JP2971764B2 - Abrasive fixed type polishing table - Google Patents
Abrasive fixed type polishing tableInfo
- Publication number
- JP2971764B2 JP2971764B2 JP32190994A JP32190994A JP2971764B2 JP 2971764 B2 JP2971764 B2 JP 2971764B2 JP 32190994 A JP32190994 A JP 32190994A JP 32190994 A JP32190994 A JP 32190994A JP 2971764 B2 JP2971764 B2 JP 2971764B2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- abrasive
- layer
- abrasive grains
- polished
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は、被研磨材の表面をラッ
ピング研磨するラッピング装置に用いられる研磨定盤に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing platen used in a lapping apparatus for lapping a surface of a material to be polished.
【０００２】[0002]
【従来の技術】電子部品や光学部品を構成するセラミッ
クス，ガラス，水晶等の被研磨材は、その表面平滑性と
加工変質層の低減が求められると共に、高い面精度が望
まれることから、一般に仕上げ加工としてラッピング研
磨が施される。このラッピング研磨は、例えば、鋳鉄，
錫，銅等から構成される円板状の研磨定盤の研磨面上に
被研磨材を治具を用いて周方向の移動不能に保持し、ダ
イヤモンドやＣＢＮ（立方晶系窒化ホウ素）等の所謂超
砥粒が分散された遊離砥粒液すなわちスラリーを供給し
つつ、研磨定盤を回転させて被研磨材を周方向に相対移
動させると共にその被研磨材を研磨定盤の研磨面上で自
転させることにより行われる。2. Description of the Related Art Materials to be polished, such as ceramics, glass, and quartz, constituting electronic parts and optical parts are generally required to have a surface smoothness and a reduced work-affected layer and a high surface accuracy. Lapping polishing is performed as a finishing process. This lapping polishing is performed, for example, on cast iron,
The workpiece is held immovable in the circumferential direction using a jig on the polishing surface of a disk-shaped polishing platen made of tin, copper, or the like, and is made of diamond, CBN (cubic boron nitride), or the like. While supplying the so-called superabrasive particles in which the free abrasive liquid or slurry is dispersed, the polishing plate is rotated to relatively move the workpiece in the circumferential direction, and the workpiece is placed on the polishing surface of the polishing table. It is performed by rotating.
【０００３】[0003]
【発明が解決すべき課題】ところで、上記の電子部品や
光学部品等は、二種以上の異なる材料が接合等により組
み合わされて用いられることも多いため、仕上げ加工
（ラッピング研磨）を施される被研磨材がそのような異
種材料が組み合わされた状態であることも多い。例え
ば、図３に示される磁気ヘッド用部材３０はその一例で
ある。この磁気ヘッド用部材３０は、比較的高硬度の A
l2O3-TiC（ビッカース硬度HV≒2200）から成るベース３
２に、比較的低硬度の Al2O3（HV≒990 ）から成る絶縁
層３６とパーマロイ等の磁性材料（HV≒180 ）から成る
磁性層３４とが積層された積層部３８がＣＶＤ法等によ
り固着されて構成されている。このような磁気ヘッド用
部材３０が記録用磁性体上を走査される際には、ラッピ
ング研磨が施される仕上げ面４０がその磁性体側に位置
させられるが、この際、高い磁気特性を得るために、磁
性層３４と記録用磁性体との距離が可及的に小さくされ
る。特に、近年の高密度化されている記録用磁性体にお
いてはこの要請が強い。そのため、ラッピング研磨にお
いて、ベース３２の仕上げ面４０b と絶縁層３６や磁性
層３４の仕上げ面４０m との間に加工段差を生じさせな
いことが必要である。The above electronic parts and optical parts are often subjected to finishing (lapping polishing) because two or more kinds of different materials are often used in combination by bonding or the like. The material to be polished is often in a state in which such dissimilar materials are combined. For example, the magnetic head member 30 shown in FIG. 3 is one example. The magnetic head member 30 has a relatively high hardness A
Base 3 made of l 2 O 3 -TiC (Vickers hardness HV ≒ 2200)
Second, a laminated portion 38 in which an insulating layer 36 made of Al 2 O 3 (HV ≒ 990) having relatively low hardness and a magnetic layer 34 made of a magnetic material (HV ≒ 180) such as permalloy are stacked is formed by a CVD method or the like. And is fixed. When such a magnetic head member 30 is scanned over the recording magnetic body, the finished surface 40 to be subjected to lapping polishing is positioned on the magnetic body side. In addition, the distance between the magnetic layer 34 and the recording magnetic material is reduced as much as possible. In particular, this demand is strong in magnetic recording materials that have been increased in density in recent years. Therefore, in lapping, the base 3 it is necessary that two of the finished surface 40 b does not cause processing step between the finished surface 40 m of the insulating layer 36 and the magnetic layer 34.
【０００４】ところが、上記のような異種材料が組み合
わされている被研磨材に、遊離砥粒を用いてラッピング
研磨を施すと、硬度の低い材料（上記の磁気ヘッド用部
材３０においては、積層部３８）が相対的に早く除去さ
れる。そのため、図に示すような高硬度のベース３２と
低硬度の積層部３８との加工段差ｄ（ｄa ，ｄm ）が生
じることとなる。すなわち、遊離砥粒を用いるラッピン
グ研磨では、異種材料が組み合わされている被研磨材全
体の高い表面平滑性が得られないという問題があったの
である。However, when the lapping polishing is performed on the material to be polished using a combination of different materials as described above using loose abrasives, a material having a low hardness (in the above-described magnetic head member 30, the laminated portion 38) is removed relatively quickly. Therefore, a processing step d (d a , d m ) between the high-hardness base 32 and the low-hardness laminated portion 38 as shown in the drawing occurs. That is, the lapping polishing using the free abrasive grains has a problem that high surface smoothness of the whole polished material in which different materials are combined cannot be obtained.
【０００５】本発明は、以上の事情を背景として為され
たものであって、その目的は、異種材料が組み合わされ
ている被研磨材をラッピング研磨する場合にも、高い表
面平滑性を得ることができる研磨定盤を提供することに
ある。The present invention has been made in view of the above circumstances, and an object of the present invention is to obtain high surface smoothness even when lapping and polishing a material to be polished in which different materials are combined. It is an object of the present invention to provide a polishing platen that can perform polishing.
【０００６】[0006]
【課題を解決するための手段】斯かる目的を達成するた
め、本発明の要旨とするところは、被研磨材の表面をラ
ッピング研磨するに際してその被研磨材が研磨面に摺接
させられる研磨定盤であって、砥粒と、その砥粒の平均
粒径よりも大きい平均粒径を備えた軟質金属粒子とを、
その砥粒を 2乃至20(vol％) およびその軟質金属粒子を
30乃至70(vol％) の割合で含む砥粒層が、前記研磨面側
の表層部に設けられていることにある。SUMMARY OF THE INVENTION In order to achieve the above object, the gist of the present invention is to provide a polishing method in which the material to be polished is brought into sliding contact with the polishing surface when lapping the surface of the material to be polished. A disk, abrasive grains, and soft metal particles having an average particle diameter larger than the average particle diameter of the abrasive grains ,
Abrasive grains of 2 to 20 (vol%) and soft metal particles
An abrasive layer containing 30 to 70 (vol%) is provided on the surface layer on the polishing surface side.
【０００７】[0007]
【作用および発明の効果】このようにすれば、研磨定盤
が砥石として作用することから、被研磨材にラッピング
研磨を施すに際して遊離砥粒液が不要となり、硬度の異
なる異種材料が組み合わされている被研磨材をラッピン
グ研磨する場合にも、遊離砥粒に起因する加工段差の発
生が好適に抑制される。しかも、砥粒層には砥粒の平均
粒径よりも大きな平均粒径の軟質金属粒子が、砥粒 2〜
20(vol％) に対して軟質金属粒子30〜70(vol％) の割合
で含まれていることから、砥粒層から比較的大径の砥粒
が脱落してもその砥粒を保持する面積が研磨定盤の面積
に対して十分に大きく確保されているため、その遊離砥
粒は被研磨材により押圧されてその軟質金属粒子に埋め
込まれることとなる。そのため、目詰まりが生じ難くな
って研磨能率が安定すると共に、研磨定盤の表面を自由
に転動させられる砥粒が減少させられることから被研磨
材表面のスクラッチの発生が好適に抑制される。なお、
上記範囲よりも砥粒量が過少になると研磨能率が低下
し、反対に過多になると脱落した砥粒が軟質金属粒子に
保持される可能性が低くなってスクラッチ等の原因とな
る。また、軟質金属粒子量が過少となると、研磨定盤の
面積に対する軟質金属粒子の全面積、すなわち脱落した
砥粒を保持する面積が小さくなってスクラッチ等の原因
となり、過多になると砥粒層の強度が低下して磨耗や変
形が大きくなって、被研磨材の仕上げ面の精度が得られ
ない。 [Effect of the action and the Invention Thus, since the Lab MigakuJoban acts as a grinding wheel, lapping the object to be polished
A free abrasive liquid is not required for polishing, and even when lapping a workpiece to be polished in which dissimilar materials having different hardnesses are combined, the occurrence of processing steps due to the free abrasive grains is suitably suppressed. Moreover, soft metal particles having an average particle size larger than the average particle size of the abrasive particles are contained in the abrasive layer .
Ratio of soft metal particles 30 to 70 (vol%) to 20 (vol%)
Since it contains, the abrasive layer or et ratio comparatively large diameter of the abrasive grains
The area that retains the abrasive grains even if it falls off is the area of the polishing platen
Therefore, the loose abrasive grains are pressed by the material to be polished and embedded in the soft metal particles. Therefore, clogging hardly occurs, the polishing efficiency is stabilized, and the number of abrasive grains that can freely roll on the surface of the polishing platen is reduced, so that the generation of scratches on the surface of the polished material is suitably suppressed. . In addition,
If the amount of abrasive particles is too small, the polishing efficiency will decrease.
On the other hand, if there is too much, the dropped abrasive grains will become soft metal particles.
The likelihood of being retained is reduced, causing
You. Also, if the amount of soft metal particles is too small, the polishing platen
The total area of the soft metal particles relative to the area, that is, dropped
The area that holds the abrasive grains becomes small and causes scratches, etc.
If it is excessive, the strength of the abrasive layer will decrease, resulting in wear and deformation.
The shape becomes large, and the accuracy of the finished surface of the workpiece is obtained.
Absent.
【０００８】因みに、砥粒層が設けられた研磨定盤は従
来から種々提案されていたが、それらは、単に通常の砥
石と同様に砥粒を樹脂等の結合剤で結合したものに過ぎ
なかった。そのため、砥粒が脱落したり研磨粉により目
詰まりが生じると研磨能率が低下すると共に、脱落した
砥粒が研磨定盤と被研磨材との間に自由に転動可能な状
態で介在して、被研磨材表面にスクラッチを生じさせる
という問題があったのである。しかも、ラッピング研磨
に用いられる高価な超砥粒は、一般砥粒とは異なり、砥
粒の自生作用により研磨能率を確保すると、砥粒のムダ
が大きくなって加工コストが増大することから結合力の
高い結合剤が用いられているため、目詰まりが生じ易い
という問題もあったのである。[0008] Incidentally, various polishing plates provided with an abrasive layer have heretofore been proposed, but they are merely those obtained by binding abrasive particles with a binder such as resin in the same manner as a normal grindstone. Was. Therefore, when the abrasive grains are dropped or clogged by the abrasive powder, the polishing efficiency is reduced, and the dropped abrasive grains are interposed in a freely rolling state between the polishing platen and the workpiece. In addition, there is a problem that scratches occur on the surface of the material to be polished. Moreover, expensive superabrasives used for lapping polishing are different from general abrasives, and if the polishing efficiency is secured by the natural action of the abrasives, the waste of the abrasives increases and the processing cost increases. Therefore, there is also a problem that clogging is liable to occur due to the use of a binder having a high viscosity.
【０００９】なお、本願において「軟質金属」とは、塑
性変形により遊離砥粒が容易に埋め込まれるが、ラッピ
ング研磨中には埋め込まれた砥粒の保持状態を維持して
研磨に関与させるだけの剛性を備えたものであり、例え
ば錫，銅等が好適に用いられる。[0009] In the present application, the term "soft metal" means that free abrasive grains are easily embedded by plastic deformation. However, during lapping polishing, the retained abrasive grains are maintained and only involved in polishing. It has rigidity and, for example, tin, copper or the like is preferably used.
【００１０】ここで、好適には、前記軟質金属粒子の平
均粒径は、砥粒の平均粒径の数倍以上、更に好ましくは
１０倍以上とされる。このようにすれば、軟質金属粒子
の平均粒径が砥粒の平均粒径よりも十分に大きいため、
砥粒層から脱落した砥粒が軟質金属粒子に埋め込まれる
割合が一層高くされて、スクラッチの発生が一層抑制さ
れる。Preferably, the average particle size of the soft metal particles is several times or more, more preferably 10 times or more, the average particle size of the abrasive grains. In this case, the average particle size of the soft metal particles is sufficiently larger than the average particle size of the abrasive particles,
The rate at which the abrasive grains dropped from the abrasive layer are embedded in the soft metal particles is further increased, and the generation of scratches is further suppressed.
【００１１】また、好適には、前記砥粒層は、前記砥粒
および軟質金属粒子が所定の結合剤により結合されたも
のであり、それらの比率は、好ましくは、砥粒が 2〜20
vol％，軟質金属粒子が30〜70 vol％，結合剤が20〜60
vol％の範囲に、更に好ましくは、砥粒が 5〜15 vol
％，軟質金属粒子が40〜60 vol％，結合剤が30〜50 vol
％とされる。結合剤量が過少となると軟質金属粒子が過
多の場合と同様に砥粒層の強度が低下し、過多になると
表面に現れる砥粒が少なくなって研磨能率が低下する。Preferably, the abrasive layer is formed by bonding the abrasive and the soft metal particles with a predetermined binder, and the ratio of the abrasive and the soft metal particles is preferably 2 to 20.
vol%, soft metal particles 30-70 vol%, binder 20-60
%, more preferably 5 to 15 vol.
%, Soft metal particles 40-60 vol%, binder 30-30 vol
% . When binding agent amount becomes too small to decrease the strength of the case soft metal particles are too much the same manner as the abrasive grain layer, the polishing efficiency is less abrasive appearing on the surface becomes excessively large drops.
【００１２】また、好適には、前記結合剤には、酸化ア
ルミニウム或いは酸化ケイ素等の微細粒子が混合され
る。このようにすれば、砥粒層の剛性が一層高くされて
縁ダレが防止され、被研磨材の仕上げ面の精度が一層高
くされる。なお、上記微細粒子の平均粒径は、砥粒の粒
子間を充填するため砥粒よりも十分小さいことが好まし
く、例えば、砥粒の平均粒径が 1μm 程度とされる場合
には、 0.1μm 程度とされることが好ましい。Preferably, fine particles such as aluminum oxide or silicon oxide are mixed with the binder. With this configuration, the rigidity of the abrasive layer is further increased, edge dripping is prevented, and the accuracy of the finished surface of the polished material is further increased. The average particle size of the fine particles is preferably sufficiently smaller than the abrasive particles to fill the gap between the abrasive particles.For example, when the average particle size of the abrasive particles is about 1 μm, 0.1 μm It is preferred that the degree is about.
【００１３】また、好適には、前記研磨定盤は、金属か
ら成る台板上に前記砥粒層が設けられて構成され、その
砥粒層は、砥粒として一般砥粒が用いられて台板側に形
成される比較的厚い補強層と、砥粒として超砥粒が用い
られて表面側に形成される比較的薄い研磨層とから構成
される。一般に、超砥粒砥石では研磨或いは研削に用い
られる砥粒層はせいぜい数mmの厚さに過ぎず、加工コス
トを考慮すると、研磨定盤の砥粒として超砥粒が用いら
れる場合には砥粒層を比較的薄くすることが望ましい。
一方、一般に台金はアルミニウム合金やステンレス鋼等
の金属から構成されて砥粒層には熱膨張係数の差に起因
する熱応力が作用すると共に、取扱中に衝撃が与えられ
得ることから、砥粒層に熱応力や衝撃力に抗するだけの
強度を与えるためには、その厚さを比較的厚くすること
が必要である。上記のようにすれば、超砥粒が用いられ
る研磨層の厚さを薄くしても、砥粒層全体の厚みは補強
層の厚さを適宜設定することで十分な厚さとできるた
め、比較的安価で高い強度を備えた研磨定盤を得ること
ができる。なお、上記一般砥粒としては、例えば、酸化
アルミニウム或いは炭化ケイ素等が用いられ、補強層と
研磨層との熱膨張係数の差を可及的に小さくするため
に、その混合比および粒径は超砥粒と同程度とされるこ
とが好ましい。Preferably, the polishing platen is configured by providing the abrasive layer on a base plate made of metal, and the abrasive layer is formed by using a general abrasive as an abrasive. It is composed of a relatively thick reinforcing layer formed on the plate side and a relatively thin polishing layer formed on the surface side using superabrasive grains as abrasive grains. Generally, in the case of a superabrasive grindstone, the abrasive layer used for polishing or grinding is only a few mm in thickness at the most. It is desirable to make the grain layer relatively thin.
On the other hand, the base metal is generally made of a metal such as an aluminum alloy or stainless steel, and the abrasive layer is subjected to thermal stress due to the difference in the coefficient of thermal expansion and, at the same time, may receive an impact during handling. In order to provide the granular layer with strength sufficient to resist thermal stress and impact force, it is necessary to make the thickness relatively large. According to the above, even if the thickness of the polishing layer in which superabrasive grains are used is reduced, the thickness of the entire abrasive layer can be made sufficient by appropriately setting the thickness of the reinforcing layer. It is possible to obtain a polishing platen which is relatively inexpensive and has high strength. In addition, as the above-mentioned general abrasive grains, for example, aluminum oxide or silicon carbide is used, and in order to minimize the difference in the thermal expansion coefficient between the reinforcing layer and the polishing layer, the mixing ratio and the particle size are as follows. It is preferable to set the same as that of the superabrasive grains.
【００１４】[0014]
【実施例】以下、本発明の一実施例を図面を参照して詳
細に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to the drawings.
【００１５】図１は、本発明の一実施例の砥粒固定型研
磨定盤（以下、定盤という）１０の断面を示す図であ
る。この定盤１０は、全体が例えばφ300 ×t40mm 程度
の大きさの円板状を成し、例えば厚さが30mm程度のアル
ミニウム合金等から高剛性に形成された台板１２と、そ
の台板１２の一面上の中央部の例えば直径 100mm程度の
部分を除く外周部に形成された、例えば厚さが10mm程度
の砥粒層１４とを備えている。上記台板１２の中央部に
は、軸心方向に貫通するねじ穴１６が設けられている。
このねじ穴１６は、図示しないラッピング研磨装置に定
盤１０を取り付けるために設けられているものである。
また、上記砥粒層１４は、台板１２側から補強層１８お
よび研磨層２０が順次積層されて構成されている。FIG. 1 is a view showing a cross section of a fixed abrasive platen (hereinafter referred to as a platen) 10 according to one embodiment of the present invention. The platen 10 has a disk shape having a size of, for example, about φ300 × t40 mm, and is made of, for example, an aluminum alloy having a thickness of about 30 mm and having high rigidity. It formed on an outer peripheral portion, a thickness of excluding for example part having a diameter of about 100mm in the central portion on one surface of and a abrasive grain layer 14 of approximately 10 mm. A screw hole 16 penetrating in the axial direction is provided at the center of the base plate 12.
The screw holes 16 are provided for attaching the surface plate 10 to a lapping polishing device (not shown).
The abrasive layer 14 is formed by sequentially laminating a reinforcing layer 18 and a polishing layer 20 from the base plate 12 side.
【００１６】上記補強層１８は、例えば、平均粒径 1μ
m 程度の炭化ケイ素微粉２１および平均粒径15μm 程度
の粒状錫粉２４が、例えばフェノール樹脂等の熱硬化性
樹脂から成る結合剤２６により結合されて成るものであ
り、上記研磨層２０は、例えば平均粒径 1μm 程度のダ
イヤモンド砥粒２２および平均粒径15μm 程度の粒状錫
粉２４が、同様にフェノール樹脂等の熱硬化性樹脂から
成る結合剤２６により結合されて成るものである。上記
研磨層２０の厚さは、補強層１８に比べて比較的薄く、
例えば、 2〜3mm 程度とされている。なお、上記粒状錫
粉２４の最小粒径は、ダイヤモンド砥粒２２の最大径よ
りも十分に大きくなるように、両者の粒度分布が選択さ
れることが望ましく、本実施例では平均粒径が約１５倍
に定められている。また、砥粒の結合度は一般にＡ〜Ｚ
のアルファベットで表示され、Ａに近いほど軟らかい
が、上記補強層１８および研磨層２０の結合度は、それ
ぞれＨ〜Ｍ程度とされている。The reinforcing layer 18 has, for example, an average particle size of 1 μm.
m.sup.2 silicon carbide fine powder 21 and granular tin powder 24 having an average particle diameter of about 15 .mu.m are bonded by a binder 26 made of a thermosetting resin such as a phenol resin. Diamond abrasive grains 22 having an average particle size of about 1 μm and granular tin powder 24 having an average particle size of about 15 μm are similarly bound by a binder 26 made of a thermosetting resin such as a phenol resin. The thickness of the polishing layer 20 is relatively thin as compared with the reinforcing layer 18,
For example, it is about 2-3 mm. In addition, it is desirable that the particle size distribution of the granular tin powder 24 is selected so that the minimum particle size is sufficiently larger than the maximum particle size of the diamond abrasive particles 22, and in this embodiment, the average particle size is about It is determined to be 15 times. The degree of bonding of the abrasive grains is generally A to Z.
The softer the closer to A, the degree of bonding between the reinforcing layer 18 and the polishing layer 20 is about H to M, respectively.
【００１７】図２は、定盤１０を図１における上側から
見た状態であり、研磨層２０の表面の一部を拡大して示
す図である。研磨層２０は、上述のように微粒のダイヤ
モンド砥粒２２および粗粒の粒状錫粉２４とが結合剤２
６により結合されて形成されているため、その表面に
は、両者が結合剤２６中に分散した状態で存在してい
る。本実施例においては、上記研磨層２０の表面が定盤
１０の研磨面に相当し、その研磨面側の表層部には、ダ
イヤモンド砥粒２２とそのダイヤモンド砥粒２２の最大
径よりも大きい粒径を備えた粒状錫粉２４（すなわち軟
質金属粒子）とを含む砥粒層１４が設けられている。な
お、上記の砥粒層１４においては、炭化ケイ素微粉２１
およびダイヤモンド砥粒２２が比較的高い密度で存在す
るが、研磨層２０においては、特に、粒状錫粉２４の近
傍にはその密度が高くなるように局在させられている。
一方、補強層１８においては、炭化ケイ素微粉２１は局
在させられていない。FIG. 2 is an enlarged view of a part of the surface of the polishing layer 20 when the platen 10 is viewed from above in FIG. As described above, the polishing layer 20 is formed by combining the fine diamond abrasive grains 22 and the coarse grain tin powder 24 with the binder 2.
6, both are present in a state of being dispersed in the binder 26 on the surface thereof. In the present embodiment, the surface of the polishing layer 20 corresponds to the polished surface of the platen 10, and the surface layer on the polished surface side has diamond abrasive grains 22 and grains having a diameter larger than the maximum diameter of the diamond abrasive grains 22. An abrasive layer 14 containing granular tin powder 24 having a diameter (ie, soft metal particles) is provided. In the above-mentioned abrasive layer 14, the silicon carbide fine powder 21
And the diamond abrasive grains 22 are present at a relatively high density, but in the polishing layer 20, especially in the vicinity of the granular tin powder 24, the grains are localized so as to have a high density.
On the other hand, in the reinforcing layer 18, the silicon carbide fine powder 21 is not localized.
【００１８】上記の定盤１０を用いて図１に示すように
被研磨材２８をラッピング研磨するに際しては、定盤１
０をねじ穴１６においてラッピング研磨装置に取り付け
てその軸心回りに回転させ、研磨層２０の表面すなわち
研磨面に例えば水等の研削液を供給しつつ、被研磨材２
８を所定の押圧力でその研磨面に押しつけて、定盤１０
の回転軸と平行な軸回りに自転させる。これにより、被
研磨材２８の下面が研磨層２０により高精度且つ平滑に
仕上げられる。When lapping and polishing the workpiece 28 as shown in FIG.
0 is attached to the lapping polishing apparatus in the screw hole 16 and rotated about its axis, and while supplying a grinding liquid such as water to the surface of the polishing layer 20, that is, the polishing surface, the polishing target 2
8 against the polished surface with a predetermined pressing force.
Rotate around an axis parallel to the rotation axis of. Thereby, the lower surface of the material to be polished 28 is finished with high precision and smoothness by the polishing layer 20.
【００１９】この場合において、上述のように、定盤１
０の表層部には、ダイヤモンド砥粒２２と、そのダイヤ
モンド砥粒２２の最大径よりも十分に大きい最小粒径を
備えた粒状錫粉２４とを含む研磨層２０が設けられてい
る。そのため、ラッピング研磨を施すに際しては、定盤
１０が砥石として作用することから遊離砥粒液が不要と
なり、被研磨材２８が硬度の異なる異種材料を組み合わ
せて成る場合にも、遊離砥粒加工に起因する加工段差の
発生が好適に抑制される。しかも、研磨層２０にはダイ
ヤモンド砥粒２２の最大径よりも十分大きな最小粒径の
粒状錫粉２４が含まれているため、研磨層２０から脱落
した比較的大径のダイヤモンド砥粒２２は被研磨材２８
により押圧されてその粒状錫粉２４に埋め込まれること
となる。そのため、目詰まりが生じ難くなって研磨能率
が安定すると共に、定盤１０の表面を自由に転動させら
れるダイヤモンド砥粒２２が減少させられることから被
研磨材２８表面のスクラッチの発生が好適に抑制され
る。In this case, as described above, the surface plate 1
The polishing layer 20 including the diamond abrasive grains 22 and the granular tin powder 24 having a minimum particle diameter sufficiently larger than the maximum diameter of the diamond abrasive grains 22 is provided on the surface layer portion 0. Therefore, when performing lapping polishing, since the surface plate 10 acts as a grindstone, a free abrasive liquid is not necessary, and even when the polished material 28 is composed of a combination of different materials having different hardnesses, the free abrasive processing can be performed. The generation of the processing step caused by this is suitably suppressed. In addition, since the polishing layer 20 contains the granular tin powder 24 having a minimum particle diameter sufficiently larger than the maximum diameter of the diamond abrasive grains 22, the relatively large-diameter diamond abrasive grains 22 dropped from the polishing layer 20 are covered. Abrasive 28
To be embedded in the granular tin powder 24. Therefore, clogging hardly occurs, the polishing efficiency is stabilized, and the number of diamond abrasive grains 22 that can freely roll on the surface of the platen 10 is reduced. Is suppressed.
【００２０】しかも、粒状錫粉２４の平均粒径は、ダイ
ヤモンド砥粒２２の平均粒径の１５倍程度と、十分に大
きくされているため、研磨層２０から脱落したダイヤモ
ンド砥粒２２が粒状錫粉２４に埋め込まれる割合が一層
高くされて、スクラッチの発生が一層抑制される。In addition, the average particle size of the granular tin powder 24 is sufficiently large, about 15 times the average particle size of the diamond abrasive particles 22, so that the diamond abrasive particles 22 dropped from the polishing The ratio of being embedded in the powder 24 is further increased, and the generation of scratches is further suppressed.
【００２１】更に、砥粒層１４は、一般砥粒である炭化
ケイ素微粉２１が用いられて台板１２側に形成される比
較的厚い補強層１８と、ダイヤモンド砥粒２２が用いら
れて表面側に形成される比較的薄い研磨層２０とから構
成されているため、高価な超砥粒が含まれる研磨層２０
の厚さを必要以上に厚くすることなく、砥粒層１４の厚
さを台金１２との熱膨張係数の差に起因する熱応力や取
扱中に与えられる衝撃力に十分耐え得る厚さとすること
ができる。Further, the abrasive layer 14 has a relatively thick reinforcing layer 18 formed on the base plate 12 side by using silicon carbide fine powder 21 which is a general abrasive, and a surface layer formed by using diamond abrasive particles 22. And a relatively thin polishing layer 20 formed on the surface of the polishing layer 20 containing expensive superabrasive grains.
The thickness of the abrasive layer 14 is set to a thickness that can sufficiently withstand the thermal stress caused by the difference in the thermal expansion coefficient with the base metal 12 and the impact force given during the handling without making the thickness of the abrasive layer unnecessarily thick. be able to.
【００２２】なお、一般にダイヤモンド砥粒２２等の超
砥粒が用いられた超砥粒砥石等においては、砥粒２２の
脱落等による自生作用を利用して研削能率を確保すると
高価な砥粒の損失が著しいことから、砥粒２２の結合度
は通常はＲよりも硬くされて、容易に脱落しないように
されている。そのため、一般に、超砥粒砥石は目詰まり
が生じ易く研削能率を維持することが困難である。これ
に対して、本実施例によれば、結合度がＨ〜Ｍ程度と比
較的低くされているため砥粒２２の脱落が生じ易いが、
脱落した砥粒２２は粒状錫粉２４に埋め込まれて研磨に
関与させられるため、目詰まりが生じ難く且つ研磨能率
が維持されると共に、砥粒２２の損失が殆ど生じないこ
ととなる。In general, in a super-abrasive grindstone or the like using super-abrasive grains such as diamond abrasive grains 22, if the grinding efficiency is ensured by utilizing the autogenous action of the abrasive grains 22 falling off, expensive abrasive grains are required. Because of the significant loss, the degree of bonding of the abrasive grains 22 is usually harder than R, so that they do not fall off easily. Therefore, in general, the superabrasive grindstone is easily clogged, and it is difficult to maintain the grinding efficiency. On the other hand, according to the present embodiment, although the degree of bonding is relatively low at about H to M, the abrasive grains 22 are likely to fall off.
Since the dropped abrasive grains 22 are embedded in the granular tin powder 24 and are involved in polishing, clogging hardly occurs, polishing efficiency is maintained, and loss of the abrasive grains 22 hardly occurs.
【００２３】次に、上記のように構成された定盤１０の
製造方法を以下に説明する。Next, a method of manufacturing the surface plate 10 configured as described above will be described below.
【００２４】下記表１のＡ〜Ｃの上段および２段目に示
す調合組成の研磨層用原料および補強層用原料を用意
し、Ａ〜Ｃのそれぞれについて、調合を行った。先ず、
補強層用原料に少量の湿潤剤（例えば、灯油等の石油系
有機溶剤）を添加して、粉体混合機にて高速回転で十分
に混合して補強層用坏土を調製した。次いで、研磨層用
原料を、擂潰機に錫粉，湿潤剤（上記と同様），ダイヤ
モンド砥粒，フェノール樹脂の順に投入して混合するこ
とにより、研磨層用坏土を調製した。なお、粒状錫粉と
しては、平均粒径15μm 程度の比較的粗粒のものを、ダ
イヤモンド砥粒および炭化ケイ素微粉としては、何れも
平均粒径 1μm 程度のものを用い、フェノール樹脂は、
何れの原料においても、ノボラック型フェノール樹脂を
数μm に微粉砕して用いた。A raw material for a polishing layer and a raw material for a reinforcing layer having the composition shown in the upper and second rows of A to C in Table 1 below were prepared, and each of A to C was prepared. First,
A small amount of a wetting agent (for example, a petroleum organic solvent such as kerosene) was added to the raw material for the reinforcing layer, and the mixture was sufficiently mixed at a high speed with a powder mixer to prepare a clay for the reinforcing layer. Then, the raw material for the polishing layer was charged into a grinder in the order of tin powder, a wetting agent (as described above), diamond abrasive grains, and a phenol resin, and mixed to prepare a clay for the polishing layer. The granular tin powder used was a relatively coarse one having an average particle size of about 15 μm, and the diamond abrasive grains and silicon carbide fine powder used had an average particle size of about 1 μm.
In each case, novolak type phenol resin was finely pulverized to several μm and used.
【００２５】[0025]
【表１】 [Table 1]
【００２６】そして、所定の金型に上記の補強層用坏土
を充填して軽く押さえた後、研磨層用坏土を均一に充填
し、例えば、熱板を予め 190℃に熱したホットプレス装
置にセットして、全体の密度が上記表１に示される密度
をなるように熱圧縮成形を行った。なお、上記金型の寸
法は、成形後の寸法が、何れも例えば、φ301 ×t 10×
φ99mmとなるように設定した。その後、補強層１８側の
表面の一部を切削加工により除去し、前記のアルミニウ
ム合金製の台板１２に、例えばエポキシ樹脂等により接
着することにより、前記のような定盤１０を得た。な
お、研磨層用坏土を調製するに際して上記手順によった
のは、錫粉に湿潤剤を添加した後にダイヤモンド砥粒を
投入することにより、錫粉にダイヤモンド砥粒をコーテ
ィングするためである。これにより、前述のように、ダ
イヤモンド砥粒２２が錫粒子２４の回りに局在した研磨
層２０が実現される。Then, after filling the above-mentioned clay for the reinforcing layer into a predetermined mold and lightly pressing the same, the clay for the polishing layer is uniformly filled, and for example, a hot press in which a hot plate is previously heated to 190 ° C. It was set in an apparatus and subjected to hot compression molding so that the overall density was as shown in Table 1 above. In addition, the dimensions of the above-mentioned molds are all dimensions after molding, for example, φ301 × t10 ×
It was set to be φ99mm. Then, a part of the surface on the side of the reinforcing layer 18 was removed by cutting, and the surface plate 10 was obtained by adhering to the base plate 12 made of aluminum alloy with, for example, an epoxy resin. The reason for preparing the kneaded material for the polishing layer by the above procedure is to coat the tin powder with the diamond abrasive grains by adding the wetting agent to the tin powder and then adding the diamond abrasive grains. Thereby, as described above, the polishing layer 20 in which the diamond abrasive grains 22 are localized around the tin particles 24 is realized.
【００２７】上記のようにして作製した定盤１０によ
り、被研磨材２８として図３に示す磁気ヘッド用部材３
０の一面を、下記に示すラッピング研磨条件で仕上げ加
工した結果を、遊離砥粒加工と比較した。本実施例の結
果を前記表１に示す。上記磁気ヘッド用部材３０は、硬
度の異なる異種材料が組み合わされているものである。
表１に示されるように、本実施例のＡ〜Ｃの定盤１０に
よれば、磁気ヘッド用部材３０（被研磨材２８）の仕上
げ面の表面粗さや面精度を従来の遊離砥粒加工と同様な
程度に維持しながら、加工段差を従来の 1/2〜1/3 程度
に小さくすることができた。具体的には、遊離砥粒加工
においては、ベース３２と磁性層３４との加工段差ｄm
が20〜30nmであったのに対し、定盤１０によった場合に
は、加工段差ｄm を10nm程度に減じることが可能であっ
た。 Using the surface plate 10 manufactured as described above, the magnetic head member 3 shown in FIG.
The result of finishing one surface of the sample No. 0 under the lapping polishing conditions shown below was compared with the process of loose abrasive processing. Table 1 shows the results of this example. The magnetic head member 30 is made of a combination of different materials having different hardnesses.
As shown in Table 1, according to the surface plates 10 of A to C of the present embodiment, the surface roughness and surface accuracy of the finished surface of the magnetic head member 30 (the material to be polished 28) are reduced by the conventional free abrasive processing. While maintaining the same level as above, the processing step could be reduced to about 1/2 to 1/3 of the conventional level. Specifically, in the loose abrasive processing, a processing step d m between the base 32 and the magnetic layer 34 is performed.
There contrast was 20 to 30 nm, with the results under the platen 10, it was possible to reduce the machining step d m of about 10 nm.
【００２８】しかも、本実施例によれば、上記の仕上げ
面を得るに際して、研磨レート（単位時間当たりの加工
量）を従来の 2倍程度にすることが可能であり、そのよ
うにしても定盤１０の磨耗量は従来の 1/2程度であっ
た。なお、遊離砥粒加工は、水に 1μm のダイヤモンド
砥粒を分散させたスラリーを研磨液として用いた他は、
定盤１０を用いたラッピング研磨と同様の条件で行っ
た。Moreover, according to the present embodiment, when obtaining the above-mentioned finished surface, the polishing rate (the processing amount per unit time) can be made about twice as large as the conventional one. The wear amount of the board 10 was about 1/2 of the conventional one. In addition, free abrasive grain processing, except that a slurry in which 1μm diamond abrasive grains were dispersed in water was used as a polishing liquid,
The polishing was performed under the same conditions as in the lapping polishing using the surface plate 10.
【００２９】なお、前記表１において、調合組成Ｄ，Ｅ
は、本実施例の比較例である。比較例Ｄは、砥粒および
結合剤が過少に、粒状錫粉が過多に調合されたものであ
り、比較例Ｅは、砥粒および結合剤が過多に、粒状錫粉
が過少に調合されたものである。Ｄの場合には、砥粒が
過少であるため高い研磨能率が得られず、錫粉が過多で
あると共に結合剤が過少であるため、研磨層２０の強度
が不足してその磨耗量が大きくなると共に被研磨材３０
の高い仕上げ面精度が得られない。一方、Ｅの場合に
は、砥粒が過多であると共に錫粉が過少であるため、脱
落した砥粒が錫粉に十分に保持されずスクラッチ等の原
因となると共に、結合剤が過多であるため、表面に現れ
て研磨に作用する砥粒が少なくなって研磨能率も得られ
ない。したがって、砥粒層１４は、前記表１のＡ〜Ｃの
ような調合組成とされることが好ましいのである。In Table 1, the composition D, E
Is a comparative example of this example. Comparative Example D was one in which the amount of abrasive grains and binder was too small and that of granular tin powder was too large, and Comparative Example E was that in which too much abrasive grains and binder and too little of the granular tin powder were mixed. Things. In the case of D, a high polishing efficiency cannot be obtained because the amount of the abrasive is too small, and the amount of the tin powder is too large and the amount of the binder is too small. Material to be polished 30
High accuracy of finished surface cannot be obtained. On the other hand, in the case of E, since the amount of the abrasive grains is too large and the amount of the tin powder is too small, the dropped abrasive grains are not sufficiently held by the tin powder, causing scratches and the like, and the amount of the binder is excessive. Therefore, the amount of abrasive grains appearing on the surface and acting on polishing is reduced, and the polishing efficiency cannot be obtained. Therefore, it is preferable that the abrasive layer 14 has a composition such as A to C in Table 1 above.
【００３０】次に、本発明が両面同時ラップ用として用
いられる場合について説明する。本実施例においては、
砥粒層１４すなわち研磨層２０および補強層１８は、下
記の調合組成で作製した。なお、定盤１０の製造方法
は、前述の実施例と略同様であるが、ホットプレス装置
の熱板の予熱温度は 180℃程度とし、熱圧縮成形後の全
体の密度は 4.40g/cm3に、成形寸法はφ332 ×t10 ×φ
158mm として、定盤１０の寸法をφ330 ×t25 ×φ160m
m とした。また、台板１２は、例えばステンレス鋼によ
り構成した。 Next, a case where the present invention is used for simultaneous double-sided wrapping will be described. In this embodiment,
The abrasive layer 14, that is, the polishing layer 20 and the reinforcing layer 18 were prepared with the following composition. The manufacturing method of the platen 10 is substantially the same as that of the above-described embodiment, except that the preheating temperature of the hot plate of the hot press apparatus is about 180 ° C., and the overall density after the hot compression molding is 4.40 g / cm 3. The molding size is φ332 × t10 × φ
158mm, the dimensions of the surface plate 10 are φ330 × t25 × φ160m
m. The base plate 12 is made of, for example, stainless steel.
【００３１】上記の定盤１０を両面ラップ盤に装着し
て、前記磁気ヘッド用部材３０の上下両面を同時研磨し
た。なお、ラッピング研磨条件は、下記に示す通りであ
り、本実施例においても、従来の遊離砥粒加工による場
合と研磨結果を対比した。その結果、表面粗さ，面精度
（スクラッチ，カケ，チッピング等）を従来並に維持し
た状態で、従来の2 〜3 倍の研磨レートが得られると共
にその経時変化が極めて少なかった。また、定盤１０の
摩耗量は、従来の遊離砥粒加工に用いられる錫定盤並で
あった。なお、遊離砥粒加工のラッピング研磨条件は、
研磨液に 3μm のダイヤモンド砥粒が分散されたスラリ
ーを用い、供給量を10cc/minとした他は、定盤１０によ
る場合と同様とした。 The platen 10 was mounted on a double-sided lapping machine, and the upper and lower surfaces of the magnetic head member 30 were simultaneously polished. The lapping conditions were as shown below, and in this example, the polishing results were compared with those obtained by conventional free abrasive processing. As a result, while maintaining the surface roughness and surface accuracy (scratch, chip, chipping, etc.) at the same level as in the past, a polishing rate two to three times that of the conventional one was obtained, and the change with time was extremely small. Further, the wear amount of the surface plate 10 was comparable to that of a tin surface plate used for conventional loose abrasive processing. In addition, the lapping polishing conditions for loose abrasive processing are as follows:
Except that a slurry in which 3 μm diamond abrasive grains were dispersed in the polishing liquid was used, and the supply rate was 10 cc / min, the procedure was the same as in the case of using the platen 10.
【００３２】以上、本発明の一実施例を図面を参照して
詳細に説明したが、本発明は他の態様でも実施される。While the embodiment of the present invention has been described in detail with reference to the drawings, the present invention can be implemented in other embodiments.
【００３３】例えば、実施例においては、砥粒層１４を
補強層１８と研磨層２０から構成し、補強層１８に炭化
ケイ素微粉（砥粒）２１，研磨層２０にダイヤモンド砥
粒２２を用いたが、用いられる砥粒の種類や粒径は適宜
変更される。例えば、ダイヤモンド砥粒２２に代えてＣ
ＢＮ砥粒が用いられても良く、酸化アルミニウムや炭化
ケイ素，酸化セリウム等の一般砥粒が研磨層２０に用い
られても良い。また、ダイヤモンド砥粒２２やＣＢＮ砥
粒等の超砥粒や、一般砥粒から砥粒層１４全体を構成し
ても差し支えない。すなわち、砥粒層１４は、二層構造
とされていなくとも良い。但し、超砥粒を用いる場合は
二層構造として超砥粒を研磨層２０のみに用いること
が、加工コストの増大を抑制するためには好ましい。For example, in the embodiment, the abrasive layer 14 is composed of the reinforcing layer 18 and the polishing layer 20, and the silicon carbide fine powder (abrasive) 21 is used for the reinforcing layer 18 and the diamond abrasive 22 is used for the polishing layer 20. However, the type and particle size of the abrasive used are appropriately changed. For example, instead of diamond abrasive grains 22, C
BN abrasive grains may be used, and general abrasive grains such as aluminum oxide, silicon carbide, and cerium oxide may be used for the polishing layer 20. Further, the entire abrasive grain layer 14 may be composed of super abrasive grains such as diamond abrasive grains 22 and CBN abrasive grains, or general abrasive grains. That is, the abrasive layer 14 does not have to have a two-layer structure. However, when using superabrasive grains, it is preferable to use the superabrasive grains only in the polishing layer 20 as a two-layer structure in order to suppress an increase in processing cost.
【００３４】また、砥粒層１４に含まれる軟質金属粒子
としては、実施例で用いた粒状錫粉２４の他に、銅やそ
れ等と同様の性質を有する金属或いは合金粉体が用いら
れても良い。As the soft metal particles contained in the abrasive layer 14, in addition to the granular tin powder 24 used in the embodiment, copper or a metal or alloy powder having the same properties as those is used. Is also good.
【００３５】また、砥粒層１４に用いられる熱硬化性樹
脂から成る結合剤２６としては、実施例で示したフェノ
ール樹脂やエポキシ樹脂の他に、ポリイミド樹脂，メラ
ミン樹脂，ポリエステル樹脂等が用いられても良く、ま
た、結合剤２６中にダイヤモンド砥粒２２や炭化ケイ素
微粉２１よりも微細な（例えば平均粒径 0.1μm 以下）
の酸化アルミニウムや酸化ケイ素が混合されても良い。As the binder 26 made of a thermosetting resin used for the abrasive layer 14, a polyimide resin, a melamine resin, a polyester resin or the like is used in addition to the phenol resin and the epoxy resin shown in the embodiment. And finer than the diamond abrasive grains 22 and the silicon carbide fine powder 21 in the binder 26 (for example, an average particle diameter of 0.1 μm or less).
Aluminum oxide or silicon oxide may be mixed.
【００３６】また、実施例においては、被研磨材２８と
して異種材料が組み合わされた磁気ヘッド用部材３０が
加工される場合について説明したが、本発明の定盤１０
は、種々の被研磨材のラッピング研磨に用いられ得、加
工段差が生じ得ない単一材料から成る被研磨材２８にお
いても、高い研磨レートが得られると共に、定盤摩耗量
が少ないという利点が得られる。Further, in the embodiment, the case where the magnetic head member 30 in which different materials are combined is processed as the material to be polished 28 has been described.
Can be used for lapping polishing of various materials to be polished. Even in the case of the material to be polished 28 made of a single material in which a processing step cannot be formed, a high polishing rate can be obtained and the wear amount of the surface plate is small. can get.
【００３７】また、実施例においては、本発明が円板状
の定盤１０に適用された場合について説明したが、本発
明は、種々の寸法，形状の定盤に適用され得る。Further, in the embodiment, the case where the present invention is applied to the disk-shaped surface plate 10 has been described, but the present invention can be applied to surface plates having various dimensions and shapes.
【００３８】また、実施例においては、定盤１０の研磨
面が平坦にされていたが、通常用いられるラッピング研
磨用定盤のように、被研磨材と摺接させられる研磨面に
同心円或いはスパイラル状の所定の深さの溝が設けられ
ていても差し支えない。In the embodiment, the polished surface of the platen 10 is flat. However, as in a commonly used lapping platen, a concentric circle or a spiral is formed on the polished surface which is brought into sliding contact with the material to be polished. A groove having a predetermined depth may be provided.
【００３９】その他、一々例示はしないが、本発明はそ
の主旨を逸脱しない範囲で種々変更を加え得るものであ
る。Although not specifically exemplified, the present invention can be variously modified without departing from the gist thereof.
【図１】本発明の一実施例の砥粒固定型研磨定盤の断面
構造を示す図である。FIG. 1 is a view showing a cross-sectional structure of a fixed abrasive grain polishing table according to one embodiment of the present invention.
【図２】図１の定盤を上面の一部を拡大して示す図であ
る。FIG. 2 is an enlarged view of a part of the upper surface of the surface plate of FIG. 1;
【図３】ラッピング加工の対象となる被研磨材の一例を
示す図であり、(a) は斜視図を、(b) は(a) におけるｂ
−ｂ断面の要部を拡大して示す図である。3A and 3B are diagrams illustrating an example of a material to be polished to be wrapped, wherein FIG. 3A is a perspective view, and FIG.
It is a figure which expands and shows the principal part of -b cross section.
１０：砥粒固定型研磨定盤 １４：砥粒層 ２２：ダイヤモンド砥粒（砥粒） ２４：粒状錫粉（軟質金属粒子） ２８：被研磨材 10: Abrasive grain fixed type polishing table 14: Abrasive grain layer 22: Diamond abrasive grains (abrasive grains) 24: Granular tin powder (soft metal particles) 28: Material to be polished
フロントページの続き (56)参考文献 特開 平３−234472（ＪＰ，Ａ) 特開 平６−226641（ＪＰ，Ａ) 特開 平８−41444（ＪＰ，Ａ) 特開 昭64−2870（ＪＰ，Ａ) 特開 昭62−130179（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) B24D 3/00 330 B24B 37/04 B24D 3/02 310 B24D 7/00 Continuation of the front page (56) References JP-A-3-234472 (JP, A) JP-A-6-226441 (JP, A) JP-A-8-41444 (JP, A) JP-A-64-2870 (JP) , A) JP-A-62-130179 (JP, A) (58) Fields investigated (Int. Cl. 6 , DB name) B24D 3/00 330 B24B 37/04 B24D 3/02 310 B24D 7/00
Claims (1)
際して該被研磨材が研磨面に摺接させられる研磨定盤で
あって、 砥粒と、該砥粒の平均粒径よりも大きい平均粒径を備え
た軟質金属粒子とを、該砥粒を 2乃至20(vol％) および
該軟質金属粒子を30乃至70(vol％) の割合で含む砥粒層
が、前記研磨面側の表層部に設けられていることを特徴
とする砥粒固定型研磨定盤。1. A polishing platen for lapping and polishing a surface of a material to be polished, wherein the material to be polished is brought into sliding contact with a polished surface, comprising: abrasive grains; Soft metal particles having a diameter of 2 to 20 (vol%)
An abrasive grain fixed type polishing table, wherein an abrasive layer containing the soft metal particles at a ratio of 30 to 70 (vol%) is provided on a surface layer portion on the polishing surface side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32190994A JP2971764B2 (en) | 1994-12-26 | 1994-12-26 | Abrasive fixed type polishing table |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32190994A JP2971764B2 (en) | 1994-12-26 | 1994-12-26 | Abrasive fixed type polishing table |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08174428A JPH08174428A (en) | 1996-07-09 |
| JP2971764B2 true JP2971764B2 (en) | 1999-11-08 |
Family
ID=18137762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32190994A Expired - Lifetime JP2971764B2 (en) | 1994-12-26 | 1994-12-26 | Abrasive fixed type polishing table |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2971764B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6634929B1 (en) * | 1999-04-23 | 2003-10-21 | 3M Innovative Properties Company | Method for grinding glass |
| JP4523707B2 (en) * | 2000-08-15 | 2010-08-11 | 株式会社ノリタケカンパニーリミテド | Honing wheel for gears |
| JP5680621B2 (en) * | 2009-04-17 | 2015-03-04 | スリーエム イノベイティブ プロパティズ カンパニー | Flat abrasive article produced using transfer article and method for producing the same |
| CN102513919B (en) * | 2011-12-12 | 2014-08-13 | 江苏智邦精工科技有限公司 | Method for grinding aluminum oxide ceramic ball based on soft grinding material fixation grinding tool |
| CN102513918B (en) * | 2011-12-12 | 2014-07-16 | 江苏智邦精工科技有限公司 | Silicon nitride ceramic ball grinding method based on flexible grinding material fixing grinding tool |
| JP6687231B2 (en) | 2015-07-15 | 2020-04-22 | 三井研削砥石株式会社 | Polishing tool, method for manufacturing the same, and method for manufacturing an abrasive |
| CN112536733B (en) * | 2020-12-03 | 2022-03-22 | 郑州磨料磨具磨削研究所有限公司 | Ultra-precise grinding wheel and preparation method and application thereof |
-
1994
- 1994-12-26 JP JP32190994A patent/JP2971764B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08174428A (en) | 1996-07-09 |
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