JP3220606U - Surface plate for polishing apparatus and polishing apparatus - Google Patents
Surface plate for polishing apparatus and polishing apparatus Download PDFInfo
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Abstract
【課題】粘着剤を備える一般的な研磨パッドを利用する研磨装置において、従来よりも研磨パッドの固定作業及び交換作業を容易にすることができるものを明らかにする。
【解決手段】本考案は、研磨装置に用いられ、研磨パッドが貼付けられる定盤において、定盤本体と、前記定盤本体の前記研磨パッドが貼付けられる面に形成された離型フィルム又は離型紙からなる離型層と、を含み、前記離型層は、表面の剥離力が０．０８Ｎ／５０ｍｍ以上５．０Ｎ／５０ｍｍ以下であることを特徴とする研磨装置用の定盤に関する。
【選択図】図２A polishing apparatus using a general polishing pad provided with a pressure-sensitive adhesive, which is capable of facilitating a fixing operation and a replacement operation of the polishing pad as compared with the conventional one is clarified.
The present invention relates to a platen used in a polishing apparatus and to which a polishing pad is attached, and a release film or release paper formed on a platen main body and a surface of the platen main body on which the polishing pad is attached. And a mold release layer comprising the mold release layer, wherein the release layer has a surface peel force of 0.08 N / 50 mm or more and 5.0 N / 50 mm or less.
[Selected figure] Figure 2
Description
本考案は、半導体部品、電子部品等で使用される半導体ウエハ等の研磨工程で使用される研磨装置用の定盤（プラテン）に関する。詳しくは、研磨工程の際に研磨パッドを貼り付けるための定盤であって、研磨パッドの交換を効率的に行うことができる定盤に関する。 The present invention relates to a platen for a polishing apparatus used in a polishing process of semiconductor wafers and the like used in semiconductor parts, electronic parts and the like. More specifically, the present invention relates to a platen for attaching a polishing pad during a polishing process, which can efficiently replace the polishing pad.
半導体ウエハ、ディスプレイ用ガラス基板、ハードディスク用基板といった半導体部品、電子部品の製造プロセスにおいて、その表面の平坦化、鏡面化のための研磨工程を組み込むことが一般的となっている。図１は、一般的な研磨装置及びそれによる研磨工程の概要を説明する図である。研磨工程においては、研磨パッドを研磨装置に固定した後、ウエハ等の被研磨部材を研磨パッドに押圧し研磨スラリーを供給しながら、両者を相対的に摺動させて研磨を行っている。 BACKGROUND OF THE INVENTION In the process of manufacturing semiconductor components such as semiconductor wafers, glass substrates for displays, substrates for hard disks, and electronic components, it is common to incorporate a polishing step for flattening and mirror-finishing of the surface. FIG. 1 is a view for explaining an outline of a general polishing apparatus and a polishing process performed thereby. In the polishing step, after the polishing pad is fixed to the polishing apparatus, a member to be polished such as a wafer is pressed against the polishing pad to supply the polishing slurry, and both are relatively slid to perform polishing.
研磨パッドの固定に際しては、予め粘着テープ等の粘着剤を研磨パッドに接合し、粘着剤を介して研磨装置の定盤に貼り付けている（図１）。尚、研磨パッドを貼り付ける定盤の部位について、定盤本体又はプラテンと称されることがある。 When fixing the polishing pad, an adhesive such as an adhesive tape is bonded to the polishing pad in advance and attached to the surface plate of the polishing apparatus via the adhesive (FIG. 1). In addition, about the site | part of the surface plate which sticks a polishing pad, it may be called a surface plate main body or a platen.
粘着剤による研磨パッドの固定方法については、研磨パッドの交換作業で手間がかかり、研磨工程の作業効率を大きく低下させる要因となっていた。即ち、研磨パッドの交換では、古い研磨パッドを定盤から剥がす必要があるが、そのときに定盤に粘着剤が残る場合がある。そして、新しい研磨パッドの固定前に、定盤に残った粘着剤を溶剤等で除去し清掃する工程が必要となり、交換作業を手間取らせるものであった。 With regard to the method of fixing the polishing pad with the adhesive, it takes time and effort in the replacement operation of the polishing pad, and this has been a factor that greatly reduces the working efficiency of the polishing process. That is, in the replacement of the polishing pad, it is necessary to remove the old polishing pad from the platen, but at that time, the adhesive may remain on the platen. Then, before the new polishing pad is fixed, a step of removing the adhesive remaining on the surface plate with a solvent or the like for cleaning is required, which takes time and effort for replacement work.
本願出願人は、上記従来の粘着剤による研磨パッドの固定方法に対し、所定の吸着材を利用した研磨パッドを提案している（特許文献１）。この研磨パッドは、定盤への貼り付け面に所定構成のシリコーン組成物からなる吸着材を設けたものである。この吸着材は、文字通りその吸着作用により研磨パッドを定盤に固定させるものであり、定盤から剥がした後でも残留物が生じない。また、この研磨パッドは、剥がした後でも再貼り付けが可能で再固定もスムーズに行うことができ、交換作業を効率的に行うことができる。そして、研磨作業の効率化を図ることができる。 The applicant of the present invention has proposed a polishing pad using a predetermined adsorbing material, as opposed to the conventional fixing method of the polishing pad with a pressure-sensitive adhesive (Patent Document 1). This polishing pad is provided with an adsorbent made of a silicone composition of a predetermined configuration on the surface to be attached to a surface plate. This adsorbent literally fixes the polishing pad to the surface plate by its adsorbing action, and no residue is produced even after peeling off the surface plate. Further, the polishing pad can be re-attached even after being peeled off, and re-fixing can be performed smoothly, so that replacement work can be performed efficiently. And, the efficiency of the polishing operation can be improved.
上記の吸着材が付属された研磨パッドの有用性は確かなものであり、その普及が待たれるところであった。しかし、現実には、従来の粘着剤を備える研磨パッドの使用例の方が未だ多いのが実情である。そのため、本出願人としては、上記の吸着材付の研磨パッドの利用拡大を図りつつ、従来の粘着剤付の研磨パッドに取扱い性向上への対応も考慮すべきと考えた。 The usefulness of the polishing pad attached with the above-mentioned adsorbent is certain, and its spread has been awaited. However, in reality, the use of polishing pads provided with conventional adhesives is still more common. Therefore, the present applicant considered that the handling of the conventional polishing pad with a pressure sensitive adhesive should be considered while expanding the utilization of the polishing pad with the above-mentioned adsorbent.
そこで、本考案は、粘着剤を備える研磨パッドを利用する場合において、従来よりも研磨パッドの固定作業及び交換作業を容易にすることができる研磨装置の構成を明らかにする。 Therefore, the present invention reveals the configuration of a polishing apparatus that can make the fixing operation and the replacement operation of the polishing pad easier than in the past when using a polishing pad provided with an adhesive.
粘着剤を備える研磨パッドに従来の問題の要因があるとしても、その構成等を改良することは必ずしも優先すべきことではない。粘着剤を備える研磨パッドの改良によって課題解決可能となったとしても、それを広範な普及させることは容易ではない。これは、上記した本出願人による吸着材を備えた研磨パッドの例からも予測できる。 Even if there is a factor of the conventional problem in the polishing pad provided with the pressure sensitive adhesive, improving its configuration etc. is not necessarily a priority. Even if the problem can be solved by the improvement of the polishing pad provided with the adhesive, it is not easy to spread it widely. This can also be predicted from the above-mentioned example of the polishing pad provided with the adsorbent according to the applicant of the present invention.
また、本考案の課題が研磨パッドの固定及び交換を容易とすることにあるとしても、それのみを重視することも好ましくない。交換作業等における取扱い性が向上しても、研磨装置の本来の目的である研磨作業に支障をきたすような改良は避けるべきである。 In addition, even if the problem of the present invention is to make it easy to fix and replace the polishing pad, it is not preferable to emphasize only that. Even if the handleability in the replacement operation etc. is improved, the improvement that would disturb the polishing operation which is the original purpose of the polishing apparatus should be avoided.
本考案者等は、上記を踏まえた検討の結果、研磨装置の定盤の構成に着目し、比較的簡易な構成を付与した定盤において、研磨作業にける品質を維持しながら、粘着剤を備える研磨パッドの交換作業の効率化を可能とすることを見出し、本考案に想到した。 As a result of the study based on the above, the present inventors paid attention to the configuration of the surface plate of the polishing apparatus and, while using the surface plate provided with a relatively simple configuration, maintaining the quality in the polishing operation, The inventors have found that it is possible to improve the efficiency of replacement work of the polishing pad provided, and have conceived the present invention.
即ち、本考案は、研磨装置に用いられ、研磨パッドが貼付けられる定盤において、定盤本体と、前記定盤本体の前記研磨パッドが貼付けられる面に形成された離型フィルム又は離型紙からなる離型層と、を含み、前記離型層は、表面の剥離力が０．０８Ｎ／５０ｍｍ以上５．０Ｎ／５０ｍｍ以下であることを特徴とする研磨装置用の定盤である。 That is, the present invention is used in a polishing apparatus and comprises a platen main body and a release film or a release paper formed on the surface of the platen main body on which the polishing pad is attached. A release layer is a surface plate for a polishing apparatus characterized in that the release layer has a surface peeling force of 0.08 N / 50 mm or more and 5.0 N / 50 mm or less.
上記の通り、本考案は定盤本体の表面に、離型フィルム又は離型紙により形成される離型層を付与した研磨装置用の定盤である。本考案では、離型層を介して定盤に研磨パッドを固定して研磨作業を行う。以下、本考案について詳細に説明する。 As described above, the present invention is a platen for a polishing apparatus in which a mold release layer formed of a mold release film or a mold release paper is provided on the surface of a platen main body. In the present invention, the polishing pad is fixed to the surface plate through the release layer to perform the polishing operation. Hereinafter, the present invention will be described in detail.
本考案に係る定盤において、離型層を形成する離型フィルム又は離型紙とは、樹脂フィルム基材又は紙基材を離型処理し、その表面において剥離作用を発現させたフィルム又は紙の総称である。ここでの剥離作用とは、各種粘着剤や塗料塗膜等に対して固着することなく剥離可能な状態で固定する作用である。かかる離型フィルム又は離型紙は、市販の粘着・接着テープ、シール、絆創膏、皮膚貼付用湿布剤等の粘着剤層上に積層されている。 In the surface plate according to the present invention, a release film or a release paper for forming a release layer is a film or a paper in which a resin film substrate or a paper substrate is subjected to release treatment to develop a peeling action on the surface thereof. It is a generic term. Here, the peeling action is an action of fixing in a peelable state without being fixed to various pressure-sensitive adhesives, paint films and the like. The release film or release paper is laminated on a pressure-sensitive adhesive layer such as a commercially available adhesive / adhesive tape, a seal, a plaster, a poultice for skin application.
本考案においては、定盤の表面について所定範囲の剥離力を有する離型フィルム又は離型紙で離型層を形成する。離型層の剥離力を規定するのは、研磨パッド交換の効率化と研磨作業における作業性及び研磨品質との双方における最適化を図るためである。即ち、５．０Ｎ／５０ｍｍを超える剥離力の剥離層は、研磨パッドの粘着剤による粘着力が強くなり過ぎて研磨パッドの交換効率が低下する。一方、以上０．０８Ｎ／５０ｍｍ未満となると、定盤に対する研磨パッドの固定が弱くなり、研磨作業中に研磨パッドのズレ、剥離が生じるおそれがある。また、研磨パッドに明確なズレが生じなくても、研磨パッドの研磨面の挙動が不安定になり、被研磨材に傷やうねり・歪み等が生じるおそれがある。以上のような理由から、剥離力が規定された離型フィルム又は離型紙が適用される。 In the present invention, the release layer is formed of a release film or release paper having a predetermined range of release force on the surface of the platen. The release force of the release layer is defined in order to optimize both the efficiency of polishing pad replacement and the workability and polishing quality in the polishing operation. That is, in the release layer having a release force exceeding 5.0 N / 50 mm, the adhesion of the polishing pad by the adhesive becomes too strong, and the replacement efficiency of the polishing pad is lowered. On the other hand, if it is not less than 0.08 N / 50 mm, the fixing of the polishing pad to the platen becomes weak, and there is a possibility that the polishing pad may be dislocated or peeled off during the polishing operation. In addition, even if there is no clear displacement in the polishing pad, the behavior of the polishing surface of the polishing pad becomes unstable, which may cause scratches, waviness, distortion and the like on the material to be polished. For the reasons as described above, a release film or release paper having a defined peel force is applied.
剥離力とは、離型フィルム又は離型紙に貼付けた粘着剤を剥離するのに要する力である。本考案における具体的な指標としては、所定の粘着テープ（日東電工製「Ｎｏ．３１Ｂ」（５０ｍｍ幅））をフィルム等の離型層の表面に貼り付け、室温で２時間放置後に、フィルム等との剥離角度１８０°、剥離速度：３００ｍｍ／分で粘着テープを剥離したときに引張試験機で測定された値である。 The peeling force is a force required to peel off the pressure-sensitive adhesive attached to the release film or release paper. As a specific index in the present invention, a predetermined adhesive tape (Nitto Denko "No. 31 B" (50 mm width)) is attached to the surface of a release layer such as a film and left for 2 hours at room temperature. It is a value measured by a tensile tester when the pressure-sensitive adhesive tape is peeled off at a peeling angle of 180 ° with a peeling speed of 300 mm / min.
上記のとおり、離型フィルム又は離型紙は、樹脂フィルム基材又は紙基材に離型剤を塗布して形成される素材である。離型剤としては、シリコーン系樹脂、フッ素系樹脂、長鎖アルキル系樹脂、パラフィン系樹脂、オレフィン系樹脂が挙げられる。これらの樹脂は、研磨パッドの粘着剤に対して上記した適切な剥離力を示すことができると共に、粘着剤の残留も少ない。本考案の定盤の離型層の表面は、これらの樹脂からなるものが好ましい。離型剤の具体的な組成としては、シリコーン系樹脂としては、オルガノポリシロキサン化合物の単独重合体、及び、オルガノポリシロキサン化合物とラジカル重合性モノマーとをラジカル重合している共有重合体等がある。また、長鎖アルキル系樹脂としては、長鎖アルキルペンダント型ポリマー（例えば、ピーロイル１０１０（ライオン・スペシャリティ・ケミカルズ株式会社製））が挙げられる。 As described above, the release film or release paper is a material formed by applying a release agent to a resin film substrate or a paper substrate. The release agent may, for example, be a silicone resin, a fluorine resin, a long chain alkyl resin, a paraffin resin or an olefin resin. These resins can exhibit the appropriate peeling force described above with respect to the pressure-sensitive adhesive of the polishing pad, and the residual pressure-sensitive adhesive is also small. The surface of the mold release layer of the platen of the present invention is preferably made of these resins. Specific examples of the composition of the release agent include, as silicone resins, homopolymers of organopolysiloxane compounds, and covalent polymers obtained by radical polymerization of organopolysiloxane compounds and radically polymerizable monomers. . In addition, as the long chain alkyl resin, a long chain alkyl pendant polymer (for example, Peiroil 1010 (manufactured by Lion Specialty Chemicals Inc.)) can be mentioned.
離型フィルム又は離型紙の樹脂フィルム基材又は紙基材の構成については、特に制限はない。樹脂フィルム基材としては、ポリエステル系樹脂、ポリエチレン系樹脂、ポリスチレン系樹脂、ポリプロピレン系樹脂、ナイロン系樹脂、ウレタン系樹脂、ポリ塩化ビニリデン系樹脂、ポリ塩化ビニル系樹脂等の樹脂製フィルムが用いられる。好ましくは、ポリエステル系樹脂であり、ポリエチレンテレフタレート（ＰＥＴ）、ポリエチレンナフタレート（ＰＥＮ）であり、特に好ましいのはＰＥＴである。紙基材としては、一般的な紙素材が適用できる。 There are no particular limitations on the configuration of the resin film substrate or paper substrate of the release film or release paper. As the resin film substrate, resin films such as polyester resin, polyethylene resin, polystyrene resin, polypropylene resin, nylon resin, urethane resin, polyvinylidene chloride resin, polyvinyl chloride resin and the like are used. . Preferred are polyester resins, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and particularly preferred is PET. A general paper material can be applied as the paper substrate.
本考案の定盤では、上記した離型フィルム又は離型紙を定盤本体に固定して離型層を形成する。離型フィルム又は離型紙の厚さについては、特に限定されないが、５０μｍ以上５００μｍ以下とするのが通常である。そして、離型フィルム又は離型紙は、粘着剤や接着剤によって定盤本体へ強固に固定されることが好ましい。具体的な粘着剤、接着剤としてはアクリル系、ゴム系の粘着剤やシリコーン系、エポキシ系の接着剤がある。 In the surface plate of the present invention, the above-described release film or release paper is fixed to the surface plate main body to form a release layer. The thickness of the release film or release paper is not particularly limited, but is usually 50 μm to 500 μm. And, it is preferable that the release film or release paper be firmly fixed to the platen main body by an adhesive or an adhesive. Specific adhesives and adhesives include acrylic adhesives, rubber adhesives, silicone adhesives and epoxy adhesives.
以上説明した離型フィルム又は離型紙からなる離型層に対して、定盤は従来と同様のものが適用される。定盤を特異な構成にすることは、本考案の利用にとって支障となるからである。研磨装置における定盤は、研磨パッドを保持すると共に、通常は回転駆動して被研磨材を研磨する機器である。そして、定盤は、単一構造のものとは限らない。研磨パッドが固定される部材と、定盤を回転駆動させるため研磨装置の機械的手段に接続された部材等で複数部材に分割される定盤も知られている。本考案においては、研磨パッドが固定される部材をその大小によらず、定盤本体とする。 With respect to the release layer made of the release film or release paper described above, the same plate as the conventional one is applied. It is because it becomes a hindrance to utilization of this invention to make a surface plate a peculiar composition. The platen in the polishing apparatus is an apparatus that holds a polishing pad and usually rotates to polish an object to be polished. And, the surface plate is not limited to a single structure. There is also known a platen which is divided into a plurality of members by a member to which the polishing pad is fixed, and a member connected to mechanical means of the polishing apparatus for rotationally driving the platen. In the present invention, the member to which the polishing pad is fixed is the platen main body regardless of the size.
よって、本考案における定盤の構成材料、寸法等についても特に定めることを要しない。もっとも、研磨パッドが固定される定盤本体は、硬質で耐食性に優れた材料からなるものが好ましく、具体的には、ステンレス、鋳鉄、ＳｉＣ等のセラミックスからなるものが好ましい。 Therefore, it is not necessary to set especially about the constituent material of the surface plate in this invention, a dimension, etc. Of course, the platen main body to which the polishing pad is fixed is preferably made of a hard material having excellent corrosion resistance, and specifically, preferably made of a ceramic such as stainless steel, cast iron or SiC.
以上説明した本考案の定盤は、従来の研磨装置に接続することで研磨作業に供することができる。この本考案に係る定盤を備える研磨装置は、研磨パッドの脱着を伴う交換作業の効率が良好な装置となる。 The surface plate of the present invention described above can be used for polishing work by connecting it to a conventional polishing apparatus. A polishing apparatus provided with a surface plate according to the present invention is an apparatus having good efficiency of replacement work involving desorption of the polishing pad.
以上説明した本考案に係る研磨装置用定盤によれば、従来から広く用いられている粘着剤を適用した研磨パッドによる研磨工程において、パッドの交換作業を容易とすることができる。本考案に係る定盤は、基本的な構成を従来の定盤と同じとしつつ、研磨品質を低下させることなく前記効果を発揮することができる。 According to the polishing apparatus surface plate of the present invention described above, pad replacement work can be facilitated in the polishing process using a polishing pad to which a conventionally widely used adhesive is applied. The surface plate according to the present invention can exhibit the above effect without lowering the polishing quality while making the basic configuration the same as the conventional surface plate.
以下、本考案の好適な実施形態を説明する。本実施形態では、離型フィルムを接着した定盤を作製し、ここに市販の粘着剤付の研磨パッドを固定して研磨作業を行い、交換時の作業性を検討すると共に研磨品質を評価した。 Hereinafter, preferred embodiments of the present invention will be described. In this embodiment, a surface plate to which a release film is adhered is manufactured, and a polishing pad with a commercially available adhesive is fixed thereto to carry out the polishing operation, and the workability at the time of replacement is examined and the polishing quality is evaluated. .
本実施形態で使用した研磨パッドは、汎用タイプのスエード調の研磨布（型番７３５５−０００Ｆ、ナップ長４５０μｍ、厚さ１．３７ｍｍ）を備える市販の円形の研磨パッドである。この研磨パッドは、裏面に粘着テープが貼付けられている。 The polishing pad used in this embodiment is a commercially available circular polishing pad provided with a general-purpose type suede-like polishing cloth (model number 7355-000F, nap length 450 μm, thickness 1.37 mm). An adhesive tape is attached to the back of the polishing pad.
そして、図１で示した装置と同様の研磨装置において、図２のように定盤の本体部分に離型フィルムを接着して本実施形態に係る定盤を作製した。本実施形態では、市販の剥離力が異なるシリコーン系の離型フィルム（株式会社フジコー製：商品名ＰＥＴ-７５×１（厚さ７５μｍ））を複数種用意し、複数の定盤を作製して離型層の特性を評価した。本実施形態では、剥離力が０．０５Ｎ／５０ｍｍ、０．０８Ｎ／５０ｍｍ、０．２Ｎ／５０ｍｍ、０．９５Ｎ／５０ｍｍ、５．０Ｎ／５０ｍｍ、７．０Ｎ／５０ｍｍの離型フィルムを用意した。そして、離型フィルムを定盤の寸法（φ８００ｍｍ）と同じ寸法に裁断し、これをアクリル系接着剤で接着接合した。 Then, in a polishing apparatus similar to the apparatus shown in FIG. 1, as shown in FIG. 2, a mold release film was adhered to the main body portion of the surface plate to produce a surface plate according to the present embodiment. In this embodiment, a plurality of commercially available silicone-based mold release films (Fujiko Co., Ltd .: trade name PET-75 × 1 (75 μm thick)) having different peel forces are prepared, and a plurality of surface plates are manufactured. The properties of the release layer were evaluated. In this embodiment, release films having a peeling force of 0.05 N / 50 mm, 0.08 N / 50 mm, 0.2 N / 50 mm, 0.95 N / 50 mm, 5.0 N / 50 mm, and 7.0 N / 50 mm were prepared. . Then, the release film was cut to the same size as the size of the surface plate (φ 800 mm), and this was adhesively bonded with an acrylic adhesive.
このようにして用意した、研磨装置・研磨パッドにて、シリコンウエハ（φ８インチ）を被研磨部材とする研磨試験を行った。この研磨試験では、上記離型フィルムを粘着剤で定盤に粘着固定した後、離型フィルム上に研磨パッドを粘着固定してシリコンウエハを研磨した。この研磨工程では、研磨スラリーを研磨パッドに滴下しつつ、研磨パッド（定盤）及びシリコンウエハ（ヘッド）を回転させてシリコンウエハを研磨した。このとき研磨条件は、下記の通りとした。
・研磨スラリー：Ｇｌａｎｚｏｘ（株式会社フジミインコーポレーテッド製）を純水で３０倍に希釈したスラリー
・研磨スラリー滴下速度：１５０ｍｌ／ｍｉｎ
・研磨圧力：０．１６３ｋｇｆ／ｃｍ2
・研磨パッドの回転速度：４５ｒｐｍ
・ヘッドの回転速度：４７ｒｐｍ
・ヘッドの揺動速度：２５０ｍｍ／ｍｉｎ
・研磨時間：３ｍｉｎ（１枚あたり）
With the polishing apparatus and polishing pad prepared in this manner, a polishing test was performed using a silicon wafer (φ 8 inches) as a member to be polished. In this polishing test, after the above release film was adhesively fixed on a surface plate with an adhesive, the polishing pad was adhesively fixed on the release film to polish a silicon wafer. In this polishing step, the silicon wafer was polished by rotating the polishing pad (surface plate) and the silicon wafer (head) while dropping the polishing slurry onto the polishing pad. At this time, the polishing conditions were as follows.
Polishing slurry: Slurry obtained by diluting Glanzox (manufactured by Fujimi Incorporated, Ltd.) with pure water by 30 times Polishing slurry dropping speed: 150 ml / min
Polishing pressure: 0.163 kgf / cm 2
・ The rotation speed of the polishing pad: 45 rpm
・ Head rotation speed: 47 rpm
· Head swing speed: 250 mm / min
Polishing time: 3 min (per sheet)
本実施形態の研磨試験では、上記条件で２５枚のシリコンウエハを連続して研磨した後、研磨パッドを定盤（離型フィルム）から引き剥がし、新しい研磨パッドを粘着固定し、同様に２５枚のシリコンウエハを連続研磨した。本実施形態では、合計で２００枚のシリコンウエハを研磨することとし、上記の研磨パッドの交換作業（引き剥がし作業）を７回行った。尚、研磨作業後のシリコンウエハについては、純水で洗浄し乾燥させて、その重量をマイクロ電子天秤で測定し、研磨前後の重量差から研磨レートを評価した。 In the polishing test of this embodiment, after 25 silicon wafers are continuously polished under the above conditions, the polishing pad is peeled off from the surface plate (mold release film), and a new polishing pad is adhesively fixed. The silicon wafer was continuously polished. In the present embodiment, a total of 200 silicon wafers were polished, and the above-described polishing pad replacement operation (peeling operation) was performed seven times. The silicon wafer after the polishing operation was washed with pure water and dried, the weight was measured by a micro electronic balance, and the polishing rate was evaluated from the weight difference before and after the polishing.
研磨試験における評価方法としては、各離型フィルムによる全ての研磨作業において、研磨パッドと定盤との固定状態（粘着状態）を目視と触感により確認し、研磨パッドのズレや剥離の有無を検討した。そして、研磨パッドのズレ等が確認された段階で、当該離型フィルムは不合格であるとして試験中止した。 As an evaluation method in the polishing test, the fixed state (adhesive state) of the polishing pad and the surface plate is confirmed by visual observation and touch in all the polishing work by each release film, and the presence or absence of the shift or peeling of the polishing pad did. Then, at the stage where the shift of the polishing pad and the like were confirmed, the test was stopped because the release film was rejected.
また、上記７回研磨パッドの交換作業における作業効率も評価した。本実施形態では、交換作業時にばね量りを使用して研磨パッドの端部を９０度上方向に引張り、研磨パッドの剥がれが生じたときの荷重を測定した。そして、荷重値が５００ｇ以下である場合を作業効率が良「○」であると判定し、荷重値が５００ｇを超えた場合を作業効率が不良「×」であると判定した。尚、荷重値の評価には、７回の交換作業時の測定値の平均値を採用した。 In addition, the work efficiency in the replacement work of the seven polishing pads was also evaluated. In this embodiment, the end portion of the polishing pad was pulled upward by 90 degrees using a spring weight during replacement work, and the load when peeling of the polishing pad occurred was measured. Then, when the load value is 500 g or less, it is determined that the working efficiency is good "O", and when the load value exceeds 500 g, it is determined that the working efficiency is bad "x". In addition, the average value of the measured value at the time of seven replacement work was employ | adopted for evaluation of a load value.
以上の研磨試験・評価は、用意した剥離力が異なる７種の離型フィルムを固定した定盤について行った。また、本実施形態では、アクリル系及びゴム系の２種の粘着剤を用意し、それぞれの粘着剤で離型フィルムの定盤に固定して研磨試験を行った。更に、本実施形態では、研磨パッドを定盤に直接粘着固定した研磨試験を、従来例として行った。以上説明した研磨試験における評価結果を、表１に示す。
The above-described polishing test and evaluation were performed on a surface plate on which seven types of release films having different peeling forces were fixed. Further, in the present embodiment, two types of pressure-sensitive adhesives of acrylic type and rubber type are prepared, fixed to the surface plate of the release film with the respective pressure-sensitive adhesives, and the polishing test was performed. Furthermore, in the present embodiment, the polishing test in which the polishing pad was directly adhered and fixed to the surface plate was performed as a conventional example. The evaluation results in the polishing test described above are shown in Table 1.
表１から、定盤（離型フィルム）の剥離力を０．０８Ｎ／５０ｍｍ以上とした場合、及び５．００Ｎ／５０ｍｍ以下とした場合は、研磨作業中の研磨パッドのズレ・剥がれも無く良好の研磨状態であった。そして、これらの定盤については、研磨パッド交換の際の剥がれ荷重は５００ｇ以下を示し、交換効率にも優れることが確認された。尚、これらの定盤では、従来例と同等の研磨レートでの研磨作業が可能であることも確認された。 From Table 1, when the peeling force of the surface plate (mold release film) is 0.08 N / 50 mm or more, and 5.00 N / 50 mm or less, there is no displacement or peeling of the polishing pad during the polishing operation. It was polished. And about these surface plates, the peeling load at the time of grinding | polishing pad exchange showed 500 g or less, and it was confirmed that it is excellent also in exchange efficiency. In addition, it was also confirmed that, with these plates, it is possible to perform polishing work at a polishing rate equivalent to that of the conventional example.
一方、定盤（離型フィルム）の剥離力が５．０Ｎ／５０ｍｍを超える場合（７．０Ｎ／５０ｍｍ）、研磨パッドの交換時の剥がれ荷重が５００ｇを超えており交換効率に劣ることが確認された。この比較例では、研磨パッドのズレ等は発生せず、研磨レートは良好であり、従来例である研磨パッドを直接定盤に固定する場合と同じであるといえる。 On the other hand, when the peeling force of the surface plate (mold release film) exceeds 5.0 N / 50 mm (7.0 N / 50 mm), it is confirmed that the peeling load at the time of replacement of the polishing pad exceeds 500 g and the replacement efficiency is inferior. It was done. In this comparative example, displacement of the polishing pad does not occur, the polishing rate is good, and it can be said that it is the same as the case of fixing the polishing pad of the conventional example directly to the surface plate.
また、定盤（離型フィルム）の剥離力を０．０８Ｎ／５０ｍｍ未満した場合（０．０５Ｎ／５０ｍｍ）、研磨作業中に研磨パッドのズレが発生した。この不具合は、最初の２５枚のシリコンウエハの研磨中に発生しており、１回目の交換作業を行うことなく試験中断となった。また、この定盤において、研磨レートが従来例に対して０．０５μｍ/ｍｉｎ低くなっていた。この研磨レートの不良は、研磨パッドが好ましくない固定状態にあったためと考察される。定盤表面の剥離力を低くすることは、研磨品質にも影響を与えることが分かる。 In addition, when the peeling force of the surface plate (mold release film) was less than 0.08 N / 50 mm (0.05 N / 50 mm), displacement of the polishing pad occurred during the polishing operation. This failure occurred during the polishing of the first 25 silicon wafers, and the test was interrupted without performing the first replacement operation. In addition, in this platen, the polishing rate was lower than that of the conventional example by 0.05 μm / min. The failure of the polishing rate is considered to be due to the polishing pad being in an undesirable fixed state. It can be seen that lowering the peel force of the platen surface also affects the polishing quality.
以上説明したように、本考案に係る研磨装置用の定盤は、離型フィルム等からなる離型層を備えたことにより、粘着剤により固定される研磨パッドの固定・交換の作業性を向上させている。本考案は、半導体ウエハ、ディスプレイ用ガラス基板、ハードディスク用基板等の研磨工程において有用である。
As described above, the surface plate for the polishing apparatus according to the present invention has improved performance in fixing and replacing the polishing pad fixed by the adhesive by providing the release layer made of a release film or the like. I am doing it. The present invention is useful in polishing processes for semiconductor wafers, glass substrates for displays, substrates for hard disks, and the like.
Claims (4)
定盤本体と、前記定盤本体の前記研磨パッドが貼付けられる面に形成された離型フィルム又は離型紙からなる離型層と、を含み、
前記離型層は、表面の剥離力が０．０８Ｎ／５０ｍｍ以上５．０Ｎ／５０ｍｍ以下であることを特徴とする研磨装置用の定盤。 In a platen used for a polishing apparatus and to which a polishing pad is attached,
A platen body, and a release layer formed of a release film or a release paper formed on the surface of the platen body to which the polishing pad is attached,
A surface plate for a polishing apparatus, wherein the release layer has a surface peeling force of 0.08 N / 50 mm or more and 5.0 N / 50 mm or less.
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