JP3021706U - Heat dissipation device for microprocessor - Google Patents
Heat dissipation device for microprocessorInfo
- Publication number
- JP3021706U JP3021706U JP1995009893U JP989395U JP3021706U JP 3021706 U JP3021706 U JP 3021706U JP 1995009893 U JP1995009893 U JP 1995009893U JP 989395 U JP989395 U JP 989395U JP 3021706 U JP3021706 U JP 3021706U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- piece
- fan
- plate
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】
【目的】 体積を縮減したマイクロプロセッサ用放熱装
置。
【構成】 アルミ板１１、ベークライト板１２及び銅箔
面１３より構成してなる一の金属製ＰＣ板１を設け、そ
の表面にエッチングにより放射状の銅箔溶接点１３１と
印刷回路１３２を形成し、ファン２の駆動・保護回路の
電子部品１３３を該印刷回路上に溶接する。
(57) [Summary] [Purpose] A heat dissipation device for microprocessors with reduced volume. [Structure] One metal PC plate 1 composed of an aluminum plate 11, a bakelite plate 12 and a copper foil surface 13 is provided, and radial copper foil welding points 131 and printed circuits 132 are formed on the surface by etching. The electronic component 133 of the drive / protection circuit of the fan 2 is welded onto the printed circuit.
Description
【０００１】[0001]
本考案は、一種のマイクロプロセッサ用放熱装置に関し、特に金属製ＰＣ板で ファンの駆動・保護回路と放熱片を集中設置し、体積縮減の目的を達成するもの に関する。 The present invention relates to a kind of heat dissipating device for a microprocessor, and more particularly, to a device for centrally installing a fan drive / protection circuit and a heat dissipating member on a metal PC plate to achieve the purpose of volume reduction.
【０００２】[0002]
マイクロプロセッサはコンピューターにあって相当重要なエレメントであり、 このため、該エレメントを演算操作する過程で引き起こされる温度上昇に対して 、放熱装置を設けて対処し、その使用寿命を延長し温度上昇による損害を防止す る必要がある。従来の放熱装置は、その殆どが、放熱片、ファン及びファン駆動 回路板を一つのアルミ板の上に設けることで放熱効果を達成するものであったが 、この方法では、回路基板がアルミ板上方に重ね置かれるため、アルミ板、隔離 層、回路板、及び銅箔面など多層の厚さを形成し、軽薄化の効果を達成できず、 ラップトップコンピュータに使用しようとしても、その占有空間が大きいために 製造が難しく、且つ放熱装置本体の体積の問題のほかにも、ファンを保護するた めの保護回路を置き入れることができないという問題を有していた。 The microprocessor is a very important element in a computer. Therefore, a heat dissipation device is installed to deal with the temperature rise caused in the process of computing and operating the element to prolong its service life and increase the temperature rise. It is necessary to prevent damage. Most of the conventional heat dissipation devices achieve the heat dissipation effect by disposing the heat dissipation piece, the fan, and the fan drive circuit board on one aluminum plate. Since they are stacked on top of each other, a multi-layer thickness such as aluminum plate, isolation layer, circuit board, and copper foil surface is formed, and the effect of weight reduction cannot be achieved. Since it is large, it is difficult to manufacture, and in addition to the problem of the volume of the heat dissipation device itself, there was the problem that a protection circuit for protecting the fan could not be installed.
【０００３】[0003]
本考案は、放熱効果が高く、しかもその体積を従来のものより縮減したマイク ロプロセッサ用放熱装置を提供することを課題とする。 本考案は、次に、上記マイクロプロセッサ用放熱装置を組立の簡単なものとす ることを課題とする。 An object of the present invention is to provide a heat dissipation device for a microprocessor, which has a high heat dissipation effect and whose volume is reduced as compared with the conventional one. Another object of the present invention is to make the heat dissipation device for a microprocessor simple to assemble.
【０００４】[0004]
本考案のマイクロプロセッ 用放熱装置は、一の金属製のＰＣ板、一の放熱片 及び一のファンより構成してなり、その中、放熱片は一の放射状体とし、且つ高 低段を交互に配列したものとし、ＰＣ板の表面には放熱片を溶接するための放射 状の銅箔点と電子部品を溶接するための印刷回路を設け、ファンの駆動・保護回 路を該印刷回路に設けることを特徴とし、以てマイクロプロセッサ内に置いて放 熱を行うものとする。 The heat dissipation device for a microprocessor according to the present invention comprises one metal PC plate, one heat dissipation piece and one fan, in which the heat dissipation piece is one radial body and alternating high and low stages. The printed circuit board for welding the radial copper foil points for welding the heat sink and the electronic parts is provided on the surface of the PC board, and the fan drive / protection circuit is connected to the printed circuit board. It is characterized in that it is placed in the microprocessor to radiate heat.
【０００５】 さらに、本考案は、上記放熱片の適当な位置には複数の切欠きを設けて印刷回 路の銅箔と部品より適当に隔離することで、体積縮減を達成する。 さらに、本考案は、金属製ＰＣ板の中央にファンを嵌挿する一の固定柱を溶接 し、これにより組立を容易とする。Further, according to the present invention, a plurality of cutouts are provided at appropriate positions of the heat dissipation piece so as to be appropriately separated from the copper foil of the printing circuit and the component, thereby achieving volume reduction. Further, according to the present invention, one fixed pillar into which the fan is fitted is welded to the center of the metal PC plate, thereby facilitating the assembly.
【０００６】[0006]
本考案のマイクロプロセッサ用放熱装置は、一の金属製のＰＣ板、一の放熱片 及び一のファンより構成してなり、その中、放熱片は一の放射状体とし、且つ高 低段を交互に配列したものとし、並びに適当な位置に複数の切欠きを設け、ＰＣ 板の表面には放熱片を溶接するための放射状の銅箔点と電子部品を溶接するため の印刷回路を設けてファンの駆動・保護回路を該印刷回路に溶接し、並びに放熱 片の切欠きにより回路の銅箔と部品を放熱片より適当に隔離し、以上により、従 来の放熱装置の有していた体積が大きく、回路を集中設置できないという問題を 改善する。 The heat dissipation device for a microprocessor of the present invention comprises one metal PC board, one heat dissipation piece and one fan, in which the heat dissipation piece is one radial body and alternating high and low stages. And a plurality of notches are provided at appropriate positions, and a radial copper foil point for welding the heat dissipation piece and a printed circuit for welding electronic parts are provided on the surface of the PC board. Weld the drive / protection circuit to the printed circuit, and cut away the heat dissipation piece to separate the copper foil and parts of the circuit from the heat dissipation piece appropriately. It solves the problem that the circuit is large and cannot be installed centrally.
【０００７】[0007]
図１、図２に示される如く、本考案は、アルミ板１１、ベークライト板１２及 び銅箔面１３より構成してなる一の金属製ＰＣ板１を設け、その表面にエッチン グにより放射状の銅箔溶接点１３１と印刷回路１３２を形成し、ファン２の駆動 ・保護回路の電子部品１３３を該印刷回路上に溶接することにより、従来の放熱 装置回路を外接することによる面倒さを排除し、体積を適当に縮減することがで きる。 As shown in FIGS. 1 and 2, the present invention provides a metal PC plate 1 composed of an aluminum plate 11, a bakelite plate 12 and a copper foil surface 13, and the surface of the metal PC board 1 is radially formed by etching. By forming the copper foil welding point 131 and the printed circuit 132 and welding the electronic component 133 of the drive / protection circuit of the fan 2 onto the printed circuit, the troublesomeness of the conventional heat dissipation device circuit being circumscribed is eliminated. , The volume can be reduced appropriately.
【０００８】 本考案の放熱片３は、その中央をファン２の組付け用の一の円孔３１とし、並 びに該円孔３１を放射状に外に延伸して高低段を交互に配列した片体３２を形成 し、該片体３２の適当な位置に複数の切欠き３２１、３２２を設け、放熱片３の 低段部分を金属ＰＣ板１に設けた銅箔溶接点１３１上に溶接し、並びに片体３２ の切欠き３２１、３２２により印刷回路１３２の銅箔リード線と電子部品より隔 離する。The heat-dissipating piece 3 of the present invention has one circular hole 31 for assembling the fan 2 at the center thereof, and the circular hole 31 is radially extended outward to alternately arrange high and low stages. The body 32 is formed, a plurality of notches 321 and 322 are provided at appropriate positions of the piece body 32, and the lower step portion of the heat dissipation piece 3 is welded onto the copper foil welding point 131 provided on the metal PC plate 1, In addition, the copper foil lead wires of the printed circuit 132 are separated from the electronic parts by the notches 321 and 322 of the piece 32.
【０００９】 金属ＰＣ板１の中央には一の固定柱１３４を溶接し、電動機２を該固定柱上に 取り付け、もって組立時間を節約する。One fixed column 134 is welded to the center of the metal PC plate 1 and the electric motor 2 is mounted on the fixed column, thereby saving the assembly time.
【００１０】 全体の構造を組み合わせた後、マイクロプロセッサ上に取り付けるが、金属製 ＰＣ板１底層のアルミ板１１及びファン２、放熱片３が形成する放熱作用により 、マイクロプロセッサの放熱効果を達成し、印刷回路１３２に設けたファン保護 回路は、ファン２が損害を受けて回転停止した時、警告の作用を達成する。After the whole structure is combined, it is mounted on the microprocessor. The heat dissipation effect of the aluminum plate 11 on the bottom of the metal PC plate 1, the fan 2, and the heat dissipation piece 3 achieves the heat dissipation effect of the microprocessor. The fan protection circuit provided in the printed circuit 132 achieves a warning function when the fan 2 is damaged and stops rotating.
【００１１】 図３に示されるように、電子部品１３３は放熱片３の片体３２に設けた切欠き ３２１の位置に溶接されるものとし、且つ印刷回路１３２のリード線もまた切欠 き３２２を通過する。このように、印刷回路１３２と部品１３３は放熱片３とい かなる接触も形成せず、完全隔離効果を達成する。また、該金属ＰＣ板１のアル ミ板１１の中央部分１１１を上に延伸して一の固定孔１１２を形成し、これによ りファン２を該固定孔１１２に挿着し、これによりファン２を放熱片３の中央円 孔に固定する。As shown in FIG. 3, the electronic component 133 is to be welded to the position of the cutout 321 provided on the piece 32 of the heat dissipation piece 3, and the lead wire of the printed circuit 132 also has the cutout 322. pass. In this way, the printed circuit 132 and the component 133 do not form any contact with the heat radiating piece 3 and achieve the complete isolation effect. Further, the central portion 111 of the aluminum plate 11 of the metal PC plate 1 is extended upward to form one fixing hole 112, whereby the fan 2 is inserted into the fixing hole 112, whereby the fan is 2 is fixed to the central hole of the heat dissipation piece 3.
【００１２】 また、図４に示されるように、ファン２を金属製ＰＣ板１の表面に接着しても 同様にファン２の固定作用を達成できる。Further, as shown in FIG. 4, even if the fan 2 is adhered to the surface of the metal PC plate 1, the fixing action of the fan 2 can be similarly achieved.
【００１３】[0013]
総合すると、本考案は、少なくとも以下の優れた点を有する： １．ファンの保護及び駆動回路は金属製ＰＣ板上に設けられるため、従来の外 接する方式に較べ、体積縮減の効果を達成する。 ２．放熱片は溶接方式で金属製ＰＣ板上に固定されるため、製造、生産が容易 で、従来の放熱装置が一のアルミ板を貼設する必要を有していたのに較べ、製造 コストを下げることができる。 ３．全体の体積が適当に縮減されたことで、その適用範囲が広がり、特に小型 のラップトップコンピュータに適合し、従来の放熱装置の占有空間が大きいとい う欠点を改善する。 Taken together, the present invention has at least the following advantages: Since the fan protection and drive circuit is installed on the metal PC board, the volume reduction effect is achieved compared to the conventional external connection method. 2. Since the heat sink is fixed on the metal PC plate by the welding method, it is easy to manufacture and produce, and the manufacturing cost is lower than that of the conventional heat radiator which required the sticking of one aluminum plate. Can be lowered. 3. By appropriately reducing the total volume, its application range is expanded, and it is particularly suitable for a small laptop computer, and the disadvantage that the conventional radiator occupies a large space is improved.
【図面の簡単な説明】[Brief description of drawings]
【図１】本考案の斜視図である。FIG. 1 is a perspective view of the present invention.
【図２】本考案の分解斜視図である。FIG. 2 is an exploded perspective view of the present invention.
【図３】本考案の断面図である。FIG. 3 is a sectional view of the present invention.
【図４】本考案のもう一つの実施例を示す断面図であ
る。FIG. 4 is a sectional view showing another embodiment of the present invention.
１１・・・アルミ板 １２・・・ベークライト板 １３
・・・銅箔面 １・・・金属製ＰＣ板 １３１・・・銅
箔溶接点 １３２・・・印刷回路 ２・・・ファン １
３３・・・電子部品 ３・・・放熱片 ３１・・・円孔
３２・・・片体３２１、３２２・・・切欠き １３４
・・・固定柱 １１１・・・アルミ板の中央部分 １１
２・・・固定孔11 ... Aluminum plate 12 ... Bakelite plate 13
・ ・ ・ Copper foil surface 1 ・ ・ ・ Metallic PC board 131 ・ ・ ・ Copper foil welding point 132 ・ ・ ・ Printed circuit 2 ・ ・ ・ Fan 1
33 ... Electronic component 3 ... Heat dissipation piece 31 ... Circular hole 32 ... Pieces 321, 322 ... Notch 134
・ ・ ・ Fixed column 111 ・ ・ ・ Central part of aluminum plate 11
2 fixing hole
Claims (2)
ファンを包括し、その中、該放熱片の中央は一の円孔と
して該円孔にファンを設置し、該円孔より放射状に高低
段を交互に配列した片体を延伸し、該金属製ＰＣ板の上
層表面には複数の放射状の銅箔溶接点を設けて放熱片を
溶接すると共に、印刷回路を設けて電子部品を溶接し、
ファンの駆動・保護回路を該印刷回路に溶接することを
特徴とする、マイクロプロセッサ用放熱装置。1. A metal PC plate, a heat radiating piece and a fan are included, in which the center of the heat radiating piece is a circular hole, and the fan is installed in the circular hole. A piece in which high and low steps are arranged in a more radial pattern is extended, and a plurality of radial copper foil welding points are provided on the upper surface of the metal PC plate to weld the heat radiating piece, and a printed circuit is provided for electronic Weld the parts,
A heat dissipation device for a microprocessor, wherein a drive / protection circuit of a fan is welded to the printed circuit.
置に切欠きを設け、印刷回路の銅箔リード線と電子部品
より放熱片を適当に隔離することを特徴とする、請求項
１に記載のマイクロプロセッサ用放熱装置。2. The heat dissipating piece is provided with a notch at an appropriate position on the radial piece of the heat dissipating piece to appropriately isolate the heat dissipating piece from the copper foil lead wire of the printed circuit and the electronic component. 1. A heat dissipation device for a microprocessor according to 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1995009893U JP3021706U (en) | 1995-08-17 | 1995-08-17 | Heat dissipation device for microprocessor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1995009893U JP3021706U (en) | 1995-08-17 | 1995-08-17 | Heat dissipation device for microprocessor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP3021706U true JP3021706U (en) | 1996-03-08 |
Family
ID=43157033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1995009893U Expired - Lifetime JP3021706U (en) | 1995-08-17 | 1995-08-17 | Heat dissipation device for microprocessor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3021706U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019504284A (en) * | 2016-01-21 | 2019-02-14 | エタリム インコーポレイテッド | Apparatus and system for exchanging heat with a fluid |
-
1995
- 1995-08-17 JP JP1995009893U patent/JP3021706U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019504284A (en) * | 2016-01-21 | 2019-02-14 | エタリム インコーポレイテッド | Apparatus and system for exchanging heat with a fluid |
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