JP3086774U - Heat dissipation device - Google Patents
Heat dissipation deviceInfo
- Publication number
- JP3086774U JP3086774U JP2001007937U JP2001007937U JP3086774U JP 3086774 U JP3086774 U JP 3086774U JP 2001007937 U JP2001007937 U JP 2001007937U JP 2001007937 U JP2001007937 U JP 2001007937U JP 3086774 U JP3086774 U JP 3086774U
- Authority
- JP
- Japan
- Prior art keywords
- main body
- heat
- lower main
- upper main
- heat radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
(57)【要約】 （修正有）
【課題】 気密性が良好で加工が容易な放熱装置の提
供。
【解決手段】 液−気相間の変化を利用し放熱効果を加
速する放熱装置２０とされ、下主体２１及び下主体の環
状下側壁２１１内に収容される上主体２２を具え、上主
体の四周と四周の環状下側壁間に連通状の間隙が形成さ
れ、且つ上主体及び下主体の結合後の内部に密閉空間が
形成され、並びに上述の密閉空間内に熱伝導速度を増加
可能な作業流体が充填され、該間隙にはんだ材料２５が
充填され、加熱後に、はんだ材料が溶融して該連通状の
間隙内に流入し、これにより毛細管現象によりはんだ材
料が上主体の四周及び下主体の下側壁の隣接面部分にし
み込み、こうして簡単に上主体と下主体を溶接して一体
となし、気密性が良好で加工が容易な機能を達成する。
(57) [Summary] (with correction) [Problem] To provide a heat radiating device having good airtightness and easy processing. SOLUTION: A heat radiating device 20 for accelerating a heat radiating effect by utilizing a change between a liquid and a gaseous phase is provided. A working fluid capable of increasing the heat conduction rate in the closed space formed between the upper main body and the lower main body after the connection is formed between the upper main body and the lower main body. And the gap is filled with the solder material 25, and after heating, the solder material melts and flows into the communicating gap, whereby the solder material is capillarized so that the solder material is surrounded by the upper main body and the lower main body. The upper main body and the lower main body are easily welded into one piece by penetrating into the adjacent surface portion of the side wall, thereby achieving a function with good airtightness and easy processing.
Description
【０００１】[0001]
本考案は一種の放熱装置に係り、特に、作業流体の液−気相変化と多孔構造の 毛細管現象により均一で且つ快速な放熱特性を達成し、且つその上主体の四周及 び下主体の環状下側壁間に連通状の間隙が形成され、それにはんだ材料が充填さ れて加熱された後に、上主体と下主体がはんだ付けされて一体とされた、放熱装 置に関する。 The present invention relates to a kind of heat radiating device, in particular, achieves uniform and rapid heat radiating characteristics by a liquid-gas phase change of a working fluid and a capillary phenomenon of a porous structure, and has a four-circumferential upper and a lower main ring. The present invention relates to a heat radiating device in which a communicating gap is formed between lower side walls, a solder material is filled in the gap, heated, and then an upper main body and a lower main body are soldered and integrated.
【０００２】[0002]
図１は周知の放熱装置の断面を示し、それは、放熱主体１２及び鰭片セット１ ３を具え、該放熱装置１０は電子製品１４、例えばＣＰＵ、ハードディスク或い はパワーサプライの上に設置され、この電子製品１４が作業で発生する熱エネル ギーを、銅或いはアルミ或いはその他の高い熱伝導性の金属で製造した放熱主体 １２により鰭片セット１３の正面に伝導し、さらにファン１１を利用して熱エネ ルギーを周囲の空気中に散布し、電子製品１４の作業温度を下げ、且つその使用 寿命を延長する。しかし、電子製品の作業の高速化の傾向に伴い、動作により発 生する熱エネルギーは高くなり、且つ電子製品の寸法がますます小さくなり、そ の熱エネルギーがますます集中し（即ちヒートポイントと称される）、迅速で有 効な放熱効果を達成するためには、放熱装置の寸法面積を増加し、ファンを増大 するか或いは風量を増加することが必要である。しかし、このような構造は却っ て電子製品の体積、重量、コストを増し、このようなファン及び風量を増大する 方式によると、騒音が過大となる欠点が発生し、これによりもう一つの解決の難 しい問題を形成した。 FIG. 1 shows a cross section of a known heat dissipating device, which comprises a heat dissipating body 12 and a fin set 13, the heat dissipating device 10 being mounted on an electronic product 14, such as a CPU, a hard disk or a power supply, The thermal energy generated by the operation of the electronic product 14 is conducted to the front of the fin piece set 13 by the heat radiating body 12 made of copper, aluminum or other high heat conductive metal, and furthermore, the fan 11 is used. The thermal energy is sprayed into the surrounding air to lower the working temperature of the electronic product 14 and prolong its service life. However, with the trend of faster operation of electronic products, the heat energy generated by the operation becomes higher, and the dimensions of electronic products become smaller and smaller, and the heat energy becomes more concentrated (ie, heat point and heat point). In order to achieve a rapid and effective heat dissipation effect, it is necessary to increase the dimensional area of the heat dissipation device, increase the number of fans or increase the air flow. However, such a structure rather increases the volume, weight, and cost of the electronic product, and the method of increasing the fan and the air flow has the disadvantage of generating excessive noise, which is another solution. Formed a difficult problem.
【０００３】 ゆえに、台湾特許公告第３０７８３７号（ヒートパイプ及びその製造方法）、 第４０６１８０号（板型ヒートパイプ及び該ヒートパイプを使用した冷却構造） で使用されている技術は、気−液相変化を利用して放熱目的を達成する放熱装置 であり、その放熱装置は、中空の金属底板を具え、且つ金属底板内部に気−液相 変化を行う作業流体が充填され、金属底板が電子製品に当接し、作業流体が電子 製品の発生する高熱により快速伝導を行い蒸発した後、さらに外界の空気と熱交 換を行い、このような快速熱交換技術により従来の、銅、アルミ或いはその他の 高熱伝導性金属で製造された放熱装置の発生する放熱効率不足の欠点を解決して いる。しかし、このような設計の金属底板はいずれも中空形式で設計されなけれ ば、作業流体のその内部に充填できず、ゆえに一般にメーカーは上主体と下主体 を接着して密閉空間を形成している。接着の方式は、上主体と下主体の有する環 状側壁の対応する表面で両者をはんだ付けして一体とする。しかし、直接はんだ 付けすると、上主体と下主体の対応する環状側壁がいずれも平坦な表面であり、 はんだ材料塗布の位置決めの部分がないため、はんだ材料が均一に付着しにくく 、安定してはんだ付けできず、環状下側壁に間隙表面が発生し、ゆえにこのよう な方式は大量生産及び使用時のいずれもコストを増加し或いは不良品の発生率を 増加し、ゆえに、いかに市場の要求に符合させるかが業者がいま一歩の改良を行 うべきところであった。[0003] Therefore, the technology used in Taiwan Patent Publication No. 307837 (heat pipe and its manufacturing method) and No. 406180 (plate-type heat pipe and cooling structure using the heat pipe) is based on the gas-liquid phase. A heat radiator that uses a change to achieve a heat radiation purpose. The heat radiator has a hollow metal bottom plate, and the inside of the metal bottom plate is filled with a working fluid that changes gas-liquid phase, and the metal bottom plate is an electronic product. The working fluid performs rapid conduction due to the high heat generated by the electronic product and evaporates.Then, the working fluid further exchanges heat with the outside air. With such rapid heat exchange technology, the conventional copper, aluminum or other It solves the shortcoming of the lack of heat dissipation efficiency generated by heat dissipation devices made of high thermal conductive metals. However, unless all of the metal bottom plates of such a design are designed in a hollow form, the working fluid cannot be filled into the inside, and therefore, in general, manufacturers adhere the upper body and the lower body to form a closed space. . In the bonding method, both are soldered on the corresponding surfaces of the annular side walls of the upper main body and the lower main body to be integrated. However, when directly soldered, the corresponding annular side walls of the upper and lower main bodies are both flat surfaces, and there is no positioning part for applying the solder material. In addition, such a method increases costs or increases the rate of rejection in both mass production and use, and thus meets market demands. To do so, the contractor had to make one step of improvement now.
【０００４】[0004]
本考案は上記従来の技術の欠点を解決し、上主体と下主体を簡単にはんだ付け してなる放熱装置を提供することを課題としている。 An object of the present invention is to solve the above-mentioned drawbacks of the conventional technology and to provide a heat radiating device in which an upper main body and a lower main body are easily soldered.
【０００５】 即ち、本考案の主要な目的は、作業流体の液−気相間の変化過程を利用して熱 集中現象を分散し放熱効率を増加する放熱装置を提供することにあり、この放熱 装置の上主体と下主体間に多孔構造と作業流体を充填する密閉空間が形成され、 且つ上主体の四周と下主体の環状側壁の隣接部分に連通状の間隙が形成され、こ の間隙にはんだ材料を充填でき、並びに加熱過程を透過してはんだ材料で上主体 と下主体の環状側壁間に形成された間隙部分を接合して一体となし、これにより 気密性に優れ、加工が容易な機能を達成する。[0005] That is, a main object of the present invention is to provide a heat radiating device that disperses a heat concentration phenomenon by using a change process between a liquid and a gas phase of a working fluid and increases heat radiating efficiency. A porous structure and a closed space for filling the working fluid are formed between the upper main body and the lower main body, and a communicating gap is formed between the four circumferences of the upper main body and the adjacent portion of the annular side wall of the lower main body. The material can be filled, and through the heating process, the gap formed between the upper and lower annular sidewalls is joined with the solder material to form a single unit, which provides excellent airtightness and easy processing To achieve.
【０００６】[0006]
請求項１の考案は、放熱装置において、 下主体とされ、その環状の下側壁の内側に上主体を収容し、上主体と下主体内 部に密閉空間を形成し、且つ上主体の四周辺縁と下主体の下側壁間に連通状の間 隙が形成され、この間隙内にはんだ材料が充填されて上主体と下主体がはんだ付 けされて一体とされる、上記下主体と、 該上主体と下主体の密閉空間内に充填される作業流体と、 多孔構造とされ、上主体と下主体の密閉空間の内部表面に設けられて熱伝導速 度と作業流体の蒸気の吸着を増加する、上記多孔構造と、 を具えたことを特徴とする、放熱装置としている。 請求項２の考案は、前記上主体が下主体の下側壁内部に収容され、且つ上主体 に下向きに延伸された上側壁が設けられ、並びに上側壁底部より外向きに延伸部 が延伸され、該延伸部の辺縁と下主体の下側壁の間に内に凹んだ環状の連通状の 間隙が形成され、この間隙にはんだ材料が充填されて上主体と下主体がはんだ付 けされて一体に接合されることを特徴とする、請求項１に記載の放熱装置として いる。 請求項３の考案は、前記多孔構造が金属粉末を上主体と下主体の内部表面にお いて焼結し、且つ金属粉末を真空或いは還元気体或いは慣性気体環境下で焼結し てなり、該金属粉末が、銅粉、ニッケル粉、銀粉、及びその混合物或いは合金粉 末のいずれかで組成されたことを特徴とする、請求項１に記載の放熱装置として いる。 請求項４の考案は、前記多孔構造が上主体と下主体の内部表面を粗くして形成 されたことを特徴とする、請求項１に記載の放熱装置としている。 請求項５の考案は、前記上主体と下主体の一側辺にバキュームパイプが設置さ れ、且つバキュームパイプの一端と放熱装置内部の密閉空間が連通し、別端が密 閉状態とされたことを特徴とする、請求項１に記載の放熱装置としている。 請求項６の考案は、前記上主体と下主体の一側辺に中空管柱が設置され、且つ 該中空管柱の二端が放熱装置内部の密閉空間と連通することを特徴とする、請求 項１に記載の放熱装置としている。 請求項７の考案は、前記上主体と下主体が銅、アルミ或いはその合金のいずれ かで形成されたことを特徴とする、請求項１に記載の放熱装置としている。 The invention according to claim 1 is a heat radiating device, wherein the upper main body is accommodated inside the annular lower wall, a closed space is formed inside the upper main body and the lower main body, and the upper main body has four peripheral portions. A communication gap is formed between the edge and the lower wall of the lower body, and the lower body is filled with a solder material, and the upper body and the lower body are soldered and integrated. The working fluid filled in the enclosed space of the upper and lower main bodies, and the porous structure, which is provided on the inner surface of the closed space of the upper main body and the lower main body, increases the heat conduction speed and the adsorption of the working fluid vapor A heat radiating device comprising: the above-mentioned porous structure; In the invention of claim 2, the upper body is housed inside the lower wall of the lower body, and the upper body is provided with an upper wall extending downward, and the extending portion extends outward from the bottom of the upper wall. An annular communicating gap depressed inward is formed between the edge of the extending portion and the lower wall of the lower main body, and the gap is filled with a solder material, and the upper main body and the lower main body are soldered and integrated. The heat radiating device according to claim 1, wherein the heat radiating device is joined to the heat radiating device. According to a third aspect of the present invention, the porous structure comprises sintering the metal powder on the inner surface of the upper main body and the lower main body, and sintering the metal powder in a vacuum or a reducing gas or inert gas environment. 2. The heat radiating device according to claim 1, wherein the metal powder is composed of one of copper powder, nickel powder, silver powder, and a mixture or alloy powder thereof. The invention according to claim 4 is the heat radiating device according to claim 1, wherein the porous structure is formed by roughening the inner surfaces of the upper main body and the lower main body. In the invention of claim 5, a vacuum pipe is installed on one side of the upper main body and the lower main body, one end of the vacuum pipe communicates with a closed space inside the heat radiating device, and the other end is closed. The heat radiating device according to claim 1, wherein: The invention according to claim 6 is characterized in that a hollow tube is installed on one side of the upper body and the lower body, and two ends of the hollow tube communicate with a closed space inside the heat radiating device. The heat dissipation device according to claim 1. The invention according to claim 7 is the heat radiating device according to claim 1, wherein the upper main body and the lower main body are formed of one of copper, aluminum, and an alloy thereof.
【０００７】[0007]
図２、３に示されるのは、本考案の具体的実施例の斜視図、断面図であり、そ の放熱装置２０は伝熱しやすい金属材料（例えば、銀、銅、アルミ及びその合金 等）で製造され、この放熱装置２０は上主体２２と下主体２１で組成され、放熱 装置２０内部に密閉空間が形成され、該放熱装置２０が吸熱面２１２で電子製品 １４の上に緊密に当接し、並びに上主体２２の表面により熱エネルギーを空気中 に伝導し、該電子製品１４の作業時に発生する熱エネルギーを排除する。本実施 例中の電子製品１４はＣＰＵとされ、別に上述の放熱装置２０は密閉空間を具え 、その密閉空間内部に多孔構造２４と作業流体２３が設けられ、上述の多孔構造 ２４は金属粉末（銅粉、ニッケル粉、銀粉、及びその混合物或いは合金粉等）を 放熱装置２０の密閉空間内部に焼結するか或いは該密閉空間内部の表面を粗化し て形成され、その目的は、熱伝導の面積を増加することにあり、毛細管現象を利 用して作業流体２３の発生する蒸気を吸着し、作業流体２３の気−液相変化の循 環使用を加速する。 2 and 3 are a perspective view and a cross-sectional view of a specific embodiment of the present invention. The heat radiating device 20 is made of a metal material (for example, silver, copper, aluminum and its alloy) that easily conducts heat. The heat radiating device 20 is composed of an upper main body 22 and a lower main body 21, a closed space is formed inside the heat radiating device 20, and the heat radiating device 20 closely contacts the electronic product 14 at the heat absorbing surface 212. In addition, the heat energy is conducted into the air by the surface of the upper main body 22 and the heat energy generated when the electronic product 14 is operated is eliminated. The electronic product 14 in the present embodiment is a CPU, and the above-mentioned heat radiating device 20 is separately provided with a closed space, and a porous structure 24 and a working fluid 23 are provided in the closed space. Copper powder, nickel powder, silver powder, and mixtures or alloy powders thereof) are formed by sintering or roughening the surface of the enclosed space of the heat radiating device 20. In order to increase the area, the vapor generated by the working fluid 23 is adsorbed by utilizing the capillary phenomenon, and the cyclic use of the gas-liquid phase change of the working fluid 23 is accelerated.
【０００８】 上述の多孔構造２４は金属粉末を焼結してなり、即ち焼結された金属粉末の半 径は以下の公式により獲得される。 １．ｒc ＝（４σ／△Ｐ）ｃｏｓγ／２ ｒc ：有効孔径（ｒａｄｉｕｓ ｏｆ ｃａｐｉｌｌａｒｙ） σ： 表面張力係数（ｓｕｒｆａｃｅ ｔｅｎｓｉｏｎ ｃｏｅｆｆｉｃ ｉｅｎｔ） △Ｐ： 毛細管作用力（ｐｒｅｓｓｕｒｅ ｄｒｏｐ‘ γ： 湿潤角（ｗｅｔｔｉｎｇ ａｎｇｌｅ） ２．ｒ＝ｒc ／ｃ（ｃは常数、それは焼結の金属粉末の形状により定められ、 一般には０．４１とされる） ｒ： 金属粉末半径（ｒａｄｉｕｓ ｏｆ ｐｏｗｄｅｒ）The above-described porous structure 24 is made by sintering a metal powder, that is, the radius of the sintered metal powder is obtained by the following formula. 1. r c = (4σ / △ P) cos γ / 2 r c : effective pore diameter σ: surface tension coefficient ΔP: capillary action force (wet angle) ) 2.r = r c / c ( c is constant, it is defined by the shape of the metal powder sintering, typically it is 0.41) r: metal powder radius (radius of powder)
【０００９】 さらに、その下主体２１に設置される多孔構造２４は電子製品１４の発生する 熱エネルギーを快速且つ均一に作業流体２３に伝導し、この焼結された金属粉末 は作業流体２３に容易に核沸騰する特性を持たせる。また、該多孔構造２４の厚 さは焼結された金属粉末の半径の２〜１０倍とされ、作業流体２３の充填量は金 属粉末孔率の０．５〜２倍とされる。このほか、該作業流体２３は潜熱が高く且 つ沸点の低い液体、例えば、水、エタノール、アセトン或いは冷媒で組成され、 多孔構造２４は放熱面積を増加して熱量交換を加速し、並びに毛細管現象を利用 し蒸発した作業流体２３を吸着し、さらに冷却して下主体２１の上表面に流して 戻す。Further, the porous structure 24 installed in the lower main body 21 quickly and uniformly conducts the heat energy generated by the electronic product 14 to the working fluid 23, and the sintered metal powder is easily transferred to the working fluid 23. Has the characteristic of nucleate boiling. The thickness of the porous structure 24 is 2 to 10 times the radius of the sintered metal powder, and the filling amount of the working fluid 23 is 0.5 to 2 times the metal powder porosity. In addition, the working fluid 23 is composed of a liquid having a high latent heat and a low boiling point, for example, water, ethanol, acetone, or a refrigerant. The porous structure 24 increases the heat radiation area to accelerate heat exchange, and also causes capillary action. The evaporating working fluid 23 is adsorbed by using the liquid, and is further cooled and flown back to the upper surface of the lower main body 21.
【００１０】 上述の放熱装置２０中、下主体２１は下側壁２１１を具え、上主体２２の下表 面と下主体２１の上表面の支持部２７は対応設置され、上主体２２の四周がはん だ材料２５で下主体２１の環状下側壁２１１の内側にはんだ付けされ、これによ り本考案の放熱装置２０の密閉空間構造が強化される。別に、二つの支持部２７ にも多孔構造２４が設けられることにより、全体の放熱面積が増加される。この ほか、電子製品１４の作業時に発生する熱エネルギーが直接吸熱面２１２より作 業流体２３中に伝導される。別にその二つの支持部２７は多孔性材質とされ得て 、且つ二つの支持部２７の表面の該多孔構造２４に被覆される部分が、作業流体 ２３の蒸気を容易に凝結させ並びにその相変化の循環を加速される機能を有する 。ゆえに、上述の多孔構造２４は必ずしも均一に該二つの支持部２７の表面を被 覆せず、該作業流体２３の相変化の状況及び放熱装置２０の密閉空間構造の必要 な強度により定められる。一般には、作業流体２３の蒸気の最も密集する或いは 温度が最高の部分は、その多孔構造２４の空孔率が比較的高い。In the above-described heat radiating device 20, the lower main body 21 has a lower side wall 211, and the lower surface of the upper main body 22 and the support portion 27 on the upper surface of the lower main body 21 are installed so as to correspond to each other. The solder material 25 is soldered to the inside of the annular lower side wall 211 of the lower main body 21, thereby strengthening the closed space structure of the heat dissipation device 20 of the present invention. Separately, by providing the porous structure 24 also on the two support portions 27, the entire heat radiation area is increased. In addition, heat energy generated during the operation of the electronic product 14 is directly transmitted to the working fluid 23 from the heat absorbing surface 212. Alternatively, the two support portions 27 can be made of a porous material, and the portion of the surface of the two support portions 27 covered with the porous structure 24 can easily condense the vapor of the working fluid 23 and change its phase. Has the function of accelerating the circulation of Therefore, the above-described porous structure 24 does not necessarily uniformly cover the surfaces of the two support portions 27, and is determined by the state of the phase change of the working fluid 23 and the required strength of the closed space structure of the heat dissipation device 20. Generally, the most dense or hottest portion of the working fluid 23 vapor has a relatively high porosity in its porous structure 24.
【００１１】 下側壁２１１が外向きに傾斜状を呈し、並びに上主体２２の四周縁側面と連通 状の間隙２６を形成し、この連通状の間隙２６がはんだ材料２５（例えば銀ベー ス、銅ベース、ニッケルベース或いは錫ベースのはんだ材料）をその内部に収容 し、上主体２２と下主体２１が密着し且つ加熱された後、該放熱装置２０がしっ かりと成形されるが、放熱装置２０の密閉空間内部で金属粉末を焼結したい時は 高温下で行う必要があり、金属粉末或いは放熱装置２０が高温下で非常に容易に 酸化物を形成し、ゆえに、本考案はさらに真空にあって、気体（例えば水素ガス ）を還元するか、或いは慣性ガス（例えば窒素ガス或いはアルゴンガス）環境下 で焼結して得られる。The lower side wall 211 has an outwardly inclined shape, and forms a communication gap 26 with the four peripheral side surfaces of the upper main body 22. The communication gap 26 is formed by the solder material 25 (for example, silver-based, copper-based). After the upper main body 22 and the lower main body 21 are closely contacted and heated, the heat radiating device 20 is firmly formed. When it is desired to sinter the metal powder inside the enclosed space, the sintering must be performed at a high temperature, and the metal powder or the heat radiating device 20 can easily form an oxide at a high temperature. (For example, hydrogen gas) or by sintering in an inert gas (for example, nitrogen gas or argon gas) environment.
【００１２】 さらに、上主体２２と下主体２１が結合された後、必ず先に作業流体２３を放 熱装置２０の密閉空間内部に注入し、さらにバキュームパイプ２８を利用し、放 熱装置２０内部の空気を抽出し、その内部の真空状態に接近させ、該作業流体２ ３の沸点を下げ、且つその液−気相間の変換を加速する。放熱装置２０内部に近 似真空状態が形成されるのを待って、バキュームパイプ２８を密封し、さらに余 分のバキュームパイプ２８を切除する。Further, after the upper main body 22 and the lower main body 21 are connected, the working fluid 23 is always injected into the closed space of the heat discharging device 20 first, and further, the inside of the heat discharging device 20 is Of the working fluid 23, lowering the boiling point of the working fluid 23 and accelerating the liquid-gas phase conversion. After the approximate vacuum state is formed inside the heat dissipation device 20, the vacuum pipe 28 is sealed, and the remaining vacuum pipe 28 is cut off.
【００１３】 別に、図４に示されるのは、本考案のもう一つの実施例の断面図であり、その 上主体２２の下表面と下主体２１の上表面間の支持部２７は交錯状に設立されて いる。FIG. 4 is a cross-sectional view of another embodiment of the present invention, in which a support portion 27 between the lower surface of the upper body 22 and the upper surface of the lower body 21 is intersected. It has been established.
【００１４】 図５は本考案のさらに一つの実施例の放熱装置の斜視図であり、そのうち放熱 装置２０の一側にＵ形中空管柱２９が設けられ、該中空管柱２９の二端が放熱装 置２０の密閉空間内部と連通し、こうして、作業流体２３の蒸気が該中空管柱２ ９中に進入し、並びに冷却し且つ該放熱装置２０の密閉空間内部に戻る。さらに 、該中空管柱２９の上方或いは下方にファンを設置可能で（図示せず）、これに より作業流体２３の冷却を加速できる。FIG. 5 is a perspective view of a heat radiating device according to another embodiment of the present invention, in which a U-shaped hollow tube post 29 is provided on one side of the heat radiating device 20, and two of the hollow tube posts 29 are provided. The end communicates with the interior of the enclosed space of the heat radiating device 20, so that the vapor of the working fluid 23 enters the hollow tube column 29, cools and returns to the interior of the enclosed space of the heat radiating device 20. Further, a fan can be installed above or below the hollow tube post 29 (not shown), whereby the cooling of the working fluid 23 can be accelerated.
【００１５】 図２、３に示されるように、本考案の放熱装置２０がいかに放熱を加速するか のメカニズムについて説明を行う。まず、吸熱面２１２と電子製品１４を利用し 、その熱エネルギーを放熱装置２０の作業流体２３に伝導し、即ちいわゆる蒸発 端であり、作業流体２３は熱エネルギー伝導により徐々に温度を上昇させ蒸発す る。本考案の放熱装置２０の内部は真空状態に接近し、作業流体２３の沸点は常 圧下より低く、そのうち、該放熱装置２０の内部圧力は１００ｔｏｒｒから１０ −３ｔｏｒｒの間とされる。水であれば、圧力が７６０ｔｏｒｒ（−大気圧）で ある時、その沸点は１００℃で、圧力が５５ｔｏｒｒに下がると、その沸点は４ ０℃に下がる。このため、該放熱装置２０内部の圧力が下がると、作業流体２３ の蒸発速度が加速する。作業流体２３が蒸発した後、その蒸気は上主体２２の上 部に到達し（図３の中空矢印に示されるとおり）、さらに液体の潜熱現象により 熱エネルギーが上主体２２に伝導され、更に熱エネルギーが空気中に伝導されて 降温の目的を達成する。別に、作業流体２３の蒸気が潜熱現象により熱量が奪わ れて凝結し液体となり、そのうち、大部分の作業流体２３の蒸気は多孔構造２４ の毛細管現象により吸着され、並びに冷却されて蒸発端に戻り、図３に示される 実心矢印のように、少部分の冷却した作業流体２３が二つの支持部２７に沿って 流れ落ち、こうして、有効に放熱装置２０の温度が最高の中間部分の熱エネルギ ーを空気中に伝導する。ゆえに、本考案は作業流体２３の気−液相変換の循環に より、電子製品１４の迅速な放熱の目的を達成する。As shown in FIGS. 2 and 3, the mechanism of how the heat radiating device 20 of the present invention accelerates heat radiation will be described. First, the heat energy is transmitted to the working fluid 23 of the heat radiating device 20 by using the heat absorbing surface 212 and the electronic product 14, that is, a so-called evaporating end. You. The inside of the heat radiating device 20 of the present invention approaches a vacuum state, and the boiling point of the working fluid 23 is lower than normal pressure, and the internal pressure of the heat radiating device 20 is between 100 torr and 10 -3 torr. In the case of water, the boiling point is 100 ° C. when the pressure is 760 torr (−atmospheric pressure), and the boiling point is reduced to 40 ° C. when the pressure is reduced to 55 torr. Therefore, when the pressure inside the heat radiating device 20 decreases, the evaporation speed of the working fluid 23 increases. After the working fluid 23 evaporates, the vapor reaches the upper part of the upper main body 22 (as shown by the hollow arrow in FIG. 3), and the thermal energy is transmitted to the upper main body 22 by the latent heat phenomenon of the liquid, and the heat is further increased. Energy is transferred into the air to achieve the purpose of cooling. Separately, the steam of the working fluid 23 is deprived of heat by the latent heat phenomenon to condense and become a liquid, and most of the steam of the working fluid 23 is adsorbed by the capillary action of the porous structure 24, and is cooled and returned to the evaporation end. As shown by the solid arrows in FIG. 3, a small portion of the cooled working fluid 23 flows down along the two support portions 27, and thus the heat energy of the middle portion where the temperature of the radiator 20 is effectively the highest is effectively obtained. To the air. Therefore, the present invention achieves the purpose of rapid heat dissipation of the electronic product 14 by circulating the gas-liquid phase conversion of the working fluid 23.
【００１６】 図６に示されるのは、本考案の第４実施例の放熱装置の断面図である。その放 熱装置２０はさらに鰭片セット３０とファン４０を具えて放熱効率を増加してい る。本実施例では、該ファン４０は鰭片セット３０の上方に設置されて、放熱装 置２０が鰭片セット３０に伝導する熱エネルギーは直接空気中に伝導され、該鰭 片セット３０ははんだ材料例えば銀ベースはんだ材料により上主体２２の上表面 に固着される。FIG. 6 is a sectional view of a heat radiating device according to a fourth embodiment of the present invention. The heat dissipation device 20 further includes a fin piece set 30 and a fan 40 to increase heat dissipation efficiency. In this embodiment, the fan 40 is installed above the fin set 30, the heat energy transmitted from the radiator 20 to the fin set 30 is directly conducted into the air, and the fin set 30 is formed of a solder material. For example, it is fixed to the upper surface of the upper main body 22 by a silver base solder material.
【００１７】 図７に示されるのは本考案の第５実施例の断面図であり、該放熱装置２０は上 主体２２と下主体２１を具え、該下主体２１の寸法は上主体２２より大きく、そ のうち該上主体２２の上側壁２２１は延伸部２２１１を具え、該延伸部２２１１ の辺縁と下主体２１の下側壁２１１内側の間に間隙２６があり、上主体２２、下 主体２１がはんだ付けされる時、僅かにはんだ材料２５を上側壁２２１の延伸部 ２２１１に置けば、温度が上昇する時、はんだ材料２５が溶融して該間隙２６内 に流入し、こうして簡単に上主体２２と下主体２１を接合して一体となすことが できる。FIG. 7 is a sectional view of a fifth embodiment of the present invention, in which the heat radiating device 20 has an upper body 22 and a lower body 21, and the size of the lower body 21 is larger than that of the upper body 22. An upper wall 221 of the upper main body 22 has an extension 2211, and a gap 26 is provided between an edge of the extension 2211 and an inner side of the lower wall 211 of the lower main body 21. When the solder material is soldered, if the solder material 25 is slightly placed on the extending portion 2211 of the upper side wall 221, when the temperature rises, the solder material 25 melts and flows into the gap 26, and thus the upper body can be easily removed. 22 and the lower main body 21 can be joined to be integrated.
【００１８】[0018]
総合すると、本考案の放熱装置は使用時に、確実にその機能と目的を達成し、 ゆえに本考案は実用性に優れた考案であり、実用新案登録の要件を具備している 。なお、本考案に基づきなしうる細部の修飾或いは改変は、いずれも本考案の請 求範囲に属するものとする。 Taken together, the heat radiator of the present invention reliably achieves its function and purpose at the time of use, and therefore the present invention is a device with excellent practicality and has the requirements for registration of a utility model. Any modification or alteration of details that can be made based on the present invention shall fall within the scope of the present invention.
【図１】周知の放熱装置の断面図である。FIG. 1 is a cross-sectional view of a known heat dissipation device.
【図２】本考案の実施例の斜視図である。FIG. 2 is a perspective view of the embodiment of the present invention.
【図３】本考案の実施例の断面図である。FIG. 3 is a sectional view of the embodiment of the present invention.
【図４】本考案のもう一つの実施例の断面図である。FIG. 4 is a cross-sectional view of another embodiment of the present invention.
【図５】本考案のさらにもう一つの実施例の放熱装置の
斜視図である。FIG. 5 is a perspective view of a heat radiating device according to still another embodiment of the present invention.
【図６】本考案の第４実施例の放熱装置の断面図であ
る。FIG. 6 is a sectional view of a heat radiating device according to a fourth embodiment of the present invention.
【図７】本考案の第５実施例の放熱装置の断面図であ
る。FIG. 7 is a sectional view of a heat radiating device according to a fifth embodiment of the present invention.
１０ 放熱装置 １１ ファン １３ 鰭片セ
ット １２ 放熱主体 １４ 電子製
品 ２０ 放熱装置 ２１ 下主体 ２４ 多孔構
造 ２１１ 下側壁 ２５ はんだ
材料 ２１２ 吸熱面 ２６ 間隙 ２２ 上主体 ２７ 支持部 ２２１ 上側壁 ２８ バキュ
ームパイプ ２２１１ 延伸部 ２９ 中空管
柱 ２３ 作業流体 ３０ 鰭片セット ４０ ファンDESCRIPTION OF SYMBOLS 10 Heat radiator 11 Fan 13 Fin piece set 12 Heat radiator 14 Electronic product 20 Heat radiator 21 Lower main body 24 Porous structure 211 Lower wall 25 Solder material 212 Heat absorbing surface 26 Gap 22 Upper main body 27 Support part 221 Upper side wall 28 Vacuum pipe 2211 Extension part 29 Hollow tube post 23 Working fluid 30 Fin set 40 Fan
Claims (7)
し、上主体と下主体内部に密閉空間を形成し、且つ上主
体の四周辺縁と下主体の下側壁間に連通状の間隙が形成
され、この間隙内にはんだ材料が充填されて上主体と下
主体がはんだ付けされて一体とされる、上記下主体と、 該上主体と下主体の密閉空間内に充填される作業流体
と、 多孔構造とされ、上主体と下主体の密閉空間の内部表面
に設けられて熱伝導速度と作業流体の蒸気の吸着を増加
する、上記多孔構造と、 を具えたことを特徴とする、放熱装置。1. A heat radiating device comprising a lower main body, an upper main body accommodated inside an annular lower wall, a closed space formed inside the upper main body and the lower main body, and four peripheral edges of the upper main body and a lower main body. A communicating gap is formed between the lower walls of the main body, and the gap is filled with a solder material, and the upper main body and the lower main body are soldered and integrated to form the lower main body, the upper main body and the lower main body. A working fluid to be filled in the closed space of the porous structure, which is provided on the inner surface of the closed space of the upper main body and the lower main body to increase heat conduction speed and adsorption of vapor of the working fluid, A heat radiating device comprising:
され、且つ上主体に下向きに延伸された上側壁が設けら
れ、並びに上側壁底部より外向きに延伸部が延伸され、
該延伸部の辺縁と下主体の下側壁の間に内に凹んだ環状
の連通状の間隙が形成され、この間隙にはんだ材料が充
填されて上主体と下主体がはんだ付けされて一体に接合
されることを特徴とする、請求項１に記載の放熱装置。2. The upper main body is housed inside a lower wall of a lower main body, and an upper side wall extending downward is provided on the upper main body, and an extending portion extends outward from a bottom of the upper side wall,
An annular communicating gap depressed inward is formed between the edge of the extending portion and the lower wall of the lower main body, and the gap is filled with a solder material, and the upper main body and the lower main body are soldered and integrally formed. The heat dissipation device according to claim 1, wherein the heat dissipation device is joined.
体の内部表面において焼結し、且つ金属粉末を真空或い
は還元気体或いは慣性気体環境下で焼結してなり、該金
属粉末が、銅粉、ニッケル粉、銀粉、及びその混合物或
いは合金粉末のいずれかで組成されたことを特徴とす
る、請求項１に記載の放熱装置。3. The porous structure comprises sintering a metal powder on the inner surface of an upper main body and a lower main body, and sintering the metal powder in a vacuum or a reducing gas or inert gas environment. The heat radiator according to claim 1, wherein the heat radiator is made of one of copper powder, nickel powder, silver powder, and a mixture or alloy powder thereof.
面を粗くして形成されたことを特徴とする、請求項１に
記載の放熱装置。4. The heat dissipation device according to claim 1, wherein the porous structure is formed by roughening the inner surfaces of an upper main body and a lower main body.
ムパイプが設置され、且つバキュームパイプの一端と放
熱装置内部の密閉空間が連通し、別端が密閉状態とされ
たことを特徴とする、請求項１に記載の放熱装置。5. A vacuum pipe is installed on one side of the upper main body and the lower main body, one end of the vacuum pipe communicates with a closed space inside the heat radiating device, and another end is closed. The heat radiating device according to claim 1, wherein
が設置され、且つ該中空管柱の二端が放熱装置内部の密
閉空間と連通することを特徴とする、請求項１に記載の
放熱装置。6. A hollow tube column is provided on one side of the upper main body and the lower main body, and two ends of the hollow column communicate with a closed space inside the heat dissipation device. Item 2. A heat dissipation device according to Item 1.
その合金のいずれかで形成されたことを特徴とする、請
求項１に記載の放熱装置。7. The heat radiating device according to claim 1, wherein the upper main body and the lower main body are formed of one of copper, aluminum, and an alloy thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001007937U JP3086774U (en) | 2001-12-06 | 2001-12-06 | Heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001007937U JP3086774U (en) | 2001-12-06 | 2001-12-06 | Heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP3086774U true JP3086774U (en) | 2002-07-05 |
Family
ID=43238151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001007937U Expired - Fee Related JP3086774U (en) | 2001-12-06 | 2001-12-06 | Heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3086774U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022146226A1 (en) * | 2020-12-30 | 2022-07-07 | Razer (Asia-Pacific) Pte. Ltd. | Vapor chamber having a reservoir |
-
2001
- 2001-12-06 JP JP2001007937U patent/JP3086774U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022146226A1 (en) * | 2020-12-30 | 2022-07-07 | Razer (Asia-Pacific) Pte. Ltd. | Vapor chamber having a reservoir |
| AU2020483756A1 (en) * | 2020-12-30 | 2023-08-17 | Razer (Asia-Pacific) Pte. Ltd. | Vapor chamber having a reservoir |
| CN116635686A (en) * | 2020-12-30 | 2023-08-22 | 雷蛇(亚太)私人有限公司 | Vapor chamber with reservoir |
| CN116635686B (en) * | 2020-12-30 | 2024-02-09 | 雷蛇(亚太)私人有限公司 | Vapor chamber with reservoir |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20030136550A1 (en) | Heat sink adapted for dissipating heat from a semiconductor device | |
| US5694295A (en) | Heat pipe and process for manufacturing the same | |
| US8737071B2 (en) | Heat dissipation device | |
| US20100188818A1 (en) | Heat dissipating device and method of manufacturing the same | |
| TW200427962A (en) | Vapor augmented heatsink with multi-wick structure | |
| CN111863746B (en) | Heat abstractor, circuit board and electronic equipment | |
| US20110088873A1 (en) | Support structure for flat-plate heat pipe | |
| WO1999034438A1 (en) | Heat sink | |
| CN211373312U (en) | Vapor chamber and capillary sheet thereof | |
| TW200941195A (en) | Heat dissipation apparatus and heat pipe thereof | |
| CN110763062A (en) | Heat conduction and heat dissipation integrated flat heat pipe | |
| JP5112374B2 (en) | Heat dissipating device for electronic equipment and manufacturing method thereof | |
| TWI819157B (en) | Ultra-thin vapor chamber and manufacturing method thereof | |
| CN216818326U (en) | High-power chip efficient heat dissipation cooling device | |
| WO2021073492A1 (en) | Vacuum soaking plate with supporting structure and terminal | |
| JP3086493U (en) | Heat dissipation device | |
| JP3086774U (en) | Heat dissipation device | |
| CN211297499U (en) | Ultrathin vapor chamber with composite liquid absorption core structure | |
| CN112702899A (en) | Ultrathin soaking plate based on self-wetting fluid as working solution and application | |
| JPH11317482A (en) | Heat sink | |
| CN214177905U (en) | Ultrathin soaking plate based on self-wetting fluid as working solution | |
| CN211527184U (en) | Heat conduction and heat dissipation integrated flat heat pipe | |
| CN100360888C (en) | Cylindrical heat pipe | |
| JP3413151B2 (en) | heatsink | |
| JPH10227585A (en) | Heat spreader and cooler employing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |