JP2949724B2 - Semiconductor substrate storage container - Google Patents
Semiconductor substrate storage containerInfo
- Publication number
- JP2949724B2 JP2949724B2 JP1179248A JP17924889A JP2949724B2 JP 2949724 B2 JP2949724 B2 JP 2949724B2 JP 1179248 A JP1179248 A JP 1179248A JP 17924889 A JP17924889 A JP 17924889A JP 2949724 B2 JP2949724 B2 JP 2949724B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- bow
- storage container
- pair
- receiving portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体基板収納容器に関し、特に半導体装置
の製造工程に用いられる半導体基板の収納容器に関する
ものである。Description: TECHNICAL FIELD The present invention relates to a semiconductor substrate storage container, and more particularly to a semiconductor substrate storage container used in a semiconductor device manufacturing process.
近年、半導体装置、特に超LSIと呼ばれる1M DRAM等
製造する量産装置に於いては、装置内外からの発塵を如
何にして半導体基板上に付着させないようにするか、換
言すれば、如何に清浄な雰囲気で半導体基板を処理する
かがLSIの歩留まりを向上させる重要な要素となってい
る。しかしながら、従来の半導体基板収納容器に於いて
は、搬送時の急激な加速度や、振動に対しては、半導体
基板と収納容器の隙間に於いて衝突が発生し、その結果
発塵していた。以下に、図面を用いて詳細に説明する。In recent years, in mass-production devices for manufacturing semiconductor devices, especially 1M DRAMs called ultra LSIs, how to prevent dust from inside and outside the device from adhering to the semiconductor substrate, in other words, how clean Whether a semiconductor substrate is processed in a suitable atmosphere is an important factor for improving the yield of LSI. However, in a conventional semiconductor substrate storage container, a collision occurs in a gap between the semiconductor substrate and the storage container against a sudden acceleration or vibration at the time of transport, and as a result, dust is generated. The details will be described below with reference to the drawings.
第３図は、従来の半導体基板収納容器を示す斜視図、
第４図は半導体基板を収納した状態での半導体基板と収
納ガイド溝との関係を現わす概念図を表わしている。収
納容器１には、半導体基板収納ガイド溝２が刻されてお
り、半導体基板３を挿入支持する。半導体基板３は、半
導体基板収納ガイド溝２内で溝幅と半導体基板３の厚さ
の関係から第４図のごとく垂直からやや傾いて支持され
る。FIG. 3 is a perspective view showing a conventional semiconductor substrate storage container,
FIG. 4 is a conceptual diagram showing the relationship between the semiconductor substrate and the storage guide groove when the semiconductor substrate is stored. A semiconductor substrate storage guide groove 2 is formed in the storage container 1 to insert and support the semiconductor substrate 3. The semiconductor substrate 3 is supported in the semiconductor substrate storage guide groove 2 with a slight inclination from the vertical as shown in FIG. 4 due to the relationship between the groove width and the thickness of the semiconductor substrate 3.
以上説明したように従来の半導体基板収納容器は、溝
状の半導体基板ガイドに半導体基板を挿入し、支持して
いるだけなので、運搬中などで衝撃を加えたりすると半
導体基板と溝との間での衝突による発塵が発生し、この
結果、半導体基板表面上への塵埃の付着に起因するLSI
の歩留まり低下を誘発するといった欠点を有していた。As described above, the conventional semiconductor substrate storage container merely inserts and supports the semiconductor substrate in the groove-shaped semiconductor substrate guide, so that if an impact is applied during transportation or the like, the semiconductor substrate storage container may be moved between the semiconductor substrate and the groove. Dust is generated by the collision of the LSI, and as a result, the LSI
This has the disadvantage of inducing a decrease in the yield.
本発明の目的は、半導体基板を挿入して運搬するとき
などでも半導体基板が衝撃による溝部との摩擦がなく、
これによる発塵を発生しないような構造を有し、LSIの
製造歩留まりを高めることができる半導体基板収納容器
を提供することにある。The object of the present invention is that the semiconductor substrate has no friction with the groove due to impact even when the semiconductor substrate is inserted and carried,
An object of the present invention is to provide a semiconductor substrate storage container having a structure that does not generate dust due to this, and that can increase the production yield of LSI.
本発明の半導体基板収納容器は、半導体基板の収納時
該半導体基板の両側に位置するよう設けられた一対の弓
型リンクと、前記一対の弓型リンク各々の下部に設けら
れた半導体基板受け部と、前記一対の弓型リンクの各々
の上部に設けられた半導体基板押さえとを有し、前記一
対の弓型リンクの各々は前記半導体基板押さえよりも前
記半導体基板受け部に近い位置に前記半導体基板の法線
方向に略平行な回転軸を持ち、前記半導体基板の挿入時
は前記半導体基板により前記半導体基板受け部が押され
前記弓型リンクが前記回転軸を中心に回転することによ
り前記半導体基板を前記半導体基板受け部および前記半
導体基板押さえにより４点で接触把持し、前記半導体基
板の取り出し時は前記半導体基板により前記半導体基板
押さえが押し上げられることにより前記把持を解除する
ことを特徴としている。A semiconductor substrate storage container according to the present invention includes a pair of bow-shaped links provided on both sides of the semiconductor substrate when a semiconductor substrate is stored, and a semiconductor substrate receiving portion provided below each of the pair of bow-shaped links. And a semiconductor substrate retainer provided above each of the pair of bow links, wherein each of the pair of bow links is closer to the semiconductor substrate receiver than the semiconductor substrate retainer. The semiconductor substrate has a rotation axis substantially parallel to the normal direction of the substrate, and when the semiconductor substrate is inserted, the semiconductor substrate receiving portion is pushed by the semiconductor substrate, and the bow-shaped link rotates about the rotation axis. The substrate is held in contact at four points by the semiconductor substrate receiving portion and the semiconductor substrate holder, and when the semiconductor substrate is taken out, the semiconductor substrate holder is pushed up by the semiconductor substrate. It is characterized by releasing the grip by Rukoto.
次に、本発明について、図面を参照して説明する、第
１図は、本発明の一実施例を示す概念図、第２図は、半
導体基板を取り出す様子を示した概念図を表わしてい
る。半導体基板受け部４は、弓型リンク５に接続されて
おり、半導体基板収納ガイド６に、半導体基板３の法線
方向に設置させた回転軸７を中心にして自在に回転す
る。この弓リンク５には、半導体基板押え８か接続され
ており、半導体基板３が挿入すると、半導体基板受け部
４が押され、この変位が弓型リンク５を介して半導体基
板押え８が伝わり、第１図のごとく半導体基板３を把持
する。半導体基板３を取り出す際には、半導体基板３が
半導体基板押え８を図面上方に押し上げ半導体基板押え
８の把持が解け、半導体基板３を取り出すことができ
る。回転軸７の位置設定は、回転軸７から半導体基板受
け部４までの距離をd1、回転軸７から半導体基板押え８
までの距離をd2とした場合、d1＜d2となるように行なえ
ばよい。Next, the present invention will be described with reference to the drawings. FIG. 1 is a conceptual diagram showing an embodiment of the present invention, and FIG. 2 is a conceptual diagram showing a state of taking out a semiconductor substrate. . The semiconductor substrate receiving portion 4 is connected to the bow-shaped link 5, and freely rotates about a rotation shaft 7 provided in the semiconductor substrate storage guide 6 in a direction normal to the semiconductor substrate 3. A semiconductor substrate retainer 8 is connected to the bow link 5. When the semiconductor substrate 3 is inserted, the semiconductor substrate receiving portion 4 is pressed, and the displacement is transmitted to the semiconductor substrate retainer 8 via the bow type link 5. The semiconductor substrate 3 is gripped as shown in FIG. When the semiconductor substrate 3 is taken out, the semiconductor substrate 3 pushes the semiconductor substrate holder 8 upward in the drawing, the semiconductor substrate holder 8 is released, and the semiconductor substrate 3 can be taken out. The position of the rotary shaft 7 is set such that the distance from the rotary shaft 7 to the semiconductor substrate receiving portion 4 is d 1 , and the position of the rotary shaft 7 is
The distance to the case of a d 2, may be performed such that d 1 <d 2.
以上説明したように、本発明は、半導体基板受け部
が、前記半導体基板収納ガイド部に、半導体基板の法線
方向に略平行な回転軸を持ち、前記回転軸を中心に回転
し、半導体基板を２点接触把持するべく設置させた弓型
リンクを採用しているため、半導体基板を挿入すると、
半導体基板の左右各々２点ずつ、計４点で支えるため、
運搬時などでも衝撃による溝部との摩擦がなく、これに
よる発塵も発生しないような構造となっているので、LS
I製造工程中の発塵を抑制でき、LSIの製造留まりを高め
るといった重要な効果が得られる。As described above, according to the present invention, the semiconductor substrate receiving portion has a rotation axis substantially parallel to a normal direction of the semiconductor substrate in the semiconductor substrate storage guide portion, and rotates around the rotation axis. Since a bow-shaped link that is installed to hold two points in contact is adopted, when a semiconductor substrate is inserted,
In order to support at two points on each of the left and right sides of the semiconductor substrate, a total of four points,
The structure is such that there is no friction with the groove due to impact even during transportation, and no dust is generated by this.
I can suppress the generation of dust during the manufacturing process, and can obtain an important effect of increasing the yield of LSI manufacturing.
第１図は、本発明の一実施例を示す概念図、第２図は、
第１図の実施例において半導体基板を取り出す様子を示
した概念図、第３図は、従来の半導体基板収納容器の一
例の斜視図、第４図は、半導体基板を収納した状態での
半導体基板と収納ガイド溝との関係を現わす概念図であ
る。 １……収納容器、２……半導体基板収納ガイド溝、３…
…半導体基板、４……半導体基板受け部、５……弓型リ
ンク、６……半導体基板収納ガイド部、７……回転軸、
８……半導体基板押え。FIG. 1 is a conceptual diagram showing one embodiment of the present invention, and FIG.
1 is a conceptual view showing a state of taking out a semiconductor substrate in the embodiment of FIG. 1, FIG. 3 is a perspective view of an example of a conventional semiconductor substrate storage container, and FIG. FIG. 4 is a conceptual diagram showing a relationship between the storage guide groove and the storage guide groove. 1 ... storage container, 2 ... semiconductor substrate storage guide groove, 3 ...
... Semiconductor substrate, 4 ... Semiconductor substrate receiving part, 5 ... Arrow link, 6 ... Semiconductor substrate storage guide part, 7 ... Rotary axis,
8 ... Semiconductor substrate holder.
Claims (1)
位置するよう設けられた一対の弓型リンクと、前記一対
の弓型リンクの各々の下部に設けられた半導体基板受け
部と、前記一対の弓型リンクの各々の上部に設けられた
半導体基板押さえとを有し、前記一対の弓型リンクの各
々は前記半導体基板押さえよりも前記半導体基板受け部
に近い位置に前記半導体基板の法線方向に略平行な回転
軸を持ち、前記半導体基板の挿入時は前記半導体基板に
より前記半導体基板受け部が押され前記弓型リンクが前
記回転軸を中心に回転することにより前記半導体基板を
前記半導体基板受け部および前記半導体基板押さえによ
り４点で接触把持し、前記半導体基板の取り出し時は前
記半導体基板により前記半導体基板押さえが押し上げら
れることにより前記把持を解除することを特徴とする半
導体基板収納器。A pair of bow links provided on both sides of the semiconductor substrate when the semiconductor substrate is stored; a semiconductor substrate receiving portion provided below each of the pair of bow links; A semiconductor substrate holder provided above each of the pair of bow links, wherein each of the pair of bow links is positioned closer to the semiconductor substrate receiver than the semiconductor substrate holder. The semiconductor substrate has a rotation axis substantially parallel to the linear direction, and when the semiconductor substrate is inserted, the semiconductor substrate receiving portion is pressed by the semiconductor substrate, and the bow-shaped link rotates about the rotation axis, thereby causing the semiconductor substrate to rotate. The semiconductor substrate receiving portion and the semiconductor substrate retainer hold the semiconductor substrate in contact at four points, and when the semiconductor substrate is taken out, the semiconductor substrate retainer is pushed up by the semiconductor substrate to thereby advance the semiconductor substrate retainer. Semiconductor substrate pods, characterized in that to release the grip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1179248A JP2949724B2 (en) | 1989-07-11 | 1989-07-11 | Semiconductor substrate storage container |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1179248A JP2949724B2 (en) | 1989-07-11 | 1989-07-11 | Semiconductor substrate storage container |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0344059A JPH0344059A (en) | 1991-02-25 |
| JP2949724B2 true JP2949724B2 (en) | 1999-09-20 |
Family
ID=16062528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1179248A Expired - Lifetime JP2949724B2 (en) | 1989-07-11 | 1989-07-11 | Semiconductor substrate storage container |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2949724B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009035022A1 (en) | 2007-09-11 | 2009-03-19 | Autoliv Development Ab | Buckle device for seatbelt and method of manufacturing the same |
| JP6442282B2 (en) * | 2014-12-26 | 2018-12-19 | キヤノンマーケティングジャパン株式会社 | Wire processing apparatus and processing tank |
-
1989
- 1989-07-11 JP JP1179248A patent/JP2949724B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0344059A (en) | 1991-02-25 |
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