JP3206839B2 - IC card module structure - Google Patents
IC card module structureInfo
- Publication number
- JP3206839B2 JP3206839B2 JP31429892A JP31429892A JP3206839B2 JP 3206839 B2 JP3206839 B2 JP 3206839B2 JP 31429892 A JP31429892 A JP 31429892A JP 31429892 A JP31429892 A JP 31429892A JP 3206839 B2 JP3206839 B2 JP 3206839B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- circuit board
- card
- resin
- conductive pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＩＣチップを実装する
回路基板の片面に導電パターンを形成したＩＣカードの
モジュール構造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a module structure of an IC card in which a conductive pattern is formed on one side of a circuit board on which an IC chip is mounted.
【０００２】[0002]
【従来の技術】近年、キャッシュカードやクレジットカ
ードをはじめ各種メンバーズカード、病院の診療券など
様々な種類のカードが流通し、われわれの日常生活には
欠かせないものになりつつある。現在、これらのカード
は磁気カードが主流となっているが、磁気カードは、そ
の記憶容量が小さいために機能拡大に限界があり、ま
た、セキュリティ、信頼性の面でも限界がある。この磁
気カードの限界を打ち破り、大きな記憶容量を有し、高
度なセキュリティ機能を有する多機能カードとして、Ｃ
ＰＵ、メモリチップ等を搭載したＩＣカードが登場して
きたのは周知の通りである。2. Description of the Related Art In recent years, various types of cards such as cash cards and credit cards, various members' cards, hospital medical treatment tickets, etc. have been circulating and are becoming indispensable to our daily life. At present, magnetic cards are mainly used for these cards. However, magnetic cards have a limited storage capacity, so their functions are limited, and security and reliability are also limited. As a multi-function card that overcomes the limitations of this magnetic card, has a large storage capacity, and has advanced security functions,
It is well known that an IC card equipped with a PU, a memory chip, and the like has appeared.
【０００３】そこで、ＩＣチップを実装する回路基板の
片面に導電パターンを形成した従来技術のＩＣカードの
モジュール構造として、特公平１−５８６５７号公報及
び特開昭５７−１０２５８号公報に具体例が開示されて
いる。Therefore, specific examples of the module structure of a conventional IC card having a conductive pattern formed on one side of a circuit board on which an IC chip is mounted are disclosed in Japanese Patent Publication No. 1-58657 and Japanese Patent Application Laid-Open No. 57-10258. It has been disclosed.
【０００４】まず、特公平１−５８６５７号公報に開示
されている従来技術の概要を図３で説明する。フィルム
３０の窓３１内に配置されたＩＣチップ３２は、別工程
において形成されたコンタクトリード３３の端部に、別
の適当の装置により結合され、コンタクトリード３３の
一方の端のコンタクト領域３４には、導電性の層３５が
形成される。その後モールド金型を用い樹脂３６にて封
止されるが、導電性の層３５はモールド面よりわずかに
高めに形成され、識別カードに組込まれた時に、この層
３５は識別カード本体の被膜と同一平面上に位置し、こ
の層３５が導電性材料の場合には、直接コンタクト方式
が使える。この層が非導電性材料により形成されている
場合には、この層を介して針がコンタクト領域が貫通さ
れるとよいなどの技術が開示されている。First, an outline of the prior art disclosed in Japanese Patent Publication No. 1-58657 will be described with reference to FIG. The IC chip 32 arranged in the window 31 of the film 30 is connected to the end of the contact lead 33 formed in another process by another appropriate device, and is connected to the contact region 34 at one end of the contact lead 33. A conductive layer 35 is formed. After that, it is sealed with a resin 36 using a molding die. However, the conductive layer 35 is formed slightly higher than the mold surface, and when incorporated into the identification card, this layer 35 forms a coating with the identification card body. If they are located on the same plane and this layer 35 is made of a conductive material, a direct contact method can be used. In the case where this layer is formed of a non-conductive material, a technique is disclosed in which it is preferable that a needle penetrates a contact region through this layer.
【０００５】次に、他の従来技術として、特開昭５７−
１０２５８号公報の概要を図４で説明する。フィルム状
の支持体４０はＩＣチップ４１を受け入れるため開口４
２を有し、公知のフォトエッチング法によって支持体４
０上にラミネートされた導電性フィルムから形成された
リード４３が開口４２の中まで延びてＩＣチップ４１と
接続されている。支持体４０の厚さは、ＩＣチップ４１
の厚みと、このＩＣチップ４１上に設けられた接続リー
ド４３の厚みを加えた厚さより厚くしてある。更に、Ｉ
Ｃチップ４１を実装するための開口４２は、ＩＣチップ
を接続したのちにその開口４２に注ぎ込むことができる
成形可能な材料４４で充填されている。これによってＩ
Ｃチップ４１及び接続リード４３を保護するなどの技術
が開示されている。Next, as another prior art, Japanese Patent Laid-Open Publication No.
The outline of Japanese Patent No. 10258 will be described with reference to FIG. The film support 40 has an opening 4 for receiving the IC chip 41.
2 and a support 4 by a known photo-etching method.
A lead 43 formed of a conductive film laminated on the IC chip 0 extends into the opening 42 and is connected to the IC chip 41. The thickness of the support 40 is the IC chip 41
And the thickness of the connection lead 43 provided on the IC chip 41. Furthermore, I
The opening 42 for mounting the C chip 41 is filled with a moldable material 44 that can be poured into the opening 42 after connecting the IC chip. This gives I
Techniques for protecting the C chip 41 and the connection lead 43 are disclosed.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、これら
の従来技術にはそれぞれ次のような問題点がある。前述
した特公平１−５８６５７号公報に開示されている従来
技術では、図４に示すように、モールド工程においてＩ
Ｃチップを正確に位置合わせをする必要があり、全体を
モールドしないとＩＣチップを固定することができず、
外部接続端子がモールド面よりわずかに高めに形成する
必要があるので、高いモールド精度を要求されるなど、
ＩＣチップの位置合わせ装置及びモールド金型により製
造コストが高くなる。また、全体モールドのため単体ユ
ニットの厚みも厚くなるなどの問題点があった。However, each of these prior arts has the following problems. In the prior art disclosed in the above-mentioned Japanese Patent Publication No. 1-58657, as shown in FIG.
It is necessary to accurately position the C chip, and the IC chip cannot be fixed unless the whole is molded.
Since the external connection terminals need to be formed slightly higher than the mold surface, high mold accuracy is required.
The manufacturing cost is increased by the IC chip alignment device and the mold. In addition, there is a problem that the thickness of the single unit is increased due to the entire mold.
【０００７】また、前述した特開昭５７−１０２５８号
公報に開示されている他の従来技術では、図５に示すよ
うに、支持体の厚みの中にＩＣチップと接続リードを納
め樹脂封止するもので、支持体の厚さに対して樹脂封止
領域が薄く少ないので、ＩＣチップ上面を外部からの衝
撃及び光線などから十分に保護することができず、耐衝
撃、遮光性に問題があり信頼性に欠ける。In another conventional technique disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 57-10258, as shown in FIG. 5, an IC chip and a connection lead are placed in the thickness of a support and resin-sealed. Since the resin sealing area is thin and small with respect to the thickness of the support, the upper surface of the IC chip cannot be sufficiently protected from external shocks and light rays, and there is a problem in shock resistance and light shielding properties. Yes, lacks reliability.
【０００８】本発明は上記従来の課題に鑑みなされたも
のであり、その目的は、構造が簡単で、かつ耐衝撃、遮
光性に優れ、しかも製造容易なＩＣカードのモジュール
を提供するものである。The present invention has been made in view of the above-mentioned conventional problems, and an object of the present invention is to provide an IC card module which has a simple structure, is excellent in shock resistance and light blocking properties, and is easy to manufacture. .
【０００９】[0009]
【課題を解決するための手段】上記目的を達成するため
に、本発明におけるＩＣカードのモジュール構造の構成
は、ＩＣチップを実装する開口部を配設した一層からな
る回路基板の上面に導電パターンを形成し、前記回路基
板の開口部内で、遮光パターンを残し、導電パターンの
フィンガー部を前記回路基板の下面と略等しい位置にな
る如く曲げ成形し、該曲げ成形したフィンガー部端と前
記ＩＣチップをパンプで接続し、樹脂領域が前記回路基
板の上面に形成した導電パターンと同一平面から、回路
基板の厚みを含みＩＣチップの側面を覆う如く、前記回
路基板にＩＣチップを一体的に樹脂封止することによ
り、前記ＩＣチップが回路基板の下面より突出すること
を特徴とするものである。In order to achieve the above object, an IC card module structure according to the present invention comprises a conductive pattern formed on an upper surface of a single-layer circuit board provided with an opening for mounting an IC chip. Is formed in the opening of the circuit board, the light-shielding pattern is left, and the fingers of the conductive pattern are bent and formed so as to be located substantially at the same position as the lower surface of the circuit board. The end of the bent finger and the IC chip Are connected by a pump, and the IC chip is integrally resin-sealed with the circuit board so that the resin region covers the side surface of the IC chip including the thickness of the circuit board from the same plane as the conductive pattern formed on the upper surface of the circuit board. By stopping, the IC chip protrudes from the lower surface of the circuit board.
【００１０】[0010]
【作用】従って、本発明により得られるＩＣカードのモ
ジュール構造においては、片面に導電パターンを形成し
た一層の回路基板で、ＩＣチップが回路基板の導電パタ
ーン形成面と反対側の面より突出して実装され、樹脂領
域が回路基板の厚みより厚く確保できるので、回路基板
の開口部の強度を増し、かつ、ＩＣチップの耐衝撃性、
遮光性を高めることができる。Accordingly, in the module structure of the IC card obtained by the present invention, the IC chip is mounted on one layer of the circuit board having a conductive pattern formed on one side thereof, with the IC chip protruding from the surface opposite to the conductive pattern forming surface of the circuit board. Since the resin region can be secured to be thicker than the thickness of the circuit board, the strength of the opening of the circuit board can be increased, and the impact resistance of the IC chip can be improved.
Light-shielding properties can be improved.
【００１１】[0011]
【実施例】以下、図面に基づいて本発明の好適な実施例
を説明する。図１は本発明のＩＣカードのモジュール構
造を示す断面図、図２は図１のＩＣカードのモジュール
をカード基板に収納した状態を示す断面図、図３は図１
の要部平面図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view showing a module structure of the IC card of the present invention, FIG. 2 is a cross-sectional view showing a state in which the IC card module of FIG. 1 is stored in a card board, and FIG.
FIG.
【００１２】まず、図１及び図３において、回路基板１
はガラスエポキシ樹脂、例えば、ＦＲ−４よりなり、板
厚も、例えば、０．１ｍｍ程度と薄く、前記回路基板１
は一層でＩＣチップ２の実装部相当位置にデバイスホー
ル３を配設する。前記回路基板１の片面（上面）に銅箔
パターンを形成した後所定形状にエッチングすることに
より導電パターン４を形成する。次に、前記導電パター
ン４の中で遮光パターン５をＩＣチップ２を覆うように
残し、フィンガー部６が前記回路基板１に配設したデバ
イスホール３内で回路基板１の下面と略等しい位置にな
る如くフォーミング加工（曲げ成形）を施し、更に、フ
ォーミングしたフィンガー部６の端部と前記ＩＣチップ
２とをパンプ７で接続する。前記したフォーミング加工
は回路基板１の下面を平坦な定盤にのせて下面基準で行
なうことにより、曲げ寸法はバラツクことなく、精度よ
く成形される。その後、少なくとも片面に樹脂と剥がれ
易い性質を有する物質、例えば、テフロン板又は、テフ
ロンをコートした板状の押え治具８で、テフロン面が前
記回路基板１上に形成した導電パターン４及び遮光パタ
ーン５を押えて封止樹脂の流れ防止を行なう。回路基板
１の下面でＩＣチップ２の側方から樹脂注入器９を使っ
て、所謂、サイドポッティング方式で熱可塑性で遮光性
のある黒色ポッティング樹脂を注入すると、樹脂１０は
毛細管現象でＩＣチップ２と回路基板１の間に入り込み
両者を一体的に封止する。この際、樹脂領域１１は、回
路基板１の導電パターン４と同一平面から回路基板１の
厚みを含みＩＣチップ２の側面を覆う範囲に達し、厚い
樹脂領域１１は、薄い一層の回路基板１のデバイスホー
ル３の強度を増し、かつ、遮光性を高め、ＩＣチップ２
を外部からの衝撃、光線等から保護する機能をもつ。
尚、ＩＣチップ２の上部に位置する遮光パターン５はＩ
Ｃチップ２への遮光に役立つものである。前記サイドポ
ッティング終了後に前記押え治具８を除去することによ
り、ポッティングされた樹脂１０は回路基板１の上面に
膨むことなく導電パターン４と同一平面となり、また、
ＩＣチップ２は回路基板１の下面より突出して実装され
て、ＩＣカードのモジュール１２が完成される。First, referring to FIG. 1 and FIG.
Is made of glass epoxy resin, for example, FR-4, and the board thickness is as thin as, for example, about 0.1 mm.
A device hole 3 is disposed at a position corresponding to the mounting portion of the IC chip 2 in one layer. A conductive pattern 4 is formed by forming a copper foil pattern on one surface (upper surface) of the circuit board 1 and then etching it into a predetermined shape. Next, the light shielding pattern 5 is left in the conductive pattern 4 so as to cover the IC chip 2, and the finger portion 6 is located at a position substantially equal to the lower surface of the circuit board 1 in the device hole 3 provided in the circuit board 1. A forming process (bending process) is performed, and the end of the formed finger portion 6 and the IC chip 2 are connected by a pump 7. The above-mentioned forming process is carried out with high precision without any variation in the bending dimensions by performing the above-mentioned forming process on the lower surface of the circuit board 1 on a flat surface plate. Then, at least one surface of the conductive pattern 4 and the light-shielding pattern formed on the circuit board 1 with a material having a property of easily peeling off from the resin, for example, a Teflon plate or a plate-like holding jig 8 coated with Teflon. 5 is pressed to prevent the sealing resin from flowing. When a black potting resin having thermoplastic and light-shielding properties is injected by a so-called side potting method from the side of the IC chip 2 on the lower surface of the circuit board 1 from the side of the IC chip 2, the resin 10 becomes captive due to the capillary phenomenon. And into the circuit board 1 to integrally seal them. At this time, the resin region 11 reaches a range including the thickness of the circuit board 1 and covering the side surface of the IC chip 2 from the same plane as the conductive pattern 4 of the circuit board 1. The strength of the device hole 3 is increased, and the light shielding property is enhanced.
Has a function of protecting the device from external shocks, light rays, and the like.
The light-shielding pattern 5 located above the IC chip 2 is
This is useful for shielding the C chip 2 from light. By removing the holding jig 8 after the end of the side potting, the potted resin 10 is flush with the conductive pattern 4 without swelling on the upper surface of the circuit board 1, and
The IC chip 2 is mounted so as to protrude from the lower surface of the circuit board 1, and the module 12 of the IC card is completed.
【００１３】次に、図２において、上記で完成したＩＣ
カードのモジュール１２をカード基板２０に収納固着す
るのに、カード基板２０にＩＣカードのモジュール１２
を収納する凹部２１を設け、上記回路基板１の下面が当
接する段部２２で熱圧着シート２３等の接着手段により
確実に固着するが、カード基板２０の上面と収納された
ＩＣカードのモジュール１２の導電パターン４、遮光パ
ターン５及び樹脂１０の上面は同一平面になるように部
材相互の厚みを予め設定しておくとよい。図２から明ら
かなように、ＩＣチップ２はカード基板２０の凹部２１
内に入るので、前記した樹脂領域１１はＩＣチップ２の
下面まで覆うことは不要である。Next, referring to FIG.
When the module 12 of the card is stored and fixed in the card substrate 20, the module 12 of the IC card is attached to the card substrate 20.
A concave portion 21 for accommodating the IC card module 12 is securely fixed by a bonding portion such as a thermocompression bonding sheet 23 at a step 22 where the lower surface of the circuit board 1 contacts. The thickness of the members is preferably set in advance so that the upper surfaces of the conductive pattern 4, the light shielding pattern 5 and the resin 10 are flush with each other. As is clear from FIG. 2, the IC chip 2 is
Therefore, it is not necessary to cover the resin region 11 to the lower surface of the IC chip 2.
【００１４】従って、本実施例の特徴とするところは、
前述した如く、一層で片面パターンの薄い回路基板で、
ＩＣチップはパターンと反対側で回路基板の下面より突
出して、パターン側を押え治具で押えてサイドポッティ
ングすることにより、樹脂領域は上面はパターン面に同
一平面になり、デバイスホールを埋めて補強し、かつ、
ＩＣチップ上面の樹脂領域が厚いので、ＩＣチップの上
面を覆う遮光パターンと共同して、ＩＣチップを外部衝
撃と光線より保護するものである。Therefore, the features of this embodiment are as follows.
As described above, a single-sided thin circuit board with one layer,
The IC chip protrudes from the lower surface of the circuit board on the opposite side of the pattern, and the pattern side is pressed with a holding jig and side potted, so that the upper surface of the resin area is flush with the pattern surface, and reinforced by filling device holes And
Since the resin region on the upper surface of the IC chip is thick, the IC chip is protected from external impact and light rays in cooperation with a light-shielding pattern covering the upper surface of the IC chip.
【００１５】[0015]
【発明の効果】以上説明したように、本発明によれば、
ＩＣカードモジュールは、一層で片面パターンの薄い回
路基板で、ＩＣチップを回路基板の下面より突出してサ
イドポッティングし、樹脂領域は、回路基板の上面では
導電パターンと同一平面となり、ＩＣカードとして好適
である。また、樹脂領域は、回路基板の厚みを埋めてい
るので開口部の強度を増し、厚い樹脂領域は外部からの
衝撃、光線からＩＣチップのエレメント形成面を保護す
る。更に、樹脂封止は、設備費の高いモールド金型が不
要となるなど、構造が簡単で信頼性、生産性が優れ、か
つ、廉価なＩＣカードのモジュールを提供することがで
きる。As described above, according to the present invention,
The IC card module is a circuit board having a single-sided thin pattern on one layer. The IC chip is projected from the lower surface of the circuit board and side-potted, and the resin area is flush with the conductive pattern on the upper surface of the circuit board, which is suitable for an IC card. is there. In addition, the resin region fills the thickness of the circuit board, thereby increasing the strength of the opening, and the thick resin region protects the element forming surface of the IC chip from external impact and light rays. Further, the resin sealing can provide an inexpensive IC card module having a simple structure, excellent reliability and productivity, and no need for a mold having a high equipment cost.
【図１】本発明の実施例に係るＩＣカードのモジュール
構造を示す断面図。FIG. 1 is a sectional view showing a module structure of an IC card according to an embodiment of the present invention.
【図２】図１のＩＣカードのモジュールをカード基板に
収納した状態を示す断面図。FIG. 2 is a sectional view showing a state in which the module of the IC card of FIG. 1 is housed in a card substrate.
【図３】図１の要部平面図。FIG. 3 is a plan view of a main part of FIG. 1;
【図４】従来のＩＣカードのモジュール構造を示す断面
図。FIG. 4 is a sectional view showing a module structure of a conventional IC card.
【図５】他の従来のＩＣカードのモジュール構造を示す
断面図。FIG. 5 is a sectional view showing a module structure of another conventional IC card.
１ 回路基板 ２ ＩＣチップ ３ デバイスホール ４ 導電パターン ５ 遮光パターン ６ フィンガー部 ８ 押え治具 １０ 樹脂 １１ 樹脂領域 １２ ＩＣカードのモジュール ２０ カード基板 DESCRIPTION OF SYMBOLS 1 Circuit board 2 IC chip 3 Device hole 4 Conductive pattern 5 Light shielding pattern 6 Finger part 8 Holding jig 10 Resin 11 Resin area 12 IC card module 20 Card board
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平２−178095（ＪＰ，Ａ) 特開 昭62−82096（ＪＰ，Ａ) 特開 平１−253494（ＪＰ，Ａ) 特開 昭63−183892（ＪＰ，Ａ) 特開 昭63−31141（ＪＰ，Ａ) 実開 昭63−201783（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) G06K 19/077 B42D 15/10 521 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-2-178095 (JP, A) JP-A-62-82096 (JP, A) JP-A-1-253494 (JP, A) JP-A-63-820 183892 (JP, A) JP-A-63-31141 (JP, A) JP-A-63-201783 (JP, U) (58) Fields investigated (Int. Cl. 7 , DB name) G06K 19/077 B42D 15 / 10 521
Claims (1)
一層からなる回路基板の上面に導電パターンを形成し、
前記回路基板の開口部内で、遮光パターンを残し、導電
パターンのフィンガー部を前記回路基板の下面と略等し
い位置になる如く曲げ成形し、該曲げ成形したフィンガ
ー部端と前記ＩＣチップをパンプで接続し、樹脂領域が
前記回路基板の上面に形成した導電パターンと同一平面
から、回路基板の厚みを含みＩＣチップの側面を覆う如
く、前記回路基板にＩＣチップを一体的に樹脂封止する
ことにより、前記ＩＣチップが回路基板の下面より突出
することを特徴とするＩＣカードのモジュール構造。1. A conductive pattern is formed on an upper surface of a circuit board having a single layer provided with an opening for mounting an IC chip,
In the opening of the circuit board, the light-shielding pattern is left, and the finger portion of the conductive pattern is bent and formed so as to be at a position substantially equal to the lower surface of the circuit board, and the end of the bent finger portion and the IC chip are connected by a pump. The IC chip is integrally resin-sealed to the circuit board so that the resin region covers the side surface of the IC chip including the thickness of the circuit board from the same plane as the conductive pattern formed on the upper surface of the circuit board. And a module structure of the IC card, wherein the IC chip projects from a lower surface of the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31429892A JP3206839B2 (en) | 1992-10-30 | 1992-10-30 | IC card module structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31429892A JP3206839B2 (en) | 1992-10-30 | 1992-10-30 | IC card module structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06143885A JPH06143885A (en) | 1994-05-24 |
| JP3206839B2 true JP3206839B2 (en) | 2001-09-10 |
Family
ID=18051680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31429892A Expired - Fee Related JP3206839B2 (en) | 1992-10-30 | 1992-10-30 | IC card module structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3206839B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4212255B2 (en) * | 2001-03-30 | 2009-01-21 | 株式会社東芝 | Semiconductor package |
-
1992
- 1992-10-30 JP JP31429892A patent/JP3206839B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06143885A (en) | 1994-05-24 |
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