JP3220364U

JP3220364U - Holding device

Info

Publication number: JP3220364U
Application number: JP2018004954U
Authority: JP
Inventors: 秀昭加藤; 明紀當摩
Original assignee: Lintec Corp
Current assignee: Lintec Corp
Priority date: 2018-12-19
Filing date: 2018-12-19
Publication date: 2019-02-28
Anticipated expiration: 2028-12-19

Abstract

【課題】円形状の被保持面を有する第１保持対象物と、第１保持対象物の直径と同じ長さの４辺からなる正方形状の被保持面を有する第２保持対象物とを外縁部まで確実に保持することができる保持装置を提供すること。【解決手段】保持装置ＥＡは、保持対象物を保持可能な保持面１２Ａに平面視正方形状の保持部ＨＴを有する保持機構１０と、保持部ＨＴに保持力を付与する保持力付与機構２０とを備え、保持部ＨＴは、第１隔壁ＷＬ１によって、当該保持部ＨＴを構成する４辺全てに内接する平面視円形状の第１保持部ＨＴ１と、当該第１保持部ＨＴ１に隣接する複数の第２保持部ＨＴ２とに区画され、保持力付与機構２０は、第１保持部ＨＴ１および第２保持部ＨＴ２に、それぞれ独立して保持力を付与する第１保持力付与機構２１と第２保持力付与機構２２とを備えている。【選択図】図１An outer edge of a first holding object having a circular holding surface and a second holding object having a square holding surface having four sides having the same length as the diameter of the first holding object. To provide a holding device that can securely hold up to a part. A holding device EA includes a holding mechanism 10 having a holding portion HT having a square shape in plan view on a holding surface 12A capable of holding a holding object, and a holding force applying mechanism 20 that applies a holding force to the holding portion HT. The holding portion HT includes a first holding portion HT1 having a circular shape in plan view that is inscribed in all four sides of the holding portion HT, and a plurality of adjoining the first holding portions HT1 by the first partition wall WL1. The holding force application mechanism 20 is partitioned into a second holding unit HT2 and the first holding force applying mechanism 21 and the second holding unit 20 apply the holding force independently to the first holding unit HT1 and the second holding unit HT2, respectively. And a force applying mechanism 22. [Selection] Figure 1

Description

本考案は、保持装置に関する。 The present invention relates to a holding device.

従来、被保持面の形状が異なる保持対象物を選択的に保持可能な保持面を有する保持装置が知られている（例えば、特許文献１参照）。 2. Description of the Related Art Conventionally, a holding device having a holding surface capable of selectively holding objects to be held having different shapes of held surfaces is known (see, for example, Patent Document 1).

特開２０１３−２２６６０７号公報JP 2013-226607 A

しかしながら、特許文献１に記載されたチャックテーブル１（保持装置）は、保持面における吸引部２００（保持部）の形状が、板状ワーク３２の円形状の被保持面の外縁に沿った円形状とされているため、当該板状ワーク３２を第１保持対象物とした場合、当該第１保持対象物の直径と同じ長さの４辺からなる正方形状の被保持面を有する第２保持対象物を保持面で保持しようとした場合、当該第２保持対象の被保持面の角部が保持部からはみ出てしまい、当該第２保持対象物の外縁部を確実に保持することができないという不都合がある。 However, in the chuck table 1 (holding device) described in Patent Document 1, the shape of the suction portion 200 (holding portion) on the holding surface is circular along the outer edge of the circular held surface of the plate-like workpiece 32. Therefore, when the plate-like workpiece 32 is a first holding object, the second holding object has a square-shaped holding surface having four sides having the same length as the diameter of the first holding object. When an object is to be held by the holding surface, the corner portion of the held surface of the second holding object protrudes from the holding part, and the outer edge part of the second holding object cannot be reliably held. There is.

本考案の目的は、円形状の被保持面を有する第１保持対象物と、第１保持対象物の直径と同じ長さの４辺からなる正方形状の被保持面を有する第２保持対象物とを外縁部まで確実に保持することができる保持装置を提供することにある。 An object of the present invention is to provide a first holding object having a circular holding surface and a second holding object having a square holding surface having four sides having the same length as the diameter of the first holding object. It is an object of the present invention to provide a holding device that can securely hold the outer edge to the outer edge.

本考案は、請求項に記載した構成を採用した。 The present invention employs the structure described in the claims.

本考案によれば、保持部が、当該保持部を構成する４辺全てに内接する平面視円形状の第１保持部と、当該第１保持部に隣接する複数の第２保持部とに区画され、第１保持部および複数の第２保持部に、それぞれ独立して保持力を付与することができるので、円形状の被保持面を有する第１保持対象物と、第１保持対象物の直径と同じ長さの４辺からなる正方形状の被保持面を有する第２保持対象物とを外縁部まで確実に保持することができる。
また、第１保持部が、相互に隣接する第３保持部と第４保持部とに区画され、第３保持部および第４保持部に、それぞれ独立して保持力を付与することができるので、第１保持対象物が二分割されていたとしても、それら両方を外縁部まで確実に保持することができる。 According to the present invention, the holding part is divided into a first holding part having a circular shape in plan view that is inscribed in all four sides constituting the holding part, and a plurality of second holding parts adjacent to the first holding part. Since the holding force can be independently applied to the first holding part and the plurality of second holding parts, the first holding object having the circular held surface and the first holding object It is possible to reliably hold the second holding object having the square holding surface having four sides having the same length as the diameter up to the outer edge portion.
Moreover, since the 1st holding | maintenance part is divided into the 3rd holding | maintenance part and the 4th holding | maintenance part adjacent to each other, a holding force can be independently provided to a 3rd holding | maintenance part and a 4th holding | maintenance part, respectively. Even if the first object to be held is divided into two, both of them can be reliably held to the outer edge.

本考案の一実施形態に係る保持装置の説明図。Explanatory drawing of the holding | maintenance apparatus which concerns on one Embodiment of this invention.

以下、本考案の一実施形態を図面に基づいて説明する。
なお、本実施形態におけるＸ軸、Ｙ軸、Ｚ軸は、それぞれが直交する関係にあり、Ｘ軸およびＹ軸は、所定平面内の軸とし、Ｚ軸は、前記所定平面に直交する軸とする。さらに、本実施形態では、Ｙ軸と平行な図１の手前方向から観た場合を基準とし、方向を示した場合、「上」がＺ軸の矢印方向で「下」がその逆方向、「左」がＸ軸の矢印方向で「右」がその逆方向、「前」がＹ軸と平行な図１中手前方向で「後」がその逆方向とする。また、平面視とは、Ｚ軸上方から下方を見下ろした視野のことである。 Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In this embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes in a predetermined plane, and the Z axis is an axis that is orthogonal to the predetermined plane. To do. Furthermore, in the present embodiment, when viewed from the near side of FIG. 1 parallel to the Y axis, when indicating the direction, “up” is the arrow direction of the Z axis, “down” is the opposite direction, “ The “left” is the arrow direction of the X axis, “right” is the opposite direction, “front” is the front direction in FIG. 1 parallel to the Y axis, and “rear” is the opposite direction. Also, the plan view is a field of view looking down from above the Z axis.

図１において、保持装置ＥＡは、保持対象物ＷＫを保持可能な保持面１２Ａに平面視正方形状の保持部ＨＴを有する保持機構１０と、保持部ＨＴに保持力としての吸引力を付与する保持力付与機構２０とを備え、保持装置ＥＡで保持した保持対象物ＷＫに接着シートＡＳを押圧して貼付する貼付機構３０とでシート貼付装置ＥＡ１を形成している。 In FIG. 1, the holding device EA has a holding mechanism 10 having a holding portion HT having a square shape in plan view on a holding surface 12A capable of holding the holding object WK, and a holding device that applies a suction force as a holding force to the holding portion HT. The sheet applying device EA1 is formed by a pasting mechanism 30 that includes the force applying mechanism 20 and presses and adheres the adhesive sheet AS to the holding object WK held by the holding device EA.

保持機構１０は、駆動機器としてのリニアモータ１１のスライダ１１Ａに支持され、その上面が保持面１２Ａとされたテーブル１２を備えている。
保持面１２Ａに設けられた保持部ＨＴは、第１隔壁ＷＬ１によって、当該保持部ＨＴを構成する４辺全てに内接する平面視円形状の第１保持部ＨＴ１と、当該第１保持部ＨＴ１に隣接する複数の第２保持部ＨＴ２とに区画されている。第１保持部ＨＴ１は、当該第１保持部ＨＴ１を構成する円周部の２箇所に一端と他端とを有する第２隔壁ＷＬ２によって、相互に隣接する第３保持部ＨＴ１Ａと第４保持部ＨＴ１Ｂとに区画されている。
第２、第３、第４保持部ＨＴ２、ＨＴ１Ａ、ＨＴ１Ｂで構成される保持部ＨＴは、保持対象物ＷＫとしての正方形状の基板ＷＫ１の被保持面と同形状とされ、第３、第４保持部ＨＴ１Ａ、ＨＴ１Ｂで構成される保持部ＨＴ部分は、保持対象物ＷＫとしての円形の半導体ウエハ（以下、単に「ウエハ」ともいう）ＷＫ２の被保持面と同形状とされ、第３保持部ＨＴ１Ａで構成される保持部ＨＴ部分は、オリエンテーションフラットを有する保持対象物ＷＫとしての図示しないオリフラ付きウエハの被保持面と同形状とされている。
なお、ウエハＷＫ２または図示しないオリフラ付きウエハの被保持面の円周部は、基板ＷＫ１の被保持面を構成する４辺全てに内接する円形状または円弧状となっている。また、第２、第３、第４保持部ＨＴ２、ＨＴ１Ａ、ＨＴ１Ｂは、それぞれポーラス体で構成され、第１、第２隔壁ＷＬ１、ＷＬ２で区画された凹部内に配置されている。さらに、図１に示すテーブル１２の断面図は、図１中の符号ＡＡで示した図におけるテーブル１２のＢＢ−ＢＢ断面ＣＣ矢視図である。 The holding mechanism 10 includes a table 12 that is supported by a slider 11A of a linear motor 11 as a driving device, and whose upper surface is a holding surface 12A.
The holding portion HT provided on the holding surface 12A is divided into a first holding portion HT1 having a circular shape in a plan view inscribed in all four sides constituting the holding portion HT and the first holding portion HT1 by the first partition wall WL1. It is partitioned into a plurality of adjacent second holding portions HT2. The first holding part HT1 is composed of a third holding part HT1A and a fourth holding part that are adjacent to each other by a second partition wall WL2 having one end and the other end at two locations on the circumferential part of the first holding part HT1. It is partitioned into HT1B.
The holding unit HT configured by the second, third, and fourth holding units HT2, HT1A, and HT1B has the same shape as the held surface of the square substrate WK1 as the holding object WK. The holding portion HT configured by the holding portions HT1A and HT1B has the same shape as the holding surface of a circular semiconductor wafer (hereinafter simply referred to as “wafer”) WK2 as the holding object WK, and the third holding portion. The holding portion HT portion constituted by HT1A has the same shape as a held surface of a wafer with an orientation flat (not shown) as a holding object WK having an orientation flat.
The circumferential portion of the held surface of wafer WK2 or the wafer with orientation flat (not shown) has a circular shape or an arc shape inscribed in all four sides constituting the held surface of substrate WK1. The second, third, and fourth holding portions HT2, HT1A, and HT1B are each composed of a porous body, and are disposed in the recesses defined by the first and second partition walls WL1 and WL2. Furthermore, the sectional view of the table 12 shown in FIG. 1 is a BB-BB section CC arrow view of the table 12 in the diagram indicated by the reference AA in FIG.

保持力付与機構２０は、第１保持部ＨＴ１および複数の第２保持部ＨＴ２に、それぞれ独立して保持力を付与する第１保持力付与機構２１と第２保持力付与機構２２とを備えている。
第１保持力付与機構２１は、第３保持部ＨＴ１Ａおよび第４保持部ＨＴ１Ｂに、それぞれ独立して保持力を付与する第３保持力付与機構２１Ａと第４保持力付与機構２１Ｂとを備えている。
なお、第２、第３、第４保持力付与機構２２、２１Ａ、２１Ｂは、減圧ポンプや真空エジェクタ等が例示できる。 The holding force application mechanism 20 includes a first holding force application mechanism 21 and a second holding force application mechanism 22 that apply a holding force independently to the first holding unit HT1 and the plurality of second holding units HT2, respectively. Yes.
The first holding force applying mechanism 21 includes a third holding force applying mechanism 21A and a fourth holding force applying mechanism 21B that apply a holding force independently to the third holding unit HT1A and the fourth holding unit HT1B, respectively. Yes.
In addition, the 2nd, 3rd, 4th holding force provision mechanism 22, 21A, 21B can illustrate a decompression pump, a vacuum ejector, etc.

貼付機構３０は、剥離シートＲＬの一方の面に接着シートＡＳが仮着された原反ＲＳを支持する支持ローラ３１と、原反ＲＳを案内するガイドローラ３２と、剥離縁３３Ａで剥離シートＲＬを折り返し、当該剥離シートＲＬから接着シートＡＳを剥離する剥離手段としての剥離板３３と、保持装置ＥＡで保持した保持対象物ＷＫに接着シートＡＳを押圧して貼付する押圧手段としての押圧ローラ３４と、駆動機器としての回動モータ３５Ａの図示しない出力軸に支持され、ピンチローラ３５Ｂとで剥離シートＲＬを挟み込む駆動ローラ３５と、図示しない駆動機器の出力軸に支持され、シート貼付装置ＥＡ１の自動運転が行われている間、ピンチローラ３５Ｂとの間に存在する剥離シートＲＬに常に所定の張力を付与し、当該剥離シートＲＬを回収する回収手段としての回収ローラ３６とを備えている。 The affixing mechanism 30 includes a support roller 31 for supporting the original fabric RS having the adhesive sheet AS temporarily attached to one surface of the release sheet RL, a guide roller 32 for guiding the original fabric RS, and a release edge 33A. And a release plate 33 as a peeling means for peeling the adhesive sheet AS from the release sheet RL, and a pressing roller 34 as a pressing means for pressing and sticking the adhesive sheet AS to the holding object WK held by the holding device EA. Supported by an output shaft (not shown) of a rotation motor 35A as a drive device, and supported by an output shaft of a drive device (not shown) and a drive roller 35 sandwiching the release sheet RL with a pinch roller 35B. During the automatic operation, a predetermined tension is always applied to the release sheet RL existing between the pinch roller 35B and the release sheet RL. And a recovery roller 36 serving as recovery means for recovering.

以上の保持装置ＥＡを備えたシート貼付装置ＥＡ１の動作を説明する。
先ず、図１中実線で示す初期位置に各部材が配置されたシート貼付装置ＥＡ１に対し、当該シート貼付装置ＥＡ１の使用者（以下、単に「使用者」という）が原反ＲＳを同図に示すようにセットした後、操作パネルやパーソナルコンピュータ等の図示しない操作機器を介して自動運転開始の信号を入力する。すると、貼付機構３０が回動モータ３５Ａを駆動し、原反ＲＳを繰り出し、図１中実線で示すように、先頭の接着シートＡＳの繰出方向先端部が剥離板３３の剥離縁３３Ａで所定長さ剥離されると、回動モータ３５Ａの駆動を停止する。 Operation | movement of the sheet sticking apparatus EA1 provided with the above holding | maintenance apparatus EA is demonstrated.
First, with respect to the sheet sticking device EA1 in which each member is arranged at an initial position indicated by a solid line in FIG. 1, a user of the sheet sticking device EA1 (hereinafter, simply referred to as “user”) shows the raw fabric RS After setting as shown, an automatic operation start signal is input via an operation device (not shown) such as an operation panel or a personal computer. Then, the sticking mechanism 30 drives the rotation motor 35A to feed out the original fabric RS, and the leading end of the leading adhesive sheet AS in the feeding direction is a predetermined length at the peeling edge 33A of the peeling plate 33 as shown by the solid line in FIG. When peeled off, the drive of the rotation motor 35A is stopped.

次いで、使用者または、多関節ロボットやベルトコンベア等の図示しない搬送機構が、図１中実線で示すように、ウエハＷＫ２を第３、第４保持部ＨＴ１Ａ、ＨＴ１Ｂ上に載置すると、保持力付与機構２０が第３、第４保持力付与機構２１Ａ、２１Ｂを駆動し、それら第３、第４保持部ＨＴ１Ａ、ＨＴ１ＢでのウエハＷＫ２の吸着保持を開始する。なお、使用者または図示しない搬送機構が、図１中二点鎖線で示すように、基板ＷＫ１を第２、第３、第４保持部ＨＴ２、ＨＴ１Ａ、ＨＴ１Ｂ上に載置すると、保持力付与機構２０が第２、第３、第４保持力付与機構２２、２１Ａ、２１Ｂを駆動し、それら第２、第３、第４保持部ＨＴ２、ＨＴ１Ａ、ＨＴ１Ｂでの基板ＷＫ１の吸着保持を開始する。また、使用者または図示しない搬送機構が、図示しないオリフラ付きウエハを第３保持部ＨＴ１Ａ上に載置すると、保持力付与機構２０が第３保持力付与機構２１Ａを駆動し、当該第３保持部ＨＴ１Ａでの図示しないオリフラ付きウエハの吸着保持を開始する。 Next, when the user or a transfer mechanism (not shown) such as an articulated robot or a belt conveyor places the wafer WK2 on the third and fourth holding portions HT1A and HT1B as shown by the solid line in FIG. The applying mechanism 20 drives the third and fourth holding force applying mechanisms 21A and 21B, and starts sucking and holding the wafer WK2 by the third and fourth holding portions HT1A and HT1B. Note that when the user or a transport mechanism (not shown) places the substrate WK1 on the second, third, and fourth holding portions HT2, HT1A, and HT1B, as shown by a two-dot chain line in FIG. 20 drives the second, third, and fourth holding force applying mechanisms 22, 21A, and 21B, and starts holding the substrate WK1 by suction with the second, third, and fourth holding portions HT2, HT1A, and HT1B. When the user or a transport mechanism (not shown) places a wafer with an orientation flat (not shown) on the third holding unit HT1A, the holding force applying mechanism 20 drives the third holding force applying mechanism 21A, and the third holding unit The suction holding of the wafer with orientation flat (not shown) at HT1A is started.

その後、保持機構１０がリニアモータ１１を駆動し、テーブル１２を左方に移動させ、テーブル１２が所定の位置に到達すると、貼付機構３０が回動モータ３５Ａを駆動し、テーブル１２の移動速度に合わせて原反ＲＳを繰り出す。これにより、接着シートＡＳは、剥離板３３の剥離縁３３Ａで剥離シートＲＬから剥離され、押圧ローラ３４によってウエハＷＫ２に押圧されて貼付される。なお、基板ＷＫ１や図示しないオリフラ付きウエハが保持面１２Ａに保持されている場合、当該基板ＷＫ１または図示しないオリフラ付きウエハに接着シートＡＳが押圧されて貼付される。次に、先頭の接着シートＡＳに次ぐ次の接着シートＡＳの繰出方向先端部が剥離板３３の剥離縁３３Ａで所定長さ剥離されると、貼付機構３０が回動モータ３５Ａの駆動を停止する。 Thereafter, the holding mechanism 10 drives the linear motor 11 to move the table 12 to the left, and when the table 12 reaches a predetermined position, the sticking mechanism 30 drives the rotation motor 35A, and the moving speed of the table 12 is increased. Together with the raw fabric RS. As a result, the adhesive sheet AS is peeled off from the release sheet RL at the release edge 33A of the release plate 33, and is pressed and stuck to the wafer WK2 by the pressing roller. When the substrate WK1 or the wafer with orientation flat (not shown) is held on the holding surface 12A, the adhesive sheet AS is pressed and pasted to the substrate WK1 or the wafer with orientation flat (not shown). Next, when the leading end in the feeding direction of the next adhesive sheet AS next to the first adhesive sheet AS is peeled for a predetermined length by the peeling edge 33A of the peeling plate 33, the sticking mechanism 30 stops driving the rotation motor 35A. .

ウエハＷＫ２への接着シートＡＳの貼付が完了し、テーブル１２が所定の位置に到達すると、保持機構１０がリニアモータ１１の駆動を停止した後、保持力付与機構２０が第３、第４保持力付与機構２１Ａ、２１Ｂの駆動を停止し、第３、第４保持部ＨＴ１Ａ、ＨＴ１ＢでのウエハＷＫ２の吸着保持を解除する。なお、基板ＷＫ１が保持面１２Ａに保持されている場合、保持機構１０がリニアモータ１１の駆動を停止した後、保持力付与機構２０が第２、第３、第４保持力付与機構２２、２１Ａ、２１Ｂの駆動を停止し、第２、第３、第４保持部ＨＴ２、ＨＴ１Ａ、ＨＴ１Ｂでの基板ＷＫ１の吸着保持を解除する。また、図示しないオリフラ付きウエハが保持面１２Ａに保持されている場合、保持機構１０がリニアモータ１１の駆動を停止した後、保持力付与機構２０が第３保持力付与機構２１Ａの駆動を停止し、第３保持部ＨＴ１Ａでの図示しないオリフラ付きウエハの吸着保持を解除する。そして、使用者または図示しない搬送機構が、接着シートＡＳが貼付されたウエハＷＫ２を次工程に搬送すると、保持機構１０がリニアモータ１１を駆動し、テーブル１２を初期位置に復帰させ、以降上記同様の動作が繰り返される。 When the adhesion of the adhesive sheet AS to the wafer WK2 is completed and the table 12 reaches a predetermined position, the holding mechanism 10 stops driving the linear motor 11, and then the holding force applying mechanism 20 has the third and fourth holding forces. The driving of the applying mechanisms 21A and 21B is stopped, and the suction holding of the wafer WK2 by the third and fourth holding portions HT1A and HT1B is released. When the substrate WK1 is held on the holding surface 12A, after the holding mechanism 10 stops driving the linear motor 11, the holding force applying mechanism 20 is operated by the second, third, and fourth holding force applying mechanisms 22, 21A. , 21B are stopped, and the suction and holding of the substrate WK1 by the second, third, and fourth holding portions HT2, HT1A, and HT1B is released. When the orientation flat wafer (not shown) is held on the holding surface 12A, the holding mechanism 10 stops driving the linear motor 11, and then the holding force applying mechanism 20 stops driving the third holding force applying mechanism 21A. Then, the suction holding of the wafer with orientation flat (not shown) in the third holding unit HT1A is released. When the user or a transport mechanism (not shown) transports the wafer WK2 to which the adhesive sheet AS is attached to the next process, the holding mechanism 10 drives the linear motor 11 to return the table 12 to the initial position. Is repeated.

以上のような実施形態によれば、保持部ＨＴが、当該保持部ＨＴを構成する４辺全てに内接する平面視円形状の第１保持部ＨＴ１と、当該第１保持部ＨＴ１に隣接する複数の第２保持部ＨＴ２とに区画され、第１保持部ＨＴ１および複数の第２保持部ＨＴ２に、それぞれ独立して保持力を付与することができるので、円形状の被保持面を有するウエハＷＫ２と、ウエハＷＫ２の直径と同じ長さの４辺からなる正方形状の被保持面を有する基板ＷＫ１とを外縁部まで確実に保持することができる。 According to the embodiment as described above, the holding part HT includes a first holding part HT1 having a circular shape in plan view that is inscribed in all four sides constituting the holding part HT, and a plurality of the holding parts HT adjacent to the first holding part HT1. Since the first holding unit HT1 and the plurality of second holding units HT2 can be independently applied with holding force, the wafer WK2 having a circular holding surface can be provided. In addition, the substrate WK1 having a square held surface having four sides having the same length as the diameter of the wafer WK2 can be reliably held to the outer edge.

以上のように、本考案を実施するための最良の構成、方法等は、前記記載で開示されているが、本考案は、これに限定されるものではない。すなわち、本考案は、主に特定の実施形態に関して特に図示され、かつ説明されているが、本考案の技術的思想および目的の範囲から逸脱することなく、以上述べた実施形態に対し、形状、材質、数量、その他の詳細な構成において、当業者が様々な変形を加えることができるものである。また、上記に開示した形状、材質などを限定した記載は、本考案の理解を容易にするために例示的に記載したものであり、本考案を限定するものではないから、それらの形状、材質などの限定の一部もしくは全部の限定を外した部材の名称での記載は、本考案に含まれる。 As described above, the best configuration, method and the like for carrying out the present invention are disclosed in the above description, but the present invention is not limited to this. That is, although the present invention has been illustrated and described with particular reference to particular embodiments, it will be understood that the present invention is not limited to the above-described embodiments without departing from the scope of the technical idea and purpose of the present invention. Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description limited to the shape, material, etc. disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of some or all of such limitation is included in this invention.

例えば、保持機構１０は、リニアモータ１３を備えていなくてもよい。
保持面１２Ａは、保持部ＨＴを含む大きさであれば、平面視において、円形、楕円形、三角形や五角形等の多角形でもよい。
第２、第３、第４保持部ＨＴ２、ＨＴ１Ａ、ＨＴ１Ｂは、ポーラス体で構成されたものに限られず、例えば、板状の部材に１または複数の吸引孔が設けられたものでもよい。
第２隔壁ＷＬ２は、平面視において、Ｖ字形状、Ｕ字形状、矩形状、曲線形状、波形状等の形状でもよいし、第１保持部ＨＴ１を区画する必要がない場合、なくてもよい。 For example, the holding mechanism 10 may not include the linear motor 13.
The holding surface 12A may be a polygon such as a circle, an ellipse, a triangle, or a pentagon in plan view as long as the holding surface HT has a size including the holding portion HT.
The second, third, and fourth holding portions HT2, HT1A, and HT1B are not limited to those formed of a porous body, and for example, a plate-like member provided with one or a plurality of suction holes may be used.
The second partition wall WL2 may have a V shape, a U shape, a rectangular shape, a curved shape, a wave shape, or the like in plan view, or may not be provided when the first holding portion HT1 is not required to be partitioned. .

保持力付与機構２０は、クーロン力、接着剤、粘着剤、磁力、ベルヌーイ吸着等で保持力を付与してもよく、第２、第３、第４保持部ＨＴ２、ＨＴ１Ａ、ＨＴ１Ｂに電極、接着剤、粘着剤、磁石、吸引孔等を設けてもよいし、第２、第３、第４保持部ＨＴ２、ＨＴ１Ａ、ＨＴ１それぞれに切替弁で独立して保持力を付与してもよい。 The holding force applying mechanism 20 may apply a holding force by a Coulomb force, an adhesive, an adhesive, a magnetic force, Bernoulli adsorption, etc., and an electrode is bonded to the second, third, and fourth holding portions HT2, HT1A, and HT1B. An agent, an adhesive, a magnet, a suction hole, or the like may be provided, or a holding force may be independently applied to each of the second, third, and fourth holding portions HT2, HT1A, and HT1 by a switching valve.

貼付機構３０は、剥離シートＲＬに仮着された帯状の接着シート基材（帯状の基材シートと帯状の接着剤層）に閉ループ状または短寸幅方向全体の切込が形成されることで、その切込で仕切られた所定の領域が接着シートＡＳとされた原反を繰り出してもよいし、帯状の接着シート基材が剥離シートＲＬに仮着された原反を採用し、接着シート基材に閉ループ状または短寸幅方向全体の切込を切断機構で形成し、その切込で仕切られた所定の領域を接着シートＡＳとしてもよいし、接着シートＡＳを剥離シートＲＬから剥離する際、原反ＲＳに所定の張力が付与されるように回動モータ３５Ａのトルク制御を行ってもよいし、支持ローラ３１やガイドローラ３２等の各ローラの代わりに板状部材やシャフト部材等で原反ＲＳや剥離シートＲＬを支持したり案内したりしてもよいし、原反ＲＳを巻回することなく例えばファンフォールド折りにして支持してもよいし、回収手段は、剥離シートＲＬを巻回することなく例えばファンフォールド折りにしたり、シュレッダ等で切り刻んだりして回収してもよいし、巻回したりファンフォールド折りにしたりすることなく単に集積して剥離シートＲＬを回収してもよいし、剥離シートＲＬを回収しなくてもよい。 The sticking mechanism 30 is formed by forming a notch in a closed loop shape or in the entire short width direction in a belt-like adhesive sheet base material (a belt-like base material sheet and a belt-like adhesive layer) temporarily attached to the release sheet RL. The raw material in which the predetermined area partitioned by the incision is the adhesive sheet AS may be fed out, or the raw material in which the belt-like adhesive sheet base material is temporarily attached to the release sheet RL is adopted. A cut in the closed loop shape or the entire short width direction is formed in the base material by a cutting mechanism, and a predetermined area partitioned by the cut may be used as the adhesive sheet AS, or the adhesive sheet AS is peeled from the release sheet RL. At this time, the torque of the rotation motor 35A may be controlled so that a predetermined tension is applied to the original fabric RS, or a plate-like member, a shaft member, etc., instead of each roller such as the support roller 31 and the guide roller 32 Raw material RS and release sheet RL It may be supported or guided, and may be supported, for example, by fanfold folding without winding the original fabric RS, and the recovery means may be, for example, fanfold without winding the release sheet RL. The release sheet RL may be collected by being folded or chopped with a shredder or the like, or simply collected without being wound or fanfold folded, or the release sheet RL may be recovered. It does not have to be.

保持装置ＥＡは、シート貼付装置ＥＡ１以外に、例えば、保持対象物ＷＫに貼付された接着シートＡＳを保持対象物ＷＫから剥離するシート剥離装置や、保持対象物ＷＫを位置決めする位置決め装置等に採用されてもよい。 In addition to the sheet sticking device EA1, the holding device EA is employed, for example, in a sheet peeling device that peels the adhesive sheet AS stuck on the holding object WK from the holding object WK, a positioning device that positions the holding object WK, and the like. May be.

接着シートＡＳおよび保持対象物ＷＫの材質、種別、形状等は、特に限定されることはない。例えば、接着シートＡＳは、円形、楕円形、三角形や四角形等の多角形、その他の形状であってもよいし、感圧接着性、感熱接着性等の接着形態のものであってもよく、感熱接着性の接着シートＡＳが採用された場合は、当該接着シートＡＳを加熱する適宜なコイルヒータやヒートパイプ等の加熱側等の加熱機構を設けるといった適宜な方法で接着されればよい。また、このような接着シートＡＳは、例えば、接着剤層だけの単層のもの、基材シートと接着剤層との間に中間層を有するもの、基材シートの上面にカバー層を有する等３層以上のもの、更には、基材シートを接着剤層から剥離することのできる所謂両面接着シートのようなものであってもよく、両面接着シートは、単層又は複層の中間層を有するものや、中間層のない単層又は複層のものであってよい。また、保持対象物ＷＫとしては、例えば、食品、樹脂容器、シリコン半導体ウエハや化合物半導体ウエハ等の半導体ウエハ、回路基板、光ディスク等の情報記録基板、ガラス板、鋼板、陶器、木板または樹脂板等、任意の形態の部材や物品なども対象とすることができる。なお、接着シートＡＳを機能的、用途的な読み方に換え、例えば、情報記載用ラベル、装飾用ラベル、保護シート、ダイシングテープ、ダイアタッチフィルム、ダイボンディングテープ、記録層形成樹脂シート等の任意の形状の任意のシート、フィルム、テープ等を前述のような任意の保持対象物ＷＫに貼付することができる。 The material, type, shape, etc. of the adhesive sheet AS and the holding object WK are not particularly limited. For example, the adhesive sheet AS may be a circle, an ellipse, a polygon such as a triangle or a quadrangle, or other shapes, or may be of an adhesive form such as pressure sensitive adhesive or heat sensitive adhesive, When the heat-sensitive adhesive sheet AS is employed, it may be bonded by an appropriate method such as providing an appropriate coil heater for heating the adhesive sheet AS or a heating mechanism such as a heating side such as a heat pipe. Such an adhesive sheet AS is, for example, a single layer having only an adhesive layer, an intermediate layer between the base sheet and the adhesive layer, a cover layer on the upper surface of the base sheet, etc. Three or more layers, or a so-called double-sided adhesive sheet that can peel the base sheet from the adhesive layer may be used. The double-sided adhesive sheet comprises a single-layer or multi-layer intermediate layer. It may be a single layer or a multilayer having no intermediate layer. Examples of the holding object WK include foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, information recording substrates such as circuit boards and optical disks, glass plates, steel plates, ceramics, wood plates, or resin plates. Any form of member or article can also be targeted. In addition, the adhesive sheet AS is replaced with a functional and intended reading, for example, any information label, decorative label, protective sheet, dicing tape, die attach film, die bonding tape, recording layer forming resin sheet, etc. Any sheet, film, tape, or the like having a shape can be attached to any holding object WK as described above.

本考案における機構および工程は、それら機構および工程について説明した動作、機能または工程を果たすことができる限りなんら限定されることはなく、まして、前記実施形態で示した単なる一実施形態の構成物や工程に全く限定されることはない。例えば、保持力付与機構は、保持部に保持力を付与するものであって、第１保持部および複数の第２保持部に、それぞれ独立して保持力を付与する第１保持力付与機構と第２保持力付与機構とを備えているものであれば、出願当初の技術常識に照らし合わせ、その技術範囲内のものであればなんら限定されることはない（その他の手段および工程も同じ）。
また、前記実施形態における駆動機器は、回動モータ、直動モータ、リニアモータ、単軸ロボット、多関節ロボット等の電動機器、エアシリンダ、油圧シリンダ、ロッドレスシリンダおよびロータリシリンダ等のアクチュエータ等を採用することができる上、それらを直接的又は間接的に組み合せたものを採用することもできる（実施形態で例示したものと重複するものもある）。
前記実施形態において、ローラが採用されている場合、各ローラを回転駆動させる駆動機器を備えてもよいし、各ローラの表面をゴムや樹脂等の弾性変形が可能な部材で構成してもよいし、各ローラを弾性変形しない部材で構成してもよいし、押圧ローラや押圧ヘッド等の貼付機構や押圧部材が採用されている場合、上記で例示したものに代えてまたは併用して、ローラ、丸棒、ブレード材、ゴム、樹脂、スポンジ等による押圧部材を採用したり、大気やガス等のエアの吹き付けにより押圧する構成を採用したりしてもよいし、貼付機構や押圧部材の押圧部をゴムや樹脂等の弾性変形が可能な部材で構成してもよいし、弾性変形しない部材で構成してもよいし、剥離機構や剥離部材が採用されている場合は、板状部材、丸棒、ローラ等で構成してもよいし、支持（保持）機構や支持（保持）部材等の被支持部材を支持または保持する構成のものが採用されている場合、メカチャックやチャックシリンダ等の把持機構、クーロン力、接着剤、粘着剤、磁力、ベルヌーイ吸着、駆動機器等で被支持部材を支持（保持）する構成を採用してもよいし、切断機構や切断刃が採用されている場合、カッター刃、レーザカッタ、イオンビーム、火力、熱、水圧、電熱線、気体や液体等の吹付け等の切断部材を採用したり、適宜な駆動機器を組み合わせたもので切断部材を移動させて切断するようにしたりしてもよい。 The mechanism and process in the present invention are not limited in any way as long as the operation, function, or process described with respect to the mechanism and process can be performed. Furthermore, the structure and process of only one embodiment shown in the above embodiment are not limited. The process is not limited at all. For example, the holding force applying mechanism applies a holding force to the holding unit, and includes a first holding force applying mechanism that independently applies a holding force to the first holding unit and the plurality of second holding units. As long as it has a second holding force imparting mechanism, there is no limitation as long as it is within the technical scope in light of the common general technical knowledge at the time of filing (other means and processes are the same). .
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).
In the above-described embodiment, when rollers are employed, a drive device that rotationally drives each roller may be provided, or the surface of each roller may be configured with a member capable of elastic deformation such as rubber or resin. Each roller may be constituted by a member that does not elastically deform, or when a sticking mechanism or a pressing member such as a pressing roller or a pressing head is employed, instead of or in combination with those exemplified above, a roller A pressing member made of a round bar, blade material, rubber, resin, sponge, or the like may be employed, or a structure may be employed that is pressed by blowing air such as air or gas. The part may be composed of a member that can be elastically deformed, such as rubber or resin, or may be composed of a member that is not elastically deformed, and when a peeling mechanism or a peeling member is employed, a plate-like member, Consists of round bars, rollers, etc. Alternatively, when a structure that supports or holds a supported member such as a support (holding) mechanism or a support (holding) member is adopted, a gripping mechanism such as a mechanical chuck or a chuck cylinder, coulomb force, adhesion A structure that supports (holds) the supported member with an agent, adhesive, magnetic force, Bernoulli adsorption, drive device, etc. may be adopted, and when a cutting mechanism or cutting blade is adopted, a cutter blade, a laser cutter, A cutting member such as ion beam, thermal power, heat, water pressure, heating wire, spraying of gas or liquid, etc. is adopted, or the cutting member is moved with a combination of appropriate driving equipment to cut. Also good.

ＥＡ…保持装置
１０…保持機構
１２Ａ…保持面
２０…保持力付与機構
２１…第１保持力付与機構
２１Ａ…第３保持力付与機構
２１Ｂ…第４保持力付与機構
２２…第２保持力付与機構
ＨＴ…保持部
ＨＴ１…第１保持部
ＨＴ１Ａ…第３保持部
ＨＴ１Ｂ…第４保持部
ＨＴ２…第２保持部
ＷＫ…保持対象物
ＷＫ１…基板
ＷＫ２…ウエハ
ＷＬ１…第１隔壁
ＷＬ２…第２隔壁 EA ... holding device 10 ... holding mechanism 12A ... holding surface 20 ... holding force applying mechanism 21 ... first holding force applying mechanism 21A ... third holding force applying mechanism 21B ... fourth holding force applying mechanism 22 ... second holding force applying mechanism HT ... Holding unit HT1 ... First holding unit HT1A ... Third holding unit HT1B ... Fourth holding unit HT2 ... Second holding unit WK ... Holding object WK1 ... Substrate WK2 ... Wafer WL1 ... First partition WL2 ... Second partition

Claims

保持対象物を保持可能な保持面に平面視正方形状の保持部を有する保持機構と、
前記保持部に保持力を付与する保持力付与機構とを備え、
前記保持部は、第１隔壁によって、当該保持部を構成する４辺全てに内接する平面視円形状の第１保持部と、当該第１保持部に隣接する複数の第２保持部とに区画され、
前記保持力付与機構は、前記第１保持部および前記複数の第２保持部に、それぞれ独立して保持力を付与する第１保持力付与機構と第２保持力付与機構とを備えていることを特徴とする保持装置。 A holding mechanism having a holding portion having a square shape in plan view on a holding surface capable of holding a holding object;
A holding force applying mechanism for applying a holding force to the holding unit,
The holding part is divided into a first holding part having a circular shape in plan view inscribed in all four sides constituting the holding part and a plurality of second holding parts adjacent to the first holding part by the first partition. And
The holding force applying mechanism includes a first holding force applying mechanism and a second holding force applying mechanism that independently apply holding force to the first holding unit and the plurality of second holding units. A holding device.

前記第１保持部は、当該第１保持部を構成する円周部の２箇所に一端と他端とを有する第２隔壁によって、相互に隣接する第３保持部と第４保持部とに区画され、
前記第１保持力付与機構は、前記第３保持部および前記第４保持部に、それぞれ独立して保持力を付与する第３保持力付与機構と第４保持力付与機構とを備えていることを特徴とする請求項１に記載の保持装置。 The first holding portion is divided into a third holding portion and a fourth holding portion adjacent to each other by a second partition wall having one end and the other end at two locations on the circumferential portion constituting the first holding portion. And
The first holding force applying mechanism includes a third holding force applying mechanism and a fourth holding force applying mechanism for independently applying a holding force to the third holding unit and the fourth holding unit, respectively. The holding device according to claim 1.