JP3076290B2 - Semiconductor chip pickup apparatus and method - Google Patents
Semiconductor chip pickup apparatus and methodInfo
- Publication number
- JP3076290B2 JP3076290B2 JP32793097A JP32793097A JP3076290B2 JP 3076290 B2 JP3076290 B2 JP 3076290B2 JP 32793097 A JP32793097 A JP 32793097A JP 32793097 A JP32793097 A JP 32793097A JP 3076290 B2 JP3076290 B2 JP 3076290B2
- Authority
- JP
- Japan
- Prior art keywords
- tape
- semiconductor
- semiconductor chip
- semiconductor chips
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
- H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
Landscapes
- Die Bonding (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、升目状にダイシン
グされるとともに粘着テ−プに貼り付けられ複数の半導
体チップに分割された半導体ウェハから個々の半導体チ
ップを剥がし取る半導体チップのピックアップ装置およ
びその方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip pick-up device for separating individual semiconductor chips from a semiconductor wafer divided into a plurality of semiconductor chips, which is diced in a grid pattern and adhered to an adhesive tape. Regarding the method.
【０００２】[0002]
【従来の技術】通常、半導体装置の素子である半導体チ
ップは、縦横に並べて複数の集積回路領域が形成された
１枚の半導体ウェハから集積回路領域ごとに切断分割さ
れ形成される。このように一個片に分割された半導体チ
ップは、次工程であるダイボンヂング工程によりリード
フレーム等の基体に取り付けられる。2. Description of the Related Art Normally, a semiconductor chip, which is an element of a semiconductor device, is formed by cutting and dividing a single semiconductor wafer having a plurality of integrated circuit regions arranged vertically and horizontally for each integrated circuit region. The semiconductor chip thus divided into single pieces is attached to a base such as a lead frame by a die bonding step which is a next step.
【０００３】ウェハ上に多数形成された半導体チップを
個片に分割し取り出すには、まず、ウェハを粘着シ−ト
に貼り付けた状態でダイシング装置により切断し個々の
チップに分離する。なお、この切断方法には２つの方法
がある。その一つは、半導体チップの厚みの途中まで切
断するハ−フカット方法と、もう一つは、半導体チップ
の厚み分を切断するフルカット方法がある。しかしなが
ら、前者の方法を採用すると、半導体チップを個片に分
離するためのブレーキングという工程が必要になる。In order to divide a large number of semiconductor chips formed on a wafer into individual chips and take them out, first, a wafer is attached to an adhesive sheet and cut by a dicing apparatus to be separated into individual chips. Note that there are two cutting methods. One of them is a half-cut method for cutting a part of the thickness of the semiconductor chip, and the other is a full-cut method for cutting the thickness of the semiconductor chip. However, adopting the former method requires a step of breaking to separate the semiconductor chip into individual pieces.
【０００４】このブレーキング工程は、まず、柔らかい
ものの上に粘着テープに貼り付けられ厚みの途中までダ
イシングされたウェハを枠とともに置き、円柱状の物を
ウェハの上で転がすことで加重をかけ、途中までダイシ
ングされた面から割ることで、ウェハを個々の半導体チ
ップに分割し個片にする。この作業は、専用自動機によ
り行なわれていた。In this breaking step, first, a wafer, which is attached to an adhesive tape on a soft object and diced to a thickness halfway, is placed together with a frame, and a columnar object is rolled on the wafer to apply a weight. The wafer is divided into individual semiconductor chips and divided into individual pieces by dividing the dicing surface halfway. This work was performed by a dedicated automatic machine.
【０００５】図４は従来の半導体チップのピックアップ
方法の一例を説明するためのダイボンディング前の半導
体チップの状態を示す図、図５は従来の半導体チップの
ピックアップ方法の一例を説明するためのシ−ト上に貼
り付けられた半導体チップを示す図である。１個１個に
分離した半導体チップをダイボンディングするために
は、図４に示すように、切断分離された半導体チップ１
３を貼り付けたシ−ト１６を加熱しながら、サポ−トフ
レ−ム１５によりシ−ト１５を約１．５倍に伸張させ
る。このシ−ト１６を拡張させることにより、半導体チ
ップ１３を整列させたまま半導体チップ１３の間隔を拡
げている。FIG. 4 is a diagram showing a state of a semiconductor chip before die bonding for explaining an example of a conventional semiconductor chip pickup method, and FIG. 5 is a view for explaining an example of a conventional semiconductor chip pickup method. FIG. 7 is a diagram showing a semiconductor chip attached on a gate. In order to die-bond the semiconductor chips separated into individual chips, as shown in FIG.
While heating the sheet 16 to which the sheet 3 is attached, the support frame 15 extends the sheet 15 about 1.5 times. By expanding the sheet 16, the interval between the semiconductor chips 13 is increased while the semiconductor chips 13 are aligned.
【０００６】そして、図５に示すように、半導体チップ
１３が貼り付けられているシ−ト１６の裏部を突き上げ
針１４と呼ばれる先端の鋭利な棒で半導体チップ１３の
ほぼ中心を突き上げ、半導体チップ１３の周りが粘着シ
−ト１６から剥がれ、上から下降する吸着コレット１２
で半導体チップを吸着し、ボンディング位置まで移動さ
せ図示していないリ−ドフレ−ムに半導体チップを移載
する。Then, as shown in FIG. 5, the back portion of the sheet 16 to which the semiconductor chip 13 is attached is pushed up, and the center of the semiconductor chip 13 is pushed up by a sharp rod called a needle 14 so that the semiconductor chip 13 is pushed up. The periphery of the chip 13 is peeled off from the adhesive sheet 16 and the suction collet 12 descending from above.
Then, the semiconductor chip is sucked, moved to the bonding position, and mounted on a lead frame (not shown).
【０００７】このように従来の半導体チップのピックア
ップ方法は、ウェハがダイシングされ半導体チップに切
断分離され粘着シ−トに貼り付けられた状態で、枠によ
りシ−トを拡張し、間隔が拡がった状態の半導体チップ
を一つづつコレットにより半導体チップを拾い、リ−ド
フレ−ムに半導体チップを移載していた。As described above, in the conventional semiconductor chip pickup method, the sheet is expanded by the frame and the interval is widened in a state where the wafer is diced, cut and separated into semiconductor chips, and attached to the adhesive sheet. The semiconductor chips in the state are picked up one by one by a collet, and the semiconductor chips are transferred to a lead frame.
【０００８】[0008]
【発明が解決しようとする課題】上述した従来の半導体
チップのピックアップ方法では、半導体チップを貼り付
けシ−トから剥離させるために行う突き上げ針による突
き上げは、半導体チップの一個所に突き上げ力が集中
し、半導体チップを破損してしまうことが多々ある。ま
た、この突き上げ針による損傷は、半導体チップに微小
クラックを生じさせ、その後、半導体装置の組立がすべ
て完了した後に行う選別工程などで不良と判定されると
いう問題があった。さらに、突き上げ針による損傷は、
その突き上げ時点で判別することは非常に困難で、半導
体装置の完成まで気がつかないことが多く、この工程以
降の工数が無駄になるという問題がある。In the conventional method for picking up a semiconductor chip described above, the push-up by the push-up needle for peeling the semiconductor chip from the attaching sheet is concentrated at one place of the semiconductor chip. However, the semiconductor chip is often damaged. Further, the damage caused by the push-up needle causes a minute crack in the semiconductor chip, and thereafter, there is a problem that the semiconductor chip is determined to be defective in a sorting process or the like performed after all the assembly of the semiconductor device is completed. In addition, damage from the push-up needle
It is very difficult to make a determination at the time of the push-up, and it is often not noticed until the completion of the semiconductor device, and there is a problem that man-hours after this step are wasted.
【０００９】一方、ウェハの貼り付けシ−トは、粘着物
質で半導体チップを接着しているため、環境の変化やテ
ープ自体の状態によって、半導体チップの貼り付き強度
が異なる。貼り付き強度が強い場合、突き上げ針による
半導体チップの周りだけを剥離するが、半導体チップの
中心部分が剥離せずピックアップできないことがある。
この場合、突き上げ力を強くし強力に半導体チップを貼
り付けテープから剥離させても、半導体チップの損傷を
より多くするだけである。On the other hand, since the semiconductor chip is bonded to the wafer by an adhesive substance, the bonding strength of the semiconductor chip varies depending on a change in environment or the state of the tape itself. When the sticking strength is strong, only the periphery of the semiconductor chip is peeled off by the push-up needle, but the central portion of the semiconductor chip may not be peeled off and may not be picked up.
In this case, even if the pushing force is increased and the semiconductor chip is strongly peeled off from the adhesive tape, the damage to the semiconductor chip is merely increased.
【００１０】また、ダイシング後に、半導体チップが貼
り付けられたシ−トを専用設備によりブレーキングし半
導体チップを分割しなければならないという煩わしい作
業があるる。しかも、このピックアップ装置とダイシン
グ装置の間にどうしても独立に専用の自動設備が必要と
なる。いずれにしても手作業を必要としていた。In addition, after dicing, there is a troublesome operation in which the sheet to which the semiconductor chip is attached must be broken by a dedicated facility to divide the semiconductor chip. In addition, a dedicated automatic equipment is required independently between the pickup device and the dicing device. In any case, manual work was required.
【００１１】さらに、従来のピックアップ方法では良品
の半導体チップのみコレットで拾い、不良品の半導体チ
ップは検知器によりマ−クを検知しコレットで拾わずシ
−トに残したままにしている。従って、不良品の半導体
チップを廃棄する場合、ごみ分別するために、不良品の
半導体チップをシ−トより手作業で剥がすかあるいは機
械的に除去する処理必要となる。いずれにしても、この
ような作業や処理はコストアップをもたらすという欠点
がある。Further, in the conventional pickup method, only good semiconductor chips are picked up by a collet, and defective semiconductor chips are detected by a detector and are left on the sheet without being picked up by the collet. Therefore, when discarding a defective semiconductor chip, it is necessary to remove the defective semiconductor chip from the sheet manually or mechanically remove the semiconductor chip in order to separate the dust. In any case, there is a disadvantage that such work and processing increase costs.
【００１２】従って、本発明の目的は、突き上げ針によ
る損傷及び半導体チップの粘着テープの粘着強度による
剥離不良を防止するとともに貼り付けテープと不良半導
体チップを分別して廃棄することができかつ途中の手作
業を必要とすることなく自動化される半導体チップのピ
ックアップ装置およびその方法を提供することにある。Accordingly, an object of the present invention is to prevent damage due to a push-up needle and peeling failure due to the adhesive strength of an adhesive tape of a semiconductor chip, and to separate and abandon the adhesive tape from the defective semiconductor chip and to remove the defective semiconductor chip. An object of the present invention is to provide a semiconductor chip pickup device and a method thereof that can be automated without requiring any operation.
【００１３】[0013]
【課題を解決するための手段】本発明の特徴は、縦横に
並べて形成された複数の半導体チップのそれぞれを区画
する線上に切り込みが入れられた半導体ウェハを貼り付
けるテ−プと、このテ−プを走行させ走行方向を変える
ことによって前記半導体ウェハに曲げ力を生じさせこの
曲げ力により前記切り込み部を破断させ前記半導体ウェ
ハを個々の前記半導体チップに分離する送りロ−ラと、
複数の前記半導体チップに切断分離された前記半導体ウ
ェハを被着する前記テ−プが走行する平坦面と該平坦面
と連なり前記テ−プが折り返される湾曲部を有する基台
と、この基台の該湾曲部の湾曲面に前記テ−プを押しつ
け回転することで前記テ−プを折り返させ前記半導体チ
ップを該テ−プから剥がす折り返しロ−ラと、前記テ−
プから剥がされ幅方向に並ぶ複数の半導体チップが前記
湾曲部から乗り移される弾性材の搬送ベルトと、前記搬
送ベルトの幅方向に並ぶ複数の前記半導体チップ間の間
隔を拡げるために前記搬送ベルトを幅を拡張する拡張手
段と、間隔が拡げられた前記半導体チップを吸着し該半
導体チップを搬送するコレットとを備える半導体チップ
のピックアップ装置である。SUMMARY OF THE INVENTION The present invention is characterized in that a tape for attaching a semiconductor wafer having a notch cut on a line dividing each of a plurality of semiconductor chips formed in a matrix is provided. A feed roller for causing a bending force to be generated in the semiconductor wafer by running the tape and changing a running direction to break the cut portion by the bending force to separate the semiconductor wafer into individual semiconductor chips;
A base having a flat surface on which the tape for applying the semiconductor wafer cut and separated into the plurality of semiconductor chips travels, a curved portion connected to the flat surface, and the tape being folded back; A folding roller for pressing the tape against the curved surface of the curved portion to rotate the tape by turning the tape and peeling the semiconductor chip from the tape;
A transfer belt made of an elastic material on which a plurality of semiconductor chips that are peeled off from each other and are arranged in the width direction are transferred from the curved portion; and the transfer belt is used to increase the interval between the plurality of semiconductor chips that are arranged in the width direction of the transfer belt. A semiconductor chip pickup device comprising: an expanding means for expanding the width of the semiconductor chip; and a collet for sucking the semiconductor chip having an increased interval and transporting the semiconductor chip.
【００１４】また、前記拡張手段は、前記搬送ベルトの
裏面から突出する２本の軌条部をはめ込む溝が形成され
る前段のベルトロ−ラと、前記前段のベルトロ−ラの該
溝の間隔より広い前記溝が形成される後段のベルトロ−
ラとを備えることが望ましい。さらに、縦横に並べて形
成された複数の前記半導体チップのそれぞれを区画する
線上に切り込みが入れられた前記半導体ウェハが貼り付
けられる粘着シ−トと該粘着シ−トの外周囲部を保持す
る枠部材を具備する半導体ウェハ貼付部材を載置する載
置面を有し上昇下降する昇降機構と、前記昇降機構の載
置面と端部とで前記半導体ウェハおよび前記粘着シ−ト
と前記テ−プを挟むとともに前記テ−プに空気圧を加え
る加圧室と、前記半導体ウェハの外周囲の前記粘着シ−
トを切り抜くカッタとを備える半導体ウェハ貼付装置を
有することが望ましい。そして、必要に応じて、前記コ
レットによって拾われずに前記搬送ベルトに残る前記半
導体チップが前記搬送ベルトの走行により該搬送ベルト
から落ちて収納される収納箱を備えることである。[0014] The expanding means may include a belt roller at a preceding stage in which a groove for fitting two rails projecting from the back surface of the conveyor belt is formed, and a gap wider than the groove of the belt roller at the preceding stage. Belt roller at the subsequent stage where the groove is formed
It is desirable to provide Furthermore, an adhesive sheet to which the semiconductor wafer, which is cut along a line dividing each of the plurality of semiconductor chips formed side by side, is attached, and a frame which holds an outer peripheral portion of the adhesive sheet. An elevating mechanism having a mounting surface on which a semiconductor wafer attaching member having a member is mounted, and elevating and lowering the semiconductor wafer, the adhesive sheet and the tape on the mounting surface and an end of the elevating mechanism. A pressure chamber for sandwiching a tape and applying air pressure to the tape; and an adhesive seal around the outer periphery of the semiconductor wafer.
It is desirable to have a semiconductor wafer pasting device including a cutter for cutting out the wafer. And, if necessary, a storage box is provided in which the semiconductor chip remaining on the transport belt without being picked up by the collet falls and is stored from the transport belt by running of the transport belt.
【００１５】本発明の他の特徴は、縦横に並べて形成さ
れた複数の前記半導体チップのそれぞれを区画する線上
に切り込みが入れられた半導体ウェハをテ−プに貼り付
け、このテ−プを走行させ送りロ−ラにより走行方向を
変え前記半導体ウェハに曲げ力を生じさせこの曲げ力に
より前記切り込み部を破断させて前記半導体ウェハを個
々の前記半導体チップに分離し、複数の前記半導体チッ
プに切断分離された前記半導体ウェハを被着する前記テ
−プを基台の平坦面に走行させ、該平坦面と連なる前記
基台の端部で折り返して前記テ−プの幅方向に並ぶ複数
の前記半導体チップを前記テ−プから剥がすと同時に前
記テ−プから剥がされた複数の該半導体チップを搬送ベ
ルトに差し渡し、前記端部と連なる下側の湾曲面に折り
返しロ−ラで前記テ−プを押しつけ前記ロ−ラを回転さ
せ前記テ−プを巻き取り、前記搬送ベルトに移載される
前記搬送ベルトの幅方向に並ぶ複数の前記半導体チップ
間の間隔を前記搬送ベルトの幅を拡張して拡げ、間隔が
拡げられた前記半導体チップをコレットで吸着し搬送す
る半導体チップのピックアップ方法である。また、より
自動化をするには、縦横に並べて形成された複数の前記
半導体チップのそれぞれを区画する線上に切り込みが入
れられた前記半導体ウェハを粘着シ−トを介して前記テ
−プに貼り付けることが望ましい。Another feature of the present invention is that a semiconductor wafer having a notch cut on a line dividing each of the plurality of semiconductor chips formed in a matrix is run on the tape, and the tape runs. The running direction is changed by a feed roller to generate a bending force on the semiconductor wafer. The bending force breaks the cut portion to separate the semiconductor wafer into individual semiconductor chips, and cuts the semiconductor wafer into a plurality of semiconductor chips. The tape on which the separated semiconductor wafer is applied is run on a flat surface of a base, and a plurality of the tapes are folded at an end of the base connected to the flat surface and arranged in the width direction of the tape. At the same time as peeling the semiconductor chip from the tape, a plurality of the semiconductor chips peeled from the tape are transferred to a conveyor belt, and the semiconductor chip is folded back on a lower curved surface connected to the end by a roller. The tape is pressed to rotate the roller, the tape is wound up, and the interval between the plurality of semiconductor chips arranged in the width direction of the transport belt transferred to the transport belt is determined by the width of the transport belt. This is a semiconductor chip pickup method in which the semiconductor chip expanded and expanded and the interval is expanded is sucked by a collet and transported. Further, for further automation, the semiconductor wafer, which is cut in a line dividing each of the plurality of semiconductor chips formed vertically and horizontally, is attached to the tape via an adhesive sheet. It is desirable.
【００１６】[0016]
【発明の実施の形態】次ぎに本発明について図面を参照
して説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.
【００１７】図１（ａ）および（ｂ）ならびに（ｃ）は
本発明の一実施の形態における半導体チップのピックア
ップ装置を示す斜視図（ａ）および断面図（ｂ）ならび
に平面図である。このピックアップ装置は、図１に示す
ように、縦横に並べて形成された複数の半導体チップの
それぞれを区画する線上に切り込みが入れられたウェハ
１３ａを貼り付ける貼り付けテ−プ１と、この貼り付け
テ−プ１を走行させ走行方向を９０度変えることによっ
てウェハ１３ａに曲げ力を生じさせこの曲げ力により切
り込み部を破断させウェハ１３ａを個々の半導体チップ
１３に分離する送りロ−ラ６ａ，６ｂと、複数の半導体
チップ１３に切断分離されたウェハ１３ａを被着する貼
り付けテ−プが走行する平坦面と該平坦面と連なり貼り
付けテ−プ１が折り返される湾曲部３を有する基台２
と、この基台２の湾曲部３の湾曲面３ａに貼り付けテ−
プ１を押しつけ回転することで貼り付けテ−プ１を折り
返させ半導体チップ１３を貼り付けテ−プから剥がす折
り返しロ−ラ４と、貼り付けテ−プ１から剥がされ幅方
向に並ぶ複数の半導体チップ１３が湾曲部３から乗り移
される弾性材の搬送ベルト５と、搬送ベルト５の幅方向
に並ぶ複数の半導体チップ１３間の間隔を拡げるために
搬送ベルト５の幅を拡張する拡張機構と、間隔が拡げら
れた半導体チップ１３を吸着し半導体チップ１３を搬送
する吸着コレット１２とを備えている。FIGS. 1A, 1B, and 1C are a perspective view, a sectional view, and a plan view showing a semiconductor chip pickup device according to an embodiment of the present invention. As shown in FIG. 1, this pickup device includes an attaching tape 1 for attaching a wafer 13a having a notch cut on a line that divides each of a plurality of semiconductor chips formed vertically and horizontally, and this attaching device. By moving the tape 1 and changing the running direction by 90 degrees, a bending force is generated in the wafer 13a, and the cut force is broken by the bending force to separate the wafer 13a into the individual semiconductor chips 13. The feed rollers 6a, 6b And a base having a flat surface on which a bonding tape for applying the wafer 13a cut and separated on the plurality of semiconductor chips 13 runs, and a curved portion 3 connected to the flat surface and on which the bonding tape 1 is folded. 2
And a tape attached to the curved surface 3a of the curved portion 3 of the base 2.
Pressing and rotating the tape 1 causes the adhesive tape 1 to be folded and the semiconductor chip 13 to be peeled off from the adhesive tape, and a plurality of roll rollers 4 to be peeled off from the adhesive tape 1 and arranged in the width direction. A conveyer belt 5 made of an elastic material on which the semiconductor chips 13 are transferred from the curved portion 3, an expansion mechanism for expanding the width of the conveyer belt 5 in order to increase the interval between the plurality of semiconductor chips 13 arranged in the width direction of the conveyer belt 5; And a suction collet 12 for sucking the semiconductor chip 13 having a widened interval and transporting the semiconductor chip 13.
【００１８】また、貼り付けテ−プ１を供給する供給ロ
−ラ１０と、折り返しロ−ラ４から送出される貼り付け
テ−プ１を巻き取る巻き取りロ−ラ７と、不良マ−クを
カメラで認識し搬送ベルト５から吸着コレット１２で拾
い上げられる不良半導体チップが落とし込まれる収納箱
９が設けられている。Further, a supply roller 10 for supplying the adhesive tape 1, a winding roller 7 for winding the adhesive tape 1 sent out from the folding roller 4, and a defective mark A storage box 9 is provided in which a defective semiconductor chip picked up by the suction collet 12 from the conveyor belt 5 and dropped by the camera is recognized by a camera.
【００１９】初段の送りロ−ラ６ｂにより、貼り付けテ
−プ１の走行方向を９０度曲げられウェハ１３ａの切り
込み部で破断し、ウェハ１３ａは半導体チップ１３に分
離されるが、より分離が確実にするためにさらに貼り付
けテ−プ１の走行方向を９０度曲げる送りロ−ラ６ａを
設けている。また、折り返しロ−ラ４は、貼り付けテ−
プ１の接着材のある面を押しているので、例えば、フッ
素系樹脂などのゴム材で接着し難い材質にすることが望
ましい。The traveling direction of the bonding tape 1 is bent by 90 degrees by the feed roller 6b at the first stage, and the tape is broken at the cut portion of the wafer 13a, and the wafer 13a is separated into the semiconductor chips 13, but is separated more. A feeding roller 6a for bending the running direction of the attached tape 1 by 90 degrees is further provided for ensuring. In addition, the folding roller 4 is attached with a sticking tape.
Since a certain surface of the adhesive of the tape 1 is pressed, for example, it is desirable to use a material that is difficult to adhere with a rubber material such as a fluororesin.
【００２０】また、その他の送りローラ６ａ，６ｂおよ
び基台２の材質は、ある程度の硬度を持っとともに静電
気を帯びない材質、例えば、アルミ、ステンレスなど、
しかもビニール系の貼り付けテープ１を送るのに摩擦係
数が低く、表面に酸化膜が出来難い材質が望ましい。The other materials of the feed rollers 6a and 6b and the base 2 are made of a material which has a certain degree of hardness and does not carry static electricity, for example, aluminum, stainless steel, etc.
In addition, a material having a low coefficient of friction for sending the vinyl adhesive tape 1 and having an oxide film hardly formed on the surface is desirable.
【００２１】図２（ａ）および（ｂ）ならびに（ｃ）は
図１の搬送ベルトを抽出して示す斜視図である。次ぎ
に、搬送ベルト５による半導体チップの間隔を拡げる拡
張機構の動作について説明する。図２に示すように、エ
ンドレスの搬送ベルト５の内側に２つの軌条部５ａを形
成する。一方、搬送ベルト５を走行させる前段のロ−ラ
８ａには、軌条部５ａが入り込む間隔の狭い溝１１ａを
形成し、後段のロ−ラ８ｂには、前段のロ−ラ８ａの溝
１１ａの間隔より広い間隔の溝１１ｂを形成する。FIGS. 2A, 2B and 2C are perspective views showing the conveyor belt of FIG. 1 in an extracted manner. Next, the operation of the expansion mechanism for expanding the interval between the semiconductor chips by the transport belt 5 will be described. As shown in FIG. 2, two rail portions 5 a are formed inside the endless transport belt 5. On the other hand, a groove 11a having a narrow interval into which the rail portion 5a enters is formed in the roller 8a at the front stage where the conveyor belt 5 runs, and the groove 11a of the roller 11a at the front stage is formed in the roller 8b at the rear stage. The grooves 11b are formed at intervals larger than the intervals.
【００２２】このように搬送ベルト５の走行を規制する
軌条部５ａとそれがはめ込まれる溝を形成すれば、図１
（ｃ）に示すように、搬送ベルト５は後段のロ−ラ８ｂ
に向け走行するにつれて搬送ベルト５は横方向に伸ばさ
れ、これによって搬送ベルト５に載置された半導体チッ
プ１３の横方向の間隔が拡がる。なお、搬送ベルト５の
表面は摩擦係数の大きく弾性のあるゴムなどの材質で製
作されることが望ましい。If the rail portion 5a for regulating the traveling of the conveyor belt 5 and the groove into which the rail portion 5a is fitted are formed as shown in FIG.
As shown in (c), the conveyor belt 5 is provided with a roller 8b at the subsequent stage.
As the vehicle travels toward the transport belt 5, the transport belt 5 is stretched in the horizontal direction, and thereby, the horizontal spacing of the semiconductor chips 13 placed on the transport belt 5 is increased. The surface of the conveyor belt 5 is desirably made of a material having a large friction coefficient, such as elastic rubber.
【００２３】次ぎに、このピックアップ装置の動作を図
１を参照して説明する。まず、ダイシング装置により半
導体チップを区画する線上に切り込み入れたウェハ１３
ａを貼り付けテ−プ１に貼り付ける。そして、巻き取り
ロ−ラ７を回転させウェハ１３ａを貼り付けた貼り付け
テ−プ１を送りロ−ラ６ｂを乗り越させベ−キングを行
う。このことにより切り込み部でウェハ１３ａが破断さ
れ個々の半導体チップ１３に分離される。Next, the operation of the pickup device will be described with reference to FIG. First, the wafer 13 cut by the dicing device on the line dividing the semiconductor chip
a is pasted on the pasting tape 1. Then, the take-up roller 7 is rotated to feed the tape 1 on which the wafer 13a is pasted, and the roller 6b is passed over to perform baking. As a result, the wafer 13 a is broken at the cut portion and separated into individual semiconductor chips 13.
【００２４】その後の送りにより貼り付けテープ１は、
送りローラ６ａを乗り越えることで確実に半導体チップ
１３に分離する。さらに、貼り付けテープ１が送られ基
台２の上を通り、湾曲部３に至ると、折り返しロ−ラ４
で貼り付けテ−プ１は折り返され半導体チップ１３は貼
り付けテ−プ１から剥離される。剥離された半導体チッ
プ１３は、搬送ベルト５によって搬送される。そし
て、、最初の一列の半導体チップ１３が所定の位置に搬
送されると、搬送ベルト５は一時停止する。この時、前
述したように、半導体チップ１３間は、吸着コレット１
２が隣接する半導体チップ１３に干渉しないように十分
開いている。By the subsequent feeding, the adhesive tape 1 becomes
The semiconductor chip 13 is surely separated by passing over the feed roller 6a. Further, when the adhesive tape 1 is sent and passes over the base 2 to the curved portion 3, the folding roller 4
Then, the attached tape 1 is folded back, and the semiconductor chip 13 is peeled off from the attached tape 1. The separated semiconductor chip 13 is transported by the transport belt 5. Then, when the first row of semiconductor chips 13 is transported to a predetermined position, the transport belt 5 temporarily stops. At this time, as described above, the suction collet 1 is provided between the semiconductor chips 13.
2 is sufficiently open so as not to interfere with the adjacent semiconductor chip 13.
【００２５】次ぎに、カメラで良品として認識された半
導体チップ１３は、吸着コレット１２によって吸着され
次の工程のリ−ドフレ−ムの載置面に送られる。また、
カメラで不良品として認識された半導体チップ１３は、
搬送ベルト５の上に残されたままになり、搬送ベルト５
のステップ送り毎に送られ、やがて搬送ベルト５の先端
部を過ぎると自然に落ち不良品受けの収納箱９に収納さ
れる。Next, the semiconductor chip 13 recognized as a non-defective product by the camera is sucked by the suction collet 12 and sent to the mounting surface of the lead frame in the next step. Also,
The semiconductor chip 13 recognized as a defective product by the camera is
The transfer belt 5 is left on the transfer belt 5,
, And falls naturally after passing the leading end of the conveyor belt 5 and is stored in the storage box 9 for receiving defective products.
【００２６】一方、半導体チップの剥離を終了した貼り
付けテープ１は、巻き取りローラ７で巻き取られる。次
ぎに、搬送ベルト５により次の列の半導体チップ１３が
所定の位置に送られ、前述と同様に吸着コレット１２に
より半導体チップ１３は拾われ次工程に搬送される。こ
のような動作を繰り返して行いウェハ１３ａから半導体
チップ１３に分割分離及び次工程への搬送並びに不良品
の半導体チップの廃棄を自動的におこなっている。On the other hand, the adhesive tape 1 from which the semiconductor chips have been peeled off is wound up by the winding roller 7. Next, the next row of semiconductor chips 13 is sent to a predetermined position by the conveyor belt 5, and the semiconductor chips 13 are picked up by the suction collet 12 and conveyed to the next step as described above. By repeating such an operation, the wafer 13a is divided and separated into the semiconductor chips 13 and transferred to the next step, and the defective semiconductor chips are automatically discarded.
【００２７】このように半導体チップを区画する線上に
切り込み入れたウェハを貼り付けたテープを、半導体チ
ップのピックアップ部よりも前にあるローラでしごくよ
うに摺動させることにより半導体チップを１つ１つ個片
に分離分割することが出来る。また、ステップ送りする
搬送ベルトと吸着コレットで構成される半導体チップの
ピックアップ部と組み合わすことにより、ウェーハを連
続的に処理することが出来、各作業間の無駄な工数が無
くなり総時間が短縮する。The tape to which the wafer cut into the line for dividing the semiconductor chip is adhered is slid with a roller in front of the pickup portion of the semiconductor chip so that the semiconductor chips are separated one by one. It can be separated and divided into individual pieces. In addition, by combining with a conveyor belt for step-feeding and a pickup part of a semiconductor chip composed of a suction collet, wafers can be processed continuously, eliminating unnecessary man-hours between operations and reducing the total time. .
【００２８】また、基台先端の板状にし、半導体チップ
を貼り付けたテープを基台先端部に沿って摺動させるこ
とにより、大きさに関係なく、小さい半導体チップでも
確実に貼り付けテープから剥離させることが出来、半導
体チップの剥離不良を防ぐことが出来る。半導体チップ
を貼り付けたテープを板状の基台先端部とはさみ、半導
体チップを貼り付けたテープを鋭角に折り返すためのロ
ーラーを設けることで、更に確実に半導体チップを貼り
付けテープから剥離することが出来る。Further, by making the tape at the tip of the base and sliding the tape on which the semiconductor chip is stuck along the tip of the base, even a small semiconductor chip regardless of the size can be securely removed from the tape. The semiconductor chip can be separated, and defective separation of the semiconductor chip can be prevented. By sandwiching the tape with the semiconductor chip attached to the tip of the plate-shaped base and providing a roller to fold the tape with the semiconductor chip attached at an acute angle, the semiconductor chip can be more reliably peeled from the adhesive tape. Can be done.
【００２９】さらに、基台先端部側に前記基台先端部か
ら剥離された半導体チップを橋渡しで受領することによ
り、粘着テープの粘着力が強く、半導体チップが剥離し
難い場合でも、確実に剥離させることが出来る。板状の
基台先端で半導体チップを剥離する方法を取ることによ
り、従来、行っていたダイシング後のテープ伸張やウェ
ーハ１枚１枚をフレームリングに貼り付ける必要がなく
なる。Further, by receiving the semiconductor chip peeled off from the base end portion on the base end side by bridging, even if the adhesive force of the adhesive tape is strong and the semiconductor chip is difficult to peel off, the semiconductor chip can be reliably separated. Can be done. By adopting a method of peeling the semiconductor chip at the tip of the plate-like base, it is no longer necessary to extend the tape after dicing and attach each wafer to the frame ring, which has been conventionally performed.
【００３０】そして、貼り付けテープ上にある全てのチ
ップを剥離させ搬送ベルトに移載し、貼り付けテ−プは
リ−ルに巻き取り、良品の半導体チップのみ次工程に搬
送し、不良品の半導体チップのみ搬送ベルトに残し搬送
ベルトの送りによって収納箱に落とし込むので、貼り付
けテ−プと半導体チップを分別して廃棄することが出来
る。Then, all the chips on the adhesive tape are peeled off and transferred to a conveyor belt, the adhesive tape is wound up on a reel, and only a good semiconductor chip is transported to the next step, and a defective semiconductor chip is transferred. Since only the semiconductor chip is left on the conveyor belt and dropped into the storage box by feeding the conveyor belt, the attached tape and the semiconductor chip can be separated and discarded.
【００３１】図３（ａ）および（ｂ）はダイシング後の
ウェハを貼り付けテ−プに貼り付ける装置の動作順に示
す図である。前述の説明では、ダイシング後のウェハの
貼り付けテ−プへの貼り付けは手作業で行ったが、この
実施の形態では図３の装置でウェハを貼り付けテ−プに
ウェハを貼り付けている。FIGS. 3 (a) and 3 (b) are diagrams showing the operation sequence of an apparatus for attaching a wafer after dicing to an attaching tape. In the above description, the attachment of the wafer after dicing to the attachment tape was performed manually, but in this embodiment, the wafer is attached to the attachment tape by using the apparatus shown in FIG. I have.
【００３２】この貼り付け装置は、図３に示すように、
供給ロ−ラ１０と送りロ−ラ６ｂの間にあって貼り付け
テ−プ１の背面側に貼り付けテープ１の背面に接するよ
うに配置される加圧室１７と、この加圧室１７に対向し
貼り付けテ−プ１の表側に配置されるとともに枠１８に
保持された状態でダイシングされたウェハ１３ａをシ−
ト１９を介して載置する押さえブロック２０と、押さえ
ブロック２０を突き上げて加圧室１７とでウェハが貼り
付けられるシ−トと貼り付けテ−プ１を挟み込むエアシ
リンダ２３と、押さえブロック２０の周囲を回転しシ−
トを切断するカッタ２２を備えている。As shown in FIG.
A pressurizing chamber 17 which is located between the supply roller 10 and the feed roller 6b and which is arranged on the back side of the adhesive tape 1 so as to be in contact with the back side of the adhesive tape 1; The wafer 13a diced while being placed on the front side of the bonding tape 1 and held by the frame 18 is sealed.
A press block 20 to be placed via a cover 19; an air cylinder 23 for sandwiching the sheet and the tape 1 to which the wafer is pasted by the press block 20 and the pressurizing chamber 17; Rotate around the sea
The cutter 22 is provided for cutting the blades.
【００３３】次ぎに、この貼り付け装置の動作を説明す
る。まず、ダイシングされたウェハ１３ａがシ−ト１９
に貼り付けられシ−ト１９が枠１８に固定された状態で
ステ−ジ（図示せず）に搬送される。そして、図３
（ａ）に示すように、枠１８付のウェハ１３ａがロボッ
トのチャック（図示せず）により搬送され押さえブロッ
ク２０に載置される。Next, the operation of the pasting device will be described. First, the diced wafer 13a is placed on a sheet 19
The sheet 19 is conveyed to a stage (not shown) while the sheet 19 is fixed to the frame 18. And FIG.
As shown in (a), the wafer 13a with the frame 18 is transported by the chuck (not shown) of the robot and placed on the holding block 20.
【００３４】次ぎに、図３（ｂ）に示すように、エアシ
リンダ２３により押さえブロック２０が上昇し、加圧室
１７の端部と押さえブロック２０の面で貼り付けテ−プ
１とシ−ト１９およびウェハ１３ａとを重ねた状態で挟
み込む。次ぎに、ソレノイド２４が作動しカッタ２２が
シ−ト１９に差し込む、そして、ア−ム２１が押さえブ
ロック２０の周囲を旋回しカッタ２２がウェハ１３ａの
際のシ−ト１９を切り抜く。そして、加圧室１７に圧縮
空気を導入しその圧力で貼り付けテ−プ１にシ−ト１９
を貼り付ける。Next, as shown in FIG. 3 (b), the holding block 20 is raised by the air cylinder 23, and the tape 1 and the sealing tape 1 are attached to the end of the pressurizing chamber 17 and the surface of the holding block 20. And the wafer 19a and the wafer 19a are sandwiched. Next, the solenoid 24 is actuated, the cutter 22 is inserted into the sheet 19, and the arm 21 pivots around the holding block 20 so that the cutter 22 cuts out the sheet 19 at the time of the wafer 13a. Then, compressed air is introduced into the pressurizing chamber 17 and the sheet 19 is attached to the tape 1 by the pressure.
Paste.
【００３５】[0035]
【発明の効果】以上説明したように本発明は、升目に切
り込みが入れられテ−プに貼り付けられたウェハに曲げ
力を与えるテ−プ送り用ロ−ラの２つを設け、ロ−ラの
押し曲げ力によってウェハの切り込み部で破断し多数の
半導体チップに分離し、半導体チップに分離されたウェ
ハを貼り付けたテ−プを平坦な面を走行させ鋭く曲がる
湾曲部でテ−プを折り曲げ返すことによって、接着強度
のばらつきがあっても、従来のように針の突き上げによ
る半導体チップの裏面にきずをつけることなく確実にテ
−プから剥ぎ取ることができ、半導体チップのボンディ
ング時に発生する不良を無くすという効果がある。As described above, according to the present invention, there are provided two tape feeding rollers for applying a bending force to a wafer cut into a square and attached to the tape. The semiconductor wafer is broken at the cut portion of the wafer by the pushing and bending force of the wafer and separated into a large number of semiconductor chips, and the tape on which the wafer separated from the semiconductor chip is adhered runs on a flat surface and is tapered at a sharply curved portion. By folding back, even if the bonding strength varies, the semiconductor chip can be reliably peeled off from the tape without damaging the back surface of the semiconductor chip by pushing up the needle as in the conventional case. This has the effect of eliminating the defects that occur.
【００３６】また、一列に並ぶ半導体チップが湾曲部か
ら移載される搬送ベルトに幅方向に搬送ベルト拡張機構
をもうけることによって、半導体チップに分離されたウ
ェハを貼り付けたシ−トにサポートリフレームを取付て
シ−トの拡張し半導体チップを互いに離間させる作業が
不要となり、工程を短縮できるという効果がある。Further, by providing a conveyor belt extending mechanism in the width direction on a conveyor belt on which semiconductor chips arranged in a row are transferred from a curved portion, a support sheet is attached to a sheet on which a wafer separated from a semiconductor chip is attached. There is no need to attach the frame and extend the sheet to separate the semiconductor chips from each other, which has the effect of shortening the process.
【００３７】さらに、貼り付けテープにウェハを貼り付
けブレーキングし半導体チップに分離する機構と不良品
の分別廃棄および半導体チップの離間させコレットによ
って拾う機構と一体化することによって、従来行ってい
た途中の手作業が無くなり、連続して自動的に出来、大
幅に時間を短縮できるという効果がある。Further, by integrating a mechanism for attaching a wafer to an attaching tape, breaking it and separating it into semiconductor chips, and a mechanism for separating and discarding defective products and separating the semiconductor chips and picking them up by a collet, the conventional mechanism is used. This eliminates the need for manual work, and can be performed automatically and continuously, which has the effect of greatly reducing the time.
【図１】本発明の一実施の形態における半導体チップの
ピックアップ装置を示す斜視図（ａ）および断面図
（ｂ）ならびに平面図である。FIG. 1A is a perspective view, FIG. 1B is a sectional view, and FIG. 1B is a plan view showing a semiconductor chip pickup device according to an embodiment of the present invention.
【図２】図１の搬送ベルトを抽出して示す斜視図であ
る。FIG. 2 is a perspective view extracting and showing the transport belt of FIG. 1;
【図３】ダイシング後のウェハを貼り付けテ−プに貼り
付ける装置の動作順に示す図である。FIG. 3 is a view showing an operation order of an apparatus for attaching a wafer after dicing to an attaching tape.
【図４】従来の半導体チップのピックアップ方法の一例
を説明するためのダイボンディング前の半導体チップの
状態を示す図である。FIG. 4 is a diagram illustrating a state of a semiconductor chip before die bonding for explaining an example of a conventional semiconductor chip pickup method.
【図５】従来の半導体チップのピックアップ方法の一例
を説明するためのシ−ト上に貼り付けられた半導体チッ
プを示す図である。FIG. 5 is a view showing a semiconductor chip attached to a sheet for explaining an example of a conventional semiconductor chip pickup method.
１ 貼り付けテ−プ ２ 基台 ３ 湾曲部 ３ａ 湾曲面 ４ 折り返しロ−ラ ５ 搬送ベルト ５ａ 軌条部 ６ａ，６ｂ 送りロ−ラ ７ 巻き取りローラ ８ａ，８ｂ ロ−ラ ９ 収納箱 １０ 供給ロ−ラ １１ａ，１１ｂ 溝 １２ 吸着コレット １３ 半導体チップ １３ａ ウェハ １４ 突き上げ針 １５ サポ−トフレ−ム １６，１９ シ−ト １７ 加圧室 １８ 枠 ２０ 押さえブロック ２１ ア−ム ２２ カッタ ２３ エアシリンダ ２４ ソレノイド DESCRIPTION OF SYMBOLS 1 Adhesive tape 2 Base 3 Curved part 3a Curved surface 4 Folding roller 5 Conveying belt 5a Rail part 6a, 6b Feeding roller 7 Take-up roller 8a, 8b Roller 9 Storage box 10 Supply roller 11a, 11b Groove 12 Suction collet 13 Semiconductor chip 13a Wafer 14 Pushing needle 15 Support frame 16, 19 sheet 17 Pressurizing chamber 18 Frame 20 Holding block 21 Arm 22 Cutter 23 Air cylinder 24 Solenoid
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/68 H01L 21/301 H01L 21/52 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) H01L 21/68 H01L 21/301 H01L 21/52
Claims (6)
ップのそれぞれを区画する線上に切り込みが入れられた
半導体ウェハを貼り付けるテ−プと、このテ−プを走行
させ走行方向を変えることによって前記半導体ウェハに
曲げ力を生じさせこの曲げ力により前記切り込み部を破
断させ前記半導体ウェハを個々の前記半導体チップに分
離する送りロ−ラと、複数の前記半導体チップに切断分
離された前記半導体ウェハを被着する前記テ−プが走行
する平坦面と該平坦面と連なり前記テ−プが折り返され
る湾曲部を有する基台と、この基台の該湾曲部の湾曲面
に前記テ−プを押しつけ回転することで前記テ−プを折
り返させ前記半導体チップを該テ−プから剥がす折り返
しロ−ラと、前記テ−プから剥がされ幅方向に並ぶ複数
の半導体チップが前記湾曲部から乗り移される弾性材の
搬送ベルトと、前記搬送ベルトの幅方向に並ぶ複数の前
記半導体チップ間の間隔を拡げるために前記搬送ベルト
を幅を拡張する拡張手段と、間隔が拡げられた前記半導
体チップを吸着し該半導体チップを搬送するコレットと
を備えることを特徴とする半導体チップのピックアップ
装置。1. A tape for attaching a semiconductor wafer having a notch cut on a line that divides each of a plurality of semiconductor chips formed in a matrix, and the tape is run to change a running direction. A feed roller for generating a bending force on the semiconductor wafer and breaking the cut portion by the bending force to separate the semiconductor wafer into individual semiconductor chips; and a semiconductor wafer cut and separated into a plurality of the semiconductor chips. A base having a flat surface on which the tape on which the tape runs and a curved portion which is continuous with the flat surface and on which the tape is folded, and the tape on the curved surface of the curved portion of the base. A folding roller for folding the tape by rotating by pressing and peeling the semiconductor chip from the tape, and a plurality of semiconductor chips peeled off from the tape and lined up in the width direction. A conveying belt of an elastic material transferred from the curved portion, and an expanding means for expanding the width of the conveying belt to increase an interval between the plurality of semiconductor chips arranged in the width direction of the conveying belt; And a collet for sucking the semiconductor chip and transporting the semiconductor chip.
から突出する２本の軌条部をはめ込む溝が形成される前
段のベルトロ−ラと、前記前段のベルトロ−ラの該溝の
間隔より広い前記溝が形成される後段のベルトロ−ラと
を備えることを特徴とする請求項１記載の半導体チップ
のピックアップ装置2. The expansion device according to claim 1, wherein the expansion means includes a belt roller at a preceding stage in which a groove for receiving two rails projecting from a back surface of the transport belt is formed, and a gap wider than the groove of the belt roller at the preceding stage. 2. The semiconductor chip pickup device according to claim 1, further comprising a belt roller at a subsequent stage in which said groove is formed.
ップのそれぞれを区画する線上に切り込みが入れられた
前記半導体ウェハが貼り付けられる粘着シ−トと該粘着
シ−トの外周囲部を保持する枠部材を具備する半導体ウ
ェハ貼付部材を載置する載置面を有し上昇下降する昇降
機構と、前記昇降機構の載置面と端部とで前記半導体ウ
ェハおよび前記粘着シ−トと前記テ−プを挟むとともに
前記テ−プに空気圧を加える加圧室と、前記半導体ウェ
ハの外周囲の前記粘着シ−トを切り抜くカッタとを備え
る半導体ウェハ貼付装置を有することを特徴とする請求
項１または請求項２記載の半導体チップのピックアップ
装置。3. An adhesive sheet to which said semiconductor wafer, which is cut on a line dividing each of a plurality of semiconductor chips formed side by side, is attached, and an outer peripheral portion of said adhesive sheet are held. A lifting / lowering mechanism having a mounting surface for mounting a semiconductor wafer attaching member having a frame member to be moved up and down; and a mounting surface and an end portion of the lifting / lowering mechanism, the semiconductor wafer and the adhesive sheet, and A semiconductor wafer sticking device comprising a pressurizing chamber for sandwiching a tape and applying air pressure to the tape, and a cutter for cutting out the adhesive sheet around the semiconductor wafer. The semiconductor chip pickup device according to claim 1 or 2.
送ベルトに残る前記半導体チップが前記搬送ベルトの走
行により該搬送ベルトから落ちて収納される収納箱を備
えることを特徴とする請求項１、請求項２および請求項
３のいずれかに記載する半導体チップのピックアップ装
置。4. The storage device according to claim 1, further comprising a storage box in which the semiconductor chips remaining on the transport belt without being picked up by the collet fall and are stored from the transport belt by the travel of the transport belt. A pickup device for a semiconductor chip according to any one of claims 2 and 3.
体チップのそれぞれを区画する線上に切り込みが入れら
れた半導体ウェハをテ−プに貼り付け、このテ−プを走
行させ送りロ−ラにより走行方向を変え前記半導体ウェ
ハに曲げ力を生じさせこの曲げ力により前記切り込み部
を破断させて前記半導体ウェハを個々の前記半導体チッ
プに分離し、複数の前記半導体チップに切断分離された
前記半導体ウェハを被着する前記テ−プを基台の平坦面
に走行させ、該平坦面と連なる前記基台の端部で折り返
して前記テ−プの幅方向に並ぶ複数の前記半導体チップ
を前記テ−プから剥がすと同時に前記テ−プから剥がさ
れた複数の該半導体チップを搬送ベルトに差し渡し、前
記端部と連なる下側の湾曲面に折り返しロ−ラで前記テ
−プを押しつけ前記ロ−ラを回転させ前記テ−プを巻き
取り、前記搬送ベルトに移載される前記搬送ベルトの幅
方向に並ぶ複数の前記半導体チップ間の間隔を前記搬送
ベルトの幅を拡張して拡げ、間隔が拡げられた前記半導
体チップをコレットで吸着し搬送することを特徴とする
半導体チップのピックアップ方法。5. A semiconductor wafer having a notch cut on a line dividing each of the plurality of semiconductor chips formed in a matrix and attached to a tape, and the tape is run and fed by a feed roller. Changing the running direction to generate a bending force on the semiconductor wafer, breaking the cut portion by the bending force, separating the semiconductor wafer into individual semiconductor chips, and cutting the semiconductor wafer into a plurality of the semiconductor chips; The tape to be coated is run on a flat surface of a base, and a plurality of the semiconductor chips arranged in the width direction of the tape by folding back at an end of the base connected to the flat surface. At the same time as peeling off the tape, the plurality of semiconductor chips peeled off from the tape are transferred to a conveyor belt, and the tape is pressed against a lower curved surface connected to the end portion with a folding roller to press the tape. Rotating a roller to take up the tape, expanding the interval between the plurality of semiconductor chips arranged in the width direction of the transport belt transferred to the transport belt by expanding the width of the transport belt; A method of picking up a semiconductor chip, wherein the semiconductor chip having an increased interval is sucked and transported by a collet.
体チップのそれぞれを区画する線上に切り込みが入れら
れた前記半導体ウェハを粘着シ−トを介して前記テ−プ
に貼り付けることを特徴とする請求項５記載の半導体チ
ップのピックアップ方法。6. A semiconductor wafer having a plurality of semiconductor chips formed side by side and having a cut in a line dividing each of the plurality of semiconductor chips is attached to the tape via an adhesive sheet. The method for picking up a semiconductor chip according to claim 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32793097A JP3076290B2 (en) | 1997-11-28 | 1997-11-28 | Semiconductor chip pickup apparatus and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32793097A JP3076290B2 (en) | 1997-11-28 | 1997-11-28 | Semiconductor chip pickup apparatus and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11163097A JPH11163097A (en) | 1999-06-18 |
| JP3076290B2 true JP3076290B2 (en) | 2000-08-14 |
Family
ID=18204603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32793097A Expired - Fee Related JP3076290B2 (en) | 1997-11-28 | 1997-11-28 | Semiconductor chip pickup apparatus and method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3076290B2 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| EP1302974A3 (en) * | 2001-10-11 | 2004-04-07 | Westvaco Corporation, Alfred H Nissan Technical Center | Chip alignment and placement apparatus for integrated circuit, MEMS, photonic or other devices |
| TWI326626B (en) | 2002-03-12 | 2010-07-01 | Hamamatsu Photonics Kk | Laser processing method |
| EP1635390B1 (en) | 2002-03-12 | 2011-07-27 | Hamamatsu Photonics K. K. | Substrate dividing method |
| JP2004006599A (en) * | 2002-04-01 | 2004-01-08 | Renesas Technology Corp | Manufacture of semiconductor device and manufacturing equipment for semiconductor |
| TWI520269B (en) | 2002-12-03 | 2016-02-01 | Hamamatsu Photonics Kk | Cutting method of semiconductor substrate |
| JP4563097B2 (en) | 2003-09-10 | 2010-10-13 | 浜松ホトニクス株式会社 | Semiconductor substrate cutting method |
| JP4511903B2 (en) * | 2004-10-20 | 2010-07-28 | 株式会社ディスコ | Wafer divider |
| JP4202376B2 (en) * | 2006-08-25 | 2008-12-24 | 株式会社東芝 | Semiconductor device manufacturing apparatus and semiconductor device manufacturing method |
| DE102007046431A1 (en) * | 2007-09-28 | 2008-11-13 | Siemens Ag | Electronic component e.g. semiconductor chip, separating device, has application device for attaching carrier foil at curved surface so that contact surface between foil and components is reduced due to mechanical rigidity of components |
| JP5405266B2 (en) * | 2009-10-27 | 2014-02-05 | シャープ株式会社 | Electronic component conveyor |
| JP5466493B2 (en) * | 2009-12-01 | 2014-04-09 | シチズン電子株式会社 | Semiconductor manufacturing method |
| JP5414486B2 (en) * | 2009-12-01 | 2014-02-12 | シチズン電子株式会社 | Semiconductor manufacturing equipment |
| JP6053132B2 (en) * | 2012-12-07 | 2016-12-27 | リンテック株式会社 | Sheet sticking device and sheet sticking method |
| KR102417917B1 (en) * | 2016-04-26 | 2022-07-07 | 삼성전자주식회사 | Process system and operation method thereof |
| CN106783676B (en) * | 2016-12-08 | 2023-10-27 | 深圳格芯集成电路装备有限公司 | Scraping device for chip on UV film |
| JP6790025B2 (en) * | 2018-05-31 | 2020-11-25 | 古河電気工業株式会社 | Manufacturing method of electronic device processing tape and electronic device processing tape |
| FR3083921B1 (en) * | 2018-07-10 | 2021-03-12 | Commissariat Energie Atomique | STRUCTURE TRANSFER PROCESS |
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1997
- 1997-11-28 JP JP32793097A patent/JP3076290B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11163097A (en) | 1999-06-18 |
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