JP3225906B2 - Mounting structure and mounting method of surface acoustic wave device - Google Patents
Mounting structure and mounting method of surface acoustic wave deviceInfo
- Publication number
- JP3225906B2 JP3225906B2 JP31412397A JP31412397A JP3225906B2 JP 3225906 B2 JP3225906 B2 JP 3225906B2 JP 31412397 A JP31412397 A JP 31412397A JP 31412397 A JP31412397 A JP 31412397A JP 3225906 B2 JP3225906 B2 JP 3225906B2
- Authority
- JP
- Japan
- Prior art keywords
- acoustic wave
- mounting
- surface acoustic
- wiring board
- wave device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、機能面に櫛形電極
と接続パッドが形成された表面弾性波素子を、接着用の
樹脂と金属製のバンプを介して配線基板に実装する表面
弾性波素子の実装方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface acoustic wave device in which a comb-shaped electrode and a connection pad are formed on a functional surface and mounted on a wiring board via a bonding resin and a metal bump. It is related to the mounting method.
【０００２】[0002]
【従来の技術】表面弾性波素子等の被実装体を配線基板
等の実装基板に実装した実装構造および実装方法とし
て、特開平４−１５０４０５号に開示されているフリッ
プチップ実装構造が知られている。2. Description of the Related Art As a mounting structure and a mounting method in which a mounting object such as a surface acoustic wave element is mounted on a mounting substrate such as a wiring board, a flip-chip mounting structure disclosed in Japanese Patent Application Laid-Open No. 4-150405 is known. I have.
【０００３】図６は上記した従来の実装構造を示す図で
ある。図６で示すように、機能面１ａに櫛形電極２と接
続パッド４が形成された表面弾性波素子１は、配線基板
６の実装面６ａに機能面１ａを対面させた状態で、バン
プ５を介して電気的，機械的に接続されている。表面弾
性波素子１は、図示しないディスペンサ等より供給され
た粘度の高いシリコン樹脂８′によって周囲がコーティ
ングされているとともに、配線基板６に接着して固定さ
れている。FIG. 6 is a view showing the above-mentioned conventional mounting structure. As shown in FIG. 6, the surface acoustic wave device 1 in which the comb-shaped electrode 2 and the connection pad 4 are formed on the functional surface 1 a has the bumps 5 with the functional surface 1 a facing the mounting surface 6 a of the wiring board 6. Are electrically and mechanically connected. The periphery of the surface acoustic wave device 1 is coated with a high-viscosity silicon resin 8 ′ supplied from a dispenser (not shown) or the like, and is adhered and fixed to the wiring board 6.
【０００４】図７は、図６に示す実装構造を得るための
従来の実装方法を説明する実装工程図である。図示する
ように、この実装方法は、ウェハ上に複数個形成された
表面弾性波素子１の、機能面１ａの入出力端子およびグ
ランド端子となる接続パッド４上にバンプ５を形成する
バンプ形成工程３１と、ウェハを切断して個々の表面弾
性波素子１に分割するダイシング工程３２と、実装する
表面弾性波素子１の個々に応じて接続パッド７が形成さ
れた配線基板６の実装面６ａに表面弾性波素子１の機能
面１ａを対面させ、表面弾性波素子１のバンプ５と配線
基板６の接続パッド７との位置を合わせ、表面弾性波素
子１を配線基板６上に載置するマウント工程３３と、接
着用のシリコン樹脂８′を供給して表面弾性波素子１を
配線基板６に接着して固定するシリコン樹脂供給工程３
４とからなっている。FIG. 7 is a mounting process diagram for explaining a conventional mounting method for obtaining the mounting structure shown in FIG. As shown in the drawing, this mounting method includes a bump forming step of forming bumps 5 on connection pads 4 serving as input / output terminals and ground terminals of a functional surface 1a of a plurality of surface acoustic wave devices 1 formed on a wafer. 31; a dicing step 32 for cutting the wafer into individual surface acoustic wave elements 1; and a mounting surface 6a of the wiring board 6 on which the connection pads 7 are formed in accordance with each of the surface acoustic wave elements 1 to be mounted. The functional surface 1a of the surface acoustic wave device 1 faces, the bumps 5 of the surface acoustic wave device 1 are aligned with the connection pads 7 of the wiring substrate 6, and the surface acoustic wave device 1 is mounted on the wiring substrate 6. Step 33, a silicon resin supply step 3 of supplying a bonding silicon resin 8 'to bond and fix the surface acoustic wave element 1 to the wiring board 6;
It consists of four.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上記し
た従来の実装構造およびその実装方法によると、配線基
板６に表面弾性波素子１を実装した後に表面弾性波素子
１の外側からシリコン樹脂８′を供給して配線基板６と
表面弾性波素子１を接着しているため、構造全体の大き
さが表面弾性波素子１よりもかなり大きくなってしまう
という問題がある。また、シリコン樹脂５の大部分が表
面弾性体素子１よりはみ出してしまい、その結果シリコ
ン樹脂の使用量も多くなって製造コストが高くなるとい
う問題もある。However, according to the conventional mounting structure and the mounting method described above, after the surface acoustic wave device 1 is mounted on the wiring board 6, the silicon resin 8 'is removed from the outside of the surface acoustic wave device 1. Since the wiring board 6 and the surface acoustic wave device 1 are supplied and bonded, there is a problem that the size of the entire structure becomes considerably larger than the surface acoustic wave device 1. Further, most of the silicon resin 5 protrudes from the surface elastic body element 1, resulting in a problem that the amount of the silicon resin used increases and the manufacturing cost increases.
【０００６】さらに、実装構造体の全体に温度変化が繰
り返し加わると、表面弾性波素子１と配線基板６の膨張
率の違いによる応力が表面弾性波素子１側のバンプと配
線基板６側の接続パッド７との接続部分に直接付加さ
れ、当該部分で疲労破壊を生じやすいという問題があ
る。また、落下時の衝撃によっても前記接続部分に破損
が生じやすく、信頼性に劣るという問題がある。さら
に、表面弾性波素子１のマウントを個々の実装構造ごと
に行っているため、マウント工程３３における作業効率
が低く、製造コストが高くなるという問題もある。Further, when a temperature change is repeatedly applied to the entire mounting structure, a stress due to a difference in expansion coefficient between the surface acoustic wave element 1 and the wiring board 6 causes a connection between the bump on the surface acoustic wave element 1 side and the wiring board 6 side. There is a problem in that it is directly added to the connection portion with the pad 7 and fatigue failure is likely to occur in the connection portion. In addition, there is a problem that the connection portion is easily damaged by an impact at the time of dropping, resulting in poor reliability. Further, since the mounting of the surface acoustic wave device 1 is performed for each mounting structure, there is a problem that the work efficiency in the mounting step 33 is low and the manufacturing cost is high.
【０００７】この場合、シリコン樹脂２６に代えてエポ
キシ樹脂等他の樹脂を使用し、表面弾性波素子１と配線
基板６との間の間隙に樹脂を浸透させ、前記接続部分の
周囲に樹脂を充填することも考えられるが、樹脂の粘度
によっては毛管現象により表面弾性波素子１と配線基板
６との間の振動空間９内にまで樹脂が浸透してしまい、
表面弾性波素子１の機能面１ａの振動伝搬部に樹脂が付
着して適切な振動空間の形状を得ることが困難になると
いう問題がある。In this case, another resin such as an epoxy resin is used instead of the silicon resin 26, and the resin penetrates into the gap between the surface acoustic wave element 1 and the wiring board 6, and the resin is spread around the connection portion. Although it is conceivable to fill the resin, depending on the viscosity of the resin, the resin penetrates into the vibration space 9 between the surface acoustic wave device 1 and the wiring board 6 due to a capillary phenomenon,
There is a problem that the resin adheres to the vibration propagating portion of the functional surface 1a of the surface acoustic wave device 1 and it becomes difficult to obtain an appropriate shape of the vibration space.
【０００８】本発明は上記の問題点にかんがみてなされ
たものであり、実装構造全体の大きさを小型なものにす
ることができ、かつ、繰り返しの温度変化や落下等の衝
撃によっても容易に前記接続部分が破損することがな
く、長期にわたって安定的な動作を得ることができる信
頼性の高い実装構造を得ることができ、マウント工程に
おいても作業性を向上させ、製造コストを低減させて安
価な実装構造を得ることができる実装方法を提供するこ
とを目的とする。The present invention has been made in view of the above problems, and can reduce the size of the entire mounting structure, and can be easily performed even by repeated temperature changes and impacts such as dropping. It is possible to obtain a highly reliable mounting structure that can obtain a stable operation for a long time without breaking the connection portion, improve workability even in the mounting process, reduce manufacturing cost, and reduce cost It is an object of the present invention to provide a mounting method capable of obtaining a simple mounting structure.
【０００９】[0009]
【課題を解決するための手段】上記目的を達成するため
に、請求項１記載の表面弾性波素子の実装方法は、振動
伝搬部を有する表面弾性波素子の機能面を、配線基板の
実装面に所定間隔離間させて対面させ、前記機能面の振
動伝搬部と前記実装面との間の振動空間を保持した状態
で前記機能面と前記実装面との間の間隙に樹脂を充填し
て前記表面弾性波素子を前記配線基板に実装してなる表
面弾性波素子の実装構造体の実装方法において、表面弾
性波素子集合体上に複数形成された前記表面弾性波素子
の前記機能面にバンプを形成する工程と、前記振動面の
全面又は一部に保護膜を形成する工程と、前記機能面あ
るいは前記実装面の少なくとも一方に感光性樹脂を供給
する工程と、前記感光性樹脂を露光，現像処理して部分
的に前記感光性樹脂を前記機能面または前記実装面から
除去し、前記振動空間を形成する工程と、前記表面弾性
波素子集合体と前記配線基板が複数形成された配線基板
集合体とを所定間隔離間させて前記機能面と前記実装面
とを対面させ、位置合わせする工程と、前記表面弾性波
素子集合体を前記配線基板集合体の実装面に加圧しなが
ら押し付け、加圧しながら加熱あるいは光を照射するこ
とにより前記感光性樹脂を硬化させ、前記表面弾性波素
子を前記配線基板に実装する工程と、表面弾性波素子集
合体及び前記配線基板集合体を、前記配線基板と前記表
面弾性波素子の外周縁とが一致するように、ダイシング
により個々に分割する工程とを有する方法としてある。According to a first aspect of the present invention, there is provided a method of mounting a surface acoustic wave device, comprising: mounting a surface of a surface acoustic wave device having a vibration propagation portion on a mounting surface of a wiring board; The gap between the functional surface and the mounting surface is filled with resin while maintaining a vibration space between the vibration propagating portion of the functional surface and the mounting surface, and In the method of mounting a surface acoustic wave element mounting structure in which a surface acoustic wave element is mounted on the wiring board, a bump is formed on the functional surface of the surface acoustic wave element formed on a plurality of surface acoustic wave element assemblies. Forming, forming a protective film on the entire or a part of the vibrating surface, supplying photosensitive resin to at least one of the functional surface or the mounting surface, exposing and developing the photosensitive resin. Process and partially treat the photosensitive tree Removing from the functional surface or the mounting surface to form the vibration space, and separating the surface acoustic wave element aggregate and the wiring substrate aggregate on which the plurality of wiring substrates are formed by a predetermined distance. A step of positioning the surface and the mounting surface to face each other, and aligning the surface acoustic wave element assembly while pressing the surface acoustic wave element assembly against the mounting surface of the wiring board assembly, and heating or irradiating light while applying the pressure. Curing the photosensitive resin and mounting the surface acoustic wave element on the wiring board; and a surface acoustic wave element assembly and the wiring board assembly, the wiring board and the outer peripheral edge of the surface acoustic wave element. And a step of individually dividing by dicing so as to coincide with each other.
【００１０】これにより、実装構造体を小型なものにす
ることができ、実装工程（マウント工程）においても作
業効率が向上して実装構造体の製造コストを安価なもの
にすることができる。また、感熱性樹脂が振動空間の周
囲を取り囲んで塵埃や水分の侵入を防止するので、より
信頼性の高い実装構造体を得ることができる。[0010] This makes it possible to reduce the size of the mounting structure, improve work efficiency in the mounting step (mounting step), and reduce the manufacturing cost of the mounting structure. In addition, since the heat-sensitive resin surrounds the periphery of the vibration space to prevent dust and moisture from entering, a more reliable mounting structure can be obtained.
【００１１】請求項２記載の表面弾性波素子の実装方法
は、請求項１に記載の表面弾性波素子の実装構造体の実
装方法において、前記表面弾性波素子集合基板がウェハ
である方法としてある。According to a second aspect of the present invention, in the method of mounting a surface acoustic wave element mounting structure according to the first aspect, the surface acoustic wave element assembly substrate is a wafer. .
【００１２】請求項３記載の表面弾性波素子の実装方法
は、請求項１または請求項２に記載の表面弾性波素子の
実装構造体の実装方法において、表面弾性波素子の前記
機能面と前記配線基板の前記実装面との間の間隙に、複
数種類の樹脂からなる樹脂層を形成し、前記樹脂層のう
ち、前記振動伝搬部に面した樹脂を感光性樹脂として、
この感光性樹脂を露光，現像処理にすることにより前記
振動空間を形成した方法としてある。これにより、高価
な感熱性樹脂の使用量を減らしてより安価に実装構造体
を製造することができる。According to a third aspect of the present invention, there is provided a method of mounting a surface acoustic wave element according to the first or second aspect, wherein the functional surface of the surface acoustic wave element and the functional surface of the surface acoustic wave element are connected to each other. In the gap between the mounting surface of the wiring board, a resin layer made of a plurality of types of resin is formed, and among the resin layers, a resin facing the vibration propagation portion is a photosensitive resin.
The photosensitive space is formed by exposing and developing the photosensitive resin to form the vibration space. Thus, the mounting structure can be manufactured at a lower cost by reducing the amount of the expensive thermosensitive resin used.
【００１３】[0013]
【００１４】[0014]
【００１５】[0015]
【００１６】[0016]
【００１７】[0017]
【００１８】[0018]
【００１９】[0019]
【００２０】[0020]
【００２１】[0021]
【００２２】[0022]
【００２３】[0023]
【００２４】[0024]
【００２５】[0025]
【発明の実施の形態】以下、本発明の表面弾性波素子の
実装構造および実装方法の一実施形態について、図面を
参照しつつ説明する。図１は本発明の表面弾性波素子の
実装構造についての第１の実施形態を示す断面図であ
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a mounting structure and a mounting method of a surface acoustic wave device according to the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing a first embodiment of a mounting structure of a surface acoustic wave device according to the present invention.
【００２６】表面弾性波素子１の機能面１ａには、櫛形
電極２および入出力端子およびグランド端子となる接続
パッド４が形成されている。この実施形態においては、
防塵または防水のために、機能面１ａに櫛形電極２およ
び接続パッド４を被覆するように保護膜３が形成されて
いるが、防水や防塵の必要が特にない場合等には保護膜
３は設けなくても、また部分的に設けるものとしてもよ
い。保護膜３としては、絶縁性や耐水性に優れ、製造コ
ストが安価であるＳｉ，ＳｉＯ2，ＳｉＮ等のシリコン
（Ｓｉ）系のものを用いることが好ましい。また、保護
膜３の厚みは櫛形電極２や接続パッド４を被覆できる程
度、通常は０．０１μm ないし０．２μm の範囲内であ
れば十分である。On the functional surface 1a of the surface acoustic wave element 1, a comb-shaped electrode 2 and connection pads 4 serving as input / output terminals and ground terminals are formed. In this embodiment,
A protective film 3 is formed on the functional surface 1a so as to cover the comb-shaped electrode 2 and the connection pad 4 for dust protection or waterproofing. However, the protective film 3 is provided when there is no particular need for waterproofing or dustproofing. They may not be provided, or may be provided partially. As the protective film 3, it is preferable to use a silicon (Si) -based material such as Si, SiO 2 , or SiN, which has excellent insulating properties and water resistance and is inexpensive to manufacture. The thickness of the protective film 3 is sufficient to cover the comb-shaped electrode 2 and the connection pad 4, and is usually sufficient if it is in the range of 0.01 μm to 0.2 μm.
【００２７】接続パッド４上の所定位置には、金属製の
バンプ５が形成されている。一方、配線基板６には、実
装面６ａに接続パッド７が形成されている。配線基板６
としては、安価なガラスエポキシ基板の他、セラミック
基板、ガラス基板、フレキシブル基板などを使用するこ
とができる。表面弾性波素子１は、配線基板５に対面し
て配置されているとともに、配線基板５に形成された接
続パッド７にバンプ５が当接して電気的に接続されてい
る。At a predetermined position on the connection pad 4, a metal bump 5 is formed. On the other hand, the connection pads 7 are formed on the mounting surface 6 a of the wiring board 6. Wiring board 6
For example, in addition to an inexpensive glass epoxy substrate, a ceramic substrate, a glass substrate, a flexible substrate, or the like can be used. The surface acoustic wave element 1 is arranged so as to face the wiring board 5, and the bump 5 is in contact with the connection pad 7 formed on the wiring board 5 to be electrically connected.
【００２８】表面弾性波素子１と配線基板５との間の間
隙には樹脂８が充填され、表面弾性波素子１と配線基板
５とを接着している。表面弾性波素子１と配線基板５は
ほぼ同一大きさおよび形状に形成されていて、接着状態
において各々の外周部が一致している。また、表面弾性
波素子１の櫛形電極２が形成された振動伝搬部と配線基
板５との間は、樹脂８が部分的に取り除かれて振動空間
９が形成されている。The gap between the surface acoustic wave device 1 and the wiring board 5 is filled with a resin 8, and the surface acoustic wave device 1 and the wiring board 5 are bonded to each other. The surface acoustic wave device 1 and the wiring board 5 are formed in substantially the same size and shape, and their outer peripheral portions coincide in the bonded state. The resin 8 is partially removed between the vibration propagation portion of the surface acoustic wave device 1 where the comb-shaped electrode 2 is formed and the wiring board 5 to form a vibration space 9.
【００２９】なお、樹脂８としては、光の照射によって
重合または架橋して不溶化する性質を有し、加熱によっ
て接着性および硬化性を有する感光性樹脂を使用するこ
とにより、本発明の実装構造を形成することが容易にな
る。また、櫛形電極２や接続パッド４は、コストが安価
で表面弾性波素子１の特性を得やすいアルミニウム（Ａ
ｌ）で形成すること望ましいが、これに限られるもので
なく、他の導電材料で形成するものとしてもよい。The mounting structure of the present invention can be realized by using a photosensitive resin which has a property of being polymerized or crosslinked to be insolubilized by light irradiation and having adhesiveness and curability by heating. It becomes easy to form. In addition, the comb-shaped electrode 2 and the connection pad 4 are made of aluminum (A
Although it is desirable to form it in 1), it is not limited to this, and it may be formed of another conductive material.
【００３０】このように構成された表面弾性波素子１の
実装構造によれば、表面弾性波素子１と配線基板５の外
周部が一致していて、かつ、接着用の樹脂８も実装構造
の外側にはみ出さないので、実装構造全体の大きさを表
面弾性波素子１とほぼ同じ大きさまで小型化することが
できる。また、表面弾性波素子１側のバンプ５と配線基
板６側の接続パッド７との接続部分が周囲から樹脂８に
よって被覆されているので、繰り返しの温度変化や落下
時の衝撃等によって容易に接続部分が破損するというこ
とがなく、長期にわたって安定的に動作する信頼性の高
い実装構造を得ることができる。また、保護膜３を形成
したものは、塵埃や水分が接続パッド４や櫛形電極２に
付着することを防止して、実装構造体の信頼性をより向
上させることができる。According to the mounting structure of the surface acoustic wave device 1 configured as described above, the surface acoustic wave device 1 and the outer peripheral portion of the wiring board 5 coincide with each other, and the bonding resin 8 also has the mounting structure. Since it does not protrude outside, the size of the entire mounting structure can be reduced to approximately the same size as the surface acoustic wave device 1. In addition, since the connection between the bump 5 on the surface acoustic wave element 1 and the connection pad 7 on the wiring board 6 is covered with the resin 8 from the surroundings, the connection can be easily made by repeated temperature changes, impacts at the time of drop, and the like. It is possible to obtain a highly reliable mounting structure that operates stably for a long period of time without the parts being damaged. In addition, the protection film 3 prevents dust and moisture from adhering to the connection pad 4 and the comb-shaped electrode 2, thereby further improving the reliability of the mounting structure.
【００３１】なお、この発明の表面弾性波素子１の実装
構造は上記の実施形態のものに限られない。図２および
図３は、本発明の他の実施形態にかかるもので、その断
面を示したものである。図２に示す実装構造では、樹脂
８をバンプ５と接続パッド７の接続部分の外側近傍に枠
状に被覆している。この実施形態のものは、表面弾性波
素子１と配線基板６との熱膨張係数の差が小さく、温度
変化により前記接続部分に付加される応力が小さい場合
に適している。この実施形態によれば、樹脂８の使用量
が極めて少なくて済むので、製造コストを安価なものに
することができるという効果がある。The mounting structure of the surface acoustic wave device 1 according to the present invention is not limited to the above embodiment. 2 and 3 relate to another embodiment of the present invention, and show a cross section thereof. In the mounting structure shown in FIG. 2, the resin 8 is coated in a frame shape near the outside of the connection portion between the bump 5 and the connection pad 7. This embodiment is suitable when the difference in the coefficient of thermal expansion between the surface acoustic wave device 1 and the wiring board 6 is small, and the stress applied to the connection portion due to a temperature change is small. According to this embodiment, since the amount of the resin 8 used is extremely small, there is an effect that the manufacturing cost can be reduced.
【００３２】図３に示す実施形態では、配線基板６の実
装面６ａには、表面弾性波素子１側から順に第１の樹脂
である感光性樹脂１０，第２の樹脂である異方導電性樹
脂１１が層状に塗布されて樹脂層を形成している。そし
て、前記と同様、露光，現像処理により感光性樹脂１０
の一部を除去して、櫛形電極２を含む振動伝搬部に振動
空間が形成されるようになっている。前記した異方導電
性樹脂１１は、導体で挟み込まれた方向、この場合に
は、表面弾性波素子１および配線基板６に直交する方向
には導電性を有するが、配線基板６に平行な方向には導
電性を有しない性質のものである。In the embodiment shown in FIG. 3, on the mounting surface 6a of the wiring board 6, a photosensitive resin 10 as a first resin and an anisotropic conductive material as a second resin are sequentially provided from the surface acoustic wave device 1 side. The resin 11 is applied in layers to form a resin layer. Then, as described above, the photosensitive resin 10 is exposed to light and developed.
Is removed so that a vibration space is formed in the vibration propagation section including the comb-shaped electrode 2. The anisotropic conductive resin 11 has conductivity in a direction sandwiched by the conductors, in this case, in a direction orthogonal to the surface acoustic wave device 1 and the wiring board 6, but in a direction parallel to the wiring board 6. Has a non-conductive property.
【００３３】この実施形態によれば、配線基板６側の接
続パッド７も異方導電性樹脂１１によって被覆されるの
で、塵埃や水分の侵入による故障を防止することがで
き、より信頼性の高い実装構造を得ることができる。な
お、異方導電性樹脂１１から導電性粒子を取り除いた絶
縁樹脂を代わりに用いることとしてもよい。According to this embodiment, since the connection pads 7 on the wiring board 6 side are also covered with the anisotropic conductive resin 11, it is possible to prevent a failure due to intrusion of dust or moisture, and to achieve higher reliability. A mounting structure can be obtained. Note that an insulating resin obtained by removing conductive particles from the anisotropic conductive resin 11 may be used instead.
【００３４】図４は、図１ないし図３に示す表面弾性波
素子１の実装構造を得るための実装方法を示すもので、
その工程図である。機能面１ａを保護膜３で被覆する場
合は、ウェハ上に複数形成された表面弾性波素子１の機
能面１ａのうち、バンプ５を形成する部分を除く全面ま
たは櫛形電極２を有する部分等の部分的に、スパッタリ
ング法や真空蒸着法等により保護膜３を形成する（図４
において１１）。保護膜３としてはＳｉ，ＳｉＯ2，Ｓ
ｉＮ等の膜であることが好ましく、膜厚も櫛形電極２や
接続パッド４を被覆できる程度の厚み、通常は０．０１
μm ないし０．２μm の範囲であればよい。FIG. 4 shows a mounting method for obtaining the mounting structure of the surface acoustic wave device 1 shown in FIGS.
FIG. When the functional surface 1a is covered with the protective film 3, the functional surface 1a of the plurality of surface acoustic wave devices 1 formed on the wafer, such as the entire surface excluding the portion where the bump 5 is formed or the portion having the comb-shaped electrode 2 or the like. The protective film 3 is partially formed by a sputtering method, a vacuum evaporation method, or the like.
11). The protective film 3 is made of Si, SiO 2 , S
It is preferably a film of iN or the like, and has a thickness enough to cover the comb-shaped electrode 2 and the connection pad 4, usually 0.01
It may be in the range of μm to 0.2 μm.
【００３５】次に、表面弾性波素子１の機能面１ａに形
成された入出力端子およびグランド端子となる接続パッ
ド４上に、メッキ法やワイヤボンディング法，転写バン
プ法等により、金（Ａｕ）等の金属でバンプ５を形成す
る（同１２）。この後、スピンコート法や印刷法によ
り、感光性樹脂８をウェハ全面に１０〜１００μm の厚
さで塗布する（同１３）。この場合、塗布する感光性樹
脂８の厚さは、マウント後のバンプ５の高さとほぼ同一
高さでなければならない。また、感光性樹脂８は、光の
照射によって重合または架橋して不溶化する性質を有す
るものであればよい。感光性樹脂の一例としては、フィ
ルム状のもので、硬化後のガラス転移温度が摂氏３００
度，フィラーなしの状態での膨張係数が７０［×１０-6
／度］のものを使用できる。Next, gold (Au) is formed on the connection pads 4 serving as input / output terminals and ground terminals formed on the functional surface 1a of the surface acoustic wave device 1 by plating, wire bonding, transfer bumping, or the like. The bumps 5 are formed of such a metal (12). Thereafter, the photosensitive resin 8 is applied to the entire surface of the wafer in a thickness of 10 to 100 μm by spin coating or printing (13). In this case, the thickness of the photosensitive resin 8 to be applied must be substantially the same as the height of the bump 5 after mounting. In addition, the photosensitive resin 8 may be any resin that has a property of being insolubilized by polymerization or crosslinking by light irradiation. An example of the photosensitive resin is a film-like resin having a glass transition temperature of 300 degrees Celsius after curing.
Every time, the expansion coefficient in the state without a filler 70 [× 10- 6
/ Degree].
【００３６】この感光性樹脂にＳｉＯ2等のフィラーを
混合することにより、熱膨張係数は２２〜７０［×１０
-6／度］の範囲内で調整が可能になり、表面弾性波素子
１や配線基板６の熱膨張係数に応じて選択が可能にな
る。なお、感光性樹脂８は、硬化後のガラス転移点温度
が摂氏２００〜３１０度の範囲内で適宜に選択すること
ができる。この感光性樹脂８に露光，現像処理を施すこ
とにより、櫛形電極２を含む振動伝搬部を覆っている感
光性樹脂８を部分的に除去して振動空間９を形成する
（同１４）。By mixing the photosensitive resin with a filler such as SiO 2 , the coefficient of thermal expansion is from 22 to 70 [× 10
−6 / degree], and can be selected in accordance with the coefficient of thermal expansion of the surface acoustic wave device 1 and the wiring board 6. In addition, the photosensitive resin 8 can be appropriately selected within a glass transition temperature of 200 to 310 degrees Celsius after curing. By exposing and developing the photosensitive resin 8, the photosensitive resin 8 covering the vibration propagating portion including the comb-shaped electrode 2 is partially removed to form the vibration space 9 (14).
【００３７】マウント工程（同１５）では、表面弾性波
素子１の個々に応じて接続パッド７が形成されたガラス
エポキシ基板，セラミック基板，ガラス基板，フレキシ
ブル基板等の配線基板上に、表面弾性波素子１の機能面
１ａを下向きにして対面させ、バンプ５が配線基板６の
接続パッド７に一致するように表面弾性波素子１の位置
を合わせる。そして、この状態を保持したまま、表面弾
性波素子１を配線基板６上に載置する。このマウント工
程においては、バンプ５と接続パッド７に一バンプ当た
り３０〜１５０ｇの押圧力を付加した状態で、感光性樹
脂８を摂氏２００度以上に加熱して硬化させ、表面弾性
波素子１と配線基板７とを接着する。In the mounting step (15), the surface acoustic wave device is mounted on a wiring substrate such as a glass epoxy substrate, a ceramic substrate, a glass substrate, or a flexible substrate on which connection pads 7 are formed in accordance with the surface acoustic wave device 1. The functional surface 1a of the element 1 is faced downward, and the position of the surface acoustic wave element 1 is adjusted such that the bump 5 coincides with the connection pad 7 of the wiring board 6. Then, while maintaining this state, the surface acoustic wave device 1 is placed on the wiring board 6. In this mounting step, the photosensitive resin 8 is heated and cured at a temperature of 200 ° C. or higher while a pressing force of 30 to 150 g per bump is applied to the bump 5 and the connection pad 7, and the surface acoustic wave element 1 The wiring board 7 is bonded.
【００３８】マウント工程では、ウェハ状の表面弾性波
素子１と、実装面６ａに表面弾性波素子１の個々に応じ
たピッチで接続パッド７が形成された配線基板６が接着
された状態であるので、ダイシング工程において個々の
実装構造体に切り離す必要がある（同１６）。このよう
にして、図１ないし図３に示すような表面弾性波素子１
の実装構造体が得られる。この実装方法によれば、感光
性樹脂８が実装構造体の外側に必要以上にはみだすとい
うことがなく、製造コストを低減することができるほ
か、マウント工程においても複数の実装構造体を一括し
て形成することができるので、作業効率が向上し、製造
コストを低減させることができる。In the mounting step, the wafer-like surface acoustic wave element 1 and the wiring board 6 having the connection pads 7 formed on the mounting surface 6a at a pitch corresponding to each of the surface acoustic wave elements 1 are adhered. Therefore, it is necessary to separate the individual mounting structures in the dicing process (16). Thus, the surface acoustic wave device 1 as shown in FIGS.
Is obtained. According to this mounting method, the photosensitive resin 8 does not protrude unnecessarily outside the mounting structure, the manufacturing cost can be reduced, and a plurality of mounting structures can be packaged together in the mounting process. Since it can be formed, the working efficiency is improved and the manufacturing cost can be reduced.
【００３９】なお、この発明の実装方法は上記のものに
限られず、例えば図５に示すようなフローによっても同
様の実装構造が得られる。図５は実装方法の他の実施形
態を示すものである。この実施形態では、保護膜形成
（工程２１）、バンプ形成工程（同２２）、マウント工
程（２５）、ダイシング工程（同１６）は同様である
が、工程２３，２４で示すように、感光性樹脂８を配線
基板６側に塗布し、露光，現像処理を施すことによって
感光性樹脂８を部分的に除去して振動空間９を形成して
いる点で異なる。It should be noted that the mounting method of the present invention is not limited to the above-described method, and a similar mounting structure can be obtained by, for example, the flow shown in FIG. FIG. 5 shows another embodiment of the mounting method. In this embodiment, the protective film formation (step 21), the bump formation step (22), the mounting step (25), and the dicing step (16) are the same, but as shown in steps 23 and 24, The difference is that the resin 8 is applied to the wiring board 6 side, and the photosensitive resin 8 is partially removed by exposure and development to form a vibration space 9.
【００４０】また、上記の説明では、表面弾性波素子を
複数有するウェハ状態で各工程の処理を行うものとして
説明したが、複数個の表面弾性波素子１が含まれる表面
弾性波素子集合体にて処理を行うものとしてもよい。例
えば、１．５ｍｍ四方の表面弾性波素子１であれば、こ
れを縦横１０個分の表面弾性波素子を有する表面弾性波
素子集合体、つまり１００個分の表面弾性波素子を有す
る１５ｍｍ四方の表面弾性波素子集合体を、１００個分
の接続パッドが形成された配線基板集合体に載置して感
光性樹脂の供給やマウント，ダイシング等の各処理を行
うものとしてもよい。In the above description, it is assumed that each process is performed in a wafer state having a plurality of surface acoustic wave devices.
The described, but a surface that includes a plurality of surface acoustic wave device 1
The processing may be performed by an elastic wave element assembly . For example, in the case of a 1.5 mm square surface acoustic wave device 1, this is a surface acoustic wave having 10 vertical and horizontal surface acoustic wave devices.
An element assembly, that is, a 15 mm square surface acoustic wave element assembly having 100 surface acoustic wave elements is placed on a wiring board assembly on which 100 connection pads are formed, and photosensitive resin is supplied. Each process such as mounting, dicing, and the like may be performed.
【００４１】[0041]
【発明の効果】本発明によれば、実装構造体の大きさを
表面弾性波素子と同等の大きさまで小型化することがで
き、携帯機器等への使用にも適した実装構造体を得るこ
とができる。また、接続バンプの周囲を樹脂によって被
覆することができるので、繰返の温度変化や衝撃等によ
って故障しにくい、信頼性の高い実装構造体を得ること
ができる。さらに、保護膜を機能面の全体または一部に
被覆することによって、塵芥や水分の侵入を防止してよ
り信頼性の高い実装構造体をうることができる。According to the present invention, the size of the mounting structure can be reduced to the same size as that of the surface acoustic wave device, and a mounting structure suitable for use in portable equipment and the like can be obtained. Can be. In addition, since the periphery of the connection bump can be covered with the resin, a highly reliable mounting structure that is less likely to fail due to repeated temperature changes and impacts can be obtained. Furthermore, by covering the whole or a part of the functional surface with the protective film, it is possible to prevent dust and moisture from entering and to obtain a more reliable mounting structure.
【００４２】また、本発明の実装方法によれば、配線基
板に効率よく表面弾性波素子を実装することができ、表
面弾性波素子の実装構造体を安価に生産することができ
るほか、表面弾性波素子を配線基板に実装する実装工程
においても作業の効率化を図ることができる。さらに、
振動空間を周囲から樹脂が密閉する実装構造体が得られ
るので、塵埃や水分の侵入を防止してより信頼性の高い
実装構造体を得ることができる。According to the mounting method of the present invention, the surface acoustic wave device can be efficiently mounted on the wiring board, and the mounting structure of the surface acoustic wave device can be produced at low cost. In the mounting step of mounting the wave element on the wiring board, the efficiency of the operation can be improved. further,
Since a mounting structure in which the vibration space is hermetically sealed from the surroundings is obtained, a more reliable mounting structure can be obtained by preventing dust and moisture from entering.
【図面の簡単な説明】[Brief description of the drawings]
【図１】本発明の表面弾性波素子の実装構造についての
第１の実施形態を示す断面図である。FIG. 1 is a sectional view showing a first embodiment of a mounting structure of a surface acoustic wave device according to the present invention.
【図２】この発明の表面弾性波素子の実装構造体の他の
実施形態を示す断面図である。FIG. 2 is a sectional view showing another embodiment of the mounting structure of the surface acoustic wave device of the present invention.
【図３】この発明の表面弾性波素子の実装構造体の他の
実施形態を示す断面図である。FIG. 3 is a sectional view showing another embodiment of the mounting structure of the surface acoustic wave device according to the present invention.
【図４】表面弾性波素子１の実装構造を得るための実装
方法を示すもので、その工程図である。FIG. 4 is a process diagram showing a mounting method for obtaining a mounting structure of the surface acoustic wave device 1.
【図５】この発明の表面弾性波素子の実装方法の他の実
施形態を示す工程図である。FIG. 5 is a process chart showing another embodiment of the mounting method of the surface acoustic wave device of the present invention.
【図６】従来の実装構造を示す断面図である。FIG. 6 is a cross-sectional view showing a conventional mounting structure.
【図７】従来の実装方法にかかり、その工程図である。FIG. 7 is a process diagram of a conventional mounting method.
１ 表面弾性波素子 １ａ 機能面 ２ 櫛形電極 ３ 保護膜 ４ 接続パッド ５ バンプ ６ 配線基板 ６ａ 実装面 ７ 接続パッド ８，８′樹脂（感光性樹脂） ９ 振動空間 １０ 第１の樹脂層（感光性樹脂） １１ 第２の樹脂層（異方導電性樹脂） DESCRIPTION OF SYMBOLS 1 Surface acoustic wave element 1a Functional surface 2 Comb-shaped electrode 3 Protective film 4 Connection pad 5 Bump 6 Wiring board 6a Mounting surface 7 Connection pad 8, 8 'resin (photosensitive resin) 9 Vibration space 10 First resin layer (photosensitive 11) Second resin layer (anisotropic conductive resin)
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平８−316778（ＪＰ，Ａ) 特開 平８−307197（ＪＰ，Ａ) 特開 平５−90882（ＪＰ，Ａ) 特開 平４−293311（ＪＰ，Ａ) 特開 平２−141113（ＪＰ，Ａ) 特開 昭62−173813（ＪＰ，Ａ) 特開 昭55−109018（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H03H 3/00 - 3/10 H03H 9/145 H03H 9/25 ──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-8-316778 (JP, A) JP-A-8-307197 (JP, A) JP-A-5-90882 (JP, A) JP-A-4- 293311 (JP, A) JP-A-2-141113 (JP, A) JP-A-62-173813 (JP, A) JP-A-55-109018 (JP, A) (58) Fields investigated (Int. 7 , DB name) H03H 3/00-3/10 H03H 9/145 H03H 9/25
Claims (3)
能面を、配線基板の実装面に所定間隔離間させて対面さ
せ、前記機能面の振動伝搬部と前記実装面との間の振動
空間を保持した状態で前記機能面と前記実装面との間の
間隙に樹脂を充填して前記表面弾性波素子を前記配線基
板に実装してなる表面弾性波素子の実装構造体の実装方
法において、 表面弾性波素子集合体上に複数形成された前記表面弾性
波素子の前記機能面にバンプを形成する工程と、 前記振動面の全面又は一部に保護膜を形成する工程と、 前記機能面あるいは前記実装面の少なくとも一方に感光
性樹脂を供給する工程と、 前記感光性樹脂を露光，現像処理して部分的に前記感光
性樹脂を前記機能面または前記実装面から除去し、前記
振動空間を形成する工程と、 前記表面弾性波素子集合体と前記配線基板が複数形成さ
れた配線基板集合体とを所定間隔離間させて前記機能面
と前記実装面とを対面させ、位置合わせする工程と、 前記表面弾性波素子集合体を前記配線基板集合体の実装
面に加圧しながら押し付け、加圧しながら加熱あるいは
光を照射することにより前記感光性樹脂を硬化させ、前
記表面弾性波素子を前記配線基板に実装する工程と、 表面弾性波素子集合体及び前記配線基板集合体を、前記
配線基板と前記表面弾性波素子の外周縁とが一致するよ
うに、ダイシングにより個々に分割する工程と、 を有することを特徴とする表面弾性波素子の実装構造体
の実装方法。1. A functioning surface of a surface acoustic wave device having a vibration propagating portion is opposed to a mounting surface of a wiring board by a predetermined distance, and a vibration space between the vibration propagating portion of the functional surface and the mounting surface. In a mounting method of a mounting structure of a surface acoustic wave element, wherein a resin is filled in a gap between the functional surface and the mounting surface while holding the surface acoustic wave element, and the surface acoustic wave element is mounted on the wiring board. Forming a bump on the functional surface of the plurality of surface acoustic wave devices formed on the surface acoustic wave device assembly; forming a protective film on the entire or a part of the vibrating surface; Supplying a photosensitive resin to at least one of the mounting surfaces; exposing and developing the photosensitive resin to partially remove the photosensitive resin from the functional surface or the mounting surface; Forming and the surface A step of causing the functional surface and the mounting surface to face each other with a predetermined distance between the surface acoustic wave element assembly and the wiring board assembly on which the plurality of wiring boards are formed; Pressing the pressure-sensitive adhesive against the mounting surface of the wiring board assembly, curing the photosensitive resin by heating or irradiating light while pressing, and mounting the surface acoustic wave element on the wiring board. A step of individually dividing the elastic wave element assembly and the wiring substrate assembly by dicing so that the outer peripheral edge of the surface acoustic wave element coincides with the wiring board. Mounting method of wave element mounting structure.
構造体の実装方法において、前記表面弾性波素子集合基
板がウェハであることを特徴とする表面弾性波素子の実
装方法。2. The method for mounting a surface acoustic wave device according to claim 1, wherein the surface acoustic wave device assembly substrate is a wafer.
の実装構造体の実装方法において、表面弾性波素子の前
記機能面と前記配線基板の前記実装面との間の間隙に、
複数種類の樹脂からなる樹脂層を形成し、前記樹脂層の
うち、前記振動伝搬部に面した樹脂を感光性樹脂とし
て、この感光性樹脂を露光，現像処理にすることにより
前記振動空間を形成したことを特徴とする表面弾性波素
子の実装方法。3. The mounting method for a mounting structure of a surface acoustic wave device according to claim 1, wherein a gap between the functional surface of the surface acoustic wave device and the mounting surface of the wiring board is provided.
Forming a resin layer composed of a plurality of types of resins, forming the vibration space by exposing and developing the photosensitive resin of the resin layer facing the vibration propagation portion as a photosensitive resin. A method of mounting a surface acoustic wave device, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31412397A JP3225906B2 (en) | 1997-11-14 | 1997-11-14 | Mounting structure and mounting method of surface acoustic wave device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31412397A JP3225906B2 (en) | 1997-11-14 | 1997-11-14 | Mounting structure and mounting method of surface acoustic wave device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11150441A JPH11150441A (en) | 1999-06-02 |
| JP3225906B2 true JP3225906B2 (en) | 2001-11-05 |
Family
ID=18049530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31412397A Expired - Fee Related JP3225906B2 (en) | 1997-11-14 | 1997-11-14 | Mounting structure and mounting method of surface acoustic wave device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3225906B2 (en) |
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| US7586240B2 (en) | 2007-01-23 | 2009-09-08 | Fujitsu Media Devices Limited | Acoustic wave device |
| US7629729B2 (en) | 2005-10-04 | 2009-12-08 | Fujitsu Media Devices Limited | Surface acoustic wave device and fabrication method thereof |
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| JP3303791B2 (en) | 1998-09-02 | 2002-07-22 | 株式会社村田製作所 | Electronic component manufacturing method |
| JP2002261582A (en) * | 2000-10-04 | 2002-09-13 | Matsushita Electric Ind Co Ltd | Surface acoustic wave device, its manufacturing method, and circuit module using the same |
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| JP2006217226A (en) * | 2005-02-03 | 2006-08-17 | Matsushita Electric Ind Co Ltd | Surface acoustic wave element and manufacturing method thereof |
| JP2006217225A (en) * | 2005-02-03 | 2006-08-17 | Matsushita Electric Ind Co Ltd | Manufacturing method of surface acoustic wave device |
| JP4657002B2 (en) * | 2005-05-12 | 2011-03-23 | 信越化学工業株式会社 | Composite piezoelectric substrate |
| US9021669B2 (en) * | 2006-08-07 | 2015-05-05 | Kyocera Corporation | Method for manufacturing surface acoustic wave apparatus |
| JP4521451B2 (en) * | 2008-03-24 | 2010-08-11 | 富士通メディアデバイス株式会社 | Surface acoustic wave device and manufacturing method thereof |
| JP2010245704A (en) * | 2009-04-02 | 2010-10-28 | Sumitomo Bakelite Co Ltd | Substrate for surface acoustic wave device and surface acoustic wave device |
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- 1997-11-14 JP JP31412397A patent/JP3225906B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7629729B2 (en) | 2005-10-04 | 2009-12-08 | Fujitsu Media Devices Limited | Surface acoustic wave device and fabrication method thereof |
| US7586240B2 (en) | 2007-01-23 | 2009-09-08 | Fujitsu Media Devices Limited | Acoustic wave device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11150441A (en) | 1999-06-02 |
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