JP3149510B2 - Cream solder - Google Patents
Cream solderInfo
- Publication number
- JP3149510B2 JP3149510B2 JP06452192A JP6452192A JP3149510B2 JP 3149510 B2 JP3149510 B2 JP 3149510B2 JP 06452192 A JP06452192 A JP 06452192A JP 6452192 A JP6452192 A JP 6452192A JP 3149510 B2 JP3149510 B2 JP 3149510B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- particles
- circuit board
- molten solder
- cream solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明はクリーム半田に関し、詳
しくは電子部品を回路用基板に面実装する際特に好適に
使用されるクリーム半田に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cream solder, and more particularly to a cream solder which is particularly preferably used when electronic components are surface-mounted on a circuit board.
【０００２】[0002]
【従来の技術】近年、電子機器は電子部品を面実装化す
ることにより軽量でかつ小型化されている。又、電子部
品の接続は多数箇所で行われ、かつ電子部品が微小であ
ることからスクリーン印刷やディスペンサー塗布による
半田の供給が便利であり、そのために半田を粉末にして
ペースト状フラックスと混合し、クリーム状半田とした
ものが用いられている。2. Description of the Related Art In recent years, electronic devices have been reduced in weight and size by mounting electronic components on a surface. In addition, the connection of electronic components is performed at many places, and since the electronic components are minute, it is convenient to supply solder by screen printing or dispenser application.For that purpose, the solder is powdered and mixed with paste-like flux, A creamy solder is used.
【０００３】例えば、特公昭４７−２８３０７号公報に
は粉末半田と前記粉末半田より高融点の金属粉末を混合
した半田が開示されており、特開昭６２−１７９８８９
号公報には半田の融点よりも高い融点をもち、しかも表
面が溶融半田に濡れることができる直径０．０７〜０．
３mmの金属球をクリーム半田中に０．５〜５重量％混入
してなるクリーム半田が開示されている。For example, Japanese Patent Publication No. 47-28307 discloses a solder in which powdered solder and a metal powder having a higher melting point than the powdered solder are mixed.
In the publication, the melting point is higher than the melting point of the solder, and the surface can be wetted by the molten solder.
There is disclosed a cream solder in which 0.5 mm to 5% by weight of a 3 mm metal ball is mixed in the cream solder.
【０００４】次に上記のクリーム半田について、その使
用方法を説明する。図２は従来の電子部品と回路用基板
を半田付けした状態を示す要部断面図である。Next, a method of using the above-mentioned cream solder will be described. FIG. 2 is a sectional view of a main part showing a state where a conventional electronic component and a circuit board are soldered.
【０００５】１は回路用基板、２は電極部、３はクリー
ム半田、４は誘電体フィルター等の面実装用電子部品、
５は面実装用電子部品４の端子部、６は溶融半田保持用
に用いられる亜鉛，鉄，銅等からなる金属球である。[0005] 1 is a circuit board, 2 is an electrode section, 3 is cream solder, 4 is a surface mount electronic component such as a dielectric filter,
Reference numeral 5 denotes a terminal of the electronic component 4 for surface mounting, and reference numeral 6 denotes a metal sphere made of zinc, iron, copper, or the like used for holding molten solder.
【０００６】回路用基板１の電極部２にクリーム半田３
を塗布し、その上に電子部品４の端子部５が位置するよ
うに電子部品４を実装し、リフロー炉によりクリーム半
田を溶融させ電子部品と回路用基板の電極部を電気的に
結合させていた。The solder paste 3 is applied to the electrode 2 of the circuit board 1.
Is applied, and the electronic component 4 is mounted thereon such that the terminal portion 5 of the electronic component 4 is located, and the cream solder is melted by a reflow oven to electrically couple the electronic component and the electrode portion of the circuit board. Was.
【０００７】金属球を半田の中に添加することにより回
路用基板の電極部と電子部品の端子部間のクリアランス
を適性に保つようにしたものである。[0007] By adding a metal ball into the solder, the clearance between the electrode portion of the circuit board and the terminal portion of the electronic component is kept appropriate.
【０００８】[0008]
【発明が解決しようとする課題】しかしながら上記従来
の構成では、半田の密度と金属球の密度が（表１）に示
すようにほぼ等しく、例えば電子部品のほとんどの端子
部が端子浮き１００μｍとし、他が３００μｍとすると
端子浮き１００μｍの端子部は電気的接続が可能である
が、３００μｍの端子部は電気的接続が困難という問題
点を有していた。However, in the above-mentioned conventional structure, the density of the solder and the density of the metal spheres are substantially equal as shown in Table 1 and, for example, most of the terminals of the electronic parts are set to 100 μm. If the other is 300 μm, the terminal portion of 100 μm can be electrically connected, but the 300 μm terminal portion has a problem that the electrical connection is difficult.
【０００９】[0009]
【表１】 [Table 1]
【００１０】更に、実装時の課題として、電子部品の端
子と回路用基板上のクリーム半田部との接触不良が生じ
易く、電気的接続に関する信頼性に欠けるという問題を
有していた。[0010] Further, as a problem at the time of mounting, there is a problem that contact failure between the terminal of the electronic component and the cream solder portion on the circuit board is apt to occur, and the reliability of the electrical connection is lacking.
【００１１】現状の面実装基準では、電子部品の端子浮
きは回路用基板の電極部から１５０μｍ以内となってい
る。しかし、誘電体フィルターのようにコムリードの加
工により面実装に対応している電子部品は、端子浮きが
５０〜２５０μｍある。従ってこのような部品は、端子
浮き用ゲージを通過させて選別したり、又は回路用基板
上に手付けにて部品を実装し半田付けしている。クリー
ム半田を厚く塗布することもあるが、この場合溶融半田
が隣接する回路とブリッジを形成しショート等の不良現
象を起こすという問題点を有していた。According to the current surface mounting standards, the terminal lift of the electronic component is within 150 μm from the electrode portion of the circuit board. However, an electronic component such as a dielectric filter which is compatible with surface mounting by processing a comb lead has a terminal float of 50 to 250 μm. Therefore, such components are selected by passing them through a terminal float gauge, or the components are manually mounted on a circuit board and soldered. Thick cream solder may be applied, but in this case, there is a problem that the molten solder forms a bridge with an adjacent circuit and causes a defective phenomenon such as a short circuit.
【００１２】本発明は上記従来の問題点を解決するもの
で、溶融半田を回路基板の電極部に塗布状態のまま保持
させることのできる生産性、作業性に極めて優れ、か
つ、電子部品の端子部の不揃いな端子浮きに対しても確
実に電気的接続を行うことができる信頼性、耐久性に優
れたクリーム半田を提供することを目的とする。The present invention solves the above-mentioned conventional problems, and is extremely excellent in productivity and workability in which molten solder can be held in an applied state on an electrode portion of a circuit board. It is an object of the present invention to provide a cream solder excellent in reliability and durability capable of reliably making an electrical connection even to a floating terminal having irregular portions.
【００１３】[0013]
【課題を解決するための手段】この目的を達成するため
に本発明のクリーム半田は、半田粒子と、表面が金属で
被覆されたセラミック粒・ガラス粒・高分子樹脂粒の内
いずれか１以上の粒子からなる溶融半田保持用粒子と、
ビヒクルと、からなる構成を有している。To achieve this object, the cream solder of the present invention comprises a solder particle and at least one of a ceramic particle, a glass particle and a polymer resin particle whose surface is coated with metal. Particles for holding molten solder comprising particles of
And a vehicle.
【００１４】ここで、溶融半田保持用粒子のセラミック
粒としては、アルミナ，四窒化珪素，シリカ，部分安定
化ジルコニア，フォルステライト等溶融半田よりも比重
が軽いものであればよく、又ガラス粒としては、ホウ珪
酸ガラス，ソーダガラス，鉛ガラス等溶融半田よりも比
重が軽いものであればよい。高分子樹脂粒としては変性
ポリイミド樹脂，エポキシ樹脂，フッソ樹脂やこれらの
混合物等が特に好適に用いられるが用途により他の合成
樹脂粒を用いてもよい。粒子の粒径としては１０〜３０
０μｍ好ましくは１００〜２００μｍで、形状としては
球状のものが好ましい。コート用の金属層としてはＣ
ｕ，Ｎｉ，Ａｇ，Ａｕ，Ｎｉ−半田，Ｃｕ−半田等半田
濡れ性の高い、又電気伝導性の金属であればよく、金属
コート法としてはメッキ法，蒸着法，スパッタ法，厚膜
法等が用いられる。Here, the ceramic particles of the particles for holding the molten solder may be alumina, silicon tetranitride, silica, partially stabilized zirconia, forsterite, etc. as long as the specific gravity is lower than that of the molten solder. May be borosilicate glass, soda glass, lead glass, or any other material having a lower specific gravity than molten solder. As the polymer resin particles, a modified polyimide resin, an epoxy resin, a fluorine resin, a mixture thereof and the like are particularly preferably used, but other synthetic resin particles may be used depending on the application. The particle size of the particles is 10 to 30
0 μm, preferably 100 to 200 μm, and the shape is preferably spherical. The metal layer for coating is C
u, Ni, Ag, Au, Ni-solder, Cu-solder, etc., may be any metal having high solder wettability and electrical conductivity. Metal coating methods include plating, vapor deposition, sputtering, and thick film methods. Are used.
【００１５】[0015]
【作用】この構成によって、溶融半田保持用粒子により
溶融した半田が流入することを防止するため、溶融半田
を回路基板の電極部に塗布状態のまま保持させることが
できる。又、半田より密度の小さいセラミック、ガラ
ス、高分子樹脂を溶融半田保持用粒子として用いている
ので、前記保持用粒子が半田溶融時に浮力により浮き上
がり、電子部品の端子部の不揃いな端子浮きに対し、確
実に電気的接続を確保することが出来る。With this configuration, the molten solder can be held in the coated state on the electrode portion of the circuit board in order to prevent the solder melted by the molten solder holding particles from flowing in. In addition, since ceramic, glass, and a polymer resin having a smaller density than solder are used as the particles for holding the molten solder, the particles for holding are lifted by buoyancy when the solder is melted. In addition, it is possible to reliably secure the electrical connection.
【００１６】[0016]
【実施例】以下本発明を実施例に基づいて、詳細に説明
する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail based on embodiments.
【００１７】電子機器本体の回路用基板として銅張りガ
ラスエポキシ基板を、電子部品として大きさが３０mm×
１４mm×４mmで端子数が１０本の誘電体フィルターを準
備した。溶融半田保持用粒子のセラミックとしては、直
径１５０μｍで球状の９９％アルミナ、径が略２００μ
ｍの球状４窒化珪素、径が略１５０μｍの球状シリカを
用いる。溶融半田保持用粒子のガラスとしては、径が２
００μｍの球状のほう珪酸ガラスを準備した。溶融半田
保持用粒子の高分子樹脂粒としては、径が略７０μｍの
エポキシ変性ポリイミド樹脂を用いた。該溶融半田用粒
子の密度を（表２）に示す。A copper-clad glass epoxy board is used as a circuit board of the electronic equipment body, and a size of 30 mm ×
A dielectric filter having 14 mm × 4 mm and 10 terminals was prepared. As a ceramic of the particles for holding the molten solder, spherical 99% alumina having a diameter of 150 μm, and a diameter of about 200 μm
m spherical silicon nitride and spherical silica having a diameter of about 150 μm are used. The glass of the particles for holding the molten solder has a diameter of 2
A 00 μm spherical borosilicate glass was prepared. Epoxy-modified polyimide resin having a diameter of about 70 μm was used as the polymer resin particles of the molten solder holding particles. Table 2 shows the density of the molten solder particles.
【００１８】[0018]
【表２】 [Table 2]
【００１９】溶融半田保持用粒子の金属コート法として
は、半田濡れ性、電気伝導性を考慮し銅−半田メッキを
採用した。半田粒子としてはＳｍ−Ｐｂ共晶半田粒子を
準備した。As the metal coating method for the molten solder holding particles, copper-solder plating was adopted in consideration of solder wettability and electric conductivity. Sm-Pb eutectic solder particles were prepared as the solder particles.
【００２０】クリーム半田の調整は、（表３）の配合表
に従って行った。又、フラックス分の調整は（表４）の
配合表に従って行った。尚、各配合表の単位は全て重量
％で表してある。The preparation of the cream solder was carried out in accordance with the recipe shown in Table 3. Further, the adjustment of the flux was performed according to the composition table in (Table 4). In addition, all the units of each composition table are represented by weight%.
【００２１】[0021]
【表３】 [Table 3]
【００２２】[0022]
【表４】 [Table 4]
【００２３】次に、これらの試料を用い誘電体フィルタ
ーを銅張りガラスエポキシ基板に半田付を行った。Next, using these samples, a dielectric filter was soldered to a copper-clad glass epoxy substrate.
【００２４】図１は本実施例における誘電体フィルター
の実装状態を示す要部断面図である。FIG. 1 is a sectional view of a main part showing a mounted state of a dielectric filter according to the present embodiment.
【００２５】回路用基板１の電極部２に溶融半田保持用
粒子６が分散されたクリーム半田３を塗布し、その上に
電子部品４の端子部５が載置されるように誘電体フィル
ター４を実装し、リフロー炉によりクリーム半田を溶融
させ電子部品と回路用基板の電極部を電気的に結合させ
て行った。この際、端子浮き１５０μｍ以内の範囲にあ
る誘電体フィルタ（端子数１０本）の端子部を１箇所故
意に端子浮き２５０μｍとしたものを用いた。試験数は
ｎ＝１０で行った。A cream solder 3 in which particles 6 for holding molten solder are dispersed is applied to an electrode portion 2 of a circuit board 1 and a dielectric filter 4 is mounted thereon so that a terminal portion 5 of an electronic component 4 is placed thereon. Was mounted, and the cream solder was melted by a reflow furnace to electrically connect the electronic components and the electrode portions of the circuit board. In this case, the terminal portion of the dielectric filter (the number of terminals was 10) within the range of the terminal lifting of 150 μm was intentionally made to have the terminal lifting of 250 μm. The number of tests was n = 10.
【００２６】評価方法としては、誘電体フィルターと回
路用基板の電極部の電気的結合状態にて判定した。試料
１〜試料６までは本発明の実施例で、試料７、試料８は
従来例である。その結果を（表５）に示した。The evaluation was made based on the electrical connection between the dielectric filter and the electrodes of the circuit board. Samples 1 to 6 are examples of the present invention, and samples 7 and 8 are conventional examples. The results are shown in (Table 5).
【００２７】[0027]
【表５】 [Table 5]
【００２８】この（表５）からも明らかなように、本発
明の範囲内にある試料は、電子部品と回路用基板の電極
部の電気的結合状態が良好であることがわかる。これは
溶融半田中に半田濡れ性の良い固形物があるため溶融半
田による配線間ブリッジが発生し難く、又、半田ボール
も発生し難いためと思われる。As is evident from Table 5, the samples within the scope of the present invention have a good electrical connection between the electronic components and the electrodes of the circuit board. This is presumably because solids having good solder wettability exist in the molten solder, so that bridging between wirings due to the molten solder is hardly generated, and solder balls are hardly generated.
【００２９】尚、本実施例では、溶融半田保持用粒子径
として１５０μｍのものを用いたが、用途に応じて粒子
径を自由に選択しても同等の効果がえられる。例えば、
粒子径の異なるものをブレンドしてもよい。In this embodiment, the particle size for holding the molten solder is 150 μm, but the same effect can be obtained even if the particle size is freely selected according to the application. For example,
Those having different particle sizes may be blended.
【００３０】[0030]
【発明の効果】以上のように本発明は、溶融半田を回路
基板の電極部に塗布状態のまま保持させることができる
ので生産性、作業性に極めて優れ、また、電子部品の端
子部の不揃いな端子浮きに対しても確実に電気的接続を
行うことができる信頼性、耐久性に優れたクリーム半田
を実現できるものである。As described above, according to the present invention, since the molten solder can be kept applied to the electrode portions of the circuit board in an applied state, the productivity and workability are extremely excellent, and the terminal portions of the electronic parts are irregular. Thus, it is possible to realize a cream solder excellent in reliability and durability, which can surely make an electrical connection even to a floating terminal.
【図面の簡単な説明】[Brief description of the drawings]
【図１】本実施例の電子部品と回路用基板の半田付けを
した状態を示す要部断面図FIG. 1 is a cross-sectional view of a main part showing a state in which an electronic component and a circuit board of this embodiment are soldered.
【図２】従来の電子部品と回路用基板の半田付けをした
状態を示す要部断面図FIG. 2 is a sectional view of a main part showing a state in which a conventional electronic component and a circuit board are soldered.
１ 回路用基板 ２ 電極部 ３ クリーム半田 ４ 電子部品 ５ 端子部 ６ 溶融半田保持用粒子 DESCRIPTION OF SYMBOLS 1 Circuit board 2 Electrode part 3 Cream solder 4 Electronic component 5 Terminal part 6 Molten solder holding particles
───────────────────────────────────────────────────── フロントページの続き (72)発明者 多木 宏光 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 平３−12992（ＪＰ，Ａ) 特開 昭62−259494（ＪＰ，Ａ) 実開 平２−65494（ＪＰ，Ｕ) 実開 平１−52275（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) B23K 35/22 - 35/26 ────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiromitsu Taki 1006 Kazuma Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP-A-3-12992 (JP, A) JP-A-62 -259494 (JP, A) Japanese Utility Model 2-65494 (JP, U) Japanese Utility Model 1-52275 (JP, U) (58) Fields surveyed (Int. Cl. 7 , DB name) B23K 35/22- 35/26
Claims (1)
ミック粒・ガラス粒・高分子樹脂粒の内いずれか１以上
の粒子からなる溶融半田保持用粒子と、ビヒクルと、か
らなることを特徴とするクリーム半田。1. A vehicle comprising: solder particles; particles for holding molten solder comprising at least one of ceramic particles, glass particles, and polymer resin particles whose surfaces are coated with metal; and a vehicle. Characteristic cream solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP06452192A JP3149510B2 (en) | 1992-03-23 | 1992-03-23 | Cream solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP06452192A JP3149510B2 (en) | 1992-03-23 | 1992-03-23 | Cream solder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05261586A JPH05261586A (en) | 1993-10-12 |
| JP3149510B2 true JP3149510B2 (en) | 2001-03-26 |
Family
ID=13260609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP06452192A Expired - Fee Related JP3149510B2 (en) | 1992-03-23 | 1992-03-23 | Cream solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3149510B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003106374A1 (en) * | 2002-06-14 | 2003-12-24 | Technische Universität Dresden | Method for producing gas-tight and high-temperature resistant unions of shaped parts, which are made of a non-oxidic ceramic material, by using a laser |
| JP2004249359A (en) * | 2003-02-21 | 2004-09-09 | Sekisui Chem Co Ltd | Solder paste and electrically-conductive connection structure |
| WO2005072906A1 (en) * | 2004-01-29 | 2005-08-11 | Matsushita Electric Industrial Co., Ltd. | Soldering flux and soldering method |
| JP2006320943A (en) * | 2005-05-19 | 2006-11-30 | Sony Corp | Solder paste and solder printing |
| JP6540869B1 (en) * | 2018-03-30 | 2019-07-10 | 千住金属工業株式会社 | Solder paste |
-
1992
- 1992-03-23 JP JP06452192A patent/JP3149510B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05261586A (en) | 1993-10-12 |
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| LAPS | Cancellation because of no payment of annual fees |