JP2984636B2 - Wafer transfer device and wafer transfer method - Google Patents
Wafer transfer device and wafer transfer methodInfo
- Publication number
- JP2984636B2 JP2984636B2 JP29530497A JP29530497A JP2984636B2 JP 2984636 B2 JP2984636 B2 JP 2984636B2 JP 29530497 A JP29530497 A JP 29530497A JP 29530497 A JP29530497 A JP 29530497A JP 2984636 B2 JP2984636 B2 JP 2984636B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- arm
- carrier
- sub
- wafer transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
【0001】[0001]
【発明の属する技術分野】本発明は、搬送装置に関し、
特に半導体製造装置で使用されるウエハ搬送装置に関す
る。TECHNICAL FIELD The present invention relates to a transfer device,
In particular, it relates to a wafer transfer device used in a semiconductor manufacturing apparatus.
【0002】[0002]
【従来の技術】従来の技術として、一般的なウエハ搬送
装置の構造を図4に示す。2. Description of the Related Art As a conventional technique, a structure of a general wafer transfer apparatus is shown in FIG.
【0003】また、従来のウエハ搬送装置の取り出し動
作を表す図を図5に示す。取り出し動作の場合は、搬送
アームを搬送対象となるウエハ(図5の9)の真下に挿
入して持ち上げ(図5(B))、そのままキャリア(図
5の8)外に搬送アームを引き出して(図5(C))半
導体処理装置への搬送動作を行う。FIG. 5 shows a drawing operation of a conventional wafer transfer device. In the case of the unloading operation, the transfer arm is inserted just below the wafer to be transferred (9 in FIG. 5) and lifted (FIG. 5B), and the transfer arm is pulled out of the carrier (8 in FIG. 5). (FIG. 5C) The transfer operation to the semiconductor processing apparatus is performed.
【0004】また収納動作を表す図を図6に示す。この
場合取り出し動作と逆に収納するキャリアにウエハを挿
入し(図6(A))、搬送アームを下降・後退させて
(図6(B),(C))収納動作を完了する。FIG. 6 is a diagram showing the storing operation. In this case, the wafer is inserted into the carrier to be stored in the reverse of the unloading operation (FIG. 6A), and the transfer arm is lowered and retracted (FIGS. 6B and 6C) to complete the storing operation.
【0005】次に、公知例として特開昭63−2676
55号公報の“搬送装置”の構造を図7の上面図(A)
及び側面図(B)に示す。公報の実施例による緩衝部
(図7の11)を設ける事によりウエハとキャリアの水
平方向の位置ズレを矯正する事を特徴とするものである
が、垂直方向の位置ズレを矯正する機構は有していな
い。Next, as a known example, Japanese Patent Application Laid-Open No. 63-2676
FIG. 7 is a top view of FIG.
And a side view (B). The invention is characterized by correcting the horizontal positional deviation between the wafer and the carrier by providing a buffer (11 in FIG. 7) according to the embodiment of the publication, but there is a mechanism for correcting the vertical positional deviation. I haven't.
【0006】[0006]
【発明が解決しようとする課題】第1の問題点は、従来
の技術においてウエハ搬送装置のアーム挿入時の垂直方
向の誤差が、最大でもキャリアの溝より小さい間隔でし
か許容できないことである。A first problem is that, in the prior art, a vertical error at the time of inserting an arm of a wafer transfer device can be tolerated only at a distance smaller than a groove of a carrier at the maximum.
【0007】その理由は、ウエハ搬送装置がアーム挿入
動作時に搬送対象ウエハとその直下のウエハとの間に搬
送アームを挿入する構造であるために、その挿入位置
が、上下方向にキャリアの溝以上にズレた場合、何れか
のウエハに損傷を与える恐れがある為である。The reason for this is that the wafer transfer device has a structure in which the transfer arm is inserted between the transfer target wafer and the wafer immediately below the transfer target wafer during the arm insertion operation. This is because there is a possibility that any of the wafers may be damaged if the wafers are misaligned.
【0008】[発明の目的]本発明は、ウエハ搬送装置
のアーム挿入動作時の垂直方向の許容誤差を拡大し、ウ
エハに損傷を与えることを回避することを目的とする。[0008] It is an object of the present invention to increase the vertical tolerance during the arm insertion operation of the wafer transfer device and to avoid damaging the wafer.
【0009】[0009]
【課題を解決するための手段】本発明のウエハ搬送装置
は、ウエハ取り出し動作時にウエハ間にアームを挿入す
ることなく動作を行う。より具体的にはウエハ取り出し
動作時にウエハプッシャー(図1の6)が搬送対象ウエ
ハを押し出し、キャリアより飛び出したウエハをサブア
ーム(図1の2)が吸着してキャリアの中程までウエハ
を引き出し、この後メインアーム(図1の3)がウエハ
を吸着してウエハ取り出し動作を行う。SUMMARY OF THE INVENTION A wafer transfer apparatus of the present invention operates without inserting an arm between wafers at the time of wafer removal operation. More specifically, the wafer pusher (6 in FIG. 1) pushes out the wafer to be transferred during the wafer unloading operation, and the sub-arm (2 in FIG. 1) sucks the wafer jumping out of the carrier and pulls out the wafer to the middle of the carrier. Thereafter, the main arm (3 in FIG. 1) sucks the wafer and performs a wafer removal operation.
【0010】[作用]本発明によれば、ウエハプッシャ
ー(図1の6)によってサブアーム(図1の2)がキャ
リア外でウエハ吸着可能な位置までウエハを押し出し、
更にサブアームによってメインアーム(図1の3)がキ
ャリア外でウエハ吸着可能な位置までウエハを引き出す
ため、アームをウエハ間に挿入する必要が無い。According to the present invention, the wafer is pushed by the wafer pusher (6 in FIG. 1) to a position where the sub arm (2 in FIG. 1) can adsorb the wafer outside the carrier.
Furthermore, since the main arm (3 in FIG. 1) pulls the wafer out of the carrier to a position where the wafer can be sucked by the sub-arm, there is no need to insert the arm between the wafers.
【0011】[0011]
[1]構成の説明 次に本発明の実施の形態について図面を参照して詳細に
説明する。[1] Description of Configuration Next, an embodiment of the present invention will be described in detail with reference to the drawings.
【0012】図1の上面図(A)、及び側面図(B)に
示す本発明のウエハ搬送装置において、本発明は、図示
するように、2つの部分からなる。まずウエハを押し出
すウエハプッシャー(図1の6)はウエハの丸みに対応
して円弧状にする必要があり、材質はウエハに損傷を与
える事が無く、且つ発塵の少ない樹脂製のものが望まし
い。In the wafer transfer apparatus of the present invention shown in the top view (A) and the side view (B) of FIG. 1, the present invention comprises two parts as shown. First, the wafer pusher (6 in FIG. 1) for extruding the wafer needs to be formed in an arc shape corresponding to the roundness of the wafer, and the material is preferably a resin material which does not damage the wafer and generates less dust. .
【0013】次にウエハの引き出しを行うサブアーム
(図1の2)であるが、材質は変形の少ないセラミック
や剛性に優れた金属等が望ましく、表面にはウエハを真
空吸着で固定するための吸着口を設ける必要がある。更
にサブアームにはウエハの水平方向のズレを矯正する為
にウエハガイド(図1の4)を取り付ける。ウエハガイ
ドの形状はウエハプッシャーと同様にウエハと接触する
面を円弧状にする必要があるが、水平方向のズレを矯正
するために円弧の大きさはウエハプッシャーよりも大き
くなる(ウエハ外周の1/4程度)。ウエハガイドの材
質はウエハプッシャーと同様に樹脂製のものが望まし
い。Next, a sub-arm (2 in FIG. 1) for pulling out the wafer is preferably made of a ceramic having a small deformation or a metal having a high rigidity, and has a suction surface for fixing the wafer by vacuum suction. It is necessary to provide a mouth. Further, a wafer guide (4 in FIG. 1) is attached to the sub-arm to correct the horizontal displacement of the wafer. The shape of the wafer guide needs to be a circular arc on the surface in contact with the wafer similarly to the wafer pusher, but the size of the circular arc is larger than that of the wafer pusher in order to correct the horizontal deviation (1. / 4). Desirably, the material of the wafer guide is made of resin like the wafer pusher.
【0014】最後にウエハの搬送動作を行うメインアー
ム(図1の3)であるが、サブアームと同様にウエハ固
定を行う真空吸着用の吸着口を設け、材質は変形の少な
いセラミックや剛性に優れた金属等を使用するのが望ま
しい。Lastly, the main arm (3 in FIG. 1) for carrying out the wafer transfer operation is provided with a suction port for vacuum suction for fixing the wafer similarly to the sub arm, and is made of ceramic with little deformation and excellent rigidity. It is desirable to use metal or the like.
【0015】[2]動作の説明 次に本発明の実施の形態の動作について図2、3を参照
して詳細に説明する。[2] Description of Operation Next, the operation of the embodiment of the present invention will be described in detail with reference to FIGS.
【0016】本発明のウエハ搬送装置ではキャリアの上
側のウエハから下側へ順に取り出し動作を行い、半導体
製造装置に搬送して、処理の終わったウエハを同様にキ
ャリアの上側から下側へ順に収納動作を行う形態が最も
望ましい。In the wafer transfer apparatus according to the present invention, the wafer is taken out from the upper wafer of the carrier in order, and transferred to the semiconductor manufacturing apparatus, and the processed wafer is similarly stored from the upper side of the carrier to the lower side. The form in which the operation is performed is most desirable.
【0017】ウエハ取り出し動作では、第1段階として
ウエハプッシャー6が取り出し対象のウエハ(図2の
9)を押し出し、サブアーム2の先端がウエハ9を吸着
できる位置まで前進する(図2(A))。In the wafer removal operation, as a first step, the wafer pusher 6 pushes out the wafer (9 in FIG. 2) to be removed, and advances to a position where the tip of the sub arm 2 can suck the wafer 9 (FIG. 2A). .
【0018】次にサブアーム2はウエハ9を吸着し、メ
インアーム3がウエハ9中央で吸着可能な位置までウエ
ハを引き出す(図2(B))。Next, the sub arm 2 sucks the wafer 9 and draws the wafer to a position where the main arm 3 can suck at the center of the wafer 9 (FIG. 2B).
【0019】最後にメインアーム3を上昇させ、ウエハ
9を吸着すると共にサブアーム2の吸着を解除し、メイ
ンアーム3のみでウエハ9を支持する(図2(C))。Finally, the main arm 3 is raised to suck the wafer 9 and release the suction of the sub-arm 2, and the wafer 9 is supported only by the main arm 3 (FIG. 2C).
【0020】以上によりウエハ取り出し動作を完了し、
メインアーム3は半導体製造装置への搬送動作に移る
(図2の(D))。Thus, the wafer removal operation is completed.
The main arm 3 shifts to a transfer operation to the semiconductor manufacturing apparatus (FIG. 2D).
【0021】次にウエハ収納動作においては、図3に示
すように、メインアーム3は収納対象となるウエハ9を
キャリアまで搬送し、キャリアの中程までウエハを挿入
する(図3(A))。Next, in the wafer storing operation, as shown in FIG. 3, the main arm 3 transports the wafer 9 to be stored to the carrier and inserts the wafer to the middle of the carrier (FIG. 3A). .
【0022】次にサブアーム2を前進・上昇させてウエ
ハ9を吸着させると共にメインアーム3の吸着を解除し
て下降させる(図3(B))。Next, the sub-arm 2 is advanced and raised to suck the wafer 9, and at the same time, the main arm 3 is released and lowered (FIG. 3B).
【0023】最後にサブアーム2を前進・下降すると共
に吸着を解除することで収納動作を終了する(図3
(C),(D))。Finally, the storage operation is completed by moving the sub-arm 2 forward and downward and releasing the suction (FIG. 3).
(C), (D)).
【0024】この際サブアーム2はキャリア内に挿入す
ることになるが、収納位置の直下のウエハは既に取り出
しを終了して半導体製造装置で処理中であるのでキャリ
ア内にウエハは存在せず、損傷を与える危険は無い。At this time, the sub-arm 2 is inserted into the carrier. However, since the wafer immediately below the storage position has already been taken out and is being processed by the semiconductor manufacturing apparatus, the wafer does not exist in the carrier and is damaged. There is no danger of giving.
【0025】[0025]
【発明の効果】第1の効果は、ウエハ搬送装置が搬送動
作を行う際、搬送対象のウエハ以外のウエハに接触する
可能性が著しく低くなることである。The first effect is that when the wafer transfer apparatus performs a transfer operation, the possibility of contact with a wafer other than the transfer target wafer is significantly reduced.
【0026】その理由は、ウエハ取り出し動作の際に搬
送動作を全てキャリア外で行う為、搬送対象外のウエハ
にアームが接触する機会が皆無であるからである。The reason is that all the transfer operations are performed outside the carrier at the time of taking out the wafer, so that there is no opportunity for the arm to come into contact with a wafer which is not to be transferred.
【図1】本発明のウエハ搬送装置の一実施の形態を示す
上面図(A)、側面図(B)である。FIG. 1 is a top view (A) and a side view (B) showing an embodiment of a wafer transfer device of the present invention.
【図2】本発明のウエハ搬送装置の一実施の形態の取り
出し動作を示す側面図である。FIG. 2 is a side view showing a take-out operation of the wafer transfer device according to one embodiment of the present invention.
【図3】本発明のウエハ搬送装置の一実施の形態の収納
動作を示す側面図である。FIG. 3 is a side view showing a storage operation of the wafer transfer device according to one embodiment of the present invention.
【図4】従来のウエハ搬送装置を示す上面図(A)、側
面図(B)である。FIG. 4 is a top view (A) and a side view (B) showing a conventional wafer transfer device.
【図5】従来のウエハ搬送装置の取り出し動作を示す側
面図である。FIG. 5 is a side view showing a take-out operation of the conventional wafer transfer device.
【図6】従来のウエハ搬送装置の収納動作を示す側面図
である。FIG. 6 is a side view showing a storing operation of the conventional wafer transfer device.
【図7】従来の技術である公知例特開昭63−2676
55の実施の形態を示す上面図(A)、側面図(B)で
ある。FIG. 7 is a known example of the prior art.
It is the top view (A) and side view (B) which show 55th Embodiment.
1 ロボット本体 2 サブアーム 3 メインアーム 4 ウエハガイド 5 吸着口 6 ウエハプッシャー 7 プッシャー本体 8 キャリア 9 ウエハ 10 アーム 11 緩衝部 12 補助機構 DESCRIPTION OF SYMBOLS 1 Robot main body 2 Sub arm 3 Main arm 4 Wafer guide 5 Suction port 6 Wafer pusher 7 Pusher main body 8 Carrier 9 Wafer 10 Arm 11 Buffer part 12 Auxiliary mechanism
Claims (7)
と、 該ウエハキャリアから該ウエハの引き出し又は該ウエハ
を前記ウエハキャリア内に格納するサブアームと、 該サブアームと該ウエハの搬送を行うメインアームと、
を有して構成されることを特徴とするウエハ搬送装置。1. A wafer transfer device, comprising: a wafer pusher for pushing out a wafer in a wafer carrier; a sub-arm for extracting the wafer from the wafer carrier or storing the wafer in the wafer carrier; and transferring the sub-arm and the wafer. A main arm that performs
A wafer transfer device comprising:
エハ吸着手段を有し、該サブアームは、該ウエハを該メ
インアームに受け渡すべく移動可能に取り付けられてい
ることを特徴とする請求項1記載のウエハ搬送装置。2. The apparatus according to claim 1, wherein the sub arm and the main arm have a wafer suction means, and the sub arm is movably attached to deliver the wafer to the main arm. Wafer transfer device.
ハキャリア内の複数のウエハ間に上記アームを挿入する
ことなく動作を行うことを特徴とする請求項1記載のウ
エハ搬送装置。3. The wafer transfer apparatus according to claim 1, wherein the operation is performed without inserting the arm between a plurality of wafers in the wafer carrier during the wafer removal operation.
る請求項1〜3のいずれかに記載のウエハ搬送装置。4. The wafer transfer device according to claim 1, wherein the wafer is a semiconductor device wafer.
搬送装置のウエハ搬送方法において、 ウエハ取り出し動作においては、 上記ウエハプッシャーによって、サブアームがキャリア
外でウエハ吸着可能な位置までウエハを押し出し、 更にサブアームによってメインアームがキャリア外でウ
エハ吸着可能な位置までウエハを引き出すことにより、
アームをウエハ間に挿入せずに、ウエハ取り出し動作を
行なうことを特徴とするウエハ搬送方法。5. The wafer transfer method for a wafer transfer device according to claim 1, wherein in the wafer take-out operation, the wafer pusher pushes the wafer to a position where the sub arm can pick up the wafer outside the carrier. By pulling out the wafer to a position where the main arm can suck the wafer outside the carrier by the sub arm,
A wafer transfer method, wherein a wafer removal operation is performed without inserting an arm between wafers.
送し、キャリアの中程までウエハを挿入し、 次にサブアームを前進・上昇させてウエハを吸着させる
と共にメインアームの吸着を解除して下降させ、 最後にサブアームを前進・下降すると共に吸着を解除す
ることで収納動作を終了することを特徴とする請求項5
記載のウエハ搬送方法。6. In the wafer storing operation, the main arm transports the wafer to be stored to the carrier, inserts the wafer to the middle of the carrier, and then advances and raises the sub arm to attract the wafer and move the main arm. 6. The storage operation is terminated by releasing the suction of the arm and lowering the same, and finally moving the sub-arm forward and lower and releasing the suction.
The wafer transfer method as described in the above.
る請求項1〜6のいずれかに記載のウエハ搬送方法。7. The wafer transfer method according to claim 1, wherein the wafer is a semiconductor device wafer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29530497A JP2984636B2 (en) | 1997-10-28 | 1997-10-28 | Wafer transfer device and wafer transfer method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29530497A JP2984636B2 (en) | 1997-10-28 | 1997-10-28 | Wafer transfer device and wafer transfer method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH11135592A JPH11135592A (en) | 1999-05-21 |
JP2984636B2 true JP2984636B2 (en) | 1999-11-29 |
Family
ID=17818882
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JP29530497A Expired - Fee Related JP2984636B2 (en) | 1997-10-28 | 1997-10-28 | Wafer transfer device and wafer transfer method |
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JP (1) | JP2984636B2 (en) |
Families Citing this family (1)
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US20140056679A1 (en) * | 2011-04-15 | 2014-02-27 | Tazmo Co., Ltd. | Wafer exchange apparatus and wafer supporting hand |
-
1997
- 1997-10-28 JP JP29530497A patent/JP2984636B2/en not_active Expired - Fee Related
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