JP3048727B2 - Reflow resin composition and electronic component - Google Patents
Reflow resin composition and electronic componentInfo
- Publication number
- JP3048727B2 JP3048727B2 JP4010087A JP1008792A JP3048727B2 JP 3048727 B2 JP3048727 B2 JP 3048727B2 JP 4010087 A JP4010087 A JP 4010087A JP 1008792 A JP1008792 A JP 1008792A JP 3048727 B2 JP3048727 B2 JP 3048727B2
- Authority
- JP
- Japan
- Prior art keywords
- reaction
- electronic component
- resin composition
- reflow
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明はリフロー用樹脂組成物に
関するものであり、更に詳しくは赤外線照射、熱風等に
よる加熱によって基板上に半田付けすることのできる電
子部品に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition for reflow, and more particularly to an electronic component which can be soldered on a substrate by infrared irradiation, heating by hot air or the like.
【０００２】[0002]
【従来の技術】電子部品をプリント基板上に固定する方
法として、従来プリント配線基板のスルーホールに電子
部品の端子を挿入した後、このプリント配線基板を半田
浴にディッピングして、部品を固定する方法が利用され
ていた。しかしながら、このような方法では電子部品の
装着密度を高くすると、基板内で回線がショートしやす
い等の問題があり、部品の装着密度をある程度以上に高
くすることはできない。2. Description of the Related Art As a method of fixing an electronic component on a printed circuit board, a terminal of the electronic component is conventionally inserted into a through hole of the printed circuit board, and the printed circuit board is dipped in a solder bath to fix the component. The method was utilized. However, in such a method, if the mounting density of the electronic components is increased, there is a problem that a line is likely to be short-circuited in the substrate, and the mounting density of the components cannot be increased to a certain degree or more.
【０００３】一方、近年、電子機器の小型化、軽量化に
ともない、電子部品の装着密度を向上させることが必要
となっており、このためチップ自体の集積度を高くする
方法が採られてきた。しかし、この方法による実装密度
の向上は既に限界近くまで達成されており、このため最
近ではプリント配線基板面における電子部品の実装密度
を向上させる方向に移行しつつある。On the other hand, in recent years, as electronic devices have become smaller and lighter, it has become necessary to increase the mounting density of electronic components. For this reason, a method of increasing the degree of integration of chips themselves has been adopted. . However, the improvement of the mounting density by this method has already been achieved to near the limit, and for this reason, it is recently shifting to the direction of increasing the mounting density of electronic components on the printed wiring board surface.
【０００４】プリント配線基板表面において部品の実装
密度を向上させる方法として、回路上の電子部品固定予
定箇所に予め半田が点着された基板上に電子部品を仮固
定した後、この基板を赤外線、熱風等の手段により加熱
して半田を溶融させて電子部品を固定する方法（リフロ
ー法）が採用されており、この方法により基板表面にお
ける電子部品の実装密度を向上させることができる。[0004] As a method of increasing the component mounting density on the surface of a printed wiring board, an electronic component is temporarily fixed on a board on which solder is previously spotted at a place where the electronic component is to be fixed on a circuit, and then the board is infrared-rayed. A method of fixing the electronic component by heating by means of hot air or the like to melt the solder (reflow method) is employed, and this method can improve the mounting density of the electronic component on the substrate surface.
【０００５】しかしながら、従来使用されてきた電子部
品は耐熱性が十分とは言えず、特に赤外線加熱によるリ
フロー工程においては、部品表面の温度が、局部的に高
くなるなどの問題があり、より耐熱性に優れた樹脂組成
物及び電子部品が望まれていた。However, conventionally used electronic components cannot be said to have sufficient heat resistance. In particular, in the reflow process by infrared heating, there is a problem that the temperature of the component surface is locally increased. A resin composition and an electronic component having excellent properties have been desired.
【０００６】[0006]
【発明の目的】本発明は上記の如き従来技術の問題点を
解決しようとするものであり、耐熱性に優れ、半田リフ
ロー用として適した樹脂組成物及び電子部品を提供する
ことを目的とする。An object of the present invention is to solve the problems of the prior art as described above, and an object of the present invention is to provide a resin composition and an electronic component having excellent heat resistance and suitable for solder reflow. .
【０００７】[0007]
【発明の構成】すなわち、本発明は下記式（Ｉ），（I
I）及び（III ）That is, the present invention provides the following formulas (I) and (I)
I) and (III)
【０００８】[0008]
【化２】 Embedded image
【０００９】の各成分より実質的に構成され、成分（I
I）と成分（III ）の含有当量比が６０／４０〜９０／
１０であり、かつ３５℃のＰ―クロルフェノール／テト
ラクロルエタン混合溶媒（重量比６０／４０）中にて測
定した固有粘度が０．３〜１．５の範囲内にある芳香族
ポリエステル９５〜３０重量％と、アスペクト比１０以
上の繊維状補強材５〜７０重量％とからなることを特徴
とするリフロー用電子部品のハウジング形成用樹脂組成
物及びこれによって構成される電子部品である。Which is substantially composed of the following components:
The content equivalent ratio of I) to component (III) is 60/40 to 90 /
Aromatic polyesters having an intrinsic viscosity of 0.3 to 1.5 in a P-chlorophenol / tetrachloroethane mixed solvent (weight ratio 60/40) at 35 ° C. A resin composition for forming a housing of an electronic component for reflow, comprising 30% by weight and 5-70% by weight of a fibrous reinforcing material having an aspect ratio of 10 or more, and an electronic component constituted by the same.
【００１０】本発明のリフロー用樹脂組成物を構成する
ポリマーは上記式（Ｉ），（II）及び（III ）の各成分
より実質的になるポリエステルである。成分（II）と成
分（III ）の含有当量比は６０／４０〜９０／１０であ
る。含有当量比がこの範囲外になると、Ｔｍが高すぎて
成形が困難となったり、逆にＴｍが低くなって耐熱性が
不充分となり好ましくない。The polymer constituting the resin composition for reflow of the present invention is a polyester substantially consisting of the components of the above formulas (I), (II) and (III). The equivalent ratio of the components (II) and (III) is from 60/40 to 90/10. If the content equivalent ratio is out of this range, the Tm is too high and molding becomes difficult, or conversely, the Tm becomes low and the heat resistance becomes insufficient, which is not preferable.
【００１１】このポリマーの製造方法は特に制限はない
が、例えば、イソフタル酸ジフェニルエステル、ハイド
ロキノン及び４，４′―ジヒドロキシジフェニルを触媒
の存在下に加熱して重縮合せしめる方法（Ａ）、イソフ
タル酸、ジアセトキシハイドロキノン及び４，４′―ジ
アセトキシジフェニルを触媒の存在下に加熱して重縮合
せしめる方法（Ｂ）、イソフタル酸、ハイドロキノン及
び４，４′―ジヒドロキシジフェニルを置換基を含有し
ていてもよいフェノール及び触媒の存在下に加熱して重
縮合せしめる方法（Ｃ）等を挙げることができる。上記
方法（Ｂ）の場合にはジアセトキシハイドロキノン、
４，４′―ジアセトキシジフェニルを用いるかわりに、
ハイドロキノン、４，４′―ジヒドロキシジフェニルと
無水酢酸とを用いて、重合反応系にて、アセトキシ化反
応を実施することもできる。本発明のポリマーの製造方
法としては上記（Ｃ）の方法を好ましく用いることがで
きる。The method for producing this polymer is not particularly limited. For example, a method (A) in which diphenyl isophthalate, hydroquinone and 4,4'-dihydroxydiphenyl are heated and polycondensed in the presence of a catalyst, Diacetoxyhydroquinone and 4,4'-diacetoxydiphenyl by heating in the presence of a catalyst to effect polycondensation (B), wherein isophthalic acid, hydroquinone and 4,4'-dihydroxydiphenyl contain substituents (C) heating and polycondensation in the presence of a good phenol and a catalyst. In the case of the above method (B), diacetoxyhydroquinone,
Instead of using 4,4'-diacetoxydiphenyl,
An acetoxylation reaction can also be carried out in a polymerization reaction system using hydroquinone, 4,4'-dihydroxydiphenyl and acetic anhydride. As the method for producing the polymer of the present invention, the method (C) can be preferably used.
【００１２】上記方法（Ｃ）はエステル化とエステル交
換反応とによってポリエステルを得る方法であるが、大
きく初期反応と重合反応との２つの反応に分けることが
できる。The above method (C) is a method for obtaining a polyester by esterification and transesterification, and can be roughly divided into two reactions, an initial reaction and a polymerization reaction.
【００１３】初期反応はカルボキシル基の少くとも５０
％がヒドロキシ成分と反応しエステル化される段階であ
り、この段階では反応によって水が生成するのでこれを
反応系外に留去する。この段階ではフェノール成分が反
応系外に留去しないようにする必要がある。The initial reaction is at least 50 carboxyl groups.
% Is a stage where it reacts with the hydroxy component and is esterified. In this stage, water is generated by the reaction, and is distilled out of the reaction system. At this stage, it is necessary to prevent the phenol component from distilling out of the reaction system.
【００１４】次の重合反応は、更にエステル化が進むと
同時にそれまでに生じたカルボン酸成分とフェノール成
分とのエステルと他種のヒドロキシ成分との交換反応も
進み重合が進行する段階であり、この段階では水ととも
にフェノール成分も反応系外に留去する。初期反応と重
合反応とは、明確に分けることはできないが、初期反応
ではフェノール成分の反応系外への留去を積極的に抑
え、重合反応では留去させる点で区別する。The next polymerization reaction is a stage in which the esterification further progresses, and at the same time, the exchange reaction between the ester of the carboxylic acid component and the phenol component and the other hydroxy component proceeds so that the polymerization proceeds. At this stage, the phenol component is distilled out of the reaction system together with the water. The initial reaction and the polymerization reaction cannot be clearly distinguished from each other, but are distinguished in that the phenol component is positively suppressed from being distilled out of the reaction system in the initial reaction and is distilled off in the polymerization reaction.
【００１５】初期反応の反応温度は、触媒によっても異
なるが、１５０℃以上、好ましくは１８０℃以上、特に
好ましくは２３０℃以上であり、反応の進行とともに昇
温するのが好ましい。この場合の上限は３３０℃、好ま
しくは３００℃程度である。Although the reaction temperature of the initial reaction varies depending on the catalyst, it is at least 150 ° C., preferably at least 180 ° C., particularly preferably at least 230 ° C., and it is preferred that the temperature be raised as the reaction proceeds. In this case, the upper limit is 330 ° C., preferably about 300 ° C.
【００１６】初期反応は常圧〜加圧下で行うことができ
るが、フェノール成分の常圧における沸点が反応温度に
比べ特に低い場合には、加圧条件下で反応することが好
ましい。また、反応系は窒素、アルゴン等の不活性ガス
雰囲気下とすることが好ましい。The initial reaction can be carried out under normal pressure to pressurization. If the boiling point of the phenol component at normal pressure is particularly lower than the reaction temperature, the reaction is preferably performed under pressurized conditions. The reaction system is preferably set in an atmosphere of an inert gas such as nitrogen or argon.
【００１７】反応時間は、上記エステル反応が十分に進
行するに足る時間であればよく、またこの時間は反応時
間、反応スケール等によっても異なるが３０分〜２０時
間、好ましくは１〜１０時間程度である。The reaction time may be a time sufficient for the above-mentioned ester reaction to proceed sufficiently. The time varies depending on the reaction time, the reaction scale and the like, but it is 30 minutes to 20 hours, preferably about 1 to 10 hours. It is.
【００１８】上記反応に際しては、エステル化により発
生する水を反応系外に除去せしめることが好ましい。エ
ステル化反応は平衡反応であり、生成する水を系外に除
去するに従って、反応が進行し、生成物の収率、純度が
向上する。生成した水は、フェノール成分との沸点差に
より、反応系外に除去することができるが、水と共沸混
合物を形成する有機溶媒を用いて共沸により、反応系外
に除去することもできる。該有機溶媒としては、それ自
身反応条件で分解することなく、反応系で実質的に安定
で、水と共沸するものであればよい。具体的には、トル
エン、キシレン、エチルベンゼン等の芳香族炭化水素が
好ましく使用できる。In the above reaction, it is preferable to remove water generated by the esterification out of the reaction system. The esterification reaction is an equilibrium reaction, and as the generated water is removed out of the system, the reaction proceeds, and the yield and purity of the product are improved. The generated water can be removed out of the reaction system by the difference in boiling point from the phenol component, but can also be removed out of the reaction system by azeotropy using an organic solvent which forms an azeotropic mixture with water. . The organic solvent may be any organic solvent which does not decompose itself under the reaction conditions, is substantially stable in the reaction system, and azeotropes with water. Specifically, aromatic hydrocarbons such as toluene, xylene, and ethylbenzene can be preferably used.
【００１９】初期反応におけるエステル化反応の反応率
は５０％以上とすることが好ましい。このエステル化反
応率は反応により生成する水の量により知ることができ
るが、より正確に求めるためには反応生成物の一部を取
出し、未反応―ＣＯＯＨ価を測定することによっても知
ることができる。The conversion of the esterification reaction in the initial reaction is preferably 50% or more. This esterification reaction rate can be known from the amount of water generated by the reaction, but for more accurate determination, it is also possible to take out a part of the reaction product and measure it by measuring the unreacted-COOH value. it can.
【００２０】初期反応におけるエステル化率は、より好
ましくは６０％以上、特に好ましくは７０％以上であ
る。重合反応における反応温度は初期反応温度乃至３８
０℃で好ましく実施される。重合が進行するに従って反
応物の融点は上昇していくので、徐々に昇温しながら行
うのが好ましく、例えば、ポリマーの固有粘度が０．５
程度までは好ましくは３３０℃以下の温度で実施され、
それ以上の場合、３８０℃、より好ましくは３６０℃以
下の温度で溶融重合される。The esterification rate in the initial reaction is more preferably 60% or more, particularly preferably 70% or more. The reaction temperature in the polymerization reaction is from the initial reaction temperature to 38.
It is preferably carried out at 0 ° C. Since the melting point of the reactant increases as the polymerization proceeds, it is preferable to perform the reaction while gradually increasing the temperature.
To a degree preferably carried out at a temperature of not more than 330 ° C.,
In the case of a higher temperature, the melt polymerization is carried out at a temperature of 380 ° C, more preferably 360 ° C or less.
【００２１】本発明方法により得られる芳香族ポリエス
テルは比較的溶融粘度が高いため、溶融重合で高重合度
化する場合、ルーダー型の反応器等で実施することが好
ましい。Since the aromatic polyester obtained by the method of the present invention has a relatively high melt viscosity, when the degree of polymerization is increased by melt polymerization, it is preferably carried out in a ruder type reactor or the like.
【００２２】重合反応は減圧下または不活性ガスを流
し、強制的に反応の結果生成する水及びフェノール成分
及び必要に応じて過剰に用いたハイドロキノンなどのジ
ヒドロキシ芳香族化合物を反応系外に除去しつつ行う。The polymerization reaction is carried out under reduced pressure or by flowing an inert gas to forcibly remove water and phenol components formed as a result of the reaction and, if necessary, excess dihydroxyaromatic compounds such as hydroquinone outside the reaction system. While doing.
【００２３】本発明方法において得られるポリエステル
の固有粘度は、好ましくは０．３〜１．５、より好まし
くは０．４〜１．２である。The intrinsic viscosity of the polyester obtained by the method of the present invention is preferably from 0.3 to 1.5, more preferably from 0.4 to 1.2.
【００２４】本発明のリフロー用樹脂組成物は上述の芳
香族ポリエステル、繊維状補強材より構成される。The resin composition for reflow of the present invention comprises the above-mentioned aromatic polyester and a fibrous reinforcing material.
【００２５】ここで繊維状補強材としてはガラス繊維、
炭素繊維、アラミド繊維、シリコンカーバイド繊維、ア
ルミナ繊維、チタン酸カリ繊維等を挙げることができ
る。この繊維状補強材はそのアスペクト比が１０以上で
あることが必要である。ここで、アスペクト比とは繊維
の長さとその直径との比である。補強繊維のアスペクト
比に、分布があるときには、その平均値をその繊維のア
スペクト比とする。アスペクト比が１０未満の場合に
は、機械特性、耐熱性等に対する補強効果が不充分とな
り好ましくない。繊維状補強材としては上記繊維のう
ち、ガラス繊維が好ましい。Here, as the fibrous reinforcing material, glass fiber,
Examples thereof include carbon fibers, aramid fibers, silicon carbide fibers, alumina fibers, and potassium titanate fibers. The fibrous reinforcing material needs to have an aspect ratio of 10 or more. Here, the aspect ratio is the ratio between the length of the fiber and its diameter. When there is a distribution in the aspect ratio of the reinforcing fiber, the average value is defined as the aspect ratio of the fiber. If the aspect ratio is less than 10, the reinforcing effect on mechanical properties, heat resistance and the like becomes insufficient, which is not preferable. As the fibrous reinforcing material, glass fiber is preferable among the above fibers.
【００２６】これらの繊維状補強材は芳香族ポリエステ
ルとの親和性、あるいは繊維そのものの取扱い性を向上
させるため、カップリング剤、サイジング剤等の表面処
理剤を適宜付与したものが好ましく用いられる。As these fibrous reinforcing materials, those in which a surface treating agent such as a coupling agent or a sizing agent is appropriately applied are preferably used in order to improve the affinity with the aromatic polyester or the handleability of the fiber itself.
【００２７】芳香族ポリエステル及び繊維状補強材の使
用割合は、芳香族ポリエステル９５〜３０重量％に対
し、補強繊維５〜７０重量％とする。混合割合としては
好ましくは芳香族ポリエステル９０〜４０重量％、補強
繊維１０〜６０重量％、特に好ましくは芳香族ポリエス
テル８５〜５０重量％、補強繊維１５〜５０重量％であ
る。The proportion of the aromatic polyester and the fibrous reinforcing material used is 95 to 30% by weight of the aromatic polyester and 5 to 70% by weight of the reinforcing fibers. The mixing ratio is preferably 90 to 40% by weight of the aromatic polyester and 10 to 60% by weight of the reinforcing fiber, and particularly preferably 85 to 50% by weight of the aromatic polyester and 15 to 50% by weight of the reinforcing fiber.
【００２８】本発明のリフロー用樹脂組成物は、上述の
成分以外に必要に応じて少割合の他種ポリマー、核剤、
酸化安定剤、紫外線吸収剤等の各種安定剤、着色剤、顔
料、滑剤、可塑剤、離型剤等の各種添加剤を配合せしめ
てもよい。芳香族ポリエステルと繊維状補強材あるいは
場合によりその他添加剤との混合は、エクストルーダー
を用いる通常のコンパウンド化法により実施することが
できる。The reflow resin composition of the present invention may contain, if necessary, a small proportion of another polymer, a nucleating agent,
Various additives such as an oxidation stabilizer and an ultraviolet absorber, and various additives such as a coloring agent, a pigment, a lubricant, a plasticizer, and a release agent may be blended. Mixing of the aromatic polyester with the fibrous reinforcing material or, if necessary, other additives can be carried out by a usual compounding method using an extruder.
【００２９】上記のようにして製造した樹脂組成物は、
通常の溶融成形法、例えば射出成形法、圧縮成形法、あ
るいは押出し成形法などを利用することにより、ハウジ
ングを製造することができる。The resin composition produced as described above is
The housing can be manufactured by using a usual melt molding method, for example, an injection molding method, a compression molding method, or an extrusion molding method.
【００３０】本発明の電子部品は上記の樹脂からなるハ
ウジングを有していればよく、また本発明の電子部品と
してはダイオード、トランジスタ、整流素子、集積回
路、抵抗器、可変抵抗器、コンデンサー等を挙げること
ができる。The electronic component of the present invention may have a housing made of the above-mentioned resin. Examples of the electronic component of the present invention include a diode, a transistor, a rectifier, an integrated circuit, a resistor, a variable resistor, and a capacitor. Can be mentioned.
【００３１】本発明の電子部品を用いたリフロー法によ
るプリント配線基板への固定は次のようにして実施され
る。Fixing to a printed circuit board by the reflow method using the electronic component of the present invention is performed as follows.
【００３２】まずプリント基板配線上に形成されている
配線の電子部品固定予定部に半田を点状に置き、次いで
本発明の電子部品を接着剤を用いて基板に仮固定する。
この際固定される端子が点状に置かれた半田と接触する
ようにする。上記のようにして電子部品が仮固定された
基板を赤外線あるいは熱風などのリフロー炉に入れ、電
子部品が仮固定されている基板を加熱して半田を溶融
し、基板の配線と電子部品の端子とを半田付けする。First, solder is placed in a dot-like manner on a portion of a wiring formed on a printed circuit board to be fixed to an electronic component, and then the electronic component of the present invention is temporarily fixed to the substrate using an adhesive.
At this time, the terminal to be fixed is brought into contact with the solder placed in a dot shape. The board on which the electronic components are temporarily fixed as described above is placed in a reflow furnace such as infrared rays or hot air, and the board on which the electronic components are temporarily fixed is heated to melt the solder, and the wiring of the board and the terminals of the electronic components are heated. And solder.
【００３３】[0033]
【発明の効果】本発明の電子部品は、特定の芳香族ポリ
エステルと繊維状補強材よりなる樹脂組成物よりなるハ
ウジングを有しているため極めて耐熱性に優れており、
リフロー法による半田付け工程において加熱温度を高く
設定することができ、半田付けの信頼性及び部品の歩留
りを向上させることができる。The electronic component of the present invention has a housing made of a resin composition comprising a specific aromatic polyester and a fibrous reinforcing material, and therefore has extremely excellent heat resistance.
The heating temperature can be set high in the soldering step by the reflow method, and the reliability of soldering and the yield of components can be improved.
【００３４】[0034]
【実施例】以下実施例を挙げて本発明をより詳細に説明
するが、本発明はこれに限定されるものではない。The present invention will be described in more detail with reference to the following Examples, but it should not be construed that the present invention is limited thereto.
【００３５】実施例中「部」は「重量部」を意味し、ポ
リマーの熱特性はＤＳＣを用い、１０℃／分の昇温速度
にて測定し、また固有粘度は３５℃のＰ―クロルフェノ
ール／テトラクロルエタン混合溶媒（重量比６０／４
０）を用いて測定した。In the examples, "parts" means "parts by weight", and the thermal characteristics of the polymer were measured using a DSC at a heating rate of 10 ° C./min. Phenol / tetrachloroethane mixed solvent (weight ratio 60/4)
0).
【００３６】[0036]
【実施例１】 ポリマーの製造例 イソフタル酸１６６部、ハイドロキノン９９部、４，
４′―ジヒドロキシジフェニル２８部、フェノール９４
部及び三酸化アンチモン０．０９部を攪拌装置、留出系
を備えた反応器に仕込み、窒素加圧下２８０℃に加熱し
た。圧力を５kg／cm2 から２kg／cm2 に徐々に下げつ
つ、かつ反応によって生成する水を系外に留去しつつ、
５時間反応させた。この間に２９部の水が生成した。次
いで反応系を常圧に戻し、窒素気流中揮発成分を系外に
留去させつつ６０分間反応させた。この間に反応温度を
２８０℃より３４０℃まで昇温した。Example 1 Production Example of Polymer 166 parts of isophthalic acid, 99 parts of hydroquinone,
28 parts of 4'-dihydroxydiphenyl, phenol 94
And 0.09 part of antimony trioxide were charged into a reactor equipped with a stirrer and a distilling system, and heated to 280 ° C. under nitrogen pressure. While gradually lowering the pressure from 5 kg / cm 2 to 2 kg / cm 2 and distilling water generated by the reaction out of the system,
The reaction was performed for 5 hours. During this time 29 parts of water were produced. Next, the pressure of the reaction system was returned to normal pressure, and the reaction was carried out for 60 minutes while distilling volatile components out of the system in a nitrogen stream. During this time, the reaction temperature was raised from 280 ° C to 340 ° C.
【００３７】次いで系内を徐々に真空下として６０分後
に約０．５mmHgの高真空下として５０分間反応させ固有
粘度０．５２のポリマーを得た。Then, the inside of the system was gradually evacuated, and after 60 minutes, the mixture was reacted for 50 minutes under a high vacuum of about 0.5 mmHg to obtain a polymer having an intrinsic viscosity of 0.52.
【００３８】次に２箇所に真空可能なベント口を有する
Ｌ／Ｄ４２の３０mmφ同方向回転２軸エクストルーダー
を用い、ポリマー温度３５０〜３６０℃、スクリュー回
転数１００ｒｐｍ、真空ゾーンでの平均滞留時間約１０
分の条件下で上記ポリマーを溶融反応させた。この際、
各ベント口の全部には通常の搬送用スクリューと逆向き
のスクリュー部を設けて真空ゾーンをシールすることに
より、２箇所のベント口を夫々約１mmHgの真空に保っ
た、このエクストルーダー中での溶融反応により、得ら
れたポリマーは固有粘度０．７２、Ｔｍ３４８℃、Ｔｇ
１６４℃であった。Next, using an L / D 42 30 mmφ co-rotating biaxial extruder having two vent holes capable of vacuuming, a polymer temperature of 350 to 360 ° C., a screw rotation speed of 100 rpm, and an average residence time in the vacuum zone of approximately 10
The polymer was subjected to a melt reaction under the conditions of minutes. On this occasion,
In each extruder, two vent ports were maintained at a vacuum of about 1 mmHg by providing a screw section in the opposite direction to a normal transport screw at each of the vent ports and sealing the vacuum zone. The polymer obtained by the melting reaction had an intrinsic viscosity of 0.72, a Tm of 348 ° C., and a Tg of
164 ° C.
【００３９】[0039]
【実施例２】実施例１で製造した芳香族ポリエステル、
長さ３mmのガラス繊維チョップドストランド（旭ファイ
バーグラス製、０３ＪＡ ＰＸ―１、アスペクト比２３
０）及びタルク（林化成製、ＰＫＮＮ）の所定量をブレ
ンドし、３０mmφ異方向回転２軸エクストルーダーを用
いてポリマー温度３６０℃、平均滞留時間約２分の条件
下に溶融ブレンドした。Example 2 The aromatic polyester produced in Example 1
3mm long glass fiber chopped strand (made by Asahi Fiberglass, 03JA PX-1, aspect ratio 23)
0) and a predetermined amount of talc (manufactured by Hayashi Kasei, PKNN) were blended and melt-blended using a 30 mmφ different direction rotating biaxial extruder under the conditions of a polymer temperature of 360 ° C. and an average residence time of about 2 minutes.
【００４０】得られたコンパウンドを射出成形機（日本
製鋼所製、Ｎ４０Ａ型）を用いて、シリンダー温度３６
０℃、金型温度１４０℃の条件で射出成形して０．８×
１０×２５mmの短冊状試験片を作製した。Using an injection molding machine (manufactured by Nippon Steel Works, Model N40A), the obtained compound was heated to a cylinder temperature of 36.
0.8 × injection molding at 0 ° C. and mold temperature 140 ° C.
A strip test piece of 10 × 25 mm was prepared.
【００４１】[0041]
【実施例３】赤外線リフロー装置（アサヒエンジニアリ
ング製、ＴＰＦ―１５）により赤外線リフロー試験を行
った。昇温は１００〜１５０℃で約８０秒予備加熱を行
った後、ピーク温度で２６０℃、２８０℃、３００℃、
３２０℃、３３０℃まで昇温させて、実施例２で作製し
た試験片の表面を観察した。表１に樹脂組成物の組成及
び結果を示す。表面に溶融、ふくれ、変形といった損傷
がない場合を「○」、損傷が明らかに認められた場合を
「×」とした。Example 3 An infrared reflow test was performed using an infrared reflow apparatus (manufactured by Asahi Engineering, TPF-15). After raising the temperature at 100 to 150 ° C for about 80 seconds, the peak temperature is 260 ° C, 280 ° C, 300 ° C,
The temperature was raised to 320 ° C. and 330 ° C., and the surface of the test piece prepared in Example 2 was observed. Table 1 shows the composition of the resin composition and the results. The case where there was no damage such as melting, swelling or deformation on the surface was marked with “○”, and the case where damage was clearly recognized was marked with “×”.
【００４２】[0042]
【比較例１】市販のポリフェニレンサルファイト樹脂
（ＰＰＳ：フィリップス社製、商品名：ライトン）を射
出成形機（日本製鋼所 Ｎ４０Ａ型）を用いてシリンダ
ー温度３２０℃、金型温度１４０℃の条件で射出成形し
て実施例２と同様の試験片を作製し、実施例３と同様に
赤外線リフロー試験を行った。Comparative Example 1 A commercially available polyphenylene sulfite resin (PPS: manufactured by Philips, trade name: Ryton) was injected using an injection molding machine (Nippon Steel Works N40A type) under the conditions of a cylinder temperature of 320 ° C. and a mold temperature of 140 ° C. A test piece similar to that in Example 2 was prepared by injection molding, and an infrared reflow test was performed in the same manner as in Example 3.
【００４３】結果を表１に示す。Table 1 shows the results.
【００４４】[0044]
【表１】 [Table 1]
【００４５】以上に示すように、本発明によるリフロー
用樹脂組成物は非常に優れた耐熱性を有していることが
明らかである。As shown above, it is clear that the resin composition for reflow according to the present invention has extremely excellent heat resistance.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平３−28221（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) C08L 67/00 - 67/03 ────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-3-28221 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) C08L 67/00-67/03
Claims (2)
I ）の含有当量比が６０／４０〜９０／１０であり、か
つ３５℃のＰ―クロルフェノール／テトラクロルエタン
混合溶媒（重量比６０／４０）中にて測定した固有粘度
が０．３〜１．５の範囲内にある芳香族ポリエステル９
５〜３０重量％と、 アスペクト比１０以上の繊維状補強材５〜７０重量％と
からなることを特徴とするリフロー用樹脂組成物。(1) The following formulas (I), (II) and (III): Consisting essentially of the components (II) and (II)
The equivalent ratio of I) is from 60/40 to 90/10, and the intrinsic viscosity measured in a P-chlorophenol / tetrachloroethane mixed solvent (weight ratio 60/40) at 35 ° C. is from 0.3 to 40. Aromatic polyester 9 in the range of 1.5
A resin composition for reflow, comprising 5 to 30% by weight and 5 to 70% by weight of a fibrous reinforcing material having an aspect ratio of 10 or more.
りなることを特徴とする電子部品。2. An electronic component comprising the resin composition for reflow according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4010087A JP3048727B2 (en) | 1992-01-23 | 1992-01-23 | Reflow resin composition and electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4010087A JP3048727B2 (en) | 1992-01-23 | 1992-01-23 | Reflow resin composition and electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05194823A JPH05194823A (en) | 1993-08-03 |
| JP3048727B2 true JP3048727B2 (en) | 2000-06-05 |
Family
ID=11740559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4010087A Expired - Fee Related JP3048727B2 (en) | 1992-01-23 | 1992-01-23 | Reflow resin composition and electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3048727B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100543907C (en) * | 2004-04-22 | 2009-09-23 | 清华大学 | A kind of preparation method of carbon nano-tube field-transmitting cathode |
| CN111471164B (en) * | 2020-05-16 | 2022-10-04 | 刘桥 | Aromatic polyester, preparation method thereof and diaphragm material containing aromatic polyester |
-
1992
- 1992-01-23 JP JP4010087A patent/JP3048727B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05194823A (en) | 1993-08-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0986613B1 (en) | Liquid crystalline polyester compositions containing carbon black | |
| JP7239473B2 (en) | Active ester curing agent compounds for thermosetting resins, flame retardant compositions containing such compounds, and articles of manufacture therefrom | |
| KR20050021263A (en) | Aromatic liquid crystalline polyester film | |
| JP3048727B2 (en) | Reflow resin composition and electronic component | |
| US4140846A (en) | Liquid crystal copolyesters containing 4-carboxybenzenepropionic acid | |
| US20040192858A1 (en) | Solution composition of aromatic liquid-crystalline polyester | |
| US6093787A (en) | Liquid crystalline polyesters and molding compositions prepared therefrom | |
| JP4912603B2 (en) | Method for producing resin-impregnated base material for circuit board | |
| EP0421603B1 (en) | Melt-processable copolyesterimide | |
| JP5050514B2 (en) | Liquid crystal polyester solution composition and use thereof | |
| JP4442137B2 (en) | Aromatic liquid crystal polyester laminated film | |
| JP3048734B2 (en) | connector | |
| JP4529480B2 (en) | Aromatic liquid crystal polyester solution composition | |
| JP3291795B2 (en) | Polyester and film | |
| JP4414262B2 (en) | Liquid crystal polyester solution, method for producing the same, and liquid crystal polyester film obtained therefrom | |
| US4925913A (en) | Heat-resistant unsaturated polyester | |
| JP2938299B2 (en) | Aromatic polyester, process for producing the same, and molding resin composition using the same | |
| JP2005097591A (en) | Aromatic liquid crystalline polyester film | |
| JP2672426B2 (en) | Resin composition | |
| JP4375005B2 (en) | Method for producing aromatic liquid crystal polyester film | |
| JP4649867B2 (en) | Aromatic liquid crystal polyester laminated film and use thereof | |
| JP2651057B2 (en) | Resin composition | |
| JPH05259594A (en) | Printed board | |
| JPH1087960A (en) | Resin composition for solder resist | |
| KR100215638B1 (en) | Polyester chip for tire cord and method of its preparation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |