JP2007245276A - Double-side tape for fixing polishing pad - Google Patents

Double-side tape for fixing polishing pad Download PDF

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Publication number
JP2007245276A
JP2007245276A JP2006070856A JP2006070856A JP2007245276A JP 2007245276 A JP2007245276 A JP 2007245276A JP 2006070856 A JP2006070856 A JP 2006070856A JP 2006070856 A JP2006070856 A JP 2006070856A JP 2007245276 A JP2007245276 A JP 2007245276A
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double
polishing pad
sided tape
fixing
base material
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Kenji Sakai
賢司 酒井
Kenji Kato
健二 加藤
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a double-side tape for fixing a polishing pad, which firmly fixes the polishing pad to a polishing surface plate or a cushion material with excellent durability against hydrogen peroxide diluted slurry liquid. <P>SOLUTION: The tape is provided with a base material 2 made of polyethylene terephthalate resin fiber nonwoven fabric having basic weight of 7-30 g/m<SP>2</SP>and rubber based pressure-sensitive adhesive layers 3 laminated on both sides of the base material 2. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、半導体ウエハ等を研磨する研磨装置の研磨定盤または研磨定盤上に設けられたクッション材に研磨パッドを固定するための研磨パッド固定用両面テープに関する。   TECHNICAL FIELD The present invention relates to a polishing pad fixing double-sided tape for fixing a polishing pad to a polishing surface plate of a polishing apparatus for polishing a semiconductor wafer or the like or a cushion material provided on the polishing surface plate.

半導体集積回路の高密度化を目的として配線の微細化が進んでいるのに伴い、半導体ウエハや液晶用ガラス基盤などの表面の凹凸をできるだけ平坦化する必要がある。そこで、ケミカルメカニカル研磨法(Chemical Mechanical Polishing:以下、CMP法という)が採用されている。   With the progress of miniaturization of wiring for the purpose of increasing the density of semiconductor integrated circuits, it is necessary to make the surface irregularities of semiconductor wafers and glass substrates for liquid crystals as flat as possible. Therefore, chemical mechanical polishing (CMP) is adopted.

すなわち、上記CMP法では、研磨装置の研磨定盤上にまたは研磨定盤上に設けられたクッション材に両面テープを用いて研磨パッドを固定し、研磨パッド上に研磨スラリーを滴下しながらウエハ等を研磨定盤およびウエハを相対的の接触面の水平方向に回転あるいはスライドさせてウエハや金属板の研磨パッドとの接触面を研磨するようにしている(たとえば、特許文献1、2参照)。   That is, in the CMP method, a polishing pad is fixed on a polishing surface plate of a polishing apparatus or a cushion material provided on the polishing surface plate using a double-sided tape, and a wafer or the like is dropped while polishing slurry is dropped on the polishing pad. The polishing surface plate and the wafer are rotated or slid in the horizontal direction of the relative contact surface to polish the contact surface with the polishing pad of the wafer or metal plate (for example, see Patent Documents 1 and 2).

特開2004-140215号公報JP 2004-140215 A 特開2005-56920号公報JP 2005-56920 A

ところで、CMP法を用いて特に金属研磨する場合、過酸化水素希釈したスラリー液が使用されようになっている。
一方、従来から研磨パッドの固定用として一般的にレーヨン不織布製基材の両面にアクリル系粘着剤層が設けられた両面テープが用いられているが、レーヨン、アクリル系粘着剤ともに過酸化水素に冒されやすく、長時間の使用には耐えないという問題がある。すなわち、上記両面テープを過酸化水素希釈したスラリー液に12時間浸漬させるとレーヨン不織布製基材は溶解し、せん断に対しずれが大きくなる。また粘着剤も浸漬により軟化し粘着強度が低下する。
By the way, particularly when metal polishing is performed using the CMP method, a slurry liquid diluted with hydrogen peroxide is used.
On the other hand, a double-sided tape with an acrylic pressure-sensitive adhesive layer provided on both sides of a rayon nonwoven substrate is generally used for fixing a polishing pad, but both rayon and acrylic pressure-sensitive adhesives are resistant to hydrogen peroxide. There is a problem that it is easily affected and cannot be used for a long time. That is, when the double-sided tape is immersed in a hydrogen peroxide-diluted slurry for 12 hours, the base material made of rayon nonwoven fabric is dissolved, and the deviation from shear increases. Also, the adhesive is softened by dipping and the adhesive strength is reduced.

本発明は、上記事情に鑑みて、過酸化水素希釈したスラリー液に対して耐久性に優れ、研磨パッドをしっかりと研磨定盤またはクッション材に固定することができる研磨パッド固定用両面テープを提供することを目的としている。   In view of the above circumstances, the present invention provides a double-sided tape for fixing a polishing pad that is excellent in durability against a slurry solution diluted with hydrogen peroxide and can firmly fix a polishing pad to a polishing surface plate or cushioning material. The purpose is to do.

上記目的を達成するために、本発明にかかる研磨パッド固定用両面テープは、ポリエチレンテレフタレート樹脂繊維製不織布からなる基材と、この基材の両面に積層されたゴム系粘着剤層とを備えることを特徴としている。   In order to achieve the above object, a polishing pad fixing double-sided tape according to the present invention comprises a base material made of a polyethylene terephthalate resin fiber nonwoven fabric, and a rubber-based pressure-sensitive adhesive layer laminated on both sides of the base material. It is characterized by.

本発明において、ポリエチレンテレフタレート樹脂繊維製不織布は、特に限定されないが、その坪量が7〜30g/m2であるものを用いることが好ましい。
すなわち、坪量が7g/m2未満であると、粘着剤保持が十分できず剥離の際被着体への糊残りが発生する。また坪量が30g/m2を超えると、研磨時のせん断に対し不織布での層間破壊が発生し十分な機械強度を発現しにくい。
In the present invention, the nonwoven fabric made of polyethylene terephthalate resin fiber is not particularly limited, but it is preferable to use one having a basis weight of 7 to 30 g / m 2 .
That is, when the basis weight is less than 7 g / m 2 , the pressure-sensitive adhesive cannot be sufficiently held, and adhesive residue on the adherend is generated at the time of peeling. On the other hand, when the basis weight exceeds 30 g / m 2 , interlaminar fracture occurs in the nonwoven fabric against shearing during polishing, and sufficient mechanical strength is hardly exhibited.

ゴム系粘着剤層を形成する粘着剤としては、スラリーへの耐性があるSIS(スチレン-イソプレン-スチレン系ブロック共重合体の熱可塑性樹脂エラストマーに粘着付与剤を配合したものが挙げられる。
粘着付与剤としては、特に限定されないが、ロジン樹脂、テルペン樹脂、石油樹脂などが挙げられる。
Examples of the pressure-sensitive adhesive forming the rubber-based pressure-sensitive adhesive layer include those obtained by blending a SIS (styrene-isoprene-styrene block copolymer thermoplastic resin elastomer having a resistance to slurry) with a tackifier.
Although it does not specifically limit as a tackifier, A rosin resin, a terpene resin, a petroleum resin etc. are mentioned.

本発明の研磨パッド固定用両面テープの形状は、特に限定されず、たとえば、ロール状に巻回された長尺帯状のもの、短尺帯状のもの、矩形や円形等のシート状のものなどが挙げられる。   The shape of the double-sided tape for fixing the polishing pad of the present invention is not particularly limited, and examples thereof include a long strip wound in a roll shape, a short strip shape, and a sheet shape such as a rectangle or a circle. It is done.

基材および両側のゴム系粘着剤層の厚みの合計は、特に限定されないが、30〜200μmが好ましく、粘着性、せん断強度を考慮すれば、60〜150μmがより好ましい。
また、ゴム系粘着剤は、初期粘着力(両面テープ試料25mm幅×150mmを、5kgローラー1往復でステンレス鋼板に貼り合せ、24時間放置後、角度90°で300mmの速さで剥離したときの強度)が20N/25mm以上、スラリー浸漬後の粘着力が(両面テープ試料25mm幅×150mmを、5kgローラー1往復でステンレス鋼板に貼り合せ、4%の過酸化水素を含むスラリー液に72時間浸漬したのち、角度90°で300mmの速さで剥離したときの強度)が15N/25mm以上となるものを選択することが好ましい。
The total thickness of the base material and the rubber-based pressure-sensitive adhesive layers on both sides is not particularly limited, but is preferably 30 to 200 μm, and more preferably 60 to 150 μm in consideration of adhesiveness and shear strength.
In addition, the rubber adhesive has an initial adhesive strength (double-sided tape sample 25mm width x 150mm, pasted on a stainless steel plate with a reciprocating 5kg roller, left for 24 hours, and then peeled off at an angle of 90 ° and a speed of 300mm. (Strength) is 20N / 25mm or more, and adhesive strength after slurry immersion (double-sided tape sample 25mm width x 150mm is pasted on a stainless steel plate with one reciprocation of 5kg roller and immersed in slurry solution containing 4% hydrogen peroxide for 72 hours After that, it is preferable to select a material having a strength of 15 N / 25 mm or more when peeled at an angle of 90 ° and a speed of 300 mm.

また、上記粘着剤層中には、さらに必要に応じて、無機もしくは有機充填剤、酸化防止剤(老化防止剤)、熱安定剤、光安定剤、紫外線吸収剤等各種の添加剤が添加されていても良い。   In addition, various additives such as inorganic or organic fillers, antioxidants (anti-aging agents), heat stabilizers, light stabilizers, ultraviolet absorbers, and the like are further added to the pressure-sensitive adhesive layer as necessary. May be.

本発明の研磨パッド固定用両面テープには、粘着剤層上に離型材が貼着されているのが好ましい。貼着される離型材としては、特に限定されず、例えば、シリコーン樹脂系離型剤や長鎖アルキル基ペンダント型グラフトポリマー系離型剤等により、紙やプラスチックフィルム等の少なくとも片面に離型処理を施して得られる離型紙や離型フィルム等が挙げられる。   In the double-sided tape for fixing the polishing pad of the present invention, a release material is preferably stuck on the pressure-sensitive adhesive layer. The release material to be attached is not particularly limited, and for example, a release treatment on at least one surface of paper, plastic film, or the like with a silicone resin release agent or a long-chain alkyl group pendant graft polymer release agent. Release paper, release film and the like obtained by applying the above.

本発明の研磨パッド固定用両面テープによって固定される研磨パッドの材質としては、特に限定されないが、たとえば、硬質ポリウレタンの発泡体、各種ゴムの発泡体、ポリエチレン・ポリプロピレン等のオレフィン系樹脂の発泡体や、更に平均発泡粒径が0.5mm以上のこれらの発泡体のスライス品や、セリウムやシリカなどの砥粒やフィラー、研磨材などをこれらの発泡体含有させたものが挙げられる。   The material of the polishing pad fixed by the double-sided tape for fixing the polishing pad of the present invention is not particularly limited. For example, hard polyurethane foam, various rubber foam, foam of olefin resin such as polyethylene / polypropylene In addition, slices of these foams having an average foamed particle size of 0.5 mm or more, and those containing these foams containing abrasive grains such as cerium and silica, fillers, and abrasives.

本発明の研磨パッド固定用両面テープは、以上のように、ポリエチレンテレフタレート樹脂繊維製不織布からなる基材と、この基材の両面に積層されたゴム系粘着剤層とを備えるので、基材および粘着剤層のいずれもが過酸化水素で希釈されたスラリー液に対して優れた耐食性を示す。したがって、過酸化水素で希釈されたスラリー液を用いてCMP法によって金属を研磨しようとした場合においても研磨パッドを研磨定盤あるいはクッション材に長期間安定して固定することができる。   As described above, the double-sided tape for fixing the polishing pad of the present invention includes a base material made of a polyethylene terephthalate resin fiber nonwoven fabric and a rubber-based pressure-sensitive adhesive layer laminated on both sides of the base material. All of the pressure-sensitive adhesive layers exhibit excellent corrosion resistance against the slurry liquid diluted with hydrogen peroxide. Therefore, the polishing pad can be stably fixed to the polishing surface plate or the cushion material for a long time even when the metal is polished by the CMP method using the slurry diluted with hydrogen peroxide.

以下に、本発明を、その実施の形態をあらわす図面を参照しつつ詳しく説明する。
図1は、本発明にかかる研磨パッド固定用両面テープの1つの実施の形態をあらわしている。
Hereinafter, the present invention will be described in detail with reference to the drawings showing embodiments thereof.
FIG. 1 shows one embodiment of a double-sided tape for fixing a polishing pad according to the present invention.

図1に示すように、この研磨パッド固定用両面テープ(以下、「両面テープ」とのみ記す)
1は、基材2と、この基材2の両面に積層されたゴム系粘着剤層3と、ゴム系粘着剤層3を被覆するように設けられた離型シート4とを備えている。
基材2は、坪量7〜30g/m2のポリエステル樹脂繊維製の不織布で形成されている。
As shown in FIG. 1, this double-sided tape for fixing a polishing pad (hereinafter referred to as “double-sided tape” only)
1 includes a base material 2, a rubber-based pressure-sensitive adhesive layer 3 laminated on both surfaces of the base material 2, and a release sheet 4 provided so as to cover the rubber-based pressure-sensitive adhesive layer 3.
The base material 2 is formed of a nonwoven fabric made of polyester resin fibers having a basis weight of 7 to 30 g / m 2 .

ゴム系粘着剤層3は、 ゴム系粘着剤層3は、スチレン−イソプレン−スチレン系ブロック共重合体より選ばれたの熱可塑性樹脂エラストマーと、粘着付与剤とを含んでいる。   The rubber-based pressure-sensitive adhesive layer 3 includes a thermoplastic resin elastomer selected from a styrene-isoprene-styrene-based block copolymer and a tackifier.

以下、実施例を挙げて本発明をより詳しく説明するが、本発明は以下の実施例に限定されるものではない。   EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated in more detail, this invention is not limited to a following example.

(実施例1)
スチレン−イソプレン−スチレン系ブロック共重合体(スチレン含有量16%、メルトインデックス12) 100重量部と、スチレン−イソプレン−スチレン系ブロック共重合体スチレン含有量15%、メルトインデックス7) 40重量部と、粘着付与剤としての1.3-ペンタジエンを主体とした脂肪族系炭化水素樹脂(軟化点95℃、色相5、溶融粘度100m・Pas) 80重量部と、クマロン(新日鐵化学社製エスクロンV120) 20重量部と、フェノール系抗酸化剤 (チバ・スペシャルティ・ケミカルズ社製イルガノックス1010) 1重量部、これらをトルエンに溶解、混合してトルエン50%に希釈した粘着剤を得た。この状態で、離型シート上に塗工し、乾燥後粘着剤層が50μmになるように調整した。
つぎに、基材としてのポリエチレンテレフタレート樹脂繊維からなる不織布(坪量13g/m2、厚み0.04mm)の両面を離型シート上に設けられた粘着剤層の間に挟み込んで、層厚107μmの両面テープを得た。
Example 1
Styrene-isoprene-styrene block copolymer (styrene content 16%, melt index 12) 100 parts by weight and styrene-isoprene-styrene block copolymer ( styrene content 15%, melt index 7) 40 parts by weight 80 parts by weight of an aliphatic hydrocarbon resin mainly composed of 1.3-pentadiene as a tackifier ( softening point 95 ° C., hue 5, melt viscosity 100 m · Pas) and coumarone (Escron V120 manufactured by Nippon Steel Chemical Co., Ltd.) ) 20 parts by weight and 1 part by weight of a phenolic antioxidant (Irganox 1010 manufactured by Ciba Specialty Chemicals). These were dissolved in toluene and mixed to obtain a pressure-sensitive adhesive diluted to 50% toluene. In this state, coating was performed on the release sheet, and after drying, the pressure-sensitive adhesive layer was adjusted to 50 μm.
Next, both sides of a nonwoven fabric (basis weight 13 g / m 2 , thickness 0.04 mm) made of polyethylene terephthalate resin fibers as a base material are sandwiched between pressure-sensitive adhesive layers provided on a release sheet, and the layer thickness is 107 μm. A double-sided tape was obtained.

(比較例1)
ゴム系粘着剤に代えて、アクリル系粘着剤(綜研化学社製SK1720)で粘着剤層形成した以外は、実施例1と同様にして両面テープを得た。
(Comparative Example 1)
A double-sided tape was obtained in the same manner as in Example 1 except that an adhesive layer was formed with an acrylic adhesive (SK1720 manufactured by Soken Chemical Co., Ltd.) instead of the rubber adhesive.

(比較例2)
基材として、ポリエチレンテレフタレート樹脂繊維製の不織布に代えて、レーヨン製の不織布(坪量13g/m2)を用いた以外は、実施例1と同様にして両面テープを得た。
(Comparative Example 2)
A double-sided tape was obtained in the same manner as in Example 1 except that a nonwoven fabric made of rayon (basis weight 13 g / m 2 ) was used in place of the nonwoven fabric made of polyethylene terephthalate resin fiber.

(比較例3)
ゴム系粘着剤に代えて、アクリル系粘着剤(綜研化学社製SK1720)で粘着剤層形成した以外は、比較例2と同様にして両面テープを得た。
(Comparative Example 3)
A double-sided tape was obtained in the same manner as in Comparative Example 2 except that an adhesive layer was formed with an acrylic adhesive (SK1720 manufactured by Soken Chemical Co., Ltd.) instead of the rubber adhesive.

上記実施例1、比較例1〜3で得られた両面テープの初期剥離強度およびスラリー液浸漬後の剥離強度をそれぞれ測定し、その結果を表1に示した。また、スラリー液浸漬後の基材の状態を調べその結果を表1に併せて示した。   The initial peel strength of the double-sided tapes obtained in Example 1 and Comparative Examples 1 to 3 and the peel strength after immersion in the slurry liquid were measured, and the results are shown in Table 1. Moreover, the state of the base material after immersion in the slurry was examined, and the results are also shown in Table 1.

なお、初期剥離強度は、実施例1、比較例1〜3で得られた両面テープ試料25mm幅×150mmを、5kgローラー1往復でステンレス鋼板に貼り合せ、常温で24時間放置後、角度90°で300mmの速さで剥離したときの強度を求めた。
また、スラリー液浸漬後の剥離強度は、実施例1、比較例1〜3で得られた両面テープ試料25mm幅×150mmを、5kgローラー1往復でステンレス鋼板に貼り合せ常温で24時間放置後、4%の過酸化水素を含むスラリー液(Cabot社製SEMI-SPERSE W2000)に常温で24時間浸漬し、その後剥離強度を測定しその結果を表1に示した。また剥離強度初期に対する浸漬後の強度が95%以上あるものを合格(○)とし、90%未満のものを不合格(×)とした。
The initial peel strength was obtained by bonding the double-sided tape sample 25 mm width × 150 mm obtained in Example 1 and Comparative Examples 1 to 3 to a stainless steel plate by one reciprocation of a 5 kg roller, leaving it at room temperature for 24 hours, and then an angle of 90 °. The strength when peeled at a speed of 300 mm was obtained.
In addition, the peel strength after immersion in the slurry was as follows: the double-sided tape sample 25 mm wide × 150 mm obtained in Example 1 and Comparative Examples 1 to 3 was attached to a stainless steel plate with one reciprocation of a 5 kg roller and left at room temperature for 24 hours. Table 1 shows the results of measuring the peel strength after dipping in a slurry solution containing 4% hydrogen peroxide (SEMI-SPERSE W2000 manufactured by Cabot) for 24 hours at room temperature. Moreover, the thing with 95% or more of the strength after immersion with respect to the peeling strength initial stage was set as the pass ((circle)), and the thing below 90% was set as the disqualified (x).

Figure 2007245276
Figure 2007245276

表1から、本発明の両面テープは、4%の過酸化水素を含むスラリー液に浸漬した場合でも、基材が傷まず、長期間優れた粘着性能を発揮することがよくわかる。   From Table 1, it is well understood that the double-sided tape of the present invention exhibits excellent adhesive performance for a long time without being damaged, even when immersed in a slurry solution containing 4% hydrogen peroxide.

本発明にかかる研磨パッド固定用両面テープの1つの実施の形態をあらわす断面図である。1 is a cross-sectional view showing an embodiment of a double-sided tape for fixing a polishing pad according to the present invention.

符号の説明Explanation of symbols

1 両面テープ
2 基材
3 粘着剤層
4 離型シート
1 Double-coated tape 2 Base material 3 Adhesive layer 4 Release sheet

Claims (3)

ポリエチレンテレフタレート樹脂繊維製不織布からなる基材と、この基材の両面に積層されたゴム系粘着剤層とを備える研磨パッド固定用両面テープ。   A double-sided tape for fixing a polishing pad, comprising: a base material comprising a nonwoven fabric made of polyethylene terephthalate resin fiber; and a rubber-based pressure-sensitive adhesive layer laminated on both sides of the base material. ポリエチレンテレフタレート樹脂繊維製不織布の坪量が7〜30g/m2である請求項1に記載の研磨パッド固定用両面テープ。 The polishing pad for fixing double-sided tape of claim 1 basis weight of polyethylene terephthalate resin fiber nonwoven fabric is 7~30g / m 2. ゴム系粘着剤が、スチレン−イソプレン−スチレン系ブロック共重合体の熱可塑性樹脂エラストマーと、粘着付与剤とを含む請求項1または請求項2に記載の研磨パッド固定用両面テープ。   The double-sided tape for fixing a polishing pad according to claim 1 or 2, wherein the rubber-based adhesive comprises a thermoplastic resin elastomer of a styrene-isoprene-styrene block copolymer and a tackifier.
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Cited By (4)

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Publication number Priority date Publication date Assignee Title
JP2009185197A (en) * 2008-02-07 2009-08-20 Tokyo Ohka Kogyo Co Ltd Adhesive composition, its use, and method for producing adhesive composition
JP2011122069A (en) * 2009-12-11 2011-06-23 Sekisui Chem Co Ltd Double-sided adhesive tape for fixing polishing pad
CN104449441A (en) * 2013-09-13 2015-03-25 日东电工株式会社 Adhesive sheet for fastening polishing pad
JP2021088614A (en) * 2019-12-02 2021-06-10 東洋インキScホールディングス株式会社 Adhesive for fixing abrasive member and adhesive sheet

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JPH06228513A (en) * 1993-02-05 1994-08-16 Sekisui Chem Co Ltd Double-coated pressure-sensitive adhesive tape and its production
JPH11116923A (en) * 1997-09-30 1999-04-27 Minnesota Mining & Mfg Co <3M> Rubber-based pressure-sensitive adhesive composition
JP2003041741A (en) * 2001-07-27 2003-02-13 Sekisui Chem Co Ltd Interior laminated body and its manufacturing method
JP2003136397A (en) * 2001-11-01 2003-05-14 Roki Techno Co Ltd Polishing pad
JP2003213559A (en) * 2002-01-10 2003-07-30 Nippon Petrochemicals Co Ltd Composite nonwoven fabric and method for producing the same
JP2005161490A (en) * 2003-12-04 2005-06-23 Diatex Co Ltd Backing material for polishing pad
JP2005294412A (en) * 2004-03-31 2005-10-20 Toyo Tire & Rubber Co Ltd Polishing pad

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JPH06228513A (en) * 1993-02-05 1994-08-16 Sekisui Chem Co Ltd Double-coated pressure-sensitive adhesive tape and its production
JPH11116923A (en) * 1997-09-30 1999-04-27 Minnesota Mining & Mfg Co <3M> Rubber-based pressure-sensitive adhesive composition
JP2003041741A (en) * 2001-07-27 2003-02-13 Sekisui Chem Co Ltd Interior laminated body and its manufacturing method
JP2003136397A (en) * 2001-11-01 2003-05-14 Roki Techno Co Ltd Polishing pad
JP2003213559A (en) * 2002-01-10 2003-07-30 Nippon Petrochemicals Co Ltd Composite nonwoven fabric and method for producing the same
JP2005161490A (en) * 2003-12-04 2005-06-23 Diatex Co Ltd Backing material for polishing pad
JP2005294412A (en) * 2004-03-31 2005-10-20 Toyo Tire & Rubber Co Ltd Polishing pad

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009185197A (en) * 2008-02-07 2009-08-20 Tokyo Ohka Kogyo Co Ltd Adhesive composition, its use, and method for producing adhesive composition
JP2011122069A (en) * 2009-12-11 2011-06-23 Sekisui Chem Co Ltd Double-sided adhesive tape for fixing polishing pad
CN104449441A (en) * 2013-09-13 2015-03-25 日东电工株式会社 Adhesive sheet for fastening polishing pad
JP2015078348A (en) * 2013-09-13 2015-04-23 日東電工株式会社 Pressure-sensitive adhesive sheet for fastening polishing pad
CN104449441B (en) * 2013-09-13 2022-06-17 日东电工株式会社 Adhesive sheet for fixing polishing pad
JP2021088614A (en) * 2019-12-02 2021-06-10 東洋インキScホールディングス株式会社 Adhesive for fixing abrasive member and adhesive sheet
JP7318510B2 (en) 2019-12-02 2023-08-01 東洋インキScホールディングス株式会社 Adhesive and Adhesive Sheet for Fixing Abrasive Member

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