JP3195493B2 - Aluminum electrolytic chip capacitors - Google Patents
Aluminum electrolytic chip capacitorsInfo
- Publication number
- JP3195493B2 JP3195493B2 JP07148894A JP7148894A JP3195493B2 JP 3195493 B2 JP3195493 B2 JP 3195493B2 JP 07148894 A JP07148894 A JP 07148894A JP 7148894 A JP7148894 A JP 7148894A JP 3195493 B2 JP3195493 B2 JP 3195493B2
- Authority
- JP
- Japan
- Prior art keywords
- pair
- aluminum electrolytic
- capacitor
- chip
- lead terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、アルミ電解チップコン
デンサに関し、更に詳しくは、電気回路基板等にアルミ
電解チップコンデンサを溶接する時において、アルミ電
解コンデンサの高さ或いは占有面積の一方或は双方を優
先させる場合に、同一のアルミ電解コンデンサと同一の
チップ用成形体を用いてそれぞれの用途に対応し得るよ
うにしたアルミ電解チップコンデンサに係るものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an aluminum electrolytic chip capacitor, and more particularly to one or both of the height and occupied area of an aluminum electrolytic capacitor when welding the aluminum electrolytic chip capacitor to an electric circuit board or the like. The present invention relates to an aluminum electrolytic chip capacitor capable of responding to each use by using the same aluminum electrolytic capacitor and the same molded product for a chip when priority is given.
【０００２】[0002]
【従来の技術】周知のように、電気回路基板等への自動
実装化が進む中で、アルミ電解コンデンサのチップ化が
急速に行なわれており、既に台座付チップ（縦形）と樹
脂ケース挿入形チップ（横形）の２種類が開発され、実
用に供されている。しかし、回路設計上、電子部品の高
さを厳しく制限する場合もあれば、高さはそれ程制約し
ない設計もあり、現実には両方の例が存することもまた
事実である。ところで、一般にアルミ電解コンデンサで
実用化されているものは、円筒形で、一方側からリード
端子が引き出されている形状であって、製品の直径に比
べ、高さの方が大きいものが多く、縦形にすると製品の
高さが問題となり、一方横形にすると、製品の占有面積
が広くなって問題となるというように目的に応じて作り
分けることが必要であった。そこで、従来においては、
特に図示しないが、アルミ電解コンデンサは同一である
が、チップ用成形体は、縦形と横形とではその構成を全
く異にした２種のものを用意し、それぞれの用途に応じ
てチップ用成形体を使い分けしていた。2. Description of the Related Art As is well known, while automatic mounting on an electric circuit board or the like is progressing, aluminum electrolytic capacitors are being rapidly made into chips. Two types of chips (horizontal type) have been developed and put to practical use. However, there are cases where the height of electronic components is severely limited in circuit design, and there are designs where the height is not so limited, and it is also true that there are actually both examples. By the way, generally, aluminum electrolytic capacitors that are practically used have a cylindrical shape in which lead terminals are drawn out from one side, and in many cases, the height is larger than the diameter of the product, If it is made vertical, the height of the product becomes a problem. On the other hand, if it is made horizontal, the area occupied by the product becomes large, which is problematic. Therefore, conventionally,
Although not particularly shown, the aluminum electrolytic capacitor is the same, but two types of molded products for the chip are prepared, which are completely different in vertical and horizontal types. Was used properly.
【０００３】[0003]
【発明が解決しようとする問題点】したがって、従来の
アルミ電解チップコンデンサは、縦形と横形の２種類を
要し、かつそれぞれの製作方法が全く異るところから、
製作工程は少なくとも２系統が必要で、製造コストが高
くなり、また、製作手番においても、異なる設計の部材
を２系統持たなければならないため、工数がかかる等の
問題点を有していた。Therefore, the conventional aluminum electrolytic chip capacitors require two types, a vertical type and a horizontal type, and their manufacturing methods are completely different.
The manufacturing process requires at least two systems, resulting in high manufacturing costs. In addition, the manufacturing process requires two systems of differently designed members.
【０００４】本発明は、このような従来の技術が有する
問題点に鑑みなされたもので、その目的とするところ
は、同一のアルミ電解コンデンサと同一のチップ用成形
体とによって、電気回路基板等への溶接が縦方向或は横
方向のいずれの方向にもなし得る縦横兼用のアルミ電解
チップコンデンサを提供することにある。The present invention has been made in view of the above-mentioned problems of the prior art, and an object of the present invention is to provide an electric circuit board and the like by using the same aluminum electrolytic capacitor and the same molded product for a chip. It is an object of the present invention to provide a vertical and horizontal aluminum electrolytic chip capacitor that can be welded in either the vertical or horizontal direction.
【０００５】[0005]
【問題点を解決するための手段】本発明の発明者は、ア
ルミ電解チップコンデンサで、同一の構成要素（アルミ
電解コンデンサおよびチップ用成形体）を用いて、縦横
兼用のチップコンデンサができれば、製作上も、実用上
もメリットは非常に大きいはずだと考えた。そして、試
作を重ねた結果、本発明を完成させることができた。本
発明に係るアルミ電解チップコンデンサは、前記の問題
点を解決したものであって、次のようなものである。す
なわち、本発明は、アルミ電解コンデンサとチップ用成
形体を含み、チップ用成形体は、耐熱性と電気的絶縁性
を有する一体成形体であって、アルミ電解コンデンサの
本体の一部分または全部が挿入される挿入凹部と、一対
のリード端子が導出される貫通孔と、該貫通孔より導出
のリード端子がアルミ電解コンデンサ本体の径方向に折
り曲げされて形成の一対の縦置き用リード端子の収納溝
が設けられた外壁部と、該外壁部の一対の横置きリード
端子の収納溝を介してそれと直交する方向に折り曲げさ
れて形成の一対の横置き用リード端子の収納溝が設けら
れた直交外壁部を有し、前記同一のアルミ電解コンデン
サと同一のチップ用成形体によってアルミ電解コンデン
サが電気回路基板等に対し縦置き、横置きいずれの方向
にも実装可能とされた構成を特徴とするものである。Means for Solving the Problems The present inventor of the present invention has proposed a method of manufacturing an aluminum electrolytic chip capacitor by using the same components (aluminum electrolytic capacitor and a molded product for a chip) to form a chip capacitor that can be used both vertically and horizontally. I thought that the merit should be very large both in terms of practical use. As a result of repeated trial production, the present invention could be completed. The aluminum electrolytic chip capacitor according to the present invention has solved the above-mentioned problems and is as follows. That is, the present invention includes an aluminum electrolytic capacitor and a molded body for a chip, and the molded body for a chip is an integrally molded body having heat resistance and electrical insulation, and a part or the whole of the main body of the aluminum electrolytic capacitor is inserted. Insertion recess, a through-hole through which a pair of lead terminals are led out, and a storage groove for a pair of vertically-placed lead terminals formed by bending the lead terminal led out from the through-hole in the radial direction of the aluminum electrolytic capacitor body. And an orthogonal outer wall provided with a pair of laterally arranged lead terminal storage grooves formed by being bent in a direction perpendicular to the outer wall portion through the pair of laterally arranged lead terminal storage grooves of the outer wall portion. With the same aluminum electrolytic capacitor and the same molded body for chips, the aluminum electrolytic capacitor can be mounted vertically or horizontally on an electric circuit board etc. The is characterized in configuration.
【０００６】[0006]
【実施例】実施例について図面を参照し、その作用と共
に説明する。図１は、本発明に係るアルミ電解チップコ
ンデンサの一例での斜視図的説明図で、本チップコンデ
ンサは、アルミ電解コンデンサとチップ用成形体とを含
んでいる。アルミ電解コンデンサ１０は、コンデンサ本
体１１と一対のリード端子１２を有し、該コンデンサ１
０は公知のものである。BRIEF DESCRIPTION OF THE DRAWINGS FIG. FIG. 1 is an explanatory perspective view of an example of an aluminum electrolytic chip capacitor according to the present invention. The present chip capacitor includes an aluminum electrolytic capacitor and a molded product for a chip. The aluminum electrolytic capacitor 10 has a capacitor body 11 and a pair of lead terminals 12.
0 is a known value.
【０００７】アルミ電解コンデンサ１０が挿着されるチ
ップ用成形体２０は、耐熱性および電気的絶縁性に優れ
た例えば、セラミック、ガラス等の単体或いはこれらの
複合材の一体成形品としての直方体であって、コンデン
サ本体１１の一部分または全部が挿入される挿入凹部２
１と、該挿入凹部２１の軸方向に面した外壁部２２に一
対のリード端子１２の導出用貫通孔２３が設けられてい
る。貫通孔２３から外方に導出された一対のリード端子
１２は外壁部２２に沿ってそれぞれ逆向き（好ましく
は、コンデンサ本体１１の径方向である外壁部２２と直
交する一方の両直交外壁部１４、２５の方向）に折り曲
げられて、一対の縦置き用リード端子１３とされるが、
該一対の縦置き用リード端子１３を収納するため、外壁
部２２には一対の収納溝２６が設けられている。また、
外壁部２２には、該外壁部２２と直交する他方の両直交
外壁部２７、２８のいずれか一方の直交外壁部２７（ま
たは２８）に向けて一対の斜向状収納溝２９が設けられ
ると共に、直交外壁部２７（または２８）の両端部分に
は、収納溝２９と連通する一対の収納溝３０が設けら
れ、これら収納溝２９、３０に、貫通孔２３より導出さ
れ、折り曲げ形成された横置き用リード端子１４が収納
されるようになっている。図１において、３１は外壁部
に設けられた密着防止用突起を示す。The chip molded body 20 into which the aluminum electrolytic capacitor 10 is inserted is a rectangular parallelepiped having excellent heat resistance and electrical insulation properties, for example, a single body of ceramic, glass, or the like, or an integrally molded article of a composite material thereof. Insertion recess 2 into which part or all of the capacitor body 11 is inserted.
1 and a through hole 23 for leading out a pair of lead terminals 12 is provided on an outer wall portion 22 facing the insertion concave portion 21 in the axial direction. The pair of lead terminals 12 led out from the through holes 23 are respectively oriented in opposite directions along the outer wall 22 (preferably, one of the two orthogonal outer walls 14 orthogonal to the outer wall 22 which is the radial direction of the capacitor body 11). , 25 direction) to form a pair of lead terminals 13 for vertical placement.
A pair of storage grooves 26 are provided in the outer wall portion 22 to store the pair of vertical lead terminals 13. Also,
The outer wall portion 22 is provided with a pair of oblique storage grooves 29 toward one of the orthogonal outer wall portions 27 (or 28) of the other two orthogonal outer wall portions 27 and 28 orthogonal to the outer wall portion 22. At both ends of the orthogonal outer wall portion 27 (or 28), a pair of storage grooves 30 communicating with the storage grooves 29 is provided, and these storage grooves 29, 30 are drawn out from the through holes 23 and formed by bending. The placement lead terminals 14 are accommodated. In FIG. 1, reference numeral 31 denotes a protrusion for preventing adhesion provided on the outer wall portion.
【０００８】本アルミ電解チップコンデンサは、上記の
構成に係り、これを縦置き用として電気回路基板４０等
に溶接する場合には、図２に示されているように、チッ
プ用成形体２０における挿入凹部２１にアルミ電解コン
デンサ１０の本体１１が挿入されて、その一対のリード
端子１２が一対の貫通孔２３より外方に導出されると共
に、この導出された一対のリード端子１２が貫通孔の外
壁部２２に沿い折り曲げられて一対の縦置き用リード端
子１３とされ、該リード端子１３は一対の収納溝２６に
収納される。そして、このコンデンサ本体１１が縦置き
の状態において、その一対の縦置き用リード端子１３は
電気回路基板４０等に溶接される。The present aluminum electrolytic chip capacitor has the above-described structure. When the aluminum electrolytic chip capacitor is welded to an electric circuit board 40 or the like for vertical installation, as shown in FIG. The main body 11 of the aluminum electrolytic capacitor 10 is inserted into the insertion recess 21, and the pair of lead terminals 12 is led out of the pair of through holes 23, and the led pair of lead terminals 12 is inserted into the through hole. It is bent along the outer wall 22 to form a pair of vertically arranged lead terminals 13, which are housed in a pair of housing grooves 26. When the capacitor body 11 is placed vertically, the pair of lead terminals 13 for vertical placement is welded to the electric circuit board 40 and the like.
【０００９】また、横置き用として用いる場合には、チ
ップ用成形体２０の貫通孔２３から導出された一対のリ
ード端子１２が外壁部２２に沿って折り曲げられ、更に
該外壁部２２と直交外壁２７に沿い折り曲げられて、一
対の横置き用リード端子１４とされ、該リード端子１４
はそれぞれ一対の収納溝２９、３０に収納される。そし
て、このコンデンサ本体１１が横置きの状態において、
その一対の横置き用リード端子１４は電気回路基板４０
等に溶接される。When used for horizontal placement, a pair of lead terminals 12 led out of the through hole 23 of the chip molded body 20 are bent along the outer wall portion 22, and furthermore, the outer terminal portion is perpendicular to the outer wall portion 22. 27 to form a pair of horizontal lead terminals 14.
Are stored in a pair of storage grooves 29 and 30, respectively. Then, when the capacitor body 11 is placed horizontally,
The pair of horizontal lead terminals 14 is connected to the electric circuit board 40.
Etc. are welded.
【００１０】図４に示されている実施例は、チップ用成
形体２０の挿入凹部２１内のコンデンサ本体１１の底部
との接触面に樹脂接着剤層３２を設けたものである。チ
ップ用成形体は耐熱性樹脂成形体、例えばＰＰＳ（ポリ
フェニレン・サルファイド）樹脂、イミド系樹脂或いは
エポキシ樹脂、更にはこれら樹脂にガラス繊維等の添加
剤を用いた複合材からなる。樹脂接着剤層３２を気密的
に介装した本実施例によれば、アルミ電解コンデンサ１
０の安定性と気密性が向上し、更には耐熱性が改善され
る。In the embodiment shown in FIG. 4, a resin adhesive layer 32 is provided on the surface of the insertion recess 21 of the chip molded body 20 which is in contact with the bottom of the capacitor body 11. The molded body for chips is made of a heat-resistant resin molded body, for example, a PPS (polyphenylene sulfide) resin, an imide-based resin or an epoxy resin, and a composite material using an additive such as glass fiber for these resins. According to the present embodiment in which the resin adhesive layer 32 is airtightly interposed, the aluminum electrolytic capacitor 1
The stability and the airtightness of No. 0 are improved, and the heat resistance is further improved.
【００１１】[0011]
【発明の効果】しかして、本発明によれば、同一のアル
ミ電解コンデンサと同一のチップ用成形体により、リー
ド端子り折り曲げ方を変えるだけで、縦形或いは横形の
アルミ電解チップコンデンサを製作することができる。
したがって、従来、縦形と横形の２系統必要であった製
作工程を１系統にすることができ、製造コストの大幅な
削減をもたらすことができる。また、製作手番において
も、異なる設計の部材を２系統持つ必要がなくなり、工
程の大幅な合理化が可能となる等の効果を有するもので
ある。According to the present invention, it is possible to manufacture a vertical or horizontal aluminum electrolytic chip capacitor by changing the bending method of the lead terminal by using the same aluminum electrolytic capacitor and the same chip molding. Can be.
Therefore, the manufacturing process, which conventionally required two systems of the vertical type and the horizontal type, can be reduced to one system, and the manufacturing cost can be greatly reduced. Also, in the production turn, there is no need to have two systems of members of different designs, and there is an effect that the process can be greatly rationalized.
【図１】本発明に係るアルミ電解チップコンデンサの一
例での斜視図的説明図である。FIG. 1 is an explanatory perspective view of an example of an aluminum electrolytic chip capacitor according to the present invention.
【図２】縦置き用とした場合の断面的説明図である。FIG. 2 is a cross-sectional explanatory view in the case of vertical installation.
【図３】横置き用とした場合の断面的説明図である。FIG. 3 is a cross-sectional explanatory view in the case of horizontal installation.
【図４】本発明の他例を示す断面的説明図である。FIG. 4 is a sectional explanatory view showing another example of the present invention.
１０ アルミ電解コンデンサ １１ コンデンサ本体 １２ 一対のリード端子 １３ 一対の縦置き用リード端子 １４ 一対の横置き用リード端子 ２０ チップ用成形体 ２１ 挿入凹部 ２２ 外壁部 ２３ 一対のリード端子導出用貫通孔 ２４、２５ 一方の直交外壁部 ２６ 一対の収納溝 ２７、２８ 他方の直交外壁部 ２９、３０ 一対の収納溝 ３２ 耐熱性樹脂接着剤層 DESCRIPTION OF SYMBOLS 10 Aluminum electrolytic capacitor 11 Capacitor main body 12 A pair of lead terminals 13 A pair of vertical placement lead terminals 14 A pair of horizontal placement lead terminals 20 A chip forming object 21 An insertion recess 22 An outer wall part 23 A pair of lead terminal lead-through holes 24, 25 One orthogonal outer wall part 26 A pair of storage grooves 27, 28 The other orthogonal outer wall part 29, 30 A pair of storage grooves 32 Heat resistant resin adhesive layer
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01G 9/004 H01G 2/06 H01G 9/00 321 H05K 1/18 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) H01G 9/004 H01G 2/06 H01G 9/00 321 H05K 1/18
Claims (2)
子(１２)を有するアルミ電解コンデンサ(１０)とチップ
用成形体(２０)を含み、 前記チップ用成形体(２０)は、耐熱性と電気的絶縁性を
有し、かつ前記コンデンサ本体(１１)が挿入される挿入
凹部(２１)の軸方向に面した外壁部(２２)と、該外壁部
(２２)と直交して相対向するそれぞれ一対の直交外壁部
(２４)、(２５)、(２７)、(２８)を有する一体成形品と
しての直方体であって、前記外壁部(２２)には、前記一
対のリード端子(１２)が導出される一対の貫通孔(２３)
が設けられるとともに、前記外壁部(２２)の外側面に
は、前記貫通孔(２３)より導出のリード端子(１２)が、
前記コンデンサ本体(１１)の径方向外側にそれぞれ折り
曲げられて形成された一対の縦置き用リード端子(１３)
がそれぞれ収納される一対の収納溝(２６)と、前記貫通
孔(２３)より導出のリード端子(１２)が、前記外壁部
(２２)および前記いずれか一つの直交外壁部に沿い折り
曲げられて形成された一対の横置き用リード端子(１４)
がそれぞれ収納される溝にして、前記貫通孔(２３)を含
む前記一対の収納溝(２６)とそれぞれ連なり、かつ外壁
部(２２)の二つの隅部に略ハ字状に向けた一対の斜向状
収納溝(２９)が設けられ、前記いずれか一つの直交外壁
部の外側面端縁部には、前記一対の斜向状収納溝(２９)
とそれぞれ連なる一対の収納溝(３０)が設けられ、 前記同一のアルミ電解コンデンサ(１０)と前記同一のチ
ップ用成形体(２０)によって前記アルミ電解コンデンサ
(１０)が、電気回路基板(４０)に対し縦置き、横置きい
ずれの方向にも実装可能とされた構成を特徴とするアル
ミ電解チップコンデンサ。An aluminum electrolytic capacitor (10) having a capacitor body (11), a pair of lead terminals (12), and a molded body for a chip (20), wherein the molded body for a chip (20) has heat resistance. An outer wall portion (22) facing the axial direction of the insertion concave portion (21) having electrical insulation properties and into which the capacitor body (11) is inserted, and the outer wall portion;
(22) A pair of orthogonal outer wall portions orthogonal to each other and opposed to each other
(24), (25), (27), a rectangular parallelepiped as an integrally molded product having (28), a pair of the outer wall portion (22) from which the pair of lead terminals (12) is led out. Through hole (23)
A lead terminal (12) led out from the through hole (23) is provided on the outer surface of the outer wall portion (22).
A pair of vertical lead terminals (13) formed by being bent radially outward of the capacitor body (11), respectively;
And a pair of storage grooves (26) in which the lead terminals (12) led out from the through holes (23) are formed.
(22) and a pair of horizontal lead terminals (14) formed by being bent along one of the orthogonal outer wall portions.
Are respectively accommodated, and are connected to the pair of accommodating grooves (26) including the through holes (23), respectively, and are formed at a pair of corners of the outer wall portion (22) in a substantially C-shape. An oblique storage groove (29) is provided, and the pair of oblique storage grooves (29) is provided at an edge of the outer surface of any one of the orthogonal outer walls.
And a pair of storage grooves (30) respectively connected to the same aluminum electrolytic capacitor (10) and the same chip molding (20).
(10) An aluminum electrolytic chip capacitor characterized in that it can be mounted vertically or horizontally with respect to an electric circuit board (40).
ルミ電解コンデンサ(１０)におけるコンデンサ本体（１
１）との接触面に、前記コンデンサ本体(１１)の安定性
と気密性並びに耐熱性が得られる耐熱性樹脂接着剤層
(３２)が介装された請求項１のアルミ電解コンデンサ。2. A capacitor body (1) in said chip molding (20) and said aluminum electrolytic capacitor (10).
1) a heat-resistant resin adhesive layer on the contact surface with which the stability, airtightness and heat resistance of the capacitor body (11) are obtained;
The aluminum electrolytic capacitor according to claim 1, wherein (32) is interposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP07148894A JP3195493B2 (en) | 1994-03-15 | 1994-03-15 | Aluminum electrolytic chip capacitors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP07148894A JP3195493B2 (en) | 1994-03-15 | 1994-03-15 | Aluminum electrolytic chip capacitors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07254530A JPH07254530A (en) | 1995-10-03 |
| JP3195493B2 true JP3195493B2 (en) | 2001-08-06 |
Family
ID=13462101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP07148894A Expired - Fee Related JP3195493B2 (en) | 1994-03-15 | 1994-03-15 | Aluminum electrolytic chip capacitors |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3195493B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6317221B1 (en) | 1994-08-22 | 2001-11-13 | Nikon Corporation | Image reading device and method |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4694826B2 (en) * | 2004-12-08 | 2011-06-08 | セイコーインスツル株式会社 | Electrochemical cell and method for producing the same |
| JP5032636B2 (en) * | 2010-07-08 | 2012-09-26 | セイコーインスツル株式会社 | Electrochemical cell and method for producing the same |
| CN111052281B (en) * | 2017-08-31 | 2022-02-08 | 松下知识产权经营株式会社 | Electrolytic capacitor |
-
1994
- 1994-03-15 JP JP07148894A patent/JP3195493B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6317221B1 (en) | 1994-08-22 | 2001-11-13 | Nikon Corporation | Image reading device and method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07254530A (en) | 1995-10-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3806766A (en) | Packaged electrical component assembly and method of fabrication | |
| US7541670B2 (en) | Semiconductor device having terminals | |
| KR950003510B1 (en) | Chip-type micro-fuse | |
| US6325642B2 (en) | Electrical connection box | |
| JP2003508889A (en) | Control device and soldering method | |
| US20170343586A1 (en) | Current detector | |
| EP0320013B1 (en) | Chip type capacitor and manufacturing thereof | |
| JP3195493B2 (en) | Aluminum electrolytic chip capacitors | |
| US4514782A (en) | Multiple feedthrough-capacitor unit | |
| JP5233294B2 (en) | Electronic components | |
| CN117156736A (en) | Electronic component | |
| US3978377A (en) | Hermetic bushing for terminals for electrolytic filter capacitors | |
| JPH04159704A (en) | Electric double-layer condenser | |
| JPH0888103A (en) | Surface-mounted electronic component | |
| JPH0236274Y2 (en) | ||
| JP7409491B2 (en) | capacitor module | |
| CN211792474U (en) | Bottom-expanded electrical protection shell structure | |
| JPH11111352A (en) | Connector with buiil-in electronic part and manufacture thereof | |
| JPH0440267Y2 (en) | ||
| JP3501099B2 (en) | Electrical junction box | |
| KR100206455B1 (en) | Electric double layer condenser | |
| KR940006435Y1 (en) | Chip-type electrolytic condenser | |
| JPH0424845B2 (en) | ||
| JPH0328500Y2 (en) | ||
| KR20230158306A (en) | Electric connector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |