JP3219449B2 - Press mold - Google Patents

Press mold

Info

Publication number
JP3219449B2
JP3219449B2 JP05784592A JP5784592A JP3219449B2 JP 3219449 B2 JP3219449 B2 JP 3219449B2 JP 05784592 A JP05784592 A JP 05784592A JP 5784592 A JP5784592 A JP 5784592A JP 3219449 B2 JP3219449 B2 JP 3219449B2
Authority
JP
Japan
Prior art keywords
substrate
press mold
molding
sic
press
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP05784592A
Other languages
Japanese (ja)
Other versions
JPH05254853A (en
Inventor
淳 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP05784592A priority Critical patent/JP3219449B2/en
Publication of JPH05254853A publication Critical patent/JPH05254853A/en
Application granted granted Critical
Publication of JP3219449B2 publication Critical patent/JP3219449B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B11/00Pressing molten glass or performed glass reheated to equivalent low viscosity without blowing
    • C03B11/06Construction of plunger or mould
    • C03B11/08Construction of plunger or mould for making solid articles, e.g. lenses
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B11/00Pressing molten glass or performed glass reheated to equivalent low viscosity without blowing
    • C03B11/06Construction of plunger or mould
    • C03B11/08Construction of plunger or mould for making solid articles, e.g. lenses
    • C03B11/084Construction of plunger or mould for making solid articles, e.g. lenses material composition or material properties of press dies therefor
    • C03B11/086Construction of plunger or mould for making solid articles, e.g. lenses material composition or material properties of press dies therefor of coated dies
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B2215/00Press-moulding glass
    • C03B2215/02Press-mould materials
    • C03B2215/03Press-mould materials defined by material properties or parameters, e.g. relative CTE of mould parts
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B2215/00Press-moulding glass
    • C03B2215/02Press-mould materials
    • C03B2215/08Coated press-mould dies
    • C03B2215/10Die base materials
    • C03B2215/12Ceramics or cermets, e.g. cemented WC, Al2O3 or TiC
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B2215/00Press-moulding glass
    • C03B2215/02Press-mould materials
    • C03B2215/08Coated press-mould dies
    • C03B2215/14Die top coat materials, e.g. materials for the glass-contacting layers
    • C03B2215/22Non-oxide ceramics

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Products (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明はプレス成形型に関し、特
には、ガラスレンズ等をプレス成形するための、成形面
が鏡面加工されるプレス成形型に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a press mold and, more particularly, to a press mold having a mirror-finished molding surface for press molding a glass lens or the like.

【0002】[0002]

【従来の技術】プレス成形品の表面形状はプレス作業に
おける重要な品質項目である。特に、仕上研摩工程抜き
で、ガラスレンズ、プラスチックレンズ等の完成品をプ
レス成形しようとする場合は、製品表面に転写されるこ
ととなるプレス成形型の成形面の鏡面加工性が良好であ
ることが求められる。また、被加工物との反応性が少な
いこと、耐摩耗性の良いこと、十分な機械的強度を持つ
ことも求められる。
2. Description of the Related Art The surface shape of a press-formed product is an important quality item in a press operation. In particular, when a finished product such as a glass lens or a plastic lens is to be press-molded without the finish polishing step, the press-molding die to be transferred to the product surface has good mirror surface workability. Is required. It is also required that the material has low reactivity with the workpiece, good wear resistance, and sufficient mechanical strength.

【0003】従来、このようなプレス成形型として、セ
ラミックスや金属の表面に炭化ケイ素膜が被着されたも
のが知られている(特公平3−55421)。このなか
でも、緻密質SiC焼結体(密度95%〜98%)を基
体とし、成形面にはCVD(化学蒸着法)SiC膜を被
着させたものがガラス成形用として、実用化されてい
る。この緻密質SiCプレス成形型は、鏡面加工性が良
く、またガラス成形品との離型性も良い。
Heretofore, as such a press mold, there has been known a press mold in which a silicon carbide film is adhered to the surface of a ceramic or metal (Japanese Patent Publication No. 3-55421). Among them, a compact SiC sintered body (density 95% to 98%) as a base and a CVD (chemical vapor deposition) SiC film adhered to a molding surface has been put into practical use for glass molding. I have. This dense SiC press mold has good mirror workability, and also has good mold releasability from a glass molded product.

【0004】しかし、この緻密質SiCプレス成形型に
は、加工が困難である。耐衝撃性が弱い、という問
題点がある。特に、非球面レンズ用の型等の加工に手間
がかかる型では、この問題は、コスト面や納期面から重
大である。
[0004] However, it is difficult to process this dense SiC press mold. There is a problem that the impact resistance is weak. In particular, in a mold requiring a lot of processing such as a mold for an aspherical lens, this problem is serious in terms of cost and delivery time.

【0005】[0005]

【発明が解決しようとする課題】本発明の目的は、鏡面
加工性と成形品との無反応性とに優れ、かつ、加工し易
すく、耐衝撃性の良いプレス成形型を提供することにあ
る。
SUMMARY OF THE INVENTION An object of the present invention is to provide a press mold excellent in mirror workability and non-reactivity with a molded product, easy to process, and excellent in impact resistance. is there.

【0006】[0006]

【課題を解決するための手段】上記目的を達成するた
め、本発明のプレス成形型は、基体(1)、該基体の一
部表面に設けられた成形面(2)及び該基体の他の一部
表面に設けられた摺動面(3)を含むプレス成形型にお
いて; (a)基体(1)が、多孔質セラミック焼結体よりな
り; (b)成形面(2)が、緻密質のSiC膜(11)で覆
われており; (c)摺動面(3)が、緻密質の無機材料膜、又は、該
基体を構成するセラミック多孔質体に無機材料が含浸さ
れた含浸層、からなる摺動面保護層(13)を含む; ことを特徴とする。
In order to achieve the above object, a press mold according to the present invention comprises a substrate (1), a molding surface (2) provided on a partial surface of the substrate, and another substrate. In a press mold including a sliding surface (3) provided on a part of the surface; (a) the base (1) is made of a porous ceramic sintered body; (b) the molding surface (2) is dense (C) the sliding surface (3) is a dense inorganic material film or an impregnated layer obtained by impregnating a ceramic porous body constituting the substrate with an inorganic material. And a sliding surface protection layer (13) composed of:

【0007】また、本発明のプレス成形型の他の一態様
は、基体(1)と、該基体の一部表面に設けられた成形
面(2)とを含むプレス成形型において; (a)基体(1)が、気孔体積率が30〜50%の多孔
質SiC焼結体よりなり; (b)成形面(2)が、緻密質のSiC膜(11)で覆
われている; ことを特徴とする。
Another aspect of the press mold of the present invention is a press mold including a base (1) and a forming surface (2) provided on a partial surface of the base; (a) The substrate (1) is made of a porous SiC sintered body having a porosity of 30 to 50%; (b) the molding surface (2) is covered with a dense SiC film (11); Features.

【0008】本発明のプレス成形型は、被成形品の材料
・品種において、特定のものに限定されない。ただし、
その特性から、特にガラス・プラスチック製のレンズの
成形用の型に好適である。また、本発明のプレス成形型
は、型としての完成品(全ての仕上加工や付属品組立が
終了した状態、すなわちすぐ打てる状態)のみならず、
鏡面加工などの仕上加工前の状態をも含む概念である。
[0008] The press mold of the present invention is not limited to a specific material and kind of a molded article. However,
From its characteristics, it is particularly suitable for a mold for molding a glass / plastic lens. In addition, the press mold of the present invention is not only a finished product as a mold (a state in which all finishing and assembling of accessories have been completed, that is, a state in which it can be immediately hit),
This is a concept including a state before finishing such as mirror finishing.

【0009】基体の形状・寸法も特に限定されない。成
形面とは、被加工物が成形作業中に接触する型の表面部
分をいう。しかし、作業の内容によっては、この接触部
の外周部を含むこともありうる。摺動面とは、成形作業
に伴う型の運動(上下・左右等)の際に、型が案内面と
摺動する部分をいう。
The shape and dimensions of the substrate are not particularly limited. Molding surface refers to the surface portion of the mold with which the workpiece contacts during the molding operation. However, depending on the content of the work, the outer periphery of the contact portion may be included. The sliding surface refers to a portion where the mold slides on the guide surface when the mold moves (up and down, left and right, etc.) during the molding operation.

【0010】基体に必要とされる物理特性は、特に一律
に数値化されるものではない。本発明のプレス成形型の
応用される作業の具体的な内容により、プレス成形型が
十分な耐久性を有するよう個々に設定されるものであ
る。一つの目安としては、曲げ強度(JIS R160
1)4kg/mm2以上でかつ弾性率が2,000〜15,0
00kg/mm2の範囲にあることである。
The physical properties required for the substrate are not particularly uniformly quantified. Depending on the specific contents of the work to which the press mold of the present invention is applied, the press mold is individually set so as to have sufficient durability. One guide is bending strength (JIS R160
1) 4 kg / mm 2 or more and elastic modulus of 2,000 to 15.0
It is within the range of 00 kg / mm 2 .

【0011】基体を構成するセラミック焼結体の多孔性
は特に数値的に限定されない。使用する材質と求められ
る強度に応じて適宜選択する。気孔率が高いほど、一般
に加工しやすくなるが、強度と剛性が下がる。一つの目
安としては、気孔率は20〜60%である。特にSiC
焼結体では、気孔率30〜50%が性質のバランスの上
から好ましい。
The porosity of the ceramic sintered body constituting the substrate is not particularly limited numerically. It is appropriately selected according to the material to be used and the required strength. The higher the porosity, generally the easier it is to process, but the lower the strength and rigidity. As a guide, the porosity is between 20 and 60%. Especially SiC
In the sintered body, a porosity of 30 to 50% is preferable from the viewpoint of a balance of properties.

【0012】使用するセラミック材料の種類も特に限定
されない。ここで、セラミックとしたのは、硬度・耐熱
性・耐食性が優れているので、本発明の目的を達成する
のに好適だからである。
The type of ceramic material used is not particularly limited. Here, the reason for using ceramic is that it is suitable for achieving the object of the present invention because of its excellent hardness, heat resistance, and corrosion resistance.

【0013】セラミック材質の例としては、SiC、S
34 、アルミナ、ムライト、ジルコニアよりなる群
より選ばれた1又は2以上の物質からなるものがあげら
れる。プレス成形型の使用条件(温度、被加工材質、必
要強度)から適宜選択することができる。成形面のSi
C膜をCVD法で付ける場合には、成膜温度が高い(一
例1300℃)ので、成膜後の冷却時に発生する熱応力
を一定値以下におさえる必要があることから、使用する
基体セラミック材質はSiCと熱膨張率が似かよったも
のであることが好ましい。そのため、基体材質として特
に好ましいのは、SiCである。
Examples of ceramic materials include SiC, S
Examples thereof include those composed of one or more substances selected from the group consisting of i 3 N 4 , alumina, mullite, and zirconia. It can be appropriately selected from the use conditions (temperature, work material, required strength) of the press mold. Molding surface Si
When the C film is formed by the CVD method, since the film formation temperature is high (for example, 1300 ° C.), it is necessary to keep the thermal stress generated during cooling after the film formation to a certain value or less. Is preferably similar in thermal expansion coefficient to SiC. Therefore, SiC is particularly preferable as the base material.

【0014】気孔の形状・寸法は特に限定されるもので
はないが、平均気孔径が0.1〜10μm の範囲にある
のが好ましい。平均気孔径が0.1μm より小さくなる
と成形面と基体との密着性を向上させることが難しく、
10μm を越えて平均気孔径が大きくなると基体の強度
が低下し、成形面の平滑性が悪化し易い。
The shape and size of the pores are not particularly limited, but the average pore diameter is preferably in the range of 0.1 to 10 μm. When the average pore diameter is smaller than 0.1 μm, it is difficult to improve the adhesion between the molding surface and the substrate,
If the average pore diameter is larger than 10 μm, the strength of the substrate is reduced, and the smoothness of the molding surface is liable to deteriorate.

【0015】焼結体の製造方法も特に限定されない。一
般的には、あらかじめ造粒されたセラミック粉末を加圧
成形する方法や、鋳込、押出、射出等の成形方法が採用
され、適切な密度を得るために必要な温度(SiCの場
合1,700〜2,200℃)で焼結される。
The method for producing the sintered body is not particularly limited. In general, a method of pressure-molding ceramic granules that have been granulated in advance, or a molding method such as casting, extrusion, or injection is adopted, and the temperature required to obtain an appropriate density (1 in the case of SiC, (700-2200 ° C.).

【0016】成形面緻密質SiC膜で覆う目的は、同面
の鏡面加工性と耐摩性の改善である。SiC膜は成形面
全面を覆うことが好ましい。ただし、被加工物との接触
条件がゆるやかな部分や、鏡面加工の要求されない部分
は、膜着けしなくともよい場合があり、その場合をも、
本発明は包含するものである。
The purpose of covering with a molded surface dense SiC film is to improve the mirror finish and abrasion resistance of the same surface. The SiC film preferably covers the entire molding surface. However, parts where the contact conditions with the workpiece are mild or parts where mirror processing is not required may not need to be coated, and in that case,
The present invention is inclusive.

【0017】成形面のSiC膜の厚さは0.1〜0.7
mmであることが好ましい。さらに好ましくは0.2〜
0.5mmである。理由は、0.1mm未満では耐摩性の改
善が不充分になり易く、型寿命を延ばすことが困難であ
る。また、0.7mmを越える厚みになると基体との密度
差、熱膨張差とにより膜の剥離が生じ易くなり型寿命を
延ばすことが困難である。
The thickness of the SiC film on the molding surface is 0.1 to 0.7.
mm. More preferably 0.2 to
0.5 mm. The reason is that if it is less than 0.1 mm, the abrasion resistance tends to be insufficiently improved, and it is difficult to extend the mold life. On the other hand, if the thickness exceeds 0.7 mm, peeling of the film is likely to occur due to the difference in density from the substrate and the difference in thermal expansion, and it is difficult to extend the life of the mold.

【0018】本発明のSiC膜の結晶構造はβ−SiC
が望ましい。理由は、成膜が低温度で可能であり、容易
に、しかも高速で成膜できるからである。
The crystal structure of the SiC film of the present invention is β-SiC
Is desirable. The reason is that the film can be formed at a low temperature and can be formed easily and at a high speed.

【0019】本発明のSiC膜の成膜方法は、特に限定
されないが、減圧CVDによることが望ましい。理由
は、純度の高い膜を形成できるからである。他の方法と
しては、イオンプレーティング法、イオンビーム蒸着
法、プラズマCVD法、スパッタリング法等があげられ
る。
Although the method for forming the SiC film of the present invention is not particularly limited, it is preferable to use low-pressure CVD. The reason is that a highly pure film can be formed. Other methods include an ion plating method, an ion beam evaporation method, a plasma CVD method, and a sputtering method.

【0020】摺動面に摺動保護層を設ける目的は、多孔
質基体の気孔からのゴミの浸出の防止である。このゴミ
が成形面に出てくると、製品の傷の原因となる。摺動保
護層は、摺動するプレス成形型には、極力設けたほうが
よい。しかし、成形面から遠い部分の摺動面には、上記
の目的からして、設ける必要のない場合もある。また、
摺動しない方のプレス成形型には、摺動保護層を設けな
くてもよい場合が多い。
The purpose of providing the sliding protective layer on the sliding surface is to prevent leaching of dust from the pores of the porous substrate. If this dust comes out on the molding surface, it may cause damage to the product. It is better to provide the sliding protection layer as much as possible in a sliding press mold. However, there is a case where it is not necessary to provide the sliding surface far from the molding surface for the above purpose. Also,
In many cases, it is not necessary to provide a slide protection layer on the press mold that does not slide.

【0021】摺動保護層は、成形面の緻密質のSiC膜
と同一の膜であってよい。両膜の成膜が同一工程で同時
にできるので製造上便利である。
The sliding protection layer may be the same film as the dense SiC film on the molding surface. Since both films can be formed simultaneously in the same process, it is convenient in manufacturing.

【0022】摺動保護層は、また、基体を構成するセラ
ミック多孔質体に無機材料が含浸された層であってよ
い。無機材料中でも、金属シリコン、金属亜鉛、金属ア
ルミニウム等が好適である。その理由は、含浸が容易な
ためである。含浸層の形成時は、成形面のSiC膜成膜
の前でも、後でもよい。また、基体の荒加工の前でも後
でもよい。含浸層の厚さも特に限定されない。基体の芯
部まで含浸されていてもよい。その場合は、基体のじん
性、剛性の向上にも有効である。
The sliding protection layer may be a layer in which an inorganic material is impregnated in a porous ceramic body constituting a base. Among inorganic materials, metallic silicon, metallic zinc, metallic aluminum and the like are preferable. The reason is that impregnation is easy. When forming the impregnation layer, it may be before or after forming the SiC film on the molding surface. Further, it may be before or after the roughing of the substrate. The thickness of the impregnated layer is not particularly limited. The core of the substrate may be impregnated. In that case, it is also effective in improving the toughness and rigidity of the base.

【0023】本発明のプレス成形型の製造・機械加工の
手順・方法は特に限定されない。一般的には、基体のプ
レス成形→仮焼結→粗加工→本焼結(含浸)→一次仕上
加工→SiC膜付け→仕上加工、の手順である。
The procedure and method for manufacturing and machining the press mold of the present invention are not particularly limited. In general, the procedure is as follows: press molding of the base → temporary sintering → rough processing → main sintering (impregnation) → primary finishing processing → SiC film formation → finish processing.

【0024】[0024]

【発明の効果】本発明は以下の効果を有する。 製造しやすいプレス成形型を提供する。基体が、焼結
・加工ともに容易な多孔質セラミック焼結体製だからで
ある。 耐衝撃性の良いプレス成形型を提供する。基体が、シ
ョックの吸収性に優れた多孔質体だからである。 成形面のSiC膜の耐剥離性が良いプレス成形型を提
供する。SiC膜が基体の孔に入り込む効果(アンカリ
ング効果)があるからである。 成形面の鏡面加工性・摺動面の耐ゴミ性は従来技術の
プレス成形型と同様に良好なプレス成形型を提供する。
The present invention has the following effects. Provide a press mold that is easy to manufacture. This is because the base is made of a porous ceramic sintered body that can be easily sintered and processed. Provide a press mold with good impact resistance. This is because the substrate is a porous body having excellent shock absorption. Provided is a press mold having good peel resistance of a SiC film on a molding surface. This is because the SiC film has an effect (anchoring effect) of entering the hole of the base. The mirror surface workability of the molding surface and the dust resistance of the sliding surface provide a good press mold as in the prior art press mold.

【0025】[0025]

【実施例】以下、本発明を実施例及び比較例によって説
明する。ただし本発明はこれらの実施例によって限定さ
れるものではない。
The present invention will be described below with reference to examples and comparative examples. However, the present invention is not limited by these examples.

【0026】本発明の実施例を以下のように作成し
た。β−SiC粉末(イビデン(株)ベータランダムU
Fグレード平均粒径0.3μm )を成形型に充填後、2
TON/cm2 の等方圧を加えてφ20×L100mmの棒状の
成形体を得た。ついで上記成形体を1気圧アルゴンガス
雰囲気下で1,945℃まで5℃/min の速度で昇温
し、4時間保持後室温まで冷却してSiCの多孔体を得
た。
An example of the present invention was made as follows. β-SiC powder (IBIDEN Co., Ltd. Beta Random U
F grade average particle size 0.3μm)
By applying an isotropic pressure of TON / cm 2 , a rod-shaped compact of φ20 × L100 mm was obtained. Then, the molded body was heated to 1,945 ° C. at a rate of 5 ° C./min under an atmosphere of 1 atm of argon gas, kept for 4 hours, and cooled to room temperature to obtain a porous SiC body.

【0027】上記多孔体から試験片を切り出し、曲げ強
度(JIS R1601)を測定すると8kg/mm2であ
り、弾性率は5,000kg/mm2であった。また、水銀圧
入法(マイクロメリテックス社ポアサイザ9320)に
より上記多孔体の気孔径分布を測定したところ、平均気
孔径が2.2μm であった。また、密度が1.80g/cm
2 であり気孔率は44%と測定された。
A test piece was cut out from the porous body, and its bending strength (JIS R1601) was measured to be 8 kg / mm 2 and its elastic modulus was 5,000 kg / mm 2 . Further, the pore size distribution of the porous body was measured by a mercury intrusion method (Micromeritex Pore Sizer 9320), and the average pore size was 2.2 μm. The density is 1.80 g / cm
2 , and the porosity was measured to be 44%.

【0028】上記多孔体を所定の形状に研削加工して基
体(1)を得た。続いて、この基体の成形面および摺動
面に、減圧CVD法によりSiCの膜を形成した。膜厚
は、成膜時に同時に使用したカーボン板(ダミー)に付
着した膜厚を測定した。基体の外形寸法は径20mm、長
さ25mmであった。
The porous body was ground into a predetermined shape to obtain a substrate (1). Subsequently, a SiC film was formed on the molding surface and the sliding surface of the substrate by a low pressure CVD method. The film thickness was measured by measuring the film thickness attached to the carbon plate (dummy) used at the time of film formation. The external dimensions of the substrate were 20 mm in diameter and 25 mm in length.

【0029】この減圧CVDによる成膜条件は以下のと
おりであった。 使用装置:形式 減圧CVD メーカー エステック 使用ガス:トリクロルシラン、プロパン、水素 基体温度:1300℃〜1320℃ 炉内全圧力:3Torr〜1Torr 成膜時間:120分
The film forming conditions by the low pressure CVD were as follows. Applicable equipment: Model Low-pressure CVD maker S-Tech Gas used: Trichlorosilane, propane, hydrogen Substrate temperature: 1300 ° C to 1320 ° C Total pressure in furnace: 3 Torr to 1 Torr Film formation time: 120 minutes

【0030】成膜後の型材をダイヤモンド研摩加工し
て、鏡面の成形面を持ったプレス成形型を得た。この型
で、ガラスレンズ(材質 ホウケイ酸、成形温度 40
0℃)を5,000回成形して、成形後の成形面の変化
を観察した。その結果、カケ、ハガレ、鏡面劣化は見ら
れず、良好であった。
The mold material after film formation was subjected to diamond polishing to obtain a press mold having a mirror-shaped molding surface. In this mold, a glass lens (material borosilicate, molding temperature 40
(0 ° C.) 5,000 times, and changes in the molded surface after molding were observed. As a result, no chipping, peeling, or mirror surface deterioration was observed, and the results were good.

【0031】本発明の実施例〜を同様なプロセスで
作成した。それらの諸元を表1に示す。
Examples 1 to 3 of the present invention were prepared by a similar process. Table 1 shows their specifications.

【0032】[0032]

【表1】 [Table 1]

【0033】ここで、実施例の基体(多孔質体)は、
市販のアルミナ粉末(昭和電工(株)AL−160S
G、平均粒径0.4μm )を実施例1と同様の成形型に
充填後2TON/cm2 の等方圧を加えて成形し、続いて大気
中1,500℃まで2.5℃/minの速度で昇温し2時間
保持後、室温まで冷却させてアルミナの多孔体を得た。
Here, the substrate (porous body) of the embodiment is
Commercially available alumina powder (AL-160S, Showa Denko KK)
G, average particle diameter of 0.4 μm) and filled in the same mold as in Example 1 and then molded by applying an isostatic pressure of 2 TON / cm 2 , and subsequently to 1,500 ° C. in air at 2.5 ° C./min. The temperature was raised at the rate described above and maintained for 2 hours, and then cooled to room temperature to obtain a porous alumina body.

【0034】これらを用いて、実施例と同一条件でプ
レス成形試験を行った。その結果を表2に示す。いずれ
の実施例も良好な試験結果であった。
Using these, a press molding test was performed under the same conditions as in the examples. Table 2 shows the results. All the examples had good test results.

【0035】また、比較例として、β−SiC粉末(イ
ビデン(株)ベータランダムUFグレード、平均粒径
0.3μm )に焼結助剤としてB、Cとをそれぞれ、
0.3wt%、3wt%添加後実施例1と同様の操作で成
形、焼結させた。
As a comparative example, B and C were respectively added to β-SiC powder (beta random UF grade of Ibiden Co., Ltd., average particle diameter 0.3 μm) as sintering aids.
After adding 0.3% by weight and 3% by weight, molding and sintering were performed in the same manner as in Example 1.

【0036】[0036]

【表2】 [Table 2]

【0037】基体が緻密質SiC(気孔率5%)の比較
例と、本発明の実施例(多孔質SiC、気孔率22
%)とでは、基体の研削加工時間が24時間:3時間
と、本発明の実施例のほうが約8分の1の加工時間であ
った。
A comparative example in which the substrate is dense SiC (porosity 5%) and an example of the present invention (porous SiC, porosity 22
%), The grinding time of the substrate was 24 hours: 3 hours, and the working time of the example of the present invention was about 1/8.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施例のプレス成形型の概念図であ
る。
FIG. 1 is a conceptual diagram of a press mold according to one embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1 基体 2 成形面 3 摺動面 11 SiC膜 13 摺動保護層 DESCRIPTION OF SYMBOLS 1 Substrate 2 Molding surface 3 Sliding surface 11 SiC film 13 Sliding protective layer

Claims (7)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 基体(1)、該基体の一部表面に設けら
れ、基体と同種の材質からなる成形面(2)及び該基体
の他の一部表面に設けられた摺動面(3)を含むプレス
成形型において; (a)基体(1)が、多孔質SiC焼結体よりなり; (b)成形面(2)が、緻密質のSiC膜(11)で覆
われており; (c)摺動面(3)が、緻密質のSiC膜、又は、該基
体を構成するSiC多孔質体に無機材料が含浸された含
浸層、からなる摺動保護層(13)を含む; ことを特徴とするプレス成形型。
1. A substrate (1), a molding surface (2) provided on a partial surface of the substrate and made of the same material as the substrate, and a sliding surface (3) provided on another partial surface of the substrate. (A) the substrate (1) is made of a porous SiC sintered body; (b) the molding surface (2) is covered with a dense SiC film (11); (C) the sliding surface (3) includes a sliding protective layer (13) composed of a dense SiC film or an impregnated layer in which an inorganic material is impregnated in a porous SiC body constituting the base; A press mold characterized by the following.
【請求項2】 上記多孔質SiC焼結体の気孔体積率
が、20〜60%である、請求項1記載のプレス成形
型。
2. The press mold according to claim 1, wherein the porous SiC sintered body has a pore volume ratio of 20 to 60%.
【請求項3】 上記多孔質SiC焼結体が、曲げ強度
(JIS R1601)4kg/mm2以上であり、かつ弾性
率が2000〜15000kg/mm2以上である、請求項1
記載のプレス成形型。
Wherein the porous SiC sintered body, and the bending strength (JIS R1601) 4kg / mm 2 or more and the elastic modulus is 2000~15000kg / mm 2 or more, according to claim 1
The press mold as described.
【請求項4】 上記多孔質SiC焼結体の気孔の平均粒
径が、0.1〜10μmである、請求項1記載のプレス
成形型。
4. The press-molding die according to claim 1, wherein the porous SiC sintered body has an average pore diameter of 0.1 to 10 μm.
【請求項5】 上記緻密質のSiC膜(11)の厚さ
が、0.1〜0.7mmである、請求項1記載のプレス成
形型。
5. The press mold according to claim 1, wherein said dense SiC film has a thickness of 0.1 to 0.7 mm.
【請求項6】 上記摺動保護層(13)構成する含浸層
が、金属シリコンが含浸された層である、請求項1記載
のプレス成形型。
6. The press-molding die according to claim 1, wherein the impregnated layer constituting the slide protection layer is a layer impregnated with metallic silicon.
【請求項7】 基体(1)と、該基体の一部表面に設け
られた成形面(2)とを含むプレス成形型において; (a)基体(1)が、気孔体積率が30〜50%の多孔
質SiC焼結体よりなり; (b)成形面(2)が、緻密質のSiC膜(11)で覆
われている; ことを特徴とするプレス成形型。
7. A press mold comprising a substrate (1) and a molding surface (2) provided on a partial surface of the substrate; (a) The substrate (1) has a pore volume ratio of 30 to 50. (B) a molding surface (2) is covered with a dense SiC film (11);
JP05784592A 1992-03-16 1992-03-16 Press mold Expired - Lifetime JP3219449B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP05784592A JP3219449B2 (en) 1992-03-16 1992-03-16 Press mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP05784592A JP3219449B2 (en) 1992-03-16 1992-03-16 Press mold

Publications (2)

Publication Number Publication Date
JPH05254853A JPH05254853A (en) 1993-10-05
JP3219449B2 true JP3219449B2 (en) 2001-10-15

Family

ID=13067318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP05784592A Expired - Lifetime JP3219449B2 (en) 1992-03-16 1992-03-16 Press mold

Country Status (1)

Country Link
JP (1) JP3219449B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4225684B2 (en) * 1997-09-05 2009-02-18 エレメント シックス リミテッド Method for producing diamond-silicon carbide-silicon composite material
JP2002255570A (en) * 2001-02-28 2002-09-11 Ibiden Co Ltd Die for forming glass lens and method for manufacturing the same
JP2002293552A (en) * 2001-03-28 2002-10-09 Ibiden Co Ltd Mold and method for manufacturing the same
JP6489775B2 (en) * 2014-08-21 2019-03-27 株式会社フジコー Manufacturing method of SiC molded body and processing method of SiC molded body

Also Published As

Publication number Publication date
JPH05254853A (en) 1993-10-05

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