JP3235185B2 - Heat dissipation device for thermoelectric conversion element - Google Patents
Heat dissipation device for thermoelectric conversion elementInfo
- Publication number
- JP3235185B2 JP3235185B2 JP14438592A JP14438592A JP3235185B2 JP 3235185 B2 JP3235185 B2 JP 3235185B2 JP 14438592 A JP14438592 A JP 14438592A JP 14438592 A JP14438592 A JP 14438592A JP 3235185 B2 JP3235185 B2 JP 3235185B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- refrigerant
- thermoelectric conversion
- conversion element
- refrigerant tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、熱電変換素子の放熱装
置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radiator for a thermoelectric conversion element.
【０００２】[0002]
【従来の技術】本発明に係わる従来技術として、例えば
特開昭６０−１７０２７２号公報に開示された「熱電変
換装置」がある。この従来技術を図１２に基づいて説明
すると、Ｐ型半導体１０１とＮ型半導体１０２とが電極
１０３により直列的に複数接続され、金属板１０４の上
に接着剤層１０５，絶縁膜１０６および接着剤層１０７
を介して配設されている。そして、金属板１０４が係合
する電極１０３面（下面）とは反対側の電極１０３面
（上面）には接着剤層１０８を介して複数の管１０９が
配設されている。2. Description of the Related Art As a prior art relating to the present invention, there is, for example, a "thermoelectric converter" disclosed in Japanese Patent Application Laid-Open No. 60-170272. This conventional technique will be described with reference to FIG. 12. A plurality of P-type semiconductors 101 and N-type semiconductors 102 are connected in series by electrodes 103, and an adhesive layer 105, an insulating film 106 and an adhesive are formed on a metal plate 104. Layer 107
It is arranged through. A plurality of tubes 109 are provided via an adhesive layer 108 on the surface (upper surface) of the electrode 103 opposite to the surface (lower surface) of the electrode 103 with which the metal plate 104 engages.
【０００３】いま、金属板１０４に図示しない吸熱装置
が係合している場合を考えると、管１０９には冷却水が
供給されて流れる。従って、吸熱装置が除去した被冷却
体の熱は下面側の電極１０３から上面側の電極１０３へ
とポンプされ、管１０９を流れる冷却水によって冷却さ
れ放熱される。Now, considering that a heat absorbing device (not shown) is engaged with the metal plate 104, cooling water is supplied to the pipe 109 and flows. Therefore, the heat of the cooled object removed by the heat absorbing device is pumped from the lower electrode 103 to the upper electrode 103, and is cooled by the cooling water flowing through the pipe 109 and radiated.
【０００４】ところが、電極１０３と管１０９との間に
介在する接着剤層１０８の熱伝導度は金属や冷却水の熱
伝導度に比べれば極めて低く、接着剤層１０８が熱伝導
に際して抵抗体として作用してしまう。この結果、放熱
量が少なくなり、熱電変換装置としての効率が低下する
といった不具合を有している。However, the thermal conductivity of the adhesive layer 108 interposed between the electrode 103 and the tube 109 is extremely low as compared with the thermal conductivity of metal or cooling water. Works. As a result, there is a problem that the amount of heat radiation is reduced and the efficiency of the thermoelectric conversion device is reduced.
【０００５】また、実開昭６２−６６７３号公報に開示
された「冷温装置」では、円筒状のヒートパイプの外周
に熱電変換素子の放熱面が伝熱的に取り付けられたもの
が開示されている。しかし、ヒートパイプと熱電変換素
子の放熱面とを直接接触させて伝熱的に取り付けた場合
には、両者間に介在する僅かな気体層が熱伝導に際して
抵抗体となり、ヒートパイプと熱電変換素子の放熱面と
を接着剤を介して接触させて伝熱的に取り付けた場合に
は、前述のとおり接着剤層が熱伝導に際して抵抗体とな
るので、いずれの場合においても放熱量が少なくなり、
熱電変換素子としての効率が低下するといった不具合を
有している。[0005] Further, a "cooling / heating device" disclosed in Japanese Utility Model Laid-Open Publication No. 62-6673 discloses a cooling device in which a heat radiation surface of a thermoelectric conversion element is heat conductively attached to the outer periphery of a cylindrical heat pipe. I have. However, when the heat pipe and the heat-dissipating surface of the thermoelectric conversion element are brought into direct contact with each other for heat transfer, the slight gas layer interposed between them becomes a resistor in heat conduction, and the heat pipe and the thermoelectric conversion element If the heat-radiating surface is in contact with the heat-dissipating surface via an adhesive and heat-conductively attached, the heat-dissipating amount is reduced in any case because the adhesive layer serves as a resistor when conducting heat as described above.
There is a problem that the efficiency as a thermoelectric conversion element is reduced.
【０００６】[0006]
【発明が解決しようとする課題】そこで、本発明では熱
電変換素子の放熱効率向上を、その技術的課題とする。Accordingly, an object of the present invention is to improve the heat radiation efficiency of a thermoelectric conversion element.
【０００７】[0007]
【０００８】[0008]
【課題を解決するための手段】前述した本発明の技術的
課題を解決するために講じた本発明の技術的手段は、Ｐ
型半導体とＮ型半導体を２枚の基板上に形成された電極
を用いて直列に接続され、前記基板の一方の基板を吸熱
面とし、前記基板の他方の基板を放熱面とした熱電変換
素子と、前記放熱面を有する前記基板が少なくとも下底
面を構成する冷媒タンクと、前記冷媒タンクと連通し、
その上方へと延在する複数のチューブと、前記複数のチ
ューブ間に固設されるフィンとを有し、前記冷媒タンク
内の冷媒は前記放熱面全体と直接接触しているようにし
たことである。Means for Solving the Problems] technical means of the present invention taken in order to solve the technical problem of the present invention described above, P
Electrodes formed of two types of semiconductors and N-type semiconductors on two substrates
Is connected in series using a heat sink that absorbs one of the substrates
As a surface, a thermoelectric conversion element having the other substrate of the substrate as a heat dissipation surface, a coolant tank in which the substrate having the heat dissipation surface constitutes at least a lower bottom surface, and communicates with the coolant tank,
It has a plurality of tubes extending upward and fins fixed between the plurality of tubes, and the refrigerant in the refrigerant tank is in direct contact with the entire heat radiation surface. is there.
【０００９】[0009]
【作用】上述した本発明の技術的手段によれば、冷媒タ
ンク内の冷媒が放熱面全体と直接接触し、放熱面が冷媒
により直接冷却される。According to the above-described technical means of the present invention, the refrigerant in the refrigerant tank comes into direct contact with the entire heat radiation surface, and the heat radiation surface is directly cooled by the refrigerant.
【００１０】[0010]
【実施例】以下、本発明の技術的手段を具体化した実施
例について添付図面に基づいて説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment embodying the technical means of the present invention will be described below with reference to the accompanying drawings.
【００１１】図１において、熱電変換素子１１は、Ｐ型
半導体１２とＮ型半導体１３を２枚の基板１４上に形成
された電極１５を用いて直列に接続して構成されてい
る。ここで、図示上側の基板１４が放熱面１６として、
図示下側の基板１４が吸熱面１７として作用する。ま
た、Ｐ型半導体１２およびＮ型半導体１３は、例えばビ
スマステルル系の半導体で形成され、基板１４は、例え
ばアルミナ等を混ぜたセラミックスによって形成され、
電極１５は、例えば銅等の熱伝導性，電気伝導性に優れ
た材料から形成される。In FIG. 1, a thermoelectric conversion element 11 is configured by connecting a P-type semiconductor 12 and an N-type semiconductor 13 in series using electrodes 15 formed on two substrates 14. Here, the substrate 14 on the upper side of the figure serves as a heat dissipation surface 16.
The substrate 14 on the lower side in the figure functions as the heat absorbing surface 17. Further, the P-type semiconductor 12 and the N-type semiconductor 13 are formed of, for example, a bismuth telluride-based semiconductor, and the substrate 14 is formed of, for example, a ceramic mixed with alumina or the like.
The electrode 15 is formed of a material having excellent heat conductivity and electric conductivity, such as copper.
【００１２】以上のような構成をもつ熱電変換素子１１
が以下に説明する各実施例に共通して用いられる。The thermoelectric conversion element 11 having the above configuration
Is commonly used in each of the embodiments described below.
【００１３】図２，図３（図２のＡ−Ａ断面）に示す第
１実施例の熱電変換素子の放熱装置１０において、放熱
面１６には放熱装置１９が係合し、吸熱面１７には被冷
却物１８が係合するが、冷却されるものならば何でもよ
くその構成は特に限定しない。即ち、放熱面１６は冷媒
タンク２０の下底面を直接的に形成している。但し、こ
の実施例では冷媒タンク２０の側壁面も放熱面１６を形
成する基板１４により一体的に形成されている。そし
て、冷媒タンク２０の上壁面は、基板１４とＯリング２
１を介して液密的に固設された上板２２により構成され
る。さらに、上板２２には複数のチューブ２３が上方へ
と延在して配設され、チューブ２３は冷媒タンク２０と
連通している。また、チューブ２３の上端には液密的に
副冷媒タンク２４が配設されている。この複数のチュー
ブ２３間には波状のコルゲートフィン２５が固設されて
いる。冷媒タンク２０の内部には冷媒が注入されてお
り、放熱面１６全面が冷媒と接触するのに十分な量とさ
れている。また、冷媒タンク２０，チューブ２３および
副冷媒タンク２４の内部全てはある程度（例えば真空近
く）まで減圧し、冷媒の沸点を比較的低温（例えば２０
〜３０℃）まで下げた状態に保持している。In the heat radiation device 10 of the thermoelectric conversion element according to the first embodiment shown in FIGS. 2 and 3 (section AA in FIG. 2), a heat radiation device 19 is engaged with the heat radiation surface 16 and The object 18 to be cooled is engaged, but any structure can be used as long as it is cooled, and the configuration is not particularly limited. That is, the heat radiation surface 16 directly forms the lower bottom surface of the refrigerant tank 20. However, in this embodiment, the side wall surface of the refrigerant tank 20 is also integrally formed by the substrate 14 forming the heat radiation surface 16. The upper wall surface of the refrigerant tank 20 includes the substrate 14 and the O-ring 2
It is constituted by an upper plate 22 fixed in a liquid-tight manner via the first plate 1. Further, a plurality of tubes 23 are disposed on the upper plate 22 so as to extend upward, and the tubes 23 communicate with the refrigerant tank 20. At the upper end of the tube 23, a sub-refrigerant tank 24 is disposed in a liquid-tight manner. Corrugated corrugated fins 25 are fixed between the plurality of tubes 23. The refrigerant is injected into the refrigerant tank 20, and the amount is sufficient to make the entire heat radiation surface 16 come into contact with the refrigerant. Further, the pressure inside the refrigerant tank 20, the tube 23, and the sub-refrigerant tank 24 is reduced to some extent (for example, close to vacuum), and the boiling point of the refrigerant is relatively low (for example, 20).
-30 ° C).
【００１４】以上の構成を有する熱電変換素子の放熱装
置１０の作動について説明する。The operation of the heat radiating device 10 of the thermoelectric conversion element having the above configuration will be described.
【００１５】熱電変換素子１１に図示方向の電流を流す
と、放熱面１６には発熱作用が生じる一方、吸熱面１７
は吸熱作用によって冷却される。この冷却された吸熱面
１７に被冷却物１８が冷却される。When a current is applied to the thermoelectric conversion element 11 in the direction shown in the drawing, a heat is generated on the heat radiating surface 16 while the heat absorbing surface 17 is formed.
Is cooled by endothermic action. The cooled object 18 is cooled on the cooled heat absorbing surface 17.
【００１６】一方、放熱面１６においてその発熱作用に
よって冷媒が沸騰し、気化する際に蒸発潜熱として放熱
面１６から熱を奪い放熱面１６を冷却し、気相冷媒が冷
媒タンク２０上方のチューブ２３および副冷媒タンク２
４へと移動する。チューブ２３においてコルゲートフィ
ン２５を介して外気へと放熱し、気相冷媒が冷却される
ことで液化する。この液化した冷媒は重力にしたがって
冷媒タンク２０へと戻る。なお、気相冷媒から外気への
放熱を促すために、図示しないファン等によってコルゲ
ートフィン２５に風を送ることも可能である。尚、冷媒
がチューブ２３内にて液化しその表面張力によってチュ
ーブ２３が閉塞しても、気相冷媒の圧力によってチュー
ブ２３内の液相冷媒が副冷媒タンク２４へと押し出され
るので、チューブ２３の完全な閉塞が防止される。On the other hand, when the refrigerant boils on the heat radiating surface 16 due to its heat generating action, when the refrigerant evaporates, it takes heat from the heat radiating surface 16 as latent heat of evaporation to cool the heat radiating surface 16, and the gaseous refrigerant flows into the tube 23 above the refrigerant tank 20. And auxiliary refrigerant tank 2
Move to 4. In the tube 23, heat is radiated to the outside air via the corrugated fins 25, and the gas phase refrigerant is cooled and liquefied. The liquefied refrigerant returns to the refrigerant tank 20 according to gravity. It is also possible to send air to the corrugated fins 25 by a fan or the like (not shown) in order to promote heat radiation from the gas-phase refrigerant to the outside air. Even if the refrigerant is liquefied in the tube 23 and the tube 23 is closed by the surface tension, the liquid-phase refrigerant in the tube 23 is pushed out to the sub-refrigerant tank 24 by the pressure of the gas-phase refrigerant. Complete occlusion is prevented.
【００１７】次に、図４，図５（図４の要部拡大図）に
おいて第２実施例の熱電変換素子の放熱装置３０を示す
が、第１実施例の同一の部分については同一の番号符号
を付すことで説明を省略する。Next, in FIGS. 4 and 5 (enlarged view of the main part of FIG. 4), a heat radiating device 30 of the thermoelectric conversion element of the second embodiment is shown. The description is omitted by attaching reference numerals.
【００１８】ここで、放熱面１６は冷媒タンク２０の下
底面を直接的に形成し、冷媒タンク２０の側壁面を形成
する側板３１と放熱面１６を形成する基板１４とが接着
剤３２によって固定されている。この第２実施例によれ
ば、基板１４を第１実施例のようにカップ状に形成する
必要がなく、製造上有利である。Here, the heat radiating surface 16 directly forms the lower bottom surface of the refrigerant tank 20, and the side plate 31 forming the side wall surface of the refrigerant tank 20 and the substrate 14 forming the heat radiating surface 16 are fixed by the adhesive 32. Have been. According to the second embodiment, the substrate 14 does not need to be formed in a cup shape as in the first embodiment, which is advantageous in manufacturing.
【００１９】次に、図６において第３実施例の熱電変換
素子の放熱装置３５を示すが、第１実施例の同一の部分
については同一の番号符号を付すことで説明を省略す
る。Next, FIG. 6 shows a heat radiating device 35 for a thermoelectric conversion element according to a third embodiment. The same parts as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.
【００２０】ここで、冷媒タンク２０と副冷媒タンク２
４とは、各タンクの側面に開口する連通管３６によって
連通している。この第３実施例によれば、冷媒タンク２
０にて気相となった冷媒は連通管３６を通って副冷媒タ
ンク２４へと至り、次いでチューブ２３へと至って放熱
・液化する。即ち、冷媒がチューブ２３内にて液化しそ
の表面張力によってチューブ２３が閉塞しても、気相冷
媒の圧力が連通管３６から副冷媒タンクを介してチュー
ブ２３内の液相冷媒にかかるので、液相冷媒が冷媒タン
ク２０へと押し出される。また、連通管３６にはコルゲ
ートフィンが配設されていないので、この管内にて気相
冷媒が液化することは稀である。Here, the refrigerant tank 20 and the auxiliary refrigerant tank 2
4 are communicated with each other by a communication pipe 36 that opens on the side surface of each tank. According to the third embodiment, the refrigerant tank 2
The refrigerant in the gas phase at 0 passes through the communication pipe 36, reaches the sub-refrigerant tank 24, and then reaches the tube 23 to be radiated and liquefied. That is, even if the refrigerant is liquefied in the tube 23 and the tube 23 is closed by the surface tension, the pressure of the gas-phase refrigerant is applied to the liquid-phase refrigerant in the tube 23 from the communication pipe 36 through the sub-refrigerant tank. The liquid-phase refrigerant is pushed out to the refrigerant tank 20. Further, since no corrugated fins are provided in the communication pipe 36, the gaseous refrigerant rarely liquefies in this pipe.
【００２１】次に、図７，図８（図７のＢ−Ｂ断面）に
おいて第４実施例の熱電変換素子の放熱装置４０を示す
が、第１実施例の同一の部分については同一の番号符号
を付すことで説明を省略する。Next, FIGS. 7 and 8 (sectional views taken along the line BB in FIG. 7) show the heat radiating device 40 of the thermoelectric conversion element of the fourth embodiment, and the same parts of the first embodiment have the same numbers. The description is omitted by attaching reference numerals.
【００２２】ここで、冷媒タンク２０と副冷媒タンク２
４とは、各タンクの略中央に開口する連通管４１によっ
て連通している。この第４実施例によれば、第３実施例
に比べ、製造上、チューブ２３と連通管４１の組付けを
同時にできるというメリットを有している。Here, the refrigerant tank 20 and the auxiliary refrigerant tank 2
4 are communicated with each other by a communication pipe 41 which is opened substantially at the center of each tank. According to the fourth embodiment, as compared with the third embodiment, there is an advantage that the tube 23 and the communication tube 41 can be assembled at the same time in terms of manufacturing.
【００２３】次に、図９において第５実施例の熱電変換
素子の放熱装置４５を示すが、第１実施例の同一の部分
については同一の番号符号を付すことで説明を省略す
る。Next, FIG. 9 shows a heat radiating device 45 for a thermoelectric conversion element according to a fifth embodiment. The same parts as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.
【００２４】ここで、冷媒タンク４６は熱電変換素子１
１の基板１４と一体となった下部タンク４７，チューブ
２３と連続する上部タンク４８および両タンク４７，４
８を連通する接続管４９からなっている。また、図６に
示す第３実施例と同様に、冷媒タンク４６の下部タンク
４７側面と副冷媒タンク２４側面に開口する連通管５０
によって連通している。そして、下部タンク４７にて気
相となった冷媒は連通管５０を通って副冷媒タンク２４
へと至り、次いでチューブ２３へと至って放熱・液化す
る。この後、上部タンク４８へと落下し、接続管４９を
通って下部タンク４７に戻る。この第５実施例によれ
ば、チューブ２３を熱電変換素子１１から離れたところ
に設置できるので、熱電変換素子の放熱装置を実際の製
品に応用する際に自由度が高まり有利である。例えばエ
アコンで考えると、被冷却物１８が室内の空気冷却用フ
ィンであるとすると、放熱部となるチューブ２３は室外
機として室内より離れた室外に設置することが可能とな
る。Here, the refrigerant tank 46 is the thermoelectric conversion element 1
A lower tank 47 integrated with one substrate 14, an upper tank 48 continuous with the tube 23, and both tanks 47, 4.
8 is connected. As in the third embodiment shown in FIG. 6, the communication pipe 50 opens on the side of the lower tank 47 of the refrigerant tank 46 and the side of the auxiliary refrigerant tank 24.
Is in communication with Then, the refrigerant in the gas phase in the lower tank 47 passes through the communication pipe 50 and passes through the sub-refrigerant tank 24.
And then to the tube 23 for heat dissipation and liquefaction. After that, it falls to the upper tank 48 and returns to the lower tank 47 through the connection pipe 49. According to the fifth embodiment, since the tube 23 can be installed at a place away from the thermoelectric conversion element 11, the degree of freedom is advantageously increased when the heat radiating device of the thermoelectric conversion element is applied to an actual product. For example, in the case of an air conditioner, if the object to be cooled 18 is a fin for cooling air in a room, the tube 23 serving as a heat radiating unit can be installed outside the room as an outdoor unit.
【００２５】次に、図１０において第６実施例の熱電変
換素子の放熱装置５５を示すが、第１実施例の同一の部
分については同一の番号符号を付すことで説明を省略す
る。Next, FIG. 10 shows a heat radiating device 55 for a thermoelectric conversion element according to a sixth embodiment. The same parts as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.
【００２６】ここで、第１実施例〜第５実施例にあった
副冷媒タンク２４がなく、止め板５６によってチューブ
２３の上端が液密的に封止されている。Here, the auxiliary refrigerant tank 24 of the first to fifth embodiments is not provided, and the upper end of the tube 23 is liquid-tightly sealed by the stopper plate 56.
【００２７】最後に、図１１において第７実施例の熱電
変換素子の放熱装置６０を示すが、第２実施例の同一の
部分については同一の番号符号を付すことで説明を省略
する。但し、第１〜第６実施例は熱電変換素子１１に電
流を流して吸熱面１７で吸熱し、放熱面１６で放熱する
作用を期待した所謂ペルチェ素子としての実施例であっ
たが、本第７実施例は熱電変換素子１１の上下面に温度
差を与えて電極の両端に電位差を発生する作用を期待し
た所謂ゼーベック素子としての実施例である。Finally, FIG. 11 shows a heat radiating device 60 for a thermoelectric conversion element according to a seventh embodiment. The same parts as those in the second embodiment are denoted by the same reference numerals and description thereof is omitted. However, the first to sixth embodiments are so-called Peltier elements which are expected to have the effect of flowing an electric current through the thermoelectric conversion element 11 to absorb heat at the heat absorbing surface 17 and release heat at the heat radiation surface 16. The seventh embodiment is a so-called Seebeck element in which a temperature difference is applied to the upper and lower surfaces of the thermoelectric conversion element 11 to generate a potential difference at both ends of the electrode.
【００２８】熱電変換素子１１の下面側基板１４には高
温発熱源６１が係合し、上面側基板１４には放熱による
低温吸熱源６２が係合している。低温吸熱源６２の構成
は図４に示す第２実施例と略同一である。A high-temperature heat source 61 is engaged with the lower substrate 14 of the thermoelectric conversion element 11, and a low-temperature heat source 62 is engaged with the upper substrate 14 by heat radiation. The configuration of the low-temperature heat absorbing source 62 is substantially the same as that of the second embodiment shown in FIG.
【００２９】[0029]
【発明の効果】上述したように本発明の熱電変換素子の
放熱装置では、Ｐ型半導体とＮ型半導体を２枚の基板上
に形成された電極を用いて直列に接続され、前記基板の
一方の基板を吸熱面とし、前記基板の他方の基板を放熱
面とした熱電変換素子と、前記放熱面を有する前記基板
が少なくとも下底面を構成する冷媒タンクと、前記冷媒
タンクと連通し、その上方へと延在する複数のチューブ
と、前記複数のチューブ間に固設されるフィンとを有
し、前記冷媒タンク内の冷媒は前記放熱面全体と直接接
触しているようにしたので、冷媒タンク内の冷媒が放熱
面全体と直接接触し、放熱面が冷媒により直接冷却され
るので、放熱面から冷媒への熱伝達に際して抵抗となる
ものが全くなく、冷媒タンク上方に配設されたチューブ
およびフィンにより放熱されるため、放熱効率に極めて
優れる。 As described above, the thermoelectric conversion element of the present invention
In a heat dissipation device, a P-type semiconductor and an N-type semiconductor are mounted on two substrates.
Are connected in series using the electrodes formed on the
One of the substrates is used as a heat absorbing surface, and the other substrate is radiated.
A thermoelectric conversion element having a surface, a refrigerant tank in which the substrate having the heat dissipation surface constitutes at least a lower bottom surface, a plurality of tubes communicating with the refrigerant tank, and extending upward, and the plurality of tubes. And a fin fixed to the refrigerant tank, so that the refrigerant in the refrigerant tank is in direct contact with the entire heat radiation surface, so that the refrigerant in the refrigerant tank directly contacts the entire heat radiation surface, and the heat radiation surface is Since it is cooled directly by the refrigerant, there is no resistance at the time of heat transfer from the heat radiating surface to the refrigerant, and the heat is radiated by the tubes and fins disposed above the refrigerant tank, so that the radiation efficiency is extremely excellent.
【図１】熱電変換素子１１の構成図を示す。FIG. 1 shows a configuration diagram of a thermoelectric conversion element 11. FIG.
【図２】本発明第１実施例の熱電変換素子の放熱装置の
構成図を示す。FIG. 2 is a configuration diagram of a heat radiating device for a thermoelectric conversion element according to a first embodiment of the present invention.
【図３】図２におけるＡ−Ａ断面図を示す。FIG. 3 is a sectional view taken along line AA in FIG. 2;
【図４】本発明第２実施例の熱電変換素子の放熱装置の
構成図を示す。FIG. 4 is a configuration diagram of a heat dissipation device of a thermoelectric conversion element according to a second embodiment of the present invention.
【図５】図４における要部拡大構成図を示す。FIG. 5 is an enlarged configuration diagram of a main part in FIG. 4;
【図６】本発明第３実施例の熱電変換素子の放熱装置の
構成図を示す。FIG. 6 is a configuration diagram of a heat dissipation device of a thermoelectric conversion element according to a third embodiment of the present invention.
【図７】本発明第４実施例の熱電変換素子の放熱装置の
構成図を示す。FIG. 7 is a configuration diagram of a heat dissipation device for a thermoelectric conversion element according to a fourth embodiment of the present invention.
【図８】図７におけるＢ−Ｂ断面図を示す。FIG. 8 is a sectional view taken along line BB in FIG. 7;
【図９】本発明第５実施例の熱電変換素子の放熱装置の
構成図を示す。FIG. 9 is a configuration diagram of a heat dissipation device for a thermoelectric conversion element according to a fifth embodiment of the present invention.
【図１０】本発明第６実施例の熱電変換素子の放熱装置
の構成図を示す。FIG. 10 shows a configuration diagram of a heat dissipation device for a thermoelectric conversion element according to a sixth embodiment of the present invention.
【図１１】本発明第７実施例の熱電変換素子の放熱装置
の構成図を示す。FIG. 11 shows a configuration diagram of a heat dissipation device for a thermoelectric conversion element according to a seventh embodiment of the present invention.
【図１２】従来技術の熱電変換装置の構成図を示す。FIG. 12 shows a configuration diagram of a conventional thermoelectric conversion device.
１０，３０，３５，４０，４５，５５，６０ 熱電変換
素子の放熱装置、 １７ 吸熱面、 １６ 放熱面、 １１ 熱電変換素子、 ２０ 冷媒タンク、 ２３ チューブ、 ２５ コルゲートフィン（フィン）、 ２４ 副冷媒タンク、 ３６，４１，５０ 連通管、 ４７ 下部タンク、 ４８ 上部タンク、 ４９ 接続管、10, 30, 35, 40, 45, 55, 60 Radiator of thermoelectric conversion element, 17 heat absorption surface, 16 heat radiation surface, 11 thermoelectric conversion element, 20 refrigerant tank, 23 tube, 25 corrugated fin (fin), 24 auxiliary refrigerant Tank, 36, 41, 50 communicating pipe, 47 lower tank, 48 upper tank, 49 connecting pipe,
Claims (4)
に形成された電極を用いて直列に接続され、前記基板の
一方の基板を吸熱面とし、前記基板の他方の基板を放熱
面とした熱電変換素子と、前記放熱面を有する前記基板
が少なくとも下底面を構成する冷媒タンクと、前記冷媒
タンクと連通し、その上方へと延在する複数のチューブ
と、前記複数のチューブ間に固設されるフィンとを有
し、前記冷媒タンク内の冷媒は前記放熱面全体と直接接
触していることを特徴とする熱電変換素子の放熱装置。1. A P-type semiconductor and an N-type semiconductor on two substrates
Are connected in series using the electrodes formed on the
One of the substrates is used as a heat absorbing surface, and the other substrate is radiated.
A thermoelectric conversion element having a surface, a refrigerant tank in which the substrate having the heat-radiating surface constitutes at least a lower bottom surface, a plurality of tubes communicating with the refrigerant tank and extending upward, and the plurality of tubes. Wherein the refrigerant in the refrigerant tank is in direct contact with the entire heat radiation surface.
クが接続されていることを特徴とする請求項１記載の熱
電変換素子の放熱装置。2. The heat dissipation device for a thermoelectric conversion element according to claim 1, wherein a sub-refrigerant tank is connected to upper ends of the plurality of tubes.
記副冷媒タンク、前記チューブへ至って放熱・液化され
るように、前記冷媒タンクと前記副冷媒タンクとの間に
連通管を接続したことを特徴とする請求項２記載の熱電
変換素子の放熱装置。3. The refrigerant in a gas phase in the refrigerant tank is
The sub-refrigerant tank is radiated and liquefied to the tube.
So that between the refrigerant tank and the sub-refrigerant tank
The heat radiating device for a thermoelectric conversion element according to claim 2, wherein a communication pipe is connected .
クとに分割され、両者は接続管により接続されているこ
とを特徴とする請求項２記載の熱電変換素子の放熱装
置。4. The heat radiating device for a thermoelectric conversion element according to claim 2, wherein said refrigerant tank is divided into an upper tank and a lower tank, and both are connected by a connecting pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14438592A JP3235185B2 (en) | 1992-06-04 | 1992-06-04 | Heat dissipation device for thermoelectric conversion element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14438592A JP3235185B2 (en) | 1992-06-04 | 1992-06-04 | Heat dissipation device for thermoelectric conversion element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05343750A JPH05343750A (en) | 1993-12-24 |
| JP3235185B2 true JP3235185B2 (en) | 2001-12-04 |
Family
ID=15360910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14438592A Expired - Fee Related JP3235185B2 (en) | 1992-06-04 | 1992-06-04 | Heat dissipation device for thermoelectric conversion element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3235185B2 (en) |
-
1992
- 1992-06-04 JP JP14438592A patent/JP3235185B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05343750A (en) | 1993-12-24 |
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