JP3102473B2 - Resin sealing device for semiconductor device - Google Patents
Resin sealing device for semiconductor deviceInfo
- Publication number
- JP3102473B2 JP3102473B2 JP09240802A JP24080297A JP3102473B2 JP 3102473 B2 JP3102473 B2 JP 3102473B2 JP 09240802 A JP09240802 A JP 09240802A JP 24080297 A JP24080297 A JP 24080297A JP 3102473 B2 JP3102473 B2 JP 3102473B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin sealing
- product
- unfilled
- sealing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は半導体装置の樹脂封
止装置に関する。The present invention relates to a resin sealing device for a semiconductor device.
【０００２】[0002]
【従来の技術】半導体装置の樹脂封止装置の未充填検出
方法に関する従来技術では、特開平７−２３１００５号
公報、特開平２−１０５５５０号公報、および特開平７
−１４８６７号公報などに示される提案がある。2. Description of the Related Art Japanese Unexamined Patent Publication Nos. Hei 7-231005, Hei 2-105550, and Hei 7 (Japanese Patent Laid-Open Publication No.
No. 14867 discloses a proposal.
【０００３】まず、特開平７−２３１００５号公報に記
載の未充填検出方法について説明する。この公報に記載
の樹脂封止装置による未充填検出の様子を図５及び図６
に示す。この公報に記載の未充填検出方法は図５及び図
６に示すように、長手方向に移送される帯状のリードフ
レーム上の半導体チップを樹脂封止し、樹脂封止後の製
品１４の樹脂バリ部１７を透過センサ１２で検出する方
法である。未充填の場合には、樹脂バリが発生しないの
で透過センサからの光は遮光されることなく透過するこ
とになる。したがって、透過した場合に、未充填として
検出することになる。[0003] First, an unfilling detection method described in JP-A-7-231005 will be described. FIGS. 5 and 6 show how unfilling is detected by the resin sealing device described in this publication.
Shown in As shown in FIGS. 5 and 6, the unfilling detection method described in this publication seals a semiconductor chip on a strip-shaped lead frame conveyed in the longitudinal direction with a resin, and forms a resin burr of the product 14 after the resin sealing. This is a method of detecting the unit 17 by the transmission sensor 12. When not filled, resin burrs do not occur, so that light from the transmission sensor is transmitted without being blocked. Therefore, when light is transmitted, it is detected as unfilled.
【０００４】次に、特開平２−１０５５５０号公報に記
載の未充填検出方法について説明する。図７にこの公報
における未充填検出方法を実施する装置を示す。この図
に示す装置は、半導体装置の樹脂封止装置２１だけでは
なく、工程順にリードフレーム供給リール１８、半導体
素子をリードフレームに搭載するダイボンディング装置
１９、リードフレームと半導体素子を電気的に接続する
ワイヤーボンディング装置２０、半導体素子を樹脂封止
する樹脂封止装置２１、不良検出除去装置２２、および
リードフレーム巻取リール２５を備えている。Next, a description will be given of an unfilling detection method described in Japanese Patent Application Laid-Open No. 2-105550. FIG. 7 shows an apparatus for implementing the unfilling detection method in this publication. The device shown in this figure is not only a resin sealing device 21 for a semiconductor device, but also a lead frame supply reel 18, a die bonding device 19 for mounting a semiconductor element on a lead frame in a process order, and an electrical connection between the lead frame and the semiconductor element. 1. A wire bonding device 20, a resin sealing device 21 for sealing a semiconductor element with a resin, a defect detection and removal device 22, and a lead frame take-up reel 25 are provided.
【０００５】樹脂封止後の製品１４は、不良検出除去装
置２２にて、未充填検出を行い、未充填製品の除去を行
う。図８には、未充填検出の機構を示す。この図におい
て、スプリング２８で付勢された接触子２９と、静電容
量センサ２６とを有するホルダ２７は、リードフレーム
の順送り動作と連動されたタイミングで上下動する。そ
のホルダ２７が下降することによって接触子２９が樹脂
封止後の製品１４に接触し、その製品１４の未充填部分
と充填部分のギャップをとらえ、その変位量を静電容量
センサ２６が検出する。これによって、樹脂封止後の製
品１４での未充填発生有無を検出する。[0005] The unfilled product is detected by the defect detection and removal device 22 to remove the unfilled product. FIG. 8 shows an unfilling detection mechanism. In this drawing, a holder 27 having a contact 29 urged by a spring 28 and a capacitance sensor 26 moves up and down at a timing interlocked with the forward feed operation of the lead frame. When the holder 27 is lowered, the contact 29 comes into contact with the resin-sealed product 14, the gap between the unfilled portion and the filled portion of the product 14 is captured, and the displacement amount is detected by the capacitance sensor 26. . Thus, the presence or absence of unfilling in the product 14 after resin sealing is detected.
【０００６】最後に、特開平７−１４８６７号公報に記
載の未充填検出方法について説明する。図９にこの公報
に記載の樹脂封止装置による未充填検出の様子を示す。
この図において、認識装置３０は、移送されるリードフ
レームの上方に設置され、樹脂封止後の製品１４の未充
填の有無を検出する。未充填の製品１４の検出後、シリ
ンダ３１、上型３２、および下型３３によって構成され
る除去金型によって未充填の製品１４がリードフレーム
から切り離される。除去された未充填の製品１４は、収
納ボックス３５に回収される。回収時、切り離された未
充填の製品１４が適切に落下したかどうかがセンサ３４
で確認される。しかる後、良品のみの樹脂封止後製品１
４を有するリードフレームが収納マガジン２に収納され
る。図１０は未充填製品が除去されたリードフレームの
状況を示している。Finally, an unfilling detection method described in Japanese Patent Application Laid-Open No. 7-14867 will be described. FIG. 9 shows a state of non-filling detection by the resin sealing device described in this publication.
In this figure, a recognition device 30 is installed above a lead frame to be transferred, and detects the presence or absence of unfilled product 14 after resin sealing. After the detection of the unfilled product 14, the unfilled product 14 is separated from the lead frame by the removal mold including the cylinder 31, the upper mold 32, and the lower mold 33. The removed unfilled product 14 is collected in the storage box 35. At the time of collection, a sensor 34 determines whether the unfilled product 14 that has been separated has fallen properly.
Confirmed by. After that, only good products after resin sealing 1
4 is stored in the storage magazine 2. FIG. 10 shows the situation of the lead frame from which unfilled products have been removed.
【０００７】[0007]
【発明が解決しようとする課題】上述の従来技術におい
ては、未充填製品の検出及び除去を行うが、連続生産を
行うため未充填発生の原因を取り除くことは出来ない。In the above-mentioned prior art, unfilled products are detected and removed. However, since continuous production is performed, the cause of the occurrence of unfilled products cannot be removed.
【０００８】未充填発生の原因としては、樹脂の流動不
良により、所定量樹脂充填される前に樹脂の硬化が始ま
ることも挙げられる。これは、射出駆動源の動作バラツ
キによって、設定射出条件通りに射出が行われず、流動
不良を引き起こすケースである。解決策としては、射出
条件としての射出スピードや射出圧力などを常時監視し
て、適正値に補正できるように制御する方法がある。[0008] The cause of the occurrence of unfilling may be that the resin starts to be cured before a predetermined amount of resin is filled due to poor flow of the resin. This is a case where the injection is not performed according to the set injection condition due to the variation in the operation of the injection drive source, causing a flow failure. As a solution, there is a method in which an injection speed, an injection pressure, and the like as injection conditions are constantly monitored and controlled so as to correct the injection value to an appropriate value.
【０００９】しかしながら、近年、樹脂封止後の製品に
対する信頼性向上の要求は非常に多くリードフレームと
密着性の高い樹脂を使用する傾向が高くなってきてい
る。However, in recent years, there has been a great demand for improving the reliability of products after resin sealing, and there has been an increasing tendency to use resins having high adhesion to lead frames.
【００１０】そのため、樹脂封止後に離型不良が発生す
る新たな問題が生じるようになった。離型不良によっ
て、金型の樹脂封止部への入り口であるゲート部に樹脂
が残存する現象が頻発し、ゲート部が残存樹脂によって
塞がれるため、以降の樹脂封止の際には、樹脂封止部に
樹脂が充填されない場合や、樹脂充填されにくい場合が
ある。For this reason, a new problem that a mold release failure occurs after resin sealing has arisen. Due to the mold release failure, the phenomenon that the resin remains in the gate part which is the entrance to the resin sealing part of the mold frequently occurs, and the gate part is blocked by the residual resin. There is a case where the resin is not filled in the resin sealing portion or a case where the resin is difficult to be filled.
【００１１】このように、ゲート部の残存樹脂は、未充
填不良を引き起こすが、従来技術では、未充填不良品を
連続生産する危険性がある。As described above, the residual resin in the gate portion causes an unfilled defect, but in the prior art, there is a risk of continuously producing an unfilled defective product.
【００１２】また、１枚のリードフレームで、複数列に
半導体装置を配置するようなリードフレーム（以下、
「マトリックスリードフレーム」と称す。）を対象製品
とする場合に、従来技術のように未充填製品をリードフ
レームから除去する機構を取り付けると、装置の複雑化
を招いてしまう。複数列の内で、どの列で未充填が発生
しても除去可能にするには、マトリックスリードフレー
ムの搬送をＸＹ方向（横送り・奥行き送り）どちらにも
可能にしなければならないからである。A lead frame in which semiconductor devices are arranged in a plurality of rows with one lead frame (hereinafter, referred to as a lead frame).
It is called "matrix lead frame". In the case of the target product, if a mechanism for removing the unfilled product from the lead frame is attached as in the related art, the device becomes complicated. This is because the matrix lead frame must be conveyed in both the XY directions (horizontal feed / depth feed) in order to make it possible to remove the unfilled row in any of a plurality of rows.
【００１３】装置複雑化の弊害は、故障時に復旧するま
での時間（ＭＴＴＲ）の延長を招き、生産能力を低下さ
せてしまう。[0014] The adverse effect of the complicated apparatus causes an increase in the time until the system is restored in the event of a failure (MTTR), thereby lowering the production capacity.
【００１４】本発明の目的は、上述の従来技術の課題に
鑑み、未充填不良の連続発生を防止することと、マトリ
ックスフレームの場合に次工程に未充填不良の製品を流
さないことを実現できる、半導体装置の樹脂封止装置を
提供することにある。SUMMARY OF THE INVENTION In view of the above-mentioned problems of the prior art, it is an object of the present invention to prevent continuous occurrence of unfilled defectives and to prevent unfilled defective products from flowing to the next process in the case of a matrix frame. Another object of the present invention is to provide a resin sealing device for a semiconductor device.
【００１５】[0015]
【課題を解決するための手段】上記目的を達成するため
の本発明は、リードフレーム上の半導体装置を樹脂封止
する樹脂封止手段と、樹脂封止後製品の未充填不良を検
出する未充填検出機構とを含む半導体装置の樹脂封止装
置において、前記未充填検出機構は、樹脂封止後製品に
接触させる検出棒と、該検出棒の上端部を検出する透過
センサとからなり、前記樹脂封止装置は、前記検出棒の
下端部を樹脂封止後製品に接触させて樹脂の無い状態ま
たは不足した状態を前記透過センサで検知し、未充填製
品と判断した場合、樹脂封止装置の動作を中断し金型ゲ
ート口に残存樹脂があるか否かの確認指示を行なうこと
を特徴とする。SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a resin sealing means for sealing a semiconductor device on a lead frame with a resin, and a method for detecting a defective filling of a product after resin sealing. In a resin sealing device for a semiconductor device including a filling detection mechanism, the unfilled detection mechanism includes a detection rod that comes into contact with a product after resin sealing, and a transmission sensor that detects an upper end of the detection rod, The resin sealing device is a resin sealing device in which the lower end of the detection rod is brought into contact with the product after resin sealing to detect a state where there is no resin or a state where resin is insufficient by the transmission sensor, and when it is determined that the product is unfilled, Is interrupted, and an instruction is issued to confirm whether or not there is residual resin in the mold gate opening.
【００１６】また、本発明は、複数列に半導体装置が配
置されたリードフレームを対象とする、半導体装置の樹
脂封止装置において、樹脂封止後製品に接触させる検出
棒と、該検出棒の上端部を検出する透過センサとからな
る未充填検出機構を有し、前記未充填検出機構は、前記
検出棒の下端部を樹脂封止後製品に接触させて樹脂の無
い状態または不足した状態を前記透過センサで検知し、
未充填製品と判断した場合、良品を有するリードフレー
ムを良品収納マガジンへ収納し、不良品を有するリード
フレームを不良品マガジンへ収納し、樹脂封止装置の動
作を中断し金型ゲート口に残存樹脂があるか否かの確認
指示を行なうことを特徴とする。Further, the present invention is directed to a resin sealing device for a semiconductor device for a lead frame in which semiconductor devices are arranged in a plurality of rows. It has an unfilled detection mechanism consisting of a transmission sensor that detects the upper end, and the unfilled detection mechanism contacts the product after sealing the lower end of the detection rod with the resin to detect the absence or lack of resin. Detected by the transmission sensor,
If it is judged that the product is not filled, the lead frame with a good product is stored in a good product storage magazine, the lead frame with a defective product is stored in a bad product magazine, the operation of the resin sealing device is suspended, and the product remains at the gate of the mold. It is characterized in that a confirmation instruction is made as to whether or not resin is present.
【００１７】上記のような樹脂封止装置は、所定の検出
回数に達した時に、樹脂封止装置の動作を中断し金型ゲ
ート口に残存樹脂があるか否かの確認指示を行なう動作
を開始するものであってもよい。The above-described resin sealing device performs an operation of interrupting the operation of the resin sealing device and instructing whether or not there is residual resin in the mold gate opening when the predetermined number of detections is reached. It may start.
【００１８】また、樹脂封止された半導体装置を連続的
に送り、樹脂封止後製品と検出棒の接触に伴って検出棒
が透過センサの光を透過したり遮断することで良否判断
を行なうことが具体的に考えられる。Further, the resin-sealed semiconductor device is continuously fed, and the quality of the semiconductor device is determined by transmitting or blocking the light of the transmission sensor with the contact between the product and the detection rod after the resin sealing. It is specifically conceivable.
【００１９】[0019]
【００２０】[0020]
【００２１】（作用）上記のとおりの発明では、未充填
製品を検出した場合には、システムをアラーム停止する
ことで、作業者が未充填不良の原因となるゲート部分の
残存樹脂を発見し、取り除くことができる。したがっ
て、連続して未充填不良の製品を生産することはない。(Operation) In the invention as described above, when an unfilled product is detected, the alarm is stopped in the system, so that the operator finds the residual resin in the gate portion which causes the unfilling failure, Can be removed. Therefore, there is no continuous production of unfilled defective products.
【００２２】また、樹脂封止後、未充填不良製品を有す
るリードフレームを正常良品のみを有するリードフレー
ムとは分別して収納することにより、複数列に半導体装
置を配置するようなリードフレーム（マトリックスリー
ドフレーム）の場合には、装置を複雑化することなく次
工程に未充填不良製品を流すことを防ぐことができる。
すなわち、マトリックスリードフレームの場合、どの列
に生じている未充填製品でも除去できるように従来技術
ではリードフレームの搬送をＸＹ方向に可能にしていた
が、本発明では不良製品を有するリードフレームを正常
良品のみのリードフレームと分別するため、装置を複雑
化させないで済む。その結果、故障時に復旧するまでの
時間（ＭＴＴＲ）の延長を招くこともない。Further, after the resin sealing, the lead frame having the unfilled defective product is separated from the lead frame having only the normal non-defective product and stored, so that the semiconductor device is arranged in a plurality of rows (matrix lead). In the case of (frame), it is possible to prevent unfilled defective products from flowing in the next step without complicating the apparatus.
That is, in the case of the matrix lead frame, the lead frame can be transported in the X and Y directions in the prior art so that unfilled products generated in any row can be removed. Since it is separated from the lead frame including only good products, the apparatus does not need to be complicated. As a result, the time (MTTR) until recovery from the failure is not extended.
【００２３】[0023]
【発明の実施の形態】次に、本発明の実施の形態につい
て図面を参照して説明する。Next, embodiments of the present invention will be described with reference to the drawings.
【００２４】図１は、本発明の一実施形態である、半導
体装置の樹脂封止装置を示す平面図である。FIG. 1 is a plan view showing a resin sealing device for a semiconductor device according to an embodiment of the present invention.
【００２５】本形態の樹脂封止装置は、図１に示すよう
に、供給トレー３から切り出されたリードフレームが配
列されるリードフレーム配列部４と、樹脂を供給する樹
脂供給部５と、樹脂が配列される樹脂ローダー６と、樹
脂封止を行う樹脂封止型７が設置されたプレス部８と、
樹脂封止後の製品の不要樹脂（例えばランナーによる樹
脂）を除去する分離部９と、不要樹脂を取り除いた製品
に対して未充填検出を行う未充填検出機構１と、良品製
品を収納する良品収納マガジン２ａと、未充填不良の製
品を収納する不良品収納マガジン２ｂと、樹脂封止型７
を清掃するクリーナー１０と、樹脂カスなどを収集する
集塵機１１とから構成される。As shown in FIG. 1, the resin sealing device of this embodiment comprises a lead frame arrangement section 4 in which lead frames cut out from a supply tray 3 are arranged, a resin supply section 5 for supplying resin, A resin loader 6 in which are arranged, a press unit 8 in which a resin sealing mold 7 for performing resin sealing is installed,
Separation unit 9 for removing unnecessary resin (for example, resin by a runner) of a product after resin sealing, unfilling detection mechanism 1 for detecting unfilling of the product from which the unnecessary resin has been removed, and non-defective product for storing a good product A storage magazine 2a, a defective product storage magazine 2b for storing unfilled defective products, and a resin sealing mold 7
And a dust collector 11 that collects resin waste and the like.
【００２６】図２及び図３に未充填検出機構１の構造を
示す。これらの図に示すように未充填検出機構１は、透
過センサ１２、検出棒１３、検出棒支持部１５、および
スプリング１６から構成される。すなわち、検出棒１３
が検出棒支持部１５の貫通孔に挿入され、かつ当該支持
部１５内のスプリング１６により支持されている。そし
て、検出棒１３の下端部をスプリング１６のばね力に抗
して押し戻すと、検出棒１３の上部が支持部１５の貫通
孔より飛び出るようになっている。さらに、検出棒支持
部１５の上方には、検出棒１３の上部によって光が遮断
される一対の受発光素子からなる透過センサー１７が設
置されている。この透過センサー１７は支持部１７に取
り付けられていてもよく、または製品１４を置く基台を
用いて取り付けられていてもよい。FIGS. 2 and 3 show the structure of the unfilled detection mechanism 1. FIG. As shown in these figures, the unfilled detection mechanism 1 includes a transmission sensor 12, a detection rod 13, a detection rod support 15, and a spring 16. That is, the detection rod 13
Are inserted into the through holes of the detection rod support 15 and are supported by springs 16 in the support 15. When the lower end of the detection rod 13 is pushed back against the spring force of the spring 16, the upper part of the detection rod 13 projects from the through-hole of the support 15. Further, a transmission sensor 17 composed of a pair of light receiving / emitting elements whose light is blocked by an upper portion of the detection rod 13 is provided above the detection rod support 15. The transmission sensor 17 may be attached to the support 17 or may be attached using a base on which the product 14 is placed.
【００２７】このような未充填検出機構１では、検出棒
支持部１５を下降することによって検出棒１３の下端部
を樹脂封止後の製品１４に接触させる。このとき、図２
に示すように樹脂封止後製品１４が良品の場合は、検出
棒１３が押し戻されて検出棒１３の上端部が支持部１５
より飛び出て、透過センサ１２からの光は遮光される。
また、図３に示すように樹脂封止後製品１４が未充填の
場合には、検出棒１３の上端部が支持部１５より飛び出
ないため、透過センサ１２からの光が透光する。以上の
ように、検出棒１３を製品１４に接触させた際の透過セ
ンサ１２の検出結果によって、樹脂封止後製品の未充填
状態を判別している。In such an unfilled detection mechanism 1, the lower end of the detection rod 13 is brought into contact with the product 14 after resin sealing by lowering the detection rod support 15. At this time, FIG.
If the product 14 is good after the resin sealing, the detection rod 13 is pushed back and the upper end of the detection rod 13 is
Further, the light from the transmission sensor 12 is shielded.
In addition, as shown in FIG. 3, when the product 14 after resin sealing is not filled, the light from the transmission sensor 12 is transmitted because the upper end of the detection rod 13 does not protrude from the support portion 15. As described above, the unfilled state of the product after resin sealing is determined based on the detection result of the transmission sensor 12 when the detection rod 13 is brought into contact with the product 14.
【００２８】次に、図１及び図４を参照し、樹脂封止装
置の、樹脂封止後の動作を説明する。図４に、この樹脂
封止後の動作フローを示す。樹脂封止が完了すると、分
離部９にて樹脂封止後製品１４のランナーなどの不要樹
脂が除去され、未充填検出機構１により樹脂封止後製品
１４に対して未充填検出が行われる。未充填検出にて良
品の場合には、良品製品を有するリードフレームがその
まま良品収納マガジン２ａに収納される。未充填不良品
が有った場合には、不良品製品を有するリードフレーム
が不良品収納マガジン２ｂに収納される。このように良
品と未充填不良品をリードフレームから除去せずに分別
するので、マトリックスリードフレームを用いた製品の
場合には、樹脂封止装置を複雑にすることなく次工程に
不良品を流すことがない。つまり、どの列に生じている
未充填製品でも除去できるようにリードフレームの搬送
をＸＹ方向に可能にする必要はないので、樹脂封止装置
を複雑にすることがない。それ故、故障時に復旧にかか
る時間が短くて済む。Next, the operation of the resin sealing device after resin sealing will be described with reference to FIGS. FIG. 4 shows an operation flow after the resin sealing. When the resin encapsulation is completed, an unnecessary resin such as a runner of the product 14 after resin encapsulation is removed by the separation unit 9, and the unfilled detection mechanism 1 detects non-filled state of the product 14 after resin encapsulation. In the case of a non-defective product in the non-fill detection, the lead frame having the non-defective product is stored as it is in the non-defective storage magazine 2a. If there is an unfilled defective product, the lead frame having the defective product is stored in the defective product storage magazine 2b. In this way, non-defective products and unfilled defective products are separated without removing them from the lead frame. In the case of products using a matrix lead frame, defective products are flowed to the next step without complicating the resin sealing device. Nothing. In other words, it is not necessary to enable the transport of the lead frame in the XY directions so that unfilled products occurring in any row can be removed, so that the resin sealing device is not complicated. Therefore, the time required for recovery in the event of a failure can be reduced.
【００２９】さらに、上記のように未充填製品があった
場合、樹脂封止装置はアラーム（警報）を出してシステ
ムを停止させる。このような装置停止アラームを出すと
きには、金型のゲート口に残存樹脂があるかの確認を示
唆するようなメッセージを、樹脂封止装置に付随するパ
ネルなどに表示してもよい。Further, when there is an unfilled product as described above, the resin sealing device issues an alarm (alarm) and stops the system. When such a device stop alarm is issued, a message indicating that there is residual resin in the gate opening of the mold may be displayed on a panel or the like attached to the resin sealing device.
【００３０】また、未充填の原因がゲート詰まりだけで
はないので、未充填検出で不良品検出した場合に、樹脂
封止装置を毎回停止させる方法に限る必要はない。つま
り、未充填検出での不良品検出回数を設定可能とし、そ
の設定回数に応じて、樹脂封止装置をアラーム停止する
方法を採用しても良い。例えば、２回連続して、未充填
不良品を検出した場合に樹脂封止装置をアラーム停止さ
せる方法が挙げられる。この場合には、不良検出で樹脂
封止装置を毎回停止させる場合よりも生産能力を低下さ
せずに済む。Further, since the cause of the unfilling is not only the clogging of the gate, it is not necessary to limit the method of stopping the resin sealing device every time when the defective product is detected by the unfilling detection. In other words, a method may be adopted in which the number of defective products detected in unfilled state detection can be set, and the resin sealing device is stopped according to the set number of times. For example, there is a method of stopping the alarm of the resin sealing device when an unfilled defective product is detected twice consecutively. In this case, the production capacity does not need to be reduced as compared with the case where the resin sealing device is stopped every time when a defect is detected.
【００３１】[0031]
【発明の効果】以上説明したように本発明は、未充填製
品を検出するとアラーム停止する、半導体装置の樹脂封
止装置であるので、作業者に未充填不良の原因を取り除
かせることができる。そのため、未充填不良の連続発生
を防止して、歩留りを向上させることができる。As described above, the present invention is a resin sealing device for a semiconductor device in which an alarm is stopped when an unfilled product is detected, so that an operator can remove the cause of the unfilled defect. For this reason, it is possible to prevent continuous occurrence of unfilled defects and improve the yield.
【００３２】また、樹脂封止後、未充填不良製品を有す
るリードフレームを良品製品のみのリードフレームとは
分別するので、樹脂封止装置がマトリックスフレームな
どを対象する場合は、装置を複雑にすることなく次工程
に不良品を流すことを防ぐことができる。従って、故障
時の作業者による検査確認時間を大幅に削減できるた
め、生産能力を低下させずに済む。Further, after the resin sealing, the lead frame having the unfilled defective product is separated from the lead frame having only the non-defective product, so that when the resin sealing device is applied to a matrix frame or the like, the device is complicated. It is possible to prevent a defective product from flowing to the next process without any problem. Therefore, the time required for the inspection and confirmation by the operator at the time of failure can be significantly reduced, and the production capacity does not need to be reduced.
【図１】本発明の一実施形態である、半導体装置の樹脂
封止装置を示す平面図である。FIG. 1 is a plan view showing a resin sealing device for a semiconductor device according to one embodiment of the present invention.
【図２】図１に示した樹脂封止装置の未充填検出機構に
よる良品検出時の状況を示す断面図である。FIG. 2 is a cross-sectional view showing a state when a non-defective product is detected by an unfilled detection mechanism of the resin sealing device shown in FIG.
【図３】図１に示した樹脂封止装置の未充填検出機構に
よる未充填検出時の状況を示す断面図である。FIG. 3 is a cross-sectional view showing a state when unfilling is detected by an unfilling detection mechanism of the resin sealing device shown in FIG. 1;
【図４】図１に示した樹脂封止装置の、樹脂封止後の動
作フローを示す図である。FIG. 4 is a diagram showing an operation flow after resin sealing of the resin sealing device shown in FIG. 1;
【図５】特開平７−２３１００５号公報に記載の従来の
樹脂封止装置による未充填検出の様子を示す斜視図であ
る。FIG. 5 is a perspective view showing a state of non-filling detection by a conventional resin sealing device described in JP-A-7-231005.
【図６】特開平７−２３１００５号公報に記載の従来の
樹脂封止装置による未充填検出の様子を示す詳細図であ
る。FIG. 6 is a detailed view showing an unfilled state detected by a conventional resin sealing device described in JP-A-7-231005.
【図７】特開平２−１０５５５０号公報に記載の従来の
未充填検出方法を実施する装置を示す正面図である。FIG. 7 is a front view showing an apparatus for implementing a conventional unfilling detection method described in JP-A-2-105550.
【図８】図７に示す不良検出除去装置における未充填検
出の機構を示す詳細図である。FIG. 8 is a detailed view showing a mechanism for detecting unfilling in the defect detection and removal device shown in FIG. 7;
【図９】特開平７−１４８６７号公報に記載の従来の樹
脂封止装置を示す概略構成図である。FIG. 9 is a schematic configuration diagram showing a conventional resin sealing device described in JP-A-7-14867.
【図１０】図９に示した金型により未充填製品が除去さ
れたリードフレームの斜視図である。FIG. 10 is a perspective view of a lead frame from which unfilled products have been removed by the mold shown in FIG. 9;
１ 未充填検出機構 ２ａ 良品収納マガジン ２ｂ 不良品収納マガジン ３ 供給トレー ４ リードフレーム配列部 ５ 樹脂供給部 ６ 樹脂ローダ ７ 樹脂封止型 ８ プレス部 ９ 分離部 １０ クリーナー １１ 集塵機 １３ 検出棒 １４ 樹脂封止後製品 １５ 検出棒支持部 １６ スプリング １７ 透過センサー DESCRIPTION OF SYMBOLS 1 Unfilled detection mechanism 2a Good goods storage magazine 2b Defective goods storage magazine 3 Supply tray 4 Lead frame arrangement part 5 Resin supply part 6 Resin loader 7 Resin sealing type 8 Press part 9 Separation part 10 Cleaner 11 Dust collector 13 Detection rod 14 Resin seal Product after stop 15 Detecting rod support 16 Spring 17 Transmission sensor
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/56 H01L 21/66 B29C 45/76 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) H01L 21/56 H01L 21/66 B29C 45/76
Claims (4)
止する樹脂封止手段と、樹脂封止後製品の未充填不良を
検出する未充填検出機構とを含む半導体装置の樹脂封止
装置において、 前記未充填検出機構は、樹脂封止後製品に接触させる検
出棒と、該検出棒の上端部を検出する透過センサとから
なり、 前記樹脂封止装置は、前記検出棒の下端部を樹脂封止後
製品に接触させて樹脂の無い状態または不足した状態を
前記透過センサで検知し、未充填製品と判断した場合、
樹脂封止装置の動作を中断し金型ゲート口に残存樹脂が
あるか否かの確認指示を行なうことを特徴とする半導体
装置の樹脂封止装置。1. A resin sealing device for a semiconductor device, comprising: a resin sealing means for resin sealing a semiconductor device on a lead frame; and an unfilling detection mechanism for detecting an unfilling failure of a product after resin sealing. The unfilled detection mechanism includes a detection rod that comes into contact with a product after resin sealing, and a transmission sensor that detects an upper end of the detection rod. The resin sealing device seals a lower end of the detection rod with a resin. After the stop, the state where there is no resin or insufficient state by contacting the product is detected by the transmission sensor, and when it is determined that the product is not filled,
A resin sealing device for a semiconductor device, wherein the operation of the resin sealing device is interrupted and a confirmation instruction is made as to whether or not there is residual resin in a mold gate opening.
フレームを対象とする、半導体装置の樹脂封止装置にお
いて、 樹脂封止後製品に接触させる検出棒と、該検出棒の上端
部を検出する透過センサとからなる未充填検出機構を有
し、 前記未充填検出機構は、前記検出棒の下端部を樹脂封止
後製品に接触させて樹脂の無い状態または不足した状態
を前記透過センサで検知し、未充填製品と判断した場
合、良品を有するリードフレームを良品収納マガジンへ
収納し、不良品を有するリードフレームを不良品マガジ
ンへ収納し、樹脂封止装置の動作を中断し金型ゲート口
に残存樹脂があるか否かの確認指示を行なうことを特徴
とする半導体装置の樹脂封止装置。2. A resin sealing device for a semiconductor device for a lead frame in which semiconductor devices are arranged in a plurality of rows, wherein a detection rod to be brought into contact with a product after resin sealing and an upper end of the detection rod are detected. And an unfilled detection mechanism comprising a transmission sensor, wherein the unfilled detection mechanism contacts the product after the lower end of the detection rod is sealed with a resin, and the transmission sensor detects a state where there is no resin or a state where resin is insufficient. If it is detected and judged to be an unfilled product, the lead frame with a good product is stored in the good product storage magazine, the lead frame with the defective product is stored in the bad product magazine, the operation of the resin sealing device is interrupted, and the mold gate is stopped. A resin sealing device for a semiconductor device, wherein an instruction is issued to confirm whether or not there is residual resin in a mouth.
装置の動作を中断し金型ゲート口に残存樹脂があるか否
かの確認指示を行なう動作を開始する請求項１又は２に
記載の半導体装置の樹脂封止装置。3. The method according to claim 1, wherein when a predetermined number of detections has been reached, the operation of the resin sealing device is interrupted and an operation for instructing whether or not there is residual resin in the mold gate opening is started. A resin sealing device for a semiconductor device as described in the above.
り、樹脂封止後製品と検出棒の接触に伴って検出棒が透
過センサの光を透過したり遮断することで良否判断を行
なう請求項１又は２に記載の半導体装置の樹脂封止装
置。4. A resin-sealed semiconductor device is continuously fed, and the pass / fail judgment is made by transmitting or blocking the light of the transmission sensor when the detection rod comes into contact with the product after resin sealing. A resin sealing device for a semiconductor device according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP09240802A JP3102473B2 (en) | 1997-09-05 | 1997-09-05 | Resin sealing device for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP09240802A JP3102473B2 (en) | 1997-09-05 | 1997-09-05 | Resin sealing device for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1187382A JPH1187382A (en) | 1999-03-30 |
| JP3102473B2 true JP3102473B2 (en) | 2000-10-23 |
Family
ID=17064911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP09240802A Expired - Fee Related JP3102473B2 (en) | 1997-09-05 | 1997-09-05 | Resin sealing device for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3102473B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100631940B1 (en) * | 2003-12-15 | 2006-10-04 | 주식회사 하이닉스반도체 | apparatus for separating a cull of a semiconductor package molding system |
-
1997
- 1997-09-05 JP JP09240802A patent/JP3102473B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH1187382A (en) | 1999-03-30 |
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