ｗ表面に被膜を形成
する。Thereafter, the workpiece W is sent out onto the hot plate 5 and a film is formed on the surface of the workpiece W by heating.
【００２１】[0021]
【発明の効果】以上に説明したように本発明によれば、
被処理物表面に塗布した塗布液をある程度乾燥せしめた
後に、余分な塗布液を除去したり、搬送するようにした
ので、表面に塗布された塗布液が搬送の振動で波打った
り、表面に塗布した塗布液が裏面に過度に廻り込んだ
り、更には裏面に廻り込んだ塗布液が落下することを防
止でき、しかも完全に乾燥させていないので、簡単に溶
媒（洗浄液）に溶解し、裏面洗浄の時間を短縮すること
ができる。According to the present invention as described above,
After the coating liquid applied to the surface of the workpiece is dried to some extent, excess coating liquid is removed or transported, so that the coating liquid applied to the surface is wavy by the vibration of the transport, This prevents the applied coating solution from spilling excessively onto the back surface, and further prevents the coating solution from spilling onto the back surface from falling. Furthermore, since the coating solution is not completely dried, it can be easily dissolved in a solvent (washing solution). Cleaning time can be reduced.
【図１】本発明方法の実施に用いる被膜形成装置の平面
図FIG. 1 is a plan view of a film forming apparatus used for carrying out a method of the present invention.
【図２】図１のＡ−Ａ線断面図FIG. 2 is a sectional view taken along line AA of FIG. 1;
２…塗布装置（塗布用スピンナー）、３…減圧乾燥装
置、４…洗浄装置（洗浄用スピンナー）、５…ホットプ
レート、６，７…搬送装置、２２，４２…チャック、Ｗ
…被処理物。2 ... Coating device (spinner for coating), 3 ... Decompression drying device, 4 ... Cleaning device (spinner for cleaning), 5 ... Hot plate, 6,7 ... Transfer device, 22, 42 ... Chuck, W
... Object to be processed.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 植原 晃 神奈川県川崎市中原区中丸子150番地 東京応化工業株式会社内 (72)発明者 中山 宗雄 神奈川県川崎市中原区中丸子150番地 東京応化工業株式会社内 (56)参考文献 特開 昭64−22375（ＪＰ，Ａ) 特開 昭62−22431（ＪＰ，Ａ) 特開 昭58−98925（ＪＰ，Ａ) 特開 平１−119024（ＪＰ，Ａ) 特開 昭61−263224（ＪＰ，Ａ) 特公 昭58−19350（ＪＰ，Ｂ１) (58)調査した分野(Int.Cl.7，ＤＢ名) B05C 9/14 B05D 3/00 H01L 21/027 B05C 11/08 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Akira Uehara 150 Nakamurako Nakahara-ku Kawasaki City Kanagawa Prefecture Inside Tokyo Oka Kogyo Co., Ltd. (56) References JP-A-64-22375 (JP, A) JP-A-62-22431 (JP, A) JP-A-58-98925 (JP, A) JP-A-1-119024 (JP, A) JP-A-61-263224 (JP, A) JP-B-58-19350 (JP, B1) (58) Fields investigated (Int. Cl. 7 , DB name) B05C 9/14 B05D 3/00 H01L 21/027 B05C 11/08
Claims (2)
物表面に被膜を形成する装置において、この装置は被処
理物の搬送ラインに沿って、上流側から下流側に向かっ
て、被膜となる液体を被処理物表面に均一に拡げる塗布
装置、被処理物表面に塗布した塗布液をある程度乾燥さ
せる減圧乾燥装置、被処理物の表面から廻り込んで付着
し、ある程度乾燥せしめられた余分な塗布液を除去する
洗浄装置及び加熱装置を順次配置したことを特徴とする
被膜形成装置。1. An apparatus for forming a coating on a surface of an object to be processed such as a glass substrate or a semiconductor wafer, the apparatus comprising a liquid forming a coating from an upstream side to a downstream side along a transfer line of the object to be processed. A coating device that spreads the coating uniformly on the surface of the workpiece, a vacuum drying device that dries the coating liquid applied to the surface of the workpiece to some extent, and an extra coating fluid that wraps around and adheres from the surface of the workpiece and is dried to some extent A film forming apparatus, wherein a cleaning device and a heating device are sequentially arranged.
の搬送ラインに沿って、上流側から下流側に向かって、
塗布装置、減圧乾燥装置、洗浄装置及び加熱装置を配置
した被膜形成ラインによる被膜形成方法であって、この
被膜形成方法は、塗布装置にて表面に塗布液が塗布され
た被処理物を減圧乾燥装置に送り込み、この減圧乾燥装
置において、被処理物表面に塗布された塗布液をある程
度乾燥せしめ、次いでこのある程度塗布液が乾燥せしめ
られた被処理物を洗浄装置に送り込み、被処理物の表面
から廻り込んで付着し、ある程度乾燥せしめられた余分
な塗布液を除去し、次いで被処理物を加熱装置まで搬送
して塗布液を被膜に形成することを特徴とする被膜形成
方法。2. Along a transfer line of an object to be processed such as a glass plate or a semiconductor wafer, from an upstream side to a downstream side,
A method for forming a film by a film forming line in which a coating device, a reduced-pressure drying device, a cleaning device, and a heating device are arranged. In the film forming method, an object to be processed whose surface is coated with a coating liquid by a coating device is dried under reduced pressure. The coating liquid applied to the surface of the workpiece is dried to some extent in the reduced-pressure drying apparatus, and then the workpiece to which the coating liquid has been dried is sent to the cleaning device. A method for forming a coating film, comprising removing an excess coating liquid that has wrapped around and adhered and has been dried to some extent, and then transports the object to be processed to a heating device to form the coating liquid on the coating film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02454699A JP3309079B2 (en) | 1999-02-02 | 1999-02-02 | Film forming apparatus and film forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02454699A JP3309079B2 (en) | 1999-02-02 | 1999-02-02 | Film forming apparatus and film forming method |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP08224925A Division JP3135846B2 (en) | 1996-08-27 | 1996-08-27 | Coating method |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002060275A Division JP3604669B2 (en) | 2002-03-06 | 2002-03-06 | Film forming apparatus and film forming method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11262720A JPH11262720A (en) | 1999-09-28 |
| JP3309079B2 true JP3309079B2 (en) | 2002-07-29 |
Family
ID=12141164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP02454699A Expired - Lifetime JP3309079B2 (en) | 1999-02-02 | 1999-02-02 | Film forming apparatus and film forming method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3309079B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3742000B2 (en) * | 2000-11-30 | 2006-02-01 | 富士通株式会社 | Press machine |
| JP4543617B2 (en) | 2002-04-22 | 2010-09-15 | セイコーエプソン株式会社 | Active matrix substrate manufacturing method, electro-optical device manufacturing method, electronic device manufacturing method, active matrix substrate manufacturing device, electro-optical device manufacturing device, and electric device manufacturing device |
| JP3988676B2 (en) | 2003-05-01 | 2007-10-10 | セイコーエプソン株式会社 | Coating apparatus, thin film forming method, thin film forming apparatus, and semiconductor device manufacturing method |
| JP3948472B2 (en) | 2004-11-09 | 2007-07-25 | セイコーエプソン株式会社 | Manufacturing method of semiconductor device |
-
1999
- 1999-02-02 JP JP02454699A patent/JP3309079B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11262720A (en) | 1999-09-28 |
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