JP3098374B2 - Equipment for signal measurement - Google Patents
Equipment for signal measurementInfo
- Publication number
- JP3098374B2 JP3098374B2 JP06048212A JP4821294A JP3098374B2 JP 3098374 B2 JP3098374 B2 JP 3098374B2 JP 06048212 A JP06048212 A JP 06048212A JP 4821294 A JP4821294 A JP 4821294A JP 3098374 B2 JP3098374 B2 JP 3098374B2
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- reference potential
- plate
- measurement
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Tests Of Electronic Circuits (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、高速信号を伝送する電
子回路パッケージの信号測定用装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for measuring a signal of an electronic circuit package for transmitting a high-speed signal.
【０００２】[0002]
【従来の技術】図９は、従来の、コンタクトプローブ式
を採用した信号測定用装置を示す側面図、図１０は、従
来の、アース接続用端子式を採用した信号測定用装置を
示す側面図である。2. Description of the Related Art FIG. 9 is a side view showing a conventional signal measuring device employing a contact probe type, and FIG. 10 is a side view showing a conventional signal measuring device employing a grounding terminal type. It is.
【０００３】従来の信号測定用装置は、図９に示すよう
な、被測定回路としての電子回路パッケージ１０９が載
置される載置板１１０に対して垂直に固定されたガイド
ポスト１０２に、コンタクトプローブ１００を支持する
支持板１０４が移動自在に挿通された構成（実開平１−
１４４８７０号公報参照）により、コンタクトプローブ
１００の先端部を電子回路パッケージ１０９の測定パッ
ド１０３に当接して信号波形を測定している。[0003] A conventional signal measuring device is configured such that a contact is made with a guide post 102 fixed vertically to a mounting plate 110 on which an electronic circuit package 109 as a circuit to be measured is mounted, as shown in FIG. A configuration in which a support plate 104 for supporting the probe 100 is movably inserted (actually,
According to Japanese Patent Application Laid-Open No. 144870), the signal waveform is measured by bringing the tip of the contact probe 100 into contact with the measurement pad 103 of the electronic circuit package 109.
【０００４】また、信号測定用装置は、図１０に示すよ
うな、同軸型の測定プローブ１１３の先端を所定の測定
パッド１０３へ案内する基準電位接続用端子１１１を、
電子回路パッケージ上に実装するとともに、基準電位接
続用端子１１１を、測定パッド１０３近傍の、電子回路
パッケージ上の基準電位と接続した構成により、測定プ
ローブ１１３の外部導体を基準電位に接続させた状態
で、測定プローブ１１３の中心導体である先端を測定パ
ッド１０３に当接して信号波形を測定している。A signal measuring device includes a reference potential connecting terminal 111 for guiding the tip of a coaxial measuring probe 113 to a predetermined measuring pad 103 as shown in FIG.
A state in which the external conductor of the measurement probe 113 is connected to the reference potential by mounting the electronic device on the electronic circuit package and connecting the reference potential connection terminal 111 to the reference potential on the electronic circuit package near the measurement pad 103. The signal waveform is measured by bringing the tip, which is the center conductor of the measurement probe 113, into contact with the measurement pad 103.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、図９に
示した、コンタクトプローブを用いた信号用測定装置で
は、測定回路系の特性インピーダンスに整合できない、
つまり測定回路系のインピーダンスが被測定回路に接続
された際の影響や負荷効果を軽減できないため、信号波
形が歪むとともに、高速信号の分岐（分流）測定が困難
であった。However, the signal measuring device using the contact probe shown in FIG. 9 cannot match the characteristic impedance of the measuring circuit system.
That is, the influence of the impedance of the measurement circuit system and the load effect when it is connected to the circuit to be measured cannot be reduced, so that the signal waveform is distorted and it is difficult to measure the branching (shunt) of the high-speed signal.
【０００６】また、図１０に示した、基準電位接続用端
子を用いた信号用測定装置は、電子回路パッケージに実
装された基準電位接続用端子によって、同軸型の測定プ
ローブの外部導体が基準電位と接続できるように構成さ
れているため、測定パッド部の実装エリアが大きくな
り、基準電位接続用端子の半田付け部での信号配線パタ
ーンの収容性が悪化する。また、電子回路パッケージ単
体を取り出して測定するので実際の使用状態に比べ基準
電位がふらつき基準電位雑音が増加したり、外来雑音の
影響を受けるので、正確な測定をしにくい、という問題
点がある。In the signal measuring apparatus shown in FIG. 10 using the reference potential connection terminal, the external conductor of the coaxial measurement probe is connected to the reference potential by the reference potential connection terminal mounted on the electronic circuit package. Therefore, the mounting area of the measurement pad portion is increased, and the accommodation of the signal wiring pattern in the soldering portion of the reference potential connection terminal is deteriorated. In addition, since the electronic circuit package itself is taken out and measured, the reference potential fluctuates compared to the actual use state, and the reference potential noise increases, and there is a problem that it is difficult to perform accurate measurement because it is affected by external noise. .
【０００７】本発明は、上記従来技術の問題点に鑑みて
なされたものであって、測定回路系の特性インピーダン
スを整合させ、かつ、測定プローブの基準電位のふらつ
きを低く抑える構造を持つ信号測定用装置を提供するこ
とを目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems in the prior art, and has a structure in which a characteristic impedance of a measurement circuit system is matched and a fluctuation of a reference potential of a measurement probe is suppressed to be low. It is intended to provide a device for use.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するため
の本発明は、同軸型の測定プローブの外部導体を基準電
位と電気的に接続させた状態で、前記測定プローブの中
心導体である先端を被測定回路基板上の測定パッドに当
接して信号波形を測定する信号測定用装置において、前
記測定パッドが設けられた側の面を被うようにして、前
記被測定回路基板と対向配置された、基準電位が接続さ
れる基準電位板と、前記測定パッドに対応して前記基準
電位板に配設され、前記測定プローブの先端が前記測定
パッドに当接するように前記測定プローブを案内可能に
するとともに、内壁部で前記測定プローブの外部導体を
前記基準電位板と電気的に接続させる案内スリーブと、
を備えたことを特徴とする。In order to achieve the above-mentioned object, the present invention provides a coaxial type measuring probe in which the outer conductor is electrically connected to a reference potential, and the tip is a center conductor of the measuring probe. In a signal measuring device for measuring a signal waveform by abutting a measurement pad on a circuit board to be measured, the apparatus is disposed to face the circuit board to be measured so as to cover a surface on which the measurement pad is provided. Further, a reference potential plate to which a reference potential is connected, and the reference potential plate is disposed on the reference potential plate corresponding to the measurement pad, so that the measurement probe can be guided so that the tip of the measurement probe comes into contact with the measurement pad. And a guide sleeve for electrically connecting the outer conductor of the measurement probe to the reference potential plate at the inner wall portion,
It is characterized by having.
【０００９】また、前記信号測定用装置は、前記被測定
回路基板の、前記測定パッドが設けられた側の面と反対
の面に複数の給電パッドが配設され、前記被測定回路基
板の、前記各給電パッドが設けられた面の側には、前記
各給電パッドに対応して複数のコンタクトプローブを支
持するとともに、該各コンタクトプローブを通じて前記
被電子回路基板へ給電するための給電板が、前記被測定
回路基板に対して対向移動可能に設置され、前記給電板
には、前記被測定回路基板へ基準電位を給電するための
基準電位電源が少なくとも接続されており、前記給電板
を前記被測定回路基板に向けて移動させて前記給電パッ
ドに前記コンタクトプローブを当接させた際、前記給電
板の基準電位と前記基準電位板との間が、一点で電気的
に接続されるものであってもよく、さらに、前記給電板
は、絶縁性板と導電性板とを交互に積層して構成されて
おり、前記給電板を構成する導電性板のうちの一つに基
準電位電源が接続され、前記給電板の、前記基準電位電
源が接続された導電板と前記基準電位板との間が、一点
で電気的に接続されるものであってもよい。In the signal measuring device, a plurality of power supply pads may be provided on a surface of the circuit board to be measured which is opposite to a surface on which the measurement pads are provided. On the side of the surface provided with each of the power supply pads, while supporting a plurality of contact probes corresponding to each of the power supply pads, a power supply plate for supplying power to the electronic circuit board through each of the contact probes, The power supply plate is provided so as to be movable to face the circuit board to be measured, and the power supply plate is connected to at least a reference potential power supply for supplying a reference potential to the circuit board to be measured. When the contact probe is brought into contact with the power supply pad by moving toward the measurement circuit board, the reference potential of the power supply plate and the reference potential plate are electrically connected at one point. The power supply plate may further include an insulating plate and a conductive plate alternately stacked, and a reference potential power supply may be provided on one of the conductive plates constituting the power supply plate. The conductive plate connected to the reference potential power supply and the reference potential plate may be electrically connected at one point.
【００１０】[0010]
【作用】上記のとおり構成された本発明では、被測定回
路基板には測定パッドが配設されており、その被測定回
路基板の、測定パッドが配設された側の面を覆うよう
に、基準電位が接続される基準電位板を対向配置して、
同軸型の測定プローブを前記測定パッドに当接するよう
に案内可能にするとともに、内壁部で測定プローブの外
部導体を基準電位板と電気的に接続させる案内スリーブ
を、基準電位板に測定パッドに対応して配設した。この
ことにより、測定パッドと測定プローブ先端との位置合
わせが確実になり、測定パッドの実装エリアが必要最小
限で済む。また、被測定回路基板に基準電位接続用端子
を実装する必要がないので、信号配線パターンの収容性
が良好となる。In the present invention configured as described above, the measurement pads are provided on the circuit board to be measured, and the circuit board to be measured covers the surface of the circuit board on the side where the measurement pads are provided. A reference potential plate to which a reference potential is connected is disposed oppositely,
A guide sleeve for electrically connecting the outer conductor of the measurement probe to the reference potential plate at the inner wall portion is provided on the reference potential plate. And arranged. As a result, the alignment between the measurement pad and the tip of the measurement probe is ensured, and the mounting area of the measurement pad is minimized. Further, since it is not necessary to mount the reference potential connection terminals on the circuit board to be measured, the accommodation of the signal wiring pattern is improved.
【００１１】また、前記基準電位板と前記案内スリーブ
との構成に加えて、被測定回路基板へ給電するための給
電板が、被測定回路基板に対して対向移動可能に配置さ
れており、給電板を被測定回路基板に向けて対向移動さ
せると、被測定回路基板に配設された複数の給電パッド
に、各給電パッドに対応させて給電板に支持された複数
のコンタクトプローブが当接し、被測定回路基板は給電
される。このとき、給電板には、被測定回路基板へ基準
電位を給電する基準電位電源が少なくとも接続されてお
り、給電板の基準電位と基準電位板との間が、一点で電
気的に接続されるので、基準電位雑音や外来雑音の影響
を受けることなく、特性インピーダンス整合をした測定
系で高速信号の分岐（分流）測定が可能となる。Further, in addition to the configuration of the reference potential plate and the guide sleeve, a power supply plate for supplying power to the circuit board to be measured is disposed so as to be able to move opposite to the circuit board to be measured. When the board is moved to face the circuit board to be measured, a plurality of contact probes supported on the power supply board corresponding to each of the power supply pads come into contact with the plurality of power supply pads arranged on the circuit under test, The circuit board to be measured is supplied with power. At this time, at least a reference potential power supply for supplying a reference potential to the circuit board to be measured is connected to the power supply plate, and the reference potential of the power supply plate and the reference potential plate are electrically connected at one point. Therefore, a high-speed signal branching (shunting) measurement can be performed by a measurement system with characteristic impedance matching without being affected by reference potential noise or external noise.
【００１２】さらに、給電板を、絶縁性板と導電性板と
を交互に積層して構成することにより、給電板内の許容
電圧降下を配慮して、導電性板の板厚を任意に設定でき
る。Further, the thickness of the conductive plate is arbitrarily set in consideration of the allowable voltage drop in the power supply plate by alternately stacking the insulating plate and the conductive plate. it can.
【００１３】[0013]
【実施例】以下、本発明の実施例について図面を参照し
て説明する。Embodiments of the present invention will be described below with reference to the drawings.
【００１４】図１は本発明の一実施例の全体構成を示
し、（Ａ）は平面図、（Ｂ）は正面図、（Ｃ）は側面図
である。図２は本発明の一実施例における電子回路パッ
ケージへの給電状態を説明するための縦断面図である。
図３は本発明の一実施例の主構成を示す分解斜視図、図
４は図３に示した電子回路パッケージの平面図、図５は
本発明の一実施例に備わる案内スリーブの取付け状態を
示す部分断面図、図６は図３に示した給電板の平面図、
図７は本発明の一実施例に備わる、給電板とコンタクト
プローブ間の接続を示す断面図、図８は本発明の一実施
例に備わる、基準電位接続用端子の接続を示す断面図で
ある。FIG. 1 shows the overall structure of an embodiment of the present invention, in which (A) is a plan view, (B) is a front view, and (C) is a side view. FIG. 2 is a longitudinal sectional view for explaining a power supply state to the electronic circuit package in one embodiment of the present invention.
FIG. 3 is an exploded perspective view showing the main structure of one embodiment of the present invention, FIG. 4 is a plan view of the electronic circuit package shown in FIG. 3, and FIG. 5 shows the state of attachment of a guide sleeve provided in one embodiment of the present invention. FIG. 6 is a plan view of the power supply plate shown in FIG.
FIG. 7 is a cross-sectional view showing a connection between a power supply plate and a contact probe provided in one embodiment of the present invention, and FIG. 8 is a cross-sectional view showing a connection of a reference potential connection terminal provided in one embodiment of the present invention. .
【００１５】図１乃至図３に示すように、被測定回路基
板としての電子回路パッケージ９の被測定面側には、基
準電位板５が覆われている。この基準電位基板５には、
図５に示すように電子回路パッケージ９を測定するため
の測定プローブ１３が装着される筒状の案内スリーブ４
がカシメ付けられている。これにより、案内スリーブ４
と基準電位板５とは電気的に強固に接続されるので、案
内スリーブ４と基準電位板５の間の電位差は無視でき
る。また、案内スリーブ４がカシメ付けられる、基準電
位板５の案内スリーブ用穴１５の位置は、電子回路パッ
ケージ９上の測定パッド３（図４参照）の位置に対応す
るように割り出して決めるので、測定パッド３の直上に
正確に設けることができる。このため、小さなサイズの
測定パッド３に対しても、測定プローブ１３の先端を確
実に当接できる。そして、図１の（Ａ）に示すように、
基準電位板５のほぼ全面に案内スリーブ４を設けること
ができるので、測定プローブ１３での測定箇所は実質的
に制約されない。ここで測定プローブ１３を案内スリー
ブ４に装着すると、測定プローブ１３の、基準電位とな
る外部導体が、案内スリーブ４の内壁部２に接続される
が、さらに確実な接続にするには、測定プローブ１３の
外周の基準電位に設けた基準電位ピンコンタクト２０と
基準電位板５に設けたソケットコンタクト１９との嵌合
で電気的に接続することも可能である。なお、測定プロ
ーブ１３は、外部導体と中心導体との間に絶縁体材料が
介在された同軸型のものである。As shown in FIGS. 1 to 3, a reference potential plate 5 is covered on the surface to be measured of an electronic circuit package 9 as a circuit substrate to be measured. The reference potential substrate 5 includes
As shown in FIG. 5, a cylindrical guide sleeve 4 on which a measurement probe 13 for measuring the electronic circuit package 9 is mounted.
Is caulked. Thereby, the guide sleeve 4
And the reference potential plate 5 are electrically strongly connected, so that the potential difference between the guide sleeve 4 and the reference potential plate 5 can be ignored. Further, the position of the guide sleeve hole 15 of the reference potential plate 5 to which the guide sleeve 4 is crimped is determined by being determined so as to correspond to the position of the measurement pad 3 (see FIG. 4) on the electronic circuit package 9. It can be provided exactly above the measuring pad 3. Therefore, the tip of the measurement probe 13 can be reliably brought into contact with the measurement pad 3 having a small size. Then, as shown in FIG.
Since the guide sleeve 4 can be provided on almost the entire surface of the reference potential plate 5, the measurement location on the measurement probe 13 is not substantially restricted. When the measurement probe 13 is mounted on the guide sleeve 4, the outer conductor serving as the reference potential of the measurement probe 13 is connected to the inner wall 2 of the guide sleeve 4. It is also possible to make an electrical connection by fitting a reference potential pin contact 20 provided on the reference potential on the outer periphery of 13 with a socket contact 19 provided on the reference potential plate 5. The measurement probe 13 is of a coaxial type in which an insulator material is interposed between an outer conductor and a center conductor.
【００１６】一方、電子回路パッケージ９の被測定面と
反対側には、図１乃至図３に示すように、電子回路パッ
ケージ９への給電を行なう給電板１４が、ハンドル１８
を備えた昇降手段により電子回路パッケージ９に対して
対向移動可能に設置されている。電子回路パッケージ９
への給電は、図１および図６に示すように、基準電位用
給電端子１６Ａ、半導体装置動作用給電端子１６Ｂ、お
よび終端電源用給電端子１６Ｃからなる給電端子１６か
らなされ、電源の種別により個々に給電できる。このよ
うな給電板１４は、図７に示すように、絶縁性板６と導
電性板７と交互に狭持または接着した積層構造となって
いる。そして、給電端子１６Ａ，１６Ｂ，１６Ｃは各導
電性板７にそれぞれ配設されるとともに、各導電性板７
にはコンタクトプローブ１０Ａ，１０Ｂ，１０Ｃ（図６
参照）が給電端子１６Ａ，１６Ｂ，１６Ｃに対応して電
気的に接続されている。このような給電板１４の構造の
為、給電板１４内の許容電圧降下を配慮して、導電性板
６の板厚を任意に設定できる。On the other hand, a power supply plate 14 for supplying power to the electronic circuit package 9 is provided on a side opposite to the surface to be measured of the electronic circuit package 9 as shown in FIGS.
It is installed so as to be able to move in opposition to the electronic circuit package 9 by means of elevating means provided with. Electronic circuit package 9
As shown in FIGS. 1 and 6, power is supplied to a power supply terminal 16 including a reference potential power supply terminal 16A, a semiconductor device operation power supply terminal 16B, and a terminal power supply power supply terminal 16C. Can be powered. As shown in FIG. 7, such a power supply plate 14 has a laminated structure in which insulating plates 6 and conductive plates 7 are alternately sandwiched or adhered. The power supply terminals 16A, 16B, and 16C are disposed on the respective conductive plates 7, and the respective conductive plates 7
Have contact probes 10A, 10B and 10C (FIG. 6).
Are electrically connected to the power supply terminals 16A, 16B, 16C. Due to such a structure of the power supply plate 14, the thickness of the conductive plate 6 can be arbitrarily set in consideration of an allowable voltage drop in the power supply plate 14.
【００１７】このように、コンタクトプローブ位置間の
電圧降下値のバラツキは無視できる値に設定できるの
で、基準電位雑音・電源雑音が信号測定結果に影響を与
えるのを防止できる。また、図７に示すように、給電板
１４から電子回路パッケージ９までの給電は、コンタク
トプローブ１０の内部のコイルスプリング（不図示）が
図７に示すＳ値までに変化したときの反発力が接触力と
なるので、高い接触力で給電板１４と電子回路パッケー
ジ９と間を接続でき、電子回路パッケージ９とコンタク
トプローブ１０との間の電圧降下値もまた無視可能なレ
ベルまで低くできる。As described above, since the variation in the voltage drop between the contact probe positions can be set to a negligible value, it is possible to prevent the reference potential noise and the power supply noise from affecting the signal measurement result. As shown in FIG. 7, the power supply from the power supply plate 14 to the electronic circuit package 9 is performed by a repulsive force when a coil spring (not shown) inside the contact probe 10 changes to the S value shown in FIG. Since the contact force is obtained, the power supply plate 14 and the electronic circuit package 9 can be connected with a high contact force, and the voltage drop between the electronic circuit package 9 and the contact probe 10 can be reduced to a negligible level.
【００１８】図６は、コンタクトプローブ１０をほぼ均
等に配置し、電圧降下を小さくした給電板１４の例を示
している。基準電位用コンタクト１０Ａは電子回路パッ
ケージ背面の半導体装置動作用パッド、終端電源用コン
タクトプローブ１０Ｃは電子回路パッケージ背面の終端
電源用パッド（各パッドの図示は省略）に対応した位置
に設けられている。FIG. 6 shows an example of the power supply plate 14 in which the contact probes 10 are arranged substantially uniformly and the voltage drop is reduced. The reference potential contact 10A is provided at a position corresponding to the semiconductor device operation pad on the back of the electronic circuit package, and the terminal power supply contact probe 10C is provided at a position corresponding to the terminal power supply pad (each pad is not shown) on the back of the electronic circuit package. .
【００１９】さらに、基準電位用給電端子１６Ａが接続
された給電板１４の導電性板、つまり基準電位には、図
８に示すように基準電位接続用端子１１が設けられてお
り、基準電位板５には、基準電位コンタクト１７が基準
電位接続用端子１１の位置に対応して設けられている。
これにより、基準電位板５を一点で基準電位に接続でき
る構造になっている。また、図５に示すように測定用の
電源が電子回路パッケージ９に実装された測定用電源コ
ネクタ２１で給電され、測定精度の向上において基準電
位系のみの強化で良い場合には、給電板１４を基準電位
接続用の導電性板のみとして構成することも可能であ
る。Further, as shown in FIG. 8, a reference potential connection terminal 11 is provided on the conductive plate of the power supply plate 14 to which the reference potential power supply terminal 16A is connected, that is, the reference potential plate. 5 is provided with a reference potential contact 17 corresponding to the position of the reference potential connection terminal 11.
Thus, the reference potential plate 5 has a structure that can be connected to the reference potential at one point. In addition, as shown in FIG. 5, a power supply for measurement is supplied by a power supply connector 21 for measurement mounted on the electronic circuit package 9, and when it is sufficient to enhance only the reference potential system to improve measurement accuracy, the power supply plate 14 is provided. Can be configured only as a conductive plate for connection of the reference potential.
【００２０】上述のように構成した信号測定用装置で
は、ハンドル１８を水平にすると、図２の（Ａ）に示し
た状態に給電板１４が上昇して、コンタクトプローブ１
０が押し下げられ、電子回路パッケージに電源が接続さ
れる。また、ハンドル１８を垂直にすると、図２の
（Ｂ）に示した状態に給電板が下降して、電源が非接続
となる。In the signal measuring device configured as described above, when the handle 18 is horizontal, the power supply plate 14 is raised to the state shown in FIG.
0 is depressed and the power supply is connected to the electronic circuit package. When the handle 18 is made vertical, the power supply plate is lowered to the state shown in FIG. 2B, and the power supply is disconnected.
【００２１】[0021]
【発明の効果】本発明は、以上のように構成されている
ので、以下に記載するような効果を奏する。Since the present invention is configured as described above, it has the following effects.
【００２２】請求項１に記載の発明は、被測定回路基板
回路の、測定パッドが配設された側の面を基準電位板で
覆い、同軸型の測定プローブの外部導体と案内スリーブ
の内壁部が接触する構造にし、案内スリーブにより被測
定回路基板の測定パッドとの位置合わせを確実にしたの
で、測定パッド部の実装エリアを最小にすることができ
る。According to the first aspect of the present invention, the surface of the circuit board to be measured on the side where the measuring pads are provided is covered with a reference potential plate, and the outer conductor of the coaxial measuring probe and the inner wall of the guide sleeve are provided. And the guide sleeve ensures alignment with the measurement pad of the circuit board to be measured, so that the mounting area of the measurement pad section can be minimized.
【００２３】請求項２に記載の発明は、請求項１に記載
の発明の効果に加えて、被測定回路基板の給電パッド側
に配置した給電板の基準電位と、被測定回路基板を覆う
基準電位板と、を一点で接続したので、基準電位雑音や
外来雑音の影響を受けることなく、特性インピーダンス
整合をした測定系で高速信号の分岐（分流）測定ができ
る。According to a second aspect of the present invention, in addition to the effects of the first aspect, the reference potential of the power supply plate disposed on the power supply pad side of the circuit board to be measured and the reference potential covering the circuit board to be measured are provided. Since the potential plate and the potential plate are connected at a single point, branching (shunting) of a high-speed signal can be measured by a measurement system with characteristic impedance matching without being affected by reference potential noise or external noise.
【００２４】請求項３に記載の発明は、請求項２に記載
の発明の効果に加えて、給電板内の許容電圧降下を配慮
して、導電性板の板厚を任意に設定できる。According to the third aspect of the invention, in addition to the effect of the second aspect, the thickness of the conductive plate can be arbitrarily set in consideration of an allowable voltage drop in the power supply plate.
【図１】本発明の一実施例の全体構成を示し、（Ａ）は
平面図、（Ｂ）は正面図、（Ｃ）は側面図である。1A and 1B show an overall configuration of an embodiment of the present invention, wherein FIG. 1A is a plan view, FIG. 1B is a front view, and FIG. 1C is a side view.
【図２】本発明の一実施例における電子回路パッケージ
への給電状態を説明するための側面図である。FIG. 2 is a side view for explaining a power supply state to an electronic circuit package according to one embodiment of the present invention.
【図３】本発明の一実施例の主構成を示す分解斜視図で
ある。FIG. 3 is an exploded perspective view showing a main configuration of one embodiment of the present invention.
【図４】図３に示した電子回路パッケージの平面図であ
る。FIG. 4 is a plan view of the electronic circuit package shown in FIG. 3;
【図５】図３に示した給電板の平面図である。FIG. 5 is a plan view of the power supply plate shown in FIG. 3;
【図６】本発明の一実施例に備わる案内スリーブの取付
け状態を示す部分断面図である。FIG. 6 is a partial cross-sectional view showing an attached state of a guide sleeve provided in one embodiment of the present invention.
【図７】本発明の一実施例に備わる、給電板とコンタク
トプローブ間の接続を示す断面図である。FIG. 7 is a cross-sectional view illustrating a connection between a power supply plate and a contact probe according to an embodiment of the present invention.
【図８】本発明の一実施例に備わる、基準電位接続用端
子の接続を示す断面図である。FIG. 8 is a cross-sectional view illustrating connection of a reference potential connection terminal provided in an embodiment of the present invention.
【図９】従来の、コンタクトプローブ式を採用した信号
測定用装置を示す側面図である。FIG. 9 is a side view showing a conventional signal measuring device employing a contact probe method.
【図１０】従来の、アース接続用端子式を採用した信号
測定用装置を示す側面図である。FIG. 10 is a side view showing a conventional signal measuring device employing a ground connection terminal type.
２ 内壁部 ３ 測定パッド ４ 案内スリーブ ５ 基準電位板 ６ 導電性板 ７ 絶縁性板 ８ 基準電位一点接続部 ９ 電子回路パッケージ １０ コンタクトプローブ １０Ａ 基準電位用コンタクトプローブ １０Ｂ 半導体装置動作電源用プローブ １０Ｃ 終端電源用コンタクトプローブ １１ 基準電位接続用端子 １３ 測定プローブ １４ 給電板 １５ 案内スリーブ用穴 １６ 給電端子 １６Ａ 基準電位用給電端子 １６Ｂ 半導体装置動作用給電端子 １６Ｃ 終端電源用給電端子 １７ 基準電位コンタクト １８ ハンドル １９ ソケットコンタクト ２０ 基準電位ピンコンタクト ２１ 測定用電源コネクタ 2 inner wall part 3 measuring pad 4 guide sleeve 5 reference potential plate 6 conductive plate 7 insulating plate 8 reference potential single point connection part 9 electronic circuit package 10 contact probe 10A reference potential contact probe 10B semiconductor device operation power supply probe 10C terminal power supply Contact probe 11 Reference potential connection terminal 13 Measurement probe 14 Power supply plate 15 Guide sleeve hole 16 Power supply terminal 16A Reference potential power supply terminal 16B Semiconductor device operation power supply terminal 16C Terminal power supply terminal 17 Reference potential contact 18 Handle 19 Socket Contact 20 Reference potential pin contact 21 Power supply connector for measurement
───────────────────────────────────────────────────── フロントページの続き (72)発明者 三日月 哲郎 東京都千代田区内幸町一丁目１番６号 日本電信電話株式会社内 (72)発明者 榊原 一彦 東京都千代田区内幸町一丁目１番６号 日本電信電話株式会社内 (72)発明者 岡 宏規 東京都千代田区内幸町一丁目１番６号 日本電信電話株式会社内 (56)参考文献 特開 平５−60789（ＪＰ，Ａ) 特開 平５−256905（ＪＰ，Ａ) 特開 昭63−317784（ＪＰ，Ａ) 実開 平４−134075（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) G01R 31/28 G01R 1/06 G01R 31/02 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Tetsuro Mikazuki 1-6-1, Uchisaiwaicho, Chiyoda-ku, Tokyo Nippon Telegraph and Telephone Corporation (72) Inventor Kazuhiko Sakakibara 1-1-6, Uchisaiwaicho, Chiyoda-ku, Tokyo Japan Inside Telegraph and Telephone Corporation (72) Inventor Hiroki Oka 1-6-6 Uchisaiwaicho, Chiyoda-ku, Tokyo Nippon Telegraph and Telephone Corporation (56) References JP-A-5-60789 (JP, A) JP-A-5- 256905 (JP, A) JP-A-63-317784 (JP, A) JP-A-4-134075 (JP, U) (58) Fields investigated (Int. Cl. 7 , DB name) G01R 31/28 G01R 1 / 06 G01R 31/02
Claims (3)
電位と電気的に接続させた状態で、前記測定プローブの
中心導体である先端を被測定回路基板上の測定パッドに
当接して信号波形を測定する信号測定用装置において、 前記測定パッドが設けられた側の面を覆うようにして、
前記被測定回路基板と対向配置された、基準電位が接続
される基準電位板と、 前記測定パッドに対応して前記基準電位板に配設され、
前記測定プローブの先端が前記測定パッドに当接するよ
うに前記測定プローブを案内可能にするとともに、内壁
部で前記測定プローブの外部導体を前記基準電位板と電
気的に接続させる案内スリーブと、を備えたことを特徴
とする、信号測定用装置。In a state in which an outer conductor of a coaxial type measurement probe is electrically connected to a reference potential, a tip, which is a center conductor of the measurement probe, is brought into contact with a measurement pad on a circuit board to be measured to generate a signal waveform. In the signal measuring device for measuring the, so as to cover the surface on which the measurement pad is provided,
A reference potential plate connected to a reference potential, the reference potential plate being opposed to the circuit board to be measured, and being provided on the reference potential plate corresponding to the measurement pad;
A guide sleeve that guides the measurement probe so that the tip of the measurement probe comes into contact with the measurement pad, and electrically connects an outer conductor of the measurement probe to the reference potential plate at an inner wall portion. A signal measuring device, characterized in that:
が設けられた側の面と反対の面に複数の給電パッドが配
設され、 前記被測定回路基板の、前記各給電パッドが設けられた
面の側には、前記各給電パッドに対応して複数のコンタ
クトプローブを支持するとともに、該各コンタクトプロ
ーブを通じて前記被電子回路基板へ給電するための給電
板が、前記被測定回路基板に対して対向移動可能に設置
され、 前記給電板には、前記被測定回路基板へ基準電位を給電
する基準電位電源が少なくとも接続されており、 前記給電板を前記被測定回路基板に向けて移動させて前
記給電パッドに前記コンタクトプローブを当接させた
際、前記給電板の基準電位と前記基準電位板との間が、
一点で電気的に接続されることを特徴とする、請求項１
に記載の信号測定用装置。2. A plurality of power supply pads are provided on a surface of the circuit board under test opposite to a surface on which the measurement pads are provided, and each of the power supply pads of the circuit board under test is provided. On the side of the surface, while supporting a plurality of contact probes corresponding to each of the power supply pads, a power supply plate for supplying power to the electronic circuit board through each contact probe, with respect to the circuit board to be measured The power supply plate is connected to at least a reference potential power supply that supplies a reference potential to the circuit board to be measured, and the power supply plate is moved toward the circuit board to be measured. When the contact probe is brought into contact with the power supply pad, between the reference potential of the power supply plate and the reference potential plate,
2. An electrical connection at one point.
3. The signal measuring device according to claim 1.
交互に積層して構成されており、 前記給電板を構成する導電性板のうちの一つに基準電位
電源が接続され、 前記給電板の、前記基準電位電源が接続された導電板と
前記基準電位板との間が、一点で電気的に接続されるこ
とを特徴とする、請求項２に記載の信号測定用装置。3. The power supply plate is configured by alternately stacking an insulating plate and a conductive plate, and a reference potential power supply is connected to one of the conductive plates constituting the power supply plate. The signal measuring device according to claim 2, wherein the power supply plate is electrically connected at one point between the conductive plate to which the reference potential power supply is connected and the reference potential plate. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP06048212A JP3098374B2 (en) | 1994-03-18 | 1994-03-18 | Equipment for signal measurement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP06048212A JP3098374B2 (en) | 1994-03-18 | 1994-03-18 | Equipment for signal measurement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07260860A JPH07260860A (en) | 1995-10-13 |
| JP3098374B2 true JP3098374B2 (en) | 2000-10-16 |
Family
ID=12797107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP06048212A Expired - Fee Related JP3098374B2 (en) | 1994-03-18 | 1994-03-18 | Equipment for signal measurement |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3098374B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6842355B2 (en) * | 2017-04-28 | 2021-03-17 | 株式会社アドバンテスト | Carrier for electronic component testing equipment |
| CN112379185B (en) * | 2020-11-06 | 2023-03-21 | 海光信息技术股份有限公司 | Bare chip power supply noise test structure |
-
1994
- 1994-03-18 JP JP06048212A patent/JP3098374B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07260860A (en) | 1995-10-13 |
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