JP3169419U - fan - Google Patents
fan Download PDFInfo
- Publication number
- JP3169419U JP3169419U JP2011002760U JP2011002760U JP3169419U JP 3169419 U JP3169419 U JP 3169419U JP 2011002760 U JP2011002760 U JP 2011002760U JP 2011002760 U JP2011002760 U JP 2011002760U JP 3169419 U JP3169419 U JP 3169419U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- conducting layer
- heat conducting
- layer
- fan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【課題】導熱層と放熱チップの熱伝導の方向が同じになるように形成されたファンを提供する。【解決手段】導熱層２と、放熱チップ３とを含んでなり、導熱層が、長方形を呈し、中央に熱源に接続するエリアを具えてなり、その周囲の空間に対流孔を等間隔に排列して設けてなり、それぞれの対流孔２１がいずれも楕円形で、導熱層の長手方向の辺と平行な方向に設けられ、放熱チップが、片状で排列し、導熱層の下方に貼着して設けられ、その長さが導熱層の長手方向の辺と同じで、導熱層の長手方向の辺と平行な方向に設けられる。【選択図】図３Provided is a fan formed so that a heat conduction layer and a heat dissipation chip have the same heat conduction direction. A heat conduction layer includes a heat radiation chip, and the heat conduction layer has a rectangular shape with an area connected to a heat source at the center, and convection holes are arranged at equal intervals in the surrounding space. Each of the convection holes 21 is oval and provided in a direction parallel to the longitudinal side of the heat conducting layer, and the heat dissipating chips are arranged in a single piece and are attached below the heat conducting layer. The length is the same as the side in the longitudinal direction of the heat-conducting layer, and is provided in a direction parallel to the side in the longitudinal direction of the heat-conducting layer. [Selection] Figure 3
Description
この考案は、ファンに関し、特にコンピュータなどの電気機器で発生した熱を放熱するファンに関する。 The present invention relates to a fan, and more particularly to a fan that dissipates heat generated by an electrical device such as a computer.
従来のアルミを成型した放熱片１は図１に開示するように、導熱層２と、放熱チップ３とを組み合わせて形成する。 As shown in FIG. 1, a conventional heat radiation piece 1 formed of aluminum is formed by combining a heat conductive layer 2 and a heat radiation chip 3.
導熱層２は、熱を伝えるために供し、放熱チップ３は放熱するために供する。 The heat conducting layer 2 is provided for transferring heat, and the heat dissipation chip 3 is provided for heat dissipation.
該導熱層２は長方形を呈し、中央に熱源２０に接続するエリアを具えてなり、その周囲の空間に対流孔２１が等間隔で排列して設けられる。 The heat conducting layer 2 has a rectangular shape and has an area connected to the heat source 20 at the center, and convection holes 21 are arranged at regular intervals in the surrounding space.
それぞれの対流孔はいずれも楕円形に形成され、導熱層２の長手方向に垂直な短い辺と平行に設けられる。 Each convection hole is formed in an elliptical shape and is provided in parallel with a short side perpendicular to the longitudinal direction of the heat conducting layer 2.
放熱チップ３は、片状で排列して設けられ、導熱層２の下に貼着し、長さが導熱層２の長手方向の辺と同じに形成される。 The heat dissipating chips 3 are arranged in a single piece, are attached under the heat conducting layer 2, and are formed to have the same length as the side of the heat conducting layer 2 in the longitudinal direction.
よって、放熱チップ３の設置方向と導熱層２の長手方向の辺とが平行になり、即ち、放熱チップ３の設置方向と対流孔２１の開口の方向とは一致しない。 Therefore, the installation direction of the heat dissipation chip 3 and the side in the longitudinal direction of the heat conducting layer 2 are parallel, that is, the installation direction of the heat dissipation chip 3 and the direction of the opening of the convection hole 21 do not match.
上述のファンは、様々な電子関連製品に幅広く応用された。導熱層の熱の伝導を利用し、放熱チップの放熱作用とを合わせることによりすばやく熱を放熱する。 The above-mentioned fan has been widely applied to various electronic related products. Heat is quickly dissipated by using heat conduction of the heat conducting layer and combining with the heat dissipating action of the heat dissipating chip.
上述のファンは、導熱層上に複数の対流孔が等間隔に排列して設けられ、空気の対流を介して、熱の伝導をすばやく実施し、その作用を高めることができる。 The above-described fan is provided with a plurality of convection holes arranged at equal intervals on the heat conduction layer, and can quickly conduct heat through air convection and enhance its action.
しかしながら、それぞれの対流孔の開口の方向が下方に貼着した片状の放熱チップの方向と一致していないため、導熱層と放熱チップとの接続面とを遮り、導熱層が中断された状態になる。 However, since the direction of the opening of each convection hole does not coincide with the direction of the piece-shaped heat radiation chip stuck downward, the heat conduction layer is interrupted by blocking the connection surface between the heat conduction layer and the heat radiation chip. become.
よって、導熱層が熱を伝導する過程で中央の熱源から両側と下方の放熱チップへすばやく熱を伝導することができず、放熱の効果、効率に影響を与える。 Therefore, heat cannot be quickly conducted from the central heat source to the heat dissipation chips on both sides and below in the process in which the heat conduction layer conducts heat, which affects the heat radiation effect and efficiency.
この考案は、導熱層と放熱チップの熱伝導の方向が同じになるように形成されたファンを提供することを課題とする。 It is an object of the present invention to provide a fan formed so that the heat conduction layer and the heat dissipation chip have the same direction of heat conduction.
そこで本考案者は、導熱層と、放熱チップとを含んでなり、該導熱層が、長方形を呈し、中央に熱源に接続するエリアを具えてなり、その周囲の空間に対流孔を等間隔に排列して設けてなり、それぞれの対流孔がいずれも楕円形で、導熱層の長手方向の辺と平行な方向に設けられ、
該放熱チップが、片状で排列し、導熱層の下方に貼着して設けられ、その長さが導熱層の長手方向の辺と同じで、導熱層の長手方向の辺と平行な方向に設けられるファンによって課題を解決できる点に着眼し、係る知見に基づき本考案を完成させた。
以下、この考案について具体的に説明する。
Therefore, the present inventor includes a heat conductive layer and a heat dissipation chip, the heat conductive layer has a rectangular shape, and has an area connected to a heat source in the center, and convection holes are equally spaced in the surrounding space. Arranged in a row, each convection hole is elliptical, provided in a direction parallel to the longitudinal side of the heat conducting layer,
The heat dissipating chips are arranged in a single piece and are attached to the lower portion of the heat conducting layer, and the length thereof is the same as the longitudinal side of the heat conducting layer, in a direction parallel to the longitudinal side of the heat conducting layer. We focused on the point that the problem can be solved by the fans provided, and completed the present invention based on such knowledge.
Hereinafter, this device will be specifically described.
請求項１に記載するファンは、導熱層と、放熱チップとを含んでなり、
該導熱層が、長方形を呈し、中央に熱源に接続するエリアを具えてなり、その周囲の空間に対流孔を等間隔に排列して設けてなり、それぞれの対流孔がいずれも楕円形で、導熱層の長手方向の辺と平行な方向に設けられ。
該放熱チップが、片状で排列し、導熱層の下方に貼着して設けられ、その長さが導熱層の長手方向の辺と同じで、導熱層の長手方向の辺と平行な方向に設けられる。
The fan according to claim 1 comprises a heat conducting layer and a heat dissipation chip,
The heat conducting layer has a rectangular shape, has an area connected to a heat source in the center, and is provided with convection holes arranged at equal intervals in the surrounding space, and each convection hole is elliptical, Provided in a direction parallel to the longitudinal side of the heat conducting layer.
The heat dissipating chips are arranged in a single piece and are attached to the lower portion of the heat conducting layer, and the length thereof is the same as the longitudinal side of the heat conducting layer, in a direction parallel to the longitudinal side of the heat conducting layer. Provided.
この考案のファンは、導熱層と、放熱チップとの熱伝導の方向が同じであるため有効に、すばやく熱を放熱して実用的であるという効果を有する。 The fan of the present invention has an effect that it is practical to dissipate heat quickly and effectively because the direction of heat conduction between the heat conducting layer and the heat radiation chip is the same.
この考案は、導熱層と放熱チップの熱伝導の方向が同じになるように形成されたファンであって、導熱層と、放熱チップとを含んでなり、
該導熱層が、長方形を呈し、中央に熱源に接続するエリアを具えてなり、その周囲の空間に対流孔を等間隔に排列して設けてなり、それぞれの対流孔がいずれも楕円形で、導熱層の長手方向の辺と平行な方向に設けられ、
該放熱チップが、片状で排列し、導熱層の下方に貼着して設けられ、その長さが導熱層の長手方向の辺と同じで、導熱層の長手方向の辺と平行な方向に設けられる。
This device is a fan formed so that the heat conduction direction of the heat conduction layer and the heat dissipation chip are the same, and includes the heat conduction layer and the heat dissipation chip,
The heat conducting layer has a rectangular shape, has an area connected to a heat source in the center, and is provided with convection holes arranged at equal intervals in the surrounding space, and each convection hole is elliptical, Provided in a direction parallel to the longitudinal side of the heat conducting layer;
The heat dissipating chips are arranged in a single piece and are attached to the lower portion of the heat conducting layer, and the length thereof is the same as the longitudinal side of the heat conducting layer, in a direction parallel to the longitudinal side of the heat conducting layer. Provided.
図３、図４は、この考案のファンを示した説明図である。 3 and 4 are explanatory views showing the fan of the present invention.
図３に開示するように、ファン１は、導熱層２と、放熱チップ３と、を組み合わせてなる。 As disclosed in FIG. 3, the fan 1 is a combination of a heat conducting layer 2 and a heat dissipation chip 3.
該導熱層２は、長方形を呈し、中央に熱源２０に接続するエリアを具えてなり、その周囲の空間に対流孔２１を等間隔に排列して設ける。 The heat conducting layer 2 has a rectangular shape, and has an area connected to the heat source 20 at the center. The convection holes 21 are arranged at equal intervals in the surrounding space.
それぞれの対流孔２１はいずれも、楕円形で、導熱層２の長手方向の辺と平行な方向に設けられる。 Each of the convection holes 21 is elliptical and is provided in a direction parallel to the longitudinal side of the heat conducting layer 2.
該放熱チップ３は、片状で、排列して設けられ、導熱層２の下方に貼着する。その長さは導熱層２の長手方向の辺と同じに形成され、導熱層２の長手方向の辺と平行な方向に設けられる。 The heat dissipating chip 3 is in the form of a piece and is arranged in a row, and is attached below the heat conducting layer 2. The length thereof is the same as the side in the longitudinal direction of the heat conducting layer 2 and is provided in a direction parallel to the side in the longitudinal direction of the heat conducting layer 2.
上述のユニットを組み合わせて形成し、図４に開示するように、導熱層２上に設けられた対流穴２１の開口の方向と下方に貼着した片状の放熱チップ３との設置方向が一致する。 As shown in FIG. 4, the direction of the opening of the convection hole 21 provided on the heat conducting layer 2 and the direction of installation of the piece-shaped heat radiation chip 3 attached downward are coincided with each other. To do.
よって、使用上、熱源２０の予め設けられる位置が導熱層２の中央であるため、熱が自然と中央から外側に向けて伝導した後、下方に向けて伝導される。 Therefore, since the position where the heat source 20 is provided in advance is the center of the heat conducting layer 2 in use, the heat is naturally conducted from the center to the outside and then conducted downward.
導熱層２の熱の伝導面積上に設けられた複数の対流孔２１の開口の方向が熱の伝導方向と同じであるため、伝導面が中断されることがなく、熱の伝導にも影響がない。 Since the direction of the openings of the plurality of convection holes 21 provided on the heat conduction area of the heat conducting layer 2 is the same as the heat conduction direction, the conduction surface is not interrupted and the heat conduction is affected. Absent.
また、導熱層２下方の放熱チップ３が片状で対流孔２１の開口の方向と同じに設けられるため、放熱面積が中断されることがなく、熱の伝導と放熱の作用をいずれも確実に高めることができる。 Further, since the heat radiation chip 3 below the heat conducting layer 2 is provided in the same shape as the opening direction of the convection hole 21, the heat radiation area is not interrupted, and both heat conduction and heat radiation are ensured. Can be increased.
この考案のファンは有効に熱を伝導し、優れた放熱効果を備えてなるため、実用的で多目的に実用できる価値を具えている。 The fan of this invention effectively conducts heat and has an excellent heat dissipation effect, so it has practical and versatile value.
以上は、この考案の好ましい実施例であって、この考案の実施の範囲を限定するものではない。よって、当業者のなし得る修正、もしくは変更であって、この考案の精神の下においてなされ、この考案に対して均等の効果を有するものは、いずれもこの考案の実用新案請求の範囲に属するものとする。 The above is a preferred embodiment of the present invention, and does not limit the scope of implementation of the present invention. Accordingly, any modifications or changes that can be made by those skilled in the art, which are made within the spirit of the present invention and have an equivalent effect on the present invention, all belong to the scope of the claims of the utility model of the present invention. And
１ ファン
２ 導熱層
２０ 熱源
２１ 対流孔
３ 放熱チップ
1 Fan 2 Heat Conducting Layer 20 Heat Source 21 Convection Hole 3 Heat Dissipation Chip
Claims (1)
該導熱層が、長方形を呈し、中央に熱源に接続するエリアを具えてなり、その周囲の空間に対流孔を等間隔に排列して設けてなり、それぞれの対流孔がいずれも楕円形で、導熱層の長手方向の辺と平行な方向に設けられ、
該放熱チップが、片状で排列し、導熱層の下方に貼着して設けられ、その長さが導熱層の長手方向の辺と同じで、導熱層の長手方向の辺と平行な方向に設けられることを特徴とするファン。 Comprising a heat conducting layer and a heat dissipation chip,
The heat conducting layer has a rectangular shape, has an area connected to a heat source in the center, and is provided with convection holes arranged at equal intervals in the surrounding space, and each convection hole is elliptical, Provided in a direction parallel to the longitudinal side of the heat conducting layer;
The heat dissipating chips are arranged in a single piece and are attached to the lower portion of the heat conducting layer, and the length thereof is the same as the longitudinal side of the heat conducting layer, in a direction parallel to the longitudinal side of the heat conducting layer. A fan characterized by being provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011002760U JP3169419U (en) | 2011-05-18 | 2011-05-18 | fan |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011002760U JP3169419U (en) | 2011-05-18 | 2011-05-18 | fan |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP3169419U true JP3169419U (en) | 2011-07-28 |
Family
ID=54880282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011002760U Expired - Fee Related JP3169419U (en) | 2011-05-18 | 2011-05-18 | fan |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3169419U (en) |
-
2011
- 2011-05-18 JP JP2011002760U patent/JP3169419U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI411383B (en) | ||
| US20140367077A1 (en) | Complex heat dissipation assembly | |
| JP2017005975A (en) | Inverter | |
| US20060185821A1 (en) | Thermal dissipation device | |
| TWI635386B (en) | Heat sink device | |
| US20090288806A1 (en) | Heat Radiating Unit | |
| JP3171782U (en) | Fin-type heatsink to enhance heat dissipation | |
| TW201319786A (en) | Heat dissipation device | |
| US20120024514A1 (en) | Plate cooling fin with slotted projections | |
| JP3169419U (en) | fan | |
| TW201443624A (en) | Heat-dissipating structure and electronic apparatus using the same | |
| US9554486B2 (en) | Heat dissipation system | |
| TW201433252A (en) | Cooling apparatus and heat sink thereof | |
| TW201502459A (en) | Heat sink | |
| JP3144915U (en) | Radiator with electronic circuit module | |
| TW201835520A (en) | Heat dissipation fin set | |
| TWI635385B (en) | Heat sink and method of manufacturing thereof | |
| TW201144993A (en) | Memory heat-dissipating device | |
| TW201410127A (en) | Electronic device | |
| TWM484295U (en) | Mesh type heat sink mechanism | |
| JP3168331U (en) | Radiation fin structure and its radiation module | |
| TWI469726B (en) | Electronic device | |
| US20130306277A1 (en) | Thermal module structure | |
| TWI556088B (en) | Radiator structure | |
| TW201323817A (en) | Heat sink |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140706 Year of fee payment: 3 |
|
| LAPS | Cancellation because of no payment of annual fees |