JP3187487B2 - Article with diamond-like thin film protective film - Google Patents

Article with diamond-like thin film protective film

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Publication number
JP3187487B2
JP3187487B2 JP30826491A JP30826491A JP3187487B2 JP 3187487 B2 JP3187487 B2 JP 3187487B2 JP 30826491 A JP30826491 A JP 30826491A JP 30826491 A JP30826491 A JP 30826491A JP 3187487 B2 JP3187487 B2 JP 3187487B2
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JP
Japan
Prior art keywords
diamond
thin film
substrate
hardness
intermediate layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP30826491A
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Japanese (ja)
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JPH05117087A (en
Inventor
正典 柴原
正俊 中山
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TDK Corp
Original Assignee
TDK Corp
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Priority to JP30826491A priority Critical patent/JP3187487B2/en
Publication of JPH05117087A publication Critical patent/JPH05117087A/en
Priority to US08/209,573 priority patent/US5707717A/en
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Publication of JP3187487B2 publication Critical patent/JP3187487B2/en
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Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、難接着性の物品基体に
対するダイヤモンド様薄膜の接着性ないし結合性を向上
させる技術に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for improving the adhesion or bonding of a diamond-like thin film to a poorly adherent article substrate.

【0002】[0002]

【従来技術】気相法により製造されるダイヤモンド様薄
膜は硬度が高く、耐摩耗性、耐久性、耐薬品性、耐食性
等に優れており、また任意形状の物品に被着できるた
め、こうした特性の一つ以上が必要な物品の保護膜とし
て有用である。気相法によるダイヤモンド様薄膜製造方
法には各種の形式がある(例えば「表面化学」第5巻第
108号(1984年)第108−115頁の各種の方
法参照)。ダイヤモンド様薄膜は任意形状の保護すべき
物品の表面に被覆され、耐食性、耐摩耗性などの保護膜
として広く利用される。
2. Description of the Related Art A diamond-like thin film produced by a gas phase method has high hardness, excellent abrasion resistance, durability, chemical resistance, corrosion resistance, and the like. Is useful as a protective film for necessary articles. There are various types of methods for producing a diamond-like thin film by a vapor phase method (for example, see various methods in “Surface Chemistry”, Vol. 5, No. 108 (1984), pp. 108-115). The diamond-like thin film is coated on the surface of an article of any shape to be protected, and is widely used as a protective film such as corrosion resistance and abrasion resistance.

【0003】ダイヤモンド様薄膜はシリコン等の基体に
は強固に結合し得るが、物品の種類によっては基体に対
する結合力が弱く、外力の作用で基体から剥離し易い問
題があった。そのため保護被覆として耐食性、耐摩耗性
等が必要な用途において充分に効果を発揮出来ない。特
にFe系の金属又は合金(例えば軟鋼(STC)、ステ
ンレス鋼、焼き入れ鋼(SKD、SKS)等)、その他
Co、Niなどの金属の合金、ガラス、セラミックス等
はダイヤモンド様薄膜に対する結合力が弱いことが知ら
れている。鉄を主成分とする基体は例えば機構部材、摺
動部材等最も工業的価値の高いものであるし、又ガラス
やセラミックスではサーマルヘッド等の摺動部分などに
使用されるなど、広い用途を有するので、これらの基体
の表面に形成されるダイヤモンド様薄膜の基体への接着
性を向上させることが重要である。
[0003] Although a diamond-like thin film can be firmly bonded to a substrate such as silicon, there is a problem that the bonding force to the substrate is weak depending on the kind of an article, and the diamond-like thin film is easily peeled off from the substrate by the action of an external force. Therefore, the effect cannot be sufficiently exerted in applications requiring corrosion resistance, wear resistance, etc. as a protective coating. In particular, Fe-based metals or alloys (eg, mild steel (STC), stainless steel, quenched steel (SKD, SKS), etc.), other metal alloys such as Co, Ni, glass, ceramics, etc., have a bonding force to a diamond-like thin film. It is known to be weak. Substrates containing iron as a main component are of the highest industrial value, such as mechanical members and sliding members, and have a wide range of uses such as glass and ceramics used for sliding parts such as thermal heads. Therefore, it is important to improve the adhesion of the diamond-like thin film formed on the surface of these substrates to the substrate.

【0004】この基体に前処理を行なって接着性を向上
することは特開昭60−200898号、同60−20
4695号、同61−174376号等で提案されてい
る。
It is disclosed in Japanese Patent Application Laid-Open Nos. 60-200898 and 60-20 to improve the adhesiveness by performing a pretreatment on the substrate.
4695 and 61-174376.

【0005】[0005]

【発明が解決すべき課題】特開昭60−200898号
ではCo−WC合金を基体とし、その表面にダイヤモン
ド様薄膜を高硬度膜として付けるに当たり、基体の表面
に予めグロー放電を直接作用させることによりイオンエ
ッチングすることを提案しているが、加速電圧は印加さ
れていないからエッチング効率は接着性向上の面からは
充分でなく本発明が目的する接着性の向上は充分に得ら
れない。特開昭60−204695号も上記技術と同様
に成膜速度の向上を意図してArガスを減圧室内に導入
し正負電極間に電圧を加えてプラズマを作りこれを基体
に作用させるのであるが、プラズマのイオン濃度は低い
のでエッチング効果は接着性向上の観点からは低い。特
開昭61−174376号は基体の接着性を向上するた
めにプラズマガスで基体を処理した後、酸化処理して酸
化物被膜を形成することを記載している。しかし、プラ
ズマは先ず拡散によって正イオンが正電位のグリッドを
通り抜ける必要があり、成膜に必要な充分な量の正イオ
ンが基体に到達出来ないので結果として効率の悪い方法
である。従って従来公知の技術では基体とダイヤモンド
様薄膜との間の接着力が充分に高い成膜は可能でなかっ
た。また特開平3−80190号にはイオンを加速して
基体表面を衝撃する方法が記載され、上記の各方法より
はすぐれているが必ずしも十分な結合力が得られていな
い。
In Japanese Patent Application Laid-Open No. 60-200898, a Co-WC alloy is used as a substrate, and a glow discharge is directly applied to the surface of the substrate before applying a diamond-like thin film as a high hardness film on the surface. However, since no acceleration voltage is applied, the etching efficiency is not sufficient from the viewpoint of improving the adhesiveness, and the improvement of the adhesiveness intended by the present invention cannot be sufficiently obtained. In Japanese Patent Application Laid-Open No. 60-204695, Ar gas is introduced into a decompression chamber and a voltage is applied between the positive and negative electrodes to produce a plasma and act on the substrate, with the intention of improving the film forming rate in the same manner as the above technique. Since the plasma ion concentration is low, the etching effect is low from the viewpoint of improving the adhesiveness. JP-A-61-174376 describes that an oxide film is formed by treating a substrate with a plasma gas and then oxidizing the substrate in order to improve the adhesion of the substrate. However, plasma is a method of inefficiency because the positive ions must first pass through a grid of positive potential by diffusion, and a sufficient amount of positive ions required for film formation cannot reach the substrate. Therefore, it was not possible to form a film having sufficiently high adhesive force between the substrate and the diamond-like thin film by the conventionally known technique. JP-A-3-80190 describes a method of bombarding the surface of a substrate by accelerating ions, which is superior to the above-mentioned methods, but does not always provide a sufficient bonding force.

【0006】そこで本発明者らは特願平3−14267
8号でMoを中間層として接着性を改善することを提案
した。この中間層はすぐれた結合力を生じることがわか
った。本発明者は中間層として他の物質を試みたとこ
ろ、同出願に記載したものと同等以上の効果を得た。そ
のほか、結晶性の炭化けい素、結晶性の窒化けい素等の
中間層を形成することも知られているが、しかし、従来
の方法及び上記先願の方法は、成膜時にダイヤモンドと
は異質の原料を使用して中間層を形成する必要があり、
工程数が増加する。それに加えて特に公知の結晶性の中
間層は結合力が十分でない。したがって、本発明の目的
は、比較的簡単な方法で、基体に対する結合力ないし接
着力が大きく、耐剥離性で耐久性の向上したダイヤモン
ド様薄膜を具備した物品を提供することにある。
Accordingly, the present inventors have filed a Japanese Patent Application No. Hei 3-14267.
No. 8 proposed using Mo as an intermediate layer to improve the adhesion. This intermediate layer was found to produce excellent bonding strength. The present inventor tried other substances as the intermediate layer, and obtained the same or better effects as those described in the same application. In addition, it is known to form an intermediate layer of crystalline silicon carbide, crystalline silicon nitride, etc. However, the conventional method and the method of the prior application are different from diamond at the time of film formation. It is necessary to form an intermediate layer using the raw materials of
The number of steps increases. In addition, particularly well-known crystalline interlayers do not have sufficient bonding strength. SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an article provided with a diamond-like thin film having a large bonding strength or adhesion to a substrate, a peel resistance and an improved durability by a relatively simple method.

【0007】[0007]

【課題を解決するための手段】本発明は、通常の基体は
もちろん、Co、Ni、Feの少なくとも一種を含む合
金、セラミックス及びガラスよりなる群より選択され且
つダイヤモンド様薄膜との親和性が悪い基体の表面に、
前記基体よりも硬度が大きく且つ後記ダイヤモンド様薄
膜よりは硬度が小さいHv=1000〜5000kg/
mm2 の炭素中間層と、ダイヤモンド様薄膜とを順に形
成した保護膜を有する物品を提供する。特に好ましく
は、本発明の中間層は基体からダイヤモンド様薄膜に向
かって段階的または連続的に硬度が大きくなる。ただし
成形あるいは加工用金型への応用は別出願の対象とした
ので本発明からは除かれる。
According to the present invention, not only a normal substrate but also an alloy containing at least one of Co, Ni and Fe, a ceramic and a glass are selected, and the affinity with a diamond-like thin film is poor. On the surface of the substrate,
Hv = 1000-5000 kg / has a higher hardness than the substrate and a lower hardness than the diamond-like thin film described later.
Provided is an article having a protective film in which a carbon intermediate layer of mm 2 and a diamond-like thin film are sequentially formed. Particularly preferably, the hardness of the intermediate layer of the present invention increases stepwise or continuously from the substrate toward the diamond-like thin film. However, the application to a molding or processing mold is excluded from the present invention since it is covered by a separate application.

【0008】本発明では、イオン化蒸着法における負バ
イアス蒸着条件を制御することによりプラズマ中の水素
及び炭素の正イオンを基体の表面に蒸着して、前記基体
よりも硬度が大きく且つ後記ダイヤモンド様薄膜よりは
硬度が小さい炭素中間層を成膜し、次いで原料炭化水素
を変更することなく且つ同じイオン化蒸着法を使用して
成膜条件を変更しダイヤモンド様薄膜を成膜する。特に
中間層は硬度が基体からダイヤモンド様薄膜に向かって
大きくなる様に中間層自体の成膜時にも階段的または連
続的な成膜条件の変更を実施することが好ましい。
In the present invention, a negative electrode in the ionization vapor deposition method is used.
Hydrogen in plasma by controlling ias deposition conditions
And depositing positive ions of carbon on the surface of the substrate to form a carbon intermediate layer having a higher hardness than the substrate and a lower hardness than the diamond-like thin film described below, and then changing the raw material hydrocarbons to the same level. A diamond-like thin film is formed by changing film forming conditions using an ionization vapor deposition method. In particular, it is preferable to change the film-forming conditions stepwise or continuously during the film formation of the intermediate layer itself so that the hardness of the intermediate layer increases from the substrate toward the diamond-like thin film.

【0009】中間層を形成するための方法は、特開昭5
8−174507号及び特開平1−234396号に記
載されたイオンが化蒸着法を使用する。この方法によれ
ば、中間層の成膜後に、その層を空気にさらすことな
く、あるいは作業自体を中断することなく条件をダイヤ
モンド様薄膜の成膜条件に変更することにより、次のダ
イヤモンド様薄膜の形成工程に移行することができる。
このため本発明の方法は作業性が極めてよい。なお、好
ましくはこの工程に先立って、成膜装置の真空室内に前
記基体を配置し、Ar等のボンバード用ガスを前記真空
室内に導入し、熱陰極フィラメントとその周りに設けら
れた対陰極とよりなるイオン化手段により電離してイオ
ンの流れを形成し、これを前記対陰極よりも低電位にあ
るグリッドにより加速して基体の表面をボンバードして
活性化する前工程を採用してもよい。
A method for forming an intermediate layer is disclosed in
The ions described in JP-A-8-174507 and JP-A-1-234396 use a chemical vapor deposition method. According to this method, after the formation of the intermediate layer, the next diamond-like thin film can be formed by changing the conditions to the diamond-like thin film formation conditions without exposing the layer to air or without interrupting the operation itself. Can be shifted to the forming process.
For this reason, the method of the present invention has extremely good workability. Preferably, prior to this step, the substrate is placed in a vacuum chamber of a film forming apparatus, bombarding gas such as Ar is introduced into the vacuum chamber, and a hot cathode filament and a counter cathode provided therearound are provided. A pre-process may be employed in which ion flow is formed by ionization by the ionizing means, and the flow of ions is formed, accelerated by a grid having a lower potential than the counter electrode, and bombarded to activate the surface of the substrate.

【0010】中間層は基体の硬度よりは大きく且つダイ
ヤモンド様薄膜の硬度よりは小さい一定の組成の膜でも
良いが、好ましくは基体側で低硬度、ダイヤモンド側で
高硬度にする。これにより結合性密着性を改善すること
ができる。中間層とダイヤモンド様薄膜の成膜は同一の
イオン化蒸着装置を使用し、同一の原料を使用し、単に
蒸着条件を連続的または段階的に変化させるだけで良
い。中間層の膜厚は0.02〜3μmが好適であり、更
に好ましくは0.05〜0.5μmである。余り薄いと
効果がなく、余り厚過ぎても効果が飽和する。
The intermediate layer may be a film having a constant composition larger than the hardness of the substrate and smaller than the hardness of the diamond-like thin film, but preferably has a low hardness on the substrate side and a high hardness on the diamond side. Thereby, the bonding and adhesion can be improved. For forming the intermediate layer and the diamond-like thin film, the same ionized vapor deposition apparatus is used, the same raw material is used, and the vapor deposition conditions may be simply changed continuously or stepwise. The thickness of the intermediate layer is preferably 0.02 to 3 μm, more preferably 0.05 to 0.5 μm. If it is too thin, there is no effect, and if it is too thick, the effect is saturated.

【0011】ダイヤモンド様薄膜の硬度はイオン化蒸着
法によるとき約6000kg/mm2 以上である。一方
基板になる物品の硬度は材質によって異なるが、通常は
200〜3000kg/mm2 である。したがって、中
間層の硬度を基板の材料とダイヤモンド様薄膜の中間の
硬度である1000〜5000kg/mm2 の範囲で選
択すれば良い。
[0011] The hardness of the diamond-like thin film is about 6000 kg / mm 2 or more as measured by ionization vapor deposition. On the other hand, the hardness of the article serving as the substrate varies depending on the material, but is usually 200 to 3000 kg / mm 2 . Therefore, the hardness of the intermediate layer may be selected in the range of 1000 to 5000 kg / mm 2 which is the intermediate hardness between the substrate material and the diamond-like thin film.

【0012】イオン化蒸着法による中間層の形成にあっ
ては、前記の単独又は混合ガスを用いる。またダイヤモ
ンド様薄膜の形成にあっては、炭化水素原料ガス又は分
解又は反応により炭化水素を生成し得る原料ガス(ここ
に炭化水素とはメタン、エタン、プロパン等の飽和炭化
水素、エチレン、プロピレン、アセチレン等の不飽和炭
化水素等があり、分解して炭化水素を生成し得る原料ガ
スはメチルアルコール、エチルアルコール等のアルコー
ル類、アセトン、メチルエチルケトン等のケトン類など
があり、又反応して炭化水素ガスを生成する原料ガスに
は一酸化炭素、二酸化炭素と水素との混合ガス等があ
る。また前記原料にはヘリウム、ネオン、アルゴン等の
希ガスあるいは水素、酸素、窒素、水、一酸化炭素、二
酸化炭素、等の少なくとも一種を含ませることができ
る)を熱陰極フィラメント−対陰極間のアーク放電、陰
極熱フィラメント−対陰極間の熱電子放出によるイオン
化等の手段でイオン化してイオン流とし、この流れを電
場で加速して基体に差し向けることによりダイヤモンド
様薄膜を成膜する方法であり、詳細は特開昭58−17
4507号及び特開平1−234396号に記載されて
いる。
In the formation of the intermediate layer by the ionization vapor deposition method, the above-mentioned single or mixed gas is used. In the formation of a diamond-like thin film, a hydrocarbon raw material gas or a raw material gas capable of generating hydrocarbons by decomposition or reaction (here, hydrocarbons are saturated hydrocarbons such as methane, ethane and propane, ethylene, propylene, There are unsaturated hydrocarbons such as acetylene, etc., and raw material gases that can be decomposed to produce hydrocarbons include alcohols such as methyl alcohol and ethyl alcohol, ketones such as acetone and methyl ethyl ketone, and hydrocarbons that react to produce hydrocarbons. Source gases for producing the gas include carbon monoxide, a mixed gas of carbon dioxide and hydrogen, etc. The above-mentioned raw materials include rare gases such as helium, neon, and argon, or hydrogen, oxygen, nitrogen, water, carbon monoxide. , Carbon dioxide, etc.) can be contained in the hot cathode filament-cathode arc discharge, the cathode hot filter. A method of forming a diamond-like thin film by ionizing by ionization by means of thermionic emission between the element and the cathode to form an ion stream, accelerating the stream with an electric field and directing the stream to a substrate. Kaisho 58-17
No. 4507 and JP-A-1-234396.

【0013】第1図に特開昭58−174507号に従
った成膜装置の好ましい例を示す。その他の公知のイオ
ン化蒸着装置を使用してもよいことはもちろんである。
図中30は真空容器、31はチャンバーであり、排気系
38に接続されて10-6Torr程度までの高真空に引
かれる。32は基体Sの裏面に設けられ負の電位Vaに
保たれた電極である。基体Sの表面に近接又は接触して
ダイヤモンド様薄膜の形状を規制する窓を有するマスク
42が設けられる。このマスクは基体に接していても良
いが膜の周部の厚みを薄くして割れ(クラック)を減じ
るためにはなるべくは離間させる。33は基体と同一の
電位Vaを与えられたグリッドで成膜工程で炭化水素イ
オンの加速を行なうのに使用される。このグリッド33
は膜の連続性を高め且つ表面を平滑にするため適正に定
めた空間率(単位面積あたりの穴の面積)と穴密度(単
位長さあたりの穴の数)のグリッドを使用し、或いはそ
の面内方向に振動するための手段を有していても良い。
34は負の電位Vdに維持された熱陰極フィラメントで
あり、交流電源からの電流Ifによって加熱されて熱電
子を発生する。35は原料でガスの供給口であり、37
はガス供給通路、37’はプラズマ励起室である。フィ
ラメント34を取囲んで陽極36が配置されている。こ
の陽極はこの場合接地されているが、フィラメントに対
しては正の電圧Vdを有し、電極32及びグリッド33
に対しては正の電位Vaを与えられている。フィラメン
ト34、陽極36及び供給口35の周りを取り囲んでイ
オン化ガスの閉じ込め用の磁界を発生するために電源V
cからの電流Icで励磁される電磁コイル39が配置さ
れている。従って、If、Va、Vd、コイルの電流I
cを調整することにより膜質を変えることができる。特
にVa(基体電圧)及びVd(熱陰極ー陽極間の電位
差)の制御が好ましい。このような成膜条件の制御は、
コンピュータによるプログラム制御により容易に実行す
ることができる。
FIG. 1 shows a preferred example of a film forming apparatus according to JP-A-58-174507. Of course, other known ionized vapor deposition devices may be used.
In the figure, reference numeral 30 denotes a vacuum container, and 31 denotes a chamber, which is connected to an exhaust system 38 and is evacuated to a high vacuum of about 10 -6 Torr. Reference numeral 32 denotes an electrode provided on the back surface of the base S and maintained at a negative potential Va. A mask 42 having a window that regulates the shape of the diamond-like thin film in proximity to or in contact with the surface of the substrate S is provided. This mask may be in contact with the substrate, but should be separated as much as possible in order to reduce the thickness of the peripheral portion of the film and reduce cracks. Reference numeral 33 denotes a grid to which the same potential Va as that of the base is applied, which is used for accelerating hydrocarbon ions in a film forming process. This grid 33
Uses a grid of properly defined porosity (area of holes per unit area) and hole density (number of holes per unit length) to increase membrane continuity and smooth the surface, or A means for vibrating in the in-plane direction may be provided.
Numeral 34 denotes a hot cathode filament maintained at a negative potential Vd, which is heated by a current If from an AC power supply to generate thermoelectrons. Reference numeral 35 denotes a raw material gas supply port;
Is a gas supply passage, and 37 'is a plasma excitation chamber. An anode 36 is arranged around the filament 34. This anode is in this case grounded, but has a positive voltage Vd for the filament, and the electrode 32 and the grid 33
Is supplied with a positive potential Va. A power supply V is provided for generating a magnetic field for confining the ionized gas surrounding the filament 34, the anode 36 and the supply port 35.
An electromagnetic coil 39 that is excited by a current Ic from c is arranged. Therefore, If, Va, Vd and the coil current I
The film quality can be changed by adjusting c. In particular, control of Va (substrate voltage) and Vd (potential difference between hot cathode and anode) is preferable. Such control of film forming conditions is as follows.
It can be easily executed by program control by a computer.

【0014】成膜にあたり、チャンバー31内を10-6
Torrまで高真空とし、ガス供給通路37のバルブを
操作して所定流量の中間層成膜用のガス、またはダイヤ
モンド成膜用のガス、場合によりそれと水素との混合ガ
ス、或いはそれとAr、He、Ne等のキャリアガス等
を各供給口35から導入しながら排気系38を調整して
所定のガス圧例えば10-1Torrとする。一方、複数
の熱陰極フイラメント34には交流電流Ifを流して加
熱し、フイラメント34と陽極36の間には電位差Vd
を印加して放電を形成する。供給口35から供給された
原料ガスは熱分解されるとともにフィラメントからの熱
電子と衝突してプラスのイオンと電子を生じる。この電
子は別の熱分解粒子と衝突する。電磁コイルの磁界によ
る閉じ込め作用の下に、このような現象を繰り返すこと
により原料ガスは熱分解物質のプラスイオンとなる。プ
ラスイオンは電極32、グリッド36に印加された負電
位Vaにより引き寄せられ、基体Sの方へ向けて加速さ
れ、基体に衝突して成膜反応を行ない、ダイヤモンド様
薄膜を形成する。なお、各部の電位、電流、温度等の条
件については上に述べた条件の他、先に引用した特許公
報を参照されたい。
In forming a film, the inside of the chamber 31 is set to 10 −6.
A high vacuum was applied to Torr, and a valve for the gas supply passage 37 was operated to operate a predetermined flow rate of a gas for forming an intermediate layer, a gas for forming a diamond, a mixed gas of hydrogen and gas, or Ar, He, The exhaust system 38 is adjusted while introducing a carrier gas such as Ne from each supply port 35 to a predetermined gas pressure, for example, 10 -1 Torr. On the other hand, the plurality of hot cathode filaments 34 are heated by passing an alternating current If, and a potential difference Vd is applied between the filaments 34 and the anode 36.
Is applied to form a discharge. The raw material gas supplied from the supply port 35 is thermally decomposed and collides with thermoelectrons from the filament to generate positive ions and electrons. This electron collides with another pyrolysis particle. By repeating such a phenomenon under the confinement effect of the magnetic field of the electromagnetic coil, the raw material gas becomes a positive ion of the thermal decomposition substance. The positive ions are attracted by the negative potential Va applied to the electrode 32 and the grid 36, accelerated toward the substrate S, collide with the substrate, and perform a film forming reaction to form a diamond-like thin film. For the conditions such as the potential, current, and temperature of each part, refer to the above-mentioned patent publications in addition to the above-mentioned conditions.

【0015】以下に本発明を例示する。Hereinafter, the present invention will be exemplified.

【実施例の説明】イオン化蒸着法を用い、SKD11及
び石英ガラス(SUPRASL:信越石英(株))より
なる物品基体の上に表1に示す条件で中間層を成膜し、
次いで表1の条件でダイヤモンド様薄膜を成膜した。フ
ィラメント34はコイル状としその幅3mm、その周り
を取り囲む電極36との隙間8mmとした。グリッド3
3は5mm/分の速度で振動させた。If=25A,フ
ィラメント電圧Vd可変、基体電圧Va可変、電磁コイ
ルの磁束密度300Gの条件で、CH4 を導入し、各種
膜厚の中間層、次いで膜厚3.0μmのダイヤモンド様
薄膜を得た。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An intermediate layer is formed on an article substrate made of SKD11 and quartz glass (SUPRASL: Shin-Etsu Quartz Co., Ltd.) under the conditions shown in Table 1 by ionization vapor deposition.
Next, a diamond-like thin film was formed under the conditions shown in Table 1. The filament 34 was coil-shaped and had a width of 3 mm and a gap of 8 mm with the electrode 36 surrounding the filament. Grid 3
3 was vibrated at a speed of 5 mm / min. CH 4 was introduced under the conditions of If = 25 A, a variable filament voltage Vd, a variable substrate voltage Va, and a magnetic flux density of the electromagnetic coil of 300 G to obtain an intermediate layer having various thicknesses, and then a diamond-like thin film having a thickness of 3.0 μm. .

【0016】[0016]

【表1】 [Table 1]

【0017】得られた保護膜付き物品の保護膜の特性表
2に示す通りであった。ただし密着力とスクラッチ力の
評価は次の通りであった。密着力は1cm角、長さ10
cmの角材をダイヤモンド様薄膜にエポキシ樹脂で接着
し、引張試験機(テンシロン−商品名)で引っ張って剥
離し測定を行なった。又スクラッチ力はRhesca社
製のCSR−02試験機で測定した。いずれの値も表1
の第1行の値を基準とした相対値である。
The properties of the protective film of the obtained article with a protective film were as shown in Table 2. However, the evaluation of adhesion and scratching power was as follows. Adhesion force 1cm square, length 10
cm square material was adhered to the diamond-like thin film with an epoxy resin, pulled and peeled off by a tensile tester (Tensilon-trade name), and measured. The scratch force was measured with a CSR-02 tester manufactured by Rhesca. Table 1 shows all values
Is a relative value based on the value in the first row of FIG.

【0018】[0018]

【表2】 [Table 2]

【0019】[0019]

【発明の効果】本発明によると中間層を介在することに
よりダイヤモンド様薄膜を、通常では結合が困難な物品
基体に施すことが可能になった。
According to the present invention, it becomes possible to apply a diamond-like thin film to an article substrate, which is usually difficult to bond, by interposing an intermediate layer.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に使用するイオン化蒸着装置の概要を示
す。
FIG. 1 shows an outline of an ionization vapor deposition apparatus used in the present invention.

【符号の説明】[Explanation of symbols]

30 真空容器 31 チャンバー 32 負電極 42 マスク 33 グリッド 34 熱陰極フィラメント 35 原料ガスの供給口 36 陽極 37 ガス供給通路 37’ プラズマ励起室 Reference Signs List 30 vacuum vessel 31 chamber 32 negative electrode 42 mask 33 grid 34 hot cathode filament 35 source gas supply port 36 anode 37 gas supply passage 37 ′ plasma excitation chamber

Claims (5)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 炭化水素プラズマから、基体の表面に、
炭化水素プラズマに対して第1の負バイアス条件下に蒸
着して得た、前記基体よりも硬度が大きく且つ後記ダイ
ヤモンド様薄膜よりは硬度が小さい硬度Hv=1000
〜5000kg/mm2 の炭素中間層と、その上に炭化
水素プラズマから、炭化水素プラズマに対してより大き
い第2の負バイアス条件下に蒸着して得たダイヤモンド
様薄膜とよりなる保護膜を有する物品。
1. The method according to claim 1, wherein the surface of the substrate is converted from the hydrocarbon plasma to
Under a first negative bias condition with respect to the hydrocarbon plasma,
Hardness Hv = 1000, which is higher in hardness than the substrate and lower in hardness than the diamond-like thin film described later , obtained by
~ 5000 kg / mm 2 carbon intermediate layer and carbonized on it
Larger to hydrogen plasma from hydrogen plasma
An article having a protective film comprising a diamond-like thin film obtained by vapor deposition under a second negative bias condition .
【請求項2】 Co、Ni、Feの少なくとも一種を含
む合金、セラミックス及びガラスよりなる群より選択さ
れ且つダイヤモンド様薄膜との親和性が悪い基体の表面
に、前記基体よりも硬度が大きく且つ後記ダイヤモンド
様薄膜よりは硬度が小さい炭素中間層と、ダイヤモンド
様薄膜を順に形成した請求項1に記載の保護膜付き物
品。
2. The surface of a substrate selected from the group consisting of an alloy containing at least one of Co, Ni, and Fe, ceramics, and glass and having a poor affinity for a diamond-like thin film, has a higher hardness than the substrate and is described later. The article with a protective film according to claim 1, wherein a carbon intermediate layer having a lower hardness than the diamond-like thin film and a diamond-like thin film are sequentially formed.
【請求項3】 中間層は基体からダイヤモンド様薄膜に
向かって段階的または連続的に硬度が大きくなる請求項
1または2に記載の保護膜付き物品。
3. The article with a protective film according to claim 1, wherein the hardness of the intermediate layer increases stepwise or continuously from the substrate toward the diamond-like thin film.
【請求項4】 中間層の膜厚が0.02〜3.0μmで
ある請求項1〜4のいずれかに記載の保護膜付き物品。
4. The article with a protective film according to claim 1, wherein the thickness of the intermediate layer is 0.02 to 3.0 μm.
【請求項5】 炭化水素ガスをプラズマ化し、基体の表
面に、前記基体よりも硬度が大きく且つ後記ダイヤモン
ド様薄膜よりは硬度が小さい硬度Hv=1000〜50
00kg/mm 2 の炭素中間層がえられるように第1の
負バイアス条件下に蒸着させ、次いで前記中間層の上に
前記負バイアス条件をより大きい第2の負バイアス条件
に変えて、より硬質であるダイヤモンド様薄膜を形成す
ることを特徴とする物品の保護膜形成方法
5. The method according to claim 1, wherein the hydrocarbon gas is converted into plasma, and
The surface has a higher hardness than the substrate and
Hardness Hv = 1000 to 50, which is smaller than the hardness of the thin film
First, a carbon intermediate layer of 00 kg / mm 2 was obtained.
Deposited under negative bias conditions, then over the interlayer
A second negative bias condition greater than the negative bias condition
To form a harder diamond-like thin film
A method for forming a protective film on an article .
JP30826491A 1991-10-29 1991-10-29 Article with diamond-like thin film protective film Expired - Fee Related JP3187487B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP30826491A JP3187487B2 (en) 1991-10-29 1991-10-29 Article with diamond-like thin film protective film
US08/209,573 US5707717A (en) 1991-10-29 1994-03-10 Articles having diamond-like protective film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30826491A JP3187487B2 (en) 1991-10-29 1991-10-29 Article with diamond-like thin film protective film

Publications (2)

Publication Number Publication Date
JPH05117087A JPH05117087A (en) 1993-05-14
JP3187487B2 true JP3187487B2 (en) 2001-07-11

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Country Link
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3119172B2 (en) 1995-09-13 2000-12-18 日新電機株式会社 Plasma CVD method and apparatus
DE69736790T2 (en) * 1996-06-27 2007-08-16 Nissin Electric Co., Ltd. Carbon film coated article and method of making the same
US6893720B1 (en) 1997-06-27 2005-05-17 Nissin Electric Co., Ltd. Object coated with carbon film and method of manufacturing the same
EP1067211B1 (en) 1999-07-08 2008-10-01 Sumitomo Electric Industries, Ltd. Hard coating and coated member
US7820293B2 (en) * 2005-08-18 2010-10-26 Nv Bekaert Sa Substrate coated with a layered structure comprising a tetrahedral carbon coating
JP2007070667A (en) * 2005-09-05 2007-03-22 Kobe Steel Ltd Formed article with hard multilayer film of diamond-like carbon, and production method therefor
JP2009167512A (en) 2008-01-21 2009-07-30 Kobe Steel Ltd Diamond-like carbon film for sliding component and method for manufacturing the same
CN111908935B (en) * 2020-01-19 2022-12-09 湖南碳康生物科技有限公司 Carbon-based composite material bone screw and preparation method thereof

Also Published As

Publication number Publication date
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