JP2946554B2 - Grinding cutting method - Google Patents
Grinding cutting methodInfo
- Publication number
- JP2946554B2 JP2946554B2 JP1245511A JP24551189A JP2946554B2 JP 2946554 B2 JP2946554 B2 JP 2946554B2 JP 1245511 A JP1245511 A JP 1245511A JP 24551189 A JP24551189 A JP 24551189A JP 2946554 B2 JP2946554 B2 JP 2946554B2
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- grinding
- cover
- workpiece
- gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D59/00—Accessories specially designed for sawing machines or sawing devices
- B23D59/001—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
- B23D59/002—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade for the position of the saw blade
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D59/00—Accessories specially designed for sawing machines or sawing devices
- B23D59/02—Devices for lubricating or cooling circular saw blades
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は切削切断方法に関し、さらに詳しくは薄形の
ストレート切断砥石を高速回転させて切断や溝入れ加工
する切削切断方法に関する。Description: TECHNICAL FIELD The present invention relates to a cutting and cutting method, and more particularly to a cutting and cutting method for cutting or grooving by rotating a thin straight cutting grindstone at high speed.
（従来の技術） ストレート切断砥石を高速回転させてガラスやセラミ
ックス等の材料を切断加工あるいは溝入れ加工する際、
切断面に発生するむしれやむしれにともなって発生する
チッピングによって切断面の表面粗さが低下する。(Conventional technology) When cutting or grooving materials such as glass and ceramics by rotating a straight cutting wheel at high speed,
The surface roughness of the cut surface decreases due to the chipping that occurs on the cut surface and the chipping that occurs with the cut.
一般に、切断面に発生するむしれやチッピングは、切
断砥石の作業面に分布する砥粒や砥粒を固定しているボ
ンドに加工屑が溶着して、加工屑の円滑な排出や研削点
の冷却が困難になる、いわゆる目詰まりによって増加す
る。In general, waviness and chipping generated on the cutting surface are caused by the welding of the processing debris to the abrasive grains distributed on the working surface of the cutting whetstone and the bond fixing the abrasive grains, and the smooth discharge of the processing debris and the reduction of the grinding point It is increased by so-called clogging, which makes cooling difficult.
そこで、このような切断砥石の目詰まりを抑制する方
法として、例えば実開昭63−201042号公報に見られるよ
うに大量の研削加工液中で研削切断する方法や、特開昭
61−279466方公報に見られるように、高圧の研削液を切
断砥石に噴射する方法が知られている。Therefore, as a method of suppressing such clogging of the cutting grindstone, for example, a method of performing grinding and cutting in a large amount of grinding fluid as disclosed in Japanese Utility Model Application Laid-Open No. 63-201042,
As disclosed in Japanese Patent Application Laid-Open No. 61-279466, a method of injecting a high-pressure grinding fluid onto a cutting wheel is known.
（発明が解決しようとする課題） しかしながら、上述の従来技術は研削点において研削
加工中の砥粒については配慮がされておらず、特に砥粒
が加工物と長く接触し続ける切断加工で、むしれやチッ
ピングの発生が増加するという課題があった。(Problems to be Solved by the Invention) However, the above-mentioned prior art does not consider the abrasive grains during the grinding process at the grinding point, and in particular, the cutting process in which the abrasive grains keep in contact with the workpiece for a long time. There was a problem that occurrence of chipping increased.
すなわち切断砥石が加工物に進入後、研削加工中の砥
粒やボンドと加工物の間に研削加工液を供給し、切断砥
石の作業面に加工屑が溶着するのを防止することは困難
であり、むしれやチッピングが増加するという課題があ
った。In other words, after the cutting wheel has entered the workpiece, it is difficult to supply a grinding fluid between the abrasive and the bond and the workpiece during the grinding process, and to prevent the processing chips from welding to the work surface of the cutting wheel. There was a problem that choking and chipping increased.
本発明は、このような従来の課題を解決し、切断面に
発生するむしれやクラックを抑制して、表面粗さを低減
できる研削切断方法を提供することを目的とする。An object of the present invention is to solve such a conventional problem and to provide a grinding and cutting method that can reduce surface roughness by suppressing peeling and cracks generated on a cut surface.
（課題を解決するための手段） ストレート切断砥石を用いた研削切断方法において、
前記切断砥石が加工物に進入する直前の位置に前記切断
砥石の外周部と側面部を取り囲むカバーを配置し、研削
加工液をこのカバーと前記研削砥石の隙間に供給して、
この隙間および前記カバーと前記加工物の隙間に研削加
工液を充填しながら、前記カバーに振動子により超音波
振動を加えることを特徴とする。(Means for Solving the Problems) In a grinding cutting method using a straight cutting whetstone,
A cover surrounding the outer peripheral portion and the side portion of the cutting grindstone is disposed at a position immediately before the cutting grindstone enters the workpiece, and a grinding liquid is supplied to a gap between the cover and the grinding grindstone,
An ultrasonic vibration is applied to the cover by a vibrator while filling the gap and the gap between the cover and the workpiece with a grinding liquid.
（作用） 本発明の作用について、第２図に示す本発明の一実施
例で用いた研削切断装置の加工部の側面図を参照して説
明する。(Operation) The operation of the present invention will be described with reference to the side view of the processing section of the grinding and cutting apparatus used in one embodiment of the present invention shown in FIG.
本発明では、切断砥石15が加工物16に進入する直前
に、切断砥石15の外周部と側面部を取り囲むカバー11が
設けられており、このカバー11と切断砥石15の隙間には
研削加工液19が充填されている。In the present invention, immediately before the cutting grindstone 15 enters the workpiece 16, the cover 11 surrounding the outer peripheral portion and the side surface of the cutting grindstone 15 is provided, and a gap between the cover 11 and the cutting grindstone 15 is provided with a grinding fluid. 19 are filled.
振動子13によってカバー11に加えられた超音波振動
は、カバー11と切断砥石15の隙間に充填し切断砥石15の
周囲を覆った研削加工液19を加振する。超音波振動の洗
浄効果や撹はん効果によって、切断砥石15の作業面に溶
着した加工屑は除去される。さらに加振された研削加工
液19は、切断砥石15が加工物16の上面から研削点に進入
するに伴って、切断砥石15と加工物16の隙間20から研削
点に向けて十分に供給され、切断砥石15の作業面と加工
屑が溶着することを防止する。The ultrasonic vibration applied to the cover 11 by the vibrator 13 vibrates the grinding fluid 19 that fills the gap between the cover 11 and the cutting grindstone 15 and covers the periphery of the cutting grindstone 15. By the cleaning effect and the stirring effect of the ultrasonic vibration, the processing chips deposited on the work surface of the cutting grindstone 15 are removed. Further, the vibrated grinding fluid 19 is sufficiently supplied from the gap 20 between the cutting wheel 15 and the workpiece 16 toward the grinding point as the cutting wheel 15 enters the grinding point from the upper surface of the workpiece 16. In addition, welding of the work surface of the cutting grindstone 15 and the processing waste is prevented.
すなわち、超音波振動によって切断砥石15の作業面と
加工屑の接触面に研削加工液が効率よく浸透するため、
研削加工液の潤滑作用が最大限に生かされて、切断砥石
15の作業面に加工屑が溶着することを防止できる。In other words, the grinding fluid efficiently penetrates into the working surface of the cutting wheel 15 and the contact surface of the processing waste by ultrasonic vibration,
A cutting wheel that maximizes the lubrication of the grinding fluid
Welding dust can be prevented from being deposited on the 15 work surfaces.
このため、切断砥石の作業面に溶着した加工屑の除去
及び作業面への加工屑の溶着防止がなされ、切断面に発
生するむしれは大幅に減少する。For this reason, the removal of the work chips deposited on the work surface of the cutting wheel and the prevention of the welding of the work chips to the work surface are performed, and the wrinkles generated on the cut surface are greatly reduced.
（実施例） 以下、本発明の一実施例について、図面を参照して詳
細に説明する。Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.
第１図は本発明の研削切断方法の斜視図、第２図は本
発明の一実施例に用いた、研削切断装置の加工部の様子
を模式的に表した断面図を示す。FIG. 1 is a perspective view of the grinding and cutting method of the present invention, and FIG. 2 is a cross-sectional view schematically showing a state of a processing section of a grinding and cutting apparatus used in one embodiment of the present invention.
第２図に示すカバー11と加工物16の隙間17が僅かにな
るように、カバー11を超音波振動子13を介して切断砥石
15が加工物16に進入する直前の位置に固定した。本実施
例では、隙間17を約1mmとした。さらに研削液19を、研
削加工液強制供給装置21によって研削加工液供給孔12を
通してカバー11の外側から内側に強制的に噴射させるこ
とで、カバー11と切断砥石15の隙間に、研削加工液19を
充填する。The cover 11 is cut through the ultrasonic vibrator 13 so that the gap 17 between the cover 11 and the workpiece 16 shown in FIG.
15 was fixed at the position immediately before entering the workpiece 16. In the present embodiment, the gap 17 is set to about 1 mm. Further, the grinding fluid 19 is forcibly jetted from the outside to the inside of the cover 11 through the grinding fluid supply hole 12 by the grinding fluid forcible supply device 21 so that the gap between the cover 11 and the cutting grindstone 15 is removed. Fill.
次に、超音波振動子13に高周波電源を電源装置14から
供給し、カバー11に与えられる振動エネルギーが最大に
なるように超音波振動子13の共振点に電源周波数をセッ
トした。以上の準備の後に、約5mm厚のガラス基板の切
断を行った。Next, high-frequency power was supplied to the ultrasonic vibrator 13 from the power supply device 14, and the power frequency was set at the resonance point of the ultrasonic vibrator 13 so that the vibration energy given to the cover 11 was maximized. After the above preparation, a glass substrate having a thickness of about 5 mm was cut.
なお、本発明の一実施例で用いた切断砥石15は、外径
76mm、厚さ0.5mm、ダイヤモンド砥粒径約30ミクロンの
レジンボンド砥石とし、研削加工液の供給量について
は、毎分2.5リットルとした。また、超音波振動子13に
供給した電源の周波数は90キロヘルツとし、電圧振幅は
200ボルト程度とした。超音波振動子13による振動方向1
8は、第１図及び第２図に示すように、切断砥石15の回
転軸方向とした。The cutting wheel 15 used in the embodiment of the present invention has an outer diameter of
A resin-bonded grindstone having a diameter of 76 mm, a thickness of 0.5 mm and a diamond abrasive grain diameter of about 30 microns was used, and the supply amount of the grinding liquid was 2.5 liters per minute. The frequency of the power supplied to the ultrasonic transducer 13 is 90 kHz, and the voltage amplitude is
It was about 200 volts. Vibration direction 1 by ultrasonic transducer 13
Reference numeral 8 denotes the direction of the rotation axis of the cutting grindstone 15 as shown in FIGS.
第３図は本発明の一実施例で用いた研削切断装置によ
って切断したガラス基板の切断表面粗さを、従来の研削
切断方法と比較したものである。この結果、本発明の研
削切断方法によって切断面に発生するむしれは大幅に減
少し、切断面の表面粗さは従来の研削切断方法のものに
比べて約３分の１に低減できた。FIG. 3 shows a comparison of the cut surface roughness of a glass substrate cut by a grinding and cutting apparatus used in one embodiment of the present invention with a conventional grinding and cutting method. As a result, the wrinkles generated on the cut surface by the grinding and cutting method of the present invention were greatly reduced, and the surface roughness of the cut surface could be reduced to about one third of that of the conventional grinding and cutting method.
（発明の効果） 以上述べたように、本発明の研削切断方法では、切断
面に発生するむしれを大幅に低減でき、切断面の表面粗
さを低減できる効果がある。(Effects of the Invention) As described above, the grinding and cutting method of the present invention has the effects of significantly reducing the wrinkles generated on the cut surface and reducing the surface roughness of the cut surface.
第１図は本発明の研削切断方法を示す斜視図であり、第
２図は本発明の作用を説明する断面図である。第３図は
本発明の研削切断方法と従来の方法による切断面の表面
粗さの変化を示した粗さ曲線図である。 図において、 11…カバー、12…研削加工液供給孔、13…超音波振動
子、14…電源装置、15…切断砥石、16…加工物、17…カ
バーと加工物の隙間、18…超音波振動の方向、19…研削
加工液、20…切断砥石と加工物の隙間、21…研削加工液
強制供給装置 をそれぞれ示す。FIG. 1 is a perspective view showing a grinding and cutting method of the present invention, and FIG. 2 is a sectional view for explaining the operation of the present invention. FIG. 3 is a roughness curve diagram showing a change in surface roughness of a cut surface by the grinding and cutting method of the present invention and a conventional method. In the figure, 11 ... cover, 12 ... grinding fluid supply hole, 13 ... ultrasonic vibrator, 14 ... power supply unit, 15 ... cutting wheel, 16 ... workpiece, 17 ... gap between cover and workpiece, 18 ... ultrasonic The direction of vibration, 19: the grinding fluid, 20: the gap between the cutting wheel and the workpiece, and 21: the grinding fluid forced supply device are shown.
Claims (1)
において、前記切断砥石が加工物に進入する直前の位置
に前記切断砥石の外周部と側面部を取り囲むカバーを配
置し、研削加工液をこのカバーと前記切断砥石の隙間に
供給して、この隙間および前記カバーと前記加工物の隙
間に研削加工液を充填しながら、前記カバーに振動子に
より超音波振動を加えることを特徴とする研削切断方
法。In a grinding and cutting method using a straight cutting wheel, a cover surrounding an outer peripheral portion and a side portion of the cutting wheel is disposed at a position immediately before the cutting wheel enters a workpiece. Grinding and cutting, wherein ultrasonic vibration is applied to the cover by a vibrator while the gap and the gap between the cover and the workpiece are filled with a grinding fluid while being supplied to a gap between the cover and the cutting grindstone. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1245511A JP2946554B2 (en) | 1989-09-20 | 1989-09-20 | Grinding cutting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1245511A JP2946554B2 (en) | 1989-09-20 | 1989-09-20 | Grinding cutting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03111166A JPH03111166A (en) | 1991-05-10 |
| JP2946554B2 true JP2946554B2 (en) | 1999-09-06 |
Family
ID=17134770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1245511A Expired - Lifetime JP2946554B2 (en) | 1989-09-20 | 1989-09-20 | Grinding cutting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2946554B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4880244B2 (en) * | 2005-04-05 | 2012-02-22 | 株式会社ディスコ | Cutting equipment |
| JP4943688B2 (en) * | 2005-10-21 | 2012-05-30 | 株式会社ディスコ | Cutting equipment |
| CN104439510B (en) * | 2014-11-28 | 2017-02-22 | 杭州电子科技大学 | Ultrasonic focusing device and method for removing sawtooth stuck chips |
| JP6218052B2 (en) * | 2016-09-16 | 2017-10-25 | 株式会社東京精密 | Dicing apparatus and dicing method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS571388B2 (en) * | 1973-07-31 | 1982-01-11 | ||
| JPS52135484A (en) * | 1976-05-07 | 1977-11-12 | Matsushita Electric Ind Co Ltd | Cutting machines with multiple tools |
-
1989
- 1989-09-20 JP JP1245511A patent/JP2946554B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03111166A (en) | 1991-05-10 |
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