JP3271221B2 - Method of detecting light emission position of light emitter and method of assembling optical parts using the same - Google Patents
Method of detecting light emission position of light emitter and method of assembling optical parts using the sameInfo
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- JP3271221B2 JP3271221B2 JP04524094A JP4524094A JP3271221B2 JP 3271221 B2 JP3271221 B2 JP 3271221B2 JP 04524094 A JP04524094 A JP 04524094A JP 4524094 A JP4524094 A JP 4524094A JP 3271221 B2 JP3271221 B2 JP 3271221B2
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- light
- light emitting
- semiconductor laser
- diffraction grating
- screen
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Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体レーザ等の発光
体における発光位置検出方法とそれを用いた光学部品の
組立て方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for detecting a light emitting position in a light emitting body such as a semiconductor laser and a method for assembling an optical component using the same.
【０００２】[0002]
【従来の技術】半導体レーザ等の発光体は、活性領域に
所定の電流を与えることで劈開面等の発光面からコヒー
レントな光を出射するものである。この半導体レーザを
情報機器等の光源として用いる場合には、チップ状の半
導体レーザを所定の実装用基台上に固定してレンズ系と
の光軸合わせを行い、パッケージ内に収納してモジュー
ル化した光学部品、いわゆる半導体レーザモジュールと
して情報機器内に組み込んでいる。2. Description of the Related Art A light emitting body such as a semiconductor laser emits coherent light from a light emitting surface such as a cleavage surface by applying a predetermined current to an active region. When this semiconductor laser is used as a light source for information equipment, a chip-shaped semiconductor laser is fixed on a predetermined mounting base, the optical axis is aligned with the lens system, and stored in a package to make a module. Optical components, so-called semiconductor laser modules, are incorporated in information equipment.
【０００３】このような光学部品を組立てるには、半導
体レーザの発光位置を正確に測定してその発光方向と実
装用基台の基準とを正確に位置合わせする必要がある。
図３は、従来の半導体レーザの発光位置測定方法を説明
する概略斜視図である。すなわち、この半導体レーザ１
の発光位置を測定するには、先ず、ＸＹＺ軸方向に基づ
く基準位置に合わせて半導体レーザ１を配置した状態で
劈開面である発光面１０上の２点Ａ、Ｂの位置をレーザ
測長機９を用いて測長する。In order to assemble such an optical component, it is necessary to accurately measure the light emitting position of the semiconductor laser and accurately align the light emitting direction with the reference of the mounting base.
FIG. 3 is a schematic perspective view illustrating a conventional method for measuring the light emission position of a semiconductor laser. That is, the semiconductor laser 1
In order to measure the light emission position, first, the position of the two points A and B on the light emission surface 10 which is the cleavage plane is measured with a laser length measuring machine in a state where the semiconductor laser 1 is arranged in accordance with the reference position based on the XYZ axis directions. 9 is used to measure the length.
【０００４】レーザ測長機９は予めＸ軸方向と平行に移
動するよう配置されており、この２点Ａ、Ｂの測長値か
ら発光面１０のＸ軸方向に対する傾きα’を算出する。
さらに、半導体レーザ１の上方に配置したＣＣＤカメラ
等の受光装置４を用いてレーザ光Ｑの映像を取り込み、
これを画像処理することでＸ軸方向に対するレーザ光Ｑ
の発光点１０ａの位置を算出する。The laser length measuring machine 9 is previously arranged so as to move in parallel with the X-axis direction, and calculates the inclination α ′ of the light emitting surface 10 with respect to the X-axis direction from the measured values of these two points A and B.
Further, an image of the laser light Q is captured by using a light receiving device 4 such as a CCD camera arranged above the semiconductor laser 1,
By image processing this, the laser light Q in the X-axis direction
Of the light emitting point 10a is calculated.
【０００５】光学部品を組立てるには、これらの算出結
果すなわち基準位置に対する発光面１０の傾きα’とＸ
軸方向に対する発光点１０ａの位置とに基づいて半導体
レーザ１を図示しない実装用基板上に固定する。この
際、レーザ光Ｑが半導体レーザ１の発光面１０に対して
直角な方向に出射することを前提としており、先に求め
た発光面１０の傾きα’および発光点１０ａの位置を考
慮して実装用基板上に位置合わせしている。In order to assemble an optical component, the results of these calculations, that is, the inclination α ′ of the light emitting surface 10 with respect to the reference position and X ′
The semiconductor laser 1 is fixed on a mounting board (not shown) based on the position of the light emitting point 10a in the axial direction. At this time, it is assumed that the laser light Q is emitted in a direction perpendicular to the light emitting surface 10 of the semiconductor laser 1, and the inclination α ′ of the light emitting surface 10 and the position of the light emitting point 10a are determined in advance. It is aligned on the mounting board.
【０００６】また、さらに精度の高い実装を行うために
は、レーザ光ＱのＺ軸方向に対する傾きβ’および発光
点１０ａの位置を求め、これを考慮した半導体レーザ１
の位置合わせする。この傾きβ’およびＺ軸方向に対す
る発光点１０ａの位置を求めるには、受光装置４を半導
体レーザ１の側方に配置し、ここから取り込んだレーザ
光Ｑの画像を処理することで算出している。Further, in order to perform mounting with higher accuracy, the inclination β ′ of the laser beam Q with respect to the Z-axis direction and the position of the light emitting point 10a are obtained, and the semiconductor laser 1 taking this into consideration is used.
Position. In order to determine the inclination β ′ and the position of the light emitting point 10a with respect to the Z-axis direction, the light receiving device 4 is arranged on the side of the semiconductor laser 1, and the image of the laser light Q captured therefrom is processed and calculated. I have.
【０００７】[0007]
【発明が解決しようとする課題】しかしながら、このよ
うな発光体の発光位置検出方法およびこれを用いた光学
部品の組立て方法には次のような問題がある。すなわ
ち、発光体の発光位置を検出するにあたり、先ずレーザ
測長機を用いて発光面の２点の位置を測長しているた
め、例えばその２点のうちいずれかに欠けや割れが発生
していたりゴミが付着していたりした場合には正確な測
長値が得られず、発光面の傾きを正確に算出するのが困
難となる。しかも、発光部品の組立てを行う場合にはこ
の発光面の傾きを基準として位置合わせしているため、
この測定が不正確になるとレンズ系との光の結合効率が
低下するという不都合が発生する。However, such a method for detecting a light emitting position of a light emitting body and a method for assembling an optical component using the same have the following problems. That is, when detecting the light emitting position of the light emitting body, first, the position of two points on the light emitting surface is measured using a laser length measuring device, so that, for example, chipping or cracking occurs at one of the two points. In the case where the light-emitting surface is moved or dust is attached, an accurate length measurement value cannot be obtained, and it is difficult to accurately calculate the inclination of the light emitting surface. In addition, when assembling the light emitting parts, the alignment is performed based on the inclination of the light emitting surface.
If this measurement becomes inaccurate, there occurs a disadvantage that the coupling efficiency of light with the lens system is reduced.
【０００８】また、精度の高い測定を行うためにはレー
ザ測長機を正確に移動させる機構が必要となったり何台
もの受光装置を配置しなければならず、装置構成の複雑
化や検出時間の遅延を招くことになる。In addition, in order to perform highly accurate measurement, a mechanism for accurately moving the laser length measuring device is required or a number of light receiving devices must be arranged, which complicates the device configuration and the detection time. Will be delayed.
【０００９】[0009]
【課題を解決するための手段】本発明はこのような課題
を解決するために成された発光体の発光位置検出方法と
それを用いた光学部品の組立て方法である。すなわち、
本発明の発光体の発光位置検出方法は、先ず、半導体レ
ーザ等から成る発光体を基準位置に配置した状態でコヒ
ーレントな光を出射し、その光を同心円状で一定間隔に
形成された円形回折格子を通過させ、次いで、円形回折
格子を通過した光をスクリーンに当てて、所定の間隔か
ら成る複数の輪状の回折光をスクリーンに映し出し、そ
の後、この回折光の間隔に基づいて基準位置に対する光
の発光方向を算出するとともに回折光の中心位置に基づ
いて基準位置に対する発光点位置を算出する方法であ
る。SUMMARY OF THE INVENTION The present invention is directed to a method for detecting a light emitting position of a luminous body and a method for assembling an optical component using the same, which have been made to solve such problems. That is,
The method for detecting the light emitting position of a light emitting body according to the present invention is as follows. First, a coherent light is emitted in a state in which a light emitting body made of a semiconductor laser or the like is arranged at a reference position, and the light is concentrically formed into a circular diffraction pattern. After passing through the grating, the light passing through the circular diffraction grating is applied to the screen to project a plurality of annular diffracted lights having a predetermined interval on the screen, and then the light relative to the reference position is determined based on the interval between the diffracted lights. And calculating the light emitting point position with respect to the reference position based on the center position of the diffracted light.
【００１０】また、本発明の光学部品の組立て方法は、
先の発光体の発光位置検出方法を用いたものであり、先
ず、測定用ステージ上に半導体レーザ等から成る発光体
を配置した状態で基準位置に対する光の発光方向および
発光点位置を算出した後、その発光体を測定用ステージ
から実装用基台へ移載し、算出した発光方向および発光
点位置に基づいて発光体を実装用基台の基準に合わせて
固定する組立て方法である。[0010] The method for assembling an optical component according to the present invention comprises:
First, the light emitting direction and the light emitting point position with respect to the reference position are calculated in a state where the light emitting body made of a semiconductor laser or the like is arranged on the measuring stage. And an assembly method in which the luminous body is transferred from the measurement stage to the mounting base, and the luminous body is fixed in accordance with the reference of the mounting base based on the calculated light emitting direction and light emitting point position.
【００１１】[0011]
【作用】本発明の発光体の発光位置検出方法では、発光
体からコヒーレントな光を出射して同心円状で一定間隔
に形成された円形回折格子を通過させスクリーンに所定
の間隔から成る複数の輪状の回折光を映し出している。
このスクリーンに映し出される回折光の間隔は、光の波
長や円形回折格子のピッチ、円形回折格子やスクリーン
の位置などが固定の場合において、発光体から出射され
る光の円形回折格子に対する角度に応じて変化する。ま
た、回折光の中心位置は、基準位置に対する発光点の相
対的な位置を示している。そこで、この回折光の間隔や
中心位置を測定することでこれらに応じた光の発光方向
および発光点位置を算出できるようになる。In the method for detecting the light emitting position of a light emitting body according to the present invention, a plurality of ring-shaped light emitting elements having a predetermined spacing are formed on a screen by emitting coherent light from the light emitting body and passing the light through a concentric circular diffraction grating formed at a constant spacing. Is reflected.
The interval of the diffracted light projected on this screen depends on the angle of the light emitted from the light emitter with respect to the circular diffraction grating when the wavelength of the light, the pitch of the circular diffraction grating, and the position of the circular diffraction grating and the screen are fixed. Change. Further, the center position of the diffracted light indicates the relative position of the light emitting point with respect to the reference position. Therefore, by measuring the interval and the center position of the diffracted light, it becomes possible to calculate the light emitting direction and the light emitting point position according to these.
【００１２】また、本発明の光学部品の組立て方法で
は、先の発光位置検出方法を用いて光の発光方向および
発光点位置を算出した後、これらの基づいて発光体を実
装用基台上へ移載し固定しているため、発光体から出射
する直接光の発光方向や発光点位置を基準とした実装を
行うことができるようになる。In the method for assembling an optical component according to the present invention, the light emitting direction and the light emitting point position of the light are calculated by using the above light emitting position detecting method, and then the light emitting body is placed on the mounting base based on these. Since it is transferred and fixed, it is possible to perform mounting based on the light emitting direction and the light emitting point position of the direct light emitted from the light emitting body.
【００１３】[0013]
【実施例】以下に、本発明の発光体の発光位置検出方法
とそれを用いた光学部品の組立て方法の実施例を図に基
づいて説明する。先ず、図１の概略斜視図に基づいて本
発明の発光体の発光位置検出方法を説明する。なお、本
実施例においては説明を分かりやすくするため発光体の
例として半導体レーザ１を用いた場合を用いる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method for detecting a light emitting position of a luminous body of the present invention and a method for assembling an optical component using the same will be described below with reference to the drawings. First, a method for detecting a light emitting position of a light emitting body according to the present invention will be described with reference to the schematic perspective view of FIG. Note that, in this embodiment, a case where the semiconductor laser 1 is used as an example of a light emitting body is used for easy understanding.
【００１４】半導体レーザ１の発光位置を検出するに
は、予めＸＹＺ軸方向に基づいた基準位置に対して円形
回折格子２とスクリーン３との位置および間隔を一定に
して配置しておく。すなわち、Ｘ軸方向と平行に円形回
折格子２とスクリーン３とを配置し、しかもその間隔を
ｍとしておく。ここで用いる円形回折格子２は、例えば
ホトリソグラフィー加工を用いてガラス基板などの透明
体上に数十μｍ以下の一定のピッチＰで複数の同心円状
の格子を形成したものである。In order to detect the light emitting position of the semiconductor laser 1, a position and an interval between the circular diffraction grating 2 and the screen 3 are previously set to be constant with respect to a reference position based on the XYZ axis directions. That is, the circular diffraction grating 2 and the screen 3 are arranged in parallel with the X-axis direction, and the distance between them is set to m. The circular diffraction grating 2 used here is formed by forming a plurality of concentric gratings at a constant pitch P of several tens μm or less on a transparent body such as a glass substrate using, for example, photolithography.
【００１５】発光位置の検出を行うには、先ず、半導体
レーザ１を基準位置に配置して円形回折格子２と劈開面
などの発光面１０とが対向するように、かつその間隔が
Ｌとなるようにする。次に、この状態で半導体レーザ１
の図示しない電極にプローブ針１１を当てて所定の電流
を半導体レーザ１の活性領域（図示せず）に与え、レー
ザ発振を発生させる。これにより、発光面１０からコヒ
ーレントな光、すなわちレーザ光Ｑが出射する。なお、
このレーザ光Ｑの発光方向は、Ｘ軸方向に対してα、Ｚ
軸方向に対してβの傾きを備えているものとする。In order to detect the light emitting position, first, the semiconductor laser 1 is arranged at the reference position, and the circular diffraction grating 2 and the light emitting surface 10 such as a cleavage plane are opposed to each other, and the interval between them is L. To do. Next, in this state, the semiconductor laser 1
A probe needle 11 is applied to an electrode (not shown) to apply a predetermined current to an active region (not shown) of the semiconductor laser 1 to generate laser oscillation. Thereby, coherent light, that is, laser light Q is emitted from the light emitting surface 10. In addition,
The emission direction of the laser light Q is α, Z with respect to the X-axis direction.
It is assumed that the inclination is β with respect to the axial direction.
【００１６】このようなレーザ光Ｑが円形回折格子２を
通過する場合、光の回折現象によってレーザ光Ｑが回折
し、スクリーン３に所定間隔で複数の輪状の回折光３１
が映し出される。また、レーザ光Ｑは発光点１０ａから
ある角度を持って広がるため、波長λ0のレーザ光Ｑが
円形回折格子２に入った場合、ある位置とそこより１ピ
ッチＰ分だけ離れた位置に入った光では位相差λ’が生
じる。この位相差λ’は半導体レーザ１の発光面１０と
円形回折格子２との距離Ｌにより変化し（数１参照）、
また見かけ上の波長λは半導体レーザの波長λ0 より位
相差λ’だけ小さくなる（数２参照）。When such a laser beam Q passes through the circular diffraction grating 2, the laser beam Q is diffracted by a light diffraction phenomenon, and a plurality of annular diffracted beams 31 are provided on the screen 3 at predetermined intervals.
Is projected. Further, since the laser light Q spreads at a certain angle from the light emitting point 10a, when the laser light Q of the wavelength λ 0 enters the circular diffraction grating 2, it enters a certain position and a position separated by one pitch P therefrom. Phase difference λ ′ is generated in the reflected light. The phase difference λ ′ changes depending on the distance L between the light emitting surface 10 of the semiconductor laser 1 and the circular diffraction grating 2 (see Equation 1).
Further, the apparent wavelength λ is smaller than the wavelength λ 0 of the semiconductor laser by the phase difference λ ′ (see Equation 2).
【００１７】[0017]
【数１】 (Equation 1)
【数２】 (Equation 2)
【００１８】ここで、レーザ光Ｑの傾きα、βがそれぞ
れ０であった場合について説明する。このようなレーザ
光Ｑが円形回折格子２を通過すると、スクリーン３には
間隔ｄから成る同心円状の回折光３１が映し出される。
同心円状となる回折光３１の間隔ｄは、レーザ光Ｑの見
かけ上の波長をλ、円形回折格子２とスクリーン３との
距離ｍおよび円形回折格子２のピッチＰとの間に数３で
示される関係が成り立つ。Here, a case where the inclinations α and β of the laser light Q are 0 will be described. When such a laser beam Q passes through the circular diffraction grating 2, a concentric diffracted beam 31 having an interval d is projected on the screen 3.
The interval d between the concentric diffracted lights 31 is represented by the apparent wavelength of the laser light Q as λ, the distance m between the circular diffraction grating 2 and the screen 3 and the pitch P between the circular diffraction gratings 2 as Relationship is established.
【００１９】[0019]
【数３】 (Equation 3)
【００２０】そこで、円形回折格子２のピッチＰおよび
円形回折格子２とスクリーン３との距離ｍが一定であれ
ば、間隔ｄを求めることによりレーザ光Ｑの見かけ上の
波長λを算出することができる。また、半導体レーザ１
の波長λ0 は半導体レーザ１の構成材料によって決まる
値であり、この波長λ0 と先に算出した見かけ上の波長
λとに基づいて数２から位相差λ’を算出することがで
きる。さらに、位相差λ’および円形回折格子２のピッ
チＰに基づいて数１から発光面１０と円形回折格子２と
の距離Ｌを算出できる。Therefore, if the pitch P of the circular diffraction grating 2 and the distance m between the circular diffraction grating 2 and the screen 3 are constant, the apparent wavelength λ of the laser beam Q can be calculated by obtaining the distance d. it can. In addition, the semiconductor laser 1
Wavelength lambda 0 is a value determined by the material of the semiconductor laser 1, it is possible to calculate the phase difference lambda 'several 2 based on the wavelength lambda of the apparent calculated for the wavelength lambda 0 and above. Further, the distance L between the light emitting surface 10 and the circular diffraction grating 2 can be calculated from Equation 1 based on the phase difference λ ′ and the pitch P of the circular diffraction grating 2.
【００２１】つまり、スクリーン上に映し出された回折
光３１の間隔ｄを求めることで円形回折格子２から発光
面１０までの距離Ｌを求めることができる。回折光３１
の間隔ｄを求めるには、スクリーン３に映し出された回
折光３１の映像をＣＣＤカメラ等の受光装置４にて取り
込み、所定の画像処理を施すことで算出する。That is, the distance L from the circular diffraction grating 2 to the light emitting surface 10 can be obtained by obtaining the distance d between the diffracted lights 31 projected on the screen. Diffracted light 31
In order to obtain the interval d, the image of the diffracted light 31 projected on the screen 3 is captured by the light receiving device 4 such as a CCD camera, and is calculated by performing predetermined image processing.
【００２２】次に、レーザ光Ｑに所定の傾きα、βがあ
る場合（０でない場合）について説明する。レーザ光Ｑ
に傾きα、βがある場合には、円形回折格子２を通過し
てスクリーン３に映し出される回折光３１が円形でなく
楕円形となる。つまり、傾きα、βがある場合、スクリ
ーン３上のＸ軸方向に沿った回折光３１の間隔ｄ’は傾
きαに応じて大きくなり、またスクリーン３上のＺ軸方
向に沿った回折光３１の間隔ｄ’’は傾きβに応じて大
きくなる。この間隔ｄ’および間隔ｄ’’はそれぞれ数
４および数５にて示される。Next, a case where the laser light Q has predetermined inclinations α and β (when it is not 0) will be described. Laser light Q
When there are inclinations α and β, the diffracted light 31 that passes through the circular diffraction grating 2 and is projected on the screen 3 is not circular but elliptical. That is, when there are the inclinations α and β, the interval d ′ of the diffracted light 31 on the screen 3 along the X-axis direction increases according to the inclination α, and the diffracted light 31 on the screen 3 along the Z-axis direction. The distance d ″ of the distance becomes larger according to the inclination β. The distance d ′ and the distance d ″ are represented by Expressions 4 and 5, respectively.
【００２３】[0023]
【数４】 (Equation 4)
【数５】 (Equation 5)
【００２４】この数４および数５の中の見かけ上の波長
λは、先に説明した数１および数２により求められる。
また、円形回折格子２とスクリーン３との距離ｍ、円形
回折格子２のピッチＰはそれぞれ一定である。したがっ
て、スクリーン３に映し出される回折光３１の映像を受
光装置４にて取り込み、その取り込み画像を画像処理し
て間隔ｄ’および間隔ｄ’’を求めれば、数４および数
５を用いてレーザ光Ｑの傾きα、βを正確に、しかも短
時間で算出することができるようになる。The apparent wavelength λ in Equations 4 and 5 is obtained by Equations 1 and 2 described above.
The distance m between the circular diffraction grating 2 and the screen 3 and the pitch P of the circular diffraction grating 2 are constant. Therefore, if the image of the diffracted light 31 projected on the screen 3 is captured by the light receiving device 4 and the captured image is subjected to image processing to determine the distance d ′ and the distance d ″, the laser light is calculated by using Expressions 4 and 5. The slopes α and β of Q can be calculated accurately and in a short time.
【００２５】また、円形回折格子２の中心から垂直線上
にあるスクリーン３の交点をＲとし、これを基準とした
回折光３１の中心３０の座標を（ＸR 、ＺR ）とした場
合、発光点１０ａの位置（Ｘ、Ｙ、Ｚ）は数６、数７、
数８にて示される。When the intersection of the screen 3 on the vertical line from the center of the circular diffraction grating 2 is R, and the coordinates of the center 30 of the diffracted light 31 with respect to this are (X R , Z R ), the light emission is obtained. The position (X, Y, Z) of the point 10a is given by Equations 6, 7,
It is shown by Equation 8.
【００２６】[0026]
【数６】 (Equation 6)
【数７】 (Equation 7)
【数８】 (Equation 8)
【００２７】つまり、回折光３１の中心３０の座標（Ｘ
R 、ＺR ）は、基準位置に対する発光点１０ａの相対的
な位置を示しており、発光面１０と円形回折格子２との
距離Ｌや円形回折格子２とスクリーン３との距離ｍなど
によってそれぞれ決まる。そこで、受光装置４にて取り
込んだスクリーン３上の回折光３１の映像に基づき中心
３０の座標（ＸR 、ＺR ）を求め、数６、数７および数
８を用いて半導体レーザ１の発光点１０ａの位置（Ｘ、
Ｙ、Ｚ）を求めることができる。That is, the coordinates (X) of the center 30 of the diffracted light 31
R , Z R ) indicate the relative position of the light emitting point 10 a with respect to the reference position, and are respectively determined by the distance L between the light emitting surface 10 and the circular diffraction grating 2 and the distance m between the circular diffraction grating 2 and the screen 3. Decided. Therefore, the coordinates (X R , Z R ) of the center 30 are determined based on the image of the diffracted light 31 on the screen 3 captured by the light receiving device 4, and the light emission of the semiconductor laser 1 is calculated by using Expressions 6, 7, and 8. The position (X,
Y, Z) can be obtained.
【００２８】このように、半導体レーザ１からレーザ光
Ｑを出射して円形回折格子２を通過させ、スクリーン３
に映し出された回折光３１の間隔ｄ’、ｄ’’や中心３
０の座標（ＸR 、ＺR ）を求めることでレーザ光Ｑの傾
きα、βおよび発光点１０ａの位置を簡単な構成でしか
も正確に求めることができるようになる。As described above, the laser beam Q is emitted from the semiconductor laser 1, passes through the circular diffraction grating 2,
D ′, d ″ and the center 3 of the diffracted light 31
By obtaining the coordinates (X R , Z R ) of 0, the inclinations α and β of the laser beam Q and the position of the light emitting point 10a can be accurately obtained with a simple configuration.
【００２９】次に、本発明の光学部品の組立て方法を図
２に基づいて説明する。図２は先に説明した半導体レー
ザ１の発光位置検出方法を用いた光学部品の組立て方法
を説明する概略斜視図である。先ず、図２（ａ）に示す
測定工程として、半導体レーザ１を測定用ステージ５の
基準位置に配置した状態でプローブ針１１から電流を与
え、発光面１０の発光点１０ａからレーザ光Ｑを出射す
る。Next, a method for assembling an optical component according to the present invention will be described with reference to FIG. FIG. 2 is a schematic perspective view for explaining a method of assembling an optical component using the above-described method for detecting the light emitting position of the semiconductor laser 1. First, in the measurement step shown in FIG. 2A, a current is applied from the probe needle 11 in a state where the semiconductor laser 1 is arranged at the reference position of the measurement stage 5, and the laser light Q is emitted from the light emitting point 10a of the light emitting surface 10. I do.
【００３０】そして、このレーザ光Ｑを円形回折格子２
で回折させスクリーン３に所定の回折光３１を映し出
し、受光装置４にて取り込んで先に説明したようなレー
ザ光Ｑの傾きα、βおよび発光点１０ａの位置（図１参
照）を算出する。この算出した結果は、半導体レーザ１
の表面に付されたマーク１２を基準とした位置データと
して記憶しておく。Then, the laser light Q is applied to the circular diffraction grating 2.
Then, a predetermined diffracted light 31 is projected on the screen 3 and taken in by the light receiving device 4 to calculate the inclinations α and β of the laser light Q and the position of the light emitting point 10a (see FIG. 1) as described above. The result of this calculation is the semiconductor laser 1
Is stored as position data with reference to the mark 12 attached to the surface of.
【００３１】すなわち、半導体レーザ１の上方に位置合
わせ用カメラ６を配置しておき、取り込んだマーク１２
の画面上における方向および位置を基準としたレーザ光
Ｑの傾きα、βおよび発光点１０ａの位置を記憶してお
く。この際、Ｚ軸方向（図１参照）に対する位置におい
ては位置合わせ用カメラ６の焦点距離に基づいて記憶し
ておけばよい。That is, the positioning camera 6 is arranged above the semiconductor laser 1 and the captured mark 12
The inclinations α and β of the laser beam Q with reference to the direction and the position on the screen of FIG. At this time, the position in the Z-axis direction (see FIG. 1) may be stored based on the focal length of the positioning camera 6.
【００３２】次に、図２（ｂ）に示す移載工程として、
発光位置の検出が終わった半導体レーザ１をコレット７
を用いて吸着保持し、測定用ステージ５から移動させ
る。次いで、図２（ｃ）に示す実装工程として、コレッ
ト７にて吸着保持した半導体レーザ１を実装用基台８上
に載置し、位置合わせ用カメラ６を用いて所定の位置決
めを行う。Next, as a transfer step shown in FIG.
The semiconductor laser 1 whose emission position has been detected is collet 7
And is moved from the measurement stage 5. Next, as a mounting step shown in FIG. 2C, the semiconductor laser 1 sucked and held by the collet 7 is placed on a mounting base 8, and predetermined positioning is performed by using a positioning camera 6.
【００３３】すなわち、図２（ａ）に示す測定工程で記
憶したマーク１２に対する発光位置の位置データを使用
し、位置合わせ用カメラ６にて取り込んだマーク１２の
位置と実装用基台８の基準とを位置合わせする。このマ
ーク１２と実装用基台８の基準との位置合わせにより半
導体レーザ１の実際の発光方向および発光点位置がそれ
ぞれ基準と正確に位置合わせされることになり、そして
この位置で半導体レーザ１を実装用基台８上に固定す
る。これにより、半導体レーザ１の光軸と図示しないレ
ンズ系の光軸とが正確に合った光学部品を組立てること
ができるようになる。That is, using the position data of the light emission position for the mark 12 stored in the measurement step shown in FIG. 2A, the position of the mark 12 captured by the positioning camera 6 and the reference of the mounting base 8 are used. And position. By aligning the mark 12 with the reference of the mounting base 8, the actual light emitting direction and the light emitting point position of the semiconductor laser 1 are accurately aligned with the reference, respectively. It is fixed on the mounting base 8. This makes it possible to assemble an optical component in which the optical axis of the semiconductor laser 1 and the optical axis of a lens system (not shown) are accurately aligned.
【００３４】なお、本実施例においては半導体レーザ１
から成る発光体を例として説明したが本発明はこれに限
定されず、コヒーレントな光を出射するものであれば同
様である。In this embodiment, the semiconductor laser 1
Although the luminous body composed of is described as an example, the present invention is not limited to this, and the same applies as long as it emits coherent light.
【００３５】[0035]
【発明の効果】以上説明したように、本発明の発光体の
発光位置検出方法とそれを用いた光学部品の組立て方法
によれば次のような効果がある。すなわち、本発明の発
光体の発光位置検出方法では、発光体から出射した光を
円形回折格子にて回折させ、スクリーン上に映し出され
た回折光の間隔や中心位置に基づいて発光方向や発光点
位置を検出しているため、発光面の欠けやゴミの付着等
の影響を受けることなく正確に発光位置を検出すること
ができる。しかも、円形回折格子やスクリーン、受光装
置を移動させる必要がないため、簡単な構成にて検出す
ることが可能となるとともに、短時間での検出を行うこ
とができるようになる。As described above, according to the method for detecting the light emitting position of a light emitting body and the method for assembling an optical component using the same according to the present invention, the following effects can be obtained. That is, in the light emitting position detecting method of the light emitting body of the present invention, the light emitted from the light emitting body is diffracted by the circular diffraction grating, and the light emitting direction and the light emitting point are determined based on the interval and the center position of the diffracted light projected on the screen. Since the position is detected, the light emitting position can be accurately detected without being affected by chipping of the light emitting surface or adhesion of dust. In addition, since there is no need to move the circular diffraction grating, the screen, and the light receiving device, detection can be performed with a simple configuration, and detection can be performed in a short time.
【００３６】また、本発明の光学部品の組立て方法によ
れば、発光体による実際の発光方向および発光位置とレ
ンズ系とを正確に位置合わせすることができ、光の結合
効率の優れた光学部品を製造できるようになる。このた
め、光学的な精度の高い光学部品を提供することが可能
となる。Further, according to the method of assembling an optical component of the present invention, the actual light emitting direction and the light emitting position of the light emitting element can be accurately aligned with the lens system, and the optical component has excellent light coupling efficiency. Can be manufactured. For this reason, it is possible to provide an optical component with high optical precision.
【図１】本発明を説明する概略斜視図である。FIG. 1 is a schematic perspective view illustrating the present invention.
【図２】本発明の光学部品の組立て方法を説明する概略
斜視図で、（ａ）は測定工程、（ｂ）は移載工程、
（ｃ）は実装工程である。FIGS. 2A and 2B are schematic perspective views illustrating a method of assembling an optical component according to the present invention, wherein FIG. 2A is a measurement step, FIG.
(C) is a mounting process.
【図３】従来例を説明する概略斜視図である。FIG. 3 is a schematic perspective view illustrating a conventional example.
１ 半導体レーザ ２ 円形回折
格子 ３ スクリーン ４ 受光装置 ５ 測定用ステージ ８ 実装用基
台 １０ 発光面 １０ａ 発光
点 １１ プローブ針 １２ マーク ３０ 中心 ３１ 回折光Reference Signs List 1 semiconductor laser 2 circular diffraction grating 3 screen 4 light receiving device 5 measuring stage 8 mounting base 10 light emitting surface 10a light emitting point 11 probe needle 12 mark 30 center 31 diffracted light
Claims (4)
で該発光体からコヒーレントな光を出射し、該光を同心
円状で一定間隔に形成された円形回折格子を通過させ、 次いで、前記円形回折格子を通過した光をスクリーンに
当てて、所定の間隔から成る複数の輪状の回折光を該ス
クリーンに映し出し、 前記回折光の間隔に基づいて前記基準位置に対する前記
光の発光方向を算出するとともに該回折光の中心位置に
基づいて該基準位置に対する前記発光点位置を算出する
ことを特徴とする発光体の発光位置検出方法。First, coherent light is emitted from the light-emitting body in a state where the light-emitting body is arranged at a reference position, and the light is passed through a concentric circular diffraction grating formed at a constant interval. The light passing through the circular diffraction grating is applied to a screen, a plurality of annular diffracted lights having a predetermined interval are projected on the screen, and the light emission direction of the light with respect to the reference position is calculated based on the interval of the diffracted lights. And calculating the light emitting point position with respect to the reference position based on the center position of the diffracted light.
特徴とする請求項１記載の発光体の発光位置検出方法。2. The method according to claim 1, wherein the illuminant is a semiconductor laser.
法を用いた光学部品の組立て方法であって、 測定用ステージ上に前記発光体を配置した状態で前記基
準位置に対する前記光の発光方向および前記発光点位置
を算出した後、 前記発光体を前記測定用ステージから実装用基台へ移載
し、 前記発光方向および前記発光点位置に基づいて前記発光
体を前記実装用基台の基準に合わせて固定することを特
徴とする光学部品の組立て方法。3. A method for assembling an optical component using the method for detecting a light emitting position of a light emitting body according to claim 1, wherein the light is emitted to the reference position with the light emitting body arranged on a measuring stage. After calculating the direction and the light emitting point position, the light emitting body is transferred from the measurement stage to the mounting base, and the light emitting body is mounted on the mounting base based on the light emitting direction and the light emitting point position. A method for assembling an optical component, comprising fixing the optical component according to a standard.
特徴とする請求項３記載の光学部品の組立て方法。4. The method according to claim 3, wherein the illuminant is a semiconductor laser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04524094A JP3271221B2 (en) | 1994-02-18 | 1994-02-18 | Method of detecting light emission position of light emitter and method of assembling optical parts using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04524094A JP3271221B2 (en) | 1994-02-18 | 1994-02-18 | Method of detecting light emission position of light emitter and method of assembling optical parts using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07231143A JPH07231143A (en) | 1995-08-29 |
| JP3271221B2 true JP3271221B2 (en) | 2002-04-02 |
Family
ID=12713736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP04524094A Expired - Fee Related JP3271221B2 (en) | 1994-02-18 | 1994-02-18 | Method of detecting light emission position of light emitter and method of assembling optical parts using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3271221B2 (en) |
-
1994
- 1994-02-18 JP JP04524094A patent/JP3271221B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07231143A (en) | 1995-08-29 |
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